JP2006278730A - Led-mounting board with reflecting member, its manufacturing method, and led module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED-mounting board etc. with a reflecting member wherein a bonding between the reflecting member and the mounting board is protected against deterioration, even while the mounting board is made of aluminum nitride, and the reflecting member is made of alumina. <P>SOLUTION: The LED-mounting board 40 is mounted with white color LEDs 18. The LED-mounting board 40 is equipped with an insulating board 12 formed of aluminum nitride sintered material, and a reflecting board 14 formed of the alumina sintered material and provided with reflecting holes 16, which surround the mounted white color LEDs 18. The insulating board 12 and the reflecting board 14 are integrally bonded together by a buffer layer 20, made of a sintered material of a mixture of aluminum nitride and alumina. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an LED mounting substrate, a method for manufacturing the same, and an LED module, and more particularly to an LED mounting substrate with a reflective member.

  LEDs have higher efficiency and longer life than incandescent bulbs and halogen bulbs, and in particular, as LED brightness increases in recent years, research on the use of LEDs for lighting purposes has been actively conducted. However, although the brightness has been increased, the brightness of one LED is much lower than that of an incandescent bulb, etc., so that the brightness of the lighting device can be improved by mounting a large number of LEDs on the mounting board. Has been done. Furthermore, in order to use each light of LED effectively, a reflection hole surrounding each LED is provided. By the side wall (reflection surface) of the reflection hole, the light emitted from the LED to the side is also reflected forward, so that the light can be effectively used.

In addition, due to the mounting of a large number, it is necessary to fully consider the heat dissipation of the mounting board.
Aluminum nitride (AlN) is known as a substrate material with good heat dissipation (thermal conductivity) (Patent Document 1). However, since aluminum nitride transmits light, it is necessary to separately form a reflective film in a hole provided in the mounting substrate when an attempt is made to manufacture a mounting substrate with a reflective hole by itself.

On the other hand, there is alumina (Al ₂ O ₃ ) as a substrate material having a relatively good light reflectance (Patent Document 2). If this is used, light is effectively used without forming a reflection film in the hole (that is, the opened hole functions as a reflection hole as it is). However, alumina has a lower thermal conductivity than aluminum nitride.
Therefore, it is conceivable that the mounting substrate is made of aluminum nitride, the reflecting member having the reflecting holes is made of alumina, and the reflecting member is attached to the mounting substrate with an adhesive. However, there is a problem in that light leaks from the adhesive layer and the light use efficiency decreases. This is because, of the light emitted from the side of the LED, the light incident on the adhesive layer is directly absorbed by the adhesive layer, and this amount of light is not effectively used.
Japanese Patent Laid-Open No. 9-40467 JP 2003-60243 A

  Further, since both aluminum nitride and alumina are ceramic materials, it can be considered that they are integrally sintered and joined (integrated joining). However, due to the difference in shrinkage rate and shrinkage rate between aluminum nitride and alumina during sintering, there is a possibility that bonding cannot be performed well. Moreover, even if it can join, there exists a possibility that a junction part may peel by repetition of lighting / extinguishing of LED from the difference in thermal expansion coefficient of both.

  In view of the above-described problems, the present invention provides an LED mounting substrate that is less likely to cause the above problems and an LED mounting substrate, while using aluminum nitride as the mounting substrate material and alumina as the reflective member material, and the LED mounting substrate. It aims at providing the LED module which has.

  In order to achieve the above object, an LED mounting substrate with a reflecting member according to the present invention is an LED mounting substrate on which an LED is mounted, and is an insulating substrate made of a sintered body of aluminum nitride, and sintered alumina. A reflective member having a reflective hole surrounding the LED in a mounted state, and the insulating substrate and the reflective member are integrally formed by a buffer layer made of a sintered body of a mixture of aluminum nitride and alumina. It is characterized by being joined.

Further, the present invention is a wiring pattern in which the electrodes of the LED are electrically connected, and has a wiring pattern formed substantially flush with the buffer layer.
In order to achieve the above object, a manufacturing method of an LED mounting substrate with a reflecting member according to the present invention is a manufacturing method of an LED mounting substrate with a reflecting member having a reflection hole, and includes an alumina powder and a binder. And a step of preparing a reflecting member element having a hole serving as a reflection hole, and a kneading element of an aluminum nitride powder and a binder, and a sheet-like insulating substrate element A step of preparing a body, a step of preparing a sheet-shaped buffer layer body, which is a kneaded body of aluminum nitride powder, alumina powder, and a binder, the reflective member body and the insulating substrate body And a step of sintering with the buffer layer element sandwiched therebetween.

Further, before the sintering step, a step of forming a recess corresponding to the wiring pattern of the LED mounting substrate on one main surface of the buffer layer element body, and a step of filling the recess with a tungsten paste It is characterized by having.
In order to achieve the above object, an LED module according to the present invention includes the LED mounting substrate with a reflecting member and an LED mounted at a position surrounded by the reflecting hole.

  According to the LED mounting substrate of the present invention, the buffer layer is made of a sintered body of a mixture of aluminum nitride that is the composition of the insulating substrate and alumina that is the composition of the reflecting member. Therefore, the thermal expansion coefficient of the buffer layer is a value between the insulating substrate and the reflecting member. Since the insulating substrate and the reflecting member are integrally joined by such a buffer layer, even if the insulating substrate and the reflecting member are repeatedly expanded and contracted by repeated lighting and extinguishing of the mounted LED, The buffer layer absorbs the difference between the expansion and contraction of the two, and the situation where the connection between the two is impaired can be prevented as much as possible.

  Further, according to the method for manufacturing an LED mounting substrate according to the present invention, the buffer layer element includes both an aluminum nitride powder that is a composition of the insulating substrate element and an alumina powder that is a composition of the reflective member element. It consists of a kneaded body of a binder. Therefore, the characteristics such as the shrinkage rate and shrinkage speed of the buffer layer body during sintering are intermediate characteristics between the insulating substrate body and the reflective member body. Since such a buffer layer element is sintered in a state where it is sandwiched between the reflecting member element and the insulating substrate element, the reflecting member element and the insulating substrate at the time of sintering due to the difference in shrinkage rate and contraction speed The deviation between the element body is absorbed by the buffer layer element body, and the reflecting member element body and the insulating substrate element body are satisfactorily bonded by the buffer layer element body.

  According to the LED module of the present invention, since the LED is mounted on the above-described LED mounting board, the joining of the reflective member and the insulating board is not impaired by the repeated turning on / off of the LED. Durability will be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1A is a perspective view showing a schematic configuration of the LED module 10 according to Embodiment 1. FIG. 1B is a cross-sectional view taken along the plane A in FIG. 1A, and FIG. 1C is an enlarged view of a portion B in FIG. 1B. In all the drawings including FIG. 1A, the scales between the constituent members are not unified.

As shown in FIGS. 1A and 1B, the LED module 10 includes a rectangular insulating substrate 12 and a reflecting plate 14 having a rectangular plate shape as an example of a reflecting member.
The insulating substrate 12 is made of a sintered body of aluminum nitride (AlN).
The reflecting plate 14 is made of a sintered body of alumina (Al ₂ O ₃ ), and includes a plurality of (in this example) reflecting holes 16 arranged in a matrix of N rows and M columns (4 rows and 4 columns in this example). , 16). The reflection hole 16 is formed in a substantially truncated cone shape whose inner wall surface extends toward the side opposite to the insulating substrate 12. Due to the whiteness of alumina, the inner wall surface functions as a reflecting surface as it is. As described later, one white LED 18 is disposed for each reflection hole 16.

  The insulating substrate 12 and the reflecting plate 16 are integrally joined by the buffer layer 20. The buffer layer 20 is made of a sintered body of a mixture of aluminum nitride and alumina. Wiring patterns 22 and 24 are formed on the upper surface (the surface facing the reflecting plate 16) and the lower surface (the surface facing the insulating substrate 12) of the buffer layer 20. Here, the wiring pattern 22 formed on the upper surface is referred to as a surface pattern 22, and the wiring pattern 24 formed on the lower surface is referred to as an internal pattern 24.

A part of the surface pattern 22 exists inside the reflection hole 16 in a plan view as shown in FIGS. 1 (c) and 1 (d). FIG. 1D is a plan view showing a state where one of the reflection holes 16 in the LED module 10 is removed with a convex lens 26 and a white LED 18 described later.
As shown in FIGS. 1C and 1D, the p-electrode and n-electrode (both not shown) of the LED chip 28 are bonded to the surface pattern 22 by a bump 30 (mechanically bonded). As well as being electrically connected) and flip-chip mounted. As the LED chip 28, for example, one that emits blue light can be used.

A phosphor film 32 is formed so as to cover the mounted LED chip 28. The phosphor film 32 is, for example, a yellow-green phosphor powder of (Ba, Sr) ₂ SiO ₄ : Eu ²⁺ or Y ₃ (Al, Ga) ₅ O ₁₂ : Ce ^{3+ on} a translucent resin such as silicone. And Sr ₂ Si ₅ N ₈ : Eu ²⁺ and red phosphor powder such as (Ca, Sr) S: Eu ²⁺ are dispersed.
The LED chip 28 and the phosphor film 32 constitute a white LED 18. That is, part of the blue light emitted from the LED chip 28 is absorbed by the phosphor film 32 and converted into yellow-green light and red light. Blue light, yellow-green light, and red light are combined into white light and emitted from the phosphor film 32.

Further, a convex lens 26 is disposed so as to cover the phosphor film 32. The convex lens 26 is made of, for example, an epoxy resin as an example of a translucent resin. As will be described later, the convex lens 26 is formed by filling a reflecting hole 16 provided for each of the 16 white LEDs 18 with solidified epoxy resin, and then solidifying.
The surface pattern 22 on which the LED chip 28 is mounted is electrically connected to the internal pattern 24 via a via hole 34. The 16 LED chips 28 are connected in series by the surface pattern 22, the via hole 34, and the internal pattern 24. Then, among the LED chips 28 connected in series, the p-side electrode of the high-potential side LED chip is connected to the anode terminal 36 via the surface pattern, via hole, and internal pattern (none of which appear in the figure). The n-side electrode of the low-potential side LED chip is electrically connected to the cathode terminal 38 via the surface pattern, via hole, and internal pattern (none of which appear in the figure). Yes. In the LED module 10, the remaining portion excluding the white LED 18 (LED chip 28, phosphor film 32), the bump 30, and the convex lens 28 becomes the LED mounting substrate 40.

  In the LED module 10 configured as described above, when power is supplied through the anode terminal 36 and the cathode terminal 38, all the 16 white LEDs 18 emit light. Part of the light emitted from the white LED 18 is reflected by the wall surface (reflective surface) of the reflection hole 16, and part of the light passes directly through the convex lens 26 and is emitted outside the LED module 10. Further, the heat generated by the LED chip 28 is effectively dissipated to the back of the LED chip 28 by the insulating substrate 12 made of aluminum nitride.

At this time, since the reflecting plate 14 and the insulating substrate 12 are integrally joined without a gap by a sintered body (buffer layer 20) of a ceramic material containing both components, the two are attached with an adhesive. As much as possible, the leakage of light that occurs in
Further, since the buffer layer 20 is formed of a sintered body of a ceramic material containing components of both the reflector 14 and the insulating substrate 12, the thermal expansion coefficient is a value between the reflector 14 and the insulating substrate 12. It becomes. Therefore, even if the reflector 14 and the insulating substrate 12 are repeatedly expanded and contracted by repeatedly turning on and off the LED module 10 (LED chip 28), the buffer layer 20 absorbs the difference between the expansion and contraction of the two. Thus, it is possible to prevent as much as possible the situation that the bonding between the two is impaired (the reflecting plate 14 and the insulating substrate 12 are peeled off).

Then, the manufacturing method of the LED module 10 which consists of said structure is demonstrated, referring FIG. 2, FIG.
First, a green sheet 42 is produced by a doctor blade method from a slurry obtained by thoroughly kneading a powder of aluminum nitride (AlN) and a binder such as polyvinyl butyral, a solvent such as ethanol, and a plasticizer such as diethyl phthalate. Then, a plurality of sheets (four in this example) are stacked and pressure-bonded to form a sheet-like insulating substrate body 44 [step A1].

A screen plate 46 is overlaid on the upper surface of the insulating substrate body 44, and a tungsten (W) paste 48 is screen-printed [steps B1, C1]. The printed tungsten paste becomes the internal pattern 24 through a sintering process described later.
In parallel with the above A1 to C1, in addition to binders such as aluminum nitride (AlN) powder, alumina (Al ₂ O ₃ ) powder, polyvinyl butyral, etc., solvents such as ethanol and plasticizers such as diethyl phthalate are often used. A green sheet is produced from the slurry obtained by kneading by the doctor blade method to form the buffer layer base body 50 [step D1].

A through-hole 52 is formed in the buffer layer body 50 by a punching press or the like [Step E1], and the through-hole 52 is filled with a tungsten (W) paste 54 by a screen printing method or the like [Step F1]. The tungsten paste 54 filled in the through hole 52 becomes the via hole 34 through a sintering process described later.
Subsequently, the buffer layer element body 50 filled with the tungsten paste 54 is superimposed on the insulating substrate element body 44 on which the tungsten paste 48 is printed, and the tungsten layer (W) paste 56 is applied to the upper surface of the buffer layer element body 50. Screen printing [process G1]. At the time of the crimping, the tungsten paste 48 on the insulating substrate body 44 is sunk into the buffer layer body 50, and although not shown, the insulating substrate body 44 corresponding to the tungsten paste 48 is slightly recessed. Become. The printed tungsten paste 56 becomes the surface pattern 22, the anode terminal 36, and the cathode terminal 38 through a sintering process described later.

In addition to the above A1 to G1 steps, in addition to alumina powder (Al ₂ O ₃ ) and a binder such as polyvinyl butyral, a solvent such as ethanol and a plasticizer such as diethyl phthalate were well kneaded. A green sheet 57 is produced from the slurry by a doctor blade method, and a plurality of sheets (four sheets in this example) are stacked and pressure-bonded to form a sheet-like reflector plate body 58 [step H1].

A tapered hole 60 is opened in the reflector plate 58 by a punching press or the like [Step J1].
The reflector body 58 having the tapered hole 60 is overlapped and pressure-bonded to the laminate obtained in the step G1 [Step K1].
Subsequently, the laminate obtained in Step K1 is heated at 500 ° C. to 600 ° C. to scatter organic components, and then sintered at 1500 ° C. to 1800 ° C. in a nitrogen (N ₂ ) atmosphere [Step M1]. . At this time, since the buffer layer body 50 containing both components is sandwiched between the reflector plate body 58 and the insulating substrate body 44, the sintering time due to the difference in shrinkage rate or shrinkage rate is caused. The deviation (interlayer deviation) between the reflecting plate element 58 and the insulating substrate element 44 is absorbed by the buffer layer element 50, and the reflecting plate element 58 and the insulating substrate element 44 have the buffer layer. Good bonding is achieved by the element body 50. Through the step M1, the LED mounting substrate 40 with the reflector 14 is completed.

Next, the LED chip 28 is flip-chip mounted [process N1], and the phosphor film 32 is disposed [process P1].
Finally, the convex lens 26 is formed of an epoxy resin by an injection molding method or the like [Step Q1], and the LED module 10 is completed.
(Embodiment 2)
Next, the LED module 70 according to Embodiment 2 will be described.

The LED module 70 has basically the same configuration as the LED module 10 of Embodiment 1 except that the wiring pattern for connecting the LED chips in series and the configuration of the reflecting member are different. Therefore, common portions are denoted by the same reference numerals, and the description thereof is omitted or simply mentioned, and different portions will be mainly described.
FIG. 4A is a perspective view showing a schematic configuration of the LED module 70. 4B is a cross-sectional view taken along the plane C in FIG. 4A, and FIG. 4C is a cross-sectional view taken along the plane D in FIG. 4A.

  In the LED module 10 of the first embodiment, series connection of the LED chips 28 is realized by the wiring patterns 22 and 24 formed on the upper and lower surfaces of the buffer layer 20 and via holes 34 that connect these wiring patterns 22 and 24 to each other. . On the other hand, the LED module 70 realizes series connection of the LED chips 28 by a wiring pattern 74 formed on one side (upper surface side) of the buffer layer 72.

  Moreover, although the LED module 10 of Embodiment 1 comprised the reflective member with the reflective plate 14 of 1 sheet, in the LED module 70, it is a reflective member with the reflective block 76 provided for every LED chip 28 (white LED18). Is going to be configured. By dividing the reflecting member into smaller parts, the difference in expansion and contraction in the surface direction (difference in the whole) between the buffer layer 72 and the buffer layer 72 caused by turning on and off the LED (due to heating and cooling) is reduced. , It becomes difficult to damage the joint.

  The wiring pattern 74 is laid so as to be embedded in the buffer layer 72, and the upper surface of the buffer layer 72 where the wiring pattern 74 does not exist and the upper surface of the wiring pattern 74 are substantially flush with each other. A part of the wiring pattern 74 that is electrically connected to the p-electrode (none of which is not shown) of the LED chip 28 at the end of the high potential side among the LED chips 28 connected in series is connected to the anode terminal 78. Further, a part of the wiring pattern 74 that is electrically connected to the n-electrode (both not shown) of the LED chip at the lower potential side end is connected to the cathode terminal 80.

The reflection block 76 is made of a sintered body of alumina (Al ₂ O ₃ ) and has the reflection hole 16 having the same shape as that of the first embodiment.
The buffer layer 72 is made of a sintered body of a mixture of aluminum nitride and alumina, like the buffer layer 20 of the first embodiment.
Each reflection block 76 is integrally joined to the insulating substrate 12 by the buffer layer 72. The effect brought about by the integral joining by the buffer layer 72 is the same as in the case of the first embodiment. In the LED module 70, the remaining portion excluding the white LED 18 (LED chip 28, phosphor film 32), the convex lens 26, and the like becomes the LED mounting substrate 81.

A method of manufacturing the LED module 70 having the above configuration will be described with reference to FIGS. In addition, in the process symbol described at the left end of FIG. 5 and FIG. 6, “−c” is attached, and “−d” is attached to a cut view at a position corresponding to the plane C in FIG. FIG. 5 shows a cut-away view at a position corresponding to the plane D in FIG.
First, a sheet-like insulating substrate body 44 is produced [step A2].

In parallel with this, the buffer layer body 50 is produced [step B2].
The buffer layer body 50 is stacked and pressure-bonded on the insulating substrate body 44 [step C2].
On the upper surface of the buffer layer body 50, a concave / convex mold 82 having a ridge-like convex part having the same pattern as the wiring pattern 74 is pressed to form a groove (concave part) 84 [step D2].
Tungsten (W) paste 86 is printed on the grooves 84 by screen printing or the like (the grooves 84 are filled with the tungsten paste 86) [Step E2]. The printed tungsten paste 86 becomes a wiring pattern 74, an anode terminal 78, and a cathode terminal 80 through a sintering process described later.

In parallel with the above A2 to E2 steps, from a slurry obtained by thoroughly kneading an alumina powder (Al ₂ O ₃ ) and a binder such as polyvinyl butyral, a solvent such as ethanol, and a plasticizer such as diethyl phthalate. Then, a green sheet 88 is produced by a doctor blade method, and a plurality of sheets (four sheets in this example) are stacked and pressure-bonded to form a laminate 90 [step F2].
After the taper hole 92 is opened by the punching press etc. with respect to the said laminated body 90, it divides | segments into an individual piece and the reflective block element body 94 is produced [process G2].

After arranging 16 reflective block bodies 94 on the top surface of the laminate obtained in step E2, pressure bonding is performed [step H2].
Subsequently, the laminate obtained in Step H2 is heated at 500 ° C. to 600 ° C. to disperse the organic components, and then sintered at 1500 ° C. to 1800 ° C. in a nitrogen (N ₂ ) atmosphere [Step J2]. . At this time, the reason why each reflection block element 94 and the insulating substrate element 44 can be satisfactorily joined by the presence of the buffer layer element 50 is the same as in the first embodiment. Furthermore, in the second embodiment, the upper surface of the buffer layer body 50 and the upper surface of the tungsten paste 86 are flush with each other, and there are few irregularities on the buffer layer body side as in the first embodiment. Done well. Through the process J2, the LED mounting substrate 81 with the reflection block 76 is completed.

Next, after the LED chip 28 is flip-chip mounted and the phosphor film 32 is disposed, the convex lens 26 is formed with an epoxy resin by an injection molding method or the like [Step K2], and the LED module 70 is completed.
As described above, the present invention has been described based on the embodiment. However, the present invention is not limited to the above-described form, and for example, the following form is also possible.
(1) In the second embodiment, the wiring pattern on the joint surface with the reflecting member (reflecting block 76) is embedded in the buffer layer, and the upper surface of the wiring pattern and the upper surface of the buffer layer are substantially flush with each other. Although adopted, this configuration may be adopted for the LED mounting substrate of the first embodiment.
(2) In the above embodiment, the LED (LED chip 28) is flip-chip mounted on the mounting substrate, but the mounting form is not limited to this. For example, the LED chip may be mounted face up, and the electrode of the LED chip and the wiring pattern on the substrate may be electrically connected by a bonding wire.
(3) In the above embodiment, the LED (LED chip 28) is mounted in the bare chip state on the LED mounting substrate to configure the LED module. However, the LED to be mounted is not limited to the bare chip form. For example, a packaged surface mount type LED may be used. Alternatively, a so-called submount type LED described in Japanese Patent Laid-Open No. 2001-15817 (Japanese Patent No. 3399440) may be mounted. The submount type LED is an LED bare chip mounted on a substrate (submount element) having a larger main area than the LED bare chip, and a phosphor film is formed around the LED bare chip as a receiving tray for the submount element. It is formed. When sub-mount type LEDs are employed, color unevenness and the like can be inspected before being mounted on a mounting substrate, so that the yield of finished products (LED modules) is improved.

  The LED mounting substrate according to the present invention can be suitably used, for example, as a substrate for mounting a large number of LEDs and using them for lighting purposes.

(A) is a perspective view which shows schematic structure of the LED module which concerns on Embodiment 1, (b) is sectional drawing cut | disconnected in the plane A in (a), (c) is (b) ) Is an enlarged view of a portion B, and FIG. 4D is a plan view showing a state where one convex hole portion in the LED module is removed from the convex lens, the white LED, and the like. 5 is a diagram showing a part of the manufacturing process of the LED module according to Embodiment 1. FIG. 5 is a diagram showing a part of the manufacturing process of the LED module according to Embodiment 1. FIG. (A) is a perspective view which shows schematic structure of the LED module which concerns on Embodiment 2, (b) is sectional drawing cut | disconnected in the plane C in (a), (c) is (a) ) Is a cross-sectional view taken along a plane D. 6 is a diagram showing a part of the manufacturing process of the LED module according to Embodiment 2. FIG. 6 is a diagram showing a part of the manufacturing process of the LED module according to Embodiment 2. FIG.

Explanation of symbols

10, 70 LED module 12 Insulating substrate 14 Reflecting plate 16 Reflecting hole 18 White LED
20, 72 Buffer layer 28 LED chip 40 LED mounting substrate 44 Insulating substrate element 50 Buffer layer element 58 Reflecting plate element 74 Wiring pattern 76 Reflecting block 81 LED mounting substrate 94 Reflecting block element 86 Tungsten (W) paste

Claims (5)

An LED mounting board on which an LED is mounted,
An insulating substrate made of a sintered body of aluminum nitride;
A reflection member comprising a sintered body of alumina and having a reflection hole surrounding the LED in a mounted state;
The LED mounting substrate with a reflecting member, wherein the insulating substrate and the reflecting member are integrally joined by a buffer layer made of a sintered body of a mixture of aluminum nitride and alumina.   The LED mounting substrate with a reflecting member according to claim 1, wherein the LED mounting board has a wiring pattern to which the electrodes of the LED are electrically connected and is formed substantially flush with the buffer layer. A method for manufacturing an LED mounting board with a reflecting member having a reflecting hole,
A kneaded body of alumina powder and a binder, the step of preparing a reflecting member body in which the holes to be the reflecting holes are opened;
A kneaded body of an aluminum nitride powder and a binder, and preparing a sheet-like insulating substrate body;
A kneaded body of aluminum nitride powder, alumina powder, and binder, and preparing a sheet-like buffer layer body; and
Sintering in a state where the buffer layer element body is sandwiched between the reflecting member element body and the insulating substrate element body;
The manufacturing method of the mounting substrate for LED with a reflecting member characterized by having. Before the sintering step,
Forming a recess corresponding to the wiring pattern of the LED mounting substrate on one main surface of the buffer layer element;
The method for producing a mounting board for LED with a reflecting member according to claim 3, further comprising a step of filling the recess with a tungsten paste. The mounting substrate for LED with a reflecting member according to claim 1 or 2,
An LED module comprising: an LED mounted at a position surrounded by the reflection hole.

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