JP2009038161A - Light emitting element storage package - Google Patents

Light emitting element storage package Download PDF

Info

Publication number
JP2009038161A
JP2009038161A JP2007200262A JP2007200262A JP2009038161A JP 2009038161 A JP2009038161 A JP 2009038161A JP 2007200262 A JP2007200262 A JP 2007200262A JP 2007200262 A JP2007200262 A JP 2007200262A JP 2009038161 A JP2009038161 A JP 2009038161A
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
light
storage package
element storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007200262A
Other languages
Japanese (ja)
Inventor
Masashi Tezuka
将志 手塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal SMI Electronics Device Inc
Original Assignee
Sumitomo Metal SMI Electronics Device Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal SMI Electronics Device Inc filed Critical Sumitomo Metal SMI Electronics Device Inc
Priority to JP2007200262A priority Critical patent/JP2009038161A/en
Publication of JP2009038161A publication Critical patent/JP2009038161A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Landscapes

  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting element storage package which prevents light interference among a plurality of adjacent light emitting elements and has high heat dissipation property for improving light emission efficiency of total light emission of the plurality of light emitting elements and has high reliability. <P>SOLUTION: The light emitting element storage package has a ceramic multilayer substrate 11 having a plurality of cavity portions 13 for enclosing and storing light emitting elements 12, and a reflector 15 which is joined to a top-surface outer circumferential portion of the ceramic multilayer substrate 11, encloses the plurality of cavity portions 13 and reflects light from the light emitting elements 12. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、発光ダイオード（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ：以下、ＬＥＤという。）等の複数個の発光素子を搭載し収納するための発光素子収納用パッケージに関し、より詳細には、発光素子からの発光を効率的に発光させることができる発光素子収納用パッケージに関する。   The present invention relates to a light emitting element storage package for mounting and storing a plurality of light emitting elements such as light emitting diodes (hereinafter referred to as LEDs), and more particularly, to efficiently emit light from the light emitting elements. The present invention relates to a light emitting element storage package that can emit light automatically.

従来からＬＥＤ等の発光素子を収容するためには、樹脂や、セラミックで作製された発光素子収納用パッケージが用いられている。一方、一般照明や大画面液晶用バックライト、自動車用ランプ等のような高い光出力を必要とする用途の発光素子は、消費電力が大きくなり、発熱する発光素子の熱を取り除かなければ、発光素子の温度が上昇して発光効率が低下して高い光出力が得られないという問題を有している。このような発光素子を樹脂製の発光素子収納用パッケージに収納した場合には、樹脂の熱伝導率が低いために発光素子への投入電力を増加させて光出力を上げると発生する高熱を取り除くことができず、発光素子の温度が上昇して逆に高い光出力が得られないこととなっている。また、樹脂製のパッケージは、このパッケージを鉛フリー半田等で実装するとき等に更に加熱があるので、樹脂の耐熱性の問題を抱えている。更に、樹脂製のパッケージは、発光素子に紫外光を含む発光素子を多く用いるので、樹脂の耐光性（ＵＶ劣化）の問題を抱えている。そこで、最近では、発光素子収納用パッケージには、熱伝導性、耐熱性、耐光性が高く、放熱性に優れるアルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）等からなるセラミック製のパッケージが多く用いられるようになってきている。 Conventionally, in order to accommodate light emitting elements such as LEDs, a light emitting element accommodation package made of resin or ceramic has been used. On the other hand, light-emitting elements that require high light output, such as general lighting, backlights for large-screen LCDs, and lamps for automobiles, consume more power and emit light without removing the heat generated by the light-emitting elements. There is a problem that a high light output cannot be obtained due to a decrease in luminous efficiency due to an increase in temperature of the element. When such a light-emitting element is housed in a resin-made light-emitting element housing package, since the thermal conductivity of the resin is low, the high heat generated when the light output is increased by increasing the input power to the light-emitting element is removed. In other words, the temperature of the light-emitting element rises and a high light output cannot be obtained. In addition, since the resin package is further heated when the package is mounted with lead-free solder or the like, the resin package has a problem of heat resistance of the resin. Furthermore, since the resin package uses many light emitting elements including ultraviolet light as the light emitting elements, there is a problem of light resistance (UV degradation) of the resin. Therefore, recently, a package made of a ceramic made of alumina (Al 2 O 3 ), aluminum nitride (AlN), or the like that has high heat conductivity, heat resistance, light resistance, and excellent heat dissipation is used as the light emitting element storage package. Are increasingly being used.

一方、従来から発光素子収納用パッケージには、明るい光を得るために１つの発光素子収納用パッケージに複数個の発光素子を搭載して全体として輝度を向上させることが行われている。この発光素子収納用パッケージには、平板状のセラミック基板の上面の導体配線パターンにワイヤボンド方式や、フリップチップ方式等で複数個の発光素子を実装している。このワイヤボンド方式とは、発光素子を発光素子収納用パッケージに予め設けるダイボンドパッドに接合させた後、Ａｕ線からなるボンディングワイヤを用いて発光素子の上面に設ける電極パッドと、発光素子収納用パッケージのワイヤボンドパッドを接続させる方式である。また、フリップチップ方式とは、発光素子の下面に設ける電極パッドに予めＡｕ−Ｓｎ等のろう材を蒸着して、このろう材を介して発光素子収納用パッケージの電極端子パッドに直接発光素子を接続させるようにして発光素子の上面側を解放する方式である。あるいは、フリップチップ方式とは、発光素子の下面に設ける電極パッドに電解めっき法や、転写バンプ法や、ボールボンディング法等でＡｕバンプを形成し、このＡｕバンプを介して発光素子収納用パッケージの電極端子パッドに直接発光素子を接続させるようにして発光素子の上面側を解放させる方式である。上記のワイヤボンド方式は、発光素子の上面側にボンディングワイヤが存在することとなり、発光素子からの発光を遮るように作用して発光素子からの発光効率を低下させることとなるので、発光効率の低下を防止するためには、発光素子の上面側を解放させるフリップチップ方式が有利となっている。そして、発光素子収納用パッケージには、複数個の発光素子を囲繞するように反射体が設けられ、全体として輝度を向上させることが行われている。   On the other hand, conventionally, in order to obtain bright light, a plurality of light emitting elements are mounted on one light emitting element storing package to improve brightness as a whole. In this light emitting element storage package, a plurality of light emitting elements are mounted on a conductor wiring pattern on the upper surface of a flat ceramic substrate by a wire bond method, a flip chip method or the like. In this wire bonding method, after a light emitting element is bonded to a die bond pad provided in advance in a light emitting element storage package, an electrode pad provided on the upper surface of the light emitting element using a bonding wire made of Au wire, and a light emitting element storage package The wire bond pad is connected. In the flip chip method, a brazing material such as Au-Sn is vapor-deposited in advance on an electrode pad provided on the lower surface of the light emitting element, and the light emitting element is directly applied to the electrode terminal pad of the light emitting element storage package through the brazing material. In this method, the upper surface side of the light emitting element is released. Alternatively, the flip chip method is a method in which an Au bump is formed on an electrode pad provided on the lower surface of a light emitting element by an electrolytic plating method, a transfer bump method, a ball bonding method, or the like. In this method, the light emitting element is directly connected to the electrode terminal pad to release the upper surface side of the light emitting element. In the above wire bonding method, there is a bonding wire on the upper surface side of the light emitting element, and the light emitting efficiency from the light emitting element is lowered by acting to block the light emission from the light emitting element. In order to prevent the decrease, a flip chip method in which the upper surface side of the light emitting element is released is advantageous. The light-emitting element storage package is provided with a reflector so as to surround a plurality of light-emitting elements, and the luminance is improved as a whole.

従来の発光素子収納用パッケージには、発光素子をフリップチップ方式で接合するキャビティ部を複数個有する回路基板のキャビティ部の壁面を反射面として、発光素子からの発光効率を向上させることができるようにするパッケージが開示されている（例えば、特許文献１参照）。
また、従来の発光素子収納用パッケージには、発光素子をワイヤボンド方式で接合するキャビティ部を複数個有するセラミック多層基板のキャビティ部に設ける反射体の壁面を反射面として、発光素子からの発光効率を向上させることができるようにするパッケージが開示されている（例えば、特許文献２参照）。
更に、従来の発光素子収納用パッケージには、発光素子を容易に位置決めして配列して接合するためのキャビティ部を複数個有するセラミック多層基板の壁面が垂直からなるキャビティ部に押圧して実装することができるにするパッケージが開示されている（例えば、特許文献４参照）。 The conventional light emitting device storage package can improve the light emission efficiency from the light emitting device by using the wall surface of the cavity portion of the circuit board having a plurality of cavity portions to which the light emitting device is joined by the flip chip method as a reflection surface. A package is disclosed (for example, see Patent Document 1).
Further, in the conventional light emitting element storage package, the light emission efficiency from the light emitting element is obtained by using the reflector wall surface provided in the cavity portion of the ceramic multilayer substrate having a plurality of cavity portions for joining the light emitting elements by wire bonding as a reflecting surface. There is disclosed a package that makes it possible to improve (see, for example, Patent Document 2).
Further, in the conventional light emitting element storage package, the wall surface of the ceramic multilayer substrate having a plurality of cavity parts for easily positioning, arranging and bonding the light emitting elements is pressed and mounted on the vertical cavity part. A package that can be used is disclosed (see, for example, Patent Document 4).

特開平１１−１６１１９７号公報JP-A-11-161197 特開２００４−３３５５１８号公報JP 2004-335518 A 特開２００６−９３５２３号公報JP 2006-93523 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
（１）複数個の発光素子を平板状の同一面にフリップチップ方式で実装する発光素子収納用パッケージは、隣接する発光素子間で光の干渉が発生し、光が吸収されて全体としての輝度の低下となっている。
（２）特開平１１−１６１１９７号公報で開示される発光素子収納用パッケージは、フリップチップ方式で発光素子の上面側を解放して発光効率を向上させることができると共に、隣接する発光素子間で光の干渉を防止して光の吸収のない発光を前方に発光させることができるものの、キャビティ部がプリント基板に形成されて熱伝導率が低く発光素子の放熱性と、耐熱性が低くパッケージとしての信頼性に問題があると共に、複数個の発光素子の全体の発光の発光効率を向上させることができなくなっている。
（３）特開２００４−３３５５１８号公報で開示される発光素子収納用パッケージは、隣接する発光素子間で光の干渉を防止して光の吸収のない発光を前方に発光させることができるものの、ワイヤボンド方式で発光素子の上面側のボンディングワイヤの存在で発光効率を低下させると共に、複数個の発光素子の全体の発光の発光効率を向上させることができなくなっている。
（４）特開２００６−９３５２３号公報で開示される発光素子収納用パッケージは、隣接する発光素子間で光の干渉を防止して光の吸収のない発光をさせることができると共に、フリップチップ方式で発光素子の上面側を解放して発光効率を向上させることができるものの、壁面が垂直からなるキャビティ部で発光を前方に発光させる反射効率が低いと共に、複数個の発光素子の全体の発光の発光効率を向上させることができなくなっている。 However, the conventional light emitting element storage package as described above has the following problems.
(1) In a light emitting element storage package in which a plurality of light emitting elements are mounted on the same flat surface by a flip chip method, light interference occurs between adjacent light emitting elements, and the light is absorbed so that the luminance as a whole It is a decline.
(2) The light emitting element storage package disclosed in Japanese Patent Application Laid-Open No. 11-161197 can improve the light emission efficiency by releasing the upper surface side of the light emitting element by a flip chip method, and between adjacent light emitting elements. Although it can prevent light interference and emit light without light absorption forward, the cavity part is formed on the printed circuit board, and the thermal conductivity is low, the heat dissipation of the light emitting element and the heat resistance are low, so as a package There is a problem in the reliability of the light emitting device, and it is impossible to improve the light emission efficiency of the entire light emission of the plurality of light emitting elements.
(3) Although the light emitting element storage package disclosed in Japanese Patent Application Laid-Open No. 2004-335518 can prevent light interference between adjacent light emitting elements and emit light without light absorption forward, In the wire bonding method, the presence of the bonding wire on the upper surface side of the light emitting element reduces the light emission efficiency, and the light emission efficiency of the entire light emission of the plurality of light emitting elements cannot be improved.
(4) The light emitting element storage package disclosed in Japanese Patent Application Laid-Open No. 2006-93523 can prevent light interference between adjacent light emitting elements and emit light without absorbing light. Although the light emission element can release the upper surface side to improve the light emission efficiency, it has a low reflection efficiency for emitting light forward in the cavity portion whose wall surface is vertical, and the entire light emission of the plurality of light emission elements. The luminous efficiency cannot be improved.

本発明は、かかる事情に鑑みてなされたものであって、複数個の隣接する発光素子間の光の干渉を防止すると共に、複数個の発光素子の全体の発光の発光効率を向上させる放熱性と、信頼性の高い発光素子収納用パッケージを提供することを目的とする。   The present invention has been made in view of such circumstances, and prevents heat interference between a plurality of adjacent light emitting elements, and improves heat dissipation efficiency of the entire light emission of the plurality of light emitting elements. Another object of the present invention is to provide a highly reliable light-emitting element storage package.

前記目的に沿う本発明に係る発光素子収納用パッケージは、発光素子を囲繞して収納するためのキャビティ部を複数個有するセラミック多層基板と、セラミック多層基板の上面外周部に接合して複数個のキャビティ部を包含して発光素子からの発光を反射させるための反射体を有する。   A light emitting device storage package according to the present invention that meets the above-described object is provided with a ceramic multilayer substrate having a plurality of cavity portions for surrounding and storing the light emitting devices, and a plurality of bonded to the outer peripheral portion of the upper surface of the ceramic multilayer substrate. A reflector for reflecting light emitted from the light emitting element is included so as to include the cavity portion.

ここで、上記の発光素子収納用パッケージは、キャビティ部の壁面、及び反射体内周側の反射面が上方側の開口を広くするテーパー状からなるのがよい。   Here, the light-emitting element storage package preferably has a tapered shape in which the wall surface of the cavity portion and the reflection surface on the circumferential side of the reflector widen the opening on the upper side.

また、上記の発光素子収納用パッケージは、反射体の高さがキャビティ部の深さより大きいのがよい。   In the light emitting element storage package, the height of the reflector is preferably larger than the depth of the cavity portion.

請求項１又はこれに従属する請求項２又は３記載の発光素子収納用パッケージは、発光素子を囲繞して収納するためのキャビティ部を複数個有するセラミック多層基板と、セラミック多層基板の上面外周部に接合して複数個のキャビティ部を包含して発光素子からの発光を反射させるための反射体を有するので、隣接する発光素子間の光の干渉をセラミック多層基板に形成するキャビティ部で防止すると共に、熱伝導率が高く放熱性に優れ、耐熱性が高く信頼性に優れるセラミック多層基板で放熱性と、信頼性を確保し、しかも、セラミック多層基板の上面外周部に設ける複数個のキャビティ部を包含する反射体で複数個の発光素子の全体の発光の発光効率を向上させることができる。   The light emitting element storage package according to claim 1 or claim 2 or 3 dependent thereon, a ceramic multilayer substrate having a plurality of cavities for surrounding and storing the light emitting elements, and an outer peripheral portion of the upper surface of the ceramic multilayer substrate And having a reflector for reflecting the light emitted from the light emitting element, including a plurality of cavity parts, prevents light interference between adjacent light emitting elements at the cavity part formed in the ceramic multilayer substrate. In addition, heat dissipation and reliability are ensured with a ceramic multilayer substrate with high thermal conductivity, excellent heat dissipation, heat resistance and excellent reliability, and a plurality of cavity portions provided on the outer periphery of the upper surface of the ceramic multilayer substrate The light emitting efficiency of the entire light emission of the plurality of light emitting elements can be improved by the reflector including the light emitting element.

特に、請求項２記載の発光素子収納用パッケージは、キャビティ部の壁面、及び反射体内周側の反射面が上方側の開口を広くするテーパー状からなるので、発光素子からの発光を前方に集中させて発光させることができ、複数個の発光素子の全体の発光の発光効率を向上させることができる。   In particular, the light-emitting element storage package according to claim 2 has a tapered shape in which the wall surface of the cavity portion and the reflection surface on the peripheral side of the reflector have a wide opening on the upper side, so that the light emission from the light-emitting element is concentrated forward. The light emission efficiency of the whole light emission of the plurality of light emitting elements can be improved.

特に、請求項３記載の発光素子収納用パッケージは、反射体の高さがキャビティ部の深さより大きいので、複数個の発光素子の発光を効率的に反射させて発光素子の全体の発光の発光効率を向上させることができる。   Particularly, in the light emitting element storage package according to claim 3, since the height of the reflector is larger than the depth of the cavity portion, the light emission of the light emitting element as a whole is efficiently reflected by efficiently reflecting the light emitted from the plurality of light emitting elements. Efficiency can be improved.

続いて、添付した図面を参照しつつ、本発明を具体化した実施するための最良の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。 Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are a plan view and a longitudinal sectional view taken along line AA ′ of a light emitting element storage package according to an embodiment of the present invention, respectively.

図１（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、熱伝導率に優れ、放熱性のよいセラミック多層基板１１を基体として用いている。このセラミック多層基板１１は、形状を限定するものではないが、外形形状が、例えば、平面視して矩形からなり、中央部にＬＥＤ等の発光素子１２を囲繞して収納するための、例えば、平面視して円形からなるキャビティ部１３を複数個有している。このセラミック多層基板１１には、通常、アルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）や、低温焼成セラミック等からなる複数枚のセラミックグリーンシートが用いられ、キャビティ部１３用の貫通孔を形成した１又は複数枚のセラミックグリーンシートと、平板状の１又は複数枚のセラミックグリーンシートが重ね合わされて積層され、焼成して形成されている。このキャビティ部１３は、そこに収納される発光素子１２からの発光の側部側への広がりを壁面１４で制限でき、隣接する発光素子１２間の光の干渉、即ち光の吸収によって発生する輝度の低下を防止することができるように作用している。 As shown in FIGS. 1A and 1B, a light emitting element storage package 10 according to an embodiment of the present invention uses a ceramic multilayer substrate 11 having excellent thermal conductivity and good heat dissipation as a base. Yes. Although the shape of the ceramic multilayer substrate 11 is not limited, the outer shape is, for example, a rectangular shape in plan view, and surrounds and stores the light emitting element 12 such as an LED in the center, for example, A plurality of cavity portions 13 having a circular shape in plan view are provided. The ceramic multilayer substrate 11 is usually made of a plurality of ceramic green sheets made of alumina (Al 2 O 3 ), aluminum nitride (AlN), low-temperature fired ceramic, and the like, and has a through hole for the cavity portion 13. The formed one or more ceramic green sheets and the flat one or more ceramic green sheets are laminated and laminated and fired. The cavity 13 can limit the spread of light emitted from the light emitting element 12 accommodated in the cavity 13 to the side wall side by the wall surface 14, and luminance generated by light interference between adjacent light emitting elements 12, that is, light absorption. It is acting so that the fall of can be prevented.

また、この発光素子収納用パッケージ１０は、セラミック多層基板１１の上面外周部に接合して複数個のキャビティ部１３を包含する平面視して、例えば、円形リング状からなる反射体１５を有している。この反射体１５には、上記と同様のセラミック製、ＫＶ（Ｆｅ−Ｎｉ−Ｃｏ系合金、商品名「Ｋｏｖａｒ（コバール）」）や、４２アロイ（Ｆｅ−Ｎｉ系合金）等のセラミック多層基板と熱膨張係数が近似する金属製、あるいは、樹脂製等が用いられ、特に材質が限定されるものではないが、反射率の高いものが好ましい。そして、通常、反射体１５は、ろう材や、ガラスや、樹脂等からなる接合剤でセラミック多層基板１１の上面外周部に接合されている。この反射体１５内周側の反射面１６は、複数個の発光素子１２からの発光を全体として反射させることができ、複数個の発光素子１２の全体としての発光効率を向上させることができるように作用している。   The light emitting element storage package 10 includes a reflector 15 made of, for example, a circular ring in plan view including a plurality of cavities 13 bonded to the outer periphery of the upper surface of the ceramic multilayer substrate 11. ing. The reflector 15 includes a ceramic multilayer substrate such as KV (Fe—Ni—Co alloy, trade name “Kovar”), 42 alloy (Fe—Ni alloy), etc. A metal or a resin having a similar thermal expansion coefficient is used, and the material is not particularly limited, but a high reflectance is preferable. In general, the reflector 15 is bonded to the outer peripheral portion of the upper surface of the ceramic multilayer substrate 11 with a bonding agent made of brazing material, glass, resin, or the like. The reflecting surface 16 on the inner peripheral side of the reflector 15 can reflect the light emitted from the plurality of light emitting elements 12 as a whole, and can improve the light emitting efficiency of the plurality of light emitting elements 12 as a whole. It is acting on.

上記の発光素子収納用パッケージ１０に収納される発光素子１２は、実装形態として、特に、制限されるものではないが、キャビティ部１３の底部に形成された発光素子接続端子パッド１７にバンプ１８等を介して接合されるフリップチップ方式で実装するのが好ましい。このフリップチップ方式での実装は、ワイヤボンド方式のようなボンディングワイヤが発光素子１２の上面側に存在するというようなことがないので、上面側への発光の発光効率を向上させることができる。上記の発光素子接続端子パッド１７の形成は、セラミックグリーンシートにタングステン（Ｗ）や、モリブデン（Ｍｏ）等からなる高融点金属からなる導体ペーストを用いてスクリーン印刷でパターンを形成し、セラミックと、導体金属を還元雰囲気中の１５５０℃程度（セラミックがＡｌ２Ｏ３の場合）の高温で同時焼成することで形成することができる。なお、発光素子接続端子パッド１７と電気的に導通状態とする外部接続端子パッド１９を含む導体配線パターン２０や、ビア２１等は、発光素子接続端子パッド１７の形成と同時に形成している。また、図示しないが、セラミック多層基板１１の上面外周部に接合される反射体１５が金属からなる場合には、上記と同様に反射体１５が接合される部位のセラミック多層基板１１の上面に導体パターンを形成することで、ろう材との接合を可能としている。 The light emitting element 12 housed in the light emitting element housing package 10 is not particularly limited as a mounting form, but the light emitting element connection terminal pad 17 formed on the bottom of the cavity portion 13 has bumps 18 and the like. It is preferable to mount by a flip chip method that is bonded via a via. In this flip chip mounting, since there is no bonding wire as in the wire bonding method on the upper surface side of the light emitting element 12, the light emission efficiency of light emission to the upper surface side can be improved. The light emitting element connection terminal pad 17 is formed by forming a pattern by screen printing using a conductive paste made of a refractory metal made of tungsten (W), molybdenum (Mo) or the like on a ceramic green sheet, The conductive metal can be formed by simultaneous firing at a high temperature of about 1550 ° C. in a reducing atmosphere (when the ceramic is Al 2 O 3 ). The conductor wiring pattern 20 including the external connection terminal pad 19 that is electrically connected to the light emitting element connection terminal pad 17, the via 21, and the like are formed simultaneously with the formation of the light emitting element connection terminal pad 17. Although not shown, when the reflector 15 bonded to the outer peripheral portion of the upper surface of the ceramic multilayer substrate 11 is made of metal, a conductor is formed on the upper surface of the ceramic multilayer substrate 11 at the portion to which the reflector 15 is bonded in the same manner as described above. By forming the pattern, it is possible to join the brazing material.

上記の発光素子収納用パッケージ１０のキャビティ部１３の壁面１４は、上方側の開口を広くするテーパー状からなるのがよい。また、上記の発光素子収納用パッケージ１０の反射体１５内周側の反射面１６は、上記のキャビティ部１３の壁面１４と同様に、上方側の開口を広くするテーパー状からなるのがよい。このキャビティ部１３の壁面１４、及び反射体１５内周側の反射面１６をテーパー状とする発光素子収納用パッケージ１０に収納された発光素子１２は、それぞれの発光素子１２からの発光を前方に集中させて発光させることができ、複数個の発光素子１２の全体の発光の発光効率を向上させることができるように作用している。なお、キャビティ部１３の壁面１４と、反射体１５内周側の反射面１６のテーパー角度は、特に制限されるものではないが、両方が略同じ角度か、反射体１５の方が鋭角からなるのが好ましい。これにより、複数個の発光素子１２からの発光は、より前方に集中させて発光させることが可能となる。   The wall surface 14 of the cavity portion 13 of the light emitting element storage package 10 preferably has a tapered shape that widens the opening on the upper side. Further, the reflecting surface 16 on the inner peripheral side of the reflector 15 of the light emitting element storage package 10 is preferably formed in a tapered shape that widens the opening on the upper side, like the wall surface 14 of the cavity portion 13. The light emitting elements 12 housed in the light emitting element housing package 10 in which the wall surface 14 of the cavity portion 13 and the reflecting surface 16 on the inner peripheral side of the reflector 15 are tapered, emit light from each light emitting element 12 forward. The light can be emitted in a concentrated manner, and the light emission efficiency of the whole light emission of the plurality of light emitting elements 12 can be improved. The taper angle between the wall surface 14 of the cavity portion 13 and the reflecting surface 16 on the inner peripheral side of the reflector 15 is not particularly limited, but both are substantially the same angle or the reflector 15 has a sharper angle. Is preferred. As a result, the light emitted from the plurality of light emitting elements 12 can be emitted more centrally.

上記の発光素子収納用パッケージ１０の反射体１５の高さｈは、キャビティ部１３の深さｄより大きい、ｈ＞ｄであるのがよい。発光素子収納用パッケージ１０は、キャビティ部１３の深さｄより大きい反射体１５の高さｈによって、発光素子からの発光を前方に集中させて発光させることができ、複数個の発光素子の全体の発光の発光効率を向上させることができるように作用している。   The height h of the reflector 15 of the light emitting element storage package 10 is preferably greater than the depth d of the cavity portion 13 and h> d. The light emitting element storage package 10 can emit light by concentrating the light emitted from the light emitting elements forward by the height h of the reflector 15 which is larger than the depth d of the cavity portion 13. It is acting so that the light emission efficiency of the light emission can be improved.

ここで、発光素子収納用パッケージ１０のセラミック多層基板１１に、セラミックの一例であるアルミナを用いた場合の作製方法を簡単に説明する。この作製には、先ず、アルミナ粉末にマグネシア、シリカ、カルシア等の焼結助剤を適当量加えた粉末に、ジオクチルフタレート等の可塑剤と、アクリル樹脂等のバインダー、及び、トルエン、キシレン、アルコール類等の溶剤が加えられ、十分に混練した後、脱泡して粘度２０００〜４００００ｃｐｓのスラリーが作製される。次に、スラリーは、ドクターブレード法等によって、例えば、厚み０．２５ｍｍのロール状のシートに形成され、適当なサイズにカットして複数枚のセラミックグリーンシートが作製される。   Here, a manufacturing method when alumina, which is an example of ceramic, is used for the ceramic multilayer substrate 11 of the light emitting element storage package 10 will be briefly described. For this preparation, first, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to alumina powder, a plasticizer such as dioctyl phthalate, a binder such as acrylic resin, and toluene, xylene, alcohol A solvent such as the like is added and sufficiently kneaded, and then defoamed to produce a slurry having a viscosity of 2000 to 40000 cps. Next, the slurry is formed into a roll sheet having a thickness of, for example, 0.25 mm by a doctor blade method or the like, and cut into an appropriate size to produce a plurality of ceramic green sheets.

そして、それぞれのセラミックグリーンシートには、打ち抜き金型やパンチングマシーン等を用いて、それぞれの所定位置にキャビティ部１３用の貫通孔や、上層と下層との間の導通を形成するためのビア１６用の貫通孔が穿設される。次いで、セラミックグリーンシートには、タングステンや、モリブデン等からなる導体ペーストを用いてスクリーン印刷でビア２１用の貫通孔に充填したり、発光素子１２と電気的に導通状態とするために表面に導体配線パターン２０用や、発光素子接続端子パッド１７用や、外部接続端子パッド１９用等の導体印刷パターンが形成される。これらの印刷が完了したセラミックグリーンシートは、複数枚が重ね合わされ積層体が形成される。そして、次に、高融点金属と、セラミックグリーンシートとを還元性雰囲気の焼成炉で同時焼成してセラミック多層基板１１が作製されている。   In each ceramic green sheet, a punching die, a punching machine, or the like is used to form a through hole for the cavity portion 13 in each predetermined position, or a via 16 for forming conduction between the upper layer and the lower layer. A through-hole is drilled. Next, the ceramic green sheet is filled with a conductive paste made of tungsten, molybdenum, or the like into a through hole for the via 21 by screen printing, or a conductor is formed on the surface so as to be electrically connected to the light emitting element 12. Conductor printing patterns for the wiring pattern 20, the light emitting element connection terminal pad 17, the external connection terminal pad 19, and the like are formed. A plurality of ceramic green sheets on which printing has been completed are stacked to form a laminate. Next, the ceramic multilayer substrate 11 is produced by simultaneously firing the refractory metal and the ceramic green sheet in a firing furnace in a reducing atmosphere.

本発明の発光素子収納用パッケージは、ＬＥＤ等の発光素子を搭載させて発光効率のよい照明や、ディスプレイ等に用いることができる。   The light-emitting element storage package of the present invention can be used for lighting, a display, or the like with a light-emitting element such as an LED mounted thereon.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。(A), (B) is a top view of the light emitting element storage package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view.

符号の説明Explanation of symbols

１０：発光素子収納用パッケージ、１１：セラミック多層基板、１２：発光素子、１３：キャビティ部、１４：壁面、１５：反射体、１６：反射面、１７：発光素子接続端子パッド、１８：バンプ、１９：外部接続端子パッド、２０：導体配線パターン、２１：ビア   10: Light emitting element storage package, 11: Ceramic multilayer substrate, 12: Light emitting element, 13: Cavity part, 14: Wall surface, 15: Reflector, 16: Reflecting surface, 17: Light emitting element connection terminal pad, 18: Bump, 19: External connection terminal pad, 20: Conductor wiring pattern, 21: Via

Claims (3)

発光素子を囲繞して収納するためのキャビティ部を複数個有するセラミック多層基板と、該セラミック多層基板の上面外周部に接合して複数個の前記キャビティ部を包含して前記発光素子からの発光を反射させるための反射体を有することを特徴とする発光素子収納用パッケージ。   A ceramic multilayer substrate having a plurality of cavities for enclosing and housing the light emitting elements, and emitting light from the light emitting elements including the plurality of cavities bonded to the outer periphery of the upper surface of the ceramic multilayer substrate A light-emitting element storage package comprising a reflector for reflecting. 請求項１記載の発光素子収納用パッケージにおいて、前記キャビティ部の壁面、及び前記反射体内周側の反射面が上方側の開口を広くするテーパー状からなることを特徴とする発光素子収納用パッケージ。   2. The light emitting element storage package according to claim 1, wherein a wall surface of the cavity portion and a reflection surface on the peripheral side of the reflector have a tapered shape that widens an opening on the upper side. 請求項１又は２記載の発光素子収納用パッケージにおいて、前記反射体の高さが前記キャビティ部の深さより大きいことを特徴とする発光素子収納用パッケージ。   3. The light emitting element storage package according to claim 1, wherein a height of the reflector is larger than a depth of the cavity portion.
JP2007200262A 2007-08-01 2007-08-01 Light emitting element storage package Pending JP2009038161A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007200262A JP2009038161A (en) 2007-08-01 2007-08-01 Light emitting element storage package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007200262A JP2009038161A (en) 2007-08-01 2007-08-01 Light emitting element storage package

Publications (1)

Publication Number Publication Date
JP2009038161A true JP2009038161A (en) 2009-02-19

Family

ID=40439806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007200262A Pending JP2009038161A (en) 2007-08-01 2007-08-01 Light emitting element storage package

Country Status (1)

Country Link
JP (1) JP2009038161A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011037184A1 (en) * 2009-09-25 2011-03-31 京セラ株式会社 Light emitting device
JP2011129425A (en) * 2009-12-18 2011-06-30 Panasonic Electric Works Co Ltd Lighting fixture
JP2012023110A (en) * 2010-07-12 2012-02-02 Vienex Corp Ultraviolet light source and optical reader using the same
JP2013526016A (en) * 2010-04-16 2013-06-20 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Optoelectronic device and method of manufacturing the optoelectronic device
JP2014132671A (en) * 2014-02-07 2014-07-17 Vienex Corp Optical reading device
KR101902393B1 (en) * 2011-12-09 2018-10-01 엘지이노텍 주식회사 Light emitting device package
USRE48858E1 (en) 2011-08-22 2021-12-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light unit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011037184A1 (en) * 2009-09-25 2011-03-31 京セラ株式会社 Light emitting device
JP2011129425A (en) * 2009-12-18 2011-06-30 Panasonic Electric Works Co Ltd Lighting fixture
JP2013526016A (en) * 2010-04-16 2013-06-20 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Optoelectronic device and method of manufacturing the optoelectronic device
US8835931B2 (en) 2010-04-16 2014-09-16 Osram Opto Semiconductors Gmbh Optoelectronic component and method for producing an optoelectronic component
JP2012023110A (en) * 2010-07-12 2012-02-02 Vienex Corp Ultraviolet light source and optical reader using the same
USRE48858E1 (en) 2011-08-22 2021-12-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light unit
KR101902393B1 (en) * 2011-12-09 2018-10-01 엘지이노텍 주식회사 Light emitting device package
JP2014132671A (en) * 2014-02-07 2014-07-17 Vienex Corp Optical reading device

Similar Documents

Publication Publication Date Title
JP4789671B2 (en) WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP2010199167A (en) Package for housing light-emitting element, and light-emitting device
JP2007214524A (en) Light emitting device and method for producing the same
JP2008109079A (en) Wiring board for surface mounting type light-emitting element, and light-emitting device
JP2007234846A (en) Ceramic package for light-emitting element
JP2009038161A (en) Light emitting element storage package
JP2008288536A (en) Surface mounting type ceramic substrate
JP2007273602A (en) Wiring board for light emitting element, and light emitting device
JP2004335518A (en) Packages for housing light emitting element
JP2006303351A (en) Package for storing light emitting element
JP2007273603A (en) Wiring board for light emitting element, and light emitting device
JP2005310935A (en) Storing package for light-emitting element
JP2007273592A (en) Light emitting element wiring board and light emitting device
JP2007266222A (en) Substrate for loading light emitting element, package for storing light emitting element, light emitting device and light system
JP5056327B2 (en) Light emitting device
JP2007258619A (en) Light-emitting element housing package
JP2007227738A (en) Wiring board for light-emitting element, and light-emitting device
JP4895777B2 (en) WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP6622812B2 (en) Light emitting element mounting substrate, light emitting device, and light emitting module
JP2007273852A (en) Package for housing light emitting element
JP4250171B2 (en) Ceramic package for light emitting device
JP2008131011A (en) Package for storing light-emitting element, and manufacturing method thereof
JP6010891B2 (en) Semiconductor device
JP2007096008A (en) Package for mounting light emitting element
JP2006261286A (en) Package for containing light emitting element and its manufacturing process