JP2005310935A - Storing package for light-emitting element - Google Patents

Storing package for light-emitting element Download PDF

Info

Publication number
JP2005310935A
JP2005310935A JP2004123762A JP2004123762A JP2005310935A JP 2005310935 A JP2005310935 A JP 2005310935A JP 2004123762 A JP2004123762 A JP 2004123762A JP 2004123762 A JP2004123762 A JP 2004123762A JP 2005310935 A JP2005310935 A JP 2005310935A
Authority
JP
Japan
Prior art keywords
emitting element
light emitting
light
resin
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004123762A
Other languages
Japanese (ja)
Inventor
Yoshikazu Mihara
芳和 三原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal SMI Electronics Device Inc
Original Assignee
Sumitomo Metal SMI Electronics Device Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal SMI Electronics Device Inc filed Critical Sumitomo Metal SMI Electronics Device Inc
Priority to JP2004123762A priority Critical patent/JP2005310935A/en
Publication of JP2005310935A publication Critical patent/JP2005310935A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a storing package for a light-emitting element capable of improving the luminance of the light-emitting element, while forming it at a low cost and with sufficient yield, by using a ceramic substrate having large resistance to heat. <P>SOLUTION: The storing packages 10, 10a for light-emitting elements comprise resin boards 15, 15a having an insertion hole 14, consisting of one or more tapered shape wall surface and jointed with adhering resin on the upper surface of ceramic substrates 13, 13a consisting of a plate; and a cavity 12 composed of the wall surface and the ceramic substrates 13, 13a exposing from the opening of the insertion holes 14, 14a for mounting the light-emitting element 11. The insertion hole 14 has a tapered shape, whose opening diameter becomes smaller, starting from the upper side surface to the underside surface of the resin boards 15, 15a, and the wall surface is made into a reflecting surface of the light-emitting element 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発行ダイオード（Ｌｉｇｈｔ Ｅｍｉｓｓｉｏｎ Ｄｉｏｄｅ：以下、ＬＥＤという。）等の発光素子をセラミック基板上に搭載し収納するための発光素子収納用パッケージに関し、より詳細には、ＬＤＥ等の発光素子の発光効率を向上できる発光素子収納用パッケージに関する。   The present invention relates to a light emitting element storage package for mounting and storing a light emitting element such as a light emitting diode (hereinafter referred to as an LED) on a ceramic substrate, and more particularly to a light emitting element storing package such as an LDE. The present invention relates to a light-emitting element storage package capable of improving light emission efficiency.

従来からＬＥＤ等の発光素子を収容するための発光素子収納用パッケージとしては、樹脂製や、セラミック製の発光素子収納用パッケージが用いられている。ＬＥＤ等の発光素子は、発光素子の光出力を大きくするのに、電流を増加させることで可能であるが、光出力の増加に併せて発光素子自体の温度も上昇する。従来の樹脂製の発光素子収納用パッケージは、その上に搭載される発光素子自体の温度上昇が大きくなることで、樹脂製のパッケージでは耐熱性が十分でなくなり、問題が発生している。そこで、樹脂製の発光素子収納用パッケージには、パッケージの放熱性向上を目的として発光素子を直接搭載できる金属リードフレーム上にモールディングした樹脂製の障壁を設けた構造の発光素子収納用パッケージが開発されている。しかしながら、樹脂製のパッケージは、このパッケージを半田等で実装する時等に更に加熱があるので、耐熱性の問題が完全に解消できていないという問題を抱えている。そこで、最近では、耐熱性の高いアルミナ（Ａｌ２Ｏ３）等からなるセラミック製のものが多く用いられるようになっている。 Conventionally, as a light-emitting element storage package for storing a light-emitting element such as an LED, a resin-made or ceramic light-emitting element storage package has been used. A light emitting element such as an LED can increase the light output of the light emitting element by increasing the current. However, the temperature of the light emitting element itself increases as the light output increases. A conventional resin light emitting element storage package has a problem in that the temperature rise of the light emitting element itself mounted thereon becomes large, and the resin package becomes insufficient in heat resistance. Therefore, a light-emitting element storage package with a resin barrier molded on a metal lead frame on which a light-emitting element can be directly mounted has been developed to improve the heat dissipation of the resin. Has been. However, since the resin package is further heated when the package is mounted with solder or the like, the heat resistance problem cannot be completely solved. Therefore, recently, a ceramic material made of alumina (Al 2 O 3 ) or the like having high heat resistance has been widely used.

図４に示すように、従来のセラミック製の発光素子収納用パッケージ５０は、通常、発光素子５１を収納させるためのキャビティ部５２を、キャビティ部５２の外形の大きさの孔を穿孔した枠体５３となるセラミックグリーンシートと、孔を設けない平板５４となるセラミックグリーンシートを重ね合わせ積層して形成している。また、積層する前のセラミックグリーンシートには、例えば、ボンディングパッド５５や、外部接続端子パッド５６や、それぞれのパターン間を接続させるため等の配線パターンや、ビア等の導体パターンを金属導体ペーストを用いてスクリーン印刷で形成している。そして、複数枚のセラミックグリーンシートを積層した後は、セラミックグリーンシートと導体パターンを同時焼成して発光素子収納用パッケージ５０を形成している。なお、この発光素子収納用パッケージ５０には、キャビティ部５２にＬＥＤ等の発光素子５１が搭載され、発光素子５１と電気的に導通状態とするために、キャビティ部５２の中に設けられているボンディングパッド５５とボンディングワイヤ５７で接続させている。また、この発光素子収納用パッケージ５０の平板５４の他方の主面に設けられる外部接続端子パッド５６は、ボンディングパッド５５と電気的に導通状態となっている。更には、この発光素子収納用パッケージ５０は、通常、キャビティ部５２の内側壁となる枠体５３の内周側面や、平板５４の表面に反射効率を向上させる、例えば、貴金属めっき被膜等を施すことで、キャビティ部５２に搭載される発光素子５１の発光効率を向上させる工夫がなされている。しかしながら、発光素子５１が搭載されるキャビティ部５２の壁面が垂直であるので、発光素子５１からの発光を効率よく反射させることができない問題を抱えている。   As shown in FIG. 4, a conventional ceramic light emitting element housing package 50 usually has a cavity portion 52 for housing a light emitting element 51, and a frame body in which a hole having an outer size of the cavity portion 52 is perforated. A ceramic green sheet 53 and a ceramic green sheet 54 that is not provided with holes are stacked and laminated. In addition, the ceramic green sheets before lamination are made of, for example, bonding pads 55, external connection terminal pads 56, wiring patterns for connecting the respective patterns, and conductor patterns such as vias with metal conductor paste. It is formed by screen printing. And after laminating | stacking several ceramic green sheets, the ceramic green sheet and the conductor pattern are baked simultaneously, and the package 50 for light emitting element accommodation is formed. In the light emitting element storage package 50, a light emitting element 51 such as an LED is mounted in the cavity portion 52, and is provided in the cavity portion 52 in order to make the light emitting element 51 electrically conductive. The bonding pads 55 and the bonding wires 57 are connected. In addition, the external connection terminal pad 56 provided on the other main surface of the flat plate 54 of the light emitting element storage package 50 is electrically connected to the bonding pad 55. Further, the light emitting element storage package 50 is usually provided with a noble metal plating film or the like for improving the reflection efficiency on the inner peripheral side surface of the frame 53 serving as the inner side wall of the cavity portion 52 and the surface of the flat plate 54. Thus, a device for improving the light emission efficiency of the light emitting element 51 mounted in the cavity 52 has been made. However, since the wall surface of the cavity portion 52 on which the light emitting element 51 is mounted is vertical, there is a problem that light emitted from the light emitting element 51 cannot be reflected efficiently.

そこで、樹脂製の発光素子収納用パッケージには、樹脂板に加熱処理し、樹脂原料の分子間結合を完全なものにして耐熱性を向上させた樹脂板を用いるものが提案されている（例えば、特許文献１参照）。セラミック製の発光素子収納用パッケージには、ＬＥＤ素子を囲繞できるキャビティ部の壁面を形成するのに、金属反射板を接合するものが提案されている（例えば、特許文献２参照）。
特開平１０−１３０１４号公報 特開２００３−１９７９７４号公報 Therefore, a resin light emitting element storage package has been proposed that uses a resin plate that is heat-treated to complete the intermolecular bonds of the resin raw material and has improved heat resistance (for example, , See Patent Document 1). A ceramic light emitting element storage package has been proposed in which a metal reflector is bonded to form a wall surface of a cavity that can surround an LED element (see, for example, Patent Document 2).
Japanese Patent Laid-Open No. 10-13014 JP 2003-197974 A

しかしながら、前述したような従来の発光素子収納用パッケージは、次のような問題がある。
（１）樹脂製の発光素子収納用パッケージや、金属リードフレームを発光素子からの発熱の放熱板として用いた樹脂製の発光素子収納用パッケージは、発光素子からの発熱の放熱性が十分ではなく、発光素子の発熱温度が発光素子が載置される部分で樹脂の耐熱性の温度を超える場合がある。また、金属リードフレームを用いた樹脂製の発光素子収納用パッケージは、リードフレームのパッケージ全体に占める面積が大きく、パッケージを小型化にすることができないという問題がある。
（２）耐熱性の高いセラミックグリーンシートを打ち抜いてキャビティ部をテーパ状に形成したとしても、セラミック製の発光素子収納用パッケージは、キャビティ部の壁面を上面に対して正常な角度を持たせて安定して成形することが難しく、歩留まりの低下となっている。
（３）セラミック製のキャビティ部に金属製の反射板を接合する発光素子収納用パッケージは、耐熱性及び発光素子の輝度を向上させることはできるものの、金属製の反射板の加工が容易でなく発光素子収納用パッケージのコストアップとなっている。
本発明は、かかる事情に鑑みてなされたものであって、耐熱性が大きいセラミック基板を用いて歩留まりよく安価に形成され、発光素子の輝度を向上できる発光素子収納用パッケージを提供することを目的とする。 However, the conventional light emitting element storage package as described above has the following problems.
(1) Resin-made light-emitting element storage packages and resin-made light-emitting element storage packages using a metal lead frame as a heat dissipation plate for heat generation from the light-emitting elements are not sufficient in heat dissipation from the light-emitting elements. In some cases, the heat generation temperature of the light emitting element exceeds the heat resistance temperature of the resin at the portion where the light emitting element is mounted. In addition, a resin light emitting element storage package using a metal lead frame has a problem that the area of the lead frame occupies a large area and the package cannot be reduced in size.
(2) Even if the ceramic green sheet with high heat resistance is punched out and the cavity portion is tapered, the ceramic light emitting element storage package has the cavity wall surface at a normal angle with respect to the upper surface. It is difficult to mold stably, resulting in a decrease in yield.
(3) The light emitting element storage package in which the metal reflector is bonded to the ceramic cavity can improve the heat resistance and the brightness of the light emitter, but the metal reflector is not easily processed. The cost of the light emitting element storage package is increased.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light-emitting element storage package that can be formed at a low yield using a ceramic substrate having high heat resistance and can improve the luminance of the light-emitting element. And

前記目的に沿う本発明に係る発光素子収納用パッケージは、平板からなるセラミック基板の上面に１又は複数個のテーパ状の壁面からなる挿通孔を有する樹脂板が接着樹脂で接合され、発光素子を搭載するための挿通孔の開口から露出するセラミック基板と壁面とで形成されるキャビティ部を有する発光素子収納用パッケージであって、挿通孔が樹脂板の下面側より上面側の開口径を大きくするテーパ状からなり、壁面を発光素子の反射面とする。   The light-emitting element storage package according to the present invention that meets the above-described object is formed by bonding a resin plate having an insertion hole made of one or a plurality of tapered wall surfaces to an upper surface of a flat ceramic substrate with an adhesive resin. A light emitting element storage package having a cavity formed by a ceramic substrate exposed from an opening of an insertion hole for mounting and a wall surface, wherein the insertion hole has an opening diameter on an upper surface side larger than a lower surface side of a resin plate It has a tapered shape, and the wall surface is used as a reflecting surface of the light emitting element.

前記目的に沿う本発明に係る他の発光素子収納用パッケージは、セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、キャビティ部にはキャビティ部内に装填されキャビティ部の上端周縁のセラミック基板の上面で接合される発光素子の光を反射するための反射体を有し、しかも、反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の貫通孔の壁面を発光素子の反射面とし、貫通孔の開口径の大きい側の樹脂製筒体端部外周に有するフランジ部でセラミック基板に接着樹脂で接合されている。   Another light-emitting element storage package according to the present invention that meets the above-described object is a light-emitting element storage package having one or a plurality of cavity portions for mounting a light-emitting element on a ceramic substrate. And a reflector for reflecting the light of the light emitting element which is loaded in the part and joined on the upper surface of the ceramic substrate at the upper edge of the cavity part, and the reflector is made of resin having a tapered conical through hole. The wall surface of the through hole of the cylindrical body is used as a reflection surface of the light emitting element, and is joined to the ceramic substrate by an adhesive resin at a flange portion provided on the outer periphery of the end portion of the resin cylindrical body on the side with the larger opening diameter of the through hole.

前記目的に沿う本発明に係る更に他の発光素子収納用パッケージは、セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、セラミック基板にはキャビティ部の上端周縁に段差を有し、キャビティ部にはキャビティ部内に装填され段差で接合される発光素子の光を反射するための反射体を有し、しかも、反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の貫通孔の壁面を発光素子の反射面とし、貫通孔の開口径の大きい側の筒体端部外周に有するフランジ部でセラミック基板の段差に接着樹脂で接合されている。   Still another light-emitting element storage package according to the present invention that meets the above-mentioned object is a light-emitting element storage package having one or a plurality of cavities for mounting a light-emitting element on a ceramic substrate. The cavity has a step at the upper edge, and the cavity has a reflector for reflecting the light of the light-emitting element that is loaded into the cavity and joined by the step, and the reflector has a tapered conical shape. The wall surface of the through-hole of the resin cylinder having a through-hole is used as the reflecting surface of the light emitting element, and the flange portion on the outer periphery of the end of the cylinder on the side with the larger opening diameter of the through-hole is joined to the step of the ceramic substrate with adhesive resin Has been.

ここで、上記の発光素子収納用パッケージ、他の発光素子収納用パッケージ、及び更に他の発光素子収納用パッケージは、反射面にめっき被膜が施されているのがよい。   Here, the light-emitting element storage package, the other light-emitting element storage package, and the other light-emitting element storage package are preferably provided with a plating film on the reflection surface.

請求項１及びこれに従属する請求項４記載の発光素子収納用パッケージは、平板からなるセラミック基板の上面に１又は複数個のテーパ状の壁面からなる挿通孔を有する樹脂板が接着樹脂で接合され、発光素子を搭載するための挿通孔の開口から露出するセラミック基板と壁面とで形成されるキャビティ部を有する発光素子収納用パッケージであって、挿通孔が樹脂板の下面側より上面側の開口径を大きくするテーパ状からなり、壁面を発光素子の反射面とするので、発光素子が載置される部分がセラミック製で耐熱性が高く、発光素子を囲繞して発光素子の光を反射する反射板となる部分が樹脂板で安価であり、目的に応じた形状のものが容易に作製でき、セラミック基板にキャビティ部用の孔を穿孔する必要がなくて容易に歩留まりがよく形成され、小型で発光素子の光出力を高くすることができる。また、１枚のセラミック基板と樹脂板に複数個のキャビティ部を形成することもできるので、小型の形態で光出力を上げることができる。   The light-emitting element storage package according to claim 1 and claim 4 dependent thereon is a resin plate having an insertion hole made of one or a plurality of tapered wall surfaces bonded to the upper surface of a ceramic substrate made of a flat plate with an adhesive resin. A light-emitting element storage package having a cavity formed by a ceramic substrate and a wall surface exposed from an opening of an insertion hole for mounting the light-emitting element, the insertion hole being located on the upper surface side from the lower surface side of the resin plate It has a tapered shape that increases the aperture diameter, and the wall surface is used as the reflecting surface of the light emitting element, so the part where the light emitting element is placed is made of ceramic and has high heat resistance, and surrounds the light emitting element and reflects the light from the light emitting element. The part that becomes the reflecting plate is inexpensive with a resin plate, and it can be easily manufactured according to the purpose, and it is not necessary to drill holes for the cavity part in the ceramic substrate, so the yield is easy Is formed, it is possible to increase the light output of the compact and light-emitting element. In addition, since a plurality of cavities can be formed in one ceramic substrate and resin plate, the light output can be increased in a small form.

請求項２及びこれに従属する請求項４記載の発光素子収納用パッケージは、セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、キャビティ部にはキャビティ部内に装填されキャビティ部の上端周縁のセラミック基板の上面で接合される発光素子の光を反射するための反射体を有し、しかも、反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の貫通孔の壁面を発光素子の反射面とし、貫通孔の開口径の大きい側の樹脂製筒体端部外周に有するフランジ部でセラミック基板に接着樹脂で接合されているので、セラミック製のキャビティ部内に安価な樹脂製筒状の反射体が容易に取り付けられ、発光素子が載置される部分がセラミック製で耐熱性が高く、キャビティ部の形成が従来の穿孔方式で形成できて歩留まりがよく、小型で発光素子の光出力を高くできる。また、１枚のセラミック基板に複数個のキャビティ部を形成することもでき、小型で光出力を上げることができる。   The light emitting element storage package according to claim 2 and claim 4 dependent thereon is a light emitting element storage package having one or a plurality of cavity parts for mounting the light emitting elements on the ceramic substrate, Has a reflector for reflecting the light of the light emitting element loaded in the cavity portion and bonded to the upper surface of the ceramic substrate at the upper peripheral edge of the cavity portion, and the reflector has a tapered conical through hole. Since the wall surface of the through hole of the resin cylinder has a reflecting surface of the light emitting element and is joined to the ceramic substrate by an adhesive resin at the flange part on the outer periphery of the resin cylinder end on the side with the larger opening diameter of the through hole An inexpensive resin cylindrical reflector is easily mounted in the ceramic cavity, and the part on which the light emitting element is placed is made of ceramic and has high heat resistance. Growth is good yield can be formed in a conventional puncturing scheme can increase the light output of the light emitting element is small. In addition, a plurality of cavities can be formed on one ceramic substrate, and the light output can be increased in a small size.

請求項３及びこれに従属する請求項４記載の発光素子収納用パッケージは、セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、セラミック基板にはキャビティ部の上端周縁に段差を有し、キャビティ部にはキャビティ部内に装填され段差で接合される発光素子の光を反射するための反射体を有し、しかも、反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の貫通孔の壁面を発光素子の反射面とし、貫通孔の開口径の大きい側の筒体端部外周に有するフランジ部でセラミック基板の段差に接着樹脂で接合されているので、セラミック基板に形成されたキャビティ部の壁面形状と関係なくセラミック製のキャビティ部内に反射体が容易に取り付けられて設けられ、発光素子が載置される部分がセラミック製で耐熱性が高く、キャビティ部の形成が従来の穿孔方式で形成できて歩留まりがよく、小型でパッケージの高さが低く、発光素子の光出力を高くすることができる。また、１枚のセラミック基板に複数個のキャビティ部を形成することもでき、小型でパッケージの高さを低くできる形態で光出力を上げることができる。   The light emitting element storage package according to claim 3 and claim 4 dependent thereon is a light emitting element storage package having one or a plurality of cavities for mounting a light emitting element on a ceramic substrate, Has a step at the periphery of the upper end of the cavity portion, the cavity portion has a reflector for reflecting the light of the light emitting element that is loaded into the cavity portion and joined by the step, and the reflector is tapered. The resin wall of the resin cylinder having a conical through-hole is used as a reflective surface of the light-emitting element, and the flange resin is provided on the outer periphery of the end of the cylinder on the larger opening diameter side of the through-hole. The reflector is easily mounted in the ceramic cavity regardless of the shape of the wall surface of the cavity formed on the ceramic substrate. The part on which the child is placed is made of ceramic and has high heat resistance, the cavity can be formed by the conventional perforation method, the yield is good, the size is small, the package height is low, and the light output of the light emitting element is increased. be able to. Also, a plurality of cavities can be formed on a single ceramic substrate, and the light output can be increased in a form that is small and can reduce the height of the package.

特に、請求項４記載の発光素子収納用パッケージは、反射面にめっき被膜が施されているので、発光素子から発せられる光の明るさを向上させることができる。   In particular, the light emitting element storage package according to claim 4 can improve the brightness of light emitted from the light emitting element because the reflecting surface is provided with a plating film.

続いて、添付した図面を参照しつつ、本発明を具体化した実施するための最良の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの断面図、図２（Ａ）、（Ｂ）はそれぞれ同他の発光素子収納用パッケージの断面図、図３（Ａ）、（Ｂ）はそれぞれ同更に他の発光素子収納用パッケージの断面図である。 Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are cross-sectional views of a light-emitting element storage package according to an embodiment of the present invention, respectively, and FIGS. 2A and 2B are for storing other light-emitting elements, respectively. Cross-sectional views of the package and FIGS. 3A and 3B are cross-sectional views of other light-emitting element storage packages.

図１（Ａ）、（Ｂ）を参照しながら、本発明の一実施の形態に係る発光素子収納用パッケージ１０、１０ａを説明する。
図１（Ａ）に示すように、発光素子収納用パッケージ１０は、平面視して、矩形状や、多角形や、円形等からなり、中心部に発光素子１１を搭載するための１つのキャビティ部１２を有している。この発光素子収納用パッケージ１０には、アルミナや、低温焼成セラミックや、窒化アルミニウム等からなる１又は複数枚のセラミックグリーンシートを積層し焼成して形成した平板のセラミック基板１３が用いられている。また、セラミック基板１３の上面には、テーパ状の壁面からなる挿通孔１４を設けた耐熱性のある樹脂、例えば、ポリイミドや、エポキシや、アクリル等の樹脂と、セラミックと熱膨張係数を近似させるためにセラミック粉末とを混合させたモールド樹脂からなる樹脂板１５が耐熱性のある、例えば、ポリイミド接着樹脂等の接着樹脂で接合されている。そして、発光素子収納用パッケージ１０は、樹脂板１５の挿通孔１４の開口から露出するセラミック基板１３と、樹脂板１５の挿通孔１４のテーパ状の壁面とでキャビティ部１２を形成している。 With reference to FIGS. 1A and 1B, a light emitting element storage package 10, 10a according to an embodiment of the present invention will be described.
As shown in FIG. 1A, the light emitting element storage package 10 has a rectangular shape, a polygonal shape, a circular shape, or the like in plan view, and has one cavity for mounting the light emitting element 11 in the center. Part 12 is provided. The light emitting element storage package 10 uses a flat ceramic substrate 13 formed by laminating and firing one or more ceramic green sheets made of alumina, low-temperature fired ceramic, aluminum nitride, or the like. Further, a heat-resistant resin provided with an insertion hole 14 formed of a tapered wall surface on the upper surface of the ceramic substrate 13, for example, a resin such as polyimide, epoxy, or acrylic, and a thermal expansion coefficient are approximated to those of ceramic. Therefore, a resin plate 15 made of a mold resin mixed with ceramic powder is bonded with a heat resistant adhesive resin such as a polyimide adhesive resin. In the light emitting element storage package 10, the cavity portion 12 is formed by the ceramic substrate 13 exposed from the opening of the insertion hole 14 of the resin plate 15 and the tapered wall surface of the insertion hole 14 of the resin plate 15.

樹脂板１５の挿通孔１４は、樹脂板１５の上面側の開口径が樹脂板１５の下面側の開口径より大きいテーパ状に形成されている。そして、挿通孔１４のテーパ状の壁面は、発光素子１１から発する光を反射させるための反射面として用いられている。テーパ状の壁面は、外側に開いているので、発光素子１１から発する光を効率よく反射させて光出力を向上させることができる。なお、樹脂板１５の挿通孔１４のテーパ状の壁面は、稜線が直線状に限定されるものではなく、例えば、椀形の形状のような曲線状のものであってもよい。   The insertion hole 14 of the resin plate 15 is formed in a taper shape in which the opening diameter on the upper surface side of the resin plate 15 is larger than the opening diameter on the lower surface side of the resin plate 15. The tapered wall surface of the insertion hole 14 is used as a reflection surface for reflecting light emitted from the light emitting element 11. Since the tapered wall surface is opened to the outside, the light output from the light emitting element 11 can be efficiently reflected to improve the light output. In addition, the tapered wall surface of the insertion hole 14 of the resin plate 15 is not limited to a linear ridge line, and may be a curved shape such as a bowl shape.

図１（Ｂ）に示すように、発光素子収納用パッケージ１０ａは、平板からなる１つのセラミック基板１３ａに複数個のテーパ状の壁面からなる挿通孔１４を有する樹脂板１５ａが接合されている。そして、発光素子収納用パッケージ１０ａは、挿通孔１４の開口から露出するセラミック基板１３ａと樹脂板１５ａのテーパ状の壁面とで形成されるそれぞれのキャビティ部１２に発光素子１１（図示せず、図１（Ａ）参照）が搭載できるようになっている。それぞれのキャビティ部１２は、樹脂板１５ａの挿通孔１４が下面側より上面側の開口径を大きくするテーパ状となっており、このテーパ状の壁面を発光素子１１から発する光の反射面としている。この発光素子収納用パッケージ１０ａは、平板からなるセラミック基板１３ａに複数個の挿通孔１４を有する樹脂板１５ａを接合することで形成できるので、小型でより明るい発光素子モジュールが実現可能となるパッケージを容易に提供できる。   As shown in FIG. 1B, in the light emitting element storage package 10a, a resin plate 15a having a plurality of insertion holes 14 each having a tapered wall surface is joined to one ceramic substrate 13a made of a flat plate. The light emitting element storage package 10a has light emitting elements 11 (not shown, not shown) in the respective cavity portions 12 formed by the ceramic substrate 13a exposed from the opening of the insertion hole 14 and the tapered wall surface of the resin plate 15a. 1 (A)) can be mounted. In each cavity portion 12, the insertion hole 14 of the resin plate 15 a has a tapered shape in which the opening diameter on the upper surface side is larger than the lower surface side, and the tapered wall surface is a reflection surface for light emitted from the light emitting element 11. . The light emitting element storage package 10a can be formed by bonding a resin plate 15a having a plurality of insertion holes 14 to a flat ceramic substrate 13a. Therefore, a package that can realize a lighter element module that is smaller and brighter can be realized. Can be easily provided.

なお、発光素子収納用パッケージ１０、１０ａには、キャビティ部１２の底面に発光素子１１（図１（Ｂ）では図示せず）が搭載され、発光素子１１とボンディングワイヤ１６で接続し、外部から電気的に導通させるためにセラミック基板１３、１３ａに導体パターン１７が形成されている。また、発光素子収納用パッケージ１０、１０ａには、発光素子１１をキャビティ部１２に搭載し、キャビティ部１２内に蛍光体の樹脂等が充填された後、発光素子１１を気密に収納するために、樹脂板１５、１５ａの挿通孔１４の上面側開口部の周縁上面にレンズ１８（図１（Ｂ）では図示せず）を樹脂接着剤等を用いて接合している。   In the light emitting element storage packages 10 and 10a, a light emitting element 11 (not shown in FIG. 1B) is mounted on the bottom surface of the cavity portion 12, and the light emitting element 11 is connected to the bonding wire 16 from the outside. Conductive patterns 17 are formed on the ceramic substrates 13 and 13a for electrical conduction. Further, in the light emitting element storage package 10, 10a, the light emitting element 11 is mounted in the cavity portion 12, and after the cavity portion 12 is filled with a phosphor resin or the like, the light emitting element 11 is stored in an airtight manner. A lens 18 (not shown in FIG. 1B) is bonded to the upper surface of the peripheral edge of the opening on the upper surface side of the insertion hole 14 of the resin plates 15 and 15a using a resin adhesive or the like.

ここで、セラミックの一例であるアルミナからなるセラミック基板１３、１３ａの作製方法を説明する。先ず、セラミックグリーンシートは、アルミナ粉末にマグネシア、シリカ、カルシア等の焼結助剤を適当量加えた粉末に、ジオクチルフタレート等の可塑剤と、アクリル樹脂等のバインダー、及び、トルエン、キシレン、アルコール類等の溶剤が加えられ、十分に混練した後、脱泡して粘度２０００〜４００００ｃｐｓのスラリーが作製される。次いで、スラリーは、ドクターブレード法等によって、例えば、厚み０．２５ｍｍのロール状のシートに形成され、適当なサイズにカットしてセラミックグリーンシートが作製される。   Here, a manufacturing method of the ceramic substrates 13 and 13a made of alumina which is an example of ceramic will be described. First, a ceramic green sheet is a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to alumina powder, a plasticizer such as dioctyl phthalate, a binder such as acrylic resin, and toluene, xylene, alcohol. A solvent such as the like is added and sufficiently kneaded, and then defoamed to produce a slurry having a viscosity of 2000 to 40000 cps. Next, the slurry is formed into a roll sheet having a thickness of, for example, 0.25 mm by a doctor blade method or the like, and cut into an appropriate size to produce a ceramic green sheet.

次に、このセラミックグリーンシートには、打ち抜き金型やパンチングマシーン等を用いて、それぞれの所定位置に上層と下層との間の導通を形成するためのビア１９用の孔が穿設される。更に、セラミックグリーンシートには、タングステン等からなる金属導体ペーストを用いてスクリーン印刷でビア１９用の孔に充填したり、発光素子１１と電気的に導通状態とするために表面に導体パターン１７が形成される。これらの印刷が完了したセラミックグリーンシートは、複数枚が重ね合わされ積層体が形成される。そして、次に、タングステン等からなる金属導体と、セラミックグリーンシートとを還元性雰囲気の焼成炉で同時焼成してセラミック基板１３、１３ａが作製されている。   Next, a hole for via 19 is formed in the ceramic green sheet to form conduction between the upper layer and the lower layer at a predetermined position using a punching die, a punching machine, or the like. Further, the ceramic green sheet is filled with a conductor pattern 17 on the surface in order to fill a hole for the via 19 by screen printing using a metal conductor paste made of tungsten or the like, or to be electrically connected to the light emitting element 11. It is formed. A plurality of ceramic green sheets on which printing has been completed are stacked to form a laminate. Next, ceramic substrates 13 and 13a are manufactured by simultaneously firing a metal conductor made of tungsten or the like and a ceramic green sheet in a firing furnace in a reducing atmosphere.

次いで、図２（Ａ）、（Ｂ）を参照しながら、本発明の一実施の形態に係る他の発光素子収納用パッケージ１０ｂ、１０ｃを説明する。
図２（Ａ）に示すように、発光素子収納用パッケージ１０ｂは、平面視して、矩形状や、多角形や、円形等からなり、中心部に発光素子１１を搭載するためのキャビティ部１２を１つ有している。この発光素子収納用パッケージ１０ｂには、キャビティ部１２に発光素子１１を搭載するためにアルミナや、低温焼成セラミックや、窒化アルミニウム等からなるセラミック基板１３ｂが用いられている。そして、キャビティ部１２は、セラミック基板１３ｂの焼成前の複数枚のセラミックグリーンシートの必要セラミックグリーンシートの必要部位にキャビティ部１２用の孔をそれぞれのセラミックグリーンシートの穿孔面が垂直になるように穿設し、積層し、焼成することで形成されている。なお、キャビティ部１２用の孔は、複数枚のセラミックグリーンシートが同一の大きさであってもよく、上層に行くにつれて大きい孔からなる階段状であってもよい。 Next, with reference to FIGS. 2A and 2B, other light emitting element storage packages 10b and 10c according to an embodiment of the present invention will be described.
As shown in FIG. 2A, the light-emitting element storage package 10b has a rectangular shape, a polygonal shape, a circular shape, or the like in plan view, and has a cavity portion 12 for mounting the light-emitting element 11 at the center. One. In the light emitting element storage package 10b, a ceramic substrate 13b made of alumina, low-temperature fired ceramic, aluminum nitride or the like is used for mounting the light emitting element 11 in the cavity portion 12. The cavity portion 12 has holes for the cavity portion 12 in the necessary portions of the ceramic green sheets of the plurality of ceramic green sheets before firing the ceramic substrate 13b so that the perforated surface of each ceramic green sheet is vertical. It is formed by drilling, stacking, and firing. Note that the holes for the cavity portion 12 may have the same size for a plurality of ceramic green sheets, or may have a stepped shape with larger holes as they go to the upper layer.

キャビティ部１２には、キャビティ部１２内に装填され、キャビティ部１２の上端周縁のセラミック基板１３ｂの上面で接着樹脂で接合される反射体２０を有している。この反射体２０は、テーパ状の円錐形状の貫通孔２１を有し、例えば、ポリイミド、エポキシ、あるいはアクリル等の樹脂と、セラミックと熱膨張係数を近似させるためにセラミック粉末とを混合させた耐熱性のある樹脂材からなる筒体の貫通孔２１の壁面を発光素子１１の発する光の反射面としている。そして、この反射体２０は、貫通孔２１の開口径の大きい側の端部外周にフランジ部２２を備え、このフランジ部２２でセラミック基板１３ｂと耐熱性のある、例えば、ポリイミド等からなる接着樹脂で接合されている。この反射体２０は、テーパ状の円錐形状の貫通孔２１の壁面を発光素子１１の発する光の反射面とし、貫通孔２１の開口径の大きい側を外側にしているので、発光素子１１から発する光を効率よく反射させて光出力を向上させることができる。なお、反射体２０の貫通孔２１の壁面のテーパ状の円錐形状は、稜線が直線状に限定されるものではなく、例えば、椀形の形状のような曲線状のものであってもよい。なお、樹脂材からなる反射体２０は、樹脂の射出成形加工等によって、容易に複雑な形状が形成できるので、目的に応じた反射角度を持つ反射体２０を容易に得ることができる。   The cavity portion 12 includes a reflector 20 that is loaded in the cavity portion 12 and bonded to the upper surface of the ceramic substrate 13b at the upper edge of the cavity portion 12 with an adhesive resin. The reflector 20 has a tapered conical through-hole 21 and is, for example, a heat-resistant material in which a resin such as polyimide, epoxy, or acrylic is mixed with a ceramic powder to approximate a thermal expansion coefficient. The wall surface of the through-hole 21 of the cylindrical body made of a curable resin material is used as a reflection surface for light emitted from the light emitting element 11. The reflector 20 is provided with a flange portion 22 on the outer periphery of the end portion of the through-hole 21 on the large opening diameter side, and the flange portion 22 has heat resistance with the ceramic substrate 13b, for example, an adhesive resin made of polyimide or the like. It is joined with. Since this reflector 20 has a tapered conical through-hole 21 as a reflecting surface for light emitted from the light-emitting element 11 and the through-hole 21 has a larger opening diameter on the outside, the light-emitting element 11 emits light. Light can be efficiently reflected to improve light output. Note that the tapered conical shape of the wall surface of the through hole 21 of the reflector 20 is not limited to a linear ridgeline, and may be a curved shape such as a bowl shape. Since the reflector 20 made of a resin material can be easily formed in a complicated shape by resin injection molding or the like, the reflector 20 having a reflection angle according to the purpose can be easily obtained.

図２（Ｂ）に示すように、発光素子収納用パッケージ１０ｃは、１つのセラミック基板１３ｃに複数個のキャビティ部１２を有し、それぞれのキャビティ部１２に発光素子１１（図示せず、図２（Ａ）参照）が搭載できるようになっている。それぞれのキャビティ部１２には、それぞれのキャビティ部１２内に装填され、それぞれのキャビティ部１２の上端周縁のセラミック基板１３ｃの上面で接着樹脂で接合されるそれぞれ反射体２０を有している。これらの反射体２０は、発光素子収納用パッケージ１０ｂの場合と同様にテーパ状の円錐形状の貫通孔２１を有する耐熱性のある樹脂材からなる筒体の貫通孔２１の壁面を発光素子１１の発する光の反射面としている。そして、これらの反射体２０は、貫通孔２１の開口径の大きい側の端部外周にフランジ部２２を備え、フランジ部２２でセラミック基板１３ｃと接合されている。発光素子収納用パッケージ１０ｃは、１つのセラミック基板１３ｃに複数個のキャビティ部１２を有し、それぞれのキャビティ部１２に発光素子１１が搭載されるので、小型でより明るい発光素子モジュールが実現可能となる。   As shown in FIG. 2B, the light emitting element storage package 10c has a plurality of cavity portions 12 in one ceramic substrate 13c, and the light emitting elements 11 (not shown in FIG. (See (A)) can be mounted. Each cavity portion 12 has a reflector 20 that is loaded in each cavity portion 12 and bonded to the upper surface of the ceramic substrate 13c at the upper edge of each cavity portion 12 with an adhesive resin. Similar to the case of the light emitting element storage package 10 b, these reflectors 20 are formed on the wall surface of the cylindrical through hole 21 made of a heat-resistant resin material having a tapered conical through hole 21 of the light emitting element 11. It is a reflective surface for the emitted light. These reflectors 20 are provided with a flange portion 22 on the outer periphery of the end portion of the through hole 21 on the larger opening diameter side, and are joined to the ceramic substrate 13 c by the flange portion 22. The light emitting element storage package 10c has a plurality of cavities 12 on one ceramic substrate 13c, and the light emitting elements 11 are mounted in the respective cavities 12, so that a small and brighter light emitting element module can be realized. Become.

なお、発光素子収納用パッケージ１０ｂ、１０ｃには、前記の発光素子収納用パッケージ１０、１０ａの場合と同様に、キャビティ部１２の底面に発光素子１１（図２（Ｂ）では図示せず）が搭載され、発光素子１１とボンディングワイヤ１６で接続し、外部から電気的に導通させるためにセラミック基板１３ｂ、１３ｃに導体パターン１７や、ビア１９が形成されている。また、発光素子収納用パッケージ１０ｂ、１０ｃには、発光素子１１をキャビティ部１２に搭載し、キャビティ部１２内に蛍光体の樹脂等が充填された後、発光素子１１を気密に収納するために、反射体２０の開口部のフランジ部２２の上面にレンズ１８（図２（Ｂ）では図示せず）を樹脂接着剤等を用いて接合している。   The light emitting element storage packages 10b and 10c have a light emitting element 11 (not shown in FIG. 2B) on the bottom surface of the cavity portion 12 as in the case of the light emitting element storage packages 10 and 10a. A conductive pattern 17 and a via 19 are formed on the ceramic substrates 13b and 13c to be mounted, connected to the light emitting element 11 by a bonding wire 16, and electrically connected from the outside. In the light emitting element storage packages 10b and 10c, the light emitting element 11 is mounted in the cavity portion 12, and after the cavity portion 12 is filled with a phosphor resin or the like, the light emitting element 11 is stored in an airtight manner. The lens 18 (not shown in FIG. 2B) is bonded to the upper surface of the flange portion 22 of the opening of the reflector 20 using a resin adhesive or the like.

次いで、図３（Ａ）、（Ｂ）を参照しながら、本発明の一実施の形態に係る更に他の発光素子収納用パッケージ１０ｄ、１０ｅを説明する。
図３（Ａ）に示すように、発光素子収納用パッケージ１０ｄは、前記の発光素子収納用パッケージ１０ｂと同様に、発光素子１１を搭載するためのキャビティ部１２を１つ有している。この発光素子収納用パッケージ１０ｄには、キャビティ部１２に発光素子１１を搭載するためにアルミナや、低温焼成セラミックや、窒化アルミニウム等からなるセラミック基板１３ｄが用いられている。このセラミック基板１３ｄには、キャビティ部１２の上端周縁に段差２３を有している。キャビティ部１２には、キャビティ部１２内に装填され、段差２３で接着樹脂で接合される反射体２０を有している。この反射体２０は、前記の発光素子収納用パッケージ１０ｂの場合と同様に、テーパ状の円錐形状を有するセラミックと熱膨張係数を近似させた耐熱性のある樹脂材からなる筒体の貫通孔２１の壁面を発光素子１１の発する光の反射面としている。そして、この反射体２０は、貫通孔２１の開口径の大きい側の端部外周にフランジ部２２を備え、このフランジ部２２でセラミック基板１３ｄの段差２３と接合されている。 Next, still another light emitting element storage package 10d, 10e according to an embodiment of the present invention will be described with reference to FIGS. 3 (A) and 3 (B).
As shown in FIG. 3A, the light-emitting element storage package 10d has one cavity portion 12 for mounting the light-emitting element 11 in the same manner as the light-emitting element storage package 10b. In the light emitting element storage package 10d, a ceramic substrate 13d made of alumina, low-temperature fired ceramic, aluminum nitride, or the like is used for mounting the light emitting element 11 in the cavity portion 12. The ceramic substrate 13 d has a step 23 on the upper edge of the cavity portion 12. The cavity portion 12 has a reflector 20 that is loaded in the cavity portion 12 and joined with an adhesive resin at a step 23. As in the case of the light emitting element storage package 10b, the reflector 20 has a cylindrical through hole 21 made of a heat-resistant resin material having a thermal expansion coefficient approximated to a ceramic having a tapered conical shape. Is used as a reflection surface of light emitted from the light emitting element 11. The reflector 20 includes a flange portion 22 on the outer periphery of the end portion of the through-hole 21 on the larger opening diameter side, and is joined to the step 23 of the ceramic substrate 13d by the flange portion 22.

図３（Ｂ）に示すように、発光素子収納用パッケージ１０ｅは、１つのセラミック基板１３ｅに複数個のキャビティ部１２を有し、それぞれのキャビティ部１２に発光素子１１（図示せず、図３（Ａ）参照）が搭載できるようになっている。それぞれのキャビティ部１２には、それぞれのキャビティ部１２内に装填され、セラミック基板１３ｅのそれぞれの段差２３で接着樹脂で接合されるそれぞれ反射体２０を有している。これらの反射体２０は、発光素子収納用パッケージ１０ｄの場合と同様に、テーパ状の円錐形状を有する耐熱性の樹脂材からなる筒体の貫通孔２１の壁面を発光素子１１の発する光の反射面としている。そして、これらの反射体２０は、貫通孔２１の開口径の大きい側の端部外周にフランジ部２２を備え、フランジ部２２でセラミック基板１３ｅと接合されている。   As shown in FIG. 3B, the light emitting element storage package 10e has a plurality of cavity portions 12 in one ceramic substrate 13e, and the light emitting elements 11 (not shown in FIG. (See (A)) can be mounted. Each cavity part 12 has a reflector 20 that is loaded in each cavity part 12 and joined with an adhesive resin at each step 23 of the ceramic substrate 13e. As in the case of the light emitting element storage package 10d, these reflectors 20 reflect light emitted from the light emitting element 11 through the wall surface of the cylindrical through hole 21 made of a heat-resistant resin material having a tapered conical shape. It is a surface. These reflectors 20 are provided with a flange portion 22 on the outer periphery of the end portion of the through hole 21 on the large opening diameter side, and are joined to the ceramic substrate 13e by the flange portion 22.

なお、発光素子収納用パッケージ１０ｄ、１０ｅには、前記の発光素子収納用パッケージ１０、１０ａ、１０ｃ、１０ｄの場合と同様に、キャビティ部１２の底面に発光素子１１（図３（Ｂ）では図示せず）が搭載され、発光素子１１とボンディングワイヤ１６で接続し、外部から電気的に導通させるためにセラミック基板１３ｄ、１３ｅに導体パターン１７や、ビア１９が形成されている。また、発光素子収納用パッケージ１０ｄ、１０ｅには、発光素子１１をキャビティ部１２に搭載し、キャビティ部１２内に蛍光体の樹脂等が充填された後、発光素子１１を気密に収納するために、反射体２０の開口部のフランジ部２２の上面にレンズ１８（図３（Ｂ）では図示せず）を樹脂接着剤を用いて接合している。   In the light emitting element storage packages 10d and 10e, the light emitting element 11 (FIG. 3B) is formed on the bottom surface of the cavity portion 12 as in the case of the light emitting element storage packages 10, 10a, 10c, and 10d. A conductor pattern 17 and a via 19 are formed on the ceramic substrates 13d and 13e in order to connect the light emitting element 11 with the bonding wire 16 and to be electrically connected from the outside. In the light emitting element storage packages 10d and 10e, the light emitting element 11 is mounted in the cavity portion 12, and after the cavity portion 12 is filled with a phosphor resin or the like, the light emitting element 11 is stored in an airtight manner. The lens 18 (not shown in FIG. 3B) is bonded to the upper surface of the flange portion 22 of the opening of the reflector 20 using a resin adhesive.

前記の発光素子収納用パッケージ１０、１０ａ、１０ｂ、１０ｃ、１０ｄ、１０ｅには、樹脂板１５、１５ａの反射面や、樹脂材からなる反射体２０の反射面に、発光素子１１から発せられる光を反射させるための、例えば、無電解めっき方法によるＮｉめっき被膜を形成し、更に電解めっき方法でＡｇめっき被膜や、無電解めっき方法によるＡｌめっき被膜等によって形成されるめっき被膜が施されているのがよい。このめっき被膜によって、発光素子１１から発せられる光の明るさを向上させることができる。   In the light emitting element storage packages 10, 10a, 10b, 10c, 10d, and 10e, the light emitted from the light emitting element 11 on the reflecting surfaces of the resin plates 15 and 15a and the reflecting surface of the reflector 20 made of a resin material. For example, an Ni plating film is formed by an electroless plating method, and a plating film formed by an Ag plating film or an Al plating film by an electroless plating method is applied. It is good. With this plating film, the brightness of light emitted from the light emitting element 11 can be improved.

なお、前記の発光素子収納用パッケージ１０ａ、１０ｃ、１０ｅのような１枚のセラミック基板１３ａ、１３ｃ、１３ｅに複数個のキャビティ部１２を有する場合には、セラミック基板１３ａ、１３ｃ、１３ｅに発光素子１１を駆動させるための駆動用半導体素子が、例えば、セラミック基板１３ａ、１３ｃ、１３ｅの裏面側に搭載でき、この駆動用半導体素子を作動させるための駆動回路用の配線パターンが形成されていると、複数個の発光素子１１の発光形態がコントロールできるので、例えば、明るさを無段階的に調整できるようになる。   In the case where the ceramic substrates 13a, 13c, and 13e have a plurality of cavity portions 12 such as the light-emitting element storage packages 10a, 10c, and 10e, the ceramic substrates 13a, 13c, and 13e have light emitting elements. For example, a driving semiconductor element for driving 11 can be mounted on the back side of the ceramic substrates 13a, 13c, and 13e, and a wiring pattern for a driving circuit for operating the driving semiconductor element is formed. Since the light emission form of the plurality of light emitting elements 11 can be controlled, for example, the brightness can be adjusted steplessly.

本発明の発光素子収納用パッケージは、ＬＥＤ等の発光素子を搭載させて照明や、ディスプレイ等に用いることができる。   The light emitting element storage package of the present invention can be used for illumination, a display, or the like by mounting a light emitting element such as an LED.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの断面図である。(A), (B) is sectional drawing of the light emitting element storage package which concerns on one embodiment of this invention, respectively. （Ａ）、（Ｂ）はそれぞれ同他の発光素子収納用パッケージの断面図である。(A), (B) is sectional drawing of the other light emitting element accommodation package, respectively. （Ａ）、（Ｂ）はそれぞれ同更に他の発光素子収納用パッケージの断面図である。(A), (B) is sectional drawing of another light emitting element accommodation package, respectively. 従来の発光素子収納用パッケージの断面図である。It is sectional drawing of the conventional package for light emitting element accommodation.

符号の説明Explanation of symbols

１０、１０ａ、１０ｂ、１０ｃ、１０ｄ、１０ｅ：発光素子収納用パッケージ、１１：発光素子、１２：キャビティ部、１３、１３ａ、１３ｂ、１３ｃ、１３ｄ、１３ｅ：セラミック基板、１４：挿通孔、１５、１５ａ：樹脂板、１６：ボンディングワイヤ、１７：導体パターン、１８：レンズ、１９：ビア、２０：反射体、２１：貫通孔、２２：フランジ部、２３：段差   10, 10a, 10b, 10c, 10d, 10e: Light emitting element storage package, 11: Light emitting element, 12: Cavity, 13, 13a, 13b, 13c, 13d, 13e: Ceramic substrate, 14: Insertion hole, 15, 15a: resin plate, 16: bonding wire, 17: conductor pattern, 18: lens, 19: via, 20: reflector, 21: through hole, 22: flange portion, 23: step

Claims (4)

平板からなるセラミック基板の上面に１又は複数個のテーパ状の壁面からなる挿通孔を有する樹脂板が接着樹脂で接合され、発光素子を搭載するための前記挿通孔の開口から露出する前記セラミック基板と前記壁面とで形成されるキャビティ部を有する発光素子収納用パッケージであって、
前記挿通孔が前記樹脂板の下面側より上面側の開口径を大きくする前記テーパ状からなり、前記壁面を前記発光素子の反射面とすることを特徴とする発光素子収納用パッケージ。 The ceramic substrate exposed from the opening of the insertion hole for mounting the light emitting element, wherein a resin plate having an insertion hole made of one or a plurality of tapered wall surfaces is bonded to the upper surface of the ceramic substrate made of a flat plate with an adhesive resin And a light emitting element storage package having a cavity formed by the wall surface,
The light-emitting element storage package, wherein the insertion hole has a tapered shape in which an opening diameter on an upper surface side is larger than a lower surface side of the resin plate, and the wall surface is a reflection surface of the light-emitting element. セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、
前記キャビティ部には該キャビティ部内に装填され該キャビティ部の上端周縁の前記セラミック基板の上面で接合される前記発光素子の光を反射するための反射体を有し、しかも、該反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の該貫通孔の壁面を前記発光素子の反射面とし、前記貫通孔の開口径の大きい側の前記樹脂製筒体端部外周に有するフランジ部で前記セラミック基板に接着樹脂で接合されていることを特徴とする発光素子収納用パッケージ。 A light emitting element storage package having one or a plurality of cavities for mounting a light emitting element on a ceramic substrate,
The cavity part has a reflector for reflecting the light of the light emitting element that is loaded in the cavity part and is bonded to the upper surface of the ceramic substrate at the upper edge of the cavity part, and the reflector is tapered. A flange portion having a wall surface of the resin cylindrical body having a conical through-hole as a reflection surface of the light-emitting element and provided on an outer periphery of the end portion of the resin cylindrical body on the larger opening diameter side of the through-hole A package for housing a light-emitting element, wherein the package is bonded to the ceramic substrate with an adhesive resin. セラミック基板に発光素子を搭載するための１又は複数個のキャビティ部を有する発光素子収納用パッケージであって、
前記セラミック基板には前記キャビティ部の上端周縁に段差を有し、前記キャビティ部には該キャビティ部内に装填され前記段差で接合される前記発光素子の光を反射するための反射体を有し、しかも、該反射体はテーパ状の円錐形状の貫通孔を有する樹脂製筒体の該貫通孔の壁面を前記発光素子の反射面とし、前記貫通孔の開口径の大きい側の前記筒体端部外周に有するフランジ部で前記セラミック基板の前記段差に接着樹脂で接合されていることを特徴とする発光素子収納用パッケージ。 A light emitting element storage package having one or a plurality of cavities for mounting a light emitting element on a ceramic substrate,
The ceramic substrate has a step at the periphery of the upper end of the cavity portion, and the cavity portion has a reflector for reflecting the light of the light emitting element that is loaded into the cavity portion and joined at the step. Moreover, the reflector has a wall surface of the through hole of the resin cylinder having a tapered conical through hole as a reflection surface of the light emitting element, and the end of the cylindrical body on the side having the larger opening diameter of the through hole. A package for housing a light emitting element, wherein a flange portion provided on an outer periphery is joined to the step of the ceramic substrate with an adhesive resin. 請求項１〜３のいずれか１項記載の発光素子収納用パッケージにおいて、前記反射面にめっき被膜が施されていることを特徴とする発光素子収納用パッケージ。   The light emitting element storage package according to claim 1, wherein a plating film is applied to the reflective surface.
JP2004123762A 2004-04-20 2004-04-20 Storing package for light-emitting element Pending JP2005310935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004123762A JP2005310935A (en) 2004-04-20 2004-04-20 Storing package for light-emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004123762A JP2005310935A (en) 2004-04-20 2004-04-20 Storing package for light-emitting element

Publications (1)

Publication Number Publication Date
JP2005310935A true JP2005310935A (en) 2005-11-04

Family

ID=35439374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004123762A Pending JP2005310935A (en) 2004-04-20 2004-04-20 Storing package for light-emitting element

Country Status (1)

Country Link
JP (1) JP2005310935A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008047916A (en) * 2006-08-16 2008-02-28 Cotco Luminant Device Ltd Apparatus, system, and method used for mounting electronic element
JP2008258214A (en) * 2007-03-31 2008-10-23 Sumitomo Metal Electronics Devices Inc Multilayer wiring board for mounting light-emitting device, and its manufacturing method
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP2016213509A (en) * 2011-08-22 2016-12-15 エルジー イノテック カンパニー リミテッド Light emitting element package and light unit including the same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JPWO2020045604A1 (en) * 2018-08-31 2021-08-12 パナソニックＩｐマネジメント株式会社 Package for mounting semiconductor elements and semiconductor devices

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126816A (en) * 1997-07-02 1999-01-29 Citizen Electron Co Ltd Inferred data communication module
JP2002232017A (en) * 2001-01-30 2002-08-16 Kyocera Corp Package for storing light emitting element, and its manufacturing method
JP2003037298A (en) * 2001-07-25 2003-02-07 Stanley Electric Co Ltd Surface-mounted led lamp
JP2003197974A (en) * 2001-12-24 2003-07-11 Samsung Electro Mech Co Ltd Light emitting diode package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1126816A (en) * 1997-07-02 1999-01-29 Citizen Electron Co Ltd Inferred data communication module
JP2002232017A (en) * 2001-01-30 2002-08-16 Kyocera Corp Package for storing light emitting element, and its manufacturing method
JP2003037298A (en) * 2001-07-25 2003-02-07 Stanley Electric Co Ltd Surface-mounted led lamp
JP2003197974A (en) * 2001-12-24 2003-07-11 Samsung Electro Mech Co Ltd Light emitting diode package

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
JP2008047916A (en) * 2006-08-16 2008-02-28 Cotco Luminant Device Ltd Apparatus, system, and method used for mounting electronic element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP2008258214A (en) * 2007-03-31 2008-10-23 Sumitomo Metal Electronics Devices Inc Multilayer wiring board for mounting light-emitting device, and its manufacturing method
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
JP2016213509A (en) * 2011-08-22 2016-12-15 エルジー イノテック カンパニー リミテッド Light emitting element package and light unit including the same
JP2018186284A (en) * 2011-08-22 2018-11-22 エルジー イノテック カンパニー リミテッド Uv light light-emitting element package
USRE48858E1 (en) 2011-08-22 2021-12-21 Suzhou Lekin Semiconductor Co., Ltd. Light emitting device package and light unit
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JPWO2020045604A1 (en) * 2018-08-31 2021-08-12 パナソニックＩｐマネジメント株式会社 Package for mounting semiconductor elements and semiconductor devices

Similar Documents

Publication Publication Date Title
JP4789671B2 (en) WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP4062358B2 (en) LED device
JP4383088B2 (en) Light emitting device storage package
JP2005310935A (en) Storing package for light-emitting element
JP4910220B1 (en) LED module device and manufacturing method thereof
JP2008109079A (en) Wiring board for surface mounting type light-emitting element, and light-emitting device
JP2007234846A (en) Ceramic package for light-emitting element
JP2006303351A (en) Package for storing light emitting element
JP2009038161A (en) Light emitting element storage package
JP4895777B2 (en) WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP2006261290A (en) Package for containing light emitting element and its manufacturing process
JP2006303366A (en) Package for storing light emitting element, and its manufacturing process
JP2006261286A (en) Package for containing light emitting element and its manufacturing process
JP2008131011A (en) Package for storing light-emitting element, and manufacturing method thereof
JP2008135526A (en) Light-emitting element coupling substrate and light-emitting device coupling substrate
JP2006324283A (en) Package for storing light-emitting element
JP4331585B2 (en) Light emitting element storage package and manufacturing method thereof
JP2007048969A (en) Package for light-emitting device storage
JP4533058B2 (en) Reflector for lighting device
KR101304748B1 (en) Package for light-emitting diode, light-emitting diode, and manufacturing method of package for light-emitting diode
JP2007073718A (en) Package for housing light emitting element
JP2007173271A (en) Package for housing light emitting device
JP4841348B2 (en) WIRING BOARD FOR LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE
JP4340283B2 (en) Light emitting diode package, manufacturing method thereof, and light emitting diode using light emitting diode package
JP2006049715A (en) Luminous light source, illuminating unit, and display unit

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061208

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090714

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090716

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090908

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100105

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100428