JPH1126816A - Inferred data communication module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve positioning accuracy among a circuit board, a reflector cup and a lens by positioning them while fitting a shaft of the reflector cup into a hole or a hole of a recess formed in the circuit board. SOLUTION: In an infrared data communication module 1, a light-emitting element 3, a light-receiving element 4, an IC chip 5 and the like are mounted on a circuit board 7, and the upper surfaces of the elements 3 and 4 are sealed with a light-transmitting resin 6 so that the elements 3 and 4 are covered by semi-spherical lens portions 6a and 6b. The element 3 is surrounded by an inclined surface 11b of a reflector cup 11. The board 7 and the cup 11 are positioned by fitting a shaft 11e of the cup 11 into a through hole 7a formed in the board 7. As a result, positioning accuracy is high, and rays of infrared light are converged onto the portion 6a efficiently. Further, since the cup 11 is dropped into the hole 7a of the board 7, there is no need to set a wire at a higher position and to a larger length than necessary. A small-sized, low- dissipation, high-speed and long-distance communication device for civil use can be implemented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an infrared data communication module used for consumer equipment such as a personal computer, a printer, a PDA, a facsimile, a pager, and a portable telephone.

[0002]

2. Description of the Related Art In recent years, there has been a strong demand for miniaturization of infrared data communication modules in portable devices such as notebook computers, PDAs, and mobile phones equipped with an optical communication function. L
A light emitting element consisting of an ED, a light receiving element consisting of a photodiode, a circuit part consisting of an IC incorporating an amplifier, a drive circuit, etc. are directly die-bonded and wire-bonded to the lead frame, and are molded with a resin integrated with a lens using visible light cut epoxy resin. An infrared data communication module in which a transmission unit and a reception unit are integrated into one package has been developed.
An outline of the structure of a conventional general infrared data communication module will be described with reference to FIGS. FIG. 7 is a front view showing the appearance of the infrared data communication module, and FIG.
FIG. 9 is a cross-sectional view showing the internal configuration of FIG.

In FIG. 7 to FIG. 9, the infrared data communication module 1 has a light emitting element 3, a light receiving element 4, and an IC chip 5 connected only to the upper surface side of a lead frame 2 by die bonding and wire bonding. A hemispherical lens having a function of irradiating and condensing infrared light with a light-transmitting resin 6 such as an epoxy resin containing a visible light-cutting agent on the upper surfaces of the light emitting element 3 and the light receiving element 4 while protecting the electronic components. Resin sealing is performed to form the portions 6a and 6b.
The terminal 2a of the lead frame 2 projects outside the main body of the infrared data communication module 1 to be mounted on a wiring pattern of a mother board (not shown) such as a printed circuit board.

As shown in FIGS. 8 and 9, an inverted conical inclined surface 2b formed by press drawing or the like is formed at a position on the lead frame 2 where the light emitting element 3 is mounted, and is surrounded by the inclined surface 2b. The light emitting element 3 is mounted on the bottom surface.

However, in the infrared data communication module described above, the light emitting element 3 is surrounded by the inverted conical inclined surface 2b integrally formed with the lead frame 2, so that the infrared light emitted from the light emitting element 3 is directed to the upper surface. Although there is an effect of reflection, in the mounting structure using the lead frame 2, the light emitting element 3, the light receiving element 4, the IC chip 5, the capacitor (not shown), etc., which are the components of the infrared data communication module 1, In this case, the mounting space has no effect on the area of the component parts, and there is a limit in reducing the size in a planar manner. In addition, since the lead terminals 2a of the lead frame 2 protrude outside the main body, there are various problems such as a large mounting space on a motherboard such as a printed circuit board, which hinders high-density mounting.

Accordingly, an ultra-compact infrared data communication module has been developed in which electronic components are mounted on the surface of a circuit board to reduce the mounting space on a motherboard. FIG.
Is a sectional view of an infrared data communication module in which electronic components are mounted on a circuit board, and FIG. 11 is a partially enlarged sectional view showing an optical path of a light emitting element.

The outline will be described with reference to FIG. Reference numeral 7 denotes a circuit board made of glass epoxy resin or the like having a substantially rectangular insulated surface and having an insulating property. Conductive patterns (not shown) formed on the upper and lower surfaces of the circuit board are formed through through holes 8 formed in the circuit board 7. It is electrically connected via the hole electrode 8a. Although a glass epoxy substrate is used as the circuit board 7, an alumina ceramic substrate, a plastic film substrate such as polyester or polyimide may be used.

Reference numeral 3 denotes a light-emitting element comprising a high-speed infrared LED, and reference numeral 4 denotes a light-receiving element comprising a photodiode. Both are mounted on the upper surface side of the circuit board 7, and are connected to the conductive pattern by die bonding and wire bonding. Reference numeral 5 denotes an IC chip having a circuit section in which a high-speed amplifier, a drive circuit and the like are incorporated, and is die-bonded and wire-bonded to a conductive pattern on the upper surface of the circuit board 7. A capacitor 9 is provided on the lower surface side of the circuit board 7.
Are soldered by the solder 10 and are connected via the through-hole electrodes 8 a of the through-holes 8. When the capacitor 9 and the like are not mounted on the lower surface side of the circuit board 7, the through hole 8 is unnecessary.

Reference numeral 6 denotes an epoxy-based translucent resin containing a visible light cutting agent for sealing the light emitting element 3 and the light receiving element 4 with a resin as described above. The translucent resin 6 forms hemispherical lens portions 6a and 6b on the upper surfaces of the light emitting element 3 and the light receiving element 4 so as to provide the function of irradiating and condensing infrared light and at the same time protect both elements. The capacitor 9 mounted on the lower surface of the circuit board 7 may or may not be sealed with a sealing resin.

In FIG. 11, most of the infrared light from the light emitting element 3 mounted on the circuit board 7 by wire bonding is a hemispherical lens portion formed on the upper surface like the infrared light A converged upward. Although the light is condensed by 6a, a considerable amount of infrared light, such as infrared light B emitted in the lateral direction, is not converged on the lens and leaks in the lateral direction.

[0011] In view of the above, an "infrared data communication module" previously filed by the present applicant (filing date: June 13, 1997)
In (2), the periphery of the light emitting element mounted on the circuit board surface is surrounded by a reflective member, and infrared light from the light emitting element is effectively focused on the lens, thereby reducing power consumption and increasing the output of the light emitting element. An infrared data communication module was proposed. The outline will be described with reference to FIG.

FIG. 12 is a sectional view of the infrared data communication module. In FIG. 12, a light emitting element 3, a light receiving element 4, an IC chip 5, a capacitor 9, and other electronic components are mounted on a circuit board 7 having a substantially rectangular flat surface.
The configuration of the infrared data communication module 1 in which the upper surface of the light receiving element 4 is sealed with the translucent resin 6 so as to cover the upper surface with the hemispherical lens portions 6a and 6b is the same as in the above-described conventional technology, and will not be described. Omitted.

The light emitting element 3 has a bottom surface 11a of a reflection cup 11 having a reflection surface whose periphery is inclined in an inverted conical shape.
It is stuck to. The reflection cup 11 has a bottomed inverted conical inclined surface 11b formed by pressing a conductive member, for example, a SuS material or a phosphor bronze material.
The inclination angle of 1b = 30-45 ° is optimal. The reflection cup 11 is fixed to the conductive pattern of the circuit board 7 by a fixing means such as a conductive adhesive.

The bottom surface 11a and the inclined surface 11b of the reflection cup 11 are provided with a silver reflective thin film 1 in order to improve the reflection efficiency of infrared light from the light emitting element 3 (high-speed infrared LED).
1c, for example, a Ni plating layer is formed by electrolytic Ni plating.

As shown in the figure, the light emitting element 3 (high-speed infrared L
The infrared light from ED) is conventionally infrared light B
Are reflected by the reflective thin film 11c formed on the inclined surface 11b of the reflective cup 11, and are collected upward.
As described above, the infrared light is condensed by the hemispherical lens portion 6a formed upward without waste. The material of the above-mentioned reflection cup 11 is not limited to a conductive member. In the case of a non-conductive member, for example, a Ni plating layer is formed by electroless Ni plating, and the above-mentioned member is fixed by a fixing means such as a conductive adhesive. The conductive pattern may be fixed to the conductive pattern of the circuit board 7.

[0016]

However, the infrared data communication module described above has the following problems. That is, as an infrared data communication module using a circuit board, the arrangement position of the reflection cup surrounding the light emitting element with the reflection surface is located at the center, that is, the center of the light emitting element is located at the center of the hemispherical lens portion. As required,
There is no means for positioning the reflective cup on the circuit board, and the positional accuracy of the reflective cup varies, making it difficult to mount the reflective cup with high accuracy. Therefore, there is a difficulty in efficiently condensing all the infrared light from the light emitting element to the hemispherical lens portion, and the optical yield is reduced. Also, wire bonding through the top of the reflective cup,
The wire length is inevitably longer, and therefore the package size is also larger. For this reason, there is a problem that there is a danger of touching the shoulder if the wire is hit with a reflection cup.

The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a circuit board and a reflecting cup which are positioned between a center of a light emitting element and a center of a hemispherical lens part by positioning means formed on the both. Improve the positioning accuracy of Further, by dropping the reflection cup from the upper surface of the circuit board, the wire length is shortened and the package size is reduced. By effectively condensing the infrared light from the light emitting element to the lens, low power consumption and high output of the light emitting element can be measured, and a miniaturized package size provides an ultra-compact and inexpensive infrared data communication module. Is what you do.

[0018]

In order to achieve the above object, an infrared data communication module according to the present invention comprises a light emitting element, a light receiving element,
In an infrared data communication module in which electronic parts such as an IC chip and a capacitor are mounted, and the upper surfaces of the light emitting element and the light receiving element are resin-sealed with a translucent resin so as to cover the upper surfaces of the light emitting element and the light receiving element, Are surrounded by the reflection surface of the reflection cup, and the center of the light emitting element is made coincident with the center of the hemispherical lens portion by the positioning means formed on both the circuit board and the reflection cup. .

Further, the positioning means is characterized in that the axis of the reflection cup is fitted and positioned with reference to the hole provided in the circuit board or the hole of the concave portion.

Further, the positioning means is characterized in that positioning is performed on a guide taper surface of the reflection cup with reference to a hole or a recessed hole provided in the circuit board.

Further, the positioning means is characterized in that positioning is performed by fitting a hole in a concave portion of the reflection cup with reference to an axis of the convex portion provided on the circuit board.

The shape of the reflection surface of the reflection cup is as follows:
It has an inverted conical shape.

The shape of the reflecting surface of the reflecting cup is as follows:
It has a curved shape.

The reflection cup is a bottomed reflection cup dropped and fixed from the upper surface of the circuit board, and the light emitting element is fixed to the bottom surface of the reflection cup at a position lower than the upper surface of the circuit board. It is a feature.

The reflection cup is a reflection cup having an opening on the bottom surface which is fixed by dropping from the top surface of the circuit board. The light emitting element is located at the bottom opening of the reflection cup at a position lower than the top surface of the circuit board. And directly fixed to the circuit board.

Further, a reflection thin film is formed on a reflection surface of the reflection cup.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an infrared data communication module according to the present invention will be described with reference to the drawings. FIGS. 1, 2 (a), 2 (b), 3 and 6 (a) relate to the first embodiment of the present invention, and FIG. 1 is a sectional view of an infrared data communication module, and FIG. 2 (a). (B) is an enlarged sectional view of a positioning portion based on a hole of the circuit board, and FIGS.
(D) is a sectional view of the reflection cup on the basis of the axis, and FIG.
(A) is sectional drawing of the state which mounted the reflection cup on the circuit board by fitting a hole and a shaft. In the drawings, the same members as those of the prior art are denoted by the same reference numerals.

In FIG. 1, light emitting elements 3, light receiving elements 4, IC chips 5, and capacitors 9 and other electronic components are mounted on a circuit board 7 having a substantially rectangular flat surface, and the upper surfaces of the light emitting elements 3 and light receiving elements 4 are formed. Since the infrared data communication module 1 in which the resin is sealed with the translucent resin 6 so that the infrared data communication module 1 is covered with the hemispherical lens portions 6a and 6b is the same as described above, the description is omitted.

Each of the reflection cups shown in FIGS. 3 (a) to 3 (d) has a circuit board and a positioning means for the reflection cup. It is for positioning. 1 and 2 (a),
As shown in FIGS. 3A and 6A, the light emitting element 3 is fixed to a bottom surface 11a of a reflection cup 11 having a reflection surface inclined in an inverted conical shape around its periphery. The reflection cup 11 has a bottomed inverted conical inclined surface 11b formed by pressing a conductive member, for example, a SuS material or a phosphor bronze material, and the like, and the inclination angle of the inclined surface 11b, α = 30 to 4
5 ° is optimal. The light emitting element 3 is provided on the inclined surface 11b.
In order to increase the reflection efficiency of infrared light from the substrate, a silver-colored reflection thin film 11c, for example, a Ni plating layer is formed by electrolytic Ni plating. The reflection cup 11 has a flange portion 11d on the outer peripheral edge, and a shaft portion 11e is formed.

FIGS. 1, 2 (a), 2 (b) and 6
As shown in FIG. 2A, a through-hole 7a is formed in the circuit board 7 at a position corresponding to the center 6c of the hemispherical lens portion 6a with high precision by NC drilling or the like in FIG. 2A. I do. The reflection cup 1 is provided on the inner diameter surface 7b of the through hole 7a.
One shaft portion 11e is fitted, the lower surface of the flange portion 11d serves as a stopper, and the reflection cup 11 is dropped into the through hole 7a of the circuit board 7. In FIG. 2 (b), a concave blind hole 7c is accurately cut out by NC milling or the like, and the reflection cup 11 is similarly fitted to the inner diameter surface 7d so that the shaft portion 11e of the reflection cup 11 is fitted. Is dropped into the blind hole 7c of the circuit board 7.

As described above, the means for positioning the circuit board 7 and the reflection cup 11 is provided by the through holes 7a provided in the circuit board 7.
3 with reference to the inner diameter surfaces 7b and 7d of the blind hole 7c.
(A), (b), (c), (d) reflection cups 11, 1
2, 13, 14 shaft portions 11e, 12e, 13e, 14e
Are positioned by fitting each other. The flange 11d of each of the reflection cups 11 to 14
14d are fixed to the conductive pattern of the circuit board 7 by fixing means such as a conductive adhesive.

Further, a lens mold for forming the hemispherical lens portion 6a, a through hole 7a and a blind hole 7c cut in the circuit board 7 are provided.
By using a guide hole (not shown) provided on the circuit board 7, the positioning can be accurately performed. Therefore, in FIG. 6A, the center 6c of the hemispherical lens portion 6a, the center 7f of the through hole 7a formed in the circuit board 7, and the center 11f of the reflection cup 11 exactly match. That is, the circuit board 7 shown in FIG.
The light emitting elements 3 on the reflection cups 11 to 14 mounted on the
It is accurately positioned at the center 6c of the hemispherical lens portion 6a.

Further, the reflection cups 11 to 14 are connected to the circuit board 7.
Since the bonding wire is mounted by being dropped from the upper surface of the bonding wire, it is unnecessary to make the bonding wire taller and longer than necessary. The design space of the circuit board 7 can also reduce the mounting space.

As shown in FIG. 1, when the center of the light emitting element 3 and the center of the hemispherical lens portion 6a coincide with each other, infrared light from the light emitting element (high-speed infrared LED) is reflected by the reflection cups 11 to 14.
The infrared light A reflected by the reflective thin films 11c to 14c formed on the inclined surfaces 11b and 12b and the curved surfaces 13b and 14b and condensed upward is efficiently used for the hemispherical lens portion 6a.
Is collected.

FIGS. 3B, 3C and 3D show reflection cups having different shapes of the bottom surface and the reflection surface. The reflection cup 12 in FIG. 3B has an opening 12a on the bottom surface of a non-conductive member, for example, a plastic member formed by resin molding or the like. The reflection cup 12 has the same structure as the reflection cup 11 described above. The inclined surface 12b has an inverted conical shape, and the optimal inclination angle of the inclined surface 12b is α = 30 to 45 °, as described above. FIG.
As shown in (b), the light emitting element 3 is located in the opening 12 a on the bottom surface of the reflection cup 12, and the light emitting element 3 is directly fixed to the conductive pattern in the concave portion of the circuit board 7. The reflection cup 12 is fixed to the light emitting element 3 by a fixing means such as an adhesive.
Is fixed on the circuit board 7 so as to surround the circuit board 7. As described above, a silver reflective thin film 12c is formed on the inclined surface 12b of the reflective cup 12 by electroless Ni plating or the like. It goes without saying that the reflection cup 12 is not limited to a non-conductive member.

In FIG. 3C, the reflecting cup 13 is
As described above, the conductive member, for example, a SuS material, a phosphor bronze material, or the like, has a bottomed curved surface 1 by pressing or the like.
3b, and the angle between the normal to the curved surface 13b and the bottom surface 13a, β = 30-45 °, is optimal. The reflection cup 13 is fixed to the conductive pattern of the circuit board 7 by fixing means such as a conductive adhesive.

On the bottom surface 13a and the curved surface 13b of the reflective cup 13, a silver reflective thin film 13c is formed by electrolytic Ni plating or the like, as described above.

In FIG. 3D, as described above, a non-conductive member, for example, a plastic member has an opening 14a on the bottom surface by resin molding or the like, and a reflecting surface is formed on the curved surface 14b. Similarly to the above, the angle between the normal to the curved surface 14b and the bottom surface of the reflection cup 14, that is, β = 30 to 45 ° is optimal. As described above, a silver reflective thin film 14c is formed on the curved surface 14b by electroless Ni plating or the like.

FIGS. 4 and 6B relate to a second embodiment of the present invention. FIG. 4 is a sectional view of a reflection cup.
(B) is a partial enlarged sectional view showing a state where a reflection cup is mounted on a circuit board.

In the reflection cup shown in FIG. 4, the circuit board and the positioning means for the reflection cup are positioned on the guide taper surface of the reflection cup with reference to a hole or a recessed hole provided in the circuit board.

The reflection cup shown in FIG. 4 differs from the reflection cup shown in FIG. 3 in that a guide taper surface is formed on the back side of the inclined surface and the curved surface, and the other configuration is shown in FIG. The same as the reflection cup.

In FIG. 4E, the reflection cup 15 is
An inclined surface 15b having an inverted conical shape with a bottom is provided.
The inclination angle of b, α = 30-45 ° is optimal. Slope 1
A guide tapered surface 15e having an inverted conical shape is formed on the back surface substantially parallel to 5b, and the tapered surface serves as a guide and is positioned in a through hole or a blind hole of a circuit board 7 described later.

On the inclined surface 15b and the bottom surface 15a, a silver reflective thin film 15c, for example, a Ni plating layer is formed in order to increase the reflection efficiency of infrared light from the light emitting element 3. As shown in FIGS. 4E and 6B, the reflecting cup 15 has a flange 15d formed on the outer peripheral edge. Reference numeral 15f denotes a positioning corner that contacts the positioning corner 7e of the circuit board 7.

FIG. 6B shows a circuit board having blind holes formed therein.
FIG. 5E shows a state where the bottomed reflecting cup 15 of FIG. 4E is mounted. In the figure, a blind hole 7c is formed in the center 6c of the hemispherical lens portion 6a by NC milling or the like as described above, and a reflective cup 15 is formed in the blind hole 7c.
Insert The reflection cup 15 has a guide tapered surface 15e.
To the positioning corner 7e of the blind hole 7c of the circuit board 7, the positioning corner 15f of the reflection cup 15 abuts, and the flange 15d of the reflection cup 15
Becomes a stopper. It is fixed to the conductive pattern of the circuit board 7 by a fixing means such as a conductive adhesive. The light emitting element 3 is mounted on the bottom surface 15a of the reflection cup 15.

Therefore, since the alignment between the lens mold and the circuit board 7 is performed using the guide holes (not shown) of the circuit board 7 as described above, the center 6c of the hemispherical lens portion 6a and the center 15g of the reflection cup 15 are aligned. And the center 7f of the blind hole 7c of the circuit board 7 exactly coincides. That is, the light emitting element 3 mounted on the reflection cup 15 and the hemispherical lens 6
The center 6c of a is positioned.

Further, the reflection cups 15 to 18 are connected to the circuit board 7.
In this case, the bonding wire is dropped on the upper surface and mounted, so that it is unnecessary to make the bonding wire unnecessarily high and long. The design space of the circuit board 7 can also reduce the mounting space.

The guide taper surface 16 on the back surface of the reflection cups 16, 17, and 18 shown in FIGS. 4 (f), 4 (g) and 4 (h).
Configurations other than e, 17e, and 18e are the same as those of the above-described reflection cup, and thus description thereof is omitted.

FIGS. 2C, 5 and 6C relate to a third embodiment of the present invention, and FIG. 2C is an enlarged sectional view of a positioning portion of the circuit board based on the axis. FIG. 6C is a cross-sectional view of a reflection cup based on a hole, and FIG. 6C is a partially enlarged cross-sectional view showing a state where the reflection cup is mounted on a circuit board by fitting a shaft and a hole.

As shown in FIGS. 2C and 6C,
The positioning means is for positioning by fitting a blind hole provided on the back surface of the reflection cup with reference to the axis of the projection provided on the circuit board.

The reflection cup shown in FIG. 5 differs from the reflection cup shown in FIGS. 3 and 4 in that a blind hole is formed on the back side, and the other configuration is the same.

In FIG. 5 (i), the reflection cup 19 is
The bottom of the inclined surface 19b having an inverted conical shape is formed by pressing or a plastic member by resin molding or the like, and the inclination angle of the inclined surface 19b, α = 30 to 45 °, is optimal. A blind hole 19d is formed on the back surface. Inner diameter surface 19e of blind hole 19d
Is to be fitted to a shaft of a convex portion formed on the circuit board 7 described later. A silver reflective thin film 19c is formed on the inclined surface 19b and the bottom surface 19a. Due to the above processing method, the shape accuracy including the blind hole 19d of the reflection cup 19 is good.

As shown in FIGS. 2C and 6C,
At a position corresponding to the center 6c of the hemispherical lens portion 6a on the circuit board 7, an axis 7 of the convex portion whose upper surface is lower than the upper surface of the circuit board 7 is provided.
The ring-shaped groove 7h having g is formed by NC end milling or the like. The reflection cup 19 is positioned by fitting the inside diameter surface 19e of the blind hole 19d of the reflection cup 19 with reference to the outside diameter surface 7i of the shaft 7g of the projection of the circuit board 7. The conduction in this case may be performed by three-dimensional wiring or the like. It is fixed to the conductive pattern of the circuit board 7 by a fixing means such as a conductive adhesive.

FIGS. 5 (j), 5 (k) and 5 (l) show other reflection cups 20, 21 and 22. The shape of the reflection surface and the like are described above except that a blind hole is formed on the back surface. The description is omitted because it is the same as the reflection cup.

Accordingly, as in the first and second embodiments, as shown in FIG. 6C, the center 6c of the hemispherical lens portion 6a, the center 19f of the reflection cup 19, and the circuit board 7 exactly coincides with the center 7j of the shaft 7g of the convex portion. That is, the light emitting element 3 mounted on the reflection cup 19 is positioned at the center 6c of the hemispherical lens portion 6a.

Further, since the reflection cup 19 is mounted by being dropped into the ring-shaped groove 7h of the circuit board 7, it is not necessary to make the bonding wire higher and longer than necessary. The design space of the circuit board 7 can also reduce the mounting space.

[0056]

As described above, according to the present invention,
The positioning accuracy of the circuit board-reflection cup-lens is improved by fitting and positioning the axis of the reflection cup with reference to the hole provided in the circuit board or the hole of the recess. Also,
Since the reflection cup is dropped into the circuit board, the wires need not be higher than necessary and need not be long, and the mounting space can be reduced in terms of circuit board design.

Further, the positioning and the positioning on the guide taper surface of the reflection cup with reference to the hole provided in the circuit board or the hole of the concave portion provide the same operation and effect as described above.

The same operation and effect as described above can be obtained by fitting and positioning the hole of the concave portion of the reflection cup with reference to the axis of the convex portion provided on the circuit board.

Further, the shape of the reflecting surface of the reflecting cup is an inverted conical shape or a curved shape, and furthermore, by forming a reflecting thin film on the reflecting surface of the reflecting cup, all the infrared light from the light emitting element is wasted. And the light can be efficiently collected by the hemispherical lens portion formed above.

As described above, it is possible to provide an infrared data communication module with high mounting position accuracy of the light emitting element, that is, high optical yield, low power consumption, and high output of the LED, and is small in size and low in power consumption. It is possible to realize consumer equipment for high-speed and long-distance communication.

[Brief description of the drawings]

FIG. 1 is a sectional view of an infrared data communication module according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged sectional view showing a circuit board positioning means of the present invention.

FIG. 3 is a sectional view of an axis-based reflection cup according to the first embodiment of the present invention.

FIG. 4 is a cross-sectional view of a reflection cup positioned on a guide tapered surface according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a hole-based reflection cup according to a third embodiment of the present invention.

FIG. 6 is a partially enlarged cross-sectional view showing a positioning state of a circuit board and a reflection cup according to the first, second, and third embodiments of the present invention.

FIG. 7 is an external front view of a conventional infrared data communication module.

FIG. 8 is a plan view seen through from the upper surface of FIG. 7;

FIG. 9 is a sectional view of FIG. 8;

FIG. 10 is a sectional view of another conventional infrared data communication module.

11 is a partially enlarged sectional view showing an optical path of the light emitting device of FIG.

FIG. 12 is a sectional view of an infrared data communication module in which a reflection cup is mounted on a circuit board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Infrared data communication module 3 Light emitting element 4 Light receiving element 5 IC chip 6 Translucent resin 6a, 6b Hemispherical lens part 6c Center of hemispherical lens part 6a 7 Circuit board 7a Through hole 7b, 7d Inner surface 7c Blind hole 7f, 7j Through-hole, blind hole, center of shaft portion of circuit board 7g Shaft of convex portion 11-22 Reflection cup 11a, 13a, 15a, 17a, 19a, 21a Bottom surface 11b, 12b, 15b, 16b, 19b, 20b Inclined surface 11f , 15g, 19f Center of reflective cup 13b, 14b, 17b, 18b, 21b, 22b Curved surface 11c-22c Reflective thin film 12a, 14a, 16a, 18a, 20a, 22a Opening 11e-14e Shaft 15e-18e Guide taper surface 19e-22e Inner diameter surface A Infrared light condensed upward B Infrared light emitted in the lateral direction α Incline Angle between the normal line and the bottom surface of the β curved surface

Continuation of the front page (51) Int.Cl. ⁶ Identification symbol FI H04B 10/22 10/28 10/26 10/14 10/04 10/06 (72) Inventor Shin Shimozawa 1-23, Kamigiji, Fujiyoshida-shi, Yamanashi Prefecture No. 1 Citizen Electronics Co., Ltd. (72) Inventor Junichi Watanabe 1-23-1 Kagurechi, Fujiyoshida City, Yamanashi Prefecture Citizen Electronics Co., Ltd.

Claims (9)

[Claims] An electronic component such as a light emitting element, a light receiving element, an IC chip and a capacitor is mounted on a circuit board surface having a substantially rectangular shape in a plane, and the upper surfaces of the light emitting element and the light receiving element are covered with a hemispherical lens portion. In an infrared data communication module resin-sealed with a translucent resin, the light emitting element is surrounded by a reflective surface of a reflective cup, and the circuit board and the reflective cup are illuminated by positioning means formed on both of them. An infrared data communication module, wherein the center of the element coincides with the center of the hemispherical lens portion. 2. The infrared data communication module according to claim 1, wherein said positioning means positions the reflection cup by fitting a shaft of the reflection cup with reference to a hole provided in the circuit board or a hole of a concave portion. . 3. The infrared data communication module according to claim 1, wherein the positioning means performs positioning on a guide taper surface of a reflection cup with reference to a hole or a recessed hole provided in the circuit board. 4. The infrared data communication according to claim 1, wherein said positioning means is positioned by fitting a hole in a concave portion of the reflection cup with reference to an axis of a convex portion provided on the circuit board. module. 5. The infrared data communication module according to claim 2, wherein the reflection surface of the reflection cup has an inverted conical shape. 6. The infrared data communication module according to claim 2, wherein the shape of the reflection surface of the reflection cup is a curved shape. 7. The reflection cup is a bottomed reflection cup dropped and fixed from the upper surface of the circuit board, and the light emitting element is fixed to the bottom surface of the reflection cup at a position lower than the upper surface of the circuit board. The infrared data communication module according to claim 4, 5 or 6, wherein: 8. The reflection cup has an opening at a bottom surface fixed by dropping from the top surface of the circuit board, and the light emitting element is located at a bottom opening of the reflection cup at a position lower than the top surface of the circuit board. 7. The infrared data communication module according to claim 4, wherein the infrared data communication module is directly fixed to a circuit board. 9. The infrared data communication module according to claim 5, wherein a reflection thin film is formed on a reflection surface of the reflection cup.