JP2006332234A - Led device having reflecting function - Google Patents

Led device having reflecting function Download PDF

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Publication number
JP2006332234A
JP2006332234A JP2005152268A JP2005152268A JP2006332234A JP 2006332234 A JP2006332234 A JP 2006332234A JP 2005152268 A JP2005152268 A JP 2005152268A JP 2005152268 A JP2005152268 A JP 2005152268A JP 2006332234 A JP2006332234 A JP 2006332234A
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Prior art keywords
led
reflector
wiring board
led device
cavity
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Japanese (ja)
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Ryoji Sugiura
良治 杉浦
Hideki Yoshida
英樹 吉田
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Lincstech Circuit Co Ltd
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Hitachi AIC Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

<P>PROBLEM TO BE SOLVED: To improve heat radiating property and reflection efficiency of the LED device, and to reduce a manufacturing cost thereof. <P>SOLUTION: The LED device having reflecting function allows mounting of a chip mounting part at the bottom surface of a cavity where the upper part of a heat radiating block in the metal polar shape is recessed, and this heat radiating block is a heat radiating reflector having the reflecting function where the reflector having the reflecting function and the heat radiating block having heat radiating function are integrally formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子を搭載するＬＥＤ搭載ブロックの放熱性と反射効率を向上させたＬＥＤ用反射体兼放熱ブロックからなるＬＥＤ装置に関するものである。   The present invention relates to an LED device including a reflector / heat radiation block for LED, in which heat dissipation and reflection efficiency of an LED mounting block on which a light emitting element is mounted are improved.

近年、高輝度化したＬＥＤチップが開発され、これまでの携帯電話機等のテンキー照明やスポット的な照明に使用されるばかりではなく、電気スタンド等の比較的広範囲の照明用として使用され始めてきており、より高い放熱性が要求されるようになっている。
従来のＬＥＤ装置は、絶縁基板に貫通穴を形成し、貫通穴の一方側の開口を金属板で覆い、貫通穴の壁面および金属板の表面ならびに絶縁基板の表面にめっきによって金属膜を形成し、金属板上にＬＥＤチップを実装し、ワイヤボンディングでＬＥＤチップと絶縁基板上の金属膜との間を電気的に接続したものがある（例えば、特許文献１参照）。
特許第３１３７８２３号公報（段落「００２７」ないし「００３７」）。 In recent years, high-intensity LED chips have been developed and are not only used for numeric keypad lighting and spot lighting for mobile phones and the like, but have also started to be used for relatively wide lighting such as desk lamps. Therefore, higher heat dissipation is required.
In the conventional LED device, a through hole is formed in an insulating substrate, an opening on one side of the through hole is covered with a metal plate, and a metal film is formed by plating on the wall surface of the through hole, the surface of the metal plate, and the surface of the insulating substrate. In some cases, an LED chip is mounted on a metal plate, and the LED chip and a metal film on an insulating substrate are electrically connected by wire bonding (for example, see Patent Document 1).
Japanese Patent No. 3137823 (paragraphs “0027” to “0037”).

上述した従来のＬＥＤ装置の場合には、反射面は貫通穴の壁面の金属膜をめっきによって形成しているため、金属膜の膜厚を厚くするには自ずと限界があり、このため放熱性を向上させることができないという問題があった。
さらに、ＬＥＤチップを実装する底面の金属板によって放熱性は向上するが大容量の熱放散が必要となる場合、さらに金属板を厚くすることになり絶縁基板に金属板を接続成形する精度が悪くなる。
また、絶縁基板の穴内面は金属板に比較して、絶縁基板の基材壁面は平滑性が悪く膜厚が均一な金属めっきを施すことが困難であるため反射効率が低下するという問題があった。 In the case of the above-described conventional LED device, since the reflective surface is formed by plating the metal film on the wall surface of the through hole, there is a limit to increasing the film thickness of the metal film. There was a problem that it could not be improved.
Furthermore, the heat dissipation is improved by the metal plate on the bottom surface on which the LED chip is mounted. However, when large-capacity heat dissipation is required, the metal plate becomes thicker and the accuracy of connecting and forming the metal plate to the insulating substrate is poor. Become.
In addition, the inner surface of the hole in the insulating substrate has a problem that the base wall surface of the insulating substrate is not smooth and it is difficult to apply metal plating with a uniform film thickness, resulting in a decrease in reflection efficiency. It was.

本発明は上記した従来の問題に鑑みなされたものであり、その目的とするところは、新規の放熱ブロック状の上部が陥没しているキャビティの底面にチップ搭載部を形成すると共に、この放熱ブロックは反射機能を有する反射体（リフレクター）と、放熱機能を有する放熱ブロックとが一体成形されている反射機能を有する放熱ブロックであって、ＬＥＤ装置の放熱性の向上と反射効率の向上を図るとともに製造コストの低減をも図ることにある。   The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to form a chip mounting portion on the bottom surface of a cavity in which an upper portion of a new heat dissipation block is depressed, and this heat dissipation block. Is a heat dissipation block having a reflection function in which a reflector (reflector) having a reflection function and a heat dissipation block having a heat dissipation function are integrally formed, and is intended to improve the heat dissipation and the reflection efficiency of the LED device The purpose is to reduce the manufacturing cost.

この目的を達成するために、請求項１に係る発明は、大盤板の配線板の分割切断線上に配置される側面端子用穴とＬＥＤ反射体を挿入する貫通穴を有する個別配線板が複数繋がる大盤板の配線板と、前記貫通穴に勘合し配線板より厚い金属柱状の反射体と、該反射体の陥没しているキャビティの底面に搭載するＬＥＤ素子と、前記ＬＥＤ素子と配線板の側面端子を電気的に接続する金ワイヤーと、前記ＬＥＤ素子と金ワイヤーとを覆う封止樹脂とで構成されたＬＥＤが複数繋がる大盤板の配線板の分割切断線で分割して個々のＬＥＤ装置に側面端子を形成するものである。   In order to achieve this object, the invention according to claim 1 connects a plurality of individual wiring boards having holes for side terminals arranged on the divided cutting lines of the wiring board of the large board and through holes for inserting the LED reflectors. A wiring board of a large board, a metal columnar reflector fitted into the through hole and thicker than the wiring board, an LED element mounted on the bottom surface of the cavity in which the reflector is depressed, and a side surface of the LED element and the wiring board Divided by the dividing cutting lines of the wiring board of the large board where a plurality of LEDs composed of gold wires that electrically connect the terminals and the sealing resin that covers the LED elements and the gold wires are connected to each LED device. A side terminal is formed.

請求項２に係る発明は、請求項１記載のＬＥＤ装置において、一個の反射体のキャビティの底面に複数のＬＥＤ素子を搭載することを特徴とするＬＥＤ装置である。   The invention according to claim 2 is the LED device according to claim 1, wherein a plurality of LED elements are mounted on the bottom surface of the cavity of one reflector.

本発明によれば、金属の塊（金属製ブロック）となっているＬＥＤ用放熱ブロックによって形成した熱伝導体積（熱伝導容量）の大きい金属柱状の放熱ブロックの反射体の上部に陥没しているキャビティの底面にＬＥＤチップを搭載するため放熱性が従来技術で公知となっている金属薄板状の配線板や金属板リードフレームに比較し大幅に向上する。   According to the present invention, a metal columnar heat radiation block having a large heat conduction volume (heat conduction capacity) formed by an LED heat radiation block that is a lump of metal (metal block) is depressed above the reflector. Since the LED chip is mounted on the bottom surface of the cavity, the heat dissipation is greatly improved compared to a metal thin plate-like wiring board or metal plate lead frame known in the prior art.

また、熱伝導体積の大きい金属ブロックで放熱ブロック状の上部が陥没しているキャビティの底面にチップ搭載部を形成すると共に、この放熱ブロックは反射機能を有する反射体（リフレクター）と、放熱機能を有する放熱ブロックとが一体成形されているＬＥＤ装置であるため、この反射体（リフレクター）も発熱や発光による熱放散が良好となりＬＥＤ部品の輝度劣化を防止できる。
さらに、ＬＥＤ用放熱ブロックの反射体の表面の粗さも均一に平滑にして鏡面加工することができるから、この反射体内面上に形成する貴金属めっきやアルミ蒸着等の加工を省略でき反射効率を向上させることができる。
また、放熱ブロックと配線板を接続成形することが容易となり加工コストを低減することができる。 In addition, a chip mounting part is formed on the bottom surface of the cavity where the upper part of the heat dissipation block is depressed with a metal block having a large heat conduction volume, and this heat dissipation block has a reflector (reflector) having a reflection function and a heat dissipation function. Since the LED device is integrally formed with the heat dissipation block, the reflector (reflector) also has good heat dissipation due to heat generation and light emission, and can prevent deterioration of the brightness of the LED component.
Furthermore, since the surface roughness of the reflector of the LED heat dissipation block can be made smooth and mirror-finished, processing such as precious metal plating and aluminum deposition formed on the inner surface of the reflector can be omitted, improving the reflection efficiency. Can be made.
Moreover, it becomes easy to connect and mold the heat dissipation block and the wiring board, and the processing cost can be reduced.

以下、本発明の実施の形態を図に基づいて説明する。図１は本発明に係るＬＥＤ用放熱ブロック兼反射板である放熱性ＬＥＤ反射体の全体を示す外観斜視図、図２は本発明に係るＬＥＤ装置を示す斜視図、図３は本発明に係るＬＥＤ装置を示す断面図、図４は本発明に係る放熱性ＬＥＤ反射体を嵌入した状態を説明するための断面図ある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing the entirety of a heat dissipating LED reflector that is a heat dissipation block and reflector for LED according to the present invention, FIG. 2 is a perspective view showing an LED device according to the present invention, and FIG. 3 is related to the present invention. Sectional drawing which shows an LED apparatus, FIG. 4 is sectional drawing for demonstrating the state which inserted the heat dissipation LED reflector which concerns on this invention.

図１に全体を符号１で示すものは円柱状の放熱性ＬＥＤ反射体であって、ＬＥＤチップが搭載される放熱性反射体の上部に陥没しているキャビティの底面に配置するチップ搭載部（ランド）２と、ＬＥＤチップ搭載部を囲む枠状に形成したキャビティ３と、このキャビティ３の上端外部に連結するリング状の鍔４とによって構成されている。
また、配線板の貫通穴に勘合し回転防止や上下の挿入位置を安定化させるため前記の放熱性ＬＥＤ反射体１の柱状外部の一部に連結固定する突起物を設ける。 1 is a cylindrical heat dissipating LED reflector as a whole, and is a chip mounting portion disposed on the bottom surface of the cavity that is depressed above the heat dissipating reflector on which the LED chip is mounted ( Land) 2, a cavity 3 formed in a frame shape surrounding the LED chip mounting portion, and a ring-shaped flange 4 connected to the outside of the upper end of the cavity 3.
Further, in order to fit into the through hole of the wiring board and prevent rotation and stabilize the upper and lower insertion positions, a protrusion that is connected and fixed to a part of the columnar exterior of the heat-dissipating LED reflector 1 is provided.

この放熱性ＬＥＤ反射体１は１枚のアルミニュウム（Ａｌ）、Ａｌ合金、黄銅、銅、Ｎｉ、ステンレスなどからなる厚板（厚みが０．５〜３．０ｍｍ）の金属板を打ち抜き加工や絞り加工によって形成することにより、上記チップ搭載部２と、このＬＥＤチップ搭載部２を囲む枠状に形成したキャビティ３と、このキャビティ３の上端外部に連結する鍔４と、前記柱状ブロックであるＬＥＤ反射体１の柱状外部に連結固定する突起物とが１枚の金属板や金属の塊（ブロック）によって一体に形成される。   This heat-dissipating LED reflector 1 is formed by punching or drawing a thick metal plate (thickness 0.5 to 3.0 mm) made of a single aluminum (Al), Al alloy, brass, copper, Ni, stainless steel, etc. By forming by processing, the chip mounting portion 2, the cavity 3 formed in a frame shape surrounding the LED chip mounting portion 2, the flange 4 connected to the outside of the upper end of the cavity 3, and the LED which is the columnar block The protrusions connected and fixed to the columnar exterior of the reflector 1 are integrally formed by a single metal plate or metal block (block).

本発明の一例として、５．０ｍｍの金属板から金型で絞り加工して図１の斜視図で示すようなＬＥＤ反射体１を成形した。ＬＥＤチップが搭載されるチップ搭載部２ランドは、金型によるプレス絞り加工によって凹型に陥没している底面が平らなＬＥＤチップ搭載部２であり、この陥没しているＬＥＤチップ搭載部２から上部表面に向かって拡がって傾斜した（傾斜角度６０度）キャビティ３と、このキャビティ３の上端外部に設けた鍔４とからなる裁頭円錐台状を呈する空間が陥没して設けられている。   As an example of the present invention, an LED reflector 1 as shown in the perspective view of FIG. 1 was formed by drawing with a mold from a 5.0 mm metal plate. The chip mounting portion 2 land on which the LED chip is mounted is the LED chip mounting portion 2 having a flat bottom surface that has been recessed into a concave shape by press drawing with a die, and is located above the recessed LED chip mounting portion 2. A space having a truncated frustoconical shape composed of a cavity 3 that is inclined toward the surface and inclined (inclination angle 60 degrees) and a flange 4 provided outside the upper end of the cavity 3 is provided to be depressed.

この凹型に陥没しているキャビティ３が形成されたＬＥＤ反射体１の高さ（鍔４の下面からＬＥＤ反射体１の下端までの高さ）Ｔは挿入する配線板の板厚より高くする。また、このＴはプリント配線板の厚みとほぼ同一に形成することも良い。
なお、ＬＥＤ反射体１の製造方法としては、上述したように打ち抜き加工をした後に絞り加工をするようにしたが、絞り加工をしてから打ち抜き加工をするようにしてもよいし、絞り加工と打ち抜き加工とを同時にするようにしてもよい。 The height (the height from the lower surface of the ridge 4 to the lower end of the LED reflector 1) T of the LED reflector 1 in which the cavity 3 depressed in the concave shape is formed is higher than the thickness of the wiring board to be inserted. Further, this T may be formed substantially the same as the thickness of the printed wiring board.
In addition, as a manufacturing method of the LED reflector 1, the drawing process is performed after the punching process as described above. However, the drawing process may be performed after the drawing process. The punching process may be performed at the same time.

次に、図４を用いて本発明に係る大盤板プリント配線板にＬＥＤ素子を搭載した状態を説明する。
なお、同図において、大盤板の配線板１００の分割切断線（Ｘ、Ｙ）上に配置される側面端子用穴（本図では省略）とＬＥＤ反射体を挿入する貫通穴（本図では省略）を有する個別配線板１０が縦横に複数繋がる大盤板の配線板１００（本図では３段４列）であって、前記貫通穴に勘合し配線板より厚い金属柱状の反射体の陥没しているキャビティの底面にＬＥＤ素子を搭載し、前記ＬＥＤ素子と配線板の側面端子のパターンを金ワイヤーで電気的に接続する。
その後、ＬＥＤ素子と金ワイヤーとを封止樹脂３５でモールドされたＬＥＤが複数繋がる大盤板の配線板の分割切断線（Ｘ、Ｙ）で分割して個々のＬＥＤ装置に側面端子を形成するものである。 Next, the state where the LED element is mounted on the large board printed wiring board according to the present invention will be described with reference to FIG.
In this figure, side terminal holes (not shown in this figure) arranged on the dividing cutting lines (X, Y) of the wiring board 100 of the large board and through holes (not shown in this figure) for inserting LED reflectors are shown. ) Is a large board board 100 (three rows and four rows in this figure) that is connected to a plurality of vertical and horizontal individual wiring boards 10, which are fitted into the through holes and have a metal columnar reflector that is thicker than the wiring board. An LED element is mounted on the bottom surface of the cavity, and the LED element and the pattern of the side terminal of the wiring board are electrically connected by a gold wire.
After that, the LED element and the gold wire are divided by the divided cutting lines (X, Y) of the wiring board of the large board where a plurality of LEDs molded with the sealing resin 35 are connected to form the side terminals on the individual LED devices. It is.

次いで、図２に示すように、大盤板の配線板から分割切断線（Ｘ、Ｙ）で分割して個々のＬＥＤ装置に側面端子を形成したものである。
このＬＥＤ装置は反射体３１の陥没しているキャビティの底面にＬＥＤ素子３２を複数個搭載（本図では６個）し、これらＬＥＤ素子３２と配線板１０の側面端子３３とを金ワイヤー３４で電気的に接続する。前記のＬＥＤ素子３２と金ワイヤー３４と配線板１０の上面の一部を封止樹脂３５でモールドする。
本図においては、側面端子３３は配線板１０の各側面に３個づつ形成したものである。 Next, as shown in FIG. 2, the side terminals are formed on the individual LED devices by dividing from the wiring board of the large board by dividing cutting lines (X, Y).
In this LED device, a plurality of LED elements 32 are mounted on the bottom surface of the cavity in which the reflector 31 is depressed (six in this figure), and these LED elements 32 and the side terminals 33 of the wiring board 10 are connected by gold wires 34. Connect electrically. A part of the upper surface of the LED element 32, the gold wire 34 and the wiring board 10 is molded with a sealing resin 35.
In this figure, three side terminals 33 are formed on each side of the wiring board 10.

図３は、図２のＬＥＤ装置の断面図を示したものである。
同図に示すように、ＬＥＤ用のチップ搭載部のＬＥＤ素子３２と金ワイヤー３４とを封止する封止樹脂３５は発光光線を透過させる透明なモールド樹脂や発光色を白色光に変換させる白色変換モールド樹脂などのによって樹脂封止して１個単位としたＬＥＤ装置を形成する。
なお、１次モールド樹脂を硬化させた後、前記１次モールド樹脂の上面を被覆するように発光光線を集光または分光させるレンズモールド樹脂となる透明な２次モールド樹脂を凸型曲面状に被せると輝度向上が図られる。 FIG. 3 shows a cross-sectional view of the LED device of FIG.
As shown in the figure, the sealing resin 35 that seals the LED element 32 and the gold wire 34 of the LED chip mounting portion is a transparent mold resin that transmits the emitted light and a white color that converts the emitted color into white light. The LED device is formed as a single unit by resin sealing with a conversion mold resin or the like.
After the primary mold resin is cured, a transparent secondary mold resin, which becomes a lens mold resin that collects or separates the emitted light so as to cover the upper surface of the primary mold resin, is covered with a convex curved surface. The brightness is improved.

このＬＥＤ装置のＬＥＤ反射体１の下端部にＬＥＤ部品の筐体となる別途ヒートシンク筐体を取り付けることにより、ＬＥＤ素子３２からの発熱は、ＬＥＤ反射体１からヒートシンクを介してＬＥＤ装置の外部に放出される。このとき、ＬＥＤ素子３２が搭載されているＬＥＤ反射体１が金属ブロックによって形成されているため、ヒートブロックの厚みを所定の厚さ以上でかつ均一に形成することができるから放熱性がさらに向上する。   By attaching a separate heat sink housing as an LED component housing to the lower end of the LED reflector 1 of the LED device, heat generated from the LED element 32 is transferred from the LED reflector 1 to the outside of the LED device via the heat sink. Released. At this time, since the LED reflector 1 on which the LED element 32 is mounted is formed of a metal block, the heat block can be uniformly formed with a thickness equal to or greater than a predetermined thickness, further improving heat dissipation. To do.

本発明に係るＬＥＤ反射体の全体を示すを示す外観斜視図である。It is an external appearance perspective view which shows the whole LED reflector which concerns on this invention. 本発明に係るＬＥＤ装置を示す斜視図である。It is a perspective view which shows the LED device which concerns on this invention. 本発明に係るＬＥＤ装置を示す断面図である。It is sectional drawing which shows the LED device which concerns on this invention. 本発明に係るＬＥＤ用反射体を嵌入した状態を説明するための断面図である。It is sectional drawing for demonstrating the state which inserted the reflector for LED which concerns on this invention.

符号の説明Explanation of symbols

１…反射体、２…チップ搭載部、３…キャビティ、４…鍔、１０…配線板、
３１…反射体、３２…ＬＥＤ素子、３３…側面端子、３４…金ワイヤー、３５…封止樹脂 DESCRIPTION OF SYMBOLS 1 ... Reflector, 2 ... Chip mounting part, 3 ... Cavity, 4 ... 鍔, 10 ... Wiring board,
31 ... reflector, 32 ... LED element, 33 ... side terminal, 34 ... gold wire, 35 ... sealing resin

Claims (2)

大盤板の配線板の分割切断線上に配置される側面端子用穴とＬＥＤ反射体を挿入する貫通穴を有する個別配線板が複数繋がる大盤板の配線板と、前記貫通穴に勘合し配線板より厚い金属柱状の反射体と、該反射体の陥没しているキャビティの底面に搭載するＬＥＤ素子と、前記ＬＥＤ素子と配線板の側面端子を電気的に接続する金ワイヤーと、前記ＬＥＤ素子と金ワイヤーとを覆う封止樹脂とで構成されたＬＥＤが複数繋がる大盤板の配線板の分割切断線で分割して個々のＬＥＤ装置に側面端子を形成することを特徴とするＬＥＤ装置。 A wiring board of a large board in which a plurality of individual wiring boards having a through hole for inserting an LED reflector and a side terminal hole arranged on a divided cutting line of the wiring board of the large board are connected to the through hole and from the wiring board A thick metal columnar reflector, an LED element mounted on the bottom surface of the cavity in which the reflector is depressed, a gold wire that electrically connects the LED element and a side terminal of the wiring board, and the LED element and the gold An LED device characterized in that a side terminal is formed in each LED device by dividing it by dividing cutting lines of a wiring board of a large board where a plurality of LEDs composed of a sealing resin covering a wire are connected. 前記請求項１に記載したＬＥＤ装置において、一個の反射体のキャビティの底面に複数のＬＥＤ素子を搭載することを特徴とするＬＥＤ装置。 2. The LED device according to claim 1, wherein a plurality of LED elements are mounted on the bottom surface of the cavity of one reflector.
JP2005152268A 2005-05-25 2005-05-25 Led device having reflecting function Pending JP2006332234A (en)

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US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
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