JP2006324392A - Substrate for mounting light emitting element, package for storing light emitting element, light emitting device, and lighting system - Google Patents

Substrate for mounting light emitting element, package for storing light emitting element, light emitting device, and lighting system Download PDF

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JP2006324392A
JP2006324392A JP2005145214A JP2005145214A JP2006324392A JP 2006324392 A JP2006324392 A JP 2006324392A JP 2005145214 A JP2005145214 A JP 2005145214A JP 2005145214 A JP2005145214 A JP 2005145214A JP 2006324392 A JP2006324392 A JP 2006324392A
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light emitting
emitting element
light
conductor layer
mounting
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JP4659515B2 (en
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Atsushi Ogasawara
厚志 小笠原
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for mounting a light emitting element which hardly has warping deformation and hence can reduce the variation in radiant intensity, axial direction luminous intensity, brightness, color rendering property, etc. of a light emitting device; and also to provide a package for storing the light emitting element, light emitting device, and lighting system using the same. <P>SOLUTION: In the substrate 1 for mounting the light emitting element, a mounting pad 3 to which an electrode of the light emitting element 6 is electrically connected is formed on the upper principal plane and a conductor layer 4 is formed on the lower principal plane, and a connection conductor 5 for electrically connecting the mounting pad 3 and the conductor layer 4 is also formed. The conductor layer 4 is surrounded by a metal layer 40 partitioned into a plurality of portions by slit-like portions 41 wherein the metal layer 40 does not exist. Since the conductor layer 4 and the metal layer 40 are partitioned into small areas, the substrate 1 for mounting the light emitting element hardly has warping deformation and thereby heat can be transmitted efficiently to an external electric circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子から発せられる光を蛍光体で波長変換し外部に放射する発光装置，照明装置およびその発光素子収納用パッケージ，発光素子搭載用基板に関する。   The present invention relates to a light-emitting device, a lighting device, a light-emitting element storage package, and a light-emitting element-mounting substrate that converts the wavelength of light emitted from the light-emitting element with a phosphor and emits the light outside.

従来の発光ダイオード（ＬＥＤ）等の発光素子16から発せられる光を反射部材12で反射させて発光させる発光装置を図７に示す。図７において、発光装置は、上側主面の中央部に発光素子16を載置するための搭載部11ａを有し、搭載部11ａおよびその周辺に発光素子16のアノード電極およびカソード電極がそれぞれ電気的に接続される第一の実装用パッド13ａと第二の実装用パッド13ｂとが形成されるとともに、発光装置の外側面に第一の導体層14ａと第二の導体層14ｂとが形成され、第一の接続導体15ａを介して第一の実装用パッド13ａと第一の導体層14ａとが電気的に接続され、第二の接続導体15ｂを介して第二の実装用パッド13ｂと第二の導体層14ｂとが電気的に接続されてなる配線導体が形成された絶縁体からなる発光素子搭載用基板11と、発光素子搭載用基板11の上側主面の外周部に接着固定され、上側開口が下側開口より大きい貫通孔12ａが形成されているとともに、内周面が発光素子16が発する光を反射する反射面12ｂとされている枠状の反射部材12と、搭載部11ａに載置固定された発光素子16とから主に構成されている。   FIG. 7 shows a light emitting device that reflects light emitted from a light emitting element 16 such as a conventional light emitting diode (LED) by a reflecting member 12 to emit light. In FIG. 7, the light emitting device has a mounting portion 11a for mounting the light emitting element 16 at the center of the upper main surface, and the anode electrode and the cathode electrode of the light emitting element 16 are electrically connected to the mounting portion 11a and the periphery thereof. The first mounting pad 13a and the second mounting pad 13b that are connected to each other are formed, and the first conductor layer 14a and the second conductor layer 14b are formed on the outer surface of the light emitting device. The first mounting pad 13a and the first conductor layer 14a are electrically connected through the first connecting conductor 15a, and the second mounting pad 13b and the first mounting layer 15a are connected through the second connecting conductor 15b. A light emitting element mounting substrate 11 made of an insulator in which a wiring conductor formed by electrically connecting the two conductor layers 14b is formed, and bonded and fixed to the outer peripheral portion of the upper main surface of the light emitting element mounting substrate 11, A through hole 12a is formed with the upper opening larger than the lower opening, The peripheral surface is mainly composed of a frame-like reflecting member 12 having a reflecting surface 12b for reflecting light emitted from the light emitting element 16, and a light emitting element 16 mounted and fixed on the mounting portion 11a.

発光素子搭載用基板11は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックスから成る。発光素子搭載用基板11の上側主面に第一の実装用パッド13ａと第二の実装用パッド13ｂとが、発光素子搭載用基板11の下側主面に第一の導体層14ａと第二の導体層14ｂとがタングステン（Ｗ），モリブデン（Ｍｏ），マンガン（Ｍｎ）等から成る金属ペーストを高温で焼成して形成される。第一の接続導体15ａと第二の接続導体15ｂとは、発光素子搭載用基板11と成るセラミックグリーンシートに貫通孔を設けるとともにこの貫通孔にＷ，Ｍｏ−Ｍｎ等から成る金属ペーストを充填し高温で焼成することによって形成される、または、発光素子搭載用基板11の側面にＷ，Ｍｏ，Ｍｎ等から成る金属ペーストを帯状に塗布し高温で焼成することによって形成される。   The light emitting element mounting substrate 11 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic. The first mounting pad 13a and the second mounting pad 13b are disposed on the upper main surface of the light emitting element mounting substrate 11, and the first conductor layer 14a and the second mounting pad 13b are disposed on the lower main surface of the light emitting element mounting substrate 11. The conductive layer 14b is formed by baking a metal paste made of tungsten (W), molybdenum (Mo), manganese (Mn), or the like at a high temperature. The first connection conductor 15a and the second connection conductor 15b are provided with a through hole in the ceramic green sheet which is the light emitting element mounting substrate 11, and filled with a metal paste made of W, Mo—Mn, or the like. It is formed by baking at a high temperature, or is formed by applying a metal paste made of W, Mo, Mn or the like on the side surface of the light emitting element mounting substrate 11 in a strip shape and baking at a high temperature.

発光素子搭載用基板11に第一の実装用パッド13ａと第二の実装用パッド13ｂ、および第一の導体層14ａと第二の導体層14ｂとを形成するには、セラミックグリーンシート上に、またはセラミック原料粉末にポリビニルアルコール等のバインダを添加混合するとともにこれを所定形状にプレス成形して得られる生セラミック成形体上に、Ｗ，Ｍｏ，Ｍｎ等から成る金属ペーストをスクリーン印刷法等により印刷塗布し、更にそれを高温で焼成することで得られる。焼成の際に、印刷塗布された金属ペーストは、金属ペースト中の金属粒子の表面同士が融着することで焼結し、第一の実装用パッド13ａと第二の実装用パッド13ｂ、および第一の導体層14ａと第二の導体層14ｂとして金属化される。   In order to form the first mounting pad 13a and the second mounting pad 13b, and the first conductor layer 14a and the second conductor layer 14b on the light emitting element mounting substrate 11, on the ceramic green sheet, Alternatively, a metal paste composed of W, Mo, Mn, etc. is printed on a raw ceramic molded body obtained by adding a binder such as polyvinyl alcohol to the ceramic raw material powder and pressing it into a predetermined shape by screen printing or the like. It is obtained by applying and baking it at a high temperature. During firing, the metal paste printed and applied is sintered by fusing the surfaces of the metal particles in the metal paste to each other, and the first mounting pad 13a, the second mounting pad 13b, and the first mounting pad Metallized as one conductor layer 14a and second conductor layer 14b.

また、反射部材12は、上側開口が下側開口より大きい貫通孔12ａが形成されるとともに内周面に光を反射する反射面12ｂが形成された枠状のものである。反射部材12は、具体的には、アルミニウム（Ａｌ）やＦｅ−Ｎｉ−コバルト（Ｃｏ）合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。   The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than a lower opening is formed and a reflecting surface 12b for reflecting light is formed on an inner peripheral surface. Specifically, the reflecting member 12 is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is processed by cutting, die molding or extrusion. It is formed by a molding technique such as molding.

更に、反射部材12の反射面12ｂは、貫通孔12ａの内周面を平滑化することにより、あるいは、貫通孔12ａの内周面にＡｌ等の金属を蒸着法やメッキ法により被着することにより形成される。そして、反射部材12は、半田，銀（Ａｇ）ロウ等のロウ材または樹脂接着材等の接合材により、搭載部11ａを反射部材12の内周面で取り囲むように発光素子搭載用基板11の上側主面に接合される。   Further, the reflecting surface 12b of the reflecting member 12 is formed by smoothing the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by. Then, the reflecting member 12 is formed of the light emitting element mounting substrate 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 by a solder, a brazing material such as silver (Ag) brazing, or a bonding material such as a resin adhesive. It is joined to the upper main surface.

そして、搭載部11ａおよびその周辺に配置した第一の実装用パッド13ａと第二の実装用パッド13ｂと発光素子16の電極とをボンディングワイヤや金属ボール等の電気的接続手段17を介して電気的に接続することで発光装置となし得る（例えば、特許文献１参照）。   Then, the first mounting pad 13a, the second mounting pad 13b, and the electrode of the light emitting element 16 disposed on the mounting portion 11a and the periphery thereof are electrically connected via an electrical connection means 17 such as a bonding wire or a metal ball. By connecting them to each other, a light emitting device can be obtained (for example, see Patent Document 1).

または、配線導体と発光素子16とをボンディングワイヤや金属ボール等の電気的接続手段17を介して電気的に接続した後、蛍光体を含有するエポキシ樹脂やシリコーン樹脂等の透光性部材をディスペンサー等の注入機で発光素子を覆うように反射部材の内側に注入し、オーブンで熱硬化させることで、発光素子16からの光を蛍光体により長波長側に波長変換させて、所望の波長スペクトルを有する光を取り出せる発光装置となし得る（例えば、特許文献２参照）。   Alternatively, after electrically connecting the wiring conductor and the light emitting element 16 via an electrical connecting means 17 such as a bonding wire or a metal ball, a translucent member such as an epoxy resin or a silicone resin containing a phosphor is dispensed. It is injected inside the reflecting member so as to cover the light emitting element with an injection machine such as a thermometer, and is thermally cured in an oven, so that the wavelength of light from the light emitting element 16 is converted to the longer wavelength side by a phosphor, and a desired wavelength spectrum is obtained. A light emitting device capable of extracting light having a light intensity can be obtained (see, for example, Patent Document 2).

このようにして作製された発光装置は、発光素子搭載用基板11の下側主面に形成された第一の導体層14ａおよび第二の導体層14ｂを外部電気回路基板のそれぞれの配線に半田やＡｇエポキシ等の導電性接着材によって、機械的かつ電気的に接続させることによって、発光装置として作動することとなる。   In the light emitting device thus manufactured, the first conductor layer 14a and the second conductor layer 14b formed on the lower main surface of the light emitting element mounting substrate 11 are soldered to the respective wirings of the external electric circuit board. By being mechanically and electrically connected by a conductive adhesive such as Ag or epoxy, the light emitting device is operated.

そして、近年、上記の発光装置を照明用として利用する動きが増加しており、放射強度、放熱特性のよい発光装置が要求されている。
特開2004−289106号公報 特開2003−37298号公報 特開平３−178195号公報 In recent years, there has been an increase in the use of the above light-emitting device for illumination, and a light-emitting device with good radiation intensity and heat dissipation characteristics is required.
JP 2004-289106 A Japanese Patent Laid-Open No. 2003-37298 Japanese Patent Laid-Open No. 3-178195

しかしながら、上記の発光装置に用いられる発光素子搭載用基板11においては、発光素子16の搭載部11ａに形成された第一の実装用パッド13ａおよび第二の実装用パッド13ｂが発光素子16の発する光を吸収してしまうという性質があり、照明用として利用する場合、発光装置の光の放射強度を大きなものとするために、第一の実装用パッド13ａおよび第二の実装用パッド13ｂのそれぞれの形成面積を最小限に抑える必要があった。   However, in the light emitting element mounting substrate 11 used in the light emitting device, the light emitting element 16 emits the first mounting pad 13a and the second mounting pad 13b formed on the mounting portion 11a of the light emitting element 16. Each of the first mounting pad 13a and the second mounting pad 13b has a property of absorbing light, and when used for illumination, in order to increase the light emission intensity of the light emitting device. It was necessary to minimize the formation area.

一方で、発光装置から発生する熱を外部電気回路基板に効率よく放散させ、発光素子16が温度上昇して放射強度が低下してしまうのを防止するため、発光装置を外部電気回路基板に広面積で接着固定させ、これによって発光素子搭載用基板11から外部電気回路基板への熱伝導を良好にする目的で、発光素子搭載用基板11の下側主面に形成された第一の導体層14ａおよび第二の導体層14ｂはそれぞれその形成面積を最大限とするのが好ましい。   On the other hand, in order to efficiently dissipate heat generated from the light emitting device to the external electric circuit board and prevent the light emitting element 16 from rising in temperature and reducing the radiation intensity, the light emitting device is spread over the external electric circuit board. The first conductor layer formed on the lower main surface of the light emitting element mounting substrate 11 for the purpose of improving the heat conduction from the light emitting element mounting substrate 11 to the external electric circuit board by bonding and fixing by area It is preferable that the formation area of each of the 14a and the second conductor layer 14b is maximized.

発光素子搭載用基板11に形成された第一の実装用パッド13ａおよび第二の実装用パッド13ｂ、ならびに第一の導体層14ａおよび第二の導体層14ｂが焼成されメタライズ層となる際、第一の実装用パッド13ａおよび第二の実装用パッド13ｂ、ならびに第一の導体層14ａおよび第二の導体層14ｂは、それぞれ体積収縮するのであるが、上記したように発光素子搭載用基板11の上側主面に形成される第一の実装用パッド13ａおよび第二の実装用パッド13ｂの形成面積を最小限とし、発光素子搭載用基板11の下側主面に形成される第一の導体層14ａおよび第二の導体層14ｂの形成面積を最大限とすれば、発光素子搭載用基板11の上下主面間でメタライズ層の形成面積が大きく異なるため、発光素子搭載用基板11の上下主面間で体積収縮量が異なって、発光素子搭載用基板11に反り変形が生じてしまう場合があった。   When the first mounting pad 13a and the second mounting pad 13b formed on the light emitting element mounting substrate 11 and the first conductor layer 14a and the second conductor layer 14b are baked to form a metallized layer, The one mounting pad 13a and the second mounting pad 13b, and the first conductor layer 14a and the second conductor layer 14b are contracted in volume, respectively. The first conductor layer formed on the lower main surface of the light emitting element mounting substrate 11 with the formation area of the first mounting pad 13a and the second mounting pad 13b formed on the upper main surface being minimized. If the formation area of 14a and the second conductor layer 14b is maximized, the formation area of the metallization layer differs greatly between the upper and lower main surfaces of the light emitting element mounting substrate 11, so that the upper and lower main surfaces of the light emitting element mounting substrate 11 The volume shrinkage differs between the two, and the light emitting element is mounted In some cases, warpage deformation occurs in the substrate 11 for use.

特に、近時においては、発光装置から発生する熱を外部電気回路基板に更に効率よく放散させるため、発光素子搭載用基板11が薄形化する傾向にあり、発光素子搭載用基板11が大きく反り易くなってきた。   In particular, recently, in order to dissipate heat generated from the light emitting device to the external electric circuit board more efficiently, the light emitting element mounting board 11 tends to be thinned, and the light emitting element mounting board 11 is greatly warped. It has become easier.

その結果、発光素子搭載用基板11の下側主面を外部電気回路基板に全面で接触させるように固定するのが困難となり、発光装置から発生する熱を外部電気回路基板に効率よく放散させるのが困難となる。そして、発光素子16の発する熱を効率よく放散させることが困難となり、発光素子16の発光特性が劣化したり、発光装置の放射強度が低下したりするとともに、軸上光度、輝度、演色性等が発光装置ごとにばらついたり、色むらや強度むらが生じたりするという問題点が発生していた。   As a result, it becomes difficult to fix the lower main surface of the light emitting element mounting substrate 11 so as to be in contact with the entire surface of the external electric circuit board, and heat generated from the light emitting device can be efficiently dissipated to the external electric circuit board. It becomes difficult. And it becomes difficult to efficiently dissipate the heat generated by the light emitting element 16, the light emitting characteristics of the light emitting element 16 deteriorate, the radiant intensity of the light emitting device decreases, and the on-axis luminous intensity, luminance, color rendering, etc. However, there has been a problem that the light-emitting device varies from one light-emitting device to another, and color unevenness and intensity unevenness occur.

セラミック基板の反り変形を小さいものとする方法としては、セラミック基板の上下主面に同形状、同面積のメタライズ層を形成する構成が提案されているが（例えば、特許文献３参照）、発光素子搭載用基板11においてこの構成を採用すると、上記のように第一の実装用パッド13ａおよび第二の実装用パッド13ｂの面積も増えることとなり、発光装置の放射強度および放熱特性が低下してしまうため、採用するのが甚だ困難であった。   As a method for reducing warpage deformation of a ceramic substrate, a structure in which a metallized layer having the same shape and the same area is formed on the upper and lower main surfaces of the ceramic substrate has been proposed (see, for example, Patent Document 3). When this configuration is adopted in the mounting substrate 11, the areas of the first mounting pad 13a and the second mounting pad 13b are increased as described above, and the radiation intensity and heat dissipation characteristics of the light emitting device are reduced. Therefore, it was very difficult to adopt.

従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、反り変形が生じにくく、そのために発光装置の放射強度や軸上光度、輝度、演色性等のばらつきを低減させることが可能な発光素子搭載用基板、およびこれを用いた発光素子収納用パッケージ，発光装置および照明装置を提供することである。   Therefore, the present invention has been completed in view of the above-described conventional problems, and its purpose is to prevent warping deformation, and for this reason, variations in the radiant intensity, on-axis luminous intensity, luminance, color rendering, etc. of the light emitting device. A light-emitting element mounting substrate that can be reduced, and a light-emitting element storage package, a light-emitting device, and a lighting device using the same.

本発明の発光素子搭載用基板は、上側主面に発光素子の電極が電気的に接続される実装用パッドが形成されるとともに、下側主面に導体層が形成され、且つ前記実装用パッドと前記導体層とを電気的に接続するための接続導体が形成されて成る発光素子搭載用基板において、前記導体層は、スリット状の非形成部によって区画された複数個の金属層に取り囲まれていることを特徴とする。   In the light emitting element mounting substrate of the present invention, a mounting pad to which an electrode of the light emitting element is electrically connected is formed on the upper main surface, a conductor layer is formed on the lower main surface, and the mounting pad In the light emitting element mounting substrate formed with a connection conductor for electrically connecting the conductor layer and the conductor layer, the conductor layer is surrounded by a plurality of metal layers defined by slit-shaped non-formation portions. It is characterized by.

本発明の発光素子収納用パッケージは、上記構成の発光素子搭載用基板の上側主面に、前記発光素子を取り囲むように取着され、内周面が光反射面とされた枠状の反射部材を具備していることを特徴とする。   The light emitting element storage package of the present invention is attached to the upper main surface of the light emitting element mounting substrate having the above structure so as to surround the light emitting element, and a frame-like reflecting member having an inner peripheral surface as a light reflecting surface. It is characterized by comprising.

本発明の発光装置は、上記構成の発光素子収納用パッケージと、前記実装用パッドに電気的に接続された前記発光素子とを具備していることを特徴とする。   A light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration and the light-emitting element electrically connected to the mounting pad.

本発明の照明装置は、上記構成の発光装置を光源として用いたことを特徴とする。   The illumination device of the present invention is characterized in that the light emitting device having the above structure is used as a light source.

本発明の発光素子搭載用基板は、上側主面に発光素子の電極が電気的に接続される実装用パッドが形成されるとともに、下側主面に導体層が形成され、且つ実装用パッドと導体層とを電気的に接続するための接続導体が形成されて成り、導体層は、スリット状の非形成部によって区画された複数個の金属層に取り囲まれていることから、上側主面に小面積の実装用パッドを形成することで、実装用パッドが発光素子の発する光を吸収してしまうのを最小限に抑えるとともに、下側主面には比較的小面積の導体層およびこの導体層を取り囲むようにスリット状の非形成部によって区画された複数個の金属層を形成し、この導体層および金属層を外部電気回路基板に広面積で機械的に接着固定させることによって、発光素子の発する熱を外部電気回路基板に効率よく放散させることができ、発光素子が温度上昇するのを防止し、発光装置の放射強度を高い状態に維持することができる。   In the light emitting element mounting substrate of the present invention, a mounting pad for electrically connecting the electrode of the light emitting element is formed on the upper main surface, a conductor layer is formed on the lower main surface, and the mounting pad and A connection conductor for electrically connecting the conductor layer is formed, and the conductor layer is surrounded by a plurality of metal layers partitioned by slit-shaped non-forming portions, so that the upper main surface By forming the mounting pad with a small area, it is possible to minimize the mounting pad from absorbing the light emitted from the light emitting element, and the lower main surface has a relatively small area conductor layer and this conductor. A plurality of metal layers partitioned by slit-shaped non-forming portions are formed so as to surround the layers, and the conductor layer and the metal layer are mechanically bonded and fixed to an external electric circuit board in a wide area, thereby producing a light emitting device Heat generated by external electricity It is possible to efficiently dissipate the road substrate, the light emitting element is prevented from rising temperature, it is possible to maintain the emission intensity of the light emitting device high.

すなわち、下側主面の金属層はスリット状の非形成部によって複数個の小領域に区画され、実質的には小面積の導体層および金属層が複数集まった状態となるため、発光素子搭載用基板に形成された実装用パッド，導体層および金属層が焼成されてメタライズ層となる際、実装用パッドと導体層と金属層とがそれぞれ体積収縮しても、それぞれの体積収縮量は少なく、発光素子搭載用基板の上下主面で体積収縮量が大きく異なることによって、発光素子搭載用基板に大きな反り変形が生じてしまうのを有効に防止することができる。   In other words, the metal layer on the lower main surface is partitioned into a plurality of small regions by slit-shaped non-forming portions, and a plurality of small-area conductor layers and metal layers are substantially gathered, so that the light-emitting element mounting When the mounting pad, conductor layer, and metal layer formed on the mounting substrate are baked to form a metallized layer, the volume shrinkage of each of the mounting pad, conductor layer, and metal layer is small even if the mounting pad, conductor layer, and metal layer shrink. Since the volume shrinkage is greatly different between the upper and lower main surfaces of the light emitting element mounting substrate, it is possible to effectively prevent the warp deformation from occurring in the light emitting element mounting substrate.

その結果、発光素子搭載用基板を平坦なものとすることができ、発光素子搭載用基板の下側主面を外部電気回路基板の配線に密着させた状態で、発光装置を外部電気回路基板に機械的に固定させることができ、発光素子から発生する熱を外部電気回路基板に効率よく放散させることができる。   As a result, the light emitting element mounting substrate can be flattened, and the light emitting device is mounted on the external electric circuit board with the lower main surface of the light emitting element mounting substrate being in close contact with the wiring of the external electric circuit board. It can be fixed mechanically, and heat generated from the light emitting element can be efficiently dissipated to the external electric circuit board.

本発明の発光素子収納用パッケージは、上記構成の発光素子搭載用基板の上側主面に、発光素子を取り囲むように取着され、内周面が光反射面とされた枠状の反射部材を具備していることから、発光素子搭載用基板において発光素子の発する熱を外部電気回路基板に効率よく放散させるとともに、反射部材によって輝度の高い発光装置とすることができる。そして、発光素子の発光特性を安定なものとし、発光素子収納用パッケージが発する光の放射強度を高めることができ、発光装置の軸上光度、輝度、演色性等がばらついたり、色むらや強度むらが生じたりするのを有効に防止することができる。   The light emitting element storage package of the present invention includes a frame-shaped reflecting member attached to the upper main surface of the light emitting element mounting substrate having the above-described structure so as to surround the light emitting element and having an inner peripheral surface as a light reflecting surface. Accordingly, the heat generated by the light emitting element in the light emitting element mounting substrate can be efficiently dissipated to the external electric circuit board, and the light emitting device having high luminance can be obtained by the reflecting member. In addition, the light emitting characteristics of the light emitting element can be stabilized, the radiation intensity of the light emitted from the light emitting element storage package can be increased, the on-axis luminous intensity, luminance, color rendering, etc. of the light emitting device can vary, and color unevenness and intensity Unevenness can be effectively prevented.

本発明の発光装置は、上記構成の発光素子収納用パッケージと、実装用パッドに接続された発光素子とを具備していることから、放射強度や軸上光度，輝度，演色性等の光特性に優れた発光装置となり得る。   Since the light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration and the light-emitting element connected to the mounting pad, the light characteristics such as radiation intensity, axial luminous intensity, luminance, and color rendering properties are provided. It can be a light emitting device excellent in.

本発明の照明装置は、上記構成の発光装置を光源として用いたことから、これらの発光装置の周囲に任意の形状に光学設計した反射具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射する照明装置とすることができる。   Since the lighting device of the present invention uses the light emitting device having the above configuration as a light source, by installing a reflector, an optical lens, a light diffusing plate, and the like optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of arbitrary light distribution.

本発明の発光素子搭載用基板，発光素子収納用パッケージ，発光装置および照明装置について以下に詳細に説明する。図１に本発明の発光装置の実施の形態の一例を示す。図１（ａ）は本発明の発光装置の実施の形態の一例を示す断面図、図１（ｂ）は図１（ａ）の発光装置に用いられる発光素子搭載用基板の下面図である。同図において、１は発光素子搭載用基板、１ａは発光素子６が載置される発光素子搭載用基板１の搭載部、２は反射部材、３は実装用パッド（３ａは第一の実装用パッド，３ｂは第二の実装用パッド）、４は導体層（４ａは第一の導体層，４ｂは第二の導体層）、40は金属層（40ａは第一の金属層，40ｂは第二の金属層）、５は接続導体（５ａは第一の接続導体，５ｂは第二の接続導体）、６は発光素子、７は電気的接続手段であり、主としてこれらで発光素子６から発せられる光が方向性をもって外部に放射される発光装置が構成される。なお、図１（ｂ）において、導体層４および金属層40にクロスハッチングを付しているが、これは図をわかりやすくするためのものであり、断面を示すものではない。   The light emitting element mounting substrate, the light emitting element storage package, the light emitting device, and the lighting device of the present invention will be described in detail below. FIG. 1 shows an example of an embodiment of a light emitting device of the present invention. FIG. 1A is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention, and FIG. 1B is a bottom view of a light emitting element mounting substrate used in the light emitting device of FIG. In the figure, 1 is a light emitting element mounting substrate, 1a is a mounting portion of a light emitting element mounting substrate 1 on which a light emitting element 6 is mounted, 2 is a reflective member, 3 is a mounting pad (3a is a first mounting board) 4 is a conductor layer (4a is a first conductor layer, 4b is a second conductor layer), 40 is a metal layer (40a is a first metal layer, and 40b is a second conductor layer). (Second metal layer), 5 is a connection conductor (5a is a first connection conductor, 5b is a second connection conductor), 6 is a light emitting element, and 7 is an electrical connection means. A light emitting device is configured in which emitted light is radiated to the outside with directionality. In FIG. 1B, the conductor layer 4 and the metal layer 40 are cross-hatched, but this is for easy understanding of the drawing and does not show a cross section.

本発明の発光素子搭載用基板１は、発光素子６の搭載部１ａに発光素子６の電極が電気的に接続される実装用パッド３が上側主面に形成されるとともに、下側主面に導体層４が形成され、且つ実装用パッド３と導体層４とを電気的に接続するための接続導体５が形成されて成り、導体層４は、スリット状の非形成部41によって区画された複数個の金属層40に取り囲まれている。   In the light emitting element mounting substrate 1 of the present invention, a mounting pad 3 for electrically connecting the electrode of the light emitting element 6 to the mounting portion 1a of the light emitting element 6 is formed on the upper main surface, and on the lower main surface. A conductor layer 4 is formed, and a connection conductor 5 for electrically connecting the mounting pad 3 and the conductor layer 4 is formed. The conductor layer 4 is partitioned by a slit-shaped non-forming portion 41. Surrounded by a plurality of metal layers 40.

本発明の発光素子収納用パッケージは、上記構成の発光素子搭載用基板１の上側主面の外周部に、発光素子６を収容するための貫通孔２ａを有するとともに、貫通孔２ａの内周面が光反射面２ｂとされた枠状の反射部材２が発光素子６を取り囲むように接合されているものである。   The light emitting element storage package of the present invention has a through hole 2a for accommodating the light emitting element 6 on the outer peripheral portion of the upper main surface of the light emitting element mounting substrate 1 having the above configuration, and an inner peripheral surface of the through hole 2a. A frame-shaped reflecting member 2 having a light reflecting surface 2 b is joined so as to surround the light emitting element 6.

本発明の発光装置は、上記構成の発光素子収納用パッケージと、搭載部１ａに搭載されるとともに実装用パッド３に電気的に接続された発光素子６とを具備しているものである。   The light-emitting device of the present invention includes the light-emitting element storage package having the above structure and the light-emitting element 6 mounted on the mounting portion 1a and electrically connected to the mounting pad 3.

本発明の照明装置は、上記構成の発光装置を光源として用いるものである。   The lighting device of the present invention uses the light emitting device having the above structure as a light source.

本発明における発光素子搭載用基板１は、アルミナセラミックスや窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックスから成り、平面視形状が円形状，楕円形状，多角形状等の板状のものである。また、発光素子搭載用基板１の上側主面は発光素子６を載置する搭載部１ａを有している。搭載部１ａまたはその周辺には発光素子６のアノード電極およびカソード電極がそれぞれ電気的に接続される第一の実装用パッド３ａと第二の実装用パッド３ｂとが形成されているとともに、下側主面に第一の導体層４ａと第二の導体層４ｂおよびこれら第一の導体層４ａを取り囲むようにスリット状の非形成部41ａを介して第一の金属層40ａと第二の導体層４ｂを取り囲むようにスリット状の非形成部41ｂを介して第二の金属層40ｂとが形成され、第一の接続導体５ａを介して第一の実装用パッド３ａと第一の導体層４ａとが電気的に接続され、第二の接続導体５ｂを介して第二の実装用パッド３ｂと第二の導体層４ｂとが電気的に接続されている。   The light-emitting element mounting substrate 1 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered body, mullite sintered body, glass ceramics, etc., and has a plan view with a circular shape, an elliptical shape, a polygonal shape, etc. It is a shape. The upper main surface of the light emitting element mounting substrate 1 has a mounting portion 1a on which the light emitting element 6 is placed. A first mounting pad 3a and a second mounting pad 3b to which the anode electrode and the cathode electrode of the light emitting element 6 are respectively electrically connected are formed on the mounting portion 1a or its periphery, and the lower side The first metal layer 40a and the second conductor layer are disposed on the main surface through the slit-shaped non-forming portion 41a so as to surround the first conductor layer 4a and the second conductor layer 4b and the first conductor layer 4a. A second metal layer 40b is formed through a slit-shaped non-forming portion 41b so as to surround 4b, and the first mounting pad 3a and the first conductor layer 4a are formed through the first connection conductor 5a. Are electrically connected, and the second mounting pad 3b and the second conductor layer 4b are electrically connected via the second connection conductor 5b.

なお、複数の金属層40および導体層４の間に比較的長いスリット状の非形成部41が設けられていることが重要であり、第一の金属層40ａ同士および/または第一の金属層40ａと第一の導体層４ａならびに第二の金属層40ｂ同士および/または第二の金属層40ｂと第二の導体層４ｂとは、その一部分で接続されていても接続されていなくてもよい。また、複数の金属層40および導体層４はそれぞれ同じ形状とする必要はなく、例えば、導体層４が金属層40のそれぞれの大きさよりも大きいものであっても小さいものであってもよい。また、図１（ｂ）においては、第一の導体層４ａおよび第一の金属層40ａと第二の導体層４ｂおよび第二の金属層40ｂとは左右対称に同じ面積で形成されているが、左右非対称に形成されてもよい。   It is important that a relatively long slit-shaped non-formed portion 41 is provided between the plurality of metal layers 40 and the conductor layer 4, and the first metal layers 40a and / or the first metal layers 40a and the first conductor layer 4a and the second metal layer 40b and / or the second metal layer 40b and the second conductor layer 4b may be connected or not connected at a part thereof. . Further, the plurality of metal layers 40 and the conductor layer 4 do not need to have the same shape. For example, the conductor layer 4 may be larger or smaller than each size of the metal layer 40. In FIG. 1B, the first conductor layer 4a and the first metal layer 40a and the second conductor layer 4b and the second metal layer 40b are formed in the same area symmetrically. Alternatively, it may be asymmetrical.

また、発光素子搭載用基板１の下側主面が接着固定される外部電気回路基板の表面に、第一の導体層４ａおよび第一の金属層40ａを覆う広い面積の第一の電極と、第二の導体層４ｂおよび第二の金属層40ｂを覆う広い面積の第二の電極とを形成し、これら第一の電極と第一の導体層４ａおよび第一の金属層40ａとを、および第二の電極と第二の導体層４ｂおよび第二の金属層４ｂとをロウ付けすれば、結局、第一の導体層４ａと第一の金属層40ａおよび第二の導体層４ｂと第二の金属層40ｂとは電気的にも接続された状態になる。なお、外部電気回路基板の表面にこのような広い面積の第一の電極および第二の電極を形成せず、それぞれを個別に接着固定しても、もちろん問題はない。   Further, a first electrode having a large area covering the first conductor layer 4a and the first metal layer 40a on the surface of the external electric circuit substrate to which the lower main surface of the light emitting element mounting substrate 1 is bonded and fixed; Forming a second electrode having a large area covering the second conductor layer 4b and the second metal layer 40b, the first electrode, the first conductor layer 4a and the first metal layer 40a, and If the second electrode, the second conductor layer 4b, and the second metal layer 4b are brazed, the first conductor layer 4a, the first metal layer 40a, the second conductor layer 4b, The metal layer 40b is also electrically connected. Of course, there is no problem even if the first electrode and the second electrode having such a large area are not formed on the surface of the external electric circuit board, and they are individually bonded and fixed.

発光素子搭載用基板１の上側主面に形成された第一の実装用パッド３ａと第二の実装用パッド３ｂ、発光素子搭載用基板１の下側主面に形成された第一の導体層４ａと第二の導体層４ｂ、第一の金属層40ａと第二の金属層40ｂとは、それぞれの部位となるセラミックグリーンシート表面にＷ，Ｍｏ，Ｍｎ等から成る金属ペーストをスクリーン印刷法等により印刷塗布し、これらセラミックグリーンシートを積層した後に更に高温で焼成して形成される。第一の接続導体５ａと第二の接続導体５ｂは、発光素子搭載用基板１と成るセラミックグリーンシートを積層した後に貫通孔を設けるとともにこの貫通孔にＷ，Ｍｏ−Ｍｎ等から成る金属ペーストを充填し高温で焼成することによって形成される。または、発光素子搭載用基板１の外周側面にＷ，Ｍｏ，Ｍｎ等から成る金属ペーストを帯状に塗布し高温で焼成することによって形成される。   The first mounting pad 3a and the second mounting pad 3b formed on the upper main surface of the light emitting element mounting substrate 1, and the first conductor layer formed on the lower main surface of the light emitting element mounting substrate 1 4a and the second conductor layer 4b, and the first metal layer 40a and the second metal layer 40b are made by screen printing using a metal paste made of W, Mo, Mn or the like on the surface of the ceramic green sheet as the respective parts. After printing and coating by laminating these ceramic green sheets, they are formed by firing at a higher temperature. The first connection conductor 5a and the second connection conductor 5b are provided with a through hole after laminating ceramic green sheets to be the light emitting element mounting substrate 1, and a metal paste made of W, Mo-Mn or the like is provided in the through hole. It is formed by filling and firing at high temperature. Or it forms by apply | coating the metal paste which consists of W, Mo, Mn etc. to a strip | belt shape on the outer peripheral side surface of the light emitting element mounting substrate 1, and baking at high temperature.

なお、第一の接続導体５ａおよび第二の接続導体５ｂは、図１のように発光素子搭載用基板１の上側主面から下側主面にかけて垂直に形成され、第一の実装用パッド３ａおよび第二の実装用パッド３ｂの直下に形成された第一の導体層４ａおよび第二の導体層４ｂに接続されるが、これら実装用パッド３および導体層４の接続は、複数本の第一の接続導体５ａおよび第二の接続導体５ｂによってもよい。また、発光素子６の下面面積と同じ程度の太い第一の接続導体５ａおよび第二の接続導体５ｂとしてもよい。このようにすることにより、発光素子６の発する熱が、金属製の第一の接続導体５ａおよび第二の接続導体５ｂによって下側主面の導体層４に効率よく伝導される。   The first connection conductor 5a and the second connection conductor 5b are formed vertically from the upper main surface to the lower main surface of the light emitting element mounting substrate 1 as shown in FIG. 1, and the first mounting pad 3a. The first conductor layer 4a and the second conductor layer 4b formed immediately below the second mounting pad 3b are connected to the first and second conductor layers 4a and 4b. One connection conductor 5a and second connection conductor 5b may be used. Moreover, it is good also as the 1st connection conductor 5a and the 2nd connection conductor 5b which are the same extent as the lower surface area of the light emitting element 6. FIG. By doing in this way, the heat which the light emitting element 6 emits is efficiently conducted to the conductor layer 4 on the lower main surface by the metal first connecting conductor 5a and the second connecting conductor 5b.

また、発光素子搭載用基板１の上側主面に近い内層に第一および第二の内層接続導体を設け、それぞれの内層接続導体を経由させて第一の接続導体５ａおよび第二の接続導体５ｂを形成してもよい。この場合、内層接続導体に対して発光素子搭載用基板１の下側主面側の第一の接続導体５ａおよび第二の接続導体５ｂの本数を多くすると、金属製の第一の接続導体５ａおよび第二の接続導体５ｂによって、発光素子６の発する熱が、下側主面の導体層４に効率よく伝導される。また、発光素子搭載用基板１の内部の内層接続導体で導体を引き回した後に、下側主面の任意の位置に形成された導体層４に電気的に接続する方法を用いてもよい。   In addition, first and second inner layer connection conductors are provided on the inner layer near the upper main surface of the light emitting element mounting substrate 1, and the first connection conductor 5a and the second connection conductor 5b are routed through the inner layer connection conductors. May be formed. In this case, if the number of the first connection conductors 5a and the second connection conductors 5b on the lower main surface side of the light emitting element mounting substrate 1 is increased with respect to the inner layer connection conductor, the first connection conductor 5a made of metal. The heat generated by the light emitting element 6 is efficiently conducted to the conductor layer 4 on the lower main surface by the second connection conductor 5b. Alternatively, a method of electrically connecting the conductor layer 4 formed at an arbitrary position on the lower main surface after the conductor is routed by the inner layer connection conductor inside the light emitting element mounting substrate 1 may be used.

または、発光素子搭載用基板１に第一の実装用パッド３ａと第二の実装用パッド３ｂ、第一の金属層40ａと第二の金属層40ｂ、第一の導体層４ａと第二の導体層４ｂとおよび第一の接続導体５ａと第二の接続導体５ｂとを形成する方法としては、セラミック原料粉末にポリビニルアルコール等のバインダを添加混合するとともにこれを所定形状にプレス成形して得られる生セラミック成形体上に、Ｗ，Ｍｏ，Ｍｎ等から成る金属ペーストをスクリーン印刷法等により印刷塗布し、更にそれを高温で焼成する。焼成の際に、印刷塗布された金属ペーストは、金属ペースト中の金属粒子の表面同士が融着することで焼結し、第一の実装用パッド３ａと第二の実装用パッド３ｂ、第一の金属層40ａと第二の金属層40ｂ、第一の導体層４ａと第二の導体層４ｂおよび第一の接続導体５ａと第二の接続導体５ｂとして金属化され、それぞれメタライズ層となる。   Alternatively, the first mounting pad 3a and the second mounting pad 3b, the first metal layer 40a and the second metal layer 40b, the first conductor layer 4a and the second conductor are formed on the light emitting element mounting substrate 1. As a method of forming the layer 4b, the first connection conductor 5a, and the second connection conductor 5b, a ceramic raw material powder is added and mixed with a binder such as polyvinyl alcohol, and is pressed into a predetermined shape. A metal paste made of W, Mo, Mn or the like is printed and applied onto the green ceramic formed body by a screen printing method or the like, and further fired at a high temperature. During firing, the metal paste printed and applied is sintered by fusing the surfaces of the metal particles in the metal paste to each other, and the first mounting pad 3a, the second mounting pad 3b, The metal layer 40a and the second metal layer 40b, the first conductor layer 4a and the second conductor layer 4b, and the first connection conductor 5a and the second connection conductor 5b are metallized to form metallized layers, respectively.

このように搭載部１ａの上面に形成され発光素子６の電極が半田等の電気的接続手段を介して電気的に接続される第一の実装用パッド３ａと第二の実装用パッド３ｂとが、第一の接続導体５ａと第二の接続導体５ｂとを介して発光装置の外表面の第一の導体層４ａと第二の導体層４ｂとに導出されて外部電気回路基板に接続されることにより、発光素子６と外部電気回路とが電気的に接続されることとなる。   Thus, the first mounting pad 3a and the second mounting pad 3b, which are formed on the upper surface of the mounting portion 1a and to which the electrodes of the light emitting element 6 are electrically connected via electrical connection means such as solder, are provided. The first and second conductor layers 4a and 4b on the outer surface of the light emitting device are led to the external electric circuit board through the first and second connection conductors 5a and 5b. As a result, the light emitting element 6 and the external electric circuit are electrically connected.

発光素子６の電極を第一の実装用パッド３ａと第二の実装用パッド３ｂに接続する方法としては、ワイヤボンディングを介して接続する方法、または、発光素子６の下面で半田バンプ等の電気的接続手段７により接続するフリップチップボンディング方式を用いた方法等が用いられる。好ましくは、フリップチップボンディング方式により接続するのがよい。これにより、第一の実装用パッド３ａと第二の実装用パッド３ｂとを発光素子６の直下に小さい面積で設けることができるため、発光素子６の周辺の発光素子搭載用基板１の上側主面に第一の実装用パッド３ａと第二の実装用パッド３ｂとを設けるためのスペースを設ける必要がなくなる。よって、発光素子６の発する光がこの発光素子搭載用基板１の第一の実装用パッド３ａと第二の実装用パッド３ｂとで吸収されて軸上光度が低下するのを抑制するとともに光の放射強度を大きなものとすることができる。   As a method of connecting the electrode of the light emitting element 6 to the first mounting pad 3a and the second mounting pad 3b, a method of connecting via wire bonding, or an electrical connection such as a solder bump on the lower surface of the light emitting element 6 is possible. For example, a method using a flip chip bonding method in which connection is made by the general connection means 7 is used. Preferably, the connection is made by a flip chip bonding method. As a result, the first mounting pad 3a and the second mounting pad 3b can be provided in a small area directly under the light emitting element 6, so that the upper main pad 1 of the light emitting element mounting substrate 1 around the light emitting element 6 can be provided. It is not necessary to provide a space for providing the first mounting pad 3a and the second mounting pad 3b on the surface. Therefore, the light emitted from the light emitting element 6 is absorbed by the first mounting pad 3a and the second mounting pad 3b of the light emitting element mounting substrate 1 to suppress the reduction of the on-axis luminous intensity and the light emission. The radiation intensity can be increased.

また、発光素子搭載用基板１の下側主面に形成される第一の導体層４ａと第二の導体層４ｂ、第一の金属層40ａと第二の金属層40ｂの面積は、第一の実装用パッド３ａと第二の実装用パッド３ｂの面積よりも広い面積で形成される。このように、発光素子搭載用基板１の下側主面に形成された導体層４と金属層４0とを、実装用パッド３より大きな形成面積とすることで、発光装置を外部電気回路基板に広面積で機械的に接着固定させることができる。   The areas of the first conductor layer 4a and the second conductor layer 4b, the first metal layer 40a and the second metal layer 40b formed on the lower main surface of the light emitting element mounting substrate 1 are as follows. The mounting pad 3a and the second mounting pad 3b are formed in an area larger than the area. In this way, the conductive layer 4 and the metal layer 40 formed on the lower main surface of the light emitting element mounting substrate 1 are formed to have a larger area than the mounting pad 3, thereby making the light emitting device an external electric circuit substrate. It can be mechanically bonded and fixed over a large area.

よって、上側主面の搭載部１ａに小面積で第一の実装用パッド３ａと第二の実装用パッド３ｂとを形成することで、第一の実装用パッド３ａと第二の実装用パッド３ｂとが発光素子６の発する光を吸収してしまうのを最小限に抑えるとともに、下側主面に大面積で第一の導体層４ａと第一の金属層40ａおよび第二の導体層４ｂと第二の金属層40ｂとを形成し、発光素子搭載用基板１を外部電気回路基板に広面積で機械的に接着固定させ、発光素子６から発生する熱を外部電気回路基板に効率よく放散させることができ、発光素子６が温度上昇するのを防止し、放射強度を高い状態に維持することができるとともに、外部電気回路基板に強固に固着させることができる。   Therefore, the first mounting pad 3a and the second mounting pad 3b are formed by forming the first mounting pad 3a and the second mounting pad 3b in a small area on the mounting portion 1a on the upper main surface. And the first conductor layer 4a, the first metal layer 40a, and the second conductor layer 4b having a large area on the lower main surface, The second metal layer 40b is formed, and the light emitting element mounting substrate 1 is mechanically bonded and fixed to the external electric circuit board in a wide area, and the heat generated from the light emitting element 6 is efficiently dissipated to the external electric circuit board. Thus, the temperature of the light emitting element 6 can be prevented from rising, the radiation intensity can be maintained at a high level, and the light emitting element 6 can be firmly fixed to the external electric circuit board.

また、導体層４（第一の導体層４ａと第二の導体層４ｂ）は、スリット状の非形成部41（第一の非形成部41ａと第二の非形成部41ｂ）によって区画された複数個の金属層40（第一の金属層40ａと第二の金属層40ｂ）に取り囲まれている。この構成により、下側主面の導体層４および金属層40は、スリット状の非形成部41によって複数個の金属層40および導体層４に分割され、実質的には小面積の導体層４および金属層40が複数集まった状態となるため、発光素子搭載用基板１に形成された実装用パッド３、導体層４および金属層40が焼成されメタライズ層となる際、実装用パッド３と導体層４と金属層40とがそれぞれ体積収縮しても、それぞれの体積収縮量は少なく、発光素子搭載用基板１の上下主面で体積収縮量が大きく異なることがない。このため、発光素子搭載用基板１に大きな反り変形が生じてしまうのを有効に防止することができる。また、非形成部41の形状は、スリット状に形成すればよく、小面積であることにより、導体層４および金属層40の面積を最大限大きくとることができ、発光素子６から発生する熱を導体層４および金属層40から外部電気回路基板へ効率よく伝えることが可能となる。   The conductor layer 4 (the first conductor layer 4a and the second conductor layer 4b) was partitioned by the slit-shaped non-formed part 41 (the first non-formed part 41a and the second non-formed part 41b). Surrounded by a plurality of metal layers 40 (first metal layer 40a and second metal layer 40b). With this configuration, the conductor layer 4 and the metal layer 40 on the lower main surface are divided into a plurality of metal layers 40 and the conductor layer 4 by the slit-shaped non-forming portions 41, and the conductor layer 4 having a small area is substantially obtained. In addition, since a plurality of metal layers 40 are gathered, when the mounting pad 3, the conductor layer 4 and the metal layer 40 formed on the light emitting element mounting substrate 1 are baked to become a metallized layer, the mounting pad 3 and the conductor Even if the layer 4 and the metal layer 40 are contracted in volume, the volume contraction amount of each of the layers 4 and the metal layer 40 is small. For this reason, it can prevent effectively that a big curvature deformation | transformation arises in the light emitting element mounting substrate 1. FIG. Further, the non-formation part 41 may be formed in a slit shape, and since the area is small, the areas of the conductor layer 4 and the metal layer 40 can be maximized, and heat generated from the light emitting element 6 can be obtained. Can be efficiently transmitted from the conductor layer 4 and the metal layer 40 to the external electric circuit board.

その結果、発光素子搭載用基板１を平坦なものとすることができ、発光素子搭載用基板１の下側主面を外部電気回路基板の配線に密着させた状態で、発光装置を外部電気回路基板に機械的に固定させることができ、発光素子６から発生する熱を外部電気回路基板に効率よく放散させることができる。   As a result, the light emitting element mounting substrate 1 can be flattened, and the light emitting device can be connected to the external electric circuit with the lower main surface of the light emitting element mounting substrate 1 being in close contact with the wiring of the external electric circuit board. It can be mechanically fixed to the substrate, and heat generated from the light emitting element 6 can be efficiently dissipated to the external electric circuit substrate.

なお、非形成部41の幅は、好ましくは、0.1ｍｍ以上とし、かつ発光素子搭載用基板１に占める非形成部41の面積が20％以下に成るようにするのがよい。この構成により、導体層４と金属層40との合計面積が充分なものとなり、発光素子６から発生する熱を導体層４および金属層40から外部電気回路基板へ極めて効率よく伝えることが可能となる。メタライズ層と成るＷ，Ｍｏ，Ｍｎ等から成る金属ペーストをスクリーン印刷法等により印刷塗布する際に金属ペーストが滲むのであるが、非形成部41の幅が0.1ｍｍ未満であると、金属ペーストが滲むことによって非形成部41を形成するのが困難となる傾向がある。また、発光素子搭載用基板１に占める非形成部41の面積が20％を超えて大きくなると、導体層４と金属層40との合計面積が小さくなり、発光素子６から発生する熱を導体層４および金属層40から外部電気回路基板へ効率よく伝えにくくなるため不都合である。   The width of the non-forming portion 41 is preferably 0.1 mm or more, and the area of the non-forming portion 41 in the light emitting element mounting substrate 1 is 20% or less. With this configuration, the total area of the conductor layer 4 and the metal layer 40 becomes sufficient, and heat generated from the light emitting element 6 can be transferred from the conductor layer 4 and the metal layer 40 to the external electric circuit board very efficiently. Become. When a metal paste made of W, Mo, Mn, or the like that becomes a metallized layer is printed and applied by a screen printing method or the like, the metal paste bleeds. If the width of the non-forming portion 41 is less than 0.1 mm, the metal paste It tends to be difficult to form the non-forming portion 41 by bleeding. Further, when the area of the non-formation portion 41 occupying the light emitting element mounting substrate 1 exceeds 20%, the total area of the conductor layer 4 and the metal layer 40 decreases, and the heat generated from the light emitting element 6 is transferred to the conductor layer. 4 and the metal layer 40 are inconvenient because it is difficult to transmit efficiently to the external electric circuit board.

また、図１（ｂ）において、導体層４および金属層40の平面視形状は四角形状であるが、これに限定されることはなく、種々の形状とすることができる。例えば、図２に示すように、円弧状であってもよいし、三角形等の種々の多角形状としてもよい。なお、図２において、導体層４および金属層40にクロスハッチングを付しているが、これは図をわかりやすくするためのものであり、断面を示すものではない。   Further, in FIG. 1B, the planar view shape of the conductor layer 4 and the metal layer 40 is a square shape, but is not limited to this, and can be various shapes. For example, as shown in FIG. 2, it may be arcuate or various polygonal shapes such as triangles. In FIG. 2, the conductor layer 4 and the metal layer 40 are cross-hatched, but this is for easy understanding of the drawing and does not show a cross section.

好ましくは、導体層４および金属層40を、正三角形状，正方形状，正六角形状で敷き詰めるように形成すると、非形成部41の面積を最小としつつ導体層４および金属層40の面積を最大にすることができ、発光素子搭載用基板１の下側主面全体の反り変形量を小さくすることができる。導体層４および金属層40は、小さく区画されることによって、それぞれの大きさを小さくする方が、発光素子搭載用基板１の反り変形量を小さくすることができるが、一方で非形成部41の面積比率が大きくなり、発光素子搭載用基板１の放熱性や機械的接合力は小さくなる。従って、発光素子搭載用基板１に求められる平坦度に応じて、適度にバランスさせた大きさとするのがよい。   Preferably, when the conductor layer 4 and the metal layer 40 are formed so as to be spread in a regular triangle shape, a square shape, or a regular hexagon shape, the area of the conductor layer 4 and the metal layer 40 is maximized while the area of the non-forming portion 41 is minimized. The amount of warp deformation of the entire lower main surface of the light emitting element mounting substrate 1 can be reduced. The conductor layer 4 and the metal layer 40 are divided into small sections so that the amount of warpage deformation of the light emitting element mounting substrate 1 can be reduced by reducing the size of each of the conductor layer 4 and the metal layer 40. The area ratio of the light emitting element is increased, and the heat dissipation and mechanical bonding force of the light emitting element mounting substrate 1 are reduced. Accordingly, it is preferable that the size is appropriately balanced according to the flatness required for the light emitting element mounting substrate 1.

なお、実装用パッド３，導体層４および金属層40の露出する表面には、Ｎｉや金（Ａｕ）等の耐食性に優れる金属を１〜20μｍ程度の厚さで被着させておくのが良く、実装用パッド３，導体層４および金属層40の酸化腐食を有効に防止し得るともに、発光素子６の電極と実装用パッド３と、および導体層４または金属層40と外部電気回路基板の電極との接続を強固にし得る。従って、これらの露出表面には、例えば、厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのがより好ましい。   It should be noted that a metal having excellent corrosion resistance such as Ni or gold (Au) is preferably deposited on the exposed surfaces of the mounting pad 3, the conductor layer 4 and the metal layer 40 in a thickness of about 1 to 20 μm. In addition to effectively preventing oxidative corrosion of the mounting pad 3, the conductor layer 4 and the metal layer 40, the electrode of the light emitting element 6, the mounting pad 3, and the conductor layer 4 or the metal layer 40 and the external electric circuit board The connection with the electrode can be strengthened. Accordingly, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on these exposed surfaces by an electrolytic plating method or an electroless plating method. Is more preferable.

好ましくは、搭載部１ａは発光素子搭載用基板１の上側主面に突出する凸部の上面に形成されている（図示せず）のがよく、これにより、発光素子６から斜め下方に向けて発せられる光を反射部材２で反射させ易くすることができ、発光素子搭載用基板１の上側主面および反射部材２等で多重反射して光が吸収されるのを防止し、発光素子６から発せられる光の多くを発光装置の放射光に利用することができる。その結果、発光素子６の発光特性を最大限に引き出すことができ、軸上光度や輝度，演色性等の光特性に優れた発光装置とすることができる。   Preferably, the mounting portion 1a is formed (not shown) on the upper surface of a convex portion projecting from the upper main surface of the light emitting element mounting substrate 1, whereby the light emitting element 6 faces obliquely downward. The emitted light can be easily reflected by the reflecting member 2, and the light is prevented from being absorbed by multiple reflection on the upper main surface of the light emitting element mounting substrate 1 and the reflecting member 2. Much of the emitted light can be used for the emitted light of the light emitting device. As a result, the light emitting characteristics of the light emitting element 6 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

また、発光素子搭載用基板１の上側主面から突出する凸部とされた搭載部１ａにより、発光素子６を搭載部１ａに実装するのが容易となり、発光素子６を所望の位置に正確かつ容易に載置することができるという作用効果もある。   In addition, the mounting portion 1a formed as a convex portion protruding from the upper main surface of the light emitting element mounting substrate 1 makes it easy to mount the light emitting element 6 on the mounting portion 1a, and accurately and accurately place the light emitting element 6 at a desired position. There also exists an effect that it can mount easily.

この場合、搭載部１ａは、発光素子搭載用基板１の搭載部１ａの周囲を切削加工や機械研磨、ブラスト研磨等の手段で除去することによって、あるいは、金型成型やセラミックグリーンシートの積層法によって発光素子搭載用基板１と一体に形成することができる。または、発光素子搭載用基板１の上側主面に搭載部１ａとなる部材を接着剤等で接合してもよい。   In this case, the mounting portion 1a is formed by removing the periphery of the mounting portion 1a of the light-emitting element mounting substrate 1 by means of cutting, mechanical polishing, blast polishing, or the like, or by mold molding or ceramic green sheet laminating method. Thus, the light emitting element mounting substrate 1 can be formed integrally. Or you may join the member used as the mounting part 1a to the upper main surface of the light emitting element mounting substrate 1 with an adhesive agent.

また、発光素子搭載用基板１の上側主面には、反射部材２が半田，Ａｇロウ等のロウ材やエポキシ樹脂等の樹脂接着剤等の接合材により取着される。反射部材２は、中央部に貫通孔２ａが、その上方が外側に向かって傾斜面となるように形成されているとともに、貫通孔２ａの内周面が発光素子６が発する光や蛍光体が発する光等を反射する光反射面２ｂとされている。   In addition, the reflecting member 2 is attached to the upper main surface of the light emitting element mounting substrate 1 with a bonding material such as solder, a brazing material such as Ag brazing, or a resin adhesive such as epoxy resin. The reflection member 2 is formed with a through hole 2a in the center so that the upper side thereof becomes an inclined surface toward the outside, and light or phosphor emitted from the light emitting element 6 on the inner peripheral surface of the through hole 2a. The light reflecting surface 2b reflects the emitted light or the like.

反射部材２は、金属やセラミックス，樹脂等から成り、切削加工や金型成形等を行なうことにより形成される。更に、貫通孔２ａの内周面に形成される光反射面２ｂは、光を反射するものであれば特に限定されないが、より高い反射率とするために、貫通孔２ａの内周面を研磨したり、金型を押し付ける等によって平滑化したり、あるいは、貫通孔２ａの内周面に、例えば、メッキや蒸着等によりＡｌ，Ａｇ，Ａｕ，白金（Ｐｔ），チタン（Ｔｉ），クロム（Ｃｒ），Ｃｕ等の高反射率の金属薄膜層を形成することにより光反射面２ｂが形成される。   The reflecting member 2 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Further, the light reflecting surface 2b formed on the inner peripheral surface of the through hole 2a is not particularly limited as long as it reflects light, but the inner peripheral surface of the through hole 2a is polished in order to obtain a higher reflectance. Or smoothing by pressing a mold or the like, or by plating, vapor deposition, or the like on the inner peripheral surface of the through hole 2a, for example, Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr ), A light reflection surface 2b is formed by forming a metal thin film layer having a high reflectance such as Cu.

また、光反射面２ｂ表面の算術平均粗さＲａは0.004〜４μｍであるのが良く、これにより、光反射面２ｂが発光素子６や蛍光体の光を良好に反射し得る。Ｒａが４μｍを超えると、発光素子６の光を均一に反射させるのが困難となり、発光装置の内部で乱反射し易くなる。一方、0.004μｍ未満では、そのような面を安定かつ効率よく形成することが困難となる傾向にある。   The arithmetic average roughness Ra on the surface of the light reflecting surface 2b is preferably 0.004 to 4 μm, whereby the light reflecting surface 2b can favorably reflect the light from the light emitting element 6 and the phosphor. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 6, and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

光反射面２ｂは、例えば、縦断面形状が、上側に向かうにともなって外側に広がった図１（ａ）に示すような直線状の傾斜面、上側に向かうにともなって外側に広がった曲面状の傾斜面、あるいは直線を組み合わせて成り、上側に向かうにともなって外側に広がった折れ線状の面等の形状が挙げられる。また、平面視形状は、円形状，楕円形状，多角形状等の形状が挙げられる。   The light reflecting surface 2b is, for example, a linear inclined surface as shown in FIG. 1A that spreads outward as it goes upward, or a curved surface that spreads outward as it goes upward. Examples of the shape include a slanted surface, or a combination of straight lines, such as a polygonal surface that spreads outward as it goes upward. Moreover, examples of the shape in plan view include a circular shape, an elliptical shape, and a polygonal shape.

反射部材２は、発光素子搭載用基板１の上側主面の搭載部１ａ以外のどの部位に取着されてもよいが、発光素子６の周囲に所望の面精度、例えば、図１の発光装置の縦断面において、発光素子６を間に挟んで発光素子６の両側に設けられた光反射面２ｂが対称になっている状態で光反射面２ｂが設けられるように取着されるのがよい。発光素子６から横方向等に発せられた光や下方に発せられた光を光反射面２ｂで均一にむらなく反射させることができ、軸上光度および輝度更には演色性等を効果的に向上させることができる。   The reflecting member 2 may be attached to any part other than the mounting portion 1a on the upper main surface of the light emitting element mounting substrate 1, but has a desired surface accuracy around the light emitting element 6, for example, the light emitting device of FIG. In the vertical cross section, the light reflecting surface 2b is preferably attached so that the light reflecting surfaces 2b provided on both sides of the light emitting device 6 are symmetrical with the light emitting device 6 interposed therebetween. . The light emitted from the light emitting element 6 in the horizontal direction or the like can be reflected uniformly and uniformly by the light reflecting surface 2b, and the axial luminous intensity, luminance and color rendering properties are effectively improved. Can be made.

特に、反射部材２が搭載部１ａに近接しているほど上記の効果が顕著に現れる。これにより、搭載部１ａの周囲を反射部材２で取り囲むことによって、より多くの光を反射させることができ、より高い軸上光度を得ることが可能となる。   In particular, the closer the reflection member 2 is to the mounting portion 1a, the more prominent the above effect is. Accordingly, by surrounding the mounting portion 1a with the reflecting member 2, more light can be reflected, and a higher on-axis luminous intensity can be obtained.

そして、搭載部１ａの周辺に配置した第一の実装用パッド３ａと第二の実装用パッド３ｂと発光素子６の電極とをボンディングワイヤや金属ボール等の電気的接続手段７を介して電気的に接続することで発光装置となし得る。   Then, the first mounting pad 3a, the second mounting pad 3b, and the electrode of the light emitting element 6 disposed around the mounting portion 1a are electrically connected via an electrical connection means 7 such as a bonding wire or a metal ball. By connecting to, a light emitting device can be obtained.

または、第一の実装用パッド３ａと第二の実装用パッド３と発光素子６の電極とをボンディングワイヤや金属ボール等の電気的接続手段７を介して電気的に接続した後、蛍光体を含有するエポキシ樹脂やシリコーン樹脂等の透光性部材をディスペンサー等の注入機で発光素子６を覆うように反射部材２の内側に注入しオーブンで熱硬化させることで、発光素子６からの光を蛍光体により長波長側に波長変換し所望の波長スペクトルを有する光を取り出せる発光装置となし得る。   Alternatively, after the first mounting pad 3a, the second mounting pad 3 and the electrode of the light emitting element 6 are electrically connected through an electrical connection means 7 such as a bonding wire or a metal ball, the phosphor is A translucent member such as an epoxy resin or a silicone resin contained is injected inside the reflecting member 2 so as to cover the light emitting element 6 with an injection machine such as a dispenser, and is thermally cured in an oven. A light emitting device capable of extracting light having a desired wavelength spectrum by converting the wavelength to a longer wavelength side by using a phosphor can be obtained.

このようにして作製された発光装置は、発光素子搭載用基板１の下側主面に形成された第一の導体層４ａと第二の導体層４ｂとを外部電気回路基板の電極に半田やＡｇエポキシ等の導電性接着材によって、機械的かつ電気的に接続させることによって、発光装置として作動することとなる。   In the light emitting device thus manufactured, the first conductor layer 4a and the second conductor layer 4b formed on the lower main surface of the light emitting element mounting substrate 1 are soldered to the electrodes of the external electric circuit board. By being mechanically and electrically connected by a conductive adhesive such as Ag epoxy, the light emitting device is operated.

また、本発明の発光装置を、１個光源として用いることにより、または複数個を、例えば、格子状や千鳥状，放射状，円状や多角形状等の同心状等の所定の配置となるように配列させた光源として用いることにより、照明装置とすることができる。これにより本発明の照明装置は、発光ダイオード（ＬＥＤ）やレーザーダイオード（ＬＤ）その他発光する半導体から成る発光素子６による発光を利用しているため、従来の放電を用いた照明装置よりも低消費電力であり、長寿命とすることが可能であり、更に発熱の少ない小型の照明装置とすることができる。また、発光素子６から発せられる光の中心波長の変動を抑制することができ、長期間にわたり安定した放射強度かつ放射角度で光を放射することができるとともに、照射面における色むらや照度分布の偏りが少ない照明装置とすることができる。   Further, by using the light emitting device of the present invention as a single light source, or a plurality of the light emitting devices, for example, a predetermined arrangement such as a lattice shape, a staggered shape, a radial shape, a concentric shape such as a circular shape or a polygonal shape. By using it as an arrayed light source, a lighting device can be obtained. As a result, the lighting device of the present invention uses light emission by the light emitting element 6 made of a light emitting diode (LED), a laser diode (LD), or other semiconductor that emits light, and thus consumes less power than a conventional lighting device using discharge. It is electric power, can have a long life, and can be a small lighting device with little heat generation. In addition, fluctuations in the center wavelength of light emitted from the light emitting element 6 can be suppressed, light can be emitted at a stable radiation intensity and radiation angle over a long period of time, and color unevenness and illuminance distribution on the irradiated surface can be emitted. A lighting device with little bias can be obtained.

例えば、図３，図４に示す平面図，断面図のように複数個の本発明の発光装置101が発光装置駆動回路基板102に複数列に配置され、発光装置101の周囲に所要の形状に光学設計された反射具103が設置されて成る照明装置の場合、一列に配置された複数個の発光装置101の間に隣り合う列の発光装置101が配置された配置、いわゆる千鳥状配置とすることが好ましい。すなわち、発光装置101が格子状に配置される際には、光源となる発光装置101が直線上に配列されることによりグレアが強くなり、このような照明装置が人の視覚に入ってくることにより、不快感等を起こしやすくなるのに対し、千鳥状とすることにより、発光装置101がほぼ均等間隔で平面上に配置されるので、グレアが抑制され人間の目に対する不快感等を低減することができる。   For example, a plurality of light emitting devices 101 of the present invention are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of an illuminating device in which an optically designed reflector 103 is installed, an arrangement in which adjacent rows of light emitting devices 101 are arranged between a plurality of light emitting devices 101 arranged in a row, a so-called staggered arrangement. It is preferable. That is, when the light emitting devices 101 are arranged in a grid, glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. However, since the light emitting device 101 is arranged on the plane at almost equal intervals, the glare is suppressed and the discomfort to the human eye is reduced. be able to.

更に、発光装置101が直線上に配列される場合に比べ、隣り合う発光装置101間の距離が長くなることにより、隣接する発光装置101間の熱的な干渉が抑制され、発光装置101が実装された発光装置駆動回路基板102内における熱のこもりが抑制され、発光装置101の外部に効率よく熱が放散される。その結果、人の目に対しても不快感の少ない長期間にわたり光学特性の安定した長寿命の照明装置を作製することができる。   Further, compared to the case where the light emitting devices 101 are arranged on a straight line, the distance between the adjacent light emitting devices 101 is increased, so that thermal interference between the adjacent light emitting devices 101 is suppressed, and the light emitting device 101 is mounted. Thus, heat accumulation in the light emitting device driving circuit board 102 is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device having stable optical characteristics over a long period of time with less discomfort to human eyes.

また、照明装置が、図５，図６に示す平面図，断面図のような発光装置駆動回路基板102上に複数の発光装置101から成る円状や多角形状の発光装置101群を、同心状に複数群配列した照明装置の場合、１つの円状や多角形状の発光装置101群における発光装置101の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置101同士の間隔を適度に保ちながら発光装置101をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置101の密度を低くして発光装置駆動回路基板102の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基板102内における温度分布が一様となり、照明装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置101の温度上昇を抑制することができる。その結果、発光装置101は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。   Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device drive circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of the illuminating devices arranged in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side to the outer peripheral side of the illuminating device. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装，展示用照明器具、街路灯用照明器具、誘導灯器具および信号装置、舞台およびスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。   Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, and street lamp lighting fixtures that are used indoors and outdoors. , Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights , Electronic bulletin boards and the like, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

なお、本発明は以上の実施の形態の例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。   In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

例えば、放射強度の向上のために発光素子搭載用基板１に発光素子６が複数個載置されても良い。また光反射面２ｂの角度を任意に調整することも可能であり、これにより、補色域を設けることにより更に良好な演色性を得ることができる。   For example, a plurality of light emitting elements 6 may be mounted on the light emitting element mounting substrate 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the light reflecting surface 2b. Thereby, by providing a complementary color gamut, better color rendering can be obtained.

また、本発明の照明装置は、複数個の発光装置101を所定の配置となるように設置したものだけでなく、１個の発光装置101を所定の配置となるように設置したものでもよい。例えば、１個の発光装置101を照明装置の中央部に配置する。   Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement. For example, one light-emitting device 101 is disposed in the center of the lighting device.

（ａ）は本発明の発光装置の実施の形態の一例を示す断面図、（ｂ）は本発明の発光素子搭載用基板の実施の形態の一例を示す下面図である。(A) is sectional drawing which shows an example of embodiment of the light-emitting device of this invention, (b) is a bottom view which shows an example of embodiment of the light emitting element mounting substrate of this invention. 本発明の発光素子搭載用基板の実施の形態の他の例を示す下面図である。It is a bottom view which shows the other example of embodiment of the light emitting element mounting substrate of this invention. 本発明の照明装置の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図３の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図５の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 従来の発光装置の例を示す断面図である。It is sectional drawing which shows the example of the conventional light-emitting device.

符号の説明Explanation of symbols

１：発光素子搭載用基板
１ａ：搭載部
２：反射部材
２ｂ：光反射面
３：実装用パッド
３ａ：第一の実装用パッド
３ｂ：第二の実装用パッド
４：導体層
４ａ：第一の導体層
４ｂ：第二の導体層
５：接続導体
５ａ：第一の接続導体
５ｂ：第二の接続導体
６：発光素子
40：金属層
40ａ：第一の金属層
40ｂ：第二の金属層
41：非形成部
41ａ：第一の非形成部
41ｂ：第二の非形成部
101：発光装置
102：発光装置駆動回路基板
103：反射具 1: Light emitting element mounting substrate 1a: Mounting portion 2: Reflecting member 2b: Light reflecting surface 3: Mounting pad 3a: First mounting pad 3b: Second mounting pad 4: Conductive layer 4a: First Conductor layer 4b: second conductor layer 5: connection conductor 5a: first connection conductor 5b: second connection conductor 6: light emitting element
40: Metal layer
40a: first metal layer
40b: second metal layer
41: Non-formed part
41a: first non-forming part
41b: second non-forming part
101: Light-emitting device
102: Light-emitting device drive circuit board
103: Reflector

Claims (4)

上側主面に発光素子の電極が電気的に接続される実装用パッドが形成されるとともに、下側主面に導体層が形成され、且つ前記実装用パッドと前記導体層とを電気的に接続するための接続導体が形成されて成る発光素子搭載用基板において、前記導体層は、スリット状の非形成部によって区画された複数個の金属層に取り囲まれていることを特徴とする発光素子搭載用基板。 A mounting pad for electrically connecting the electrodes of the light emitting element is formed on the upper main surface, and a conductor layer is formed on the lower main surface, and the mounting pad and the conductor layer are electrically connected. A light-emitting element mounting substrate comprising a connection conductor for forming a light-emitting element, wherein the conductor layer is surrounded by a plurality of metal layers partitioned by slit-shaped non-forming portions Substrate. 請求項１記載の発光素子搭載用基板の上側主面に、前記発光素子を取り囲むように取着され、内周面が光反射面とされた枠状の反射部材を具備していることを特徴とする発光素子収納用パッケージ。 A light-emitting element mounting substrate according to claim 1, further comprising a frame-like reflecting member attached to the upper main surface so as to surround the light-emitting element and having an inner peripheral surface as a light reflecting surface. The light emitting element storage package. 請求項２記載の発光素子収納用パッケージと、前記実装用パッドに電気的に接続された前記発光素子とを具備していることを特徴とする発光装置。 A light emitting device comprising: the light emitting element storage package according to claim 2; and the light emitting element electrically connected to the mounting pad. 請求項３記載の発光装置を光源として用いたことを特徴とする照明装置。 An illumination device, wherein the light-emitting device according to claim 3 is used as a light source.
JP2005145214A 2005-05-18 2005-05-18 Light-emitting element mounting substrate, light-emitting element storage package, light-emitting device, and lighting device Expired - Fee Related JP4659515B2 (en)

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