JP4818028B2 - Light-emitting element mounting substrate, light-emitting element storage package, light-emitting device, and lighting device - Google Patents

Description

  The present invention relates to a light-emitting device that radiates light emitted from a light-emitting element to the outside, or a light-emitting device that radiates light emitted from a light-emitting element after being wavelength-converted by a phosphor and a light-emitting element storage package for a lighting device , A light-emitting element mounting substrate, and a light-emitting device and a lighting device.

  A conventional light emitting element storage package and light emitting device are shown in FIG.

  In FIG. 9, the light emitting element storage package has a mounting portion 11a for mounting the light emitting element 16 at the center of one main surface, and the anode electrode and cathode of the light emitting element 16 around the mounting portion 11a. A first mounting pad 13a and a second mounting pad 13b to which the electrodes are electrically connected are formed. A first conductor layer 14a and a second conductor layer 14b are formed on the outer surface of the light emitting element storage package, and the first mounting pad 13a and the first conductor are interposed via the first connection conductor 15a. The layer 14a is electrically connected, and the second mounting pad 13b and the second conductor layer 14b are electrically connected via the second connection conductor 15b. Then, the light emitting element mounting substrate 11 made of an insulator in which such a wiring conductor is formed, and the upper opening is larger than the lower opening, and is bonded and fixed to the outer peripheral portion of one main surface of the light emitting element mounting substrate 11. A hole 12a is formed, and a frame-like reflecting member 12 having an inner peripheral surface as a reflecting surface 12b for reflecting light emitted from the light emitting element 16 is provided.

  In the light emitting device, a light emitting element 16 such as a light emitting diode (LED) is mounted and fixed on the mounting portion 11a, and the light emitted from the light emitting element 16 is reflected by the reflecting member 12 and emitted to the outside of the light emitting device.

  The light emitting element mounting substrate 11 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic. The first mounting pad 13a, the second mounting pad 13b, the first conductor layer 14a, and the second conductor layer 14b are made of tungsten (W), molybdenum (Mo), manganese (Mn), or the like. It is formed by the metallized layer baked together.

  An electrical connection means such as a bonding wire or a metal ball for connecting the first mounting pad 13a, the second mounting pad 13b, and the electrode of the light emitting element 16 disposed on and around the mounting portion 11a of the light emitting element storage package. It can be set as a light emitting device by being electrically connected via 17 (see, for example, Patent Document 1).

  Alternatively, after the first mounting pad 13a, the second mounting pad 13b, the electrode of the light emitting element 16, and the light emitting element 16 are electrically connected through an electrical connecting means 17 such as a bonding wire or a metal ball. By injecting a translucent member such as an epoxy resin or a silicone resin containing a phosphor into the inside of the reflecting member so as to cover the light emitting device with an injection machine such as a dispenser, and thermosetting in an oven, the light emitting device 16 The light can be converted to a longer wavelength side by a phosphor to obtain a light emitting device that can extract light having a desired wavelength spectrum (see, for example, Patent Document 2).

  In the light emitting device thus manufactured, the first conductor layer 14a and the second conductor layer 14b formed on the other main surface of the light emitting element mounting substrate 11 are soldered to the respective wirings of the external electric circuit board. By connecting mechanically and electrically with a conductive adhesive such as Ag epoxy, the light emitting device operates.

In recent years, there has been an increase in the use of the above light-emitting device for illumination, and a light-emitting device with good radiation intensity and heat dissipation characteristics is required.
JP 2004-289106 A Japanese Patent Laid-Open No. 2003-37298 Japanese Patent Laid-Open No. 3-178195

  However, in the light emitting element mounting substrate 11 used in the light emitting device, the light emitting element 16 emits the first mounting pad 13a and the second mounting pad 13b formed on the mounting portion 11a of the light emitting element 16. In order to increase the radiation intensity of the light emitting device, it is necessary to minimize the formation area of each of the first mounting pad 13a and the second mounting pad 13b. was there.

  On the other hand, in order to efficiently dissipate heat generated from the light emitting device to the external electric circuit board and prevent the light emitting element 16 from rising in temperature and reducing the radiation intensity, the light emitting device is spread over the external electric circuit board. It is preferable that the area can be bonded and fixed. The first conductor layer 14a and the second conductor layer formed on the other main surface of the light emitting element mounting substrate 11 for the purpose of improving the heat conduction from the light emitting element mounting substrate 11 to the external electric circuit board. It is preferable that each of the 14b has a maximum formation area and can be bonded and fixed in a wide area. In order to bond and fix in a wide area, it is necessary that the warp deformation of the light emitting element mounting substrate 11 is controlled within a certain range.

  By the way, when the first mounting pad 13a and the second mounting pad 13b formed on the light emitting element mounting substrate 11, and the first conductor layer 14a and the second conductor layer 14b are baked to become a metallized layer. The first mounting pad 13a and the second mounting pad 13b, and the first conductor layer 14a and the second conductor layer 14b each contract in volume, but as described above, the light emitting element mounting substrate The first conductor formed on the other main surface of the light-emitting element mounting substrate 11 while minimizing the formation area of the first mounting pad 13a and the second mounting pad 13b formed on one main surface of the light emitting device 11. If the formation area of the layer 14a and the second conductor layer 14b is maximized, the formation area of the metallization layer differs greatly between the two main surfaces of the light emitting element mounting substrate 11, so The volume shrinkage differs between the faces, In some cases, the substrate 11 may be greatly warped and deformed.

  In particular, recently, in order to dissipate heat generated from the light emitting device to the external electric circuit board more efficiently, the light emitting element mounting board 11 tends to be thinned, and the light emitting element mounting board 11 is greatly warped. There is a tendency to become easy.

  As a result, it becomes difficult to fix the other main surface of the light emitting element mounting substrate 11 so as to be in contact with the external electric circuit board in a wide area, and heat generated from the light emitting device is efficiently dissipated to the external electric circuit board. It becomes difficult. Then, it becomes difficult to efficiently dissipate the heat generated by the light emitting element 16, the light emission characteristics of the light emitting element 16 deteriorate, the radiation intensity of the light emitting device decreases, and the on-axis luminous intensity, luminance, color rendering, etc. However, there has been a problem that the light-emitting device varies from one light-emitting device to another, and color unevenness and intensity unevenness occur.

  As a method for reducing the warpage deformation of the ceramic substrate within a certain range, a configuration in which metallized layers having the same shape and the same area are formed on both main surfaces of the ceramic substrate has been proposed (see, for example, Patent Document 3). ) If this structure is adopted in the light emitting element mounting substrate 11, the areas of the first mounting pad 13a and the second mounting pad 13b are increased as described above, and the radiation intensity and heat dissipation characteristics of the light emitting device are increased. It was very difficult to adopt because it would decrease.

Therefore, the present invention has been completed in view of the above-mentioned conventional problems, and the object thereof is to prevent warping deformation, and for this reason, variations in the radiation intensity, on-axis luminous intensity, luminance, color rendering, etc. of the light emitting device. A light-emitting element mounting substrate that can be reduced, and a light-emitting element storage package, a light-emitting device, and a lighting device using the same.

The light emitting element mounting substrate of the present invention includes an insulating substrate, a mounting pad formed on one main surface of the insulating substrate, to which electrodes of the light emitting element are electrically connected, and substantially the other main surface of the insulating substrate. A conductor layer formed over the entire surface, in which slit-shaped conductor non-formation portions are provided in a lattice shape, and disposed between the mounting pad and the conductor layer inside the insulating substrate; And an inner conductor layer formed so as to have substantially the same area, and a connection conductor that electrically connects the mounting pad and the conductor layer.

  In the light emitting element mounting substrate of the present invention, preferably, the connection conductor is provided on an outer peripheral portion of the insulating substrate.

  The light emitting element mounting substrate of the present invention is preferably characterized in that the inner conductor layer is formed in substantially the same pattern as the conductor layer.

  The light emitting element storage package of the present invention is mounted so that a frame-shaped reflecting member having an inner peripheral surface as a light reflecting surface surrounds the light emitting element mounting portion on one main surface of the light emitting element mounting substrate having the above-described configuration. It is characterized by being worn.

  A light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration and the light-emitting element electrically connected to the mounting pad.

  An illumination device of the present invention includes a light emitting device having the above-described configuration, a driving unit that includes the light emitting device and includes an electrical wiring that drives the light emitting device, and a light reflecting unit that reflects light emitted from the light emitting device. including.

  The light emitting element mounting substrate of the present invention includes an insulating substrate, a mounting pad formed on one main surface of the insulating substrate, to which an electrode of the light emitting element is electrically connected, and substantially the entire other main surface of the insulating substrate. A conductor layer formed between the mounting pad and the conductor layer inside the insulating substrate and facing the conductor layer so as to have substantially the same area, and for mounting Since the pad and the connection conductor for electrically connecting the conductor layer are provided, when the conductor layer and the inner conductor layer are fired to become a metallized layer, the conductor layer and the inner conductor layer are contracted in volume by substantially the same amount. Therefore, warpage deformation occurring in the insulating substrate located between the conductor layer and the inner conductor layer can be suppressed to a small level. Since the amount of warpage can be suppressed to a small value within a certain range, mountability is improved.

  On the other hand, the mounting pad formed on one main surface can have a small area, and light absorption by the mounting pad can be reduced.

  In the light emitting element mounting substrate of the present invention, preferably, the connection conductor is provided on the outer peripheral portion of the insulating substrate, so that the formation area of the connection conductor can be increased. Compared with the case where the connecting conductor to be connected is a through conductor, the electric resistance value can be lowered, and the loss due to the electric resistance can be suppressed between the conductor layer and the inner conductor layer. As a result, power can be efficiently supplied to the light emitting element from the external electric circuit board. In addition, it becomes possible to form a good meniscus of conductive adhesive between the connection conductor provided on the outer peripheral portion and the wiring of the external electric circuit board, so that the light emitting element mounting board is firmly attached to the external electric circuit board. Can be fixed.

Substrate for mounting a light-emitting element of the present invention, the electrically layer, since it has a slit-like nonconductive portion provided in a grid pattern and bonded via a conductive adhesive to the conductor layer to an external electric circuit board In this case, since the conductor layer is divided into each metal layer having a small area by the slit-shaped conductor non-forming portion, it is caused by the difference in thermal expansion between the insulating substrate acting through each metal layer and the conductive adhesive. Stress can be reduced. As a result, the occurrence of breakage such as cracks in the light emitting element mounting substrate can be suppressed.

  In the light emitting element mounting substrate of the present invention, preferably, since the inner conductor layer is formed in substantially the same pattern as the conductor layer, even when a slit-like conductor non-forming portion is provided in the conductor layer, The conductor layer and the inner conductor layer shrink in volume by the same amount, and the warpage deformation that occurs in the insulating substrate located between the conductor layer and the inner conductor layer can be suppressed. And it can suppress effectively that the curvature deformation as the whole light emitting element mounting substrate will arise.

  The light emitting element storage package of the present invention is attached to the main surface of the light emitting element mounting substrate having the above-described structure so that a frame-shaped reflecting member whose inner peripheral surface is a light reflecting surface surrounds the light emitting element mounting portion. Therefore, the heat generated by the light emitting element in the light emitting element mounting substrate can be efficiently dissipated to the external electric circuit board, and the light emitting device with high luminance can be obtained by the reflecting member. Then, the light emitting characteristics of the light emitting element can be made stable, the on-axis luminous intensity, luminance, color rendering, etc. of the light emitting device are not varied, and the color unevenness and intensity unevenness can be reduced.

  Since the light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration and the light-emitting element connected to the mounting pad, the light characteristics such as radiation intensity, axial luminous intensity, luminance, and color rendering properties are provided. The light emitting device can be made excellent.

  An illuminating device of the present invention includes a light emitting device having the above-described configuration, a drive unit on which the light emitting device is mounted and having an electrical wiring that drives the light emitting device, and a light reflecting unit that reflects light emitted from the light emitting device. Therefore, by installing light reflecting means such as an optical lens or a light diffusing plate that is optically designed in an arbitrary shape around these light emitting devices, an illuminating device that emits light of an arbitrary light distribution can be obtained. .

  The light emitting element mounting substrate, the light emitting element storage package, the light emitting device, and the lighting device of the present invention will be described in detail below.

A reference example of FIG. 1 two shot light device, showing another reference example of FIG. 2 two shots light device. 1 (a) is a cross-sectional view showing a reference example of light emission device, and FIG. 1 (b) is an exploded perspective view of the light-emitting element mounting substrate used in the light emitting device of FIGS. 1 (a) from the lower surface . The cross-sectional view, FIG. 2 (b) is an exploded perspective view of a light-emitting element mounting substrate used in the light emitting device is viewed from the lower surface side of FIGS. 2 (a) showing a reference example of FIG. 2 (a) emitting light device It is. FIG. 3A and FIG. 4 are exploded perspective views seen from the lower surface side of the light emitting element mounting substrate, showing an example of the embodiment of the light emitting element mounting substrate of the present invention . 3 (b) is an exploded perspective view seen from the lower surface side of the light-emitting element mounting substrate showing a reference example of a light-emitting element mounting substrate.

  In these drawings, 1 is an insulating substrate, 1a is a light emitting element mounting portion on which the light emitting element 6 is placed, 2 is a reflecting member, 3 is a mounting pad (3a is a first mounting pad, 3b is a second mounting pad) 4 is a conductor layer (4a is a first conductor layer, 4b is a second conductor layer), 41 is a conductor non-formation part (41a is a first conductor non-formation part, 41b is a second conductor) 5) is a connection conductor (5a is a first connection conductor, 5b is a second connection conductor), 6 is a light emitting element, 7 is an electrical connection means, 8 is an inner conductor layer (8a is a first connection conductor) The inner layer conductor layer 8b is a second inner layer conductor layer), and a light emitting device that mainly emits light emitted from the light emitting element 6 to the outside is configured. In FIG. 1 (b) and FIG. 2 (b), the conductor layer 4 and the inner conductor layer 8 are cross-hatched, but this is for easy understanding of the drawing and shows a cross section. is not.

  The substrate for mounting a light emitting element of the present invention includes an insulating substrate 1, a mounting pad 3 formed on one main surface of the insulating substrate 1 and electrically connected to the electrodes of the light emitting element 6, and the insulating substrate 1. The conductor layer 4 formed over almost the entire main surface, and is disposed between the mounting pad 3 and the conductor layer 4 inside the insulating substrate 1, and has substantially the same outer shape and area facing the conductor layer 4. It has an inner conductor layer 8 and a connection conductor 5 that electrically connects the mounting pad 3 and the conductor layer 4.

  In the light emitting element mounting substrate of the present invention, the connection conductor 5 that connects the conductor layer 4 and the inner conductor layer 8 is preferably realized by the side connection conductor 50 provided on the outer peripheral portion of the insulating substrate 1.

Substrate for mounting a light-emitting element of the present invention, the electrically layer 4, a slit-like nonconductive portion 41 by being arranged in grid-like conductor layer 4 is partitioned into a plurality of metal layers 40.

  In the light emitting element mounting substrate of the present invention, the inner conductor layer 8 is preferably formed in a pattern having substantially the same shape and area as the conductor layer 4. For example, when the conductor layer 4 is provided with the slit-shaped conductor non-forming portion 41 and divided into a plurality of metal layers 40, the inner-layer conductor layer 8 also has the same slit-shaped inner layer conductor non-forming portion 81. The inner metal layer 80 is provided in a symmetrical pattern with the same shape, area, and arrangement with the metal layer 40 of the conductor layer 4 and the dielectric of the insulating substrate 1 interposed therebetween.

  3A, 3B, and 4, each metal layer 40 or each inner metal layer 80 is an isolated shape that is not connected to each other by the conductor non-forming portion 41 or the inner-layer conductor non-forming portion 81. However, there is no problem even if each part has a shape connected by a conductor layer.

  The light emitting element storage package of the present invention has a through hole 2a for accommodating the light emitting element 6 on one main surface of the light emitting element mounting substrate having the above structure, and the inner peripheral surface of the through hole 2a is a light reflecting surface. The light-emitting element 6 is mounted so that the light-emitting element 6 is in focus so that the frame-shaped reflecting member 2 of 2b surrounds the light-emitting element mounting part 1a.

  The light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration and the light-emitting element 6 mounted on the light-emitting element mounting portion 1a and electrically connected to the mounting pad 3. .

  An illuminating device of the present invention includes a light emitting device having the above-described configuration, a drive unit on which the light emitting device is mounted and having an electrical wiring that drives the light emitting device, and a light reflecting unit that reflects light emitted from the light emitting device. .

  The insulating substrate 1 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered body, mullite sintered body, glass ceramics, etc., and has a plate-like shape such as a circular shape, an elliptical shape, or a polygonal shape in plan view. It is.

In addition, a light emitting element mounting portion 1a for mounting the light emitting element 6 is provided on one main surface of the insulating substrate 1, that is, the upper main surface in FIG. A first mounting pad 3a and a second mounting pad 3b, to which the anode electrode or the cathode electrode of the light emitting element 6 is electrically connected, are formed on or around the light emitting element mounting portion 1a. The first conductor layer 4a and the second conductor layer 4b are formed on the other main surface, and the first mounting pad 3a and the first conductor layer 4a are electrically connected via the first connection conductor 5a. The second mounting pad 3b and the second conductor layer 4b are electrically connected via the second connection conductor 5b.

  The conductor layer 4 is provided with a gap so that the first conductor layer 4a and the second conductor layer 4b are not electrically connected to each other, and is substantially the same as the other main surface of the insulating substrate 1, that is, the lower main surface of FIG. An inner layer conductor layer 8 formed over the entire surface and having substantially the same pattern as that of the conductor layer 4 between the mounting pad 3 and the conductor layer 4, that is, having substantially the same shape and area, is formed in the lower part of the insulating substrate 1. The conductive layer 4 is provided so as to overlap with the ceramic layer 1c. When the inner layer conductor layer 8 having substantially the same pattern as the conductor layer 4 is disposed, when the conductor layer 4 and the inner layer conductor layer 8 are fired to become a metallized layer, the conductor layer 4 and the inner layer conductor layer 8 are The volume shrinks by substantially the same amount, warpage deformation hardly occurs in the insulating substrate 1 positioned between the conductor layer 4 and the inner conductor layer 8, and large warpage deformation occurs in the entire light emitting element mounting substrate. You can avoid it.

  That the conductor layer 4 is formed on almost the entire other main surface of the insulating substrate 1 means that the conductor layer 4 is formed in an area of 0.8 times or more the total area of the other main surface of the insulating substrate 1.

  As a result, the mounting pad 3 formed on one main surface has a small area, and there is a difference in shrinkage due to the difference in the formation area of the metallized layer between the one main surface side and the other main surface side of the insulating substrate 1. However, the light emitting element mounting substrate can be controlled to be almost flat, for example, and the light emitting device can be externally attached with the other main surface of the light emitting element mounting substrate being in close contact with the wiring of the external electric circuit board. It can be mechanically fixed to the electric circuit board, and heat generated from the light emitting element 6 can be efficiently dissipated to the external electric circuit board.

  By the way, as shown in FIG. 1B or FIG. 2B, the inner conductor layer 8 is formed between the upper ceramic layer 1b and the lower ceramic layer 1c serving as the light emitting element mounting substrate. The adhesion strength between the upper ceramic layer 1b and the lower ceramic layer 1c may be reduced in the formation portion of the layer 8. Therefore, as shown in FIG. 1B or FIG. 2B, the upper ceramic layer is disposed between the outer peripheral ends of the first inner conductor layer 8a and the second inner conductor layer 8b and the outer peripheral end of the insulating substrate 1. It is preferable to provide a certain width in which 1b and the lower ceramic layer 1c are closely stacked without the inner conductor layer 8 interposed therebetween. For example, the distance of this width is preferably 0.1 mm or more. Thereby, the upper ceramic layer 1b and the lower ceramic layer 1c can be firmly adhered to each other at the respective outer peripheral portions, and a decrease in the adhesion strength between the upper ceramic layer 1b and the lower ceramic layer 1c can be prevented.

  The first inner conductor layer 8a and the second inner conductor layer 8b are electrically insulated from the first inner conductor layer 8a and the second inner conductor layer 8b, and the upper ceramic layer 1b and the lower inner conductor layer 8b are electrically insulated from each other. It is preferable to provide a gap, for example, a gap of 0.1 mm or more so that the ceramic layers 1c are closely stacked without interposing the inner conductor layer 8. As a result, the upper ceramic layer 1b and the lower ceramic layer 1c can be brought into close contact with each other at the portion where the metallized layer is not formed between the first inner conductor layer 8a and the second inner conductor layer 8b. And the lower ceramic layer 1c can be adhered and laminated more firmly.

  Furthermore, the area of the first inner layer conductor layer 8a and the second inner layer conductor layer 8b is preferably 0.8 times or more the area of the first conductor layer 4a and the second conductor layer 4b, respectively. That is, the inner conductor layer 8 has substantially the same pattern as the conductor layer 4. The inner conductor layer 8 has an outer shape similar to the outer shape of the conductor layer 4 and the area of the inner conductor layer 8 is the conductor layer. 4 is 0.8 times or more of the area of 4 or the area of the conductor layer 4 is 0.8 times or more of the area of the inner conductor layer 8. For example, when the conductor layer 4 is composed of a plurality of metal layers 40 partitioned by slit-like conductor non-forming portions 41 and the inner conductor layer 8 does not have slit-like inner layer conductor non-forming portions 81 formed therein, The area of the conductor layer 8 is wider than that of the conductor layer 4 by the area of the inner-layer conductor non-forming portion 81, but this difference may be within a range of 0.8 to 1.25 times each other.

  As a result, the volume shrinkage amounts of the first conductor layer 4a and the second conductor layer 4b, and the first inner conductor layer 8a and the second inner conductor layer 8b become substantially the same, and the conductor layer 4 and the inner conductor layer 8 It is possible to suppress the occurrence of a large warp deformation in the lower ceramic layer 1c positioned between and the light emitting element mounting substrate as a whole, so that the large warp deformation does not occur. When the areas of the first inner conductor layer 8a and the second inner conductor layer 8b are less than 0.8 times the areas of the first conductor layer 4a and the second conductor layer 4b, respectively, the first conductor layer 4a and The volume shrinkage of the second conductor layer 4b, the first inner layer conductor layer 8a, and the second inner layer conductor layer 8b tend to be greatly different, and a large warp deformation occurs as the entire light emitting element mounting substrate. There is a case. Further, in order to prevent warping deformation, the inner conductor layer 8 and the conductor layer 4 are arranged substantially in parallel.

  Further, the thickness of the upper ceramic layer 1b is sufficient if the light reflectance can be maintained, for example, 0.2 mm or more. When the thickness of the upper ceramic layer 1b is B and the thickness of the lower ceramic layer 1c is C , B <C. As a result, even if the upper ceramic layer 1b is warped and deformed due to the difference in volume shrinkage between the mounting pad 3 and the inner conductor layer 8, the upper ceramic layer 1b is formed by the lower ceramic layer 1c because the lower ceramic layer 1c is thick. Therefore, it is possible to effectively prevent the warpage deformation of the light emitting element mounting substrate as a whole. When B ≧ C, when the upper ceramic layer 1b is warped due to a difference in volume shrinkage between the mounting pad 3 and the inner conductor layer 8, the lower ceramic layer 1c is equal to or less than the thickness of the upper ceramic layer 1b. For this reason, the lower ceramic layer 1c is warped together with the upper ceramic layer 1b, and a large warp deformation as a whole of the light emitting element mounting substrate may occur.

  In FIG. 1B or FIG. 2B, the first conductor layer 4a and the second conductor layer 4b are formed in the same area in the left-right symmetry, but may be formed in the left-right asymmetric shape. Good. In order to suppress a large warp deformation as a whole substrate for mounting a light emitting element, it is more important to make the areas the same than to form them symmetrically.

  The first electrode covering the first conductor layer 4a and the second electrode covering the second conductor layer 4b are provided on the surface of the external electric circuit board to which the other main surface of the light emitting element mounting substrate is bonded and fixed. And bonding the first electrode and the first conductor layer 4a, and the second electrode and the second conductor layer 4b via a conductive adhesive such as a brazing material, The first conductor layer 4a and the second conductor layer 4b are electrically connected to the first electrode and the second electrode of the external electric circuit board, respectively.

  The first mounting pad 3a and the second mounting pad 3b formed on one main surface of the light emitting element mounting substrate, the first conductor layer 4a formed on the other main surface of the light emitting element mounting substrate and the first The first inner layer conductor layer 8a and the second inner layer conductor layer 8b formed in the inner layer of the light emitting element mounting substrate between the second conductor layer 4b and the mounting pad 3 and the conductor layer 4 are respectively located A metal paste made of W, Mo, Mn, or the like is printed on the surface of the ceramic green sheet to be formed by screen printing or the like, and these ceramic green sheets are laminated and then fired at a higher temperature. The first connection conductor 5a and the second connection conductor 5b are provided with a through hole after laminating ceramic green sheets serving as a light emitting element mounting substrate, and filled with a metal paste made of W, Mo-Mn, or the like. And formed by baking at a high temperature.

  Preferably, as shown in FIG. 2, the first connection conductor 5a, the second conductor layer 4b, and the second inner layer conductor layer 8b that connect the first conductor layer 4a and the first inner layer conductor layer 8a The second connection conductor 5b for connecting the first side connection conductor 50a and the second side connection conductor 50b provided on the outer peripheral portion is preferable. In this case, the first side connection conductor 50a and the second side connection conductor 50b are formed by applying a metal paste made of W, Mo, Mn, or the like on the outer peripheral side surface of the light emitting element mounting substrate in a band shape and firing it at a high temperature. Is formed. In this case, since the formation area of the first and second side connection conductors 50a and 50b can be appropriately increased, the connection conductor 5 connecting the conductor layer 4 and the inner conductor layer 8 is a through conductor as shown in FIG. The electric resistance value can be easily reduced as compared with the case, and the loss due to the electric resistance is suppressed to be small between the conductor layer 4 and the inner conductor layer 8, and as a result, the light emitting element 6 can be efficiently transferred from the external electric circuit board. Electric power can be supplied. Further, a brazing material for external connection, solder, Ag epoxy or the like between the first side connection conductor 50a and the second side connection conductor 50b and the first electrode and the second electrode of the external electric circuit board. It is also possible to form a meniscus of the conductive adhesive, and the light emitting element mounting substrate can be firmly fixed to the external electric circuit substrate via the conductive adhesive.

  Needless to say, as shown in FIG. 2, the connection conductor 5 that connects the conductor layer 4 and the inner conductor layer 8 may have a configuration in which a through conductor and a side connection conductor 50 are provided in parallel. However, a configuration in which only the side connection conductor 50 is provided without forming the through conductor may be employed. Preferably, the through conductor and the side connection conductor 50 may be provided in parallel. With this configuration, the conductor layer 4 and the inner conductor layer 8 are connected with a lower electrical resistance value, It becomes possible to supply power to the light emitting element 6 more efficiently from the external electric circuit board. The through conductors formed between the conductor layer 4 and the inner conductor layer 8 should be many, and the conductor layer 4 and the inner conductor layer 8 are connected to each other with a lower electrical resistance value so that the external electric It becomes possible to supply electric power to the light emitting element 6 more efficiently from the circuit board. It is also advantageous in terms of heat dissipation.

  Further, as shown in FIG. 2, the first side connection conductor 50a and the second side connection conductor 50b are castellation conductors in which a notch portion is provided on the light emitting element mounting substrate and a conductor layer is provided on the inner surface of the notch portion. It is good to form. With this configuration, a rectangular or elliptical through-hole that is a notch is formed in advance in a ceramic green sheet that is a light-emitting element mounting substrate, and a metal paste is formed on the inner surface of the through-hole that becomes a notch by suction printing. Can be printed and applied, and the first side connection conductor 50a and the second side connection conductor 50b can be easily formed.

  Further, the meniscus of the conductive adhesive for external connection formed between the first electrode and the second electrode of the external electric circuit board can be accommodated in the inner surface of the notch, and the meniscus of the conductive adhesive is Since it is not formed on the outer peripheral portion of the light emitting element mounting substrate, the first electrode and the second electrode of the external electric circuit substrate have a larger area than the first conductor layer 4a and the second conductor layer 4b. There is an effect that it is not necessary to. That is, the substrate for mounting a light emitting element can be made excellent in manufacturing efficiency, and can be adapted to the recent trend of downsizing of external electric circuit boards.

  The first connection conductor 5a and the second connection conductor 5b are formed vertically from one main surface to the other main surface of the light emitting element mounting substrate as shown in FIG. The first conductor layer 4a and the second conductor layer 4b, which are formed immediately below the second mounting pad 3b, are connected to each other. The connection conductor 5a and the second connection conductor 5b may be used. Moreover, it is good also as the 1st connection conductor 5a and the 2nd connection conductor 5b which are the same extent as the lower surface area of the light emitting element 6. FIG. By doing in this way, the heat which the light emitting element 6 emits is efficiently conducted to the conductor layer 4 on the other main surface by the metal first connecting conductor 5a and the second connecting conductor 5b.

  The number of first connection conductors 5a and second connection conductors 5b formed from the first inner layer connection conductor 8a and the second inner layer connection conductor 8b to the first conductor layer 4a and the second conductor layer 4b. Is increased, the heat generated by the light emitting element 6 is efficiently conducted to the conductor layer 4 on the other main surface by the first connection conductor 5a and the second connection conductor 5b. Alternatively, a method of electrically connecting to the conductor layer 4 formed at an arbitrary position on the other main surface after the conductor is routed by the inner layer connection conductor inside the light emitting element mounting substrate may be used.

  Thus, the first mounting pad 3a and the second mounting pad 3b that are formed on the upper surface of the light emitting element mounting portion 1a and to which the electrodes of the light emitting element 6 are electrically connected through electrical connection means such as solder. Are led to the first conductor layer 4a and the second conductor layer 4b on the outer surface of the light emitting device via the first connection conductor 5a and the second connection conductor 5b, and connected to the external electric circuit board. As a result, the light emitting element 6 and the external electric circuit are electrically connected.

As shown in FIG. 3A, the conductor layer 4 (the first conductor layer 4a and the second conductor layer 4b) includes a slit-shaped conductor non-forming portion 41 (the first conductor non-forming portion 41a and the second conductor layer 4b). that consisted of nonconductive portion 41b) a plurality of metal layers 40 which are defined by the (first metal layer 40a and the second metal layer 40b). In this case, the conductor layer 4 (the first conductor layer 4a and the second conductor layer 4b) is divided into the metal layers 40 (the first metal layer 40a and the second metal layer 40b) having a small area. A first electrode (not shown) on the electric circuit and the first conductor layer 4a, and a second electrode (not shown) on the external electric circuit and the second conductor layer 4b are brazed, When bonded via a conductive adhesive such as solder or Ag epoxy, the stress due to the thermal expansion difference between the insulating substrate and the conductive adhesive acting on the first metal layer 40a and the second metal layer 40b is reduced. can do. As a result, the occurrence of breakage such as cracks in the light emitting element mounting substrate can be suppressed.

  The width of the non-forming part 41 is preferably 0.1 mm or more. When a metal paste made of W, Mo, Mn, etc., which becomes a metallized layer is printed and applied by screen printing or the like, the metal paste spreads, but if the width of the conductor non-forming portion 41 is less than 0.1 mm, the metal paste It tends to be difficult to form the conductor non-forming portion 41 due to bleeding.

  Also, the conductor layer 4 (first conductor layer 4a and second conductor layer 4b) is partitioned by slit-like conductor non-formation parts 41 (first non-formation parts 41a and second non-formation parts 41b). In the case of a plurality of metal layers 40 (first metal layer 40a and second metal layer 40b), preferably, as shown in FIG. 4, the inner conductor layer 8 (first inner layer conductor) The layer 8a and the second inner layer conductor layer 8b) are divided into a plurality of slit-shaped inner layer conductor non-forming portions 81 (first inner layer conductor non-forming portion 81a and second inner layer conductor non-forming portion 81b). The inner layer metal layer 80 (the first inner layer metal layer 80a and the second inner layer metal layer 80b) is the same as the conductor layer 4 composed of the plurality of metal layers 40 partitioned by the slit-like conductor non-forming portion 41. It has a shape. With this configuration, the conductor layer 4 (the first conductor layer 4a and the second conductor layer 4b) is formed into a slit-like conductor non-forming portion 41 (the first conductor non-forming portion 41a and the second conductor non-forming portion 41b). ), The conductor layer 4 and the inner conductor layer 8 shrink in volume by the same amount even when the metal layer 40 is composed of a plurality of metal layers 40 (first metal layer 40a and second metal layer 40b). As a result, warping deformation occurring in the insulating substrate 1 located between the conductor layer 4 and the inner conductor layer 8 can be suppressed. And it can suppress more reliably that the big curvature deformation as the whole light emitting element mounting substrate will arise.

  As shown in FIG. 4, the inner conductor layer 8 (the first inner conductor layer 8a and the second inner conductor layer 8b) has a slit-like inner conductor non-forming part 81 (first inner conductor non-forming part 81a). And a plurality of inner metal layers 80 (the first inner metal layer 80a and the second inner metal layer 80b) partitioned by the second inner layer conductor non-forming portion 81b). A metallized layer is preferably deposited so that 80 is partially conductive, and a first side connection conductor 50a and a second side connection conductor 50b are provided as shown in FIG. When the number of through conductors formed between the conductor layer 4 and the inner layer conductor layer 8 is large, the conductor layer 4 and the inner layer conductor layer 8 are connected to each other with a lower electric resistance value. It becomes possible to supply electric power to the light emitting element 6 more efficiently from the circuit board.

  As a method of connecting the electrode of the light emitting element 6 to the first mounting pad 3a and the second mounting pad 3b, a method of connecting via wire bonding, or an electrical connection such as a solder bump on the lower surface of the light emitting element 6 is possible. For example, a method using a flip chip bonding method in which connection is made by the general connection means 7 is used. Preferably, the connection is made by a flip chip bonding method. As a result, the first mounting pad 3 a and the second mounting pad 3 b can be provided in a small area directly under the light emitting element 6. Therefore, one main surface of the light emitting element mounting substrate around the light emitting element 6. It is not necessary to provide a space for providing the first mounting pad 3a and the second mounting pad 3b. Therefore, the light emitted from the light emitting element 6 is absorbed by the first mounting pad 3a and the second mounting pad 3b of the light emitting element mounting substrate to suppress the reduction of the on-axis luminous intensity and emit light. The strength can be increased.

  Further, the areas of the first conductor layer 4a and the second conductor layer 4b formed on the other main surface of the light emitting element mounting substrate are larger than the areas of the first mounting pad 3a and the second mounting pad 3b. Is formed in a wide area. As described above, the conductive layer 4 formed on the other main surface of the light emitting element mounting substrate has a larger area than the mounting pad 3 so that the light emitting device is mechanically bonded to the external electric circuit substrate over a wide area. Can be fixed.

  Therefore, by forming the first mounting pad 3a and the second mounting pad 3b with a small area on the light emitting element mounting portion 1a on one main surface, the first mounting pad 3a and the second mounting pad are formed. The pad 3b minimizes the absorption of light emitted from the light emitting element 6, and the first conductor layer 4a and the second conductor layer 4b are formed on the other main surface with a large area, and the light emitting element The mounting substrate can be mechanically bonded and fixed to the external electric circuit board over a wide area, and the heat generated from the light emitting element 6 can be efficiently dissipated to the external electric circuit board, preventing the light emitting element 6 from rising in temperature. In addition, the radiation intensity can be maintained at a high level and can be firmly fixed to the external electric circuit board.

  In FIG. 1B or FIG. 2B, the conductor layer 4 and the inner conductor layer 8 are also rectangular in plan view. However, the shape is not limited to this, and may be various shapes. it can. For example, it may be arcuate or may be various polygonal shapes such as a triangle, and should be maximized in accordance with the planar view shape of the light emitting element mounting substrate.

  In addition, a metal having excellent corrosion resistance such as Ni or gold (Au) is deposited on the exposed surfaces of the mounting pad 3, the conductor layer 4, and the side connection conductor 50 in a thickness of about 1 to 20 μm. The oxidative corrosion of the mounting pad 3, the conductor layer 4 and the side connection conductor 50 can be effectively prevented, and the electrode of the light emitting element 6, the mounting pad 3, and the conductor layer 4 or the side connection conductor 50 can be effectively prevented. And the electrode of the external electric circuit board can be strengthened. Accordingly, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on these exposed surfaces by an electrolytic plating method or an electroless plating method. Is more preferable.

  Preferably, the light emitting element mounting portion 1a is formed on the upper surface of a convex portion projecting from one main surface of the light emitting element mounting substrate (not shown), whereby the light emitting element 6 is directed obliquely downward from the light emitting element 6. The light emitted from the light can be easily reflected by the reflecting member 2, and is prevented from being absorbed by multiple reflections on one main surface of the light emitting element mounting substrate and the reflecting member 2. Much of the emitted light can be used for the emitted light of the light emitting device. As a result, the light emitting characteristics of the light emitting element 6 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  Further, in the case of the light emitting element mounting portion 1a formed as a convex portion protruding from one main surface of the light emitting element mounting substrate, it becomes easy to mount the light emitting element 6 on the light emitting element mounting portion 1a. There is also an effect that it can be placed accurately and easily at the position.

  In this case, the light emitting element mounting portion 1a is formed by removing the periphery of the light emitting element mounting portion 1a of the light emitting element mounting substrate by means of cutting, mechanical polishing, blast polishing or the like, or by molding or ceramic green sheet. It can be formed integrally with the light emitting element mounting substrate by the laminating method. Or you may join the member used as the light emitting element mounting part 1a to the one main surface of the light emitting element mounting board | substrate with an adhesive agent.

  Further, the reflective member 2 is attached to one main surface of the light emitting element mounting substrate with a bonding material such as solder, a brazing material such as Ag brazing, or a resin adhesive such as epoxy resin. The reflection member 2 is formed with a through hole 2a in the center so that the upper side thereof becomes an inclined surface toward the outside, and light or phosphor emitted from the light emitting element 6 on the inner peripheral surface of the through hole 2a. The light reflecting surface 2b reflects the emitted light or the like.

  The reflecting member 2 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Further, the light reflecting surface 2b formed on the inner peripheral surface of the through hole 2a is not particularly limited as long as it reflects light, but the inner peripheral surface of the through hole 2a is polished in order to obtain a higher reflectance. Or smoothing by pressing a mold or the like, or by plating, vapor deposition, or the like on the inner peripheral surface of the through hole 2a, for example, Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr ), A light reflection surface 2b is formed by forming a metal thin film layer having a high reflectance such as Cu.

  The arithmetic average roughness Ra on the surface of the light reflecting surface 2b is preferably 0.004 to 4 μm, whereby the light reflecting surface 2b can favorably reflect the light from the light emitting element 6 and the phosphor. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 6, and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The light reflecting surface 2b is, for example, a linear inclined surface as shown in FIG. 1 (a) or FIG. 2 (a) whose longitudinal cross-sectional shape spreads outward as it goes upward, and as it goes upward. Examples of the shape include a curved inclined surface extending outward or a combination of straight lines, and a polygonal surface extending outward as it goes upward. Moreover, examples of the shape in plan view include a circular shape, an elliptical shape, and a polygonal shape.

  The reflecting member 2 may be attached to any part other than the light emitting element mounting portion 1a on one main surface of the light emitting element mounting substrate. However, a desired surface accuracy around the light emitting element 6, for example, FIG. In the longitudinal section of the light-emitting device, the light-reflecting surface 2b is provided in a state where the light-reflecting surfaces 2b provided on both sides of the light-emitting element 6 are symmetrical with the light-emitting element 6 in between. It is better. The light emitted from the light emitting element 6 in the horizontal direction or the like can be reflected uniformly and uniformly on the light reflecting surface 2b, and the on-axis luminous intensity, luminance and color rendering properties are effectively improved. Can be made.

  In particular, the closer the reflection member 2 is to the light emitting element mounting portion 1a, the more the above effect appears. Thereby, by surrounding the periphery of the light emitting element mounting portion 1a with the reflecting member 2, it is possible to reflect more light and to obtain a higher on-axis luminous intensity.

  Then, the first mounting pad 3a, the second mounting pad 3b, and the electrode of the light emitting element 6 arranged around the light emitting element mounting portion 1a are connected via an electrical connection means 7 such as a bonding wire or a metal ball. A light emitting device can be formed by electrical connection.

  Alternatively, after the first mounting pad 3a, the second mounting pad 3b, and the electrode of the light emitting element 6 are electrically connected through the electrical connection means 7 such as a bonding wire or a metal ball, the phosphor is A translucent member such as an epoxy resin or a silicone resin contained is injected inside the reflecting member 2 so as to cover the light emitting element 6 with an injection machine such as a dispenser, and is thermally cured in an oven. A light emitting device capable of extracting light having a desired wavelength spectrum by converting the wavelength to a longer wavelength side by using a phosphor can be obtained.

  In the light-emitting device thus manufactured, the first conductor layer 4a and the second conductor layer 4b formed on the other main surface of the light-emitting element mounting substrate are connected to the electrode of the external electric circuit board with a brazing material and solder. By being mechanically and electrically connected by a conductive adhesive such as Ag or epoxy, the light emitting device is operated.

  Further, by using the light emitting device of the present invention as a single light source, or a plurality of the light emitting devices, for example, a predetermined arrangement such as a lattice shape, a staggered shape, a radial shape, a concentric shape such as a circular shape or a polygonal shape. By using it as an arrayed light source, a lighting device can be obtained. As a result, the lighting device of the present invention uses light emission by the light emitting element 6 made of a light emitting diode (LED), a laser diode (LD), or other semiconductor that emits light, and thus consumes less power than a conventional lighting device using discharge. It is electric power, can have a long life, and can be a small lighting device with little heat generation. Further, since the cooling performance of the light emitting element mounting substrate is good, fluctuations in the center wavelength of light emitted from the light emitting element 6 can be suppressed, and light can be emitted with a stable radiation intensity and radiation angle over a long period of time. In addition, it is possible to provide a lighting device with less uneven color and uneven illuminance distribution on the irradiation surface.

  For example, as shown in FIG. 5 and FIG. 6, a plurality of light emitting devices 101 of the present invention are arranged in a plurality of rows on the light emitting device driving circuit board 102, and a required shape is formed around the light emitting device 101. In the case of an illuminating device in which the light reflecting means 103 made of a molded product such as an optically designed metal member is installed, adjacent light emitting devices 101 are arranged between a plurality of light emitting devices 101 arranged in a row. It is preferable to adopt a so-called staggered arrangement. That is, when the light emitting devices 101 are arranged in a grid, glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. However, since the light emitting device 101 is arranged on the plane at almost equal intervals, the glare is suppressed and the discomfort to the human eye is reduced. be able to.

  Furthermore, compared with the case where the light emitting devices 101 are arranged on a straight line, the distance between the adjacent light emitting devices 101 is increased, so that thermal interference between the adjacent light emitting devices 101 is suppressed, and the light emitting device 101 is mounted. Thus, heat accumulation in the light emitting device driving circuit board 102 is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device having stable optical characteristics over a long period of time with less discomfort to human eyes.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of the illuminating devices arranged in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side to the outer peripheral side of the illuminating device. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, and street lamp lighting fixtures that are used indoors and outdoors. , Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights , Electronic bulletin boards and the like, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 6 may be mounted on the light emitting element mounting substrate in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the light reflecting surface 2b, and thereby it is possible to obtain a better color rendering by providing a complementary color gamut.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement. For example, one light-emitting device 101 is disposed in the center of the lighting device.

  In the description of the above embodiment, the terms “upper, lower, left and right” are merely used to describe the positional relationship on the drawings, and do not mean the positional relationship during actual use.

(A) is a sectional view showing a reference example of a light emission device, (b) is an exploded perspective view seen from the lower surface side of the light-emitting element mounting substrate used in the light emitting device of (a). (A) is a sectional view showing another example of a reference example of emitting light device, (b) is an exploded perspective view seen from the lower surface side of the light-emitting element mounting substrate used in the light emitting device of (a). (A ) is an exploded perspective view showing an example of an embodiment of a light emitting element mounting substrate of the present invention, as seen from the lower surface side of the light emitting element mounting substrate. (B) is the disassembled perspective view which showed the reference example of the light emitting element mounting substrate, and looked at the light emitting element mounting substrate from the lower surface side. It is the disassembled perspective view which showed the other example of embodiment of the light emitting element mounting substrate of this invention, and looked at the light emitting element mounting substrate from the lower surface side. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing which shows the example of the conventional light-emitting device.

Explanation of symbols

1: Insulating substrate 1a: Light emitting element mounting portion 2: Reflecting member 2b: Light reflecting surface 3: Mounting pad 3a: First mounting pad 3b: Second mounting pad 4: Conductive layer 4a: First conductor Layer 4b: Second conductor layer 5: Connection conductor 5a: First connection conductor 5b: Second connection conductor 6: Light emitting element 8: Inner layer conductor layer 8a: First inner layer conductor layer 8b: Second inner layer conductor layer
40: Metal layer
40a: first metal layer
40b: second metal layer
41: Conductor non-forming part
41a: 1st conductor non-formation part
41b: second conductor non-formation part
50: Side connection conductor
50a: first side connecting conductor
50b: Second side connecting conductor
80: Inner metal layer
80a: first inner metal layer
80b: second inner metal layer
81: Inner layer non-forming part
81a: first inner layer conductor non-forming portion
81b: second inner layer conductor non-forming portion
101: Light-emitting device
102: Light-emitting device drive circuit board
103: Light reflection means

Claims (6)

An insulating substrate, a mounting pad formed on one main surface of the insulating substrate, to which an electrode of a light emitting element is electrically connected, and formed on almost the entire other main surface of the insulating substrate , A conductor layer in which conductor non-formation portions are provided in a grid pattern and the insulating substrate are disposed between the mounting pad and the conductor layer so as to face the conductor layer and have substantially the same area. A light-emitting element mounting substrate comprising: an inner conductor layer formed on the substrate; and a connection conductor that electrically connects the mounting pad and the conductor layer.   The light emitting element mounting substrate according to claim 1, wherein the connection conductor is provided on an outer peripheral portion of the insulating substrate. The inner conductor layer, the light emitting element mounting substrate according to claim 1 or claim 2, characterized in that it is formed in substantially the same pattern as the conductive layer. A frame-shaped reflecting member having an inner peripheral surface as a light reflecting surface is disposed on one main surface of the light emitting element mounting substrate according to claim 1 so as to surround the light emitting element mounting portion. A package for housing a light emitting element, wherein the package is worn. 5. A light emitting device comprising: the light emitting element storage package according to claim 4; and the light emitting element electrically connected to the mounting pad. 6. A lighting device comprising: the light-emitting device according to claim 5 ; a drive unit on which the light-emitting device is mounted and having an electrical wiring that drives the light-emitting device; and a light reflecting unit that reflects light emitted from the light-emitting device.

Images