JP4845370B2 - Light emitting device and lighting device - Google Patents

Light emitting device and lighting device Download PDF

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Publication number
JP4845370B2
JP4845370B2 JP2004343101A JP2004343101A JP4845370B2 JP 4845370 B2 JP4845370 B2 JP 4845370B2 JP 2004343101 A JP2004343101 A JP 2004343101A JP 2004343101 A JP2004343101 A JP 2004343101A JP 4845370 B2 JP4845370 B2 JP 4845370B2
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light
light emitting
emitting element
surface
emitting device
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JP2006156604A (en
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民男 草野
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京セラ株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Description

  The present invention relates to a light-emitting device and a lighting device that radiate light emitted from a light-emitting element to the outside after wavelength conversion with a phosphor.

  A light emitting device that emits white light by converting long wavelengths of light such as near ultraviolet light and blue light emitted from a light emitting element 15 such as a conventional light emitting diode (LED) into a long wavelength with a plurality of phosphors such as red, green, blue, and yellow Is shown in FIG. In FIG. 6, the light emitting device has a mounting portion 11a for mounting the light emitting element 15 in the central portion of the upper main surface, and the inside and outside of the light emitting device led out from the mounting portion 11a and its periphery to the outer surface of the light emitting device. A base body 11 made of an insulator on which a wiring conductor (not shown) made of a lead terminal, metallized wiring, or the like for electrically conducting a connection is bonded and fixed to the upper main surface of the base body 11, and the upper opening is A through-hole 12a larger than the lower opening is formed, and a frame-like reflecting member 12 whose inner peripheral surface is a reflecting surface 12b that reflects light emitted from the light emitting element 15 is filled inside the reflecting member 12. The light-emitting element 15 is mainly composed of a translucent member 13 containing a phosphor 14 that converts the wavelength of light emitted from the light-emitting element 15 to the long wavelength side, and the light-emitting element 15 mounted and fixed on the mounting portion 11a.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on the upper main surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is formed on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the reflecting surface 12b of the reflecting member 12 is formed by smoothing the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by. The reflecting member 12 is formed on the upper main surface of the base 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 by a soldering material such as solder, silver (Ag) brazing, or a bonding material such as a resin adhesive. Be joined.

Then, the wiring conductor arranged in the periphery of the mounting portion 11a and the light emitting element 15 are electrically connected through an electrical connecting means 16 such as a bonding wire or a metal ball, and then an epoxy resin containing the phosphor 14 or A translucent member 13 such as silicone resin is injected into the inside of the reflecting member 12 so as to cover the light emitting element 15 with an injection machine such as a dispenser and thermally cured in an oven, so that the light from the light emitting element 15 is prolonged by the phosphor. A light emitting device capable of extracting light having a desired wavelength spectrum by converting the wavelength to the wavelength side can be obtained (see Patent Document 1 below).
Japanese Patent Laid-Open No. 2003-37298

  In recent years, there has been an increase in the use of the above-described light emitting device for illumination, and a light emitting device with higher characteristics in radiation intensity and heat dissipation characteristics is required.

  However, in the conventional light emitting device, the translucent member 13 tends to wet and spread so as to scoop up the inner peripheral surface of the reflecting member 12 due to surface tension, and the translucent member 13 injected into the inner side of the reflecting member 12 There was a problem that the shape of the upper surface was not stable and the surface area of the upper surface of the translucent member 13 was not stable. Therefore, the angle of refraction of the light emitted from the light emitting element 15 on the upper surface of the translucent member 13 varies, and the radiation angle cannot be made constant, or the density of light emitted from the upper surface of the translucent member 13 varies. Therefore, the radiant intensity cannot be made constant, or the wavelength conversion efficiency cannot be made constant due to variations in the optical path length through which the light emitted from the light-emitting element 15 passes through the translucent member 13. In addition, there is a problem that luminance, color rendering, and the like vary from light emitting device to light emitting device.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to provide a light emitting device and an illumination device that can reduce variations in radiation intensity, axial luminous intensity, luminance, color rendering, and the like. Is to provide.

In the light emitting device of the present invention, a base on which a conductor layer to which a light emitting element is electrically connected is formed at the center of the upper main surface, and the upper main surface of the base are joined so as to surround the conductor layer. A frame-shaped reflecting member whose inner peripheral surface is a reflecting surface that reflects light emitted from the light emitting element, a light emitting element electrically connected to the conductor layer, and a plurality of layers laminated on the upper surface of the light emitting element The translucent sheet containing phosphors adhered to each other by a transparent resin , and the entire surface of the light-emitting element and the side surface of the translucent sheet are attached to the upper surface of the translucent sheet. And a translucent member containing a phosphor that is not deposited.

  In the light emitting device of the present invention, it is preferable that the plurality of translucent sheets have a higher refractive index as they are closer to the light emitting element.

  In the light emitting device of the present invention, preferably, a convex portion is formed at a central portion of the upper main surface of the base body, and the conductor layer is formed on an upper surface of the convex portion.

  The illumination device of the present invention is characterized in that the light-emitting device of the present invention is used as a light source.

  The light-emitting device of the present invention includes a light-transmitting sheet containing a plurality of phosphors laminated on the top surface of a light-emitting element, and a light-transmitting material containing a phosphor that is deposited on the entire side surface of the light-emitting element. Since the light emitted upward from the upper surface of the light emitting element occupies a large part of the total amount of light emitted from the light emitting element, a plurality of light emitted from the upper surface of the light emitting element is used. By transmitting the light through the light-transmitting sheet, the light from the light-emitting element can be reliably wavelength-converted to the long wavelength side by the phosphor to obtain light having a desired wavelength spectrum. In addition, by laminating a plurality of translucent sheets, it is possible to suppress variation in the distribution of phosphors in one translucent sheet and to make uniform variations as a whole. Therefore, it is possible to effectively prevent the occurrence of uneven color and uneven intensity by keeping the wavelength conversion efficiency for all light emitted from the upper surface of the light emitting element constant.

  In addition, by installing a plurality of translucent sheets, the area of the side surface of the translucent sheet can be increased, and the light-emitting element that is wavelength-converted by the translucent sheet and is output from the side surface of the translucent sheet. Light can be reflected over a large area of the reflecting surface of the reflecting member, and an extremely high on-axis luminous intensity can be obtained.

  On the other hand, when a translucent member containing a phosphor is filled inside the reflecting member as in the past, the light emitted from the side surface of the light emitting element is lighter than the light emitted from the upper surface of the light emitting element. In addition, there is a long optical path length after light is emitted from the light emitting element, reflected by the reflecting member, and emitted to the outside of the translucent member. Therefore, while the radiation intensity is relatively small and easily causes unevenness of the intensity, in the present invention, the light emitted from the side surface of the light emitting element is sufficiently wavelength-converted by the translucent member having a constant thickness. The color tone can be adjusted, and it is possible to effectively prevent the phosphor from obstructing the progress of light, and to efficiently radiate light from the translucent member to the outside. Increasing the emitted light intensity of the emitted light It is possible to effectively prevent the strength unevenness occurs in the emitted light.

  As a result, a light emitting device having excellent light characteristics such as radiation intensity, axial luminous intensity, luminance, and color rendering can be obtained.

  In the light-emitting device of the present invention, preferably, the light-transmitting sheets are closer to the light-emitting element and have a higher refractive index. Therefore, light emitted upward from the upper surface of the light-emitting element is emitted from the light-emitting element. When passing outside, it can be prevented from being suddenly refracted or totally reflected, and it is possible to effectively prevent the radiated light intensity of the light emitted from the light emitting element from being lowered.

  In the light emitting device of the present invention, preferably, a convex portion is formed at the center of the upper main surface of the substrate, and a conductor layer is formed on the upper surface of the convex portion, so that light is emitted obliquely downward from the light emitting element. Since the reflected light can travel well to the reflecting surface of the reflecting member and be reflected by the reflecting surface, it effectively prevents the light from being absorbed by the upper surface of the substrate or the joint between the substrate and the reflecting member. The emission intensity can be made extremely high.

  Since the illuminating device of the present invention uses the light emitting device of the present invention as a light source, it uses light emission by recombination of electrons of a light emitting element made of a semiconductor. A small lighting device that can have low power consumption and a long lifetime can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In the figure, 1 is a base, 1a is a convex part, 2 is a reflecting member, 4a is a translucent sheet containing phosphor, 4b is a translucent member containing phosphor, and 5 is a light emitting element. Thus, a light emitting device capable of emitting light emitted from the light emitting element 5 to the outside with directionality is configured.

  The substrate 1 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, resins such as epoxy resins, metals, or the like. In addition, the base body 1 preferably has a convex portion 1a in which the central portion of the upper main surface protrudes, and the light emitting element 5 is preferably mounted on the upper surface of the convex portion 1a. Thereby, the light emitted obliquely downward from the light emitting element 5 can be favorably traveled to the reflecting surface 2b of the reflecting member 2 and reflected by the reflecting surface 2b, so that the upper surface of the base 1 or the base 1 and the reflecting member can be reflected. It is possible to effectively prevent light from being absorbed at the joint with 2 and the like, and to increase the emission intensity.

  Such a convex portion 1a is formed by removing the periphery of the convex portion 1a of the base body 1 by means of cutting, mechanical polishing, blast polishing, or the like, or by molding or a ceramic green sheet lamination method. It can be formed integrally. Or you may join the member used as the convex part 1a to the upper side main surface of the base | substrate 1 with an adhesive agent.

  On the mounting portion of the light emitting element 5 on the upper main surface of the base 1, a conductor layer 6 is formed to which the electrodes of the light emitting element 5 are electrically connected through an electrical connection means such as solder. The electrical connection pattern is led out to the outer surface of the light emitting device via a wiring conductor (not shown) formed inside the base 1 and connected to the external electrical circuit board, whereby the light emitting element 5 and the external electrical circuit are connected. Are electrically connected to each other.

  In the case of having the convex portion 1a, the light emitting element 5 is mounted on the convex portion 1a protruding from the upper main surface of the base body 1, whereby the light emitted from the side surface of the light emitting element 5 downward by the protruding convex portion 1a. Is effectively irradiated to the reflecting surface 2b of the reflecting member 2 to effectively prevent the light from being absorbed by a portion other than the reflecting member 2 and reflect most of the light emitted from the light emitting element 5 with a high reflectance. be able to. Further, the light emitting element 5 can be accurately and easily mounted at a desired position of the base body 1 by the convex portion 1a. As a result, the light emitting characteristics of the light emitting element 5 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  As a method of connecting the light emitting element 5 to the conductor layer 6, a method of connecting via wire bonding, a method using a flip chip bonding method in which the lower surface of the light emitting element 5 is connected by an electrical connection means such as a solder bump, or the like. Is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the conductor layer 6 can be provided directly under the light emitting element 5, it is not necessary to provide a space for providing an electrical connection pattern on the upper surface of the base 1 around the light emitting element 5. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 5 from being absorbed in the space for the electrical connection pattern of the substrate 1 and the on-axis luminous intensity being lowered.

  The electrical connection pattern is formed, for example, by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface or inside of the base 1 so that lead terminals such as Fe-Ni-Co alloy are formed on the base 1. It is provided by embedding or by fitting and joining an input / output terminal made of an insulator on which a wiring conductor is formed in a through hole provided in the base 1.

  The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 5 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

  Further, the reflecting member 2 is attached to the upper surface of the substrate 1 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflection member 2 has a through hole 2a formed at the center and an inner peripheral surface that is a reflection surface 2b that reflects light emitted from the light emitting element 5.

  The reflecting member 2 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Further, the reflecting member 2 is a reflecting surface 2 b that reflects the light emitted from the light emitting element 5. Such a reflective surface 2b is not particularly limited as long as it reflects light, but in order to obtain a higher reflectance, the inner peripheral surface of the through hole 2a is polished or smoothed by pressing a mold or the like. Or on the inner peripheral surface of the through-hole 2a by, for example, plating, vapor deposition or the like with high reflectivity such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), Cu, etc. The reflective surface 2b may be formed by forming a metal thin film. When the reflecting surface 2b is made of a metal that is easily discolored by oxidation such as Ag or Cu, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 2b improves.

  In addition, the arithmetic average roughness Ra of the surface of the reflecting surface 2b is preferably 0.004 to 4 μm, whereby the reflecting surface 2b can favorably reflect the light from the light emitting element 5 and the phosphor. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 5 and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The reflecting surface 2b has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, a curved inclined surface that spreads outward as it goes upward, Or shapes, such as a rectangular surface, are mentioned.

  The reflecting member 2 may be attached to any part other than the mounting portion of the light emitting element 5 on the upper main surface of the base 1, but has a desired surface accuracy around the light emitting element 5, for example, in the longitudinal section of the light emitting device. The reflective surface 2b is preferably attached so that the reflective surfaces 2b provided on both sides of the light emitting device 5 are symmetrical with the light emitting device 5 interposed therebetween. Thereby, not only the light from the light emitting element 5 is wavelength-converted by the phosphor and directly radiated to the outside, but also the light emitted from the light emitting element 5 in the lateral direction or the light emitted downward from the phosphor. The reflecting surface 2b can be uniformly reflected, and the axial luminous intensity, luminance, color rendering properties, and the like can be effectively improved.

  In particular, the closer the reflecting member 2 is to the light emitting element 3, the more the above effect appears. Thus, by surrounding the light emitting element 3 with the reflecting member 2, more light can be reflected, and a higher on-axis luminous intensity can be obtained.

  The translucent sheet 4a and the translucent member 4b are made of a transparent member made of a transparent resin such as an epoxy resin or a silicone resin, a sol-gel glass or the like containing a phosphor that converts the wavelength of light emitted from the light emitting element 5. is there. As the translucent sheet 4 a, a sheet-like sheet prepared in advance as shown in FIG. 1 is installed on the upper surface of the plurality of light emitting elements 5. The translucent sheet 4a can be bonded to the light emitting element 5 with an adhesive such as a transparent resin constituting the translucent sheet 4a. Moreover, mutual translucent sheets 4a can also be adhere | attached with adhesive agents, such as transparent resin.

  By installing a plurality of translucent sheets 4a in this way, the area of the side surface of the translucent sheet 4a can be increased, and the wavelength of the translucent sheet 4a is converted and output from the side surface of the translucent sheet 4a. The light emitted from the light emitting element 5 can be reflected over a wide area of the reflecting surface of the reflecting member 2, and an extremely high on-axis luminous intensity can be obtained.

  In FIG. 1, the thickness of the translucent sheet 4 a is such that the wavelength of light emitted from the light emitting element 5 can be converted, and the upper surface of the translucent sheet 4 a is from the upper surface of the reflecting member 2. Thickness that does not protrude. Thereby, an axial luminous intensity and a brightness | luminance can be improved effectively.

  This is because if the thickness of the translucent sheet 4a is less than the thickness capable of converting the wavelength of light emitted from the light emitting element 5, desired chromaticity cannot be obtained, and the translucent sheet is used. The light of the light emitting element 5 whose wavelength is converted from the side surface of 4a emits light. However, when the thickness of the translucent sheet 4a protrudes from the upper surface of the reflecting member 2, the light transmitting element protrudes from the upper surface of the reflecting member 2. This is because the light emitted from the side surface portion of the light-sensitive sheet 4a is not reflected by the reflecting surface 2b of the reflecting member 2, and the axial luminous intensity and luminance cannot be effectively improved.

  Preferably, the refractive index of the plurality of translucent sheets 4a closer to the light emitting element 5 is higher. More preferably, the plurality of translucent sheets 4 a have a refractive index that is closer to the refractive index of the light emitting element 5 as they are closer to the light emitting element 5, and have a refractive index that is closer to the refractive index of the external atmosphere as they are farther from the light emitting element 5. It is good. With this configuration, when light emitted upward from the upper surface of the light emitting element 5 passes from the light emitting element 5 to the outside, it is prevented from being rapidly refracted, and the emitted light intensity of the light emitted from the light emitting element 5 is increased. It can prevent effectively that it falls by refraction. When light emitted upward from the upper surface of the light emitting element 5 is refracted rapidly in the translucent sheet 4a, reflection in the translucent sheet 4a increases, and the intensity of radiated light emitted to the outside decreases. It is because it ends.

  Preferably, the thickness of the translucent sheet 4 a is such that the upper surface of the translucent sheet 4 a coincides with the upper surface of the reflecting member 2. Thereby, the area of the side surface of the translucent sheet 4a can be maximized, and the light of the light emitting element 5 converted in wavelength by the translucent sheet 4a is reflected by a wide area of the reflecting surface 2b of the reflecting member 2. It is possible to obtain a very high on-axis luminous intensity.

  The plan view shape of the translucent sheet 4a may be various shapes such as a quadrangle and a circle. Preferably, the plan view shape of the translucent sheet 4a is a quadrilateral shape having a round shape and a curved corner. By doing so, the light emitted from the side surface of the translucent sheet 4a can be uniformly and evenly applied to the reflecting surface 2b of the reflecting member 2, and color unevenness does not occur in the light emitted from the light emitting device.

  Next, an uncured liquid translucent member 4b containing a phosphor is applied around the light emitting element 5 and the convex portion 1a with an injection machine such as a dispenser, and is cured. At this time, the translucent member 4b may be attached to the surface of the plurality of translucent sheets 4a.

  In the present invention, when the translucent member 4b is attached to the side surface of the light emitting element 5, the liquid translucent member 4b flows along the side surface of the light emitting element 5 due to gravity, The translucent member 4b can be attached to the side surface of the light emitting element 5 with a uniform thickness by surface tension. As a result, the variation in the optical path length through which the light emitted from the light emitting element 5 passes through the translucent member 4b is reduced, and the color unevenness and the intensity unevenness are reduced.

  Furthermore, if the convex part 1a is formed in the upper surface center part of the base | substrate 1 in this invention, when attaching the translucent member 4b to the side surface of the light emitting element 5, liquid translucent member 4b of the light emitting element 5 by gravity. It flows from the side surface along the side surface of the convex portion 1a, and the translucent member 4b can be attached to the side surface of the light emitting element 5 with a very uniform thickness by the surface tension during the flow. As a result, the variation in the optical path length through which the light emitted from the light emitting element 5 passes through the translucent member 4b is extremely small, and the color unevenness and the intensity unevenness are extremely small.

  In addition, the light emitting device of the present invention may be a single light source and installed in a predetermined arrangement, or a plurality of light sources may be used, for example, a grid, staggered, radial, or a plurality of light sources. A lighting device can be obtained by installing the light emitting device in a predetermined arrangement such as a concentrically formed group of circular or polygonal light emitting devices. Thereby, since light emission by recombination of electrons of the light emitting element 5 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 5 can be suppressed, and light can be irradiated with a stable radiant light intensity and radiant light angle (light distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on adjacent rows, an arrangement in which the interval between the adjacent light emitting devices 101 is not the shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 101 are arranged in a grid, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between adjacent light emitting devices 101 is increased, thermal interference between adjacent light emitting devices 101 is effectively suppressed, and heat in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted is reduced. Clouding is suppressed, and heat is efficiently dissipated to the outside of the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  In addition, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side of the illuminating device to the outer peripheral side. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 5 may be provided on the substrate 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the reflecting surface 2b and the distance from the upper end of the reflecting surface 2b to the surfaces of the first to third translucent members 4a to 4c, thereby providing a complementary color gamut. Thus, even better color rendering can be obtained.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing which shows the other example of the conventional light-emitting device.

Explanation of symbols

1: Base 1a: Convex part 2: Reflecting member 2b: Reflecting surface 4a: Translucent sheet 4b: Translucent member 5: Light emitting element 6: Conductor layer
101: Light-emitting device

Claims (4)

  1. A base on which a conductor layer to which a light emitting element is electrically connected is formed at the center of the upper main surface;
    A frame-like reflecting member that is joined to the upper main surface of the substrate so as to surround the conductor layer, and whose inner peripheral surface is a reflecting surface that reflects light emitted from the light emitting element;
    A light emitting element electrically connected to the conductor layer;
    A light-transmitting sheet containing phosphors laminated on the upper surface of the light-emitting element and bonded to each other by a transparent resin ;
    A translucent member containing a phosphor that is attached to the side surface of the light-emitting element and the side surface of the translucent sheet over the entire periphery but is not applied to the upper surface of the translucent sheet. A light emitting device characterized by that.
  2. The light-emitting device according to claim 1, wherein the plurality of translucent sheets have a refractive index that is closer to the light-emitting element.
  3. The light emitting device according to claim 1, wherein a convex portion is formed at a central portion of the upper main surface of the base body, and the conductor layer is formed on an upper surface of the convex portion.
  4. An illuminating device using the light-emitting device according to claim 1 as a light source.
JP2004343101A 2004-11-26 2004-11-26 Light emitting device and lighting device Expired - Fee Related JP4845370B2 (en)

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