JP4593974B2 - Light emitting device and lighting device - Google Patents

Description

  The present invention relates to a light emitting device for emitting light emitted from a light emitting element to the outside, and an illumination device using the light emitting device.

  A light emitting device for emitting light emitted from a light emitting element 14 such as a conventional light emitting diode (LED) to the outside is shown in FIG. In FIG. 6, the light emitting device has a mounting portion 16 for mounting the light emitting element 14 in the central portion of the upper main surface, and electrically connects the inside and outside of the light emitting device from the mounting portion 16 and its periphery. A base 11 made of an insulator on which wiring conductors 17 made of lead terminals, metallized wiring, and the like are formed, and a light reflecting surface that is bonded and fixed to the upper surface of the base 11 and whose inner peripheral surface reflects light emitted from the light emitting element 14. The frame-shaped reflecting member 13, the light emitting element 14 mounted and fixed on the mounting portion 16, and the translucent member 15 provided so as to cover the light emitting element 14 inside the reflecting member 13. It is configured.

  Such a light emitting device can reflect light emitted from the light emitting element 14 in a desired direction by the reflecting member 13 and efficiently radiate light to the outside. Further, by including a phosphor that converts the wavelength of light emitted from the light emitting element 14 in the light transmissive member 15, the light emitted from the light emitting element 14 can be emitted as light having a desired wavelength spectrum. .

  Further, a light emitting element 14 that emits light such as near-ultraviolet light or blue light is used, and the light-transmitting member 15 contains a plurality of phosphors such as red, green, blue, and yellow to emit light from the light emitting element 14. By converting the wavelength of the emitted light, a light emitting device capable of emitting white light can be obtained, and use for illumination is being studied.

  The substrate 11 used in such a light emitting device is made of ceramic such as aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, glass ceramic, resin such as epoxy resin, or the like. Become. When the substrate 11 is made of ceramics, the wiring conductor 17 is formed on the upper surface or inside thereof by baking a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 13 has a frame shape in which a light reflecting surface for reflecting light is provided on the inner peripheral surface. Specifically, it is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina ceramics, or resin such as epoxy resin, and is formed by cutting, die molding or extrusion molding. Formed by technology.

  Further, the light reflecting surface of the reflecting member 13 is formed by smoothing the inner peripheral surface of the reflecting member 13 or by depositing a metal such as Al on the inner peripheral surface of the reflecting member 13 by vapor deposition or plating. It is formed by. Then, the reflecting member 13 is bonded to the upper surface of the base body 11 so as to surround the mounting portion 16 with the inner peripheral surface of the reflecting member 13 by using a brazing material such as solder, silver (Ag) brazing, or a resin adhesive. Is done.

Then, the wiring conductor 17 and the light emitting element 14 arranged around the mounting portion 16 are electrically connected through an electrical connection means 18 such as a bonding wire or solder, and then an epoxy resin containing a phosphor or A light-transmitting member 15 such as silicone resin is filled inside the reflecting member 13 so as to cover the light-emitting element 14 with an injection machine such as a dispenser and is thermally cured in an oven, so that the light from the light-emitting element 14 is prolonged by the phosphor. A light-emitting device capable of extracting light having a desired wavelength spectrum by converting the wavelength to the wavelength side can be obtained.
Japanese Patent Laid-Open No. 2003-37298

  However, the conventional light emitting device has a problem in that the light emitted from the light emitting element 14 has a difference in path length through which the light transmissive member 15 is transmitted, and the color emitted from the light emitting device is uneven. It was.

  Further, the reflective member 13 is thermally expanded by heat such as heat generated by the light emitting element 14, and the light reflecting surface of the inner peripheral surface of the reflecting member 13 and the light transmitting member 15 are distorted. Peeling occurs at the interface with the reflecting member 13 or the interface between the translucent member 15 and the base 11 and light is absorbed by the peeling portion, so that the radiation efficiency is reduced, or stress is applied to the light emitting element 14 to cause the light emitting element 14 to emit light. There is a problem that the electrical connection between the wiring conductor 17 and the wiring conductor 17 is cut off.

  In addition, as shown in FIG. 7, the translucent member 15 is not filled inside the reflecting member 13, but is potted so as to cover the light emitting element 14, and the light emitted from the light emitting element 14 is transmitted through the translucent member. It is also conceivable that the path lengths passing through 15 are substantially equal in all directions.

  However, when the translucent member 15 is potted in this way, the translucent member 15 tends to wet and spread on the base 11 or the inner peripheral surface of the reflection member 13, and the interface of the translucent member 15 with the base 11. A problem arises in that it is difficult to improve the radiation efficiency because light is transmitted through the translucent member 15 due to a depression on the surface of the outer peripheral portion A and totally reflected by this surface and confined in the translucent member 15. Had a point.

  Accordingly, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to efficiently radiate light emitted from a light-emitting element without causing uneven color tone and reliability of electrical connection. It is to provide an excellent light emitting device.

One light-emitting device according to aspects of the substrate mounting portion of the light-emitting element is formed on an upper major surface, attached to an annular member so as to surround the placing part to the upper major surface of the base body of the present invention When the is attached to the upper major surface of the substrate, the inner peripheral surface lower end reflecting member of the inner peripheral surface light-reflecting surface and is a frame-shaped with in contact with the outer peripheral surface over the entire circumference of the annular member And the light-emitting element placed on the mounting portion, and a translucent member provided inside the annular member so as to cover the light-emitting element, and the coefficient of thermal expansion of the annular member Is smaller than the thermal expansion coefficient of the reflecting member, and the longitudinal elastic coefficient of the annular member is larger than the longitudinal elastic coefficient of the reflecting member .

Lighting device according to the present invention further aspect is characterized in that installed on the SL light - emitting device so as to be arranged in a predetermined.

  The light-emitting device of the present invention includes a base having a light-emitting element mounting portion formed on the upper main surface, an annular member attached to the upper main surface of the base so as to surround the mounting portion, and an upper main surface of the base. The frame-shaped reflecting member having the lower end of the inner peripheral surface in contact with the outer peripheral surface of the annular member over the entire circumference and the inner peripheral surface being a light reflecting surface, and mounted on the mounting portion Since the light-emitting element and the translucent member provided to cover the light-emitting element inside the annular member are provided, the translucent member that covers the light-emitting element by the annular member wets the upper main surface of the substrate. Effectively preventing the light from spreading, and suppressing the light emitted from the light emitting element from being totally reflected on the surface of the light transmissive member and confined in the light transmissive member. Can do. As a result, a light emitting device with excellent radiation efficiency can be obtained.

  Further, by effectively preventing the light transmissive member covering the light emitting element from being spread by the annular member, the thickness of the light transmissive member covering the upper side of the light emitting element and the thickness of the light transmissive member covering the side surface of the light emitting element Thus, it is possible to very effectively prevent unevenness in color due to variations in the path length of the light emitted from the light emitting element through the translucent member.

  Furthermore, even if the reflective member is about to thermally expand due to heat generation of the light emitting element, the annular member can effectively prevent the thermal expansion of the reflective member, and distortion or stress is applied to the inner peripheral surface of the reflective member or the translucent member. Generation | occurrence | production can be suppressed and radiation | emission light efficiency can be maintained favorable, and the connection reliability of the light emitting element sealed by the translucent member can be made high.

  In the light emitting device of the present invention, the annular member preferably has a thermal expansion coefficient smaller than that of the reflective member and a longitudinal elastic coefficient larger than that of the reflective member. Therefore, the thermal expansion of the reflective member is harder and has a lower thermal expansion. It can suppress firmly by an annular member, and can suppress more effectively that distortion arises in the internal peripheral surface of a translucent member or a reflective member.

  In the light emitting device of the present invention, preferably, the mounting portion protrudes so as to have a height higher than that of the annular member, so that light emitted obliquely downward from the light emitting element Without being absorbed by the annular member, it can be directly reflected by the inner peripheral surface of the reflecting member and radiated to the outside, so that the radiation efficiency of the light emitting device can be made very high.

  Since the light emitting device of the present invention is installed in a predetermined arrangement, the lighting device of the present invention uses light emission by recombination of electrons of a light emitting element made of a semiconductor. Thus, a small illuminating device that can have lower power consumption and longer life than the existing illuminating device can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a substrate, 2 is an annular member, 3 is a reflecting member, 4 is a light emitting element, 5 is a translucent member, and mainly emits light emitted from the light emitting element 4 to the outside with directionality. A light emitting device is obtained.

  The light-emitting device of the present invention includes a base body 1 on which the mounting portion 6 of the light-emitting element 4 is formed on the upper main surface, and an annular member 2 attached to the upper main surface of the base body 1 so as to surround the mounting portion 6. And a frame-like reflecting member 3 attached to the upper main surface of the base 1, the lower end of the inner peripheral surface being in contact with the outer peripheral surface of the annular member 2 over the entire periphery, and the inner peripheral surface being a light reflecting surface; The light emitting element 4 mounted on the mounting portion 6 and the translucent member 5 provided so as to cover the light emitting element 4 inside the annular member 2 are provided.

  The substrate 1 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, resins such as epoxy resins, metals, and the like.

  The base body 1 has a wiring conductor 7 led out from the mounting portion 6 on the upper main surface and the periphery thereof to the outer surface such as the side surface and the lower main surface of the base body 1 through the surface and the inside of the base body 1. Yes. And the electrode of the light emitting element 4 is electrically connected by the electrical connection means 8 to the mounting portion 6 on the upper main surface of the base body 1 and the wiring conductor 7 formed in the periphery thereof, and the outer surface such as the side surface and the lower surface of the base body 1. By connecting the wiring conductor 7 led out to the external electric circuit board, the external electric circuit board and the light emitting element 4 are electrically connected.

  The electrical connection means 8 is wire bonding, solder, or the like. Preferably, a solder flip chip bonding method using bump-like solder is used as the electrical connection means 8. Accordingly, since the wiring conductor 7 can be provided immediately below the light emitting element 4, it is not necessary to provide an extra space for providing the wiring conductor 7 on the upper surface of the base 1 around the light emitting element 4. It is possible to effectively prevent the emitted light from being absorbed in the extra space of the substrate 1 and the intensity of the emitted light from being lowered.

  The wiring conductor 7 is formed by, for example, forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface or inside of the base 1 so that a lead terminal such as an Fe—Ni—Co alloy is embedded in the base 1. Or an input / output terminal made of an insulator on which a wiring conductor is formed is fitted and joined to a through hole provided in the base 1.

  The exposed surface of the wiring conductor 7 is preferably coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. In addition, the connection between the light emitting element 4 and the wiring conductor 7 can be strengthened. Preferably, on the exposed surface of the wiring conductor 7, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially covered by an electrolytic plating method or an electroless plating method. More preferably it is worn.

  A frame-like reflecting member 3 is provided on the upper main surface of the substrate 1. The reflecting member 3 is attached to the upper main surface of the base 1 with a bonding material such as a soldering material such as solder or Ag brazing or an adhesive such as an epoxy resin. Alternatively, it may be formed integrally with the substrate 1.

  The reflecting member 3 is made of a metal such as Al, ceramics, resin, or the like, and is formed by cutting or molding. Further, in order to favorably reflect the light emitted from the light emitting element 4 and increase the emitted light intensity, the inner peripheral surface of the reflecting member 3 is made smooth by a method such as polishing or pressing a mold, or the reflecting member 3. A highly reflective metal thin film such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu may be deposited on the inner peripheral surface of the metal by, for example, plating or vapor deposition. . When the light reflecting surface of the reflecting member 3 is made of a metal that is easily discolored by oxidation such as Ag or Cu, a Ni plating layer having a thickness of about 1 to 10 μm and a thickness of 0.1 to 3 μm are formed on the surface, for example. It is preferable that an Au plating layer of a certain degree is sequentially deposited by an electrolytic plating method or an electroless plating method. This improves the corrosion resistance of the light reflecting surface.

  In addition, the arithmetic average roughness Ra of the light reflecting surface of the reflecting member 3 is preferably 4 μm or less, and thus the light reflecting surface can favorably reflect the light emitted from the light emitting element 4. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 4 and it becomes easy to diffusely reflect inside the light emitting device.

  The light reflecting surface has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, a curved inclined surface that spreads outward as it goes upward, Or shapes, such as a rectangular surface, are mentioned.

  An annular member 2 is attached to the upper main surface of the base 1 so as to surround the mounting portion 6. The annular member 2 is made of metal such as Fe-Ni-Co alloy or Fe-Ni alloy, ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, resins such as epoxy resins, and the like. The upper surface of the substrate 1 is joined by a brazing material or an adhesive. Alternatively, the annular member 2 may be formed integrally with the base body 1.

  The outer peripheral surface of the annular member 2 is in contact with the inner peripheral surface of the reflecting member 3 over the entire periphery. The annular member 2 and the inner peripheral surface of the reflecting member 3 may be joined via a brazing material, an adhesive, or the like, or may be only in contact. Since the annular member 2 and the reflecting member 3 are in contact with each other in this manner, the thermal expansion of the reflecting member 3 can be effectively suppressed by the annular member 2, and the heat generated from the light emitting element 4 is transmitted through the base 1. Even if it is transmitted to the annular member 2, heat can be radiated well by the reflecting member 3, the temperature of the annular member 2 rises, the thermal expansion of the annular member 2, and distortion of the translucent member 5 occurs. It can be effectively prevented.

  Moreover, the longitudinal cross-sectional shape of the annular member 2 is not limited to a quadrangular shape as shown in FIG. 1, but may be a polygonal shape or a curved surface shape. Preferably, the inner peripheral surface expands outward as the inner peripheral surface moves upward, and the inner peripheral surface is recessed. Thereby, the light emitted from the light emitting element 4 can be favorably reflected upward, the radiated light intensity can be increased, and the translucent member 5 can be satisfactorily held by the recessed inner peripheral surface. In addition, it is possible to more effectively prevent the translucent member 5 from spreading outward, and variation in the distance between the light emitting element 4 and the surface of the translucent member 5 can be further reduced.

  Furthermore, it is preferable that the surface of the annular member 2 is a light reflecting surface, whereby the light can be favorably reflected to increase the emitted light intensity. Such a light reflection surface of the annular member 2 can be formed by smoothing the surface by polishing, a mold, or the like, or by depositing plating.

  Further, the annular member 2 preferably has a thermal expansion coefficient smaller than that of the reflecting member 3 and a longitudinal elastic coefficient larger than that of the reflecting member 3. Thereby, the thermal expansion of the reflecting member 3 can be strongly suppressed by the harder and lower thermal expansion annular member 2, and it is more effective that the inner peripheral surface of the reflecting member 3 and the translucent member 5 are distorted. Can be suppressed.

Examples of the combination of the annular member 2 and the reflecting member 3 include an annular member 2 made of a Cu—W alloy having a thermal expansion coefficient of 7 × 10 ⁻⁶ / ° C. and a longitudinal elastic modulus of 310 GPa, Examples thereof include a reflecting member 3 made of Al having an expansion coefficient of 23 × 10 ⁻⁶ / ° C. and a longitudinal elastic modulus of 71 GPa.

  Preferably, the mounting portion 6 of the base body 1 protrudes so that the height is higher than that of the annular member 2 as shown in FIG. Thereby, the light emitted obliquely downward from the light emitting element 4 is directly reflected by the inner peripheral surface of the reflecting member 3 without being absorbed by the upper main surface of the substrate 1 or the annular member 2 and radiated to the outside. The radiation efficiency of the light emitting device can be made very high.

  Such a mounting portion 6 is formed by removing the periphery of the mounting portion 6 on the upper main surface of the base 1 by polishing, cutting, etching, or the like, or a ceramic green sheet that becomes the base 1 and the mounting portion 6. Can be formed by stacking and integrating them. Alternatively, another member may be attached to the upper main surface of the base 1 with an adhesive or the like.

  Preferably, the side surface of the protruding mounting portion 6 is inclined so as to expand outward as it goes downward. Thereby, when the liquid uncured translucent member 5 to be the translucent member 5 is provided on the base body 1, bubbles are generated at the corners between the protruding mounting portion 6 and the upper main surface of the base body 1. Can be effectively prevented, and the light emitted from the light-emitting element 4 can be favorably reflected upward on this side surface, so that the radiation efficiency can be further increased. Further, the heat generated in the light emitting element 4 can be efficiently transmitted to the base 1 through the mounting portion 6, and the temperature rise of the light emitting element 4 can be more effectively suppressed.

  Moreover, it is preferable that irregularities be formed on the side surface of the protruding mounting portion 6. Thereby, when the translucent member 5 contains a phosphor, the light emitted from the light emitting element 4 is irregularly reflected by the unevenness on the side surface of the projecting portion 6, and the phosphor in the translucent member 5 is reflected. Therefore, the wavelength conversion efficiency by the phosphor can be improved. Such a protruding mounting portion 6 having unevenness on the side surface can be formed, for example, by blast polishing the base body 1, and when removing the periphery of the mounting portion 6 of the base body 1 by this blast polishing, The size of the irregularities can be adjusted by changing the blast polishing conditions such as the particle size of the particles used for blast polishing. Alternatively, when the ceramic green sheets to be the base 1 and the mounting portion 6 are laminated and integrated by firing, the ceramic green sheets to be the mounting portion 6 can be appropriately displaced to form irregularities on the side surfaces.

  The translucent member 5 is made of a transparent resin such as an epoxy resin or a silicone resin, a transparent inorganic material formed by hydrolysis of a metal alkoxide, or the like, and is provided inside the annular member 2 so as to cover the light emitting element 4. . The translucent member 5 may be in contact with the upper surface of the annular member 2.

  The translucent member 5 is preferably formed so that the distance between the surface thereof and the surface of the light emitting element 4 is substantially constant, and such translucent member 5 is a liquid uncured translucent light. It can be formed by pouring the conductive member 5 from above the light emitting element 4, potting it in a shape such as a hemisphere while preventing the annular member 2 from spreading as a dam, and then thermosetting.

  The translucent member 5 may contain a phosphor capable of converting the wavelength of light emitted from the light emitting element 4. Thereby, the light of the light emitting element 4 can be radiated as light having a desired wavelength spectrum or white light.

  Further, the surface of the translucent member 5 may be further covered with a transparent resin or the like, or a transparent lid made of glass, transparent resin or the like may be attached to the reflecting member 3 to protect the light emitting device. Further, by forming such a transparent resin or a transparent lid into a lens shape, the emitted light can be favorably converged.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by electron recombination of the light emitting element 4 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a conventional lighting device using discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 4 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 101 are arranged in a plurality of rows on the light emitting device driving circuit board 102 as shown in the plan view and the cross-sectional view shown in FIGS. 2 and 3, and are optically designed in an arbitrary shape around the light emitting device 101. In the case of an illuminating device in which the reflecting jig 103 is installed, in a plurality of light emitting devices 101 arranged on an adjacent row, an arrangement in which the interval between adjacent light emitting devices 101 is not shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 101 are arranged in a grid pattern, the glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Further, since the distance between the adjacent light emitting devices 101 is increased, thermal interference between the adjacent light emitting devices 101 is effectively suppressed, and heat in the light emitting device driving circuit board 102 on which the light emitting devices 101 are mounted is reduced. Clouding is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with less obstacles to human eyes.

  In addition, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device drive circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of a plurality of lighting devices formed in a group, it is preferable to increase the number of light emitting devices 101 arranged in one circular or polygonal light emitting device 101 group toward the outer peripheral side from the center side of the lighting device. As a result, more light emitting devices 101 can be arranged while maintaining an appropriate interval between the light emitting devices 101, and the illuminance of the lighting device can be further improved. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 is uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all. For example, a plurality of light emitting elements 4 may be provided on the mounting portion 6 in order to improve the emitted light intensity.

  In addition, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing of the conventional light-emitting device. It is sectional drawing of the conventional light-emitting device.

Explanation of symbols

1: Base body 2: Annular member 3: Reflecting member 4: Light emitting element 5: Translucent member 6: Mounting portion 101: Light emitting device 102: Light emitting device driving circuit board 103: Reflecting jig

Claims (2)

A substrate mounting portion of the light-emitting element is formed on an upper major surface, and an annular member that is attached so as to surround the placing part to the upper major surface of said substrate, taken on the upper major surface of the substrate is deposited, the inner peripheral surface with the lower end of the inner peripheral surface is in contact over the entire circumference on the outer peripheral surface of the annular member and the reflecting member of the light reflecting surface and is a frame-shaped, placed on the placement section The light-emitting element, and a translucent member provided to cover the light-emitting element inside the annular member ,
The light emitting device characterized in that a thermal expansion coefficient of the annular member is smaller than a thermal expansion coefficient of the reflecting member, and a longitudinal elastic coefficient of the annular member is larger than a longitudinal elastic coefficient of the reflecting member . Lighting apparatus characterized by installing the so that light emission device of claim 1 Symbol placing a predetermined arrangement.

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