KR101193909B1 - Lead-frame for led light and method thereof - Google Patents

Abstract

A lead frame for LED lighting and a method for manufacturing the same, At least one pair of electrode plates for supplying power to the LED chip, a chip bonding unit can be bonded to the LED chip; And a guide part configured to enclose the chip bonding part and to guide the encapsulant such that the encapsulant injected into the chip bonding part has a curvature. Thereby, durability and light efficiency can be improved, and the lead frame for LED lighting with a uniform color temperature can be provided.

LED, lighting, color temperature, durable, lead frame

Description

Lead frame for LED lighting and its manufacturing method {LEAD-FRAME FOR LED LIGHT AND METHOD THEREOF}

The present invention relates to a lead frame for an LED package and a manufacturing method thereof, and more particularly, to a lead package for an LED package and a method of manufacturing the same, which is improved in durability and light efficiency and uniform in color temperature.

As LED (hereinafter referred to as "LED") technology is developed, technologies using LED are being used in various fields. In particular, the LED package mounted with the LED chip in the lead frame and injecting the encapsulant is expected to be used in various fields, LED lighting is a typical example.

The LED package is typically manufactured in a form in which an LED chip is mounted on a lead frame, and the lead frame is emitted from a chip bonding portion to which the LED chip is bonded, a pair of electrode plates for supplying power to the LED chip, and an LED chip. And a reflector for reflecting or scattering the light to be made. The reflector is formed to surround the LED chip and receives or reflects or scatters light from the LED chip while the LED chip is turned on, and the light may be lost in the reflection or scattering process. In addition, the reflector not only is exposed to light (for example, UV) emitted from the LED chip for a long time, but also receives heat generated from the LED chip, thereby deteriorating. Due to this deterioration, the reflectance of the light reflected by the reflector is lowered, which leads to a decrease in the brightness.

One object of the present invention is to provide a lead frame for LED lighting with improved durability and a method of manufacturing the same.

Another object of the present invention is to provide a lead frame for LED lighting with improved light efficiency and a method of manufacturing the same.

It is still another object of the present invention to provide a lead frame for LED lighting having a uniform color temperature and a method of manufacturing the same.

The objects include at least a pair of electrode plates for electrical connection with the LED chip; A chip bonding unit to which the LED chip may be bonded; And a guide part configured to enclose the chip bonding part and guide the encapsulant so that the encapsulant injected into the chip bonding part has a curvature.

On the other hand, the at least one electrode plate may be provided with a hole through which resin can be introduced.

In addition, the hole may be formed such that the resin flowing into the hole and the encapsulant contact each other.

On the other hand, the above objects, at least a pair of electrode plates for electrical connection with the LED chip; A chip bonding unit to which the LED chip may be bonded; A dam configured to enclose the chip bonding portion and providing a space in which a fluorescent layer may be injected; And a guide part configured to surround the dam and providing a space in which the transparent layer can be injected.

In addition, the shape of the portion in which the chip is seated in the chip bonding portion may have a shape of any one of a circle, an ellipse, and a polygon.

Meanwhile, the dam may be made of a transparent material or an opaque material through which light can pass.

In addition, the at least one electrode plate may include a hole through which resin can be introduced.

The hole may be formed such that the resin flowing into the hole and the transparent layer contact each other.

The guide part may guide the transparent layer so that the transparent layer has a curvature.

Meanwhile, the dam may separate the chip bonding part into at least one space.

In addition, to achieve the above objects, forming a chip bonding portion to which the LED chip can be bonded; Forming a dam surrounding the chip bonding portion and providing a space in which a fluorescent layer may be injected; And a guide part configured to have a shape surrounding the dam and providing a space in which the transparent layer can be injected, by the method of manufacturing a lead frame for LED lighting.

In addition, the above objects, at least a pair of electrode plates for electrical connection with the LED chip; A chip bonding unit to which the LED chip may be bonded; A dam configured to enclose the chip bonding portion and providing a space in which a fluorescent layer may be injected; A guide part configured to surround the dam and providing a space in which a transparent layer may be injected; And a resin part coupled to the electrode plate, the chip bonding part, the dam, and the guide part to form a body, wherein the dam, the guide part, and the resin part are transparent to allow light to pass therethrough. It may be made of a material.

In addition, the above objects, the substrate; At least a pair of electrode layers coated and formed on the substrate for electrical connection with the LED chip; A chip bonding part formed on the substrate and capable of bonding the LED chip; And a guide part configured to enclose the chip bonding part and guide the encapsulant so that the encapsulant injected into the chip bonding part has a curvature.

The substrate may include a tapered hole or a stepped hole.

In addition, the above objects, the substrate; At least a pair of electrode layers coated and formed on the substrate for electrical connection with the LED chip; A chip bonding part formed on the substrate and capable of bonding the LED chip; And a dam configured to enclose the chip bonding portion and to provide a space in which a fluorescent layer may be injected; It can be achieved by a lead frame for LED lighting comprising a.

The LED lighting lead frame may further include a guide part configured to surround the dam and guide the encapsulant so that the encapsulant injected into the LED illuminating lead frame has a curvature.

In addition, the substrate may include a tapered hole or a stepped hole.

On the other hand, the above objects, at least a pair of electrode plates for electrical connection with the LED chip; A chip bonding unit to which the LED chip may be bonded; And a guide part configured to surround the dam and providing a space in which the transparent layer can be injected, wherein the chip bonding part is recessed to form a space in which the fluorescent layer can be injected. It can be achieved by a lead frame for illumination.

In addition, the above objects, the substrate; At least a pair of electrode layers coated and formed on the substrate for electrical connection with the LED chip; And a chip bonding part formed on the substrate and capable of bonding the LED chip to the substrate, wherein the substrate on which the chip bonding part is formed is recessed to provide a space for injecting a fluorescent layer. It can be achieved by a lead frame for illumination.

The LED lighting lead frame according to the present embodiment has improved durability and light efficiency, and has a uniform color temperature.

First, since the lead frame for LED lighting according to the present embodiment does not include a resin reflector, it is possible to prevent durability degradation due to deterioration of the reflector.

Second, since the LED lighting lead frame according to the present embodiment does not include a reflector, there is no light that is lost in the process of being reflected or scattered by the reflector, and thus the light efficiency may be improved.

Third, the LED lighting lead frame according to the present embodiment has a natural curvature by the surface tension of the encapsulant itself, the light efficiency can be improved.

Fourth, the lead frame for LED lighting according to the present embodiment can ensure a uniform color temperature by forming a fluorescent layer of a constant thickness around the LED chip.

Hereinafter, the present invention will be described in detail with reference to the drawings. In describing the following specific embodiments, various specific details are set forth in order to explain and understand the invention in more detail. However, those skilled in the art can understand that the present invention can be used without these various specific details. In some cases, it is mentioned in advance that parts of the invention which are commonly known in the description of the invention and which are not highly related to the invention are not described in order to prevent confusion in explaining the invention without cause.

1 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention, Figure 2 is a perspective perspective view of the lead frame of Figure 1, Figure 3 is a rear perspective view of the lead frame of Figure 1, Figure 4a is a view FIG. 4B is a cross-sectional view taken along the line YY 'of the lead frame of FIG. 1, and FIG. 4B is a cross-sectional view taken along the line XX' of the lead frame of FIG. 1, and FIG. 5A is taken along the line XX 'of the lead frame of FIG. FIG. 5B is a perspective cross-sectional view taken along the line YY ′ of the lead frame of FIG. 1. FIG.

The present embodiment will now be described in detail with reference to each of these drawings or simultaneously individually.

The LED lighting lead frame according to an embodiment of the present invention (hereinafter, abbreviated as 'LED lighting lead frame' or 'lead frame') 100 is a chip bonding part 131, 132, 135, the at least one pair of electrode plates 123 for electrical connection with the LED chip, and the shape of surrounding the chip bonding parts 131, 132 and 135, and a layer made of a fluorescent material (hereinafter, 'fluorescence' A guide guiding the dam 133 to provide a space into which the layer 'can be injected and a layer formed of a shape surrounding the dam 133 and made of a transparent material (hereinafter,' transparent layer '). The unit 150 is included. A resin is inserted between the chip bonding portion, the electrode plate, and the dam to form the body 140.

According to an embodiment of the present invention, the dam 133 is preferably made of a transparent material that can transmit light, but the dam 133 may be made of an opaque material.

According to another embodiment of the present invention, except for the electrode plate, the dam 133, the resin constituting the body 140, the guide portion 150 may be all made of a transparent material that can transmit light.

The fluorescent layer may be used by mixing a resin with a fluorescent material (a material that absorbs light emitted from a light emitting chip and emits light having a different wavelength). And a filler, a diffusing agent, a pigment, a light diffusing member, etc. can also be mixed with resin. Examples of the fluorescent layer include, but are not limited to, YAG-based, nitride-based nitrides such as alkaline earth silicon nitride phosphors, and oxynitride-based compounds such as alkaline earth silicon oxynitride phosphors. Korean Patent Publication No. 10-2005-0113226 (published date: December 1, 2005) discloses various types of phosphors. This document is incorporated as part of this specification.

The chip bonding part according to the present embodiment may be made of metal or ceramic, but is not limited thereto. 4A and 4B of the present application, the chip bonding portion may include a bottom portion 131 on which an LED chip is mounted, a side portion 132 extending from the bottom portion 131, and a wing portion 135 extending from the side portion 132. ). Here, the side portion 132 and the bottom portion 131 forms a recess in order to provide a space for mounting the LED chip.

The shape of the portion where the chip is mounted in the chip bonding portion (for example, the shape of the bottom portion 131) may have a shape of any one of a circle, an ellipse, and a polygon.

LED lead frame 100 according to an embodiment of the present invention includes a dam surrounding the chip bonding (131, 132, 135) (133). According to the present embodiment, the dam 133 may be made of a transparent material through which light can pass. A detailed description of the function of the dam 133 will be described later with reference to FIG. 6.

1 and 2, a hole 121 is formed in the electrode plate 123. Resin flows into the hole 121, thereby contributing to fixing the plurality of electrode plates 123.

In addition, the hole 121 according to the present embodiment is configured to be in contact with the transparent layer to be injected. For example, a part of the hole 121 into which the resin is injected is covered by the guide part 150 and the body part 140, but another part of the hole 121 into which the resin is injected is exposed. Thereafter, the resin portion of the exposed hole is directly bonded with the transparent layer when the transparent layer is injected. As a result, interfacial separation due to a weakening of the adhesive force between the transparent layer and the electrode plate can be prevented.

6 is a view provided to explain a lead frame for LED lighting according to an embodiment of the present invention.

Referring to FIG. 6, the LED chip 200 is mounted on the chip bonding part, and the fluorescent layer 190 and the transparent layer 180 are injected into the LED chip 200.

The fluorescent layer 190 is injected into the space provided by the dam 133, and as shown in FIG. 6, the fluorescent layer 190 is injected only into the space formed by the dam 133. As described above, since the fluorescent layer 190 is formed only in the space formed by the dam 133, the light emitted from the LED chip 200 passes through the fluorescent layer 190 having almost the same thickness in any direction. . Thereby, the uniformity of color temperature can be ensured.

The light emitted from the LED chip 200 passes through the fluorescent layer 190 injected into the dam 133, and then passes through the transparent layer 180 again. According to the present exemplary embodiment, the transparent layer 180 has a circular shape having a predetermined curvature and serves as a lens. That is, to have a natural curvature by the surface tension of the transparent layer 180 itself.

Conventional LED lighting lead frame is provided with a reflector for reflecting or scattering light in order to give direction to the emitted light, as described above, there was a problem that the light disappears in the process of reflection or scattering.

However, according to the present exemplary embodiment, since the transparent layer 180 has a natural curvature, the amount of light that disappears due to total reflection and the like is smaller than when the transparent layer is formed horizontally, and there is no reflector structure that reflects or scatters light. The efficiency can be improved.

In the present specification, the 'encapsulation material' is used to refer to the fluorescent layer 190 and the transparent layer 180 collectively, except when it is necessary to specifically distinguish the fluorescent layer 190 and the transparent layer 180. These are collectively referred to as encapsulating materials. The transparent layer 180 refers to a layer made of a material having high light transmittance, and may be formed of, for example, epoxy or silicon.

7A is a view provided to explain a guide unit according to an embodiment of the present invention, FIG. 7B is a view provided to explain a guide unit according to another embodiment of the present invention, and FIG. 7C is another embodiment of the present invention. It is a figure provided in order to demonstrate the guide part which concerns on an example.

The guide part 150 illustrated in these figures is a configuration in which the transparent layer 180 has a natural curvature.

The guide part 150 of FIG. 7A has a configuration in which the transparent layer 180 protrudes from the left side of the z axis with a curvature based on the z axis. According to an embodiment of the present invention, the transparent layer 180 preferably has a predetermined surface tension, and the transparent layer 180 is moved to the right of the z-axis by the surface tension of the transparent layer 180 and the adhesion between the guide part 150. It does not flow, but is formed with curvature on the left side of the z axis. The guide part 150 of FIG. 7B is also configured to protrude, and in the same principle as described above, the transparent layer 180 is formed with curvature. On the other hand, like the guide portion 150 of Figure 7c, it may be configured in a flat form without protruding.

8 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention, Figure 9 is a perspective perspective view of the lead frame of Figure 8, Figure 10 is a rear perspective view of the lead frame of Figure 8, Figure 11a is a view 8 is a cross-sectional view taken along the line YY 'of the lead frame of FIG. 8, FIG. 11B is a cross-sectional view taken along the line XX' of the lead frame of FIG. 8, and FIG. 12A is taken along the line XX 'of the lead frame of FIG. FIG. 12B is a perspective cross-sectional view taken along the line YY ′ of the lead frame of FIG. 8. FIG. 13 is a view provided to explain a LED lighting lead frame according to an embodiment of the present invention. FIG. 13. Is a view provided to explain a lead frame for LED lighting according to an embodiment of the present invention.

Referring to these drawings, the LED lighting lead frame 600 according to an embodiment of the present invention, the chip bonding portion 631, 632, 635 to which the LED chip is bonded, and at least one for the electrical connection with the LED chip A pair of electrode plates 623 and a guide portion 650 configured to surround the chip bonding portions 631, 632, and 635 and guide the encapsulant to be formed with curvature are included. A resin is inserted between these chip bonding portions, electrode plates, and guide portions to form the body 640.

8 differs from the embodiment in FIG. 1 in that it does not include a dam, and has a common point in that it has a guide part. Therefore, in the embodiment of FIG. 8, the encapsulant does not need to be divided into a transparent layer and a fluorescent layer as in the embodiment of FIG. 1, and may be composed of only a fluorescent layer.

Referring to FIG. 13, the LED chip 200 is mounted on a chip bonding part, and an encapsulant is injected into the LED chip 200. For example, the encapsulant may be configured in such a manner that a fluorescent layer is injected into a portion indicated by reference numeral 690 and a transparent layer is injected into a portion indicated by reference numeral 680. Meanwhile, a method of injecting only the fluorescent layer into the portions indicated by reference numerals 680 and 690 without dividing the transparent layer and the fluorescent layer is also possible. The guide part 650 may employ a guide part as shown in FIGS. 7A to 7C described above so that the encapsulant may be formed with a natural curvature, but is not limited thereto.

14 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention, FIG. 15 is a perspective perspective view of the lead frame of FIG. 14, FIG. 16 is a rear perspective view of the lead frame of FIG. 14, and FIG. 17 is a view of FIG. 14 is a cross-sectional view taken along the line XX 'of the lead frame, and FIG. 18 is a cross-sectional view taken along the line YY' of the lead frame of FIG.

Referring to FIGS. 14 to 18, the LED lighting lead frame according to the embodiment of the present invention will be described. The LED lighting lead frame includes a chip bonding unit 731a, 731b, and 731c to which an LED chip is bonded, and an LED chip. And at least one pair of electrode plates 723, a dam 733, and a guide part 750 for electrical connection therewith. A resin is inserted between the chip bonding portion, the electrode plate, and the dam to form the body 740.

Here, the dam 733 is configured to separate the chip bonding portions 731a, 731b, and 731c into a plurality of regions, and surround the separated chip bonding portions 731a, 731b, and 731c. As described above, a fluorescent layer may be injected into the dam 773. In addition, the guide part 750 is configured in a shape surrounding the dam 733, and guides the layer formed of a transparent material (hereinafter, 'transparent layer') to have a curvature.

In this embodiment, as in the embodiment of FIG. 1, a fluorescent layer is formed in a space formed by the dam 733, and a transparent layer is formed on the fluorescent layer. In addition, the transparent layer on the fluorescent layer is formed to have a curvature by the guide portion 750, for this purpose, the guide portion 750 may be configured in the shape as shown in Figures 7a to 7c described above. The dam 733 may be made of a transparent material through which light can be transmitted, and the guide part 750 may be made of a transparent or opaque material. 14, similar to the embodiment of FIG. 1, components other than the electrode plate 723, for example, a dam 733, a resin constituting the body 740, and a guide part 750 are described. All may be made of a material that can transmit light. Each component of the embodiment of FIG. 14 performs the same or similar function as those having similar reference numerals in FIG. 1, and for details, refer to the description of FIG. 1.

Referring to FIG. 17, the dam 733 separates the chip bonding portion into three regions A, B, and C spatially, and chips may be bonded to each of the three regions. Subsequently, fluorescent layers are formed on the bonded chips, and transparent layers are formed on the fluorescent layers. In the present embodiment, the chip bonding portion is divided into three regions by the dam 733, but this is merely an example and is not limited to three. That is, the dam 733 may be configured to separate the chip bonding portion into two or four or more regions.

19 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 20 is a perspective perspective view of the lead frame of FIG. 19, FIG. 21 is a rear perspective view of the lead frame of FIG. 19, and FIG. 22 is a view of FIG. 19 is a perspective cross-sectional view cut along the line XX 'of the lead frame of FIG. 19, and FIG. 23 is a perspective cross-sectional view cut along the YY' line of the lead frame of FIG.

19 to 23, the LED lighting lead frame according to an embodiment of the present invention will be described. The LED lighting lead frame includes a chip bonding unit 831a, 831b, and 831c to which an LED chip is bonded, and an LED chip. And at least one pair of electrode plates 823, dams 833, and guides 850 for electrical connection therewith. A resin is inserted between the chip bonding portion, the electrode plate, and the dam to form the body 840.

Like the dam 733 of FIG. 14, the dam 833 separates the chip bonding part into three (A, B, C) area spatially. A chip may be bonded to each of these three regions, and then a fluorescent layer is formed on each of the bonded chips, and a transparent layer is formed on the fluorescent layer, which is the same as the embodiment of FIG. 14 described above. The guide part 850 of FIG. 19 may also be configured to have the same shape as that of FIGS. 7A to 7C to guide the transparent layer and to impart a natural curvature.

19 is different from the embodiment of FIG. 14 in the shape of a dam, but the remaining components have a similar structure to each other. Accordingly, each component of the embodiment of FIG. 19 performs the same or similar function as those having similar reference numerals in FIG. 14, and for details, refer to the description of FIG. 14.

24 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 25 is a perspective perspective view of the lead frame of FIG. 24, FIG. 26 is a rear perspective view of the lead frame of FIG. 24, and FIG. 27 is a view of FIG. FIG. 28 is a cross-sectional view taken along the line XX ′ of the lead frame of FIG. 24, and FIG. 28 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 24.

24 to 28, when describing the LED lighting lead frame according to an embodiment of the present invention, the LED lighting lead frame, the chip bonding unit 931, the LED chip is bonded to the electrical connection with the LED chip At least one pair of electrode layers 926a, 926b, 926c, and 926d, a substrate 924, a dam 933, a guide portion 950, and coupling holes 948a, 948b, 948c, and 948d. A resin is inserted between the chip bonding portion, the electrode layer, the substrate, and the dam, and the coupling hole to form the body 940.

The resin is inserted through the coupling holes 948a, 948b, 948c, and 948d, thereby strongly bonding the substrate 924 and the resin injection molded product. Furthermore, a portion of the resin inserted through the coupling holes 948a, 948b, 948c, and 948d is exposed to be combined with the encapsulating material, so that the encapsulating material, the substrate, and the resin are strongly bonded.

The coupling holes 948a, 948b, 948c, and 948d may be tapered as shown in FIG. 25 or configured to have a step as shown in FIG. 48 to be described later. On the other hand, the coupling holes in the embodiments to be described later, even if not explicitly mentioned, may be configured to be tapered or stepped.

The substrate 924 may be formed of a ceramic material, but may be formed of a material other than the ceramic material. For example, the substrate 924 may be made of an insulating material having predetermined durability and heat resistance.

The electrode layers 926a, 926b, 926c, and 926d may be formed by coating a conductive material such as silver or copper on the substrate 924.

According to the present exemplary embodiment, the chip bonding part 931 is positioned in the center region of the substrate 924 and is formed by coating a material having high thermal conductivity such as silver or copper on the center region of the substrate 924. As such, the coating of the chip bonding part 931 with a material having high thermal conductivity is for dissipating heat to be generated from the chip. Referring to FIG. 24, it can be seen that a plurality of heat dissipation holes 928 are formed in the chip bonding part 931. The heat dissipation holes 928 are holes passing through the substrate 924. It may be filled by a material having high thermal conductivity such as silver paste. The heat dissipation port 928 is connected to the heat sink layer 934 formed on the rear surface of the LED lighting lead frame so that heat dissipated from the chip is discharged to the outside. Meanwhile, the heat sink layer 934 may be formed by coating the substrate 924 with a material having high thermal conductivity.

Referring to FIGS. 27 and 28, the dam 933 surrounds the chip bonding portion 931 and forms a space A in which a fluorescent layer may be formed. When the chip is bonded to the chip bonding unit 931, a fluorescent layer is formed thereon, and a transparent layer is formed on the fluorescent layer. As in the above-described embodiments, the fluorescent layer is located in the space A formed by the dam 933. The dam 933 may be formed of a transparent material, and the guide part 950 may be formed of a transparent or opaque material.

The guide part 950 may be configured to have a shape as shown in FIGS. 7A to 7C to guide the transparent layer not to flow to the outside and to impart a natural curvature to the transparent layer.

The electrode layers 926a, 926b, 926c, and 926d are electrically connected to the chip bonded to the chip bonding unit 931. For example, the electrode layers 926a, 926b, 926c, and 926d may be connected to the chip by wires to supply power to the chip.

Referring to FIG. 24, although the electrode layer 926a and the electrode layer 926b are visually shown to be separated from each other by a dam 933, the electrode layer 926a and the electrode layer 926b are electrically connected to each other. It is configured to be. That is, after the electrode layer 926a and the electrode layer 926b are integrally coated on the substrate 924, the dam 933 is positioned thereon. Referring to FIG. 26, in addition to the heat dissipation hole 928, there are two holes penetrating through the substrate 924, among which holes 936a are electrically connected to the electrode layer 926a and the electrode layer 926b.

In addition, in the embodiment of FIG. 24, the electrode layer 926c and the electrode layer 926d are also configured to be electrically connected to each other. That is, after the electrode layer 926c and the electrode layer 926d are integrally coated on the substrate 924, the dam 933 is positioned thereon. Referring to FIG. 26, a hole 936b penetrating the substrate 924 electrically connects the electrode layer 926c and the electrode layer 926d.

The above-described holes 936a and 936b are formed in the coating layers 938a and 938b made of a conductive material. That is, the holes 936a and 936b may electrically connect the coating layers 938a and 938b and the electrode layers 926a, 926b, 926c and 926d of the conductive material, respectively.

In the above embodiment, the electrode layer 926a and the electrode layer 926b have been described as being electrically connected to each other, but they may be electrically insulated from each other. In addition, the electrode layer 926c and the electrode layer 926d may be configured to be electrically insulated from each other.

29 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 30 is a perspective perspective view of the lead frame of FIG. 29, FIG. 31 is a rear perspective view of the lead frame of FIG. 29, and FIG. 32 is a view of FIG. It is sectional drawing cut along the XX 'line of the lead frame of FIG. 29, and FIG. 33 is sectional drawing cut along the YY' line of the lead frame of FIG.

Referring to Figure 29 to Figure 33, when explaining the LED lighting lead frame according to an embodiment of the present invention, the LED lighting lead frame, the chip bonding unit 1031, the LED chip is bonded to the electrical connection with the LED chip A pair of electrode layers 1026a, 1026b, a substrate 1024, a guide portion 1050, and coupling holes 1048a, 1048b, 1048c, and 1048d. Then, a resin is inserted between the chip bonding portion, the electrode layer, and the substrate, and the bonding hole to form the body 1040.

Here, a plurality of heat dissipation holes 1028 are formed in the chip bonding portion 1031, and through holes 1036a and 1036b are formed in the electrode layers 1026a and 1026b, respectively. Referring to FIG. 31, the heat sink layer connected to the heat dissipation hole 1028 is coated on the substrate 1024, and the coating layers 1038a and 1038b of the conductive material connected to the through holes 1036a and 1036b are formed on the substrate 1024. Is formed on the coating.

The embodiment of FIG. 29 has a substantially similar structure except that it does not have a dam when compared to the embodiment of FIG. 24. Accordingly, each component of the embodiment of FIG. 29 performs the same or similar function as those denoted by like reference numerals in FIG. 24, and for details, refer to the description of FIG. 24 described above.

34 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 35 is a perspective perspective view of the lead frame of FIG. 34, FIG. 36 is a rear perspective view of the lead frame of FIG. 34, and FIG. 37 is a view of FIG. It is sectional drawing cut along the XX 'line of the lead frame of FIG. 34, and FIG. 38 is sectional drawing cut along the YY' line of the lead frame of FIG.

Referring to Figure 34 to Figure 38, when explaining the LED lighting lead frame according to an embodiment of the present invention, the LED lighting lead frame, the chip bonding unit 1131, the LED chip is bonded to the electrical connection with the LED chip And a pair of electrode layers 1126a, 1126b, 1126c, and 1126d, a substrate 1124, a dam 1133, coupling holes 1148a, 1148b, 1148c, and 1148d, and a guide part 1150. The resin 1 is inserted into the chip bonding portion, the electrode layer, and the bonding hole, and the body 1140 is formed.

Here, a plurality of heat dissipation holes 1128 are formed in the chip bonding portion 1131, and through holes 1136a and 1136b are formed in the electrode layers 1126a, 1126b, 1126c, and 1126d, respectively. Referring to FIG. 36, a heat sink layer connected to the heat dissipation hole 1128 is coated on the substrate 1124, and coating layers 1138a and 1138b of conductive material connected to the through holes 1136a and 1136b are formed on the substrate 1124. On the coating is formed.

The embodiment of FIG. 34 has a structure similar to that of the embodiment of FIG. 24 except that the chip bonding portion is recessed into a cavity shape. Accordingly, each component of the embodiment of FIG. 34 performs the same or similar function as those denoted by like reference numerals in FIG. 24, and for details, refer to the description of FIG. 24 described above.

39 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 40 is a perspective perspective view of the lead frame of FIG. 39, FIG. 41 is a rear perspective view of the lead frame of FIG. 39, and FIG. 42 is a view of FIG. It is sectional drawing cut along the XX 'line of the lead frame of FIG. 39, and FIG. 43 is sectional drawing cut along the YY' line of the lead frame of FIG.

Referring to FIGS. 39 to 43, a LED lighting lead frame according to an embodiment of the present invention will be described. The LED lighting lead frame includes a chip bonding part 1231 and 1232 to which an LED chip is bonded and an LED chip. A pair of electrode layers 1226a and 1226b, a substrate 1224, coupling holes 1248a, 1248b, 1248c and 1248d for electrical connection, and a guide portion 1250 are included. The resin 1 is inserted into the chip bonding portion, the electrode layer, and the bonding hole, and the body 1240 is formed.

Here, the chip bonding portion is composed of side portions 1232 and bottom portions 1231, and these side portions 1232 and bottom portions 1231 form recesses to provide a space for mounting the LED chip. A plurality of heat dissipation holes 1228 are formed in the bottom portion 1231 of the chip bonding portion, and through holes 1236a and 1236b are formed in the electrode layers 1226a and 1226b, respectively. Referring to FIG. 39, a heat sink layer connected to the heat dissipation hole 1228 is coated on the substrate 1224, and coating layers 1238a and 1238b made of a conductive material connected to the through holes 1236a and 1236b are formed on the substrate 1224. On the coating is formed.

The embodiment of Fig. 39 is configured such that the chip bonding portion forms a recess. According to an embodiment of the present invention, the fluorescent layer may be positioned in the concave portion, and the transparent layer may be positioned on the fluorescent layer. On the other hand, a configuration in which only the fluorescent layer is evenly injected is also possible without forming two layers.

The embodiment of FIG. 39 has a similar structure to that of the embodiment of FIG. 34 except that there is no dam. Accordingly, each component of the embodiment of FIG. 39 performs the same or similar function as those denoted by like reference numerals in FIG. 34, and for details, refer to the description of FIG. 34.

FIG. 44 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention, FIG. 45 is a perspective perspective view of the lead frame of FIG. 44, and FIG. 46 is a rear perspective view of the lead frame of FIG. 44.

44 to 47, when describing the LED lighting lead frame according to an embodiment of the present disclosure, the LED lighting lead frame includes chip bonding units 1331a, 1331b, 1331c, and 1331d to which the LED chips are bonded. At least one pair of electrode layers 1326a, 1326b, 1326c, 1326d, 1326e, 1326f, 1326g for electrical connection with the LED chip, substrate 1324, dam 1333, coupling holes 1348a, 1348b, 1348c, 1348d ), And a guide portion 1350. The resin 1 is inserted into the chip bonding portion, the electrode layer, and the bonding hole, and the body 1340 is formed.

Here, a plurality of heat dissipation holes 1328a, 1328b, 1328c, and 1328d are formed in the chip bonding units 1331a, 1331b, 1331c, and 1331d, respectively, and the electrode layers 1326a, 1326b, 1326c, 1326d, 1326e, 1326f, and 1326g, respectively. Through holes 1336a, 1336b, 1336c, 1336d, 1336e, 1336f, and 1336g are formed. Referring to FIG. 46, a heat sink layer 1334 connected to the heat dissipation holes 1328a, 1328b, 1328c, and 1328d is coated on the substrate 1324, and the through holes 1336a, 1336b, 1336c, 1336d, 1336e, and 1336f are formed. , 1336g) are coated with a conductive layer coated on the substrate 1324.

Referring to FIG. 44, the dam 1333 surrounds the chip bonding parts 1331a, 1331b, 1331c, and 1331d to form a space in which the fluorescent layer may be formed. In the embodiment of FIG. 44, the dam 1333 separates the chip bonding units 1331a, 1331b, 1331c, and 1331d into four regions spatially.

When chips are bonded to the chip bonding units 1331a, 1331b, 1331c, and 1331d, respectively, a fluorescent layer is formed thereon, and a transparent layer is formed on the fluorescent layer. As in the above-described embodiments, the fluorescent layer is located in the space formed by the dam 1333. The dam 1333 may be formed of a transparent material, and the guide part 1350 may be formed of a transparent or opaque material. The guide part 1350 may be configured to have a shape as shown in FIGS. 7A to 7C to guide the transparent layer not to flow to the outside and to impart a natural curvature to the transparent layer.

The electrode layers 1326a, 1326b, 1326c, 1326d, 1326e, 1326f, and 1326g are electrically connected to the chips bonded to the chip bonding parts 1331a, 1331b, 1331c, and 1331d. For example, the electrode layers 1326a, 1326b, 1326c, 1326d, 1326e, 1326f, and 1326g may be connected to the chip by a wire to supply power to the chip.

Although the dam in the embodiment of FIG. 44 has been described as being formed of resin, it may be configured to have the shape of the dam by recessing the chip bonding portion, as in the embodiment of FIG. 58 described later.

FIG. 47 is a plan view of a lead frame for LED lighting according to an embodiment of the present invention, and FIG. 48 is a perspective perspective view of FIG. 47.

The embodiment of FIG. 47 replaces the tapered coupling hole in the stepped configuration in the LED lighting lead frame shown in FIG. 29, and removes the guide part arbitrarily for convenience of description. Thus, each component of the embodiment of FIG. 47 has a similar function to components having similar reference numerals in FIG. 29.

49 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention, FIG. 50 is a perspective perspective view of the lead frame of FIG. 49, FIG. 51 is a rear perspective view of the lead frame of FIG. 49, and FIG. 52 is of FIG. 49. Sectional drawing cut along the XX 'line of a lead frame, FIG. 53 is sectional drawing cut along the line YY' of the lead frame of FIG.

FIG. 49 is a lead frame for LED lighting according to an embodiment of the present invention, which is one of the modified embodiments of the LED lighting lead frame illustrated in FIG. The embodiment illustrated in FIG. 49 includes a pair of electrodes 1450 unlike the embodiment of FIG. 1, which includes three pairs of electrodes. The embodiment of FIG. 49 has a shape surrounding the chip bonding unit 1431 to which the LED chip is bonded, a pair of electrode plates 1423 for electrical connection with the LED chip, and the chip bonding unit 1431. And a dam 1433 providing a space in which the fluorescent layer can be injected, and a guide portion 1450 configured to surround the dam 1433 and guide the transparent layer to be formed with curvature. A resin is inserted between the chip bonding portion and the electrode plate to form the body 1440. Each component of the embodiment of FIG. 49 has a similar function to components having similar reference numerals in FIG. 1.

FIG. 54 is a front perspective view according to an embodiment of the present invention, and FIG. 55 is a rear perspective view of the lead frame of FIG. 55.

FIG. 54 is a lead frame for LED lighting according to an embodiment of the present invention, and is a modified embodiment of the LED lighting lead frame illustrated in FIG. 49. The embodiment illustrated in FIG. 49 has a configuration in which a dam made of resin is positioned on the chip bonding portion, but the embodiment of FIG. 54 is configured to function as a dam by recessing the chip bonding portion. The embodiment of FIG. 54 has a shape surrounding a chip bonding unit 1531 to which an LED chip is bonded, a pair of electrode plates 1523 for electrical connection with the LED chip, and a chip bonding unit 1531. And a dam 1533 configured to provide a space in which the fluorescent layer can be injected, and a guide portion 1550 configured to surround the dam 1533 and guide the transparent layer to be formed with curvature. A resin is inserted between the chip bonding portion and the electrode plate to form the body 1540. Each component of the embodiment of FIG. 54 has a similar function to components having similar reference numerals in FIG. 49.

56 is a front perspective view according to an embodiment of the present invention, and FIG. 57 is a rear perspective view of the lead frame of FIG. 56.

FIG. 56 is a lead frame for LED lighting according to an embodiment of the present invention, which is a modified embodiment of the LED lighting lead frame illustrated in FIG. 14. Although the embodiment illustrated in FIG. 14 has a configuration in which a dam made of resin is positioned on the chip bonding portion, the embodiment of FIG. 56 is configured to function as a dam by recessing the center of the chip bonding portion. 56 has a shape surrounding the chip bonding unit 1631 to which the LED chip is bonded, at least one pair of electrode plates 1623 for electrical connection with the LED chip, and the chip bonding unit 1631. And three dams 1633 configured to provide a space in which the fluorescent layer may be injected, and a guide portion 1650 configured to surround the dam 1633 and guide the transparent layer to be formed with curvature. A resin is inserted between the chip bonding portion and the electrode plate to form the body 1640. Each component of the embodiment of FIG. 56 has a similar function to components having similar reference numerals in FIG. 14.

FIG. 58 is a front perspective view according to an embodiment of the present invention, and FIG. 59 is a rear perspective view of the lead frame of FIG. 58.

58 is a lead frame for LED lighting according to an embodiment of the present invention, which is one embodiment of a modified embodiment of the LED lighting lead frame illustrated in FIG. 24 or 29. The embodiment illustrated in FIG. 24 has a configuration in which a dam made of resin is located, but the embodiment of FIG. 58 is configured to function as a dam by recessing the center of the ceramic substrate. In addition, although the embodiment of FIG. 29 does not have a dam, the embodiment of FIG. 58 is configured to function as a dam by recessing the center of the ceramic substrate to function as a dam. 58 illustrates a chip bonding unit 1731 to which an LED chip is bonded, at least one pair of electrode plates 1723s and 1723b for electrical connection with the LED chip, and a chip bonding unit 1731. Dam 1733, which is configured in a shape and provides a space in which the fluorescent layer can be injected, a guide portion 1750, which is configured in a shape surrounding the dam 1733 and guides the transparent layer to be formed with curvature, and a heat radiating hole 1728 ), Through holes 1748a, 1748b, 1748c, and 1748d. A resin is inserted between the chip bonding portion and the substrate to form the body 1740. Each component of the embodiment of FIG. 58 has a similar function to components having similar reference numerals in FIG. 24 or FIG. 29.

Embodiments as described above can be produced, for example, by an insert injection method.

According to the insert injection method, the embodiment of FIG. 1 inserts the chip bonding part and the electrode plate into the injection mold and then injection molding the resin to complete the body, the guide part, the dam, etc. It can be produced in a manner.

On the other hand, in an embodiment using a substrate such as ceramic, on the ceramic substrate, the coating layer for the electrode layer, the chip bonding portion, and the heat sink layer is formed, and the coated ceramic is inserted into the injection mold and then injected into the resin. It can be molded and completed.

In another embodiment using a substrate such as a ceramic, a portion of the ceramic substrate can be recessed to function as a dam, and a coating layer for the electrode layer, the chip bonding portion, and the heat sink layer is formed on the ceramic substrate, and the coating is applied. One ceramic substrate can be inserted into an injection mold and then injection molded with resin to complete.

In the above-described embodiments, all the guide parts guide the encapsulant not to flow to the outside and at the same time, the encapsulant has a natural curvature. To this end, the guide unit may have a configuration as shown in FIGS. 7A to 7C. In addition, all the dams in the above embodiments are preferably made of a transparent material, and a chip is mounted in the space formed by the dam, and the fluorescent layer is injected. All of the above-described embodiments having a dam have a configuration in which the fluorescent layer is located in the dam, and the transparent layer is located again on the fluorescent layer. On the other hand, those skilled in the art to which the present invention belongs, although the dam of the embodiments of the present invention described above is preferably made of a transparent material that can transmit light, the dam may also be composed of an opaque material It should be known.

On the other hand, as the structure without a dam in the above-described embodiments, when the chip bonding portion has a concave portion, the encapsulant may be injected into any one of two types. For example, the first type is a configuration in which the fluorescent layer is located in the concave portion, and the transparent layer is positioned on the fluorescent layer again, and the second type is an encapsulant only by the fluorescent layer.

While the above has been shown and described with respect to preferred embodiments of the present invention, the present invention is not limited to the specific embodiments described above, it is usually in the technical field to which the invention belongs without departing from the spirit of the invention claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

1 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention;

Figure 2 is a perspective perspective view of the lead frame of Figure 1,

3 is a rear perspective view of the lead frame of FIG. 1;

4A is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 1;

4B is a cross-sectional view taken along the line XX ′ of the lead frame of FIG. 1;

Figure 5a is a perspective cross-sectional view taken along the line XX 'of the lead frame of Figure 1,

5B is a perspective cross-sectional view taken along the line YY ′ of the lead frame of FIG. 1;

6 is a view provided to explain a lead frame for LED lighting according to an embodiment of the present invention,

7A is a view provided to explain a guide unit according to an embodiment of the present invention;

7B is a view provided to explain a guide unit according to another embodiment of the present invention;

7c is a view provided to explain a guide unit according to another embodiment of the present invention;

8 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention;

9 is a perspective perspective view of the lead frame of FIG. 8, FIG.

10 is a rear perspective view of the lead frame of FIG. 8;

FIG. 11A is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 8; FIG.

FIG. 11B is a cross-sectional view taken along the line XX ′ of the lead frame of FIG. 8; FIG.

12A is a perspective cross-sectional view taken along the line XX 'of the lead frame of FIG. 8;

12B is a perspective cross-sectional view taken along the line YY ′ of the lead frame of FIG. 8;

13 is a view provided to explain a lead frame for LED lighting according to an embodiment of the present invention,

14 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention;

15 is a perspective perspective view of the lead frame of FIG. 14;

16 is a rear perspective view of the lead frame of FIG. 14;

17 is a cross-sectional view taken along the line XX ′ of the lead frame of FIG. 14;

18 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 14;

19 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

20 is a perspective perspective view of the lead frame of FIG. 19;

21 is a rear perspective view of the lead frame of FIG. 19;

FIG. 22 is a cross-sectional view taken along line XX ′ of the lead frame of FIG. 19; FIG.

FIG. 23 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 19; FIG.

24 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

25 is a perspective perspective view of the lead frame of FIG. 24;

26 is a rear perspective view of the lead frame of FIG. 24;

27 is a cross-sectional view taken along the line XX 'of the lead frame of FIG. 24;

28 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 24;

29 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

30 is a perspective perspective view of the lead frame of FIG. 29;

31 is a rear perspective view of the lead frame of FIG. 29;

32 is a cross-sectional view taken along the line XX ′ of the lead frame of FIG. 29;

33 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 29;

34 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

35 is a perspective perspective view of the lead frame of FIG. 34;

36 is a rear perspective view of the lead frame of FIG. 34;

37 is a cross-sectional view taken along the line XX 'of the lead frame of FIG. 34;

38 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 34;

39 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

40 is a perspective perspective view of the lead frame of FIG. 39;

41 is a rear perspective view of the lead frame of FIG. 39;

FIG. 42 is a cross-sectional view taken along the line XX 'of the lead frame of FIG. 39;

43 is a cross-sectional view taken along the line YY ′ of the lead frame of FIG. 39;

44 is a front perspective view of a lead frame for LED lighting according to another embodiment of the present invention;

45 is a perspective perspective view of the lead frame of FIG. 44;

46 is a rear perspective view of the lead frame of FIG. 44;

47 is a plan view of a lead frame for LED lighting according to an embodiment of the present invention;

48 is a perspective perspective view of FIG. 47;

49 is a front perspective view of a lead frame for LED lighting according to an embodiment of the present invention;

50 is a perspective perspective view of the lead frame of FIG. 49;

51 is a rear perspective view of the lead frame of FIG. 49;

52 is a cross-sectional view taken along the line XX 'of the lead frame of FIG. 49;

53 is a cross-sectional view taken along the line YY 'of the lead frame of FIG. 49;

54 is a front perspective view according to an embodiment of the present invention;

55 is a rear perspective view of the lead frame of FIG. 55;

56 is a front perspective view according to an embodiment of the present invention;

FIG. 57 is a rear perspective view of the lead frame of FIG. 56; FIG.

58 is a front perspective view according to an embodiment of the present invention, and

FIG. 59 is a rear perspective view of the lead frame of FIG. 58.

Brief description of the symbols in the drawings

100, 600: lead frame for LED lighting 121, 161: hole

123 and 163: electrode plates 131 and 631: bottom part

132, 632: side portion 135, 635: wing portion

133: dam 140, 640: body portion

150, 650: guide part

Claims (19)

At least one pair of electrode plates for electrical connection with the LED chip; A chip bonding unit to which the LED chip may be bonded; A dam configured to enclose the chip bonding portion and providing a space in which a fluorescent layer may be injected; And  And a guide part configured to surround the dam, to provide a space in which the transparent layer can be injected, and to guide the transparent layer so that the transparent layer is formed with curvature. The at least one electrode plate has a hole through which resin can be introduced, The lead frame for LED lighting, characterized in that the resin flowing into the hole and the transparent layer is formed in contact with each other. delete delete delete The method of claim 1, The shape of the portion in which the chip is seated in the chip bonding portion is a lead frame for LED lighting, characterized in that it has a shape of any one of circular, oval, and polygon. The method of claim 1, The dam is a lead frame for LED lighting, characterized in that consisting of a transparent material or an opaque material that can transmit light. delete delete delete The method of claim 1, The dam, LED chip lead frame, characterized in that for separating the chip bonding portion into at least one space. delete The method of claim 1, And a resin part combined with the electrode plate, the chip bonding part, the dam, and the guide part to form a body. The dam, the guide part, and the resin part is made of a transparent material through which light can pass, and the resin introduced into the hole is a part of the resin part. The method of claim 1, Further comprising; And the at least one pair of electrode plates and the chip bonding portions are respectively located on the substrate. 14. The method of claim 13, The substrate is a lead frame for LED lighting, characterized in that it comprises a tapered hole or stepped hole. delete delete delete 14. The method of claim 13, The chip bonding part is recessed to form a space in which the fluorescent layer can be injected lead frame for LED lighting. 14. The method of claim 13, The substrate on which the chip bonding portion is located is recessed, thereby providing a space in which the fluorescent layer can be injected.

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