CN109887906A - A kind of high reflection LED package support - Google Patents
A kind of high reflection LED package support Download PDFInfo
- Publication number
- CN109887906A CN109887906A CN201910133869.6A CN201910133869A CN109887906A CN 109887906 A CN109887906 A CN 109887906A CN 201910133869 A CN201910133869 A CN 201910133869A CN 109887906 A CN109887906 A CN 109887906A
- Authority
- CN
- China
- Prior art keywords
- high reflection
- substrate
- box dam
- convex annular
- package support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000003292 glue Substances 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 241000826860 Trapezium Species 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 7
- -1 methyl silica gel Chemical compound 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910052681 coesite Inorganic materials 0.000 claims description 3
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 229910052906 cristobalite Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229910052682 stishovite Inorganic materials 0.000 claims description 3
- 229910052905 tridymite Inorganic materials 0.000 claims description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 3
- 239000011324 bead Substances 0.000 claims description 2
- 238000002310 reflectometry Methods 0.000 abstract description 6
- 238000000605 extraction Methods 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of high reflection LED package supports, including plate, insulation box dam, metal lead wire frame, it is characterized by: the metal lead wire frame is arranged in the substrate, the insulation box dam surrounds baltimore groove in the upper surface of the substrate, the cross sectional shape of the insulation box dam is right-angled trapezium, and bevel edge is in the inside of the box dam；It is provided with convex annular island in the baltimore groove to be located on the substrate, the encircled area of convex annular island on the substrate is LED wafer installing zone；The area of the LED wafer installing zone is less than the area of the spill trench bottom, and high reflection white glue is filled between the convex annular island and the insulation box dam；Using the convex island of mold one-pass molding, realize that secondary spraying high reflection glue or gluing process increase reflector angle and realizes that a completely new packaging body is coated with the high white glue of reflectivity in package support, and reflection angle is increased, the reflectivity of light is improved, to improve the extraction efficiency of light.
Description
Technical field
The present invention relates to LED encapsulation technology field, especially a kind of high reflection LED package support.
Technical background
As shown in Figure 1, the LED package support of existing QFN form is made of metal lead wire frame and insulation box dam；Wherein
Metal lead wire frame is made of substrate metal and coated metal, and overall thickness is in 0.10mm~0.35mm, and the box dam that insulate is by heat curing type
The bowl height formed with thermoplastic resin filler material is determined by chip thickness and packaging technology；The bracket that the two is constituted is subsequent
LED encapsulation provides carrier, radiation conductive channel and protection etc.；But this kind of package support can not effectively promote light extraction efficiency.
Summary of the invention
To solve the above problems, improving package support light the object of the present invention is to provide a kind of high reflection LED package support
Reflectivity.
It is realized in the embodiment of the present invention using following scheme: a kind of high reflection LED package support is provided, including substrate, absolutely
Edge box dam, metal lead wire frame, the metal lead wire frame are arranged in the substrate, and the insulation box dam is in the substrate
Upper surface surround baltimore groove, the cross sectional shape of the insulation box dam is right-angled trapezium, and the bevel edge of the right-angled trapezium is described
The inside of box dam；It is provided with convex annular island in the baltimore groove to be located on the substrate, convex annular island is on the substrate
Encircled area is LED wafer installing zone；The area of the LED wafer installing zone is less than the area of the spill trench bottom, in institute
State filling high reflection white glue between convex annular island and the insulation box dam.
In one embodiment of the invention, the filling region of the high reflection white glue is the substrate, the inclined-plane of the box dam, institute
The closed area of line composition between at the top of the island Shu Tu and the convex island and at the top of the bevel edge.
In one embodiment of the invention, in the substrate be located at convex annular island a side on the downside of be provided with insulation every
The metal lead wire frame is separated into two parts by item, in favor of separating the positive and negative anodes of metal lead wire frame.
In one embodiment of the invention, the surface bottom of the high reflection white glue is overlapped with the vertex on the convex island.
In one embodiment of the invention, the vertical line on the inclined-plane and the convex island vertex that are formed after the high reflection white glue filling
Angle is a=56 °.
In one embodiment of the invention, the angle of the vertical line of the bevel edge and the substrate is b=12 °.
In one embodiment of the invention, the insulation box dam, the substrate and the convex annular island use epoxide resin material,
The high reflection white glue is tuned into using methyl silica gel or phenyl silica gel with white powder, the materials'use TiO of the white powder2
Or ZrO2Or ZnO or SiO2Or Al2O3。
Beneficial effects of the present invention: convex using mold one-pass molding the present invention provides a kind of high reflection LED package support
Island realizes that secondary spraying high reflection glue or gluing process increase reflector angle and realizes that a completely new packaging body is applied in package support
There is the white glue that reflectivity is high, and increase reflection angle, improve the reflectivity of light, to improve the extraction efficiency of light.
Detailed description of the invention
Fig. 1 is original QFN enclosure support structure schematic diagram.
Fig. 2 is a kind of high reflection LED package support sectional view.
Fig. 3 is schematic diagram after a kind of high reflection LED package support encapsulation LED wafer.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing.
It please refers to Fig.1 to Fig.3, the present invention provides a kind of high reflection LED package support, including substrate 3, insulation box dam 1, gold
Belong to lead frame 301, the metal lead wire frame 301 is arranged in the substrate 3, and the insulation box dam 1 is in the substrate 3
Upper surface surround baltimore groove, the cross sectional shape of the insulation box dam 1 is right-angled trapezium, and the right-angled trapezium bevel edge is enclosed described
The inside on dam；It is provided with convex annular island 4 in the baltimore groove it is located on the substrate 3 and once shape, convex annular island 4 is described
Encircled area on substrate 3 is LED wafer installing zone；The area of the LED wafer installing zone is less than the spill trench bottom
Area fills high reflection white glue 5 between the convex annular island 4 and the insulation box dam 1；The high reflection white glue 5 is methyl
Silica gel is seperated with white to be tuned into, and the substrate 3, convex annular island 4 and the insulation box dam 1 use epoxy resin, and the ring is arranged
The island Xing Tu 4 is to be able to be coated with the high reflection white glue 5.
Please continue to refer to Fig. 2, in one embodiment of the invention, the filling region of the high reflection white glue 5 be the substrate 3,
The insulation inclined-plane of box dam 1, the convex annular island 4 and 4 top of the convex annular island at the top of the bevel edge between line
The closed area of composition fills high reflection white glue 5 to improve reflectivity and improves light extraction efficiency.
Please continue to refer to Fig. 2, Fig. 3, in one embodiment of the invention, 4 side of convex annular island is located in the substrate 3
It is provided with insulation parting bead 401 on the downside of side, the metal lead wire frame 301 is separated into two parts, in favor of separating metal lead wire
The positive and negative anodes of frame 301.
Please continue to refer to Fig. 2, in one embodiment of the invention, the surface bottom of the high reflection white glue 5 and the convex island 4
Vertex is overlapped.
Please continue to refer to Fig. 1, in one embodiment of the invention, inclined-plane that the high reflection white glue 5 is formed after filling with it is described
The vertical line angle on 4 vertex of convex annular island is a=56 °, increases angle to improve the extraction efficiency of light.
Please continue to refer to Fig. 1, in one embodiment of the invention, the angle of the vertical line of the bevel edge and the substrate 3 be b=
12°。
In an embodiment of the present invention, the insulation box dam 1, the substrate 3 and the convex annular island 4 use epoxy resin
Perhaps the silica column high reflection white glue 5 is tuned into using methyl silica gel or phenyl silica gel with white powder material, described white
TiO can be used in the material of toner body2Or ZrO2Or ZnO or SiO2Or Al2O3。
The foregoing is merely presently preferred embodiments of the present invention, should not be understood as the limitation to the application, all according to Shen of the present invention
Please the equivalent changes and modifications done of the scope of the patents, be all covered by the present invention.
Claims (7)
1. a kind of high reflection LED package support, including substrate, insulation box dam, metal lead wire frame, it is characterised in that: described
Metal lead wire frame is arranged in the substrate, and the insulation box dam surrounds baltimore groove in the upper surface of the substrate, described exhausted
The cross sectional shape of edge box dam is right-angled trapezium, and the bevel edge of the right-angled trapezium is in the inside of the box dam；In the baltimore groove
It is provided with convex annular island to be located on the substrate, the encircled area of convex annular island on the substrate is LED wafer installing zone；Institute
The area for stating LED wafer installing zone is less than the area of the spill trench bottom, the convex annular island and the insulation box dam it
Between fill high reflection white glue.
2. a kind of high reflection LED package support according to claim 1, it is characterised in that: the high reflection white glue is filled out
Filling region is at the top of the substrate, the inclined-plane of the box dam, the convex annular island and the convex annular island and at the top of the bevel edge
Between line composition closed area.
3. a kind of high reflection LED package support according to claim 1, it is characterised in that: be located at institute in the substrate
It states and is provided with insulation parting bead on the downside of a side of convex annular island the metal lead wire frame is separated into two parts, in favor of separating
The positive and negative anodes of metal lead wire frame.
4. a kind of high reflection LED package support according to claim 1, it is characterised in that: the high reflection white glue it is oblique
Face bottom end is overlapped with the vertex on the convex annular island.
5. a kind of high reflection LED package support according to claim 1 or 2 or 4, it is characterised in that: the high reflection is white
The vertical line angle on the inclined-plane and convex annular island vertex that are formed after glue filling is a=56 °.
6. a kind of high reflection LED package support according to claim 1, it is characterised in that: the bevel edge and the substrate
The angle of vertical line be b=12 °.
7. a kind of high reflection LED package support according to claim 2, it is characterised in that: the insulation box dam, the base
Plate and the convex annular island use epoxide resin material, and the high reflection white glue is using methyl silica gel or phenyl silica gel and white powder
Body is tuned into, the materials'use TiO of the white powder2Or ZrO2Or ZnO or SiO2Or Al2O3。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133869.6A CN109887906A (en) | 2019-02-22 | 2019-02-22 | A kind of high reflection LED package support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910133869.6A CN109887906A (en) | 2019-02-22 | 2019-02-22 | A kind of high reflection LED package support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109887906A true CN109887906A (en) | 2019-06-14 |
Family
ID=66928855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910133869.6A Pending CN109887906A (en) | 2019-02-22 | 2019-02-22 | A kind of high reflection LED package support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109887906A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110649144A (en) * | 2019-09-25 | 2020-01-03 | 广东晶科电子股份有限公司 | LED device and packaging support thereof |
| CN113594334A (en) * | 2021-07-15 | 2021-11-02 | 福建天电光电有限公司 | Novel semiconductor support |
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