CN209000903U - A kind of RF radio frequency products encapsulating structure of cavity structure - Google Patents
A kind of RF radio frequency products encapsulating structure of cavity structure Download PDFInfo
- Publication number
- CN209000903U CN209000903U CN201821919453.4U CN201821919453U CN209000903U CN 209000903 U CN209000903 U CN 209000903U CN 201821919453 U CN201821919453 U CN 201821919453U CN 209000903 U CN209000903 U CN 209000903U
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- CN
- China
- Prior art keywords
- chip
- radio frequency
- substrate
- glue
- box dam
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of RF radio frequency products encapsulating structures of cavity structure；The encapsulating structure draws box dam glue around radio frequency chip, and rubberizing film forms cavity structure, then completes product plastic packaging.Box dam glue is drawn around chip, enables the shape of box dam glue that the shape of chip and size is followed to change and change, without specially making the first time encapsulating mould for meeting chip form；Simultaneously as the dielectric constant of air is 1, less than the dielectric constant of plastic packaging material (dielectric constant of common plastic packaging material is 4), for radio frequency class chip package product, cavity dielectric in cavity structure is low due to dielectric constant, it can effectively reduce radio frequency class product power consumption, raising efficiency shows better properties of product.
Description
[technical field]
The utility model belongs to chip package field, is related to a kind of RF radio frequency products encapsulating structure of cavity structure.
[background technique]
In current semicon industry, Electronic Packaging has become an importance of industry development.With encapsulation
The development of technology makes high density, the encapsulation of small size requires to become the main flow direction of encapsulation；Existing encapsulation technology is mostly twice
Encapsulation, chip package is isolated with outside air, but existing encapsulation twice has the disadvantage that: (1) at high cost；(2) work
Skill is complicated.
[utility model content]
The shortcomings that the purpose of the utility model is to overcome the above-mentioned prior arts, the RF radio frequency for providing a kind of cavity structure produce
Product encapsulating structure；The structure increases box dam glue in traditional encapsulating structure, covers glue film on box dam glue, so that only needing primary
Encapsulation can complete encapsulation process.
In order to achieve the above objectives, the utility model is achieved using following technical scheme:
A kind of RF radio frequency products encapsulating structure of cavity structure, including substrate and glue film are fixedly installed chip on substrate,
The periphery of chip is fixedly installed box dam glue, and setting has the gap between box dam glue and chip；Glue film is " bowl-shape " structure, opening
Side fixation is attached on substrate, and glue film spiral-lock forms cavity in the top of box dam glue and chip between glue film and chip；Outside glue film
Portion is packaged with plastic-sealed body；Chip and substrate electrical connection.
Further improvement of the utility model is:
Preferably, the surface of chip and substrate are electrically connected by bonding wire；The height of box dam glue is higher than bonding wire and forms bank
Highly.
Preferably, the height of box dam glue is 10~100um.
Preferably, substrate with a thickness of 80~300um.
Preferably, thickness≤4.0mm of plastic-sealed body.
Preferably, substrate is resin substrate, metal framework or ceramic substrate.
Preferably, glue film includes cover board and edge, and edge is fixedly installed around the edge of cover board；Cover board is in box dam glue and core
The top of piece；The inner wall and box dam at edge are glued touching；The bottom at edge is fixedly connected with substrate.
Preferably, cover board is plate.
Compared with prior art, the utility model has the following beneficial effects:
The utility model discloses a kind of RF radio frequency products encapsulating structures of cavity structure；The encapsulating structure is in radio frequency chip
Surrounding draws box dam glue, and rubberizing film forms cavity structure, then completes product plastic packaging.Box dam glue is drawn around chip, so that box dam glue
Shape can follow the shape of chip and size to change and change, without specially making the first time Encapsulation Moulds for meeting chip form
Tool；Simultaneously as the dielectric constant of air is 1, it is right less than the dielectric constant of plastic packaging material (dielectric constant of common plastic packaging material is 4)
Cavity dielectric in radio frequency class chip package product, cavity structure can effectively reduce radio frequency class product since dielectric constant is low
Power consumption, raising efficiency show better properties of product.
Further, the chip in the utility model and substrate are realized by bonding wire is electrically connected, and the height of box dam glue is higher than
The height of bank, guarantees box dam glue when supporting glue film, and glue film can get along well chip contact, is capable of forming between glue film and chip
Cavity.
Further, box dam glue is that can support glue film, and range is arranged in 10~100um.
Further, the thickness with a thickness of Common radio frequency product substrate of substrate is arranged between 80~300um.
Further, the requirement with a thickness of Common radio frequency product plastic packaging body thickness of plastic-sealed body.
Further, substrate is common substrate, so that this structure is applied widely.
Further, glue film includes cover board and edge, and the inner wall and box dam at edge are glued touching；Bottom and substrate contact, lid
The edge of plate is supported on box dam glue.
[Detailed description of the invention]
Fig. 1 is the package structure diagram of the utility model；
Fig. 2 is that the substrate of the utility model pastes core, chip routing schematic diagram；
Fig. 3 is that box dam glue schematic diagram is made around chip；
Fig. 4 is that rubberizing film forms cavity structure schematic diagram；
Fig. 5 is plastic packaged products schematic diagram.
Wherein: 1- plastic-sealed body；2- glue film；3- box dam glue；4- cavity；5- chip；6- substrate；7- bonding wire；The edge 8-；9- lid
Plate.
[specific embodiment]
The utility model is described in further detail with specific steps with reference to the accompanying drawing:
Referring to Fig. 1, the utility model discloses a kind of RF radio frequency products encapsulating structures of cavity structure；The cavity structure
Including plastic-sealed body 1, glue film 2, box dam glue 3, cavity 4, chip 5, substrate 6 and bonding wire 7；It is fixedly installed chip 5 on substrate 6, welds
One end of line 7 is fixedly connected with substrate 6, and the other end is fixedly connected with the top of chip 5, and chip 5 passes through 6 electricity of bonding wire 7 and substrate
Connection；The periphery of chip 5 is fixedly installed a corral dam glue 3, and box dam glue 3 is that high-viscosity glue and chip 5 do not contact, box dam glue 3
It is fixed on substrate 6；The height of box dam glue 3 is higher than the height of chip 5, also above the height for the bank that bonding wire 7 is formed, energy
Enough play the role of supporting the height of glue film 2.Glue film 2 is big for " bowl-shape " structure, including cover board 9 and edge 8, the area of cover board 9
In the area of chip 5, cover board 9 is plate, and the edge of cover board 9 is fixedly connected with a circle edge 8, and the bottom at edge 8 and substrate 6 are solid
Fixed connection, the outer wall contact of the inner wall and box dam glue 3 at edge 8, the i.e. outer diameter and shape of the internal diameter at edge 8 and shape and box dam glue 3
Shape is identical, the two fitting；Glue film 2 by chip 5, bonding wire 7 and 3 spiral-lock of box dam glue inside it, while its it is internal form cavity 4,
The height of the distance between cover board 9 and substrate 6 and box dam glue 3 is identical, guarantee box dam glue 3 can spiral-lock in glue film 2, and glue film
2 edge is contacted with substrate 6；The external fixation of box dam glue 3 is packaged with plastic-sealed body 1.
Thickness≤4.0mm of plastic-sealed body 1, substrate 6 with a thickness of between 80~300um, the height of box dam glue 3 is 10~
100um；Substrate 6 is resin substrate, metal framework or ceramic substrate.
The preparation process of the utility model:
Step 1, as shown in Fig. 2, fixing pasting chip 5 on substrate 6, bonding wire 7 is installed, one end of bonding wire 7 is in chip 5
On upper surface, the other end is electrically connected chip 5 and substrate 6 on substrate 6.
Step 2, as shown in figure 3, standardized corral dam glue 3, the height of box dam glue 3 are formed greater than bonding wire 7 around chip 5
Loop height；
Step 3, as shown in figure 4, attaching glue film 2 in the top of chip 5, the top of box dam glue 3 and outer wall；The bottom of glue film 2
Portion is fixedly connected with substrate 6；Cavity 4 is formed between glue film 2 and chip 5.
Step 4, as shown in figure 5, being packaged in the outside of glue film 2, plastic-sealed body 1 is formed, subsequent job is completed at the same time.
The packaging method is on the basis of the structure setting has box dam glue, so that after box dam glue is fixedly installed, entire mistake
Journey only needs once to encapsulate, and completes encapsulation process, simplifies encapsulation process, reduces cost of manufacture.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection scope within.
Claims (8)
1. a kind of RF radio frequency products encapsulating structure of cavity structure, which is characterized in that including substrate (6) and glue film (2), substrate
(6) be fixedly installed on chip (5), the periphery of chip (5) is fixedly installed box dam glue (3), box dam glue (3) and chip (5) it
Between be arranged and have the gap；Glue film (2) is " bowl-shape " structure, and opening edge fixation is attached on substrate (6), and glue film (2) spiral-lock is in box dam
The top of glue (3) and chip (5) forms cavity (4) between glue film (2) and chip (5)；The outer enclosure of glue film (2) has plastic packaging
Body (1)；Chip (5) and substrate (6) electrical connection.
2. the RF radio frequency products encapsulating structure of cavity structure according to claim 1, which is characterized in that the table of chip (5)
Face and substrate (6) are electrically connected by bonding wire (7)；The height of box dam glue (3) is higher than the height that bonding wire (7) form bank.
3. the RF radio frequency products encapsulating structure of cavity structure according to claim 2, which is characterized in that box dam glue (3)
Height is 10~100um.
4. the RF radio frequency products encapsulating structure of cavity structure according to claim 1, which is characterized in that the thickness of substrate (6)
Degree is 80~300um.
5. the RF radio frequency products encapsulating structure of cavity structure according to claim 1, which is characterized in that plastic-sealed body (1)
Thickness≤4.0mm.
6. the RF radio frequency products encapsulating structure of cavity structure according to claim 1, which is characterized in that substrate (6) is tree
Aliphatic radical plate, metal framework or ceramic substrate.
7. the RF radio frequency products encapsulating structure of cavity structure according to claim 1, which is characterized in that glue film (2) includes
Cover board (9) and edge (8), the edge of edge (8) around cover board (9) are fixedly installed；Cover board (9) is in box dam glue (3) and chip (5)
Top；The inner wall and box dam glue (3) at edge (8) contact；The bottom at edge (8) is fixedly connected with substrate (6).
8. the RF radio frequency products encapsulating structure of cavity structure according to claim 7, which is characterized in that cover board (9) is flat
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821919453.4U CN209000903U (en) | 2018-11-20 | 2018-11-20 | A kind of RF radio frequency products encapsulating structure of cavity structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821919453.4U CN209000903U (en) | 2018-11-20 | 2018-11-20 | A kind of RF radio frequency products encapsulating structure of cavity structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209000903U true CN209000903U (en) | 2019-06-18 |
Family
ID=66807808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821919453.4U Active CN209000903U (en) | 2018-11-20 | 2018-11-20 | A kind of RF radio frequency products encapsulating structure of cavity structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN209000903U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009515A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Stacked semiconductor packaging piece and electronic equipment |
| US11728261B2 (en) | 2020-07-23 | 2023-08-15 | Samsung Electronics Co., Ltd. | Chip on film package and display apparatus including the same |
-
2018
- 2018-11-20 CN CN201821919453.4U patent/CN209000903U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111009515A (en) * | 2019-11-22 | 2020-04-14 | 青岛歌尔智能传感器有限公司 | Stacked semiconductor packaging piece and electronic equipment |
| US11728261B2 (en) | 2020-07-23 | 2023-08-15 | Samsung Electronics Co., Ltd. | Chip on film package and display apparatus including the same |
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