CN207968442U - Gluing crystal base containing ground structure and its gluing crystal resonator - Google Patents
Gluing crystal base containing ground structure and its gluing crystal resonator Download PDFInfo
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- CN207968442U CN207968442U CN201820706503.4U CN201820706503U CN207968442U CN 207968442 U CN207968442 U CN 207968442U CN 201820706503 U CN201820706503 U CN 201820706503U CN 207968442 U CN207968442 U CN 207968442U
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- hole
- electrode
- upper cover
- base body
- gluing
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Abstract
The utility model discloses a kind of gluing crystal base and its gluing crystal resonator containing ground structure, belong to crystal resonator technical field, for preparing crystal resonator with the metal shell upper cover gluing encapsulated wafer with curved cavity, including base body, base body is the slab construction without curved cavity；The back side of base body is set there are four electrode, the through-hole of metallization is opened on base body, the through-hole of metallization includes the first through hole being connected respectively with first electrode, third electrode, third through-hole, the front of base body is provided with metallization coating, metallization coating is connect with second electrode and the 4th electrode conduction respectively, it is access area except the coverage area that the subregion of metallization coating is covered on the shell, access area is for connection to be connected with outer casing upper cover.The earthing mode that the utility model is connect by the way that two independent metallization coating are arranged with outer casing upper cover, it is simple and practical, it is at low cost, it is conducive to promote.
Description
Technical field
The utility model is related to crystal resonator technical fields, more particularly to a kind of gluing crystal containing ground structure
Pedestal and its gluing crystal resonator.
Background technology
The pedestal of gluing crystal resonator carries curved cavity currently on the market, the outer casing upper cover cooperation gluing envelope with tablet
It fills quartz crystal and completes crystal resonator.And the existing common pedestal with curved cavity is by double-layer ceramic plate by special
Different process links together, and cost is higher.It is generally logical second on base body in the prior art in order to complete to be grounded
The metallization coating of annular is set between hole and fourth hole, and outer casing upper cover is generally slab construction, exists by welding
Curved cavity is connected on pedestal, and is able to coordinate encapsulation to complete crystal resonator with outer casing upper cover, then passes through gluing cavity knot
Structure and outer casing upper cover, to complete to encapsulate, and welding procedure is complicated, and production cost is high.
Utility model content
The purpose of this utility model be to provide a kind of earthing mode is reliable, can substantially reduce cost of manufacture containing ground connection
The gluing crystal base and its gluing crystal resonator of structure.
To achieve the above object, the utility model adopts the following technical solution：
The utility model provides a kind of gluing crystal base containing ground structure, for outside the metal with curved cavity
Shell upper cover gluing encapsulated wafer prepares crystal resonator, including base body, and the base body is without the flat of curved cavity
Harden structure；
The back side of the base body is set there are four electrode, including first electrode, second electrode, third electrode and the 4th electricity
Pole, opens the through-hole of metallization on the base body, and the through-hole of the metallization includes and the first electrode, third electricity
First through hole that pole is connected respectively, third through-hole, the first through hole, third through-hole for being connect with crystal,
The front of the base body is provided with metallization coating, the metallization coating respectively with the second electrode
It is connected with the 4th electrode conduction, is ground connection except the coverage area that the subregion for metallizing coating is covered on the housing
Area, the access area is for connection to be connected with outer casing upper cover.
Further, the metallization coating is cricoid metallization coating；
Alternatively, the metallization coating is two independent metals being connect respectively with second electrode, the 4th electrode conduction
Change coating.
Further, the through-hole of the metallization further include be connected with the second electrode connection the second through-hole and/or
The fourth hole being connect with the 4th electrode conduction, second through-hole and/or fourth hole are connect with the metallization coating.
Preferably, the metallization coating is two independent gold being connect respectively with second electrode, the 4th electrode conduction
Categoryization coating, described two independent metallization coating pass through the second through-hole, fourth hole and second electrode, the 4th electrode respectively
Connection.
Further, second through-hole and fourth hole are diagonally arranged, and second through-hole and fourth hole are close to institute
The outside of base body is stated, the first through hole and third through-hole are positioned close to the inside diagonal position at center.
Further, the base body uses ceramic wafer.
Further, the mode that connection is connected with outer casing upper cover for the access area is conducting resinl, Laser Welding or soldering connection.
Further, the front of the base body set there are two be used for dispensing platform for dispensing glue, the dispensing platform packet
Include the first dispensing platform and the second dispensing platform for being arranged and keeping left in the positive inside of the base body, first dispensing
The conductive material that platform and the second dispensing platform are perfused by first through hole and third through-hole respectively be diagonally arranged described the
One electrode is connected with third electrode conduction, and the second dispensing platform is connected to third through-hole by metal connecting line；
The positive inside of the base body, which is kept right, is provided with the support platform for being used to support crystal；
The base body is rectangle, and the quadrangle of the rectangle is provided with arc unfilled corner, and the arc unfilled corner can make to be in square
Round through hole is formed at the joint of four adjacent pedestals of battle array arrangement.
On the other hand, a kind of gluing crystal resonator, including the gluing crystal base containing ground structure are provided,
Further include quartz wafer and the metal shell upper cover with pedestal sealing cooperation, the quartz wafer is located on pedestal and shell
It covers in the sealing cavity formed；
The middle section of the outer casing upper cover raises up the curved cavity to be formed for the pedestal fitted seal, institute
State outer casing upper cover edge be used for the pedestal gluing, the local edge part of the metallization coating is covered at the edge
It is access area except lid range, connection is connected with the outer casing upper cover in the access area.
Further, the quartz crystal is SMD quartz crystals, and the base body is the ceramic wafer of single layer.
Further, the mode that connection is connected with outer casing upper cover for the access area is conducting resinl, Laser Welding or soldering connection.
Due to the adoption of the above technical scheme, the utility model has at least the following advantages：
(1) the utility model by the metallization coating that is arranged on base body with its coordinate with curved cavity
After outer casing upper cover bonds, metallization cladding portion region is only covered, unlapped neighboring is as access area and shell mechanism
Conducting connection can use conducting resinl, metal wire, welding etc., so that it may to form reliable earthing mode；Because of setting for ground structure
It sets, curved cavity needs not necessarily need to be provided on pedestal, curved cavity can be arranged and cover on the shell, and outer casing upper cover is simple object
Structure is managed, processing technology is simpler, and manufacturing cost is lower.
(2) the utility model can improve the anti-electromagnetic interference capability of gluing crystal, it is made to expand application range.
(3) pedestal of the utility model is primarily adapted for use in gluing crystal resonator, between the edge and pedestal of outer casing upper cover
It can be bonded with gluing, and in order to solve problem with grounding, the periphery of base body, only covering part are less than by adjusting edge periphery
Metallization coating region, it is unlapped metallization coating fringe region can be connected with outer casing upper cover connection (conducting resinl or
Metallicity etc.), it can solve existing
There is the problem of needing to weld when curved cavity is arranged on pedestal in technology, the earthing mode of the utility model is simple
Reliably, production cost is reduced.
(4) single-layer ceramic plate can be used in the utility model, substantially reduces cost.
Description of the drawings
Above-mentioned is only the general introduction of technical solutions of the utility model, in order to better understand the technology hand of the utility model
Section, below in conjunction with attached drawing, the utility model is described in further detail with specific implementation mode.
Fig. 1 is the backside structure signal of one embodiment of the gluing crystal base containing ground structure of the utility model
Figure；
Fig. 2 is the Facad structure signal of one embodiment of the gluing crystal base containing ground structure of the utility model
Figure；
Fig. 3 is that the stereochemical structure of one embodiment of the gluing crystal base containing ground structure of the utility model is shown
It is intended to；
Fig. 4 is the dimensional structure diagram of one embodiment of the outer casing upper cover coordinated with pedestal of the utility model；
Fig. 5 is the cross-sectional view of one embodiment of the outer casing upper cover coordinated with pedestal of the utility model；
Fig. 6 is the structural schematic diagram of the outer casing upper cover and one embodiment after pedestal encapsulation of the utility model；
Fig. 7 is that the backside structure of another embodiment of the gluing crystal base containing ground structure of the utility model is shown
It is intended to；
Fig. 8 is the structural schematic diagram of the outer casing upper cover and another embodiment after pedestal encapsulation of the utility model.
Specific implementation mode
The utility model provides a kind of one embodiment of the gluing crystal base containing ground structure, such as Fig. 1 to Fig. 8 institutes
Show, for preparing crystal resonator, including base body with the metal shell upper cover cooperation encapsulation quartz wafer with curved cavity,
Base body is the slab construction without curved cavity, and the back side of base body is set there are four electrode, including first electrode 1, the
Two electrodes 2, third electrode 3 and the 4th electrode 4, open the through-hole of metallization on base body, the through-hole of metallization include with
First through hole 10 that first electrode, third electrode are connected respectively, third through-hole 30, first through hole 10, third through-hole 30 are used
It is connect in crystal；The front of base body be provided with metallization coating 6 (or 6 '), metallization coating 6 (or 6 ') respectively with
Second electrode 2 and the conducting connection of the 4th electrode 4, the coverage area that the subregion of coating 6 (or 6 ') of metallizing is covered on the shell
Except be access area, access area is for connection to be connected with outer casing upper cover.Such as in access area point conducting resinl, so that it may to be grounded
Area is connected with the conducting of outer casing upper cover, for being grounded.
When the utility model is used, in gluing encapsulation process, it can be with gluing between the edge and pedestal of outer casing upper cover
It bonds, and in order to solve problem with grounding, the periphery of base body is less than by adjusting edge periphery, only covers metallization coating
Subregion, it is unlapped metallization coating fringe region as access area can be connected with outer casing upper cover connection (conducting resinl or
Metallicity etc.).
The utility model by the metallization coating that is arranged on base body coordinate with it is outer with curved cavity
After shell upper cover bonds, metallization cladding portion region is only covered, unlapped neighboring is led as access area and shell mechanism
Lead to and connect, conducting resinl, metal wire, welding etc. can be used, so that it may to form reliable earthing mode；Because of the setting of ground structure,
Curved cavity needs not necessarily need to be provided on pedestal, curved cavity can be arranged and cover on the shell, and outer casing upper cover is simple physics
Structure, processing technology is simpler, and manufacturing cost is lower.
The metallization plating of annular is generally set between the second through-hole and fourth hole on base body in the prior art
Layer, outer casing upper cover are generally slab construction, and need to connect curved cavity on pedestal using the mode of welding, and be able to outside
The cooperation encapsulation of shell upper cover is completed crystal resonator and to complete to encapsulate, and is welded then by gluing curved cavity and outer casing upper cover
Connect complex process, production cost is high, and the existing common pedestal with curved cavity is by double-layer ceramic plate by special
Process links together, and cost is higher.
Further, metallization coating is cricoid metallization coating 6 ', as shown in Figure 7；Alternatively, metallization coating is point
Two independent metallization coating 6 not connect with second electrode, the 4th electrode conduction, as shown in Fig. 2, preferably metallization plating
Layer is two independent metallization coating 6.
In order to complete to be grounded, the through-hole of metallization further include with the second through-hole 20 of the conducting connection of the second electrode 2 and/
Or the fourth hole 40 with the conducting connection of the 4th electrode 4, the second through-hole 20 and/or fourth hole 40 are connect with metallization coating.
At least one ground connection of second electrode and the 4th electrode, it is possible to while the second through-hole and fourth hole are opened up, also may be used
Only to open up one of those.
Preferably, metallization coating is the two independent metals connected respectively with second electrode 2, the conducting of the 4th electrode 4
Change coating 6, two independent metallization coating point 6 do not pass through the second through-hole 20, fourth hole 40 and the 2, the 4th electricity of second electrode
Pole 4 connects.Connecing for two electrodes (second electrode 2, the 4th electrode 4) can be completed by the way that two independent metallization coating are arranged
Ground.
It can be by the simpler glue of technique with outer casing upper cover by the way that (independent metallization coating) are arranged on pedestal at 2 points
It is viscous, and the ground structure that base body and outer casing upper cover are completed by conducting resinl or conductor wire is simple and practical, it is at low cost, conducive to pushing away
Extensively, there is vast market prospect in SMD field of crystals.
Independent metallization coating can reduce metallic region and be distributed, and the endless all standing pedestal sheet in the edge of outer casing upper cover
Connection is connected with outer casing upper cover by conducting resinl or conductor wire for the metallization coating of body, to complete ground connection well.
In order to be more easily grounded with outer casing upper cover cooperation, the second through-hole 20 and fourth hole 40 are diagonally arranged, the
Two through-holes 20 and fourth hole 40 are positioned close to center close to the outside of base body, first through hole 10 and third through-hole 30
Inside diagonal position.
Further, base body uses ceramic wafer, preferably single-layer ceramic plate.Single-layer ceramic plate is relative to multi-layer sintering
Ceramic substrate further reduced material cost and processing cost.
Preferably, the mode that connection is connected with outer casing upper cover for access area is that conducting resinl, Laser Welding or soldering connect, preferably
Conductive glue connection.Conducting resinl is the glue with conductive compositions (such as metal powder), and caking property is relatively poor, but for access area and
The conducting of outer casing upper cover connects, convenient and efficient easy to implement.
In order to realize that conductive communication, metallization VIA are that the through-hole of conductive material is perfused.
Further, the front of base body is set there are two dispensing platform for dispensing glue is used for, and dispensing platform includes that setting exists
The the first dispensing platform 5 and the second dispensing platform 7 that the positive inside of base body keeps left, the first dispensing platform 5 and second point
The conductive material that glue platform 7 is perfused by first through hole 10 and third through-hole 30 respectively and the first through hole 10 being diagonally arranged and
The conducting connection of third through-hole 30, the second dispensing platform 7 are connected to third through-hole 30 by metal connecting line.Base body it is positive
Inside, which is kept right, is provided with the support platform 9 for being used to support crystal.First dispensing platform 5 and the second dispensing platform 7.
Further, base body is rectangle, and the quadrangle of rectangle is provided with arc unfilled corner, and arc unfilled corner can make to arrange in matrix
Round through hole is formed at the joint of four adjacent pedestals of row.
Wiring connection type in the utility model is, as shown in Figure 1 and Figure 2：
The first electrode 1 at the pedestal back side is connected to by the positive first dispensing platform of first through hole 10 and pedestal 5；
The second electrode 2 at the pedestal back side is connected to by the second through-hole 20 with metallization coating；
The third electrode 3 at the pedestal back side is connected to by third through-hole 30 with the second dispensing platform 7；
4th electrode 4 at the pedestal back side is connected to by fourth hole 40 with metallization coating；
The second electrode 2 at the pedestal back side can be connected by metal connecting line and the 4th electrode 4, to make two independent gold
Categoryization coating is connected to, and connection is connected by conducting resinl glue with outer casing upper cover in access area, to realize metal shell upper cover
Ground connection.
On the other hand, it as shown in Fig. 4-Fig. 8, provides a kind of gluing crystal resonator, including above-mentioned contains ground structure
Gluing crystal base 11, further include quartz wafer and with pedestal sealing cooperation metal shell upper cover 21, quartz wafer is located at
In the sealing cavity that pedestal 11 and outer casing upper cover 21 are formed, the middle section of outer casing upper cover 21 raises up to be formed and be used for and pedestal
The curved cavity of 11 fitted seals, the edge of outer casing upper cover 21 are used to bond with pedestal 11, the covering metallization of outer casing upper cover edge
A part for coating 6 (or 6 ') is not connected by the outer peripheral portion of the metallization coating 6 (or 6 ') of edge covering with outer casing upper cover
Connection, to complete to be grounded.
The utility model by the metallization coating that is arranged on base body coordinate with it is outer with curved cavity
After shell upper cover bonds, metallization cladding portion region is only covered, unlapped neighboring is led as access area and shell mechanism
Lead to and connect, conducting resinl, metal wire, welding etc. can be used, so that it may to form reliable earthing mode；Because of the setting of ground structure,
Curved cavity needs not necessarily need to be provided on pedestal, curved cavity can be arranged and cover on the shell, and outer casing upper cover is simple physics
Structure, processing technology is simpler, and manufacturing cost is lower.
Further, quartz crystal is SMD quartz crystals, and base body is the ceramic wafer of single layer.Existing common band
The pedestal of curved cavity is linked together by special process processing by double-layer ceramic plate, and cost is higher.
As an improvement the mode of access area and the conducting connection of outer casing upper cover 21 is that conducting resinl, Laser Welding or soldering connect
It connects.
The glue dispensing and packaging flow of the utility model crystal resonator is as follows：
Outer casing upper cover is inverted, covers last layer glue at edge, will be inverted with the pedestal of SMD chips, and be accurately buckled in
On the flange of outer casing upper cover, the edge on pedestal as the metallization coating of ground structure and outer casing upper cover bonds, part metals
Change coating not covered by the edge of outer casing upper cover, the exposed outside covered on the shell, outer casing upper cover and exposed is connected to conducting resinl
Metallization coating connection on the outside, glue are bonding to pedestal and outer casing upper cover, and room temperature is carried out to the crystal resonator assembled
It places or heats, make adhesive curing, to obtain the crystal resonator with reliable ground.
Because conducting resinl is the glue comprising metal powder, if in order to complete to be grounded, it is viscous using outer casing upper cover and metallization coating
Knot, then can influence adhesive property, be allowed to bond loosely.Therefore it is glue between the outer casing upper cover of the utility model and metallization coating
It is viscous.
The utility model can be saved by can preferentially be set as two independent metallization coating on base body
Many metallic regions, reduce cost, after being bonded with the outer casing upper cover with curved cavity coordinated with it, only covering part metal
Change cladding region, connection is connected with shell mechanism for unlapped peripheral edge regions, so that it may to form reliable earthing mode；It is recessed
Cavity configuration needs not necessarily need to be provided on pedestal, curved cavity can be arranged and cover on the shell, and outer casing upper cover is simple physics knot
Structure, processing technology is simpler, and manufacturing cost is lower.The access area of the pedestal of the utility model passes through conducting resinl and outer casing upper cover
It is connected and efficiently accomplishes ground connection.Single-layer ceramic plate can be used in the utility model, substantially reduces cost.
The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model
Limitation, those skilled in the art make a little simple modification, equivalent variations or modification using the technology contents of the disclosure above,
It falls within the protection scope of the present utility model.
Claims (10)
1. a kind of gluing crystal base containing ground structure, it is characterised in that：
For preparing crystal resonator, including base body, institute with the metal shell upper cover gluing encapsulated wafer with curved cavity
It is the slab construction without curved cavity to state base body；
The back side of the base body is set there are four electrode, including first electrode, second electrode, third electrode and the 4th electrode,
The through-hole of metallization is opened on the base body, the through-hole of the metallization includes and the first electrode, third electrode
The first through hole that is connected respectively, third through-hole, the first through hole, third through-hole for being connect with crystal,
The front of the base body is provided with metallization coating, the metallization coating respectively with the second electrode and
Four electrode conductions connect, and are access area except the coverage area that the subregion for metallizing coating is covered on the housing,
The access area is for connection to be connected with outer casing upper cover.
2. the gluing crystal base according to claim 1 containing ground structure, which is characterized in that the metallization coating
For cricoid metallization coating；
Alternatively, the metallization coating is two independent metallization platings being connect respectively with second electrode, the 4th electrode conduction
Layer.
3. the gluing crystal base according to claim 2 containing ground structure, which is characterized in that the metallization is led to
Hole further includes the fourth hole that the second through-hole of connection is connected with the second electrode and/or is connect with the 4th electrode conduction, institute
The second through-hole and/or fourth hole is stated to connect with the metallization coating.
4. the gluing crystal base according to claim 3 containing ground structure, which is characterized in that second through-hole and
Fourth hole is diagonally arranged, second through-hole and fourth hole close to the outside of the base body, the first through hole and
Third through-hole is positioned close to the inside diagonal position at center.
5. the gluing crystal base according to claim 1 containing ground structure, which is characterized in that the base body is adopted
Use ceramic wafer.
6. the gluing crystal base according to any one of claims 1 to 5 containing ground structure, which is characterized in that described to connect
The mode that connection is connected with outer casing upper cover for area is conducting resinl, Laser Welding or soldering connection.
7. the gluing crystal base according to any one of claims 1 to 5 containing ground structure, which is characterized in that the base
Seat ontology front set there are two be used for dispensing platform for dispensing glue, the dispensing platform include be arranged the base body just
The the first dispensing platform and the second dispensing platform to keep left on the inside of face, the first dispensing platform and the second dispensing platform lead to respectively
The conductive material for crossing first through hole and third through-hole perfusion is connect with the first electrode and third electrode conduction being diagonally arranged,
The second dispensing platform is connected to third through-hole by metal connecting line；
The positive inside of the base body, which is kept right, is provided with the support platform for being used to support crystal；
The base body is rectangle, and the quadrangle of the rectangle is provided with arc unfilled corner, and the arc unfilled corner can make to arrange in matrix
Round through hole is formed at the joint of four adjacent pedestals of row.
8. a kind of gluing crystal resonator, which is characterized in that any described containing ground structure including claim 1 to 7
Gluing crystal base further includes quartz wafer and the metal shell upper cover with pedestal sealing cooperation, the quartz wafer position
In in the sealing cavity that pedestal and outer casing upper cover are formed；
The middle section of the outer casing upper cover raises up the curved cavity to be formed for the pedestal fitted seal, described outer
The edge of shell upper cover is used to cover model at the edge with the pedestal gluing, the local edge part of the metallization coating
It is access area except enclosing, connection is connected with the outer casing upper cover in the access area.
9. gluing crystal resonator according to claim 8, which is characterized in that the quartz crystal is SMD quartz crystals,
The base body is the ceramic wafer of single layer.
10. gluing crystal resonator according to claim 8 or claim 9, which is characterized in that led with outer casing upper cover the access area
It is conducting resinl, Laser Welding or soldering connection to lead to the mode connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706503.4U CN207968442U (en) | 2018-05-14 | 2018-05-14 | Gluing crystal base containing ground structure and its gluing crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820706503.4U CN207968442U (en) | 2018-05-14 | 2018-05-14 | Gluing crystal base containing ground structure and its gluing crystal resonator |
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| CN207968442U true CN207968442U (en) | 2018-10-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110836871A (en) * | 2019-11-08 | 2020-02-25 | 江苏科技大学 | Measuring cell for biomolecule detection |
-
2018
- 2018-05-14 CN CN201820706503.4U patent/CN207968442U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110836871A (en) * | 2019-11-08 | 2020-02-25 | 江苏科技大学 | Measuring cell for biomolecule detection |
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