CN204614790U - A kind of microminiaturized ceramic cartridge photodetector encapsulating structure - Google Patents
A kind of microminiaturized ceramic cartridge photodetector encapsulating structure Download PDFInfo
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- CN204614790U CN204614790U CN201520293363.9U CN201520293363U CN204614790U CN 204614790 U CN204614790 U CN 204614790U CN 201520293363 U CN201520293363 U CN 201520293363U CN 204614790 U CN204614790 U CN 204614790U
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Abstract
A kind of microminiaturized ceramic cartridge photodetector encapsulating structure, comprises shell, detector chip and light window glass; Shell comprises substrate and lug boss, be overlying on the first electrode pad of substrate upper surface, the second electrode pad and third electrode pad, and run through substrate and be located at the metallization via hole of the first electrode pad, the second electrode pad and third electrode pad lower end respectively, substrate and lug boss all adopt High Temperature Co Fired Ceramic material; The lower surface of detector chip is welded on the outer surface of the second electrode pad by the preformed solder sheet eutectic be located under it, the first electrode pad, third electrode pad are connected respectively by the electrode bonding of spun gold with both sides, detector chip upper end; The lower surface of light window glass is welded on the upper surface of lug boss by the preformed solder ring eutectic be located under it, and forms sealed cavity.Advantageous Effects of the present utility model is: realize good sealing property, reduces small product size, reduces production cost, enhances productivity.
Description
Technical field
The utility model relates to photodetector encapsulation technology field, particularly one microminiaturized ceramic cartridge photodetector encapsulating structure.
Background technology
At present, the photoelectric detector chip encapsulation of domestic and international application in fields such as military, space flight generally adopts TO series metal case package structure.Please refer to Fig. 1, existing photodetector encapsulating structure comprises the base 15 and pipe cap 16 that metal material makes, detector chip 2, light window glass 3, ceramic substrate 17, insulator 18 and lead-in wire 19, wherein, organic conductive silver is adopted to starch bonding between detector chip 2 with ceramic substrate 17, adopt between ceramic substrate 17 and base 15 that AB is gluing to be connect, sealing-in is realized by high frequency sealing by fusing technique between light window glass 3 and pipe cap 16, the insulator 18 made by burning glass or ceramic material between base 15 and lead-in wire 19 realizes sealing, sealing between pipe cap 16 and base 15 is then according to the size of base 15 with pipe cap 16, realized by the mode of stored energy welding or Laser Welding.In conjunction with actual situation about using, the subject matter that prior art exists is: 1) sealing property of this photodetector encapsulating structure is not ideal enough, main manifestations is in product use procedure, between pipe cap 16 and base 15, between base 15 and lead-in wire 19, be easier to leak gas between light window glass 3 and pipe cap 16, thus affect the Performance And Reliability of product; 2) because base 15 and pipe cap 16 all adopt metal material to make, make the volume of product and weight larger; 3) adopt the coated and sealing by fusing of pipe cap 16 on light window glass 3, and detector chip 2 is placed on ceramic substrate 17, ceramic substrate 17 is placed in again design on base 15, cause the height of product comparatively large, structure is comparatively complicated, compact not; 4) production technology is comparatively complicated comparatively speaking, thus makes production cost higher, and not easily realizes mass production.
Utility model content
For the problems referred to above existed in background technology, the purpose of this utility model is to provide a kind of microminiaturized ceramic cartridge photodetector encapsulating structure, while realizing good seal performance, can reduce the volume of product, reduce production cost, and improve the efficiency of producing further.
The technical solution of the utility model is as follows: comprise shell 1, detector chip 2 and light window glass 3; Shell 1 is structure as a whole, comprise integrated substrate 1a and the lug boss 1b being positioned at substrate 1a edge, be overlying on the first electrode pad 8, second electrode pad 9 separated from one another and the third electrode pad 10 of substrate 1a upper surface, and run through substrate 1a and be located at the metallization via hole of the first electrode pad 8, second electrode pad 9 and third electrode pad 10 lower end respectively, first electrode pad 8, second electrode pad 9 is connected with external circuit respectively by the via hole that metallizes with third electrode pad 10, and substrate 1a and lug boss 1b all adopts High Temperature Co Fired Ceramic material; Detector chip 2 is located on the second electrode pad 9, the lower surface of detector chip 2 and the outer surface of the second electrode pad 9 are all coated with the metal level matched with preformed solder sheet 5, the lower surface of detector chip 2 is welded on the outer surface of the second electrode pad 9 by preformed solder sheet 5 eutectic be located under it, the first electrode pad 8, third electrode pad 10 are connected respectively by the electrode bonding of spun gold with both sides, detector chip 2 upper end; Light window glass 3 is located on lug boss 1b, the upper surface 7 of lug boss 1b and the lower surface of light window glass 3 are all coated with the metal level matched with preformed solder ring 6, the lower surface of light window glass 3 is welded on the upper surface 7 of lug boss 1b by preformed solder ring 6 eutectic be located under it, and forms sealed cavity 14.
The beneficial effect of above-mentioned improvement is: the product 1) existed for prior art is in use easier to the problem occurring to leak gas between pipe cap 16 and base 15, shell 1 in the utility model is structure as a whole, adopt integrated substrate 1a due to shell 1 and be positioned at the design of lug boss 1b of substrate 1a edge, therefore avoiding the problem that the junction between pipe cap 16 and base 15 leaks gas.2) for prior art exist base 15 and lead-in wire 19 between sealed by insulator 18, owing to being difficult to avoid between base 15 and insulator 18 in product use procedure, and the problem of the easy gas leakage producing gap between insulator 18 and lead-in wire 19 and cause, the utility model have employed the design of omitting insulator 18, pass through the first electrode pad 8 simultaneously, second electrode pad 9, third electrode pad 10 and substrate 1a are designed to integrative-structure, namely be sintered to and integrally realize sealing, simultaneously at the first electrode pad 8, second electrode pad 9 arranges with the lower end of third electrode pad 10 the metallization via hole running through substrate 1a respectively, and realize the first electrode pad 8 by this metallization via hole, second electrode pad 9 and the connection of third electrode pad 10 with external circuit, not only structure is more simply compact, sealing effectiveness is also even more ideal comparatively speaking.3) easily be there is the problem of leaking gas by the technique sealing-in of high frequency sealing by fusing between the light window glass 3 existed for prior art and pipe cap 16, the utility model adopts the mode of eutectic weldering by light window glass 3 and shell 1 sealing-in, not only sealing effectiveness is better, production technology is simple, weld strength is higher, also helps mass production simultaneously and enhances productivity, 4) design of metal material is adopted relative to pipe cap in prior art 16 and base 15, in the utility model, substrate 1a and lug boss 1b all adopts High Temperature Co Fired Ceramic material, not only reduce the cost of material, and made small product size is less, improves the space availability ratio of product, 5) adopt the coated and sealing by fusing of pipe cap 16 on light window glass 3 relative to prior art, and detector chip 2 is placed on ceramic substrate 17, ceramic substrate 17 is placed in again the design on base 15, the utility model have employed the more compact design of structure, the lower surface of light window glass 3 is welded with upper surface 7 eutectic of lug boss 1b, and the outer surface eutectic of the lower surface of detector chip 2 with the second electrode pad 9 is welded, not only further reduce the height of product, simultaneously relative to the connection that prior art realizes between detector chip 2 and ceramic substrate 17 by the bonding mode of organic conductive silver slurry, weld strength can also be obtained higher, heat dispersion is better, product temperature resistant range is wider, and improve the beneficial effect of the rate that manufactures a finished product further.
Further, shell 1 also comprises the position of lower surface corresponding to the via hole that metallizes that the 4th electrode pad 11, the 5th electrode pad 12 and the 6th electrode pad the 13, four electrode pad 11, the 5th electrode pad 12 and the 6th electrode pad 13 are located at substrate 1a respectively.So do be in order in the lower surface of substrate 1a, correspond to metallization via hole position, by arrange the 4th electrode pad 11, the 5th electrode pad 12, the 6th electrode pad 13 by metallization via hole lower end all seal, thus the sealing again realized between detector chip 2 and substrate 1a, improve sealing effectiveness further; Realized the connection of the connection of the first electrode pad 8 and the 4th electrode pad 11, the second electrode pad 9 and the 5th electrode pad 12 by metallization via hole simultaneously, and the connection of third electrode pad 10 and the 6th electrode pad 13.
Further, the melting temperature of preformed solder ring 6 is lower than the melting temperature of preformed solder sheet 5.So do is because in process of production, after first detector chip 2 will being welded with the second electrode pad 9 eutectic, again the mode that light window glass 3 and shell 1 are welded by eutectic is connected, to avoid in the process of sintering light window glass 3, melting temperature due to preformed solder ring 6 is equal to or higher than the melting temperature of preformed solder sheet 5, and causes the eutectic between detector chip 2 and shell 1 again dissolve and affect the quality of weld strength and product.
Further, the outer surface of the upper surface 7 of lug boss 1b, the lower surface of light window glass 3, the lower surface of detector chip 2 and the second electrode pad 9 is all coated with layer gold or the alloying metal layer containing gold.Relative to the metal such as tin, silver, layer gold or the alloying metal layer containing gold have the feature not oxidizable, adhesive strength is higher and performance is more stable, can also obtain the higher beneficial effect of rate of finished products in process of production simultaneously.
Further, be coated with in the upper surface 7 of lug boss 1b the nickel dam that thickness is 2 ~ 5 μm from bottom to top successively, and thickness is the layer gold of 1.5 ~ 2.5 μm.
Further, in order to increase the intensity of welding, ensureing the sealing of product simultaneously, being coated with one deck titanium layer, one deck nickel dam and one deck layer gold from top to bottom successively in the lower surface of light window glass 3, or be coated with one deck layers of chrome and one deck layer gold from top to bottom successively.
Further, preformed solder sheet 5 adopts Au
88ge
12, fusing point is 357 DEG C.
Further, preformed solder ring 6 adopts Au
80sn
20, fusing point is 280 DEG C.
Further, to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of the first electrode pad 8, second electrode pad 9, third electrode pad 10 is coated with thickness all from bottom to top successively, to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of the 4th electrode pad 11, the 5th electrode pad 12, the 6th electrode pad 13 is coated with thickness all from top to bottom successively.
Advantageous Effects of the present utility model is: realize good sealing property, reduces small product size, reduces production cost, enhances productivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing photodetector encapsulating structure;
The schematic perspective view of a kind of microminiaturized ceramic cartridge photodetector encapsulating structure of Fig. 2 the utility model;
Fig. 3 is A-A profile of the present utility model.
Fig. 4 is the vertical view of shell 1;
Fig. 5 is the surface texture figure of the lower surface of shell 1;
Fig. 6 is the structural representation of shell 1.
In figure, shown in each mark, parts or structure are respectively: 1 shell; 1a substrate; 1b lug boss; 2 detector chips; 3 light window glass; 4 spun golds; 5 preformed solder sheets; 6 preformed solder rings; The upper surface of 7 lug bosses; 8 first electrode pads; 9 second electrode pads; 10 third electrode pads; 11 the 4th electrode pads; 12 the 5th electrode pads; 13 the 6th electrode pads; 14 sealed cavities; 15 bases; 16 pipe caps; 17 ceramic substrates; 18 insulators; 19 lead-in wires; 20 metallization via holes.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is further described.It should be noted that, convenient in order to describe, in description of the present utility model, term " on ", the orientation of D score, "front", "rear", "left", "right" instruction is based on the orientation shown in Fig. 3.
As shown in Fig. 2 ~ Fig. 6, the structure of the embodiment of a kind of microminiaturized ceramic cartridge photodetector encapsulating structure of the utility model is: comprise shell 1, detector chip 2 and light window glass 3, shell 1 is structure as a whole, comprise integrated substrate 1a and the lug boss 1b being positioned at substrate 1a edge, be overlying on first electrode pad 8 separated from one another of substrate 1a upper surface, second electrode pad 9 and third electrode pad 10, run through substrate 1a and be located at the first electrode pad 8, 3 via holes 20 that metallize of the second electrode pad 9 and third electrode pad 10 lower end, and in the lower surface of substrate 1a corresponding to the 4th electrode pad 11 that the position of metallization via hole 20 is arranged, 5th electrode pad 12 and the 6th electrode pad 13, substrate 1a and lug boss 1b all adopts High Temperature Co Fired Ceramic material, detector chip 2 is located on the second electrode pad 9, the lower surface of detector chip 2 and the outer surface of the second electrode pad 9 are all coated with the metal level matched with preformed solder sheet 5, the lower surface of detector chip 2 is welded on the outer surface of the second electrode pad 9 by preformed solder sheet 5 eutectic be located under it, the first electrode pad 8, third electrode pad 10 are connected respectively by the electrode bonding of spun gold 4 with both sides, detector chip 2 upper end, light window glass 3 is located on lug boss 1b, the upper surface 7 of lug boss 1b and the lower surface of light window glass 3 are all coated with the metal level matched with preformed solder ring 6, the lower surface of light window glass 3 is welded on the upper surface 7 of lug boss 1b by preformed solder ring 6 eutectic be located under it, and forms sealed cavity 14.
As shown in Fig. 4 and Fig. 6, the via hole 20 that metallizes is equipped with between the first electrode pad 8 and the 4th electrode pad 11, between the second electrode pad 9 and the 5th electrode pad 12, between third electrode pad 10 and the 6th electrode pad 13, wherein Fig. 4 also show 3 metallization via holes 20 relative to the position of the first electrode pad 8, second electrode pad 9 with third electrode pad 10, because the upper end of the via hole 20 that metallizes is sealed with third electrode pad 10 by the first electrode pad 8, second electrode pad 9, the via hole 20 that in fact metallizes viewed from the appearance of shell 1 is sightless, simultaneously, with prior art by arranging through hole on base 15, and insulator 18 and lead-in wire 19 are set in this through hole, thus realize base 15 compared with the sealing gone between 19 by insulator 18, because the metallization via hole in the utility model 20 need realize connection first electrode pad 8 and the 4th electrode pad 11, second electrode pad 9 and the 5th electrode pad 12, the function of third electrode pad 10 and the 6th electrode pad 13, and do not need to arrange insulator 18 and lead-in wire 19 wherein, therefore the diameter of metallization via hole 20 is much smaller with the diameter of the through hole of lead-in wire 19 relative to housing insulation 18 in prior art, thus raising product strength can also be obtained, and make the beneficial effect that the structure of product is compacter.
Preferably, the melting temperature of preformed solder ring 6 is lower than the melting temperature of preformed solder sheet 5.
Preferably, the outer surface of the upper surface 7 of lug boss 1b, the lower surface of light window glass 3, the lower surface of detector chip 2 and the second electrode pad 9 is all coated with layer gold or the alloying metal layer containing gold.
More preferably, be coated with in the upper surface 7 of lug boss 1b the nickel dam that thickness is 2 ~ 5 μm from bottom to top successively, and thickness is the layer gold of 1.5 ~ 2.5 μm.
More preferably, be coated with one deck titanium layer, one deck nickel dam and one deck layer gold from top to bottom successively in the lower surface of light window glass 3, or be coated with one deck layers of chrome and one deck layer gold from top to bottom successively.
More preferably, preformed solder sheet 5 adopts Au
88ge
12, fusing point is 357 DEG C.
More preferably, preformed solder ring 6 adopts Au
80sn
20, fusing point is 280 DEG C.
More preferably, to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of the first electrode pad 8, second electrode pad 9, third electrode pad 10 is coated with thickness all from bottom to top successively, to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of the 4th electrode pad 11, the 5th electrode pad 12, the 6th electrode pad 13 is coated with thickness all from top to bottom successively.
In concrete production process, can carry out according to following step:
1) prepare shell 1, first plate the nickel dam of 2 ~ 5 μm in the upper surface 7 of the lug boss 1b of shell 1, then plate the layer gold of 1.5 ~ 2.5 μm.
2) gold-plated process is carried out to the outer surface of all electrode pads and the lower surface of light window glass 3.
3) detector chip 2 and shell 1 are carried out eutectic to weld and sinter.Particularly, before sintering, by Ultrasonic Cleaning and the mode with absolute ethyl alcohol scouring, detector chip 2 and shell 1 are thoroughly cleaned; Detector chip 2 is put on the second electrode pad 9, and between detector chip 2 and the second electrode pad 9, put one piece of size preformed solder sheet 5 close with detector chip 2, eutectic furnace is put into after detector chip 2 adds the counterweight of certain mass, by eutectic furnace control temperature, time and vacuum degree, the eutectic completed between the electrode of detector chip 2 lower end and the second electrode pad 9 welds and sinters.
4) by the mode of gold ball bonding bonding, with spun gold, the electrode of both sides, detector chip 2 upper end is connected with the first electrode pad 8, third electrode pad 10 respectively.
5) light window glass 3 and shell 1 are carried out eutectic to weld and sinter.Particularly, according to the size of the upper surface 7 of lug boss 1b, light window glass 3 adopt the mode of evaporation steam one deck titanium layer, one deck nickel dam and one deck layer gold successively, or after steaming one deck layers of chrome and one deck layer gold successively, metallized light window glass 3 is placed on shell 1, and puts the preformed solder ring 6 with the adjoining dimensions of the upper surface 7 of lug boss 1b between; Again the above-mentioned shell 1 be well placed is put into eutectic furnace, by adjustment temperature, time and vacuum degree, the eutectic realizing light window glass 3 and shell 1 welds and sinters, thus completes a kind of sealing of microminiaturized ceramic cartridge photodetector encapsulating structure.
Claims (9)
1. a microminiaturized ceramic cartridge photodetector encapsulating structure, is characterized in that: comprise shell (1), detector chip (2) and light window glass (3);
Described shell (1) is structure as a whole, comprise integrated substrate (1a) and be positioned at the lug boss (1b) of substrate (1a) edge, be overlying on first electrode pad (8) separated from one another of described substrate (1a) upper surface, second electrode pad (9) and third electrode pad (10), and run through described substrate (1a) and be located at described first electrode pad (8) respectively, the metallization via hole of described second electrode pad (9) and described third electrode pad (10) lower end, described first electrode pad (8), described second electrode pad (9) is connected with external circuit respectively by described metallization via hole with described third electrode pad (10), described substrate (1a) and described lug boss (1b) all adopt High Temperature Co Fired Ceramic material,
Described detector chip (2) is located on described second electrode pad (9), the lower surface of described detector chip (2) and the outer surface of described second electrode pad (9) are all coated with the metal level matched with preformed solder sheet (5), the lower surface of described detector chip (2) is welded on the outer surface of described second electrode pad (9) by described preformed solder sheet (5) eutectic be located under it, described first electrode pad (8), described third electrode pad (10) is connected respectively by the electrode bonding of spun gold with described detector chip (2) both sides, upper end,
Described light window glass (3) is located on described lug boss (1b), the upper surface (7) of described lug boss (1b) and the lower surface of described light window glass (3) are all coated with the metal level matched with preformed solder ring (6), the lower surface of described light window glass (3) is welded on the upper surface (7) of described lug boss (1b) by described preformed solder ring (6) eutectic be located under it, and forms sealed cavity (14).
2. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 1, it is characterized in that: described shell (1) also comprises the 4th electrode pad (11), the 5th electrode pad (12) and the 6th electrode pad (13), described 4th electrode pad (11), described 5th electrode pad (12) and described 6th electrode pad (13) are located at the position of lower surface corresponding to described metallization via hole of described substrate (1a) respectively.
3. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 1, is characterized in that: the melting temperature of described preformed solder ring (6) is lower than the melting temperature of described preformed solder sheet (5).
4. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 2, is characterized in that: the lower surface of the upper surface (7) of described lug boss (1b), the lower surface of described light window glass (3), described detector chip (2) and the outer surface of described second electrode pad (9) are all coated with layer gold or the alloying metal layer containing gold.
5. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 4, it is characterized in that: be coated with in the upper surface (7) of described lug boss (1b) nickel dam that thickness is 2 ~ 5 μm from bottom to top successively, and thickness is the layer gold of 1.5 ~ 2.5 μm.
6. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 4, it is characterized in that: be coated with one deck titanium layer, one deck nickel dam and one deck layer gold from top to bottom successively in the lower surface of described light window glass (3), or be coated with one deck layers of chrome and one deck layer gold from top to bottom successively.
7. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 4, is characterized in that: described preformed solder sheet (5) adopts Au
88ge
12, fusing point is 357 DEG C.
8. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 4, is characterized in that: described preformed solder ring (6) adopts Au
80sn
20, fusing point is 280 DEG C.
9. microminiaturized ceramic cartridge photodetector encapsulating structure according to claim 4, it is characterized in that: to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of described first electrode pad (8), described second electrode pad (9), described third electrode pad (10) is coated with thickness all from bottom to top successively, to be the nickel dam of 2 ~ 5 μm and thickness the be layer gold of 1.5 ~ 2.5 μm that the outer surface of described 4th electrode pad (11), described 5th electrode pad (12), described 6th electrode pad (13) is coated with thickness all from top to bottom successively.
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Address after: 400060 Chongqing City Economic Development Zone Danlong Road No. 7 building E Patentee after: CHONGQING EAGLE VALLEY OPTOELECTRONIC LIMITED Address before: Danlong road 400060 Chongqing Nan'an District No. 7 building E Patentee before: Chongqing Eagle Valley Optoelectronic Limited |