JP2013115116A - Led module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED module that can have higher luminance.SOLUTION: An LED module 101 includes an LED chip 210, and a chip support 221 having a mount surface 221a where the LED chip 210 is mounted. The chip support 221 has a projection part 222 which projects away from the mount surface 221a and surrounds the LED chip 210.

Description

  The present invention relates to an LED module including an LED chip.

  FIG. 17 shows an example of a conventional LED module (see, for example, Patent Document 1). In the LED module 900 shown in the figure, an LED chip 902 is mounted on a substrate 901. The LED chip 902 is mounted on a submount substrate 903 made of Si, and the submount substrate 903 is mounted on the substrate 901. The LED chip 902 is electrically connected to the substrate 901 through the submount substrate 903. The LED chip 902 is surrounded by a frame-shaped reflector 904. A space surrounded by the reflector 904 is filled with a sealing resin 905.

  However, Si, which is the material of the submount substrate 903, can easily absorb, for example, blue light emitted from the LED chip 902. For this reason, of the light emitted from the LED chip 902, the light traveling to the submount substrate 903 is absorbed by the submount substrate 903. Therefore, high brightness of the LED module 900 has been hindered.

JP 2004-119743 A

  The present invention has been conceived under the above-described circumstances, and an object thereof is to provide an LED module capable of achieving high brightness.

  The LED module provided by the first aspect of the present invention includes an LED chip and a chip support having a mounting surface on which the LED chip is mounted, and the chip support is moved away from the mounting surface. And a protruding portion surrounding the LED chip.

  In a preferred embodiment of the present invention, the inner surface of the protruding portion on the LED chip side in the direction perpendicular to the normal direction is further away from the mounting surface in the normal direction of the mounting surface. It inclines so that it may distance from the said LED chip.

  In preferable embodiment of this invention, the inner surface by the side of the said LED chip in the said protrusion part is formed with a material with a higher reflectance than Si.

  In a preferred embodiment of the present invention, the chip support is made of a metal material.

  In a preferred embodiment of the present invention, the chip support includes aluminum.

  In a preferred embodiment of the present invention, the chip support is formed by pressing a metal plate.

  In a preferred embodiment of the present invention, the projection further includes an opaque resin that covers at least a part of the outer surface opposite to the LED chip and does not transmit light from the LED chip.

  In a preferred embodiment of the present invention, the opaque resin covers all of the outer surface of the protrusion.

  In a preferred embodiment of the present invention, the opaque resin is white.

  In preferable embodiment of this invention, the board | substrate with which the said chip support body is mounted is further provided.

  In a preferred embodiment of the present invention, a reflector attached to the substrate and having a reflective surface surrounding the chip support, and a seal that covers the chip support and transmits light from the LED chip. And a stop resin.

  In a preferred embodiment of the present invention, a light-transmitting resin is further provided that is interposed between the chip support and the sealing resin and covers the LED chip.

  In a preferred embodiment of the present invention, at least one of the sealing resin and the translucent resin is excited by light from the LED chip and emits light having a color different from that of the light from the LED chip. Contains phosphor material.

  In a preferred embodiment of the present invention, the translucent resin includes the phosphor material, and the sealing resin is made of a transparent resin that does not include the phosphor material.

  In a preferred embodiment of the present invention, the sealing resin and the translucent resin are formed of resin materials having different refractive indexes.

  In preferable embodiment of this invention, the refractive index of the said translucent resin is smaller than the refractive index of the material which comprises the said LED chip, and the refractive index of the said sealing resin is the refraction of the said translucent resin. Less than rate.

  In a preferred embodiment of the present invention, the opaque resin is interposed between the substrate and the sealing resin and covers the entire region from the chip support to the reflective surface.

  In a preferred embodiment of the present invention, a boundary surface between the opaque resin and the sealing resin is located farther from the substrate than the mounting surface of the chip support.

  In a preferred embodiment of the present invention, one end is bonded to the LED chip, and the other end is bonded to a wiring pattern located outside the protruding portion, and the wire is provided so as to straddle the protruding portion. Is further provided.

  The LED module provided by the second aspect of the present invention includes a plurality of LED chips, a plurality of chip supports each having a mounting surface on which the LED chips are mounted, and the plurality of chip supports. And a reflector attached to the substrate and having a reflecting surface surrounding the chip support, and an opaque resin, the chip support projecting away from the mounting surface, and the LED chip The projecting portion is surrounded, and at least a part of the outer surface of the projecting portion opposite to the LED chip is covered with the opaque resin.

  In a preferred embodiment of the present invention, the opaque resin covers the entire region from the chip support to the reflective surface.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a perspective view which shows the LED module based on 1st Embodiment of this invention. It is a top view which shows the LED module of FIG. It is sectional drawing which follows the III-III line of FIG. It is sectional drawing which follows the IV-IV line of FIG. It is a principal part expanded sectional view which shows the LED module of FIG. It is a top view which shows the LED module based on 2nd Embodiment of this invention. It is sectional drawing which follows the VII-VII line of FIG. It is a principal part expanded sectional view which shows the LED module of FIG. It is a top view which shows the LED module based on 3rd Embodiment of this invention. It is sectional drawing which follows the XX line of FIG. It is a principal part expanded sectional view which shows the LED module of FIG. It is a perspective view which shows the LED module based on 4th Embodiment of this invention. It is a top view which shows the LED module of FIG. It is a principal part enlarged plan view which shows the LED module of FIG. It is sectional drawing which follows the XV-XV line | wire of FIG. It is a principal part expanded sectional view which shows the LED module of FIG. It is sectional drawing which shows an example of the conventional LED module.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 5 show an LED module according to a first embodiment of the present invention. The LED module 101 of the present embodiment includes a substrate 300, an LED chip 210, a chip support 220 on which the LED chip 210 is mounted, two wires 400, a translucent resin 500, a reflector 600, a white resin 700, and a sealing resin 800. It has. For ease of understanding, the light-transmitting resin 500 and the sealing resin 800 are omitted in FIGS. 1 and 2.

  The substrate 300 includes a base material 310 and a wiring pattern 320 formed on the base material 310. The base material 310 has a rectangular shape and is made of, for example, a glass epoxy resin. The wiring pattern 320 is made of, for example, a metal such as Cu or Ag, and has bonding portions 321 and 322, detour portions 323 and 324, and mounting terminals 325 and 326. The bonding parts 321 and 322 are formed on the upper surface of the base material 310. The detour portions 323 and 324 are connected to the bonding portions 321 and 322 and are formed on both side surfaces of the base material 310. The mounting terminals 325 and 326 are formed on the lower surface of the base 310 and are connected to the detour portions 323 and 324. The mounting terminals 325 and 326 are used for mounting the LED module 101 on, for example, a circuit board.

  The LED chip 210 has a structure having a semiconductor layer in which an n-type semiconductor layer made of, for example, GaN, an active layer, and a p-type semiconductor layer are stacked, and emits blue light, for example. The chip support 220 is a member on which the LED chip 210 is mounted, and is made of a metal material including, for example, aluminum. The chip support 220 includes a flat plate portion 221 and a protrusion 222 formed on the periphery of the flat plate portion 221, and the upper surface of the flat plate portion 221 in FIGS. 3 to 5 is a mounting surface on which the LED chip 210 is mounted. 221a. The protruding portion 222 protrudes away from the mounting surface 221 a and surrounds the LED chip 210. As shown in FIG. 5, the inner surface 222a of the protrusion 222 on the LED chip 210 side is closer to the mounting surface 221a in the normal direction of the mounting surface 221a, and the LED chip in a direction perpendicular to the normal direction. Inclined away from 210. The outer surface 222b on the opposite side of the protrusion 222 from the LED chip 210 extends along the normal direction of the mounting surface 221a. As shown in FIG. 2, the outer surface 222b of the protrusion 222 is rectangular in plan view (viewed in the normal direction of the mounting surface 221a). The chip support 220 is formed, for example, by pressing a metal plate made of aluminum or an aluminum alloy.

  As shown in FIG. 5, the LED chip 210 is bonded to the mounting surface 221a of the chip support 220 via a transparent resin 240 such as a silicone resin. The chip support 220 is mounted on the substrate 300 with an insulating paste 250. Two electrodes (not shown) are formed on the LED chip 210. One end of each of the two wires 400 is bonded to these electrodes, and the LED chip 210 is configured as a so-called two-wire type. The other end of one wire 400 is bonded to the bonding portion 321, and the other end of the other wire 400 is bonded to the bonding portion 322. Thereby, each wire 400 is provided so that the protrusion part 222 may be straddled.

  Taking an example of the dimensions of the LED chip 210 and the chip support 220, the chip support 220 has a square shape with a side of about 1 mm in plan view, and the thickness of the flat plate portion 221 is about 50 to 300 μm. The length in which the protruding portion 222 protrudes from the mounting surface 221a in the normal direction is about 300 μm. The LED chip 210 has a square shape with a side of about 610 μm in a plan view and a thickness of about 150 μm. The refractive index of GaN constituting the LED chip 210 is about 2.4.

  The translucent resin 500 is interposed between the chip support 220 and the sealing resin 800. The translucent resin 500 covers the LED chip 210 and fills the space surrounded by the inner surface 222a of the chip support 220 (protruding portion 222). The translucent resin 500 is made of, for example, a material obtained by mixing a phosphor material into a transparent phenyl silicone resin. This phosphor material emits yellow light when excited by blue light emitted from the LED chip 210, for example. The LED module 101 emits white light by mixing these blue light and yellow light. In addition, as the phosphor material, a material that emits red light and a material that emits green light when excited by blue light may be used. In addition, the refractive index of the translucent resin 500 is about 1.5 to 1.6.

  The reflector 600 is for causing more light from the LED chip 210 to travel in the normal direction, and is made of a white resin such as polybutylene terephthalate. The reflector 600 has a frame shape surrounding the chip support 220, and a reflective surface 610 is formed on the reflector 600. The reflection surface 610 surrounds the chip support 220 (LED chip 210), and includes four planes corresponding to the four outer surfaces 222b of the chip support 220, respectively. In the present embodiment, as the reflective surface 610 is separated from the substrate 300 in the thickness direction of the substrate 300, the reflecting surface 610 moves away from the chip support 220 (LED chip 210) in a direction perpendicular to the thickness direction of the substrate 300. So as to be inclined. As an example of the dimensions of the reflector 600, the opening surrounded by the reflecting surface 610 in a plan view has a long rectangular shape of about 1.9 mm × 3.9 mm, and is in the height direction (the same as the thickness direction of the substrate 300). Direction) is about 1 mm.

  The white resin 700 is made of a white resin material that does not transmit light from the LED chip 210 and corresponds to an example of an opaque resin in the present invention. The white resin 700 is, for example, a silicone resin in which titanium oxide particles are mixed. The white resin 700 covers all of the outer side surface 222b of the protrusion 222 (chip support 220). In the present embodiment, the white resin 700 also covers the entire region from the chip support 220 to the reflection surface 610 of the reflector 600. As shown in FIGS. 3 to 5, the surface of the white resin 700 (the boundary surface 701 with the sealing resin 800) has a shape in which an intermediate portion is recessed. The boundary surface 701 is located farther from the substrate 300 than the mounting surface 221a of the chip support 220.

  The sealing resin 800 covers the chip support 220 and fills the space surrounded by the reflective surface 610. The sealing resin 800 is made of, for example, a transparent epoxy resin or silicone resin. The phosphor material is not mixed in the sealing resin 800. The refractive index of the sealing resin 800 is about 1.4.

  An example of the manufacturing method of the LED module 101 is given. First, the LED chip 210 is bonded to the chip support 220. Next, the chip support 220 is mounted on the substrate 300. Next, the wire 400 is bonded to the LED chip 210. Next, the reflector 600 is formed on the substrate 300. Next, a translucent resin 500 is formed. Next, a white resin 700 is formed. The white resin 700 is formed by injecting a white liquid resin material between the outer surface 222b of the chip support 220 and the reflection surface 610 of the reflector 600 and curing it. The liquid resin material is rich in fluidity at the time of injection, and has a shape in which an intermediate portion of the surface exposed in the normal direction is recessed due to surface tension. The white resin 700 formed in this way reaches the upper end of the protrusion 222 at the contact portion with the protrusion 222 and covers the entire outer surface 222b. On the other hand, the contact portion between the white resin 700 and the reflective surface 610 does not reach the upper end of the reflective surface 610, and the white resin 700 partially covers the reflective surface 610. Then, by forming the sealing resin 800, the LED module 101 is completed.

  Next, the operation of the LED module 101 will be described.

  According to the present embodiment, of the light from the LED chip 210, the light emitted toward the side of the LED chip 210 is shielded by the protrusion 222 that surrounds the LED chip 210. The protrusion 222 is made of a metal material containing aluminum, and has a higher reflectance than Si, which is a material of a submount substrate that is not used in the present embodiment. For this reason, the light from the LED chip 210 is favorably reflected by the inner side surface 222 a of the protrusion 222. Therefore, it is possible to increase the ratio of the light emitted from the LED chip 210 to be emitted from the sealing resin 800, and to increase the brightness of the LED module 101.

  The LED chip 210 is mounted on the mounting surface 221 a of the chip support 220, and the chip support 220 has a protrusion 222 that surrounds the LED chip 210. According to such a configuration, the protruding portion 222 can be brought closer to the LED chip 210, and more light from the LED chip 210 can be reflected by the inner side surface 222 a of the protruding portion 222. This is preferable for increasing the brightness of the LED module 101.

  Furthermore, as shown in FIG. 5, the inner side surface 222a of the protrusion 222 is inclined so as to open upward. For this reason, the light reflected by the inner side surface 222a is easily emitted outside the LED module 101. Therefore, it is possible to further increase the brightness of the LED module 101.

  The chip support body 220 having the protrusions 222 can be easily formed by pressing a metal plate containing aluminum. Further, the LED chip 210 is mounted on a metal chip support 220 having excellent thermal conductivity, and the chip support 220 is mounted on the substrate 300. Thereby, the effect which improves the thermal radiation from the LED chip 210 to the board | substrate 300 side can be anticipated.

  The translucent resin 500 interposed between the chip support 220 and the sealing resin 800 contains a phosphor material and covers the LED chip 210. On the other hand, the sealing resin 800 is made of a transparent resin containing no phosphor material. As described above, according to the configuration including the sealing resin 800 that does not include the phosphor material, the usage amount of the phosphor material can be reduced. This is advantageous for reducing the cost of the LED module 101.

  Light traveling from the LED chip 210 is diffused by the phosphor material. According to the sealing resin 800 that does not include the phosphor material, it is possible to suppress the diffusion of light from the LED chip 210. This is preferable for increasing the brightness of the LED module 101.

  The difference between the refractive index (approximately 1.5 to 1.6) of the translucent resin 500 covering the LED chip 210 and the refractive index (approximately 2.4) of GaN constituting the LED chip 210 is the refraction of the sealing resin 800. It is smaller than the difference between the refractive index (about 1.4) and the refractive index of GaN. Therefore, according to the LED module 101 of this embodiment, the ratio of the light reflected on the surface of the LED chip 210 and staying inside the LED chip 210 is lower than when the LED chip is directly covered with the sealing resin. In addition, the proportion of light emitted from the LED chip 210 increases. This is preferable for increasing the brightness of the LED module 101.

  The white resin 700 covers the entire region from the chip support 220 to the reflection surface 610 of the reflector 600. For this reason, it is possible to avoid the light from the LED chip 210 being absorbed by the substrate 300 or the like. This is preferable for increasing the brightness of the LED module 101.

  A boundary surface 701 between the white resin 700 and the sealing resin 800 is located farther from the substrate 300 than the mounting surface 221 a of the chip support 220. According to such a configuration, the entire region from the chip support 220 to the reflection surface 610 of the reflector 600 can be appropriately covered with the white resin 700.

  6 to 16 show other embodiments of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  6 to 8 show an LED module according to a second embodiment of the present invention. The LED module 102 of the present embodiment is different from the LED module 101 described above in the configuration of the LED chip 210, the translucent resin 500, and the sealing resin 800.

  In the present embodiment, only one wire 400 is bonded to the LED chip 210, and the LED chip 210 is configured as a so-called one-wire type. Of the two electrodes (not shown) of the LED chip 210, one electrode is provided on the surface mounted on the chip support 220, and the conductive paste 241 is applied to the mounting surface 221 a of the chip support 220. Are joined through. The other electrode is provided on the surface opposite to the surface mounted on the chip support 220. One end of a wire 400 is bonded to the other electrode. The other end of the wire 400 is bonded to the bonding part 322. The chip support 220 is mounted on the substrate 300 via the conductive paste 251.

  In the present embodiment, the translucent resin 500 does not include a phosphor material, and the sealing resin 800 includes a phosphor material.

  According to such an embodiment, it is possible to increase the brightness of the LED module 102.

  9 to 11 show an LED module according to a third embodiment of the present invention. The LED module 103 of this embodiment is different from the LED module 101 described above in the configuration of the chip support 220.

  In the present embodiment, the chip support 220 is made of Si, and has a shape having a protrusion 222 by removing the central portion to a predetermined depth by etching or the like. As shown in FIG. 11, an aluminum film 223 is formed on the mounting surface 221a of the flat plate portion 221 and the inner side surface 222a and the front end surface of the protruding portion 222 by a technique such as sputtering. As the aluminum film 223, a single aluminum film or a film made of a plurality of kinds of metals including aluminum and copper can be employed.

  According to the present embodiment, of the light from the LED chip 210, the light emitted toward the side of the LED chip 210 is shielded by the protrusion 222 that surrounds the LED chip 210. Si, which is a material of the protruding portion 222 (chip support 220), relatively easily absorbs light. In the present embodiment, an aluminum film 223 is formed on the inner side surface 222 a of the protrusion 222. Since the surface on which the aluminum film 223 is formed has a higher reflectance than Si, light from the LED chip 210 is reflected. Therefore, according to such an embodiment, it is possible to increase the brightness of the LED module 103.

  Further, the outer surface 222 b of the projecting portion 222 made of Si is entirely covered with the white resin 700. For this reason, it is possible to avoid that the light from the LED chip 210 is absorbed by the outer surface 222b. This is preferable for increasing the brightness of the LED module 103.

  12 to 16 show an LED module according to a fourth embodiment of the present invention. The LED module 104 of the present embodiment includes a plurality of LED chips 210, and accordingly, the configurations of the substrate 300 and the reflector 600 are different from those of the LED module 101 described above. Further, the LED module 104 of the present embodiment does not include the above-described translucent resin 500.

  As shown in FIGS. 12 and 13, in this embodiment, the base material 310 is made of ceramics such as alumina, for example, and has a bar shape extending long in a certain direction. The wiring pattern 320 formed on the base material 310 includes a plurality of bonding portions 321 and 322 that are alternately arranged in the longitudinal direction of the base material 310, and connection terminal portions (not shown) provided at end portions of the base material 310. Have A plurality of chip supports 220 are mounted on the upper surface of the substrate 300 at predetermined intervals in the longitudinal direction. The plurality of bonding portions 321 and 322 are arranged corresponding to the plurality of LED chips 210. The paired bonding portions 321 and 322 corresponding to the adjacent LED chips 210 are connected to each other and are electrically connected. Of the two wires 400 having one end bonded to an electrode (not shown) of each LED chip 210, the other end of one wire 400 is bonded to a bonding portion 321 corresponding to the LED chip 210, and the other The other end of the wire 400 is bonded to a bonding part 322 corresponding to the LED chip 210. With such a configuration, the plurality of LED chips 210 are connected in series with each other.

  The reflector 600 has a long shape corresponding to the substrate 300. The reflector 600 is formed with a plurality of reflective surfaces 610 separated from each other so as to correspond to the arrangement of the plurality of chip supports 220. In the present embodiment, the sealing resin 800 includes a phosphor material. The LED module 104 having such a configuration is used, for example, as a light source device for a backlight of a liquid crystal display device.

  Also according to such an embodiment, it is possible to increase the brightness of the LED module 104.

  The LED module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the LED module according to the present invention can be changed in various ways.

101-104 LED module 210 LED chip 220 Chip support 221 Flat plate portion 221a Mounting surface 222 Projection portion 222a Inner side surface 222b Outer side surface 223 Aluminum film 240 Transparent resin 241 Conductive paste 250 Insulating paste 251 Conductive paste 300 Substrate 310 Base material 320 Wiring patterns 321 and 322 Bonding portions 323 and 324 Detour portions 325 and 326 Mounting terminal 400 Wire 500 Translucent resin 600 Reflector 700 White resin (opaque resin)
800 Sealing resin

Claims (21)

An LED chip;
A chip support having a mounting surface on which the LED chip is mounted,
The said chip support body protrudes so that it may distance from the said mounting surface, and has a protrusion part surrounding the said LED chip, LED module.   The inner surface of the protruding portion on the LED chip side is inclined so as to move away from the LED chip in a direction perpendicular to the normal direction as the distance from the mounting surface in the normal direction of the mounting surface increases. The LED module according to claim 1.   3. The LED module according to claim 1, wherein an inner surface of the protruding portion on the LED chip side is formed of a material having a higher reflectance than Si.   The LED module according to claim 3, wherein the chip support is made of a metal material.   The LED module according to claim 4, wherein the chip support includes aluminum.   The LED module according to claim 4, wherein the chip support is formed by pressing a metal plate.   The LED module according to claim 1, further comprising an opaque resin that covers at least a part of an outer surface opposite to the LED chip in the protruding portion and does not transmit light from the LED chip.   The LED module according to claim 7, wherein the opaque resin covers all of the outer surface of the protruding portion.   The LED module according to claim 7 or 8, wherein the opaque resin is white.   The LED module according to claim 7, further comprising a substrate on which the chip support is mounted. A reflector attached to the substrate and having a reflective surface surrounding the chip support;
The LED module according to claim 10, further comprising: a sealing resin that covers the chip support and transmits light from the LED chip.   The LED module according to claim 11, further comprising a translucent resin interposed between the chip support and the sealing resin and covering the LED chip.   The at least one of the sealing resin and the translucent resin includes a phosphor material that is excited by light from the LED chip and emits light having a color different from that of the light from the LED chip. 12. The LED module according to 12. The translucent resin includes the phosphor material,
The LED module according to claim 13, wherein the sealing resin is made of a transparent resin not including the phosphor material.   The LED module according to claim 14, wherein the sealing resin and the translucent resin are formed of resin materials having different refractive indexes.   The refractive index of the translucent resin is smaller than the refractive index of the material constituting the LED chip, and the refractive index of the sealing resin is smaller than the refractive index of the translucent resin. LED module according to 1.   The LED module according to any one of claims 11 to 16, wherein the opaque resin is interposed between the substrate and the sealing resin and covers the entire region from the chip support to the reflective surface. .   The LED module according to claim 17, wherein a boundary surface between the opaque resin and the sealing resin is located at a position farther from the substrate than the mounting surface of the chip support.   19. The device according to claim 1, further comprising: a wire having one end bonded to the LED chip and the other end bonded to a wiring pattern positioned outside the protrusion, and provided to straddle the protrusion. The LED module in any one. A plurality of LED chips;
A plurality of chip supports each having a mounting surface on which the LED chip is mounted;
A substrate on which the plurality of chip supports are mounted;
A reflector attached to the substrate and having a reflective surface surrounding the chip support;
An opaque resin,
The chip support has a protrusion that protrudes away from the mounting surface and surrounds the LED chip, and at least a part of the outer surface of the protrusion opposite to the LED chip is at least part of the opaque resin. LED module covered with   The LED module according to claim 20, wherein the opaque resin covers the entire region from the chip support to the reflective surface.

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