JP2005310911A - Package for housing light emitting element, light emitting device, and lighting apparatus - Google Patents

Package for housing light emitting element, light emitting device, and lighting apparatus Download PDF

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Publication number
JP2005310911A
JP2005310911A JP2004123225A JP2004123225A JP2005310911A JP 2005310911 A JP2005310911 A JP 2005310911A JP 2004123225 A JP2004123225 A JP 2004123225A JP 2004123225 A JP2004123225 A JP 2004123225A JP 2005310911 A JP2005310911 A JP 2005310911A
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Japan
Prior art keywords
light emitting
emitting element
reflecting member
upper
surface
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Pending
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JP2004123225A
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Japanese (ja)
Inventor
Tamio Kusano
民男 草野
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Kyocera Corp
京セラ株式会社
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Priority to JP2004123225A priority Critical patent/JP2005310911A/en
Publication of JP2005310911A publication Critical patent/JP2005310911A/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting element housing package, a light emitting device, and an illumination device capable of reducing variations in radiation intensity, axial luminous intensity, luminance, color rendering, and the like.
A light emitting element storage package includes a base 1 having a mounting portion 1a of a light emitting element 5 at a central portion of an upper main surface, and an inner surface joined to the upper main surface of the base 1 so as to surround the mounting portion 1a. A frame-shaped reflecting member 2 whose peripheral surface is a reflecting surface that reflects light emitted from the light emitting element 5, and a conductor layer that is formed on the upper main surface of the substrate 1 and to which the light emitting element 5 is electrically connected. 6, the reflecting member 2 is formed by joining the lower reflecting member 2 a and the upper reflecting member 2 b, and the inclination angle of the inner peripheral surface of the lower reflecting member 2 a with respect to the upper main surface of the base 1 is upper reflecting. The inclination angle of the inner peripheral surface of the member 2b with respect to the upper main surface of the base 1 is larger.
[Selection] Figure 1

Description

  The present invention relates to a light-emitting element housing package, a light-emitting device, and a lighting device that radiate light emitted from a light-emitting element to the outside.

  A light emitting device that emits white light by converting long wavelengths of light such as near ultraviolet light and blue light emitted from a light emitting element 15 such as a conventional light emitting diode (LED) into a long wavelength with a plurality of phosphors such as red, green, blue, and yellow Is shown in FIG. In FIG. 3, the light-emitting device has a mounting portion 11a for mounting the light-emitting element 15 at the center of the upper main surface, and leads terminals that electrically connect the inside and outside of the light-emitting device from the mounting portion 11a and its periphery. And a base 11 made of an insulator on which a wiring conductor (not shown) made of metallized wiring or the like is formed, and an upper main surface of the base 11 are bonded and fixed, and a through hole 12a having an upper opening larger than the lower opening is formed. In addition, a frame-like reflecting member 12 whose inner peripheral surface is a reflecting surface 12b that reflects light emitted from the light emitting element 15, and excitation of light emitted from the light emitting element 15 filled inside the reflecting member 12 However, it is mainly composed of a translucent member 13 containing a phosphor 14 for wavelength conversion on the long wavelength side, and a light emitting element 15 mounted and fixed on the mounting portion 11a.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramics, the wiring conductor is formed on the upper main surface by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is provided on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the reflecting surface 12b of the reflecting member 12 is formed by smoothing the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by. The reflecting member 12 is formed on the upper main surface of the base 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 by a soldering material such as solder, silver (Ag) brazing, or a bonding material such as a resin adhesive. Be joined.

Then, the wiring conductor arranged around the mounting portion 11a and the light emitting element 15 are electrically connected through the electrical connection means 16 such as a bonding wire or a metal ball, and then an epoxy resin or silicone containing a phosphor is used. Filling the inside of the reflective member 12 with a translucent member 13 such as a resin so as to cover the light emitting device 15 with an injection machine such as a dispenser, and thermosetting in an oven, the light from the light emitting device 15 is emitted by a phosphor with a long wavelength A light emitting device capable of extracting light having a desired wavelength spectrum by wavelength conversion to the side can be obtained (see Patent Document 1 below).
Japanese Patent Laid-Open No. 2003-37298

  In recent years, there has been an increase in the use of the above-described light emitting device for illumination, and a light emitting device with higher characteristics in radiation intensity and heat dissipation characteristics is required.

  However, in the above conventional light emitting device, the translucent member 13 tends to spread on the surface of the reflecting member 12, the shape of the upper surface of the translucent member 13 filled inside the reflecting member 12 is not stable, and the translucent light is transmitted. There was a problem that the surface area of the upper surface of the conductive member 13 was not stable. Therefore, the angle of refraction of the light emitted from the light emitting element 15 on the upper surface of the translucent member 13 varies, and the radiation angle cannot be made constant, or the density of light emitted from the upper surface of the translucent member 13 varies. In other words, the radiant intensity cannot be made constant, and the radiant intensity, on-axis luminous intensity, luminance, color rendering, and the like vary from light emitting device to light emitting device.

Therefore, the present invention has been completed in view of the above-described conventional problems, and its purpose is as follows.
It is an object to provide a light emitting element storage package, a light emitting device, and a lighting device capable of reducing variations in radiation intensity, on-axis luminous intensity, luminance, color rendering, and the like.

  The light emitting element storage package of the present invention has a base having a light emitting element mounting portion at the center of the upper main surface, and an inner peripheral surface joined to the upper main surface of the base so as to surround the mounting portion. A frame-shaped reflecting member that is a reflecting surface that reflects light emitted from the light emitting element, and a conductor layer that is formed on the upper main surface of the base and is electrically connected to the light emitting element. The reflecting member is formed by joining a lower reflecting member and an upper reflecting member, and an inclination angle of the inner peripheral surface of the lower reflecting member with respect to the upper main surface is the inner peripheral surface of the upper reflecting member. It is characterized by being larger than the inclination angle with respect to the upper main surface.

  The light emitting device of the present invention includes the light emitting element storage package of the present invention, the light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member that covers the light emitting element. It is characterized by comprising.

  The illuminating device of the present invention is characterized in that the light emitting device of the present invention is installed in a predetermined arrangement.

  The light emitting element storage package of the present invention has a base having a light emitting element mounting portion at the center of the upper main surface and an inner peripheral surface joined to the upper main surface of the base so as to surround the mounting portion. A frame-like reflecting member that is a reflecting surface that reflects light to be emitted, and a conductor layer that is formed on the upper main surface of the substrate and to which the light emitting element is electrically connected. The lower reflection member and the upper reflection member are joined together, and the inclination angle of the inner peripheral surface of the lower reflection member with respect to the upper main surface of the base is greater than the inclination angle of the inner peripheral surface of the upper reflection member with respect to the upper main surface of the base Since it is large, a corner portion where the inner peripheral surface becomes discontinuous is formed at the boundary between the inner peripheral surface of the lower reflective member and the inner peripheral surface of the upper reflective member. Even if the adhesive member tries to spread on the inner peripheral surface of the upper reflecting member, Thus, it is possible to effectively prevent the spread of the light transmissive member. Therefore, the shape and surface area of the upper surface of the translucent member filled inside the reflecting member can be stabilized without variation. As a result, it is possible to effectively prevent variations in the angle of refraction of the light emitted from the light emitting element on the upper surface of the translucent member and the density of light emitted from the upper surface of the translucent member. Intensity, on-axis brightness, brightness, color rendering, etc. can be made very stable.

  Also, with this configuration, when the lower reflective member is filled with the translucent member, the translucent member can be formed into a convex shape very easily due to the effect of surface tension. By making the upper surface of the translucent member convex upward, it is possible to approximate the path length of light emitted from the light emitting element in various directions and transmit the translucent member, resulting in uneven radiation intensity. Can be effectively suppressed.

  As a result, the light characteristics such as the on-axis luminous intensity, luminance, and color rendering can be improved, and the mass productivity can be improved.

  A light emitting device of the present invention includes the light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member covering the light emitting element. Therefore, the light characteristics such as the on-axis luminous intensity, the luminance, and the color rendering properties, which are the characteristics of the light emitting element storage package of the present invention, are improved.

  Since the light emitting device of the present invention is installed in a predetermined arrangement, the lighting device of the present invention uses light emission by recombination of electrons of a light emitting element made of a semiconductor. Thus, a small illuminating device that can have lower power consumption and longer life than the existing illuminating device can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a base, 1a is a mounting portion, 2a is a lower reflecting member, 2b is an upper reflecting member, 3 is a translucent member, 5 is a light emitting element, and mainly emits light emitted from the light emitting element 5. A light-emitting device that can be emitted to the outside with directionality is configured.

  The light emitting device of the present invention has a base 1 having a mounting portion 1a for the light emitting element 5 at the center of the upper main surface, and an inner peripheral surface joined to the upper main surface of the base 1 so as to surround the mounting portion 1a. A frame-shaped reflecting member 2 that is a reflecting surface that reflects light emitted from the light emitting element 5, and a conductor layer 6 that is formed on the upper main surface of the substrate 1 and to which the light emitting element 5 is electrically connected. The reflecting member 2 is formed by joining the lower reflecting member 2a and the upper reflecting member 2b, and the inclination angle of the inner peripheral surface of the lower reflecting member 2a with respect to the upper main surface of the base 1 is that of the upper reflecting member 2b. The inclination angle of the inner peripheral surface with respect to the upper main surface of the substrate 1 is larger.

  The substrate 1 in the present invention is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, or resin such as epoxy resin. The base body 1 has a mounting portion 1a on which the light emitting element 5 is mounted on the upper main surface.

  A conductor layer 6 to which the light emitting element 5 is electrically connected is formed on the mounting portion 1a on the upper main surface of the substrate 1 and its periphery. The conductor layer 6 is led out to the outer surface of the light emitting device via a wiring layer (not shown) formed inside the base 1 and connected to the external electric circuit board, whereby the light emitting element 5 and the external electric circuit are connected. Are electrically connected.

  As a method for connecting the light emitting element 5 to the conductor layer 6, a method using a flip chip bonding method in which the lower surface of the light emitting element 5 as shown in FIG. Thereby, since the conductor layer 6 can be provided directly under the light emitting element 5, it is not necessary to provide a space for providing the conductor layer 6 on the upper main surface of the substrate 1 around the light emitting element 5. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 5 from being absorbed in the space of the conductor layer 6 of the substrate 1 and the axial luminous intensity from being lowered. Further, the light emitting element 5 is joined to the mounting portion 1a of the base 1 with an adhesive or the like, and the electrode formed on the upper surface of the light emitting element 5 is electrically connected to the conductor layer 6 formed around the mounting portion 1a, such as a bonding wire. You may connect by.

  The conductor layer 6 is formed by, for example, forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface or inside of the substrate 1 so that lead terminals such as Fe-Ni-Co alloy are embedded in the substrate 1. Or an input / output terminal made of an insulator on which a wiring conductor is formed is fitted and joined to a through hole provided in the base 1.

  The exposed surface of the conductor layer 6 is preferably coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. While being able to prevent effectively, the connection of the light emitting element 5 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

  Further, the reflecting member 2 is attached to the upper main surface of the base 1 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflection member 2 is formed by bonding a lower reflection member 2a and an upper reflection member 2b with a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin.

  With this configuration, a corner portion where the inner peripheral surface is discontinuous is formed at the boundary between the inner peripheral surface of the lower reflecting member 2a and the inner peripheral surface of the upper reflecting member 2b. Even if the translucent member 3 tries to wet and spread the inner peripheral surface of the upper reflecting member 2b, the corner portion can effectively prevent the translucent member 3 from spreading. Therefore, the shape and surface area of the upper surface of the translucent member 3 filled inside the reflecting member 2 can be stabilized without variation. As a result, it is possible to effectively prevent variations in the refraction angle of the light emitted from the light emitting element 5 on the upper surface of the translucent member 3 and variations in the density of light emitted from the upper surface of the translucent member 3. It is possible to make the radiation intensity, the on-axis luminous intensity, the luminance, the color rendering property, etc. very stable.

  Further, with this configuration, when the lower reflective member 2a is filled with the translucent member 3, the translucent member 3 can be formed into a convex shape very easily due to the effect of surface tension. By making the upper surface of the translucent member 3 convex upward, the path length of light emitted from the light emitting element 5 in various directions can be approximated, and the radiation intensity can be approximated. The occurrence of unevenness can be effectively suppressed.

  As a result, the light characteristics such as the on-axis luminous intensity, luminance, and color rendering can be improved, and the mass productivity can be improved.

  The lower reflecting member 2a and the upper reflecting member 2b are made of metal, ceramics, resin, or the like, and are formed by performing cutting processing, mold forming, or the like. Further, the lower reflecting member 2a and the upper reflecting member 2b are formed by polishing the inner peripheral surface of the through hole, smoothing it by pressing a mold, or the like on the inner peripheral surface of the through hole. The reflective surface may be formed by forming a highly reflective metal thin film such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu by vapor deposition or the like. In addition, when the lower reflection member 2a and the upper reflection member 2b are made of a metal that is easily discolored by oxidation such as Ag or Cu, a Ni plating layer having a thickness of, for example, about 1 to 10 μm and a thickness of 0.1 to 3 μm are formed on the surface. It is preferable that the Au plating layer of a certain degree is sequentially deposited by an electrolytic plating method or an electroless plating method. Thereby, the corrosion resistance of the lower reflecting member 2a and the upper reflecting member 2b is improved.

  The arithmetic mean roughness Ra of the surfaces of the lower reflecting member 2a and the upper reflecting member 2b is preferably 0.004 to 4 μm, whereby the lower reflecting member 2a and the upper reflecting member 2b emit light emitted from the light emitting element 5. It can be reflected well. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 5 and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The lower reflecting member 2a and the upper reflecting member 2b are inclined so that the inner peripheral surface spreads outward as the upper surface is directed upward, and the inclination angle of the inner peripheral surface of the lower reflecting member 2a with respect to the upper main surface of the base 1 is increased. The inclination angle of the inner peripheral surface of the upper reflecting member 2b with respect to the upper main surface of the base 1 is larger. That is, the opening angle of the inner peripheral surface of the lower reflecting member 2a is smaller than the opening angle of the upper reflecting member 2b.

  The lower reflecting member 2a has a role for filling the translucent member 3 and a role for reflecting light emitted from the light emitting element 5 upward on the inner peripheral surface. Further, the upper reflecting member 2b has a role of reflecting light emitted from the light emitting element 5 upward on the inner peripheral surface.

  The inclination angle of the inner peripheral surface of the lower reflecting member 2a with respect to the upper main surface of the substrate 1 is preferably 1.1 to 2.5 times the inclination angle of the inner peripheral surface of the upper reflecting member 2b with respect to the upper main surface of the substrate 1. Thereby, the translucent member filled inside the lower reflecting member 2a by the corner portion where the inner peripheral surface becomes discontinuous at the boundary between the inner peripheral surface of the lower reflecting member 2a and the inner peripheral surface of the upper reflecting member 2b. It is possible to effectively prevent 3 from spreading on the inner peripheral surface of the upper reflecting member 2b.

  The inclination angle of the inner peripheral surface of the lower reflecting member 2a with respect to the upper main surface of the base 1 is preferably 40 to 80 degrees. Thereby, the light emitted from the light emitting element 5 can be favorably reflected upward.

  For example, the inner peripheral surfaces of the lower reflecting member 2a and the upper reflecting member 2b are not limited to the linear inclined surface as shown in FIG. A curved inclined surface may be used. When the inner peripheral surface of the lower reflecting member 2a is curved, the inclination angle of the inner peripheral surface of the lower reflecting member 2a of the present invention with respect to the upper main surface of the base 1 is the opening edge on the upper side of the lower reflecting member 2a in the longitudinal sectional shape. The angle formed between the line connecting the lower opening edge and the upper main surface of the substrate 1 is also referred to. Similarly, when the inner peripheral surface of the upper reflecting member 2b is curved, the inclination angle of the inner peripheral surface of the upper reflecting member 2b according to the present invention with respect to the upper main surface of the base 1 is the upper reflecting member 2b in the longitudinal sectional shape. The angle formed by the line connecting the upper opening edge and the lower opening edge and the upper main surface of the substrate 1.

  When the inner peripheral surfaces of the lower reflecting member 2a and the upper reflecting member 2b are curved, the inner peripheral surfaces are discontinuous at the boundary between the inner peripheral surface of the lower reflecting member 2a and the inner peripheral surface of the upper reflecting member 2b. In order to form a corner well, the angle formed by the tangent at the upper opening edge of the inner peripheral surface of the lower reflecting member 2a and the tangent at the lower opening edge of the inner peripheral surface of the upper reflecting member 2b is 100 to 150 degrees. It is good to be.

  The reflecting member 2 may be attached to any part other than the mounting portion 1a on the upper main surface of the base body 1. However, a desired surface accuracy around the light emitting element 5, for example, in the longitudinal section of the light emitting device, the light emitting element It is preferable that the reflecting member 2 is attached so that the reflecting member 2 provided on both sides of the light-emitting element 5 is symmetrical with 5 interposed therebetween. Thereby, not only the light from the light emitting element 5 is directly radiated to the outside, but also the light emitted from the light emitting element 5 in the lateral direction or the light emitted downward is uniformly reflected by the reflecting member 2 evenly. Thus, the on-axis luminous intensity, luminance, color rendering, etc. can be effectively improved.

  In particular, as the reflecting member 2 is closer to the mounting portion 1a, the above-described effect of effectively improving the on-axis luminous intensity, luminance, color rendering, and the like appears more remarkably. Therefore, by enclosing the periphery of the mounting portion 1a closely with the reflecting member 2, more light can be reflected, and a higher on-axis luminous intensity can be obtained.

  The translucent member 3 is made of a transparent member such as an epoxy resin, a silicone resin, or sol-gel glass. Preferably, the translucent member 3 may contain a phosphor that converts the wavelength of light emitted from the light emitting element 5. By making the translucent member 3 contain a phosphor, the light emitted from the light emitting element 5 is wavelength-converted by the phosphor and light having a desired wavelength spectrum can be extracted.

  The translucent member 3 is poured inside the lower reflecting member 2 a by an injection machine such as a dispenser and filled inside the lower reflecting member 2 a so as to cover the light emitting element 5. Then, it is thermally cured in an oven or the like. As described above, the translucent member 3 is filled inside the lower reflective member 2 a, so that the translucent member 3 filled in the reflective member 2 is stabilized in a desired shape. The surface area is constant. Then, light emitted from the light emitting element 5 can be emitted above the light emitting device in the same state, and radiation intensity, axial luminous intensity, luminance, color rendering, etc. are very stable.

  In addition, with this configuration, when the lower reflective member 2a is filled with the translucent member 3, the translucent member 3 can be easily formed in a convex shape due to the effect of surface tension. By making the upper surface of the translucent member 3 convex upward, the path length through which the light emitted from the light emitting element 5 in various directions can pass through the translucent member 3 can be approximated, and the radiation intensity can be approximated. The occurrence of unevenness can be effectively suppressed.

  Further, the light characteristics such as the on-axis luminous intensity, luminance, and color rendering properties are improved, and the mass productivity is excellent.

  As shown in FIG. 2, the mounting portion 1 a is formed on the upper surface of the convex portion 1 b formed so as to protrude from the upper main surface of the base 1, and the translucent member 3 includes the convex portion 1 b and the light emitting element. A first translucent member 3a containing a phosphor covering 5 and an epoxy resin or silicone that does not include a phosphor that covers the periphery of the first translucent member 3a and is filled inside the lower reflective member 2a It may have a two-layer structure with the second translucent member 3b made of a transparent member such as resin or sol-gel glass.

  In the configuration in which the mounting portion 1a for mounting the light emitting element 5 is formed on the convex portion 1b of the base body 1, a conductor layer 6 for electrically connecting the light emitting element 5 is formed on the upper surface of the convex portion 1b. Yes. The conductor layer 6 is led out to the outer surface of the light emitting device via a wiring layer (not shown) formed inside the base 1 and connected to the external electric circuit board, whereby the light emitting element 5 and the external electric circuit are connected. Are electrically connected.

  By mounting the light emitting element 5 on the convex portion 1b protruding from the upper main surface of the base body 1, the light emitted downward from the light emitting element 5 by the protruding convex portion 1b is favorably applied to the reflecting surface of the reflecting member 2. , The light is prevented from being absorbed by a portion other than the reflecting member 2, and most of the light emitted from the light emitting element 5 can be reflected with a high reflectance. Further, the light emitting element 5 can be accurately and easily mounted on a desired position of the base body 1 by the convex portion 1b. As a result, the light emitting characteristics of the light emitting element 5 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  Moreover, the 1st translucent member 3a and the 2nd translucent member 3b are formed as follows. First, the first translucent member 3a containing a phosphor is poured onto the upper surface of the light emitting element 5 by an injection machine such as a dispenser, and droops along the side surface of the convex portion 1b by gravity, whereby the light emitting element 5 Can be covered in a hemispherical shape, and the lower portion of the first translucent member 3a can cover the side surface of the convex portion 1b with a constant thickness. And the 1st translucent member 3a is formed by thermosetting in oven etc. As shown in FIG. Thereafter, the second translucent member 3b made of a transparent member such as an epoxy resin, a silicone resin, or a sol-gel glass that does not contain a phosphor serving as the second translucent member 3b is replaced with the first translucent member 3a. The inside of the lower reflecting member 2a is filled so as to cover the periphery. And the 2nd translucent member 3b is formed by thermosetting in oven etc. As shown in FIG.

  With such a configuration, it is possible to take out light having a desired wavelength spectrum by converting the wavelength of light from the light emitting element 5 with the phosphor. Since the lower part of the first translucent member 3a covers the side surface of the protrusion 1b with a certain thickness, light emitted upward from the upper surface of the light emitting element 5 passes through the first translucent member 3a. The path length of the light and the path length through which the light emitted in the lateral direction from the side surface of the light emitting element 5 passes through the first translucent member 3 a can be made substantially the same. The path length through which the light emitted in the lower direction passes through the first light transmissive member 3a can be made substantially the same, and the wavelength conversion efficiency for all the light emitted from the light emitting element 5 can be made constant. It is possible to effectively prevent unevenness and unevenness in strength.

  In addition, by filling the second translucent member 3b up to the opening edge on the upper side of the lower reflecting member 2a, the translucent member 3 can be easily convex upward due to the effect of surface tension. By making the upper surface of the second translucent member 3b convex upward, the path length through which the light emitted from the light emitting element 5 in various directions passes through the second translucent member 3b is approximated. It is possible to effectively suppress the occurrence of uneven radiation intensity.

  Thus, in the light emitting element storage package of the present invention, the light emitting element 5 is mounted on the mounting portion 1a and the conductor layer is electrically connected to the electrode of the light emitting element 5 via the electrical connection means 6 such as a conductive adhesive or a bonding wire. By connecting the light emitting element 5 with the translucent member 3, a light emitting device is obtained.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 5 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 5 can be suppressed, and light can be irradiated with a stable radiant light intensity and radiant light angle (light distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 5 may be provided on the substrate 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the upper reflecting member 2b and the distance from the upper surface of the upper reflecting member 2b to the upper surface of the translucent member 3, thereby further improving the color rendering properties by providing a complementary color gamut. Can be obtained.

  In addition, the lighting device of the present invention may be one in which a plurality of light emitting devices are installed in a predetermined arrangement, and one light emitting device is installed in a predetermined arrangement.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is sectional drawing which shows the other example of embodiment of the light-emitting device of this invention. It is sectional drawing of the conventional light-emitting device.

Explanation of symbols

1: Base 1a: Mounting portion 2: Reflecting member 2a: Lower reflecting member 2b: Upper reflecting member 3: Translucent member 5: Light emitting element

Claims (3)

  1. A base having a light emitting element mounting portion at the center of the upper main surface, and an inner peripheral surface joined to the upper main surface of the base so as to surround the mounting portion reflects light emitted from the light emitting element. A frame-like reflecting member that is a reflecting surface; and a conductor layer that is formed on the upper main surface of the base body and to which the light emitting element is electrically connected. A reflection member and an upper reflection member are joined, and an inclination angle of an inner peripheral surface of the lower reflection member with respect to the upper main surface is larger than an inclination angle of an inner peripheral surface of the upper reflection member with respect to the upper main surface. A package for storing light-emitting elements.
  2. The light emitting element storage package according to claim 1, the light emitting element mounted on the mounting portion and electrically connected to the conductor layer, and a translucent member covering the light emitting element. A light emitting device characterized by that.
  3. 3. A lighting device comprising the light emitting device according to claim 2 installed in a predetermined arrangement.
JP2004123225A 2004-04-19 2004-04-19 Package for housing light emitting element, light emitting device, and lighting apparatus Pending JP2005310911A (en)

Priority Applications (1)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201334A (en) * 2006-01-30 2007-08-09 Kyocera Corp Light emitting device, and lighting apparatus
JP2007220942A (en) * 2006-02-17 2007-08-30 Matsushita Electric Ind Co Ltd Light emitting device
KR100836210B1 (en) * 2006-03-22 2008-06-09 (주) 아모센스 Semiconductor package and method of manufacturing thereof
KR100863756B1 (en) 2007-01-23 2008-10-16 (주) 아모센스 Method for manufacturing semiconductor package
JP2010050367A (en) * 2008-08-25 2010-03-04 Panasonic Corp Light-emitting device
KR100956143B1 (en) 2008-09-11 2010-05-06 (주) 아모엘이디 Reflector capable of removing yellow ring and semiconductor package using the reflector
JP2010283281A (en) * 2009-06-08 2010-12-16 Nichia Corp Light emitting device
KR101309760B1 (en) * 2007-03-30 2013-09-23 서울반도체 주식회사 Light emitting diode package employing reflecting cup with convex reflecting surface
JP2014072213A (en) * 2012-09-27 2014-04-21 Toyoda Gosei Co Ltd Light-emitting device and process of manufacturing the same

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JPS4814973U (en) * 1971-06-30 1973-02-20
JPS62162860U (en) * 1986-04-05 1987-10-16
JPH05275750A (en) * 1992-03-25 1993-10-22 Sanyo Electric Co Ltd Optical semiconductor device
JP2001177157A (en) * 1999-12-15 2001-06-29 Matsushita Electronics Industry Corp Semiconductor light emitting device
JP2001237463A (en) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd Led module
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Corp Semiconductor light emitting device
JP2004056075A (en) * 2002-05-31 2004-02-19 Stanley Electric Co Ltd Light-emitting device and method of manufacturing the same
JP2004111937A (en) * 2002-08-30 2004-04-08 Nichia Chem Ind Ltd Light-emitting device

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JPS4814973U (en) * 1971-06-30 1973-02-20
JPS62162860U (en) * 1986-04-05 1987-10-16
JPH05275750A (en) * 1992-03-25 1993-10-22 Sanyo Electric Co Ltd Optical semiconductor device
JP2001177157A (en) * 1999-12-15 2001-06-29 Matsushita Electronics Industry Corp Semiconductor light emitting device
JP2001237463A (en) * 2000-02-24 2001-08-31 Matsushita Electric Works Ltd Led module
JP2002033520A (en) * 2000-07-14 2002-01-31 Toshiba Corp Semiconductor light emitting device
JP2004056075A (en) * 2002-05-31 2004-02-19 Stanley Electric Co Ltd Light-emitting device and method of manufacturing the same
JP2004111937A (en) * 2002-08-30 2004-04-08 Nichia Chem Ind Ltd Light-emitting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201334A (en) * 2006-01-30 2007-08-09 Kyocera Corp Light emitting device, and lighting apparatus
JP2007220942A (en) * 2006-02-17 2007-08-30 Matsushita Electric Ind Co Ltd Light emitting device
KR100836210B1 (en) * 2006-03-22 2008-06-09 (주) 아모센스 Semiconductor package and method of manufacturing thereof
KR100863756B1 (en) 2007-01-23 2008-10-16 (주) 아모센스 Method for manufacturing semiconductor package
KR101309760B1 (en) * 2007-03-30 2013-09-23 서울반도체 주식회사 Light emitting diode package employing reflecting cup with convex reflecting surface
JP2010050367A (en) * 2008-08-25 2010-03-04 Panasonic Corp Light-emitting device
KR100956143B1 (en) 2008-09-11 2010-05-06 (주) 아모엘이디 Reflector capable of removing yellow ring and semiconductor package using the reflector
JP2010283281A (en) * 2009-06-08 2010-12-16 Nichia Corp Light emitting device
JP2014072213A (en) * 2012-09-27 2014-04-21 Toyoda Gosei Co Ltd Light-emitting device and process of manufacturing the same

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