JP2007208292A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve light-emitting performance by improving heat dissipation capability. <P>SOLUTION: A light-emitting device comprises a light-emitting element, a base member composed of a metal, a protruding pedestal composed of a ceramic and formed on the base member, and a package constituted by a frame-shaped member that comprises an insulator part and a light-reflecting surface and surrounds the light-emitting element. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting device including a light emitting element.

  FIG. 4 shows a light emitting element housing package (hereinafter also simply referred to as a package) for housing a light emitting element 11 such as a conventional light emitting diode (LED). In FIG. 4, the package has a mounting portion 12a for mounting the light emitting element 11 in the central portion of the upper surface, and leads terminals that electrically connect the mounting portion 12a and its periphery to the inside and outside of the package. A base 12 made of an insulator on which a wiring conductor (not shown) made of metallized wiring or the like is formed, and is bonded and fixed to the upper surface of the base 12 and is inclined so that the inner peripheral surface extends outward as it goes upward. In addition, the inner peripheral surface is mainly composed of a frame-like reflecting member 13 which is a reflecting surface 13a that reflects light emitted from the light emitting element 11.

  The substrate 12 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, the wiring conductor is formed on the upper surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn) or the like at a high temperature. When the base 12 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 12.

  The reflecting member 13 is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina ceramics or resin such as epoxy resin, and is used for cutting, die molding or extrusion molding. Formed by molding technique.

  Further, the reflection member 13 has an inner peripheral surface that is a reflection surface 13a that reflects light emitted from the light emitting element 11, and the reflection surface 13a is coated with a metal such as Al by vapor deposition or plating. It is formed by. Then, the reflecting member 13 is bonded to the upper surface of the base 12 so that the mounting portion 12a is surrounded by the inner peripheral surface of the reflecting member 13 by a soldering material such as solder, silver (Ag) brazing, or a resin adhesive. Is done.

Then, the wiring conductor arranged around the mounting portion 12a and the electrode of the light emitting element 11 are electrically connected via the bonding wire 14, and then transparent such as epoxy resin or silicone resin is formed inside the reflecting member 13. A light emitting device can be formed by filling the light emitting element 11 with a resin (not shown) so as to cover it and thermosetting it. Alternatively, after applying a phosphor or a transparent resin mixed with a phosphor around or on the surface of the light-emitting element 11, the inside of the reflective member 13 is filled with a transparent resin and thermally cured, so that the light from the light-emitting element 11 is fluorescent. A light-emitting device capable of taking out light having a desired wavelength spectrum after wavelength conversion by a body can be obtained.
Japanese Patent Laid-Open No. 2003-37298

  However, in the conventional package described above, the light emitted from the light emitting element 11 or the light irregularly reflected inside the package is exposed to a part other than the reflecting surface 13a, that is, a part not covered with the reflecting member 13 on the upper surface of the substrate 12. Easy to absorb and transmit. As a result, there has been a problem that the intensity and luminance of the light transmitted from the light emitting element 11 through the transparent resin and emitted to the outside of the light emitting device are significantly deteriorated.

  Therefore, when the lower end of the inner peripheral surface of the reflecting member 13 is extended to the periphery of the light emitting element 11 so that most of the upper surface of the base 12 is covered with the reflecting member 13, the bonding area between the reflecting member 13 and the base 12 is large. Therefore, when heat is applied, for example, when the reflecting member 13 is bonded to the base 12, the difference in thermal expansion between the reflecting member 13 and the base 12 becomes large and the reflecting member 13 is easily distorted. The desired surface accuracy of the reflective surface 13a provided on the light-emitting element (for example, a state where the reflective surfaces 13a provided on both sides of the light-emitting element 11 are symmetric with respect to the light-emitting element 11 in the package cross section) is broken. There was a problem that irregular reflection occurred. As a result, there is a problem in that the reflected light intensity is uneven or the reflected light intensity is lowered, so that sufficient radiated light intensity and luminance cannot be obtained.

  Further, when the inner peripheral surface of the reflecting member 13 is extended to the periphery of the light emitting element 11, the bonding material for attaching the reflecting member 13 and the base body 12 protrudes inside the reflecting member 13, and this protruding bonding material However, there is a problem that the light emitting function of the light emitting element 11 and the reflecting function of the reflecting surface 13a are deteriorated by scooping up the side surface and the reflecting surface 13a of the light emitting element 11.

  Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to effectively prevent light from the light emitting element from being absorbed and transmitted to the upper surface of the substrate and to be caused by the heat of the reflecting member. Disclosed is a light-emitting element storage package and a light-emitting device that prevent distortion and maintain a desired surface accuracy of a reflecting surface provided around a light-emitting element, and have high radiation light intensity and high luminance.

  The light emitting device of the present invention includes a light emitting element, a base portion made of metal, a projecting portion made of ceramic and provided on the base portion, a light reflecting surface and an insulator portion, and surrounds the light emitting element. A package including a frame-shaped portion.

  The light emitting device of the present invention includes a light emitting element, a base portion made of metal, a projecting portion made of ceramic, provided on the base portion, a light reflecting surface and an insulator portion, and a frame shape surrounding the light emitting element. And the light emitting characteristics can be improved by improving the heat dissipation.

  The light emitting element storage package of the present invention will be described in detail below. 1 to 3 are cross-sectional views showing various examples of embodiments of the package of the present invention. In these drawings, 2 is a base, and 3 is a reflecting member, and these mainly constitute a package for housing the light emitting element 1.

  The substrate 2 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, metals such as Fe-Ni-Co alloys and Cu-W, or resins such as epoxy resins. Consists of. Further, as shown in FIGS. 1 to 3, the base 2 has a placement portion 2 a on which the light emitting element 1 is placed protruding from the upper surface of the base 2.

  The mounting portion 2a is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, metal such as Fe-Ni-Co alloy or Cu-W, or resin such as epoxy resin. The member made of the above ceramic, metal or resin is attached to the upper surface of the base 2 with a bonding material such as a brazing material or an adhesive, or the through hole provided in the central portion of the base 2 It can be provided by fitting and attaching so that the upper side protrudes from the upper surface of the base 2.

  Preferably, the mounting portion 2a and the base 2 are made of the same material. As a result, the difference in thermal expansion between the mounting portion 2a and the base body 2 can be reduced, and it is possible to effectively suppress the displacement of the mounting portion 2a resulting in the displacement of the light emitting element 1 and the decrease in the light emission intensity. .

  Further, the placing portion 2 a may be integrated with the base body 2. When the mounting portion 2a is integrated with the base body 2, for example, by stacking and simultaneously firing ceramic green sheets to be the mounting portion 2a and the base body 2, by a metal processing method such as cutting, or It can be produced by molding a resin by injection molding or the like.

  On the mounting portion 2a, an electrical connection pattern (not shown) for electrically connecting the light emitting element 1 is formed. The electrical connection pattern is led to the outer surface of the package through a wiring layer (not shown) formed inside the base body 2 and connected to the external electrical circuit board, whereby the light emitting element 1 and the external electrical circuit are connected. Are electrically connected.

  As a method of connecting the light emitting element 1 to the electrical connection pattern, a method of connecting via wire bonding, a method using a flip chip bonding method of connecting the lower surface of the light emitting element 1 with a solder bump, or the like is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the electrical connection pattern can be provided immediately below the light emitting element 1, it is not necessary to provide a space for providing the electrical connection pattern on the upper surface of the base 2 around the light emitting element 1. Therefore, it is possible to effectively suppress the light emitted from the light emitting element 1 from being absorbed by the space for the electrical connection pattern of the base 2 and the intensity of the radiated light from being lowered.

  This electrical connection pattern can be formed, for example, by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag, by embedding a lead terminal such as an Fe-Ni-Co alloy, or when the wiring conductor is The input / output terminal made of the formed insulator is provided by being fitted and joined to a through hole provided in the base 2.

  The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 1 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

  Further, the reflecting member 3 is attached to the upper surface of the base 2 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflecting member 3 may be attached to any part other than the mounting portion 2a on the upper surface of the base 2, but a desired surface accuracy around the light emitting element 1 (for example, the light emitting element 1 is interposed in the package cross section). The reflective surface 3a is preferably attached so that the reflective surface 3a is provided in a state in which the reflective surfaces 3a provided on both sides of the light-emitting element 1 are symmetrical. Thereby, the light from the light emitting element 1 can be uniformly reflected by the reflective surface 3a, and the emitted light intensity and the brightness can be effectively improved.

  Since the mounting portion 2a of the present invention protrudes from the upper surface of the base 2, the reflecting member 3 can be attached with high positional accuracy using the mounting portion 2a as a reference. Moreover, since the reflecting member 3 is attached to the upper surface of the base 2 so that the lower end of the inner peripheral surface of the reflecting member 3 contacts the side surface of the mounting portion 2a, the reflecting member 3 is attached to the base 2 The thermal expansion of the reflecting member 3 caused by the heat applied at the time is prevented, and the thermal distortion of the reflecting member 3 (the positional deviation due to the thermal distortion of the reflecting surface 3a and the thermal distortion of the reflecting member 3 itself) is effectively suppressed. It has a function. Therefore, the mounting portion 2 a functions as a thermal expansion suppressing material for the reflecting member 3.

  Due to the thermal expansion suppressing function of the reflecting member 3, materials having greatly different thermal expansion and hardness can be used as the base 2 and the reflecting member 3. For example, even if hard alumina ceramic is used as the base 2 and soft Al is used as the reflecting member 3, the mounting portion 2 a functions effectively as a thermal expansion suppressing material and effectively suppresses distortion of the reflecting member 3. be able to. As a result, the strength of the package can be increased by the base 2 made of hard alumina ceramics, and the reflective surface 3a can be made to have good reflection characteristics by the reflective member 3 made of Al that is soft and easy to process. In addition, the heat generated from the light emitting element 1 can be dissipated well.

  As shown in FIG. 2 in particular, the mounting portion 2a is placed so that the lower side of the inclined surface on the inner peripheral surface of the reflecting member 3 is above the side surface of the mounting portion 2a, that is, the inner peripheral surface of the reflecting member 3 is mounted. The larger the area in contact with the portion 2a, the more the reflective member 3 can cover the side surface of the mounting portion 2a in a wider range, so that the light emitted from the light emitting element 1 is more absorbed by the mounting portion 2a. It can suppress effectively and can improve radiated light intensity and a brightness | luminance more. Further, since heat generated by the light emitting element 1 during operation can be efficiently transmitted from the mounting portion 2 a to the reflecting member 3, deterioration of the operability of the light emitting element 1 can be more effectively prevented.

  When the mounting portion 2 a does not protrude from the upper surface of the base 2, that is, when the light emitting element 1 is mounted on the base 2 and the inner peripheral surface of the reflecting member 3 extends to the very vicinity of the light emitting element 1, the base 2 And the reflecting member 3 are attached to the surface of the light emitting element 1 and the reflecting surface 3a, which are very thin, so that the light emitting function of the light emitting element 1 and the reflecting function of the reflecting surface 3a are improved. The problem of deteriorating occurred. In addition, due to the thermal expansion of the reflecting member 3 when the reflecting member 3 and the substrate 2 are joined, the reflecting member 3 compresses the light emitting element 1 and damages the light emitting element 1.

  On the other hand, in the case of the package of the present invention, the bonding material for bonding the base body 2 and the reflecting member 3 slightly enters the slight gap where the reflecting member 3 and the side surface of the mounting portion 2a are in contact. However, this gap was not completely filled, and it did not crawl up to the surface of the light emitting element 1 or the reflecting surface 3a without staying in the gap. Thus, the slight gap where the reflecting member 3 and the side surface of the mounting portion 2a are in contact with each other allows the bonding material for bonding the base 2 and the reflecting member 3 to reach the surface of the light emitting element 1 or the surface of the reflecting surface 3a. It has been found that it functions as a so-called bonding material dam for prevention.

  The height of the mounting portion 2a is appropriately selected in consideration of the volume of the bonding material, the distance between the upper surface of the substrate 2 and the lower surface of the reflecting member 3, the intensity of the radiated light, the luminance, the heat transfer efficiency, and the bonding material dam function. The

  On the other hand, the length of the mounting portion 2a parallel to the upper surface of the base 2 is the position due to thermal strain (bonding of the surface of the reflective surface 3a and the thermal strain of the reflective member 3 itself) when the base 2 and the reflective member 3 are joined. The size of the base 2 and the reflecting member 3 is appropriately selected as long as the size can effectively suppress the deviation).

  Further, the reflecting member 3 is inclined so that the inner peripheral surface spreads outward as it goes upward, and the inner peripheral surface is a frame-like shape that reflects the light emitted by the light emitting element 1. The lower end of the inner peripheral surface is in contact with the side surface of the mounting portion 2a.

  With this configuration, the reflecting member 3 has the reflecting surface 3a formed in a wide range on the upper surface of the base 2 (outer peripheral portion of the mounting portion 2a), so that the light of the light emitting element 1 is absorbed and transmitted to the upper surface of the base 2 Can be effectively suppressed. That is, since the area where light is reflected by the reflecting surface 3a is greatly increased as compared with the conventional configuration (FIG. 4), the intensity of emitted light and the luminance can be significantly improved.

  In addition, the reflection member 3 has the reflective surface 3a which can reflect the light of the light emitting element 1 with a high reflectance at least on the surface of the inclined surface on the inner peripheral surface. Such a reflective surface 3a is made of a highly reflective metal such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), or Cu.

  When the reflecting member 3 is made of metal, the reflecting surface 3a is formed by performing cutting or molding on the reflecting member 3. Alternatively, when the reflecting member 3 is made of an insulator such as ceramics or resin (including the case where the reflecting member 3 is a metal), the reflecting surface 3a may be formed by forming a metal thin film by plating or vapor deposition. When the reflecting surface 3a is made of a metal that is easily discolored by oxidation such as Ag or Cu, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 3a improves.

  In addition, the arithmetic average roughness Ra of the surface of the reflecting surface 3a is preferably 0.004 to 4 μm, whereby the reflecting surface 3a can reflect the light of the light emitting element 1 well. When Ra exceeds 4 μm, the light of the light emitting element 1 cannot be reflected uniformly, and is irregularly reflected inside the package. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The reflection surface 3a may have a flat (straight) shape as shown in FIGS. 1 and 2 or a circular arc (curved) shape as shown in FIG. Preferably, it is in the shape of an arc, whereby the light from the light emitting element 1 can be uniformly reflected and radiated uniformly to the outside.

  Thus, in the light emitting device of the present invention, after the light emitting element 1 is mounted and fixed on the upper surface of the mounting portion 2a by the flip chip method or the like, the reflecting member 3 is brought into contact with the side surface of the mounting portion 2a at the lower end of the inner peripheral surface. In this way, the light-emitting device is obtained by bonding to the upper surface of the base 2 and then providing a translucent member (not shown) made of silicone resin or the like so as to cover the light-emitting element 1 inside the reflecting member 3.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 1 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. A small lighting device can be obtained. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 1 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 4 are arranged in a plurality of rows on the light emitting device driving circuit board 6 as shown in the plan view and the cross-sectional view shown in FIGS. 5 and 6, and are optically designed in an arbitrary shape around the light emitting device 4. In the case of an illuminating device in which the reflecting jig 5 is installed, in a plurality of light emitting devices 4 arranged on one adjacent row, an arrangement in which the interval between adjacent light emitting devices 4 is not shortest, a so-called staggered pattern It is preferable that That is, when the light emitting devices 4 are arranged in a grid, the glare is strengthened by arranging the light emitting devices 4 serving as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between the adjacent light emitting devices 4 is increased, thermal interference between the adjacent light emitting devices 4 is effectively suppressed, and heat in the light emitting device driving circuit board 6 on which the light emitting devices 4 are mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 4. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  Further, the lighting device is a concentric arrangement of a circular or polygonal light emitting device group 4 composed of a plurality of light emitting devices 4 on the light emitting device drive circuit board 6 as shown in the plan view and sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of light emitting devices 4 arranged in one circular or polygonal light emitting device 4 group is increased from the center side of the illuminating device toward the outer peripheral side. Thereby, more light-emitting devices 4 can be arrange | positioned maintaining the space | interval of light-emitting devices 4 moderately, and the illumination intensity of an illuminating device can be improved more. Moreover, the density of the light-emitting device 4 in the center of the lighting device can be lowered to suppress heat accumulation in the center of the light-emitting device driving circuit board 6. Therefore, the temperature distribution in the light emitting device drive circuit board 6 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 4 can be suppressed. As a result, the light emitting device 4 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  Examples of the package and the light emitting device of the present invention are shown below.

  First, an alumina ceramic substrate to be the base 2 was prepared. In addition, the base | substrate 2 also integrally formed the site | part used as the mounting part 2a, and made the upper surface of the mounting part 2a and the upper surface of the base | substrate 2 other than the mounting part 2a in parallel.

  The base body 2 was obtained by forming a rectangular parallelepiped mounting portion 2a having a width of 0.35 mm, a depth of 0.35 mm, and a thickness of 0.15 mm at the center of the upper surface of a rectangular parallelepiped having a width of 8 mm, a depth of 8 mm, and a thickness of 0.5 mm.

  In addition, an electrical connection pattern for electrically connecting the light emitting element 1 and the external electric circuit board to the portion where the light emitting element 1 of the mounting portion 2a is mounted via an internal wiring formed inside the base 2 Formed. The electrical connection pattern was formed into a 0.1 mmφ circular pad by a metallized layer made of Mo—Mn powder, and a 3 μm thick Ni plating layer and a 2 μm thick Au plating layer were deposited on the surface. Further, the internal wiring inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed with a metallized conductor made of Mo-Mn powder in the same manner as the electrical connection pattern.

  Further, a joining portion for joining the base 2 and the reflecting member 3 with Au—tin (Sn) brazing was formed on the entire surface of the portion other than the mounting portion 2 a on the top surface of the base 2. This joint was obtained by depositing a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 2 μm on the surface of a metallized layer made of Mo—Mn powder.

  Furthermore, the reflection member 3 was prepared. The reflecting member 3 has a diameter of 6 mm and a height of 1.5 mm at the uppermost end (uppermost end portion when packaged) of the inner peripheral surface, and is in contact with the lower end of the inner peripheral surface (side surface of the mounting portion 2a). The height of the portion) (the height from the lower surface joined to the upper surface of the base 2 to the lower side of the inclined surface of the inner peripheral surface) was 0.1 mm. Further, the inclined surface on the inner peripheral surface was a flat surface having an angle of 45 degrees with respect to the upper surface of the substrate 2, and the surface of the inclined surface was the reflecting surface 3a with Ra of 0.1 μm.

  Next, an Au—Sn bump is provided on the light emitting element 1, and the light emitting element 1 is bonded to the electrical connection pattern via the Au—Sn bump, and the reflecting member 3 is attached to the bonding portion on the upper surface of the base 2. -Joined with Sn solder. At this time, the base 2 and the reflecting member 3 were joined such that the lower end of the inner peripheral surface of the reflecting member 3 (the lower side of the reflecting surface 3a) was in contact with the side surface of the mounting portion 2a.

  When the cross section of the contact portion between the reflecting member 3 and the mounting portion 2a was observed for the package thus manufactured, Au—Sn was formed in a slight gap where the reflecting member 3 and the side surface of the mounting portion 2a were in contact with each other. Although it was confirmed that the solder had entered a little, the Au—Sn solder did not completely fill the gap, and the light-emitting element 1 did not crawl up without remaining in the gap. That is, it was found that a slight gap where the reflecting member 3 and the side surface of the mounting portion 2a are in contact functions as a so-called bonding material dam that prevents the Au—Sn brazing from reaching the light emitting element 1.

  On the other hand, when a similar evaluation was performed on a comparative package manufactured in the same manner as described above except that the mounting portion 2a was not formed, the Au—Sn solder creeped up to the light emitting portion of the light emitting element 1, and the light emission intensity. Was confirmed to be decreasing. Therefore, it was found that the package of the present invention is excellent.

  It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

  In addition, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 4 are installed in a predetermined arrangement, but may be one in which one light emitting device 4 is installed in a predetermined arrangement.

It is sectional drawing which shows an example of embodiment of the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. It is sectional drawing of the conventional package for light emitting element accommodation. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG.

Explanation of symbols

1: Light emitting element 2: Base 2a: Placement part 3: Reflecting member 3a: Reflecting surface 4: Light emitting device 5: Reflecting jig 6: Light emitting device driving circuit board

Claims (4)

A light emitting element;
A base part made of metal, a projecting part made of ceramic and provided on the base part, and a package having a light reflection surface and an insulator part and a frame-like part surrounding the light emitting element. Light emitting device.   The light emitting device according to claim 1, further comprising a lens provided on the light emitting element.   The light emitting device according to claim 1, wherein the protruding portion is made of an aluminum nitride sintered body.   The light emitting device according to claim 1, further comprising a translucent member made of a resin covering the light emitting element.

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