JP2005159262A - Package for housing light emitting element, light emitting device, and lighting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small package for housing a light emitting element and the light emitting device which can improve heat dissipating property by effectively diffusing heat of a plurality of light emitting elements and can maintain luminescence property good. <P>SOLUTION: A substrate 1 which has a mounting part 1a wherein a plurality of the light emitting elements 3 are mounted at a central part of an upper surface, and a frame 2 which is attached on an outer peripheral part of the upper surface of the substrate 1 so as to surround the mounting part 1a with a circle profile 2a are installed. In the mounting part 1a, at least three light emitting elements 3 are mounted respectively at equal intervals on a plurality of peripheries 1b which are concentric to the circle profile 2a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light-emitting element housing package that houses a light-emitting element, a light-emitting device that emits light to the outside by converting the wavelength of light emitted from the light-emitting element with a phosphor.

  A light emitting element that emits an arbitrary color by a phosphor that converts light such as near ultraviolet light and blue light emitted from a light emitting element 13 such as a conventional light emitting diode (LED) into red, green, blue, yellow, etc. light 4 and 5 are a top view and a cross-sectional view of a storage package (hereinafter also referred to as a package) and a light-emitting device. In FIG. 4, the package has a mounting portion 11a for placing and mounting a plurality of light emitting elements 13 on the upper surface, and electrically connects the inside and outside of the light emitting device from the mounting portion 11a and its periphery. A base 11 made of an insulator on which a wiring conductor (not shown) made of a lead terminal, metallized wiring, or the like is formed, and a through hole that is bonded and fixed to the upper surface of the base 11 and whose upper opening is larger than the lower opening are formed. And a frame 12 whose inner peripheral surface is a reflecting surface that reflects light emitted from the light emitting element 13.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on its upper surface by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), etc. at a high temperature. When the base 11 is made of a resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 11.

  In addition, the frame body 12 has a frame shape in which a through hole is formed in the central portion with an upper opening larger than the lower opening, and a reflection surface for reflecting light is provided on the inner peripheral surface thereof. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the inner peripheral surface of the frame 12 is a reflective surface that reflects light emitted from the light emitting element 13, and this reflective surface is formed by cutting, electrolytic polishing, chemical polishing, or the like on the inner peripheral surface of the frame 12. Then, it is formed by flattening or by depositing a metal such as Al on the inner peripheral surface by vapor deposition or plating. The frame 12 is bonded to the upper surface of the base 11 by a soldering material such as solder, silver (Ag) paste, or a bonding material such as a resin adhesive so as to surround the mounting portion 11a with the inner peripheral surface of the frame 12. Is done.

  The light emitting element 13 is made of a gallium nitride compound semiconductor or a silicon carbide compound semiconductor, mounted on the mounting portion 11a with an adhesive such as solder or Ag paste, and a wiring conductor disposed around the mounting portion 11a. And the light emitting element 13 are electrically connected by bonding wires (not shown) or flip chip mounting.

  In addition, the translucent member 14 has a small refractive index difference from the light emitting element 13, and transmits light of the light emitting element 13 to transparent resin or transparent glass having a high transmittance with respect to light in the ultraviolet light region to the visible light region. It contains a phosphor that converts the wavelength to the long wavelength side.

The phosphor that mounts the light emitting element 13 on the mounting portion 11a of such a package, electrically connects the electrode of the light emitting element 13 to the wiring conductor, and further converts the wavelength of the light of the light emitting element 13 to the long wavelength side. A light emitting device capable of extracting light having a desired wavelength spectrum by filling the inside of the frame body 12 with a translucent member 14 containing (not shown) so as to cover the light emitting element 13 with an injector such as a dispenser. It becomes.
JP 2002-94128 JP

  In the conventional light emitting device, when a plurality of light emitting elements 13 are mounted on the mounting portion 11a at equal intervals, for example, when the light emitting elements 13 are mounted on the mounting portion 11a in a lattice shape, the heat flux density of the light emitting elements 13 However, the heat of the light-emitting element 13 is not efficiently diffused from the central part of the base 11 to the side parts, and is easily trapped in the central part of the base 11. Therefore, the junction temperature of the light-emitting element 13 mounted in the central part of the base 11 (the limit temperature at which the light-emitting element can maintain good luminous efficiency, that is, the limit temperature at which the input current and the emission intensity can maintain a proportional relationship. As the junction temperature (junction temperature) rises, the temperature distribution of the substrate 11 becomes non-uniform, and heat cannot be efficiently dissipated to the external electric circuit and the heat radiation fin on which the light-emitting device is mounted. There is a problem that the internal quantum efficiency of the light emitting element 13 is lowered and the light output is remarkably deteriorated.

  Further, since the junction temperature varies depending on the mounting position of the light emitting element 13, the wavelength spectrum of each light emitting element 13 fluctuates, and light having a uniform wavelength cannot be emitted outside the package. As a result, the light emitting device There is a problem that the illumination characteristics become unstable due to uneven color distribution and illuminance distribution on the light emitting surface.

  Further, when the light emitting element 13 is mounted close to the mounting portion 11a, light propagation loss due to light interference or irregular reflection by each light emitting element 13, light absorption loss of the active layer, the P layer, and the N layer of the light emitting element 13 To increase. Furthermore, the thermal diffusivity to the inside of the base 11 is deteriorated because the thermal interference by the adjacent light emitting elements 13 and the heat flux density at the center of the base 11 are increased. As a result, the junction temperature of the light emitting element 13 is increased, the light emission efficiency is decreased, the light emission wavelength is fluctuated, and color unevenness occurs on the light emitting surface of the light emitting device.

  On the other hand, when the space between adjacent light emitting elements 13 is increased to improve heat dissipation, the light emitting device becomes larger, and the illuminance distribution is not uniform and the illuminance distribution is uneven. there were.

  The present invention has been devised in view of the above-described problems in the prior art, and the object thereof is to efficiently diffuse heat of a plurality of light emitting elements to improve heat dissipation and to improve light emission characteristics. It is an object of the present invention to provide a small light-emitting element storage package and a light-emitting device that can be maintained.

  The light emitting element storage package of the present invention is attached to a base having a mounting portion for mounting a plurality of light emitting elements in the center of the upper surface, and to surround the mounting portion in a circular shape on the outer periphery of the upper surface of the base. The mounting portion has at least three light emitting elements mounted at equal intervals on a plurality of circumferences concentric with the circular shape.

  In the light emitting element storage package of the present invention, preferably, in two adjacent circumferences, one light emitting element on the outer circumference and two light emitting elements on the inner circumference nearest to the circumference. Each distance between and is the same.

In the light emitting element storage package of the present invention, preferably, the circumference is 3R _n / 2 when the radius of the n-th one counted from the innermost side is R _n (n is an integer of 1 or more). <R _{n + 1} <5R _n / 2.

  A light-emitting device of the present invention includes the light-emitting element storage package having the above-described configuration, a light-emitting element mounted on the mounting portion, and a translucent member that covers the light-emitting element.

  The illuminating device of the present invention is characterized in that the light emitting device of the present invention is installed in a predetermined arrangement.

  The light emitting element storage package of the present invention includes a base having a mounting portion for mounting a plurality of light emitting elements at the center of the upper surface, and a frame attached to the outer periphery of the upper surface of the base so as to surround the mounting portion in a circular shape. And the mounting portion has at least three light emitting elements mounted at equal intervals on a plurality of circumferences concentric with the circular frame body. Therefore, the heat flow density due to the heat of the light emitting element can be reduced from the central part toward the outer peripheral part, and the heat of the light emitting element mounted on the inner circumference can be reduced by the heat flux density. It can be efficiently diffused radially to the outer periphery of a small substrate. Therefore, the temperature distribution inside the substrate can be made substantially uniform, and the heat of the light emitting element can be efficiently transmitted to the external electric circuit or the heat radiating fin, or can be efficiently dissipated outside the light emitting element housing package via the substrate.

  In addition, since the plurality of light emitting elements are mounted along the inner peripheral surface of the frame body, the heat of the light emitting elements can be easily and efficiently transmitted to the frame body through the base body, and the entire frame body can be efficiently transmitted. Heat can be dissipated, and the heat dissipation of the light emitting element storage package is further improved.

  As a result, the junction temperature of the light emitting element is lowered, the deterioration of the internal quantum efficiency and the light output is suppressed, and the fluctuation of the emission wavelength of the light emitting element is suppressed, so that the light output of the light emitting device is improved and the color characteristics are improved. Stabilize.

  In the light emitting element storage package of the present invention, in the configuration described above, between two adjacent circumferences, between one light emitting element on the outer circumference and two light emitting elements on the inner circumference closest thereto. Since each distance is the same, thermal interference between the light emitting elements mounted on the circumference between the inner side and the outer side can be suppressed, and the heat of the light emitting elements can be evenly diffused throughout the base. . Further, the temperature distribution inside the substrate due to the heat of the light emitting element can be made uniform.

  As a result, an increase in the junction temperature of the light emitting element can be more effectively suppressed, a difference in junction temperature caused by the mounting position of the light emitting element can be suppressed, and a difference in light output between the light emitting elements can be reduced. It is possible to effectively suppress the uneven color of the emitted light and the uneven illuminance distribution due to the wavelength variation of the light of the light emitting element, and to stably output the light for a long period of time.

  Furthermore, it is possible to suppress light propagation loss due to light interference or irregular reflection by each light emitting element and light absorption loss of the active layer, P layer, and N layer of the light emitting element, and to make a light emitting device with high emission efficiency and low loss. Can do.

In the light emitting element storage package of the present invention, in the above configuration, when the circumference on which the light emitting element is mounted is R _n (n is an integer of 1 or more), the radius of the _nth element counted from the innermost one In addition, since 3R _n / 2 <R _{n + 1} <5R _n / 2, between two adjacent circumferences, between the light emitting element on the outer circumference and the light emitting element on the inner circumference closest thereto By appropriately increasing the distance between the light emitting elements, it is possible to more effectively prevent the junction temperature of each light emitting element from increasing, prevent deterioration of the light emitting efficiency, and prevent fluctuations in the light emitting wavelength, and provide an appropriate distance between the light emitting elements. Thus, uneven color and uneven illumination on the light emitting surface of the light emitting device can be effectively suppressed. Further, since the interval between adjacent light emitting elements can be reduced, the light emitting device can be reduced in size.

  The light-emitting device of the present invention includes the light-emitting element storage package having the above structure, the light-emitting element mounted on the mounting portion, and the translucent member that covers the light-emitting element. It becomes a small light-emitting device that can be diffused well to improve heat dissipation and can maintain good light emission characteristics.

  Since the light emitting device of the present invention is installed in a predetermined arrangement, the lighting device of the present invention uses light emission by recombination of electrons of a light emitting element made of a semiconductor. Thus, a small illuminating device that can have lower power consumption and longer life than the existing illuminating device can be obtained. As a result, fluctuations in the center wavelength of light generated from the light emitting element can be suppressed, light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time, and an irradiation surface It is possible to provide a lighting device in which uneven color and uneven illuminance distribution are suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which radiates | emits the light of this light distribution.

  The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a top perspective view showing an example of an embodiment of the package of the present invention, and FIGS. 2 and 3 are cross-sectional views taken along line A-A ′ in FIG. 1. Reference numeral 1 denotes a base, and 2 denotes a frame, which mainly constitutes a package for housing the light-emitting element 3. A plurality of light-emitting elements 3 are mounted on the mounting portion 1 a of the base 1, By filling the inside of the frame 2 with the sexual member 4, a light emitting device is obtained.

  The light emitting element storage package of the present invention has a base body 1 having a mounting portion 1a for mounting a plurality of light emitting elements 3 in the center of the upper surface, and a circular shape 2a surrounding the mounting portion 1a on the outer peripheral portion of the upper surface of the base body 1. The mounting portion 1a has at least three light emitting elements 3 mounted on a plurality of circumferences 1b concentric with the circular shape 2a.

  The substrate 1 is an insulator made of an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin, and supports the light emitting element 3. It functions as a member and has a mounting portion 1a for mounting a plurality of light emitting elements 3 on its upper surface.

  Further, when the substrate 1 is made of ceramics, a metal powder such as W, Mo, Mn or the like for electrically conducting and connecting the inside and outside of the package from the mounting portion 1a and its periphery and from the inside to the outside of the frame 2 of the substrate 1 A wiring conductor (not shown) in which a metallized layer made of is formed is formed. Then, the wiring conductor exposed on the outer surface such as the lower surface of the base 1 is electrically connected to an external electric circuit board via a lead terminal (not shown) made of a metal such as Cu, Fe—Ni alloy, for example. Thus, the external electric circuit board and the light emitting element 3 can be electrically connected.

  When the substrate 1 is made of a resin, lead terminals made of Cu, Fe—Ni alloy or the like are installed and fixed inside the molded substrate 1 to electrically connect the inside and outside of the package.

  In addition, it is preferable to deposit a metal having excellent corrosion resistance such as Ni or gold (Au) with a thickness of about 1 to 20 μm on the exposed surface of the wiring conductor, which effectively prevents the wiring conductor from being oxidatively corroded. In addition to being able to prevent, it is possible to strengthen the connection with the light emitting element 3 with a bonding material such as solder, the connection with the bonding wire, and the connection with the lead terminal.

  In addition, the base 1 is electrically connected to the wiring conductor or the lead terminal on the upper surface for the purpose of suppressing light transmission from the light emitting element 3 to the lower surface of the base 1 and efficiently reflecting light to the upper side of the base 1. In order to prevent short circuit, a metal layer of Al, Ag, Au, platinum (Pt), Cu, etc. is formed by vapor deposition or plating to produce a reflective layer that improves the reflectance of light above the substrate 1 It is preferable to do.

  The frame 2 is attached to the outer peripheral portion of the upper surface of the base body 1 with a bonding material such as solder or a resin adhesive so as to surround the mounting portion 1a in a circular shape 2a. The frame body 2 is a frame body whose inner peripheral surface is a reflective surface that efficiently reflects the light of the light emitting element 3. With this configuration, a reflection surface is formed in the peripheral portion of the mounting portion 1a, so that the light of the light emitting element 3 emitted in the horizontal direction with respect to the mounting portion 1a is efficiently reflected on the upper side of the package. At the same time, since the absorption and transmission of light by the substrate 1 are effectively suppressed, the intensity of emitted light and the luminance can be significantly improved.

  As a method of forming such a reflective surface, the frame 2 is made of a metal having high reflectivity such as Al, Ag, Au, Pt, titanium (Ti), chromium (Cr), Cu, etc., and this is cut. It is formed by or mold forming. Alternatively, when the frame 2 is made of an insulator such as ceramics or resin, the reflective surface may be formed by forming a metal thin film by metal plating or vapor deposition of Al, Ag, Au or the like. If the reflective surface is made of a metal that is easily discolored by oxidation such as Ag or Cu, low melting point glass, sol-gel glass, or silicone resin having excellent transmittance from the ultraviolet light region to the visible light region is used on the surface. Or an epoxy resin. As a result, the corrosion resistance, chemical resistance, and weather resistance of the inner peripheral surface of the frame 2 are improved.

  Moreover, it is preferable that the frame body 2 is inclined so that the inner peripheral surface spreads outward as it goes upward. Thereby, the light emitted from the light emitting element 3 can be efficiently reflected on the upper surface.

  The arithmetic mean roughness Ra of the surface on the inner peripheral surface of the frame body 2 is preferably 0.1 μm or less, whereby the light of the light emitting element 3 can be favorably reflected on the upper side of the package. When Ra exceeds 0.1 μm, it becomes difficult to specularly reflect light on the inner peripheral surface of the frame 2 of the light emitting element 3 and it is easy to diffusely reflect inside the package. As a result, the propagation loss of light inside the package tends to increase, making it difficult to emit light outside the package at a desired radiation angle.

  The inner peripheral surface of the frame 2 may be flat (straight) as shown in FIG. 2, or may be arcuate (curved) as shown in FIG. Good. In the case of the circular arc shape, the light of the light emitting element 3 can be uniformly reflected, and light with high directivity can be uniformly emitted to the outside.

  In the mounting portion 1a of the present invention, at least three light emitting elements 3 are respectively mounted at equal intervals on a plurality of circumferences 1b concentric with the circular shape 2a. As a result, the integration density of the light emitting elements 3 decreases toward the outer side of the base 1, and the heat flow density due to the heat of the light emitting elements 3 can be decreased from the central portion toward the outer peripheral portion of the base 1, and the inner circumference 1b. The heat of the light emitting element 3 mounted thereon can be efficiently diffused radially to the outer periphery of the substrate 1 having a low heat flux density. Therefore, the temperature distribution inside the base 1 is made substantially uniform, and the heat of the light emitting element 3 is efficiently transmitted to the external electric circuit and the heat radiating fins, or is efficiently dissipated outside the light emitting element storing package via the base 1. Can do.

  Further, since the plurality of light emitting elements 3 are mounted along the inner peripheral surface of the frame body 2, the heat of the light emitting elements 3 is easily and efficiently transmitted to the frame body 2 through the base body 1. 2 The heat can be efficiently radiated around the entire circumference, and the heat dissipation of the light emitting element storage package is further improved.

  As a result, the junction temperature of the light emitting element 3 is decreased, the internal quantum efficiency and the deterioration of the light output are suppressed, and the fluctuation of the light emission wavelength of the light emitting element 3 is suppressed. The characteristics are stable.

  Preferably, in two adjacent circumferences 1b, each distance between one light emitting element 3 on the outer circumference 1b and two light emitting elements 3 on the inner circumference 1b closest thereto is the same. It is good. That is, in two adjacent circumferences 1b, the light emitting element 3 on the other circumference 1b is preferably located on the perpendicular bisector of the line connecting the two light emitting elements 3 on the one circumference 1b. . Thereby, thermal interference between the respective light emitting elements 3 mounted on the circumference 1b between the inner side and the outer side can be suppressed, and the heat of the light emitting elements 3 can be diffused uniformly throughout the substrate 1. In addition, the temperature distribution inside the substrate 1 due to the heat of the light emitting element 3 can be made uniform.

  As a result, an increase in the junction temperature of the light emitting element 3 can be more effectively suppressed, a difference in junction temperature caused by the mounting position of the light emitting element 3 can be suppressed, and an optical output difference between the light emitting elements 3 can be reduced. It is possible to reduce the color unevenness of the emitted light and the illuminance distribution due to the light wavelength variation of the light emitting element 3, and to stably output the light over a long period of time.

  Further, light propagation loss due to light interference or irregular reflection by each light emitting element 3 and light absorption loss of the active layer, P layer, and N layer of the light emitting element 3 can be suppressed, and a low loss light emitting device with high emission efficiency and can do.

Preferably, the circumference 1b on which the light-emitting element 3 is mounted is 3R _n / 2 <R _{n + 1} when the radius of the n-th one counted from the innermost side is R _n (n is an integer of 1 or more). It is good that it is <5R _n / 2.

  Thereby, in two adjacent circumferences 1b, by appropriately increasing the distance between the light emitting element 3 on the outer circumference 1b and the light emitting element 3 on the inner circumference 1b closest thereto, It is possible to more effectively prevent the junction temperature of the light emitting element 3 from increasing, prevent the deterioration of the light emission efficiency, and prevent the fluctuation of the light emission wavelength, and the distance between the light emitting elements 3 becomes appropriate so that the light emitting surface of the light emitting device can be prevented. Color unevenness and illuminance unevenness can be effectively suppressed. Furthermore, since the space | interval of the adjacent light emitting element 3 can be made small, size reduction of a light-emitting device is attained.

  The light-emitting element 3 includes a buffer layer, an n-type layer, a light-emitting layer, and a p-type layer made of gallium (Ga) -nitrogen (N), Al-Ga-N, indium (In) -GaN, or the like on a sapphire substrate. A gallium nitride compound semiconductor or a silicon carbide compound semiconductor that is sequentially stacked is used. Then, a bonding material such as a non-conductive paste, solder, resin adhesive, etc., in which Ag epoxy resin in which metal powder such as Ag, Al or the like is mixed in the resin is mounted on the light emitting element 3 or resin in which powder such as ceramics is mixed in the resin. (Not shown). And the electrode of the light emitting element 3 is electrically connected to the mounting part 1a and the wiring conductor formed in the periphery by flip chip mounting or wire bonding (not shown).

  Further, in the light emitting element storage package of the present invention, a translucent member 4 containing at least one phosphor that emits light by being excited by light of the light emitting element 3 is disposed around or around the light emitting element 3. ing. Arbitrary colors are emitted from the light emitting device. The phosphor (not shown) is filled with the light-transmitting member 4 with inorganic or organic phosphors that are excited by light from the light-emitting element 3 and emit light in blue, red, green, etc. by recombination of electrons. . Thereby, the light which has a desired emission spectrum and color can be output by mix | blending a fluorescent substance in arbitrary ratios.

  The translucent member 4 has a small refractive index difference from the light emitting element 3 and has a high transmittance with respect to light in the ultraviolet light region to the visible light region, such as a transparent resin such as silicone resin, epoxy resin, urea resin, or low melting glass. In addition, a transparent glass such as sol-gel glass or the like contains a phosphor that converts the light of the light-emitting element 3 to the longer wavelength side. This effectively suppresses the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 3 and the translucent member 4, and allows light to be emitted outside the light emitting device with a desired radiation intensity and angular distribution with high efficiency. Can be manufactured.

  Then, the light emitting element 3 is mounted on the mounting portion 1a of such a package, the electrode of the light emitting element 3 is electrically connected to the wiring conductor, and the light transmissive member 4 is inserted into the light emitting element with an injection machine such as a dispenser. By filling the inside of the frame 2 so as to cover 3 and thermosetting it, a light emitting device capable of extracting light having a desired wavelength spectrum is obtained.

  Further, after applying a phosphor or a translucent member 4 mixed with a phosphor around or on the surface of the light-emitting element 3, it is filled with a transparent resin or transparent glass that does not contain the phosphor so as to cover the light-emitting element 3 and thermoset. Thus, the light emitting device 3 may be a light emitting device that can convert the wavelength of light of the light emitting element 3 using a phosphor and extract light having a desired wavelength spectrum.

  In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 3 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 3 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

  In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

  For example, a plurality of light emitting devices 5 are arranged in a plurality of rows on the light emitting device driving circuit board 7 as shown in the plan view and the cross-sectional view shown in FIGS. 6 and 7, and are optically designed in an arbitrary shape around the light emitting device 5. In the case of an illuminating device in which the reflecting jig 6 is installed, in a plurality of light emitting devices 5 arranged on one adjacent row, an arrangement in which the interval between the adjacent light emitting devices 5 is not shortest, a so-called zigzag shape It is preferable that That is, when the light-emitting devices 5 are arranged in a grid, the light-emitting devices 5 serving as light sources are arranged on a straight line, so that the glare becomes strong, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced. Furthermore, since the distance between the adjacent light emitting devices 5 is increased, thermal interference between the adjacent light emitting devices 5 is effectively suppressed, and heat in the light emitting device driving circuit board 7 on which the light emitting devices 5 are mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 5. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  In addition, the lighting device is a concentric arrangement of circular or polygonal light-emitting device groups of a plurality of light-emitting devices 5 on the light-emitting device drive circuit board 7 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of the light emitting devices 5 arranged in one circular or polygonal light emitting device 5 group is increased from the center side of the illuminating device toward the outer peripheral side. Thereby, more light-emitting devices 5 can be arrange | positioned maintaining the space | interval of light-emitting devices 5 moderately, and the illumination intensity of an illuminating device can be improved more. Moreover, the density of the light-emitting device 5 in the central portion of the lighting device can be lowered to suppress heat accumulation in the central portion of the light-emitting device driving circuit board 7. Therefore, the temperature distribution in the light emitting device drive circuit board 7 becomes uniform, heat is efficiently transmitted to the external electric circuit board on which the lighting device is installed and the heat sink, and the temperature rise of the light emitting device 5 can be suppressed. As a result, the light emitting device 5 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, an optical lens for arbitrarily condensing or diffusing the light emitted from the package on the upper surface of the frame body 2 or a flat light-transmitting lid body is joined by solder or a resin adhesive or the like. Light can be extracted at the radiation angle, and the water resistance into the package is improved to improve long-term reliability. Further, in order to suppress the optical loss due to the bonding wire, a light emitting device in which metallized wiring is formed on the mounting portion 1a and the light emitting element 3 is electrically connected to the metallized wiring via solder may be used.

  In addition, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 5 are installed in a predetermined arrangement, but may be one in which one light emitting device 5 is installed in a predetermined arrangement.

It is an upper surface perspective view which shows an example of embodiment about the light-emitting device of this invention. It is sectional drawing of the light-emitting device of FIG. It is sectional drawing which shows the other example of embodiment about the light-emitting device of this invention. It is an upper surface perspective view which shows the conventional light-emitting device. It is sectional drawing of the light-emitting device of FIG. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG.

Explanation of symbols

1: Base 1a: Mounting portion 1b: Circumference 2: Frame 2a: Circular shape 3: Light emitting element 4: Translucent member 5: Light emitting device 6: Reflecting jig 7: Light emitting device driving circuit board

Claims (5)

A base having a mounting portion for mounting a plurality of light emitting elements in the center of the upper surface, and a frame attached to the outer peripheral portion of the upper surface of the base so as to surround the mounting portion in a circular shape, The mounting part is a package for storing light emitting elements, wherein at least three of the light emitting elements are respectively mounted at equal intervals on a plurality of circumferences concentric with the circular shape. In two adjacent circles, the distance between the one light emitting element on the outer circumference and the two light emitting elements on the inner circumference closest thereto is the same. The light emitting element storage package according to claim 1. Wherein the circumferential is the innermost of the n-th radius ones counted from those when the _R n (n is an integer of 1 or _{more), 3R n / 2 <R} n + 1 <5R n / 2 The light emitting element storage package according to claim 1 or 2. A light-emitting element storage package according to any one of claims 1 to 3, a light-emitting element mounted on the mounting portion, and a translucent member that covers the light-emitting element. Light-emitting device. 5. A lighting device, wherein the light emitting device according to claim 4 is installed in a predetermined arrangement.

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