KR200449626Y1 - Arrangement of Light-Emitting Diodes of LED Lamp - Google Patents

Arrangement of Light-Emitting Diodes of LED Lamp Download PDF

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KR200449626Y1
KR200449626Y1 KR2020070004643U KR20070004643U KR200449626Y1 KR 200449626 Y1 KR200449626 Y1 KR 200449626Y1 KR 2020070004643 U KR2020070004643 U KR 2020070004643U KR 20070004643 U KR20070004643 U KR 20070004643U KR 200449626 Y1 KR200449626 Y1 KR 200449626Y1
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light emitting
emitting diodes
circuit board
led lamp
emitting diode
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KR20080000007U (en
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페이-초아 왕
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파이로스위프트 홀딩 컴퍼니 리미티드
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

LED 램프 발광다이오드의 개선된 배열구조는 회로기판과 복수의 발광다이오드를 포함한다. 상기 회로기판의 표면에는 전도성 회로가 형성되므로 발광다이오드가 상기 회로기판에 배열되어 상기 전도성 회로에 전기적으로 연결된다. 전도성 회로를 구비한 상기 회로기판의 표면에는 가상의 원이 형성된다. 또한, 발광다이오드는 상기 가상의 원을 따라 회로기판에 분포되어 원형으로 배열된다. An improved arrangement of LED lamp light emitting diodes includes a circuit board and a plurality of light emitting diodes. Since a conductive circuit is formed on the surface of the circuit board, a light emitting diode is arranged on the circuit board and electrically connected to the conductive circuit. A virtual circle is formed on the surface of the circuit board having the conductive circuit. Further, the light emitting diodes are distributed in a circuit board along the imaginary circle and arranged in a circle.

LED, 배열구조 LED structure

Description

엘이디 램프의 발광다이오드 배열구조{Arrangement of Light-Emitting Diodes of LED Lamp}Arrangement structure of LED lamps {Arrangement of Light-Emitting Diodes of LED Lamp}

도1은 본 고안의 제1 실시예에 대한 사시도이다.1 is a perspective view of a first embodiment of the present invention.

도2는 본 고안의 제1 실시예에 대한 평면도이다.2 is a plan view of a first embodiment of the present invention.

도3은 도2의 3-3선을 따라 자른 단면도이다.FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 2.

도4는 본 고안의 제2 실시예에 대한 사시도이다.4 is a perspective view of a second embodiment of the present invention.

도5는 본 고안의 제3 실시예에 대한 사시도이다.5 is a perspective view of a third embodiment of the present invention.

도6은 도5의 6-6선을 따라 자른 단면도이다. 6 is a cross-sectional view taken along line 6-6 of FIG.

본 고안은 LED 램프 발광다이오드의 개선된 배열구조에 관한 것으로, 더욱 상세하게는 발광다이오드가 원형으로 배열되어 있는 LED 램프 발광다이오드의 개선된 배열구조에 관한 것이다.The present invention relates to an improved arrangement of LED lamp light emitting diodes, and more particularly to an improved arrangement of LED lamp light emitting diodes in which the light emitting diodes are arranged in a circular shape.

발광다이오드(light-emitting diodes, LED)는 고강도, 절전 및 긴 수명의 특 징을 가지기 때문에 전기 장치 및 램프의 조명용으로 널리 사용된다. 나아가, 조명 범위와 세기를 증가시키기 위하여 일반적으로 복수의 발광다이오드를 결합하여 LED 램프 세트를 형성하고 이들 발광다이오드에 의해 발광면(illuminating surface)을 형성한다.Light-emitting diodes (LEDs) are widely used for the lighting of electrical devices and lamps because of their high strength, low power consumption and long life. Further, in order to increase the illumination range and the intensity, a plurality of light emitting diodes are generally combined to form a set of LED lamps and an illuminating surface is formed by these light emitting diodes.

통상적인 램프의 발광면은 원형으로 이루어진다. 그러나, LED 램프 세트에 장착되는 발광다이오드는 일반적으로 회로기판에 한 줄로 배열되는데 이는 통상적인 램프의 원형 발광면에 사용되는 2차 광학렌즈(second-ordered optical lens)를 설계하는데 적합하지 않다. 또한, 상기 회로상의 배치(layout)도 불편하다.The light emitting surface of a conventional lamp is circular. However, light emitting diodes mounted on a set of LED lamps are generally arranged in a row on a circuit board, which is not suitable for designing a second-ordered optical lens used for the circular light emitting surface of a conventional lamp. The layout on the circuit is also inconvenient.

상기와 같은 관점에서 고안자는 자신의 전문적인 경험과 정밀한 연구에 기초하여 본 고안이 상기 문제점을 극복할 수 있도록 의도하였다.In view of the above, the inventors intended to overcome the above problems based on their professional experience and precise research.

본 고안은 상술한 바와 같은 종래 기술의 단점을 해결하기 위한 것으로서, 통상적인 램프의 원형 발광면을 사용하면서 각 발광다이오드가 원형으로 배열된 LED 램프 발광다이오드의 개선된 배열구조를 제공하기 위한 것이다. The present invention is to solve the disadvantages of the prior art as described above, and to provide an improved arrangement of the LED lamp light emitting diode in which each light emitting diode is arranged in a circle while using a circular light emitting surface of a conventional lamp.

본 고안은 통상적인 램프의 원형 발광면을 사용하면서 각 발광다이오드가 원형으로 배열된 LED 램프 발광다이오드의 개선된 배열구조를 제공하기 위한 것이다. 이러한 방식은 LED 램프의 2차 광학렌즈를 설계하는데 유용할 뿐만 아니라 직렬연 결, 병렬연결 또는 이들의 조합에 의하여 전도성 회로(conductive circuit)를 제작하는데도 유용하다. 따라서, 상기 전도성 회로는 배치 및 설계면에서 어려움을 야기하는 발광다이오드 각각의 배열구조에 의한 영향을 받지 않게 된다.The present invention aims to provide an improved arrangement of LED lamp light emitting diodes in which each light emitting diode is arranged in a circle while using a circular light emitting surface of a conventional lamp. This method is not only useful for designing secondary optical lenses of LED lamps, but also for fabricating conductive circuits by series connection, parallel connection, or a combination thereof. Accordingly, the conductive circuit is not affected by the arrangement of each of the light emitting diodes, which causes difficulties in terms of layout and design.

본 고안은 회로기판과 복수의 발광다이오드를 포함하는 LED 램프의 발광다이오드에 대한 개선된 배열구조를 제공한다. 상기 회로기판의 표면은 전도성 회로층을 구비하여 상기 회로기판 위에 발광다이오드가 배열되어 상기 전도성 회로에 전기적으로 연결될 수 있다. 상기 전도성 회로를 구비한 회로기판의 표면에는 가상의 원이 형성된다. 나아가, 발광다이오드는 상기 가상의 원을 따라 회로기판에 분포되어 원형으로 배열된다. 각 발광다이오드가 원형으로 배열됨으로써 상기 목적이 달성된다.The present invention provides an improved arrangement for a light emitting diode of an LED lamp comprising a circuit board and a plurality of light emitting diodes. The surface of the circuit board may include a conductive circuit layer such that a light emitting diode is arranged on the circuit board so as to be electrically connected to the conductive circuit. A virtual circle is formed on the surface of the circuit board having the conductive circuit. Furthermore, the light emitting diodes are distributed in a circuit board along the imaginary circle and arranged in a circle. The above object is achieved by arranging each light emitting diode in a circle.

이하에서는 본 고안의 특징과 기술적 내용이 보다 더 용이하게 이해될 수 있도록 첨부된 도면을 참고하여 상세하게 설명한다. 그러나, 상기 첨부된 도면은 예시적인 설명을 위한 것이며 본 고안의 영역을 한정하기 위한 것이 아니다.Hereinafter will be described in detail with reference to the accompanying drawings so that the features and technical details of the present invention can be more easily understood. However, the accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the present invention.

도1 및 도2는 각각 본 고안의 제1 실시예에 대한 사시도 및 평면도이다. 본 고안은 회로기판(1)과 회로기판(1)에 설치된 복수의 발광다이오드(LED, 2)를 포함하는 LED 램프의 상기 발광다이오드에 대한 개선된 배열구조를 제공한다. 1 and 2 are a perspective view and a plan view, respectively, of a first embodiment of the present invention. The present invention provides an improved arrangement for the light emitting diode of an LED lamp comprising a circuit board (1) and a plurality of light emitting diodes (LEDs) 2 mounted on the circuit board (1).

회로기판(1)은 절연 플레이트이다. 구리 박편과 같은 금속성 전도성 물질로 형성된 전도성 회로층(10)이 회로기판의 표면에 도금되어 있어 그 위에 배열된 각각의 발광다이오드(2)가 전기적으로 직렬 또는 병렬로 연결된다. 회로기판(1)의 외 부 형상 및 사이즈는 사용되는 램프에 따라 설계될 수 있다. 나아가, 발광다이오드(2)의 수는 사용 조건에 따라 결정될 수 있다.The circuit board 1 is an insulating plate. A conductive circuit layer 10 formed of a metallic conductive material such as copper flake is plated on the surface of the circuit board so that each light emitting diode 2 arranged thereon is electrically connected in series or in parallel. The outer shape and size of the circuit board 1 can be designed depending on the lamp used. Furthermore, the number of light emitting diodes 2 can be determined according to the use conditions.

본 고안의 특징은 회로기판(1)상에서 발광다이오드(2)의 배열이 원형 또는 수 개의 동심원으로 형성되는 것에 있다. 또한, 상기 전도성 회로(10)를 통해 발광다이오드(2)가 전기적으로 연결된 후 플러스 접점(100) 및 마이너스 접점(101)이 발광다이오드(2)의 외측 주변에 배치된다. 이러한 배열은 통상적인 램프에 사용되는 원형 발광면의 2차 광학렌즈를 설계하는데 매우 적합하다. 또한, 직렬연결 또는 병렬연결 회로를 구성하는 것이 한층 더 용이해진다. A feature of the present invention is that the arrangement of the light emitting diodes 2 on the circuit board 1 is formed in a circular or several concentric circles. In addition, after the light emitting diodes 2 are electrically connected through the conductive circuit 10, the plus contact 100 and the minus contact 101 are disposed around the outside of the light emitting diode 2. This arrangement is well suited for designing secondary optical lenses of circular emitting surfaces used in conventional lamps. In addition, it is easier to construct a series connection circuit or a parallel connection circuit.

상기 원형 배열구조는 다음과 같다. 먼저, 전도성 회로(10)를 구비하는 회로기판(1)의 표면상에 적어도 하나의 가상의 원(11)을 형성한다(도2). 다음으로, 발광다이오드(2)를 가상의 원(11)에 분포시킨다. 한편, 배열이 수 개의 동심원으로 형성되는 경우 복수의 가상 원(11)을 동심원 형태로 배열하도록 형성한 후, 발광다이오드(2)를 각각의 가상 원(11)에 분포시킨다. 내측과 외측에 있는 가상의 원(11)에 있는 발광다이오드(2)는 지그재그(staggered)로 구성된다.The circular arrangement is as follows. First, at least one virtual circle 11 is formed on the surface of the circuit board 1 having the conductive circuit 10 (Fig. 2). Next, the light emitting diodes 2 are distributed in the imaginary circle 11. On the other hand, when the array is formed of several concentric circles, the plurality of virtual circles 11 are formed to be arranged in the form of concentric circles, and then the light emitting diodes 2 are distributed in the respective virtual circles 11. The light emitting diodes 2 in the imaginary circle 11 on the inside and the outside are staggered.

본 고안의 제1 실시예에 대한 도1 내지 도3에서 발광다이오드(2)는 전도성 회로(10)에 전기적으로 직렬로 연결된다. 이때, 각 발광다이오드(2)가 회로기판(1)에 배열되는 지점에는 각 발광다이오드(2)를 수용하기 위한 오목부(12)를 형성하여 각 발광다이오드(2)의 패키징(packaging) 절차를 수행한다. 1차 렌즈(20)가 각 오목부(12) 위에 형성된다. 각 발광다이오드(2)에 1차 렌즈(20)가 형성되면, 발광다이오드(2)에 이른바 2차 광학 렌즈 처리를 하여 LED 램프 세트를 완성한다.1 to 3 for the first embodiment of the present invention, the light emitting diodes 2 are electrically connected in series to the conductive circuit 10. At this time, a recess 12 for accommodating each of the light emitting diodes 2 is formed at a point where each of the light emitting diodes 2 is arranged on the circuit board 1, thereby packaging the light emitting diodes 2. Perform. The primary lens 20 is formed on each recess 12. When the primary lens 20 is formed in each light emitting diode 2, the so-called secondary optical lens processing is performed on the light emitting diode 2 to complete the LED lamp set.

또한, 도4에 도시된 본 고안의 제2 실시예에서는 서로 이웃하는 세 개씩의 발광다이오드(2)가 전도성 회로(10)에 전기적으로 직렬로 연결되고, 이렇게 직렬로 연결된 발광다이오드(2)들이 전기적으로 병렬로 연결된다. 원형으로 배열된 발광다이오드(2)가 내측 및 외측의 가상 원(11)에서 지그재그로 배열되기 때문에 각 발광다이오드(2)는 전도성 회로(10)를 설계 및 배치함에 있어서 충분한 공간을 가진다. 즉, 본 고안에서 각 발광다이오드(2)의 원형 배열구조는 전도성 회로(10)를 직렬, 병렬 또는 이들의 조합으로 제작하는데 유용하다. 또한, 전도성 회로(10)는 배치 및 설계 측면에서 어려움을 발생시키는 각 발광다이오드(2)의 배열구조에 의한 영향을 받지 않게 된다.In addition, in the second embodiment of the present invention shown in FIG. 4, three light emitting diodes 2 adjacent to each other are electrically connected to the conductive circuit 10 in series, and thus the light emitting diodes 2 connected in series are connected. Electrically connected in parallel. Since the light emitting diodes 2 arranged in a circle are arranged zigzag in the inner and outer imaginary circles 11, each light emitting diode 2 has sufficient space in designing and arranging the conductive circuit 10. That is, in the present invention, the circular array structure of each light emitting diode 2 is useful for manufacturing the conductive circuits 10 in series, in parallel, or a combination thereof. In addition, the conductive circuit 10 is not affected by the arrangement of each light emitting diode 2 which causes difficulties in terms of layout and design.

도5와 도6에서는 회로기판(1)에 각 발광다이오드(2)가 배열된 지점에 각 발광다이오드(2)를 수용하기 위한 도3의 오목부(12)가 형성되지 않는다. 이는 각 발광다이오드(2)가 회로기판(1)의 표면상에 직접 배열하고 전술한 것과 유사한 발광다이오드(2)의 패키징 절차가 수행됨을 의미한다. 5 and 6, the recessed portion 12 of FIG. 3 for accommodating each light emitting diode 2 is not formed at the point where the light emitting diodes 2 are arranged on the circuit board 1. This means that each light emitting diode 2 is arranged directly on the surface of the circuit board 1 and a packaging procedure of the light emitting diode 2 similar to that described above is performed.

상기에 따라 본 고안은 바람직한 효과를 얻을 수 있으며 종래 기술의 단점을 해결할 수 있다. 따라서, 본 고안은 신규성 및 진보성을 구비하며 발명특허의 요건을 만족한다.According to the above, the present invention can obtain a desirable effect and can solve the disadvantages of the prior art. Accordingly, the present invention has novelty and inventiveness and satisfies the requirements of the invention patent.

상기에서 본 고안의 바람직한 실시예에 관하여 설명하였으나 본 고안은 이에 한정되지 않는다. 본 고안의 사상의 범위 내에서 해당 기술분야의 숙련된 당업자에 의한 다양한 균등범위의 수정과 변경이 가능하다. 따라서, 어떠한 수정 및 변경사항도 첨부한 본 고안의 청구범위에 속함을 이해할 수 있을 것이다.Although the preferred embodiment of the present invention has been described above, the present invention is not limited thereto. Various equivalent modifications and changes are possible by those skilled in the art within the scope of the idea of the present invention. Accordingly, it will be understood that any modifications and variations fall within the scope of the appended claims.

이상에서 상세히 설명한 바와 같이 본 고안에 따른 LED 램프 발광다이오드의 개선된 배열구조는 LED 램프의 2차 광학렌즈를 설계하는데 유용할 뿐만 아니라 직렬연결, 병렬연결 또는 이들의 조합에 의하여 전도성 회로(conductive circuit)를 제작하는데도 유용하다. 따라서, 상기 전도성 회로는 배치 및 설계면에서 어려움을 야기하는 발광다이오드 각각의 배열구조에 의한 영향을 받지 않게 된다.As described in detail above, the improved arrangement of the LED lamp light emitting diode according to the present invention is not only useful for designing the secondary optical lens of the LED lamp but also a conductive circuit by series connection, parallel connection, or a combination thereof. It is also useful for making). Accordingly, the conductive circuit is not affected by the arrangement of each of the light emitting diodes, which causes difficulties in terms of layout and design.

Claims (6)

LED 램프의 발광다이오드 배열구조에 있어서,In the light emitting diode array structure of the LED lamp, 표면에 전도성 회로를 구비하는 회로기판;과A circuit board having a conductive circuit on its surface; and 상기 전도성 회로에 전기적으로 연결되도록 상기 회로기판에 마련되는 복수의 발광다이오드를 포함하고,A plurality of light emitting diodes provided on the circuit board to be electrically connected to the conductive circuit; 상기 전도성 회로를 구비한 회로기판의 표면에는 가상의 원이 형성되고, 상기 발광다이오드는 상기 가상의 원을 따라 회로기판에 분포되어 원형 배열을 형성하는 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조. And a virtual circle is formed on a surface of the circuit board having the conductive circuit, and the light emitting diodes are distributed on the circuit board along the virtual circle to form a circular array. 제1항에 있어서,The method of claim 1, 상기 전도성 회로의 플러스 및 마이너스 접점은 상기 발광다이오드의 외측 주변에 위치하는 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조.The light emitting diode arrangement of the LED lamp, characterized in that the positive and negative contacts of the conductive circuit is located around the outside of the light emitting diode. 제1항에 있어서,The method of claim 1, 상기 가상의 원은 복수이고, 각각의 가상의 원은 동심원으로 배열되며, 상기 발광다이오드는 각각의 가상의 원에 분포되는 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조.The virtual circle is a plurality of, each virtual circle is arranged in a concentric circle, the light emitting diode array structure of the LED lamp, characterized in that distributed in each virtual circle. 제3항에 있어서,The method of claim 3, 상기 동심원 중 내측 및 외측 가상의 원에 분포하는 각각의 발광다이오드는 지그재그(staggered)인 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조.The light emitting diode arrangement of the LED lamp, characterized in that each of the light emitting diodes distributed in the inner and outer virtual circles of the concentric circles is staggered (staggered). 제1항에 있어서,The method of claim 1, 상기 회로기판 상에 각각의 발광다이오드가 배열되는 위치에는 상기 각각의 발광다이오드를 수용하기 위한 오목부가 마련되는 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조.And a recess for accommodating each of the light emitting diodes is provided at a position where each of the light emitting diodes is arranged on the circuit board. 제1항에 있어서,The method of claim 1, 상기 각각의 발광다이오드는 그 위에 1차 광학렌즈가 형성되는 것을 특징으로 하는 LED 램프의 발광다이오드 배열구조.Wherein each of the light emitting diodes has a primary optical lens formed thereon.
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JP2002328094A (en) 2001-05-02 2002-11-15 Nidec Tosok Corp Led ring lighting and image inspecting device with it
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JP2005159262A (en) 2003-10-30 2005-06-16 Kyocera Corp Package for housing light emitting element, light emitting device, and lighting system
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