EP2077415B1 - LED bulb with heat removal device - Google Patents

LED bulb with heat removal device Download PDF

Info

Publication number
EP2077415B1
EP2077415B1 EP08000087A EP08000087A EP2077415B1 EP 2077415 B1 EP2077415 B1 EP 2077415B1 EP 08000087 A EP08000087 A EP 08000087A EP 08000087 A EP08000087 A EP 08000087A EP 2077415 B1 EP2077415 B1 EP 2077415B1
Authority
EP
European Patent Office
Prior art keywords
light source
heat removal
housing
led
removal device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP08000087A
Other languages
German (de)
French (fr)
Other versions
EP2077415A1 (en
Inventor
Albert Stekelenburg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to AT08000087T priority Critical patent/ATE537405T1/en
Priority to EP08000087A priority patent/EP2077415B1/en
Publication of EP2077415A1 publication Critical patent/EP2077415A1/en
Application granted granted Critical
Publication of EP2077415B1 publication Critical patent/EP2077415B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to light sources and more particularly to an LED (light-emitting diode) having a heat removal device for sufficiently dissipating excess heat generated by a high power (“Hi-Power”) LED.
  • LED light-emitting diode
  • Hi-Power high power
  • LED lamps have advantages including longer life, less power consumption (i.e., more energy-efficient), and no special ballasts being required.
  • LED based light sources have gradually replace conventional incandescent lamps and fluorescent lamps as an ideal light source.
  • One type of LED lamp has a Hi-Power LED as light source.
  • excess heat can be generated by the Hi-Power LED.
  • LED lamps are limited in applications (e.g., in indoor environment).
  • a need has arisen for an improved LED lamp having a heat removal device for dissipating excess heat generated by the Hi-Power LED so that the LED lamp can find applications in indoor environment.
  • the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being integrally formed with the cone by die casting.
  • the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being formed separately prior to assembling with the cone.
  • the cone comprises a plurality of longitudinal heat radiating grooves so as to provide a large heat radiating surface.
  • the heat radiating grooves have openings so as to provide a large heat radiating surface and space.
  • the LED bulb comprises a base 10, a housing 20, a heat removal device 30, a bulb 40, a printed circuit board (PCB) 50, and a solid state light source 60.
  • PCB printed circuit board
  • the base 10 is a well known device and is adapted to mount in an electrical socket.
  • the base 10 comprises a bottom contact 11 being used as, for example, positive terminal, a metallic element 12 formed of copper, the metallic element 12 being used as, for example, negative terminal, and an insulator 13 formed between the contact 11 and the metallic element 12 for preventing them from electrically contacting each other.
  • the hollow, cylindrical housing 20 is adapted to mount on the base 10.
  • the housing 20 consists of two mated halves.
  • the housing 20 is formed of an insulative material and comprises a lower portion 21 of reduced diameter adapted to secure to an upper portion of the base 10, an annular flange 22 formed between the lower portion 21 and an upper main portion of the housing 20, and a plurality of top tabs 23.
  • the insulative housing 20 is mounted between the heat removal device 30 and the metallic element 12 for preventing them from electrically contacting each other.
  • the PCB 50 is fastened in the housing 20.
  • the PCB 50 comprises electrical elements such as capacitors, resistors, diodes, etc.
  • the PCB 50 has two conductors (not numbered) electrically connected to the contact 11 and the metallic element 12 respectively.
  • the heat removal device 30 is formed of good conductive material (e.g., metal) and comprises an inverted, truncated cone 32 surrounding most portion of the housing 20 and having its bottom edge rested upon and secured to the flange 22, the cone 32 including a plurality of longitudinal, spaced heat radiating grooves 321 formed around the outer surface, the heat radiating grooves 321 substantially having one end adjacent the top edge of the cone 32 and the other end adjacent the bottom edge of the cone 32 such that the heat radiating grooves 321 can provide a large heat radiating surface, and a disc-shaped mounting member 31 secured to a top edge of the cone 32, the mounting member 31 including a plurality of holes 311 secured to the tabs 23 by snapping the tabs 23 through the holes 311 with the light source 60 on the mounting member 31 being surrounded by the holes 311. Further, the light source 60 is electrically connect to the PCB 50.
  • good conductive material e.g., metal
  • the bulb 40 is made of transparent material (e.g., glass) as to be clear or frosted to diffuse the light.
  • the bulb 40 is mounted on the top edge of the heat removal device 30 so as together with the heat removal device 30, the housing 20, and the base 10 to sealingly receive the PCB 50 and the light source 60.
  • the light source 60 is implemented as an LED (e.g., Hi-Power LED in this embodiment). Alternatively, the light source 60 is formed of another material in other embodiments.
  • Heat generated by the light source 60 can be effectively conducted away by the heat removal device 30 (i.e., through the mounting member 31 and the heat radiating grooves 321 of the cone 32).
  • a heat removal device 30' according to a second preferred embodiment of the invention is shown.
  • the characteristics of the second preferred embodiment are detailed below.
  • the mounting member 31' is integrally formed with the cone 32' by die casting. Further, the heat radiating grooves 321 are replaced by latches 321' having an open top end 323' and a lower opening 322' so as to provide a large heat radiating surface and space.

Abstract

A LED bulb includes a housing (20) a having a base (10) mounted in an electrical socket; a heat removal device (30) mounted on a lower portion of the housing for surrounding the remaining portion of the housing; a bulb (40) formed of transparent material or being frosted, the bulb being mounted on a top edge of the heat removal device (30); a light source (60) (e.g., Hi-Power LED) mounted on the heat removal device and the housing; and a circuit board (50) received in the housing, the circuit board being electrically connected to the light source (60) and the base respectively. Heat generated by the LED is adapted to conduct away by the heat removal device. In one embodiment, the heat removal device includes an inverted, truncated cone having a corrugated surface. In another embodiment, the cone includes a plurality of longitudinal, spaced latches formed around, the latches having an opening.

Description

    BACKGROUND OF THE INVENTION 1. Field of Invention
  • The invention relates to light sources and more particularly to an LED (light-emitting diode) having a heat removal device for sufficiently dissipating excess heat generated by a high power ("Hi-Power") LED.
    • 2. Description of Related Art
  • LED lamps have advantages including longer life, less power consumption (i.e., more energy-efficient), and no special ballasts being required. Thus, LED based light sources have gradually replace conventional incandescent lamps and fluorescent lamps as an ideal light source.
  • One type of LED lamp has a Hi-Power LED as light source. However, excess heat can be generated by the Hi-Power LED. Hence, such LED lamps are limited in applications (e.g., in indoor environment). Hence, a need has arisen for an improved LED lamp having a heat removal device for dissipating excess heat generated by the Hi-Power LED so that the LED lamp can find applications in indoor environment.
  • There have been numerous suggestions in prior patents for LED based light sources. For example, U.S. Pat. No. 5,688,042 discloses an LED lamp and U.S. Pat. No. 7,086,767 discloses an LED bulb.
  • Documents WO 2006/118457 A1 and US 2006/0092640 A1 disclose LED lamps with heat removal means.
    • SUMMARY OF THE INVENTION
  • It is therefore one object of the invention to provide an LED bulb including a metal heat removal device mounted between a bulb and a housing, and a Hi-Power LED being in good thermal contact with the heat removal device such that excess heat generated by the Hi-Power LED can be sufficiently dissipated.
  • In one aspect of the invention the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being integrally formed with the cone by die casting.
  • In another aspect of the invention the heat removal device comprises an outer, inverted, truncated cone and a top mounting member secured to the bulb, the mounting member being formed separately prior to assembling with the cone.
  • In yet another aspect of the invention the cone comprises a plurality of longitudinal heat radiating grooves so as to provide a large heat radiating surface.
  • In a further aspect of the invention the heat radiating grooves have openings so as to provide a large heat radiating surface and space.
  • The above and other objects, features and advantages of the invention will become apparent from the following detailed description taken with the accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
    • FIG. 1 is a side elevation of an LED bulb incorporating a first preferred embodiment of heat removal device according to the invention;
    • FIG. 2 is a longitudinal sectional view of the LED bulb of FIG. 1;
    • FIG. 3 is an exploded view of the LED bulb of FIG. 1; and
    • FIG. 4 is a perspective view of a second preferred embodiment of heat removal device according to the invention.
    DETAILED DESCRIPTION OF THE INVENTION
  • Referring to FIGS. 1 to 3, an LED bulb in accordance with the invention is shown. The LED bulb comprises a base 10, a housing 20, a heat removal device 30, a bulb 40, a printed circuit board (PCB) 50, and a solid state light source 60. Each component is discussed in detail below.
  • The base 10 is a well known device and is adapted to mount in an electrical socket. The base 10 comprises a bottom contact 11 being used as, for example, positive terminal, a metallic element 12 formed of copper, the metallic element 12 being used as, for example, negative terminal, and an insulator 13 formed between the contact 11 and the metallic element 12 for preventing them from electrically contacting each other.
  • The hollow, cylindrical housing 20 is adapted to mount on the base 10. The housing 20 consists of two mated halves. The housing 20 is formed of an insulative material and comprises a lower portion 21 of reduced diameter adapted to secure to an upper portion of the base 10, an annular flange 22 formed between the lower portion 21 and an upper main portion of the housing 20, and a plurality of top tabs 23. The insulative housing 20 is mounted between the heat removal device 30 and the metallic element 12 for preventing them from electrically contacting each other.
  • The PCB 50 is fastened in the housing 20. The PCB 50 comprises electrical elements such as capacitors, resistors, diodes, etc. The PCB 50 has two conductors (not numbered) electrically connected to the contact 11 and the metallic element 12 respectively.
  • The heat removal device 30 is formed of good conductive material (e.g., metal) and comprises an inverted, truncated cone 32 surrounding most portion of the housing 20 and having its bottom edge rested upon and secured to the flange 22, the cone 32 including a plurality of longitudinal, spaced heat radiating grooves 321 formed around the outer surface, the heat radiating grooves 321 substantially having one end adjacent the top edge of the cone 32 and the other end adjacent the bottom edge of the cone 32 such that the heat radiating grooves 321 can provide a large heat radiating surface, and a disc-shaped mounting member 31 secured to a top edge of the cone 32, the mounting member 31 including a plurality of holes 311 secured to the tabs 23 by snapping the tabs 23 through the holes 311 with the light source 60 on the mounting member 31 being surrounded by the holes 311. Further, the light source 60 is electrically connect to the PCB 50.
  • The bulb 40 is made of transparent material (e.g., glass) as to be clear or frosted to diffuse the light. The bulb 40 is mounted on the top edge of the heat removal device 30 so as together with the heat removal device 30, the housing 20, and the base 10 to sealingly receive the PCB 50 and the light source 60.
  • The light source 60 is implemented as an LED (e.g., Hi-Power LED in this embodiment). Alternatively, the light source 60 is formed of another material in other embodiments.
  • Heat generated by the light source 60 can be effectively conducted away by the heat removal device 30 (i.e., through the mounting member 31 and the heat radiating grooves 321 of the cone 32).
  • Referring to FIG. 4, a heat removal device 30' according to a second preferred embodiment of the invention is shown. The characteristics of the second preferred embodiment are detailed below. The mounting member 31' is integrally formed with the cone 32' by die casting. Further, the heat radiating grooves 321 are replaced by latches 321' having an open top end 323' and a lower opening 322' so as to provide a large heat radiating surface and space.
  • While the invention herein disclosed has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of the invention set forth in the claims.

Claims (5)

  1. An LED light source comprising:
    a housing (20) having a base (10) adapted to be mounted in an electrical socket;
    heat removal means (30') formed of conductive material and mounted on a lower portion of the housing (20) for surrounding the remaining portion of the housing (20);
    a bulb (40) formed of transparent material or being frosted, the bulb (40) being mounted on a top edge of the heat removal means (30');
    a light source (60) mounted on the heat removal means (30') and the housing (20), the light source (60) being adapted to emit light to pass the bulb (40); and
    a circuit board (50) received in the housing (20), the circuit board (50) being electrically connected to the light source (60) and the base (10) respectively,
    wherein heat generated by the light source is adapted to conduct away by the heat removal means (30'),
    characterized in that
    the heat removal means (30') comprises an inverted, truncated cone (32), wherein the cone (32) includes a plurality of longitudinal, spaced latches (321') formed around, the latches (321') having an open top end (323') and a lower opening (322') so as to provide a large heat retarding surface and space.
  2. The LED light source of claim 1, wherein the light source is an LED.
  3. The LED light source of claim 1, wherein the light source is a Hi-Power LED.
  4. The LED light source of claim 1, wherein the heat removal means (30') is an integral member.
  5. The LED light source of claim 1, wherein a disc-shaped mounting member (31) is secured to the top of the cone (32) with the light source (60) secured thereon such that heat generated by the light source (60) is adapted to conduct away through the mounting member (30) and the cone (32).
EP08000087A 2008-01-04 2008-01-04 LED bulb with heat removal device Not-in-force EP2077415B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AT08000087T ATE537405T1 (en) 2008-01-04 2008-01-04 LED LAMP WITH HEAT DISSIPATION DEVICE
EP08000087A EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08000087A EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device

Publications (2)

Publication Number Publication Date
EP2077415A1 EP2077415A1 (en) 2009-07-08
EP2077415B1 true EP2077415B1 (en) 2011-12-14

Family

ID=39283904

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08000087A Not-in-force EP2077415B1 (en) 2008-01-04 2008-01-04 LED bulb with heat removal device

Country Status (2)

Country Link
EP (1) EP2077415B1 (en)
AT (1) ATE537405T1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011030479A1 (en) * 2009-09-09 2011-03-17 パナソニック株式会社 Bulb-shaped lamp and lighting device
WO2011068431A1 (en) 2009-12-03 2011-06-09 Общество с ограниченной ответственностью "ДиС ПЛЮС" Method for producing a led lamp, led lamp obtained by said method, and radiator for said lamp
WO2011141846A2 (en) 2010-05-11 2011-11-17 Koninklijke Philips Electronics N.V. Lighting module
DE102010031293A1 (en) * 2010-07-13 2012-01-19 Osram Gesellschaft mit beschränkter Haftung Heat sink for a semiconductor lamp and semiconductor lamp
WO2012020366A1 (en) * 2010-08-13 2012-02-16 Koninklijke Philips Electronics N.V. A led lamp
CN102032490B (en) * 2010-12-28 2013-01-02 深圳市聚作实业有限公司 Inner shaft radiation type LED bulb
KR101823677B1 (en) 2011-04-21 2018-01-30 엘지이노텍 주식회사 Led lighting apparatus
IN2014CN01872A (en) 2011-09-23 2015-05-29 Koninkl Philips Nv
RU2556871C2 (en) * 2013-05-31 2015-07-20 Общество с ограниченной ответственностью "ДиС ПЛЮС" Led lamp
RU2680720C1 (en) * 2018-05-03 2019-02-26 Юрий Борисович Соколов General-purpose led lamp

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688042A (en) 1995-11-17 1997-11-18 Lumacell, Inc. LED lamp
KR20090115810A (en) * 2001-12-29 2009-11-06 항조우 후양 신잉 띠앤즈 리미티드 A LED and LED lamp
US7086767B2 (en) 2004-05-12 2006-08-08 Osram Sylvania Inc. Thermally efficient LED bulb
US7165866B2 (en) * 2004-11-01 2007-01-23 Chia Mao Li Light enhanced and heat dissipating bulb
NL1028678C2 (en) * 2005-04-01 2006-10-03 Lemnis Lighting Ip Gmbh Heat sink, lamp and method for manufacturing a heat sink.

Also Published As

Publication number Publication date
EP2077415A1 (en) 2009-07-08
ATE537405T1 (en) 2011-12-15

Similar Documents

Publication Publication Date Title
EP2077415B1 (en) LED bulb with heat removal device
US20110001417A1 (en) LED bulb with heat removal device
EP2142842B1 (en) Led connector assembly with heat sink
US8696168B2 (en) Illumination device
US8471443B2 (en) Lighting device
US6252350B1 (en) Surface mounted LED lamp
US8500301B2 (en) Illuminant device and manufacturing method of lamp holder
US8556462B2 (en) LED lighting device
CA2735632C (en) Multiple led bulb with thermal management features
EP2937628A1 (en) Electric connecting piece and led lamp using same
US20050078477A1 (en) Light emitting diode lamp
US7880389B2 (en) LED lighting lamp
EP2392851A1 (en) LED lighting device
CN101194369A (en) LED unit and LED illuminating lamp using such LED unit
EP2757313A1 (en) LED lamp assembly
US9052066B2 (en) LED light bulb with integrated heat sink
US20110317437A1 (en) Led illuminating device
EP3343098B1 (en) Led lamp with heat dissipation effect
US8534872B2 (en) LED illumination device
EP2314913A1 (en) Light emitting unit carrier and light source comprising such a carrier
WO2017124784A1 (en) Wide-angle light emitting led filament lamp
US20110006679A1 (en) LED bulb with an enlarged irradiation range by arranging led elements in three-dimension
KR20160011579A (en) Light-emitting diode bulb
CN220551875U (en) Novel LED circuit board
EP2077414A1 (en) LED bulb with an enlarged irradiation range by arranging LED elements in three-dimension

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

17P Request for examination filed

Effective date: 20091210

17Q First examination report despatched

Effective date: 20100107

AKX Designation fees paid

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: F21K 99/00 20100101AFI20100729BHEP

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602008011894

Country of ref document: DE

Effective date: 20120216

REG Reference to a national code

Ref country code: NL

Ref legal event code: T3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120314

LTIE Lt: invalidation of european patent or patent extension

Effective date: 20111214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120315

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20120227

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120314

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120414

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120416

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

Ref country code: MC

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120131

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 537405

Country of ref document: AT

Kind code of ref document: T

Effective date: 20111214

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120131

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120131

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

26N No opposition filed

Effective date: 20120917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602008011894

Country of ref document: DE

Effective date: 20120917

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120104

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20120325

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20130104

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20130104

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 602008011894

Country of ref document: DE

Representative=s name: PATENTANWAELTE RUFF, WILHELM, BEIER, DAUSTER &, DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20111214

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20140117

Year of fee payment: 7

Ref country code: BE

Payment date: 20140124

Year of fee payment: 7

Ref country code: DE

Payment date: 20131223

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20120104

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20140129

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20080104

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150131

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602008011894

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: V1

Effective date: 20150801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150801

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20150930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150202