JP3141579U - LED lighting fixtures - Google Patents

Abstract

An LED lighting apparatus capable of ensuring a desired luminance using a low power consumption type chip LED is provided.
A plurality of chip LEDs are mounted on each of a plurality of side substrates and a ceiling substrate of a substrate structure. A circuit pattern is provided in almost the entire region sandwiched between the chip LEDs adjacent to each other on the side board and the ceiling board, and the wiring conductor 16 constituting a part of the circuit pattern extends to the edge of the side board and the ceiling board and is adjacent to each other. By connecting the wiring conductors 16 positioned at the edges of the side board and / or the ceiling board to be connected by soldering, the respective chip LEDs are electrically connected and the side board and the ceiling board are fixed to each other.
[Selection] Figure 5

Description

  The present invention relates to an LED lighting apparatus using a large number of chip LEDs as light sources.

  LEDs (Light Emitting Diodes) have already been used in various fields, but today, when white LEDs are put into practical use, they are being considered as lighting fixtures that can replace incandescent and fluorescent lamps. Since LEDs have a longer life and consume less energy than incandescent lamps and fluorescent lamps, lighting fixtures that employ LEDs tend to become popular today when global warming is screaming.

  Patent Document 1 proposes a lighting fixture in which a plurality of illumination boards on which a plurality of LEDs are arranged are arranged on the same plane. Further, Patent Document 2 proposes a lighting fixture including a base that can be screwed into a general-purpose socket, and a plurality of LED elements mounted on a hemispherical holding unit. More specifically, in Patent Document 2, the LED element is provided with plus and minus leg terminals vertically on the same axis, while the hemispherical holding unit has two poles having different polarities via an insulating layer. A power transmission film is provided, and power is supplied to each LED element by inserting a leg terminal of each LED element into the holding unit.

  By the way, currently available LEDs are classified and manufactured as super-brightness type, high-brightness type, low power consumption type, etc., and the shape is classified into bullet type LED, surface mount type LED (chip LED), etc. Are manufactured and sold.

JP 2007-122936 A JP 2003-281925 A

  In the case of LED lighting, if you use ultra-bright LEDs or high-brightness LEDs that use a large current, you can use fewer LEDs to make LED lighting fixtures with the desired brightness. There is. In addition, when a bullet-type LED is employed, there is a difficulty in miniaturizing the LED lighting apparatus.

  The objective of this invention is providing the LED lighting fixture which can ensure desired brightness | luminance using the low power consumption type chip | tip LED.

  It is a further object of the present invention to provide an LED lighting apparatus that can improve the efficiency of wiring and assembly of small chip LEDs.

According to the present invention, the above technical problem is
A plurality of side substrates constituting the side surface of the polygonal columnar or truncated polygonal pyramid substrate structure, and a polygonal ceiling substrate constituting the ceiling surface of the polygonal columnar or truncated polygonal pyramid substrate structure This is achieved by providing an LED luminaire characterized in that a plurality of chip LEDs are mounted.

  According to a preferred embodiment of the present invention, a polygonal column is formed by a combination of a side substrate and a ceiling substrate on which a plurality of chip LEDs are mounted, and a large number of LEDs are arranged three-dimensionally. Further, the structural fixing and electrical connection between the side board and the ceiling board are simultaneously performed by soldering the wiring conductors provided on the edges of the respective boards.

  Also, the circuit patterns of the side board and the ceiling board are set as large as possible, and the circuit patterns are provided on the front and back surfaces of the side board and the ceiling board, and the heat generated by the LEDs is generated by connecting the circuit patterns on both sides. Since heat can be radiated using not only the circuit pattern but also the circuit pattern on the back surface, the heat radiation effect can be improved.

  Moreover, the surface of the circuit pattern on the surface of the side board and the ceiling board is plated to give the function of a reflecting mirror, so that the light emitted from the LED can efficiently contribute to illumination.

  The side substrate and the ceiling substrate constituting the substrate structure of the polygonal column or the truncated polygonal pyramid are formed by separating them from the substrate that has been subjected to V-cut processing and imposing, and long on the V-cut processing line. By providing a hole-shaped through-hole and providing a wiring conductor at the periphery of the through-hole, by soldering the through-hole portion, the side boards adjacent to each other and the ceiling board and the side board are fixed. In addition, each LED is electrically connected. Of course, the chip LED can be mounted on the substrate to be impositioned by V-cut processing by the work robot. In addition, the reflection plate is a separate component in the past, but in the present invention, the substrate itself also serves as the reflection plate.

  FIG. 1 shows a light bulb type LED lighting apparatus of the embodiment. Referring to FIG. 1, a light bulb type LED lighting apparatus 1 has an electrode base 2 and can be illuminated using a commercial power source by screwing the electrode base 2 into a general-purpose socket.

  The bulb-type LED lighting device 1 has an opaque plastic case 3 disposed in the vicinity of the electrode cap 2, and a power supply circuit (not shown) is accommodated in the plastic case 3. A light transmissive cover 4 is provided above the opaque plastic case 3, and a substrate structure 5 is accommodated in the cover 4. The light transmissive cover 4 may be made of plastic or glass.

  FIG. 2 is a view in which the substrate structure 5 is exposed by removing the light-transmitting cover 4 from the bulb-type LED lighting device 1. Referring to FIG. 2, the substrate structure 5 has a hexagonal column shape composed of six side substrates 6 and one ceiling substrate 7, and each substrate 6, 7 includes a plurality of substrates. Chip LEDs 10 are arranged. Here, the chip LED 10 is a low power consumption type LED with relatively low brightness.

  The side substrate 6 has a rectangular shape, and four chip LEDs 10 are mounted in series in the longitudinal direction at intervals. The ceiling substrate 7 has a hexagonal shape in plan view, and three chip LEDs 10 are mounted on the ceiling substrate 7 in series and spaced from each other. The hexagonal column is merely an example, and a polygonal column shape such as a quadrangle, pentagon, or octagon can be arbitrarily employed. Of course, a truncated polygonal pyramid shape having a polygonal ceiling surface may be employed.

  FIG. 3 shows a state before the plurality of side substrates 6 described above are applied to a single substrate 11 and the side substrates 6 are separated. Note that the same substrate 11 including the ceiling substrate 7 may be impositioned, or the top substrate 7 may be impositioned on another substrate.

  Referring to FIG. 3, a plurality of side substrates 6 are divided into a substrate 11 by vertical lines 12 and horizontal lines 13, and each side substrate 6 is formed by cutting along vertical lines 12 and horizontal lines 13. it can. Here, the vertical line 12 and the horizontal line 13 are V-cut processed with a V-shaped cross section. The vertical line 12 and the horizontal line 13 have long hole shaped through holes 14. Reference numeral 15 in FIG. 3 indicates a circuit pattern. This circuit pattern 15 is for electrically connecting adjacent chip LEDs 10 and 10, and as can be understood from FIG. 3, using almost the entire area between adjacent chip LEDs 10 and 10 on each side substrate 6. A circuit pattern 15 is formed. Then, the surface of the side base end 6 on which the chip LED 10 and the circuit pattern 15 are provided is subjected to light reflection plating such as nickel. In addition, a transparent material is employed as a resist paint for protecting the surface of the substrate 11, whereby the circuit pattern 15 has a function of a reflecting mirror. The ceiling substrate 7 has substantially the same configuration as the side substrate 6.

  As shown in FIG. 4, among the long hole-shaped through holes 14, a wiring conductor 16 is applied to the peripheral portion of the through hole 14, and the side substrate adjacent to each other by the wiring conductor 16. 6 and the ceiling board 7 are electrically connected to each other.

  The same conductive material as that of the circuit pattern 15 and the wiring conductor 16 described above is applied to the back surfaces of the side substrate 6 and the ceiling substrate 7 (not shown). The front and back circuit patterns 15 and wiring conductors 16 of the side board 6 and the ceiling board 7 are connected to each other by soldering at the portion of the through holes 14. Thereby, the heat | fever which chip | tip LED10 emits can be thermally radiated efficiently using the circuit pattern 15 which consists of an electroconductive material apply | coated to almost all the area | regions between chip | tip LEDs 10 and 10 on both surfaces of the board | substrates 6 and 7. FIG.

  FIG. 5 shows the assembly of the boards 6 and 7 on each side separated from the board 11, and the circuit patterns 15 on the boards 6 and 7 on each side are electrically connected by soldering the wiring conductors 16 on the periphery of the through holes 14. Connected. A part to be soldered is indicated by reference numeral 20.

  According to the LED lighting apparatus 1 of the embodiment, the side substrate 6 and the ceiling substrate 7 on which the plurality of chip LEDs 10 are mounted are soldered to the wiring substrate 16 at the peripheral portion of the through hole 14, whereby the LED 10 of each substrate 6, 7. Are connected to the power supply circuit and the ceiling substrate 7 and the plurality of side surface substrates 6 are fixed to each other to form a hexagonal column light source. Therefore, the assembly work of the substrate structure 5 incorporating a large number of chip LEDs 10 can be made efficient.

  Further, according to the LED lighting apparatus 1 of the embodiment, the circuit pattern 15 is formed using almost the entire area between the chip LEDs 10 and 10 adjacent to each other on the surface of the side substrate 6 and the ceiling substrate 7, and the back surface Since the conductive material is applied in the same manner as the circuit pattern 15 and the conductive material is generally excellent in thermal conductivity, the heat generated by the LED is transferred to the side substrate 6 and the ceiling substrate of the substrate structure 5. It is possible to efficiently dissipate heat using almost the entire area of the front surface and the back surface of 7.

  In addition, a large number of chip LEDs 10 can be disposed on each side and ceiling of the polygonal-pillar substrate structure 6, and light emitted from the chip LEDs 10 is reflected by the circuit pattern 15 functioning as a reflecting mirror. The emitted light can be efficiently contributed to illumination.

It is a perspective view of the lightbulb type LED lighting fixture of an Example. It is the figure which removed the light-transmitting cover from the lightbulb type LED lighting fixture of FIG. 1, and exposed the board | substrate structure. It is a top view of the board | substrate impositioned by V cut process. It is a figure for demonstrating the long hole-shaped through-hole provided in the V cut line, and the wiring conductor of the periphery of this through-hole. For explaining the connection of the circuit pattern and the fixing of the side board and the ceiling board by aligning the through holes between the side board and the ceiling board adjacent to each other and soldering the wiring conductor of the through hole portion. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light bulb type LED lighting fixture 2 Electrode base 5 Board structure 6 Side board 7 Ceiling board 10 Chip LED
DESCRIPTION OF SYMBOLS 11 Imposed substrate 12, 13 V cut processing line 14 Through-hole 15 Circuit pattern 16 Wiring conductor 20 Soldering part

Claims (7)

  A plurality of side substrates constituting the side surface of the polygonal columnar or truncated polygonal pyramid substrate structure and each of the polygonal ceiling substrates constituting the ceiling surface of the polygonal columnar or truncated polygonal pyramid substrate structure An LED lighting apparatus comprising a plurality of chip LEDs.   A circuit pattern is provided in almost the entire area sandwiched between the chip LEDs adjacent to each other on the side board and the ceiling board, and a wiring conductor constituting a part of the circuit pattern extends to an edge of the side board and the ceiling board. Then, by connecting the wiring conductors located at the edges of the side board and / or the ceiling board adjacent to each other by soldering, the side board and the chip LED of the ceiling board are electrically connected and the side board and the The LED lighting apparatus according to claim 1, wherein the ceiling substrates are fixed to each other.   A plurality of side substrates provided with the plurality of chip LEDs are formed by separating each side substrate from a substrate divided by V-cut processing at least a plurality of side substrates, and the V-shaped cut portion has a long hole shape. The LED lighting apparatus according to claim 2, wherein a through hole is provided, the wiring conductor is provided at a periphery of the through hole, and the soldering is performed on the wiring conductor in the through hole portion.   The circuit pattern is provided on the front and back surfaces of the side substrate and the ceiling substrate, the wiring conductors on the front and back surfaces are connected to each other, and heat generated by the chip LED is performed on both sides of the side substrate and the ceiling substrate. The LED lighting apparatus according to claim 2 or 3.   5. The light reflection plating is applied to the surface of the circuit pattern on the surface of the substrate on each surface, and a transparent protective resist is provided on the surface of the substrate on each surface. LED lighting fixture of description.   The LED lighting apparatus according to claim 5, wherein the chip LED is composed of a low power consumption type LED.   The LED lighting apparatus according to claim 6, wherein the LED lighting apparatus is a light bulb-type LED lighting apparatus including an electrode base that can be screwed into a general-purpose socket connected to a commercial power source.

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