WO2022028022A1

WO2022028022A1 - Novel led stereoscopic light source

Info

Publication number: WO2022028022A1
Application number: PCT/CN2021/092355
Authority: WO
Inventors: 黄敏; 殷克雄
Original assignee: 东莞市瑞拓科技有限公司
Priority date: 2020-08-04
Filing date: 2021-05-08
Publication date: 2022-02-10
Also published as: CN213089463U

Abstract

An novel LED stereoscopic light source, comprising a red copper cylinder (4), a polygonal copper piece (1), a Teflon single-strand copper wire (2), a high-temperature resistant insulating spacer (3), and an LED module (6). The red copper cylinder (4) comprises a first cylinder (43) and a second cylinder (44); a polygonal prism (42) of which a bottom surface is consistent with the polygonal copper piece (1) in shape is provided on the top of the first cylinder (43); the polygonal copper piece (1), the high-temperature resistant insulating spacer (3), the polygonal prism (42), the first cylinder (43), and the second cylinder (44) are sequentially connected from top to bottom; the LED module (6) is attached onto the side surface of the polygonal prism (42) and fixed by means of welding and molding; a silica gel layer (8) is formed at the periphery of the LED module (6); the red copper cylinder (4) is used as a stereoscopic light source carrier; and the silica gel layer (8) protects the light source.

Description

A new type of LED stereo light source

technical field

The utility model belongs to the technical field of LEDs, in particular to a novel LED three-dimensional light source.

Background technique

LED lighting fixtures have been widely used in the application market. Since the performance of LED lighting fixtures directly affects people's lives, people's requirements for LED lighting fixtures are getting higher and higher, and they are constantly pursuing LED lighting fixtures with high light efficiency and long life. stability characteristics. However, the high-power LED stereo light source will generate a lot of heat during use, and the accumulated heat cannot be dissipated in time and effectively, which will seriously affect the luminous efficiency and service life of the LED light source.

technical problem

At present, the stereo light source on the market has the following deficiencies in the application side:

(1) The three-dimensional light source bracket pin and the cylinder are molded by injection insulation. Due to the instability of the injection pressure, the pin and the center hole of the cylinder will be offset, and the product has a high risk of high voltage resistance and short circuit, and the safety performance is poor;

(2) The pins of the three-dimensional light source bracket are formed by riveting copper pins and copper sheets. The products formed by this process are prone to loosening due to thermal expansion at the end of use, resulting in unstable lighting in the application, which seriously affects the safety and experience of the application end. ;

(3) Low assembly efficiency on the application side: Most of the three-dimensional light sources for vehicles are assembled with screws and nuts correspondingly. The application side needs to be connected by welding connecting wires and heat shrinkable sleeves. Twisting assembly leads to low assembly efficiency;

(4) The light source is easily damaged in the assembly of the application side: by twisting the screw and the nut to match the assembly, the structure of the light source will be damaged due to the unstable manual grasping force, which will affect the appearance and performance of the product;

(5) The assembly of the application side is unstable: there is a large gap between the three-dimensional light source screw and the nut assembly, and the bottom platform of the three-dimensional light source screw or the platform of the thermal conduction column is not flat, which leads to a small risk of the contact surface and other factors, which will directly affect the stability of the product’s heat dissipation. Indirectly affect the life stability of the product on the application side;

(6) Short service life: Most of the three-dimensional light source applications are matched with screws and nuts, and the gaps are thermally conductive through thermal conductive silicone grease. Continuous use of thermal conductive silicone grease loses thermal conductivity and affects the service life of the product;

Most LED light sources are prone to oxidation, vulcanization and other problems when used in harsh environments, resulting in serious LED light decay. Adding encapsulant to the outside of the light source to protect the light-emitting area can effectively reduce the risk of oxidation, vulcanization, pollution, and blue light leakage from the phosphor powder in the internal light-emitting area.

technical solutions

In order to solve the above problems, the purpose of this utility model is to provide a new type of LED three-dimensional light source, including: red copper cylinder, polygonal copper sheet, Teflon single-strand copper wire, high temperature resistant insulating gasket and LED module; The red copper cylinder includes a first cylinder and a second cylinder, the top of the first cylinder is provided with a polygonal prism whose bottom surface is the same as the shape of the polygonal copper sheet, the polygonal copper sheet, the high-temperature insulation The gasket, the polygonal prism, the first cylinder and the second cylinder are connected in sequence from top to bottom, the polygonal copper sheet is provided with a first central hole; the top of the polygonal prism is provided with a second A center hole, the bottom of the second cylinder is provided with a third center hole; the main body of the Teflon single-strand copper wire is fixed and formed into one body with the inside of the red copper cylinder through a heat-conducting potting glue, and the iron One end of the Teflon single-strand copper wire is welded to the first central hole and penetrates from the high temperature insulating gasket to the second central hole, and the other end of the Teflon single-strand copper wire is inserted from the The inside of the second cylinder is penetrated through the third central hole to form an integrated conductive member; the integrated conductive member, the polygonal prism and the second cylinder are coated with an electroplated silver layer by electroplating, and the first A cylinder is coated with an electroplated nickel layer or an electroplated chromium layer; the LED module is attached to the side of the polygonal prism and fixed by welding, and a silica gel layer is provided on the periphery of the LED module.

Wherein, the Teflon single-strand copper wire and the central hole of the polygonal copper sheet are formed into one body by laser welding, and the Teflon single-strand copper wire comprises any one of Teflon material or FEP material The wire insulation layer is made, and the length of the wire insulation layer is greater than the length of the red copper column.

Wherein, the high temperature resistant insulating pads are nylon gaskets, Teflon gaskets and ceramic gaskets.

Wherein, the diameter of the second central hole is less than 1.2 mm, the second central hole passes through the polygonal prism and extends to more than 3 mm of the first column, and the copper core of the Teflon single-strand copper wire The diameter is greater than 0.5mm, and the thickness of the Teflon single-strand copper wire covered with the insulating layer is smaller than that of the second central hole.

Wherein, the polygonal copper sheet and the bottom surface of the polygonal prism are aligned and connected side-to-side, and the side surface of the polygonal prism is a regular polygon.

Wherein, the thickness of the electroplated silver layer is more than 60 μm, and the thickness of the electroplated nickel layer or the electroplated chromium layer is more than 40 μm.

Wherein, the LED module includes an LED substrate, an LED flip chip, a substrate insulating layer and a fluorescent film coating, and the LED substrate is an aluminum nitride ceramic substrate, an alumina ceramic substrate, a superconducting aluminum substrate or a copper substrate. In any one of the above, the backside of the LED substrate is provided with a positive electrode and a negative electrode, and the positive electrode and the negative electrode are separated from each other by the insulating layer of the substrate.

Wherein, the polygonal prism is smeared with solder paste, and the solder paste is smeared at the welding part of the Teflon single-strand copper wire and the polygonal copper sheet.

Wherein, the first cylinder and the second cylinder are cylinders, and the diameter of the second cylinder is larger than the diameter of the first cylinder.

Wherein, the silica gel layer is attached to the peripheral surface of the LED module through a glue-filling mold cavity.

beneficial effect

Compared with the prior art, the beneficial effects of the present utility model are:

(1) The red copper cylinder is used as the carrier of the three-dimensional light source, which is insulated from the high temperature resistant insulating sheet and the Teflon single-strand copper wire insulation layer, which effectively solves the problem of injection molding between the pins and the cylinder of the three-dimensional light source bracket on the market. The instability of the pressure leads to the problem of short circuit caused by the deviation of the pin and the center hole of the cylinder and the risk of high pressure resistance of the product, which improves the yield and safety of the product;

(2) It is directly fixed by the fixture, and the riveting position is far away from the light-emitting area. The riveting machine is directly riveted for one-time forming, which improves the assembly efficiency, reduces labor costs, and reduces the risk of damage to the light-emitting area of the product due to riveting misalignment;

(3) Encapsulation glue is added to the outside of the LED stereo light source to protect the light-emitting area, which effectively solves the problems of oxidation and vulcanization that are prone to occur in most LED light sources on the market when used in harsh environments. , waterproof, shockproof and anti-drop performance;

(4) The difference in diameter between the first cylinder and the second cylinder forms riveting positioning. Not only is it far away from the light-emitting area of the LED module during the riveting process, but the diameter of the second cylinder of the three-dimensional light source bracket is too large. This design effectively increases the riveting contact area and the positioning of the riveting operation to ensure the verticality of the light source and the application-side heat sink, improving the product. Thermal efficiency while improving assembly quality;

(5) The bottom of the light source bracket and the heat dissipation base of similar products on the market are mostly assembled with the corresponding thermal grease between the screw and the nut. Usually, the thermal conductivity of the thermal grease itself is low, and it will not be effective for a long time if it becomes dry for a long time. It has the effect of heat conduction. This kind of assembly has the risk of gaps and cannot guarantee the complete and lasting heat conduction between the light source and the heat dissipation base. The LED light source bracket and the heat dissipation base of the present invention are assembled and formed by tolerance matching and riveting to ensure that the LED light source bracket is partially formed. Fully contact with the heat dissipation base to achieve a good lasting and stable heat dissipation effect and prolong the service life of the product.

Description of drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

Fig. 1 is the exploded structure schematic diagram of the light source carrier provided by the present utility model;

Fig. 2 is the top schematic diagram of the light source carrier provided by the present invention;

Fig. 3 is the bottom schematic diagram of the light source carrier provided by the present invention;

Fig. 4 is the assembly schematic diagram of Fig. 2 of the present utility model;

5 is a schematic view of the top structure of the LED module provided by the present invention;

6 is a schematic diagram of the bottom structure of the LED module provided by the present invention;

7 is a schematic diagram of the structure of the LED module provided by the present invention after mounting;

8 is a schematic diagram of a first-polarity positive circuit provided by the present invention;

9 is a schematic diagram of a second polarity negative circuit provided by the present invention;

FIG. 10 is a schematic diagram of the LED module provided by the present invention, which is to be placed on the injected silica gel after being mounted.

FIG. 11 is a schematic diagram of the overall structure of a stereo light source provided by the present invention after molding.

In the picture: 1. Polygonal copper sheet; 2. Teflon single-strand copper wire; 3. High temperature insulating gasket; 4. Red copper cylinder; 5. Thermal potting glue; 6. LED module; 7. Filling Plastic cavity; 8. Silicone layer; 10. First central hole; 21. Conductor insulation layer; 22. Integrated conductive member; 41. Second central hole; 42. Polygonal prism; 43. First cylinder; Two cylinders; 45, the third central hole; 61, the LED substrate; 62, the LED flip chip; 63, the positive electrode; 64, the negative electrode; 65, the substrate insulating layer.

Embodiments of the present invention

Hereinafter, the present utility model will be further described with reference to the accompanying drawings and specific embodiments. It should be noted that, on the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new implementations. example.

As shown in Figure 1, Figure 2, Figure 3 and Figure 4, a new type of LED three-dimensional light source includes: red copper cylinder 4 as a light source carrier, polygonal copper sheet 1, Teflon single-strand copper wire 2, high temperature resistance Insulation gasket 3 and LED module 6. The red copper cylinder 4 includes a first cylinder 43 and a second cylinder 44 , the first cylinder 43 and the second cylinder 44 are cylinders, and the diameter of the second cylinder 44 is larger than that of the first cylinder 43 . The top of the first cylinder 43 is provided with a polygonal prism 42 whose bottom surface is the same in shape as the polygonal copper sheet 1. The polygonal copper sheet 1, the high temperature insulating gasket 3, the polygonal prism 42, the first cylinder 43 and the second cylinder 44 are Connected in sequence from top to bottom, the polygonal copper sheet 1 is provided with a first central hole 10; the top of the polygonal prism 42 is provided with a second central hole 41, and the bottom of the second cylinder 44 is provided with a third central hole 45; The main body of the long single-strand copper wire 2 is fixed and formed into one body with the inside of the red copper cylinder 4 through the heat-conducting potting glue 5, and one end of the Teflon single-strand copper wire 2 is welded to the first central hole 10 and is insulated from the high temperature. The gasket 3 penetrates into the second center hole 41, and the other end of the Teflon single-strand copper wire 2 penetrates from the inside of the second cylinder 44 through the third center hole 45 to form an integrated conductive member 22; the integrated conductive member 22, polygonal The prism 42 and the second cylinder 44 are coated with an electroplated silver layer by electroplating, and the first cylinder 43 is coated with an electroplated nickel layer or an electroplated chromium layer by electroplating.

As shown in FIG. 5 , FIG. 6 , FIG. 7 , FIG. 8 , FIG. 9 , FIG. 10 and FIG. 11 , the LED module 6 includes an LED substrate 61 , an LED flip chip 62 , a substrate insulating layer 65 and a fluorescent film coating. The substrate 61 is any one of an aluminum nitride ceramic substrate, an alumina ceramic substrate, a superconducting aluminum substrate or a copper substrate. The back of the LED substrate 61 is provided with a positive electrode 63 and a negative electrode 64, and the positive electrode 63 and the negative electrode 64 pass through The substrate insulating layer 65 is spaced apart. The LED module 6 is pasted on the side of the polygonal prism 42 and fixed by welding. The LED module 6 is pasted on each side and formed by reflow soldering. The semi-finished product is placed in the corresponding glue-filling mold cavity 7 that has been injected with silica gel. , and ensure that the periphery of the LED module 6 is protected by a corresponding silica gel layer 8 by baking.

In the utility model, the Teflon single-strand copper wire 2 and the central hole of the polygonal copper sheet 1 are formed into one body by laser welding to ensure seamless connection. The Teflon single-strand copper wire 2 includes a wire insulating layer 21 made of either Teflon material or FEP material. The length of the wire insulating layer 21 is greater than the length of the red copper cylinder 4 .

In the utility model, the high temperature resistant insulating pads are nylon gaskets, Teflon gaskets and ceramic gaskets.

In the present invention, the diameter of the second central hole 41 is less than 1.2 mm, the second central hole 41 passes through the polygonal prism 42 and extends to more than 3 mm of the first column, and the diameter of the copper core of the Teflon single-strand copper wire 2 When the thickness is greater than 0.5 mm, the thickness of the Teflon single-strand copper wire 2 covered with the insulating layer is smaller than that of the second central hole 41 .

In the present invention, the bottom surfaces of the polygonal copper sheet 1 and the polygonal prism 42 are aligned and connected with the sides, and the side surfaces of the polygonal prism 42 are regular polygons.

In the utility model, the thickness of the electroplated silver layer is more than 60 μm, and the thickness of the electroplated nickel layer or the electroplated chromium layer is more than 40 μm.

In the present invention, the polygonal prism 42 is coated with tin paste, and the welding place of the Teflon single-strand copper wire 2 and the polygonal copper sheet 1 is coated with tin paste. The silver content of the solder paste is 3±0.2%, the copper content is 0.5±0.1%, and the balance is tin.

The novel LED three-dimensional light source of the present invention comprises the following manufacturing steps:

A. Welding: one end of the Teflon single-strand copper wire 2 and the first center hole 10 of the polygonal copper sheet 1 are formed into one body by welding;

B. Assembly: The central hole of the high temperature insulating gasket 3 passes through the other end of the Teflon single-strand copper wire 2, and at the same time passes through the second central hole 41 of the polygonal prism 42 on the upper end of the red copper cylinder 4 to the red copper The third central hole 45 at the lower end of the second cylinder 44 of the cylinder 4 ensures that the length of the wire insulation layer 21 of the Teflon single-strand copper wire 2 is greater than the total length of the red copper cylinder 4;

C. Injecting thermal conductive glue: Fix the above semi-finished products with a jig to ensure that each surface of the polygonal copper sheet 1 corresponds to each polygonal side of the red polygonal prism 42 one by one, and inject an appropriate amount of thermal conductive potting glue 5 or The thermal conductive silicone grease is baked and cured to fix the Teflon single-strand copper wire 2 to form an integral body through the inside of the red copper cylinder 4;

D. Electroplating: The polygonal facets and the integrated conductive parts 22 and the second cylinder 44 are plated with an electroplated silver layer through the electroplating process, and the first cylinder 43 is plated with an electroplated nickel layer or an electroplated chromium layer to ensure the electrical and thermal conductivity of the functional area. and non-functional areas in good appearance;

E. Brushing solder paste: Print the solder paste on the multiple sides of the polygonal prism 42, the Teflon single-strand copper wire 2 and the polygonal copper sheet 1 at the welding places, and the printing of the solder paste needs to use a jig to control its uniform thickness sex;

F. Paste the LED module 6: paste the back of the LED module 6 on each plane of the silver-plated copper column that has been coated with solder paste and each side of the polygonal copper sheet 1, and ensure that the back of the LED module 6 is completely in contact with the solder paste Contact and the positive and negative electrodes are completely separated and neatly arranged on the cylinder. After the process is completed, the online time needs to be controlled within 3 hours;

G. Reflow soldering: Fix the semi-finished product with LED module 6 in the reflow soldering machine through a fixture for soldering. The maximum temperature is controlled at about 265 °C. Make sure that the void rate is less than 5% before operation;

H. Cleaning: Place the semi-finished products that have been reflowed and soldered in a plasma cleaning machine for cleaning to ensure that the surfaces of the cylinder and LED module 6 are clean, and the cleaning time should not exceed 4H before the cleaned materials flow into the next process. 4H needs to be re-cleaned, and the number of cleaning is no more than 3 times;

I. Glue filling: The A/B silica gel that has been configured, mixed and vacuumized is injected quantitatively into the cavity through a high-precision glue dispenser, and the semi-finished product after plasma cleaning is assembled into the glue filling cavity 7, and placed in a high temperature Staged baking in the oven, wherein the initial curing conditions are 150°C/1.5H, and the full curing baking conditions are 150°C/4H. Through the above baking, the assembled semi-finished outer sealant is completely cured, so that the LED module 6 The periphery is integrally formed with a silica gel layer 8 to form an LED three-dimensional light source structure;

J. Spectroscopy and packaging: Set the corresponding BIN in the test system, each BIN includes the setting range of voltage, brightness, wavelength, color rendering index, and color tolerance, and place the formed LED light source structure through the test fixture The LED tester of the integrating sphere is used for testing, and it is packaged together with the BIN material to ensure the consistency of the photoelectric parameters with the BIN material.

The above-mentioned embodiments are only the preferred embodiments of the present invention, and the scope of protection of the present invention cannot be limited by this. Any insubstantial changes and replacements made by those skilled in the art on the basis of the present invention belong to the scope of the present invention. The scope of protection of the utility model.

Claims

A novel LED three-dimensional light source is characterized in that it comprises: a red copper cylinder, a polygonal copper sheet, a Teflon single-strand copper wire, a high temperature resistant insulating gasket and an LED module; the red copper cylinder comprises a first column body and a second cylinder, the top of the first cylinder is provided with a polygonal prism whose bottom surface is the same as the shape of the polygonal copper sheet, the polygonal copper sheet, the high temperature resistant insulating gasket, the polygonal prism, the The first column body and the second column body are connected in sequence from top to bottom, the polygonal copper sheet is provided with a first central hole; the top of the polygonal prism is provided with a second central hole, and the second column body There is a third center hole at the bottom; the main body of the Teflon single-strand copper wire is fixed and formed into one body with the inside of the red copper cylinder through heat-conducting potting glue, and one end of the Teflon single-strand copper wire is connected to the inner part of the red copper cylinder. The first center hole is welded into one body and penetrates from the high temperature insulating gasket to the second center hole, and the other end of the Teflon single-strand copper wire passes through the inside of the second cylinder. The third central hole is penetrated to form an integrated conductive member; the integrated conductive member, the polygonal prism and the second cylinder are coated with an electroplated silver layer by electroplating, and the first cylinder is coated with electroplated silver layer by electroplating. Nickel layer or electroplated chromium layer; the LED module is attached to the side surface of the polygonal prism and fixed by welding, and the periphery of the LED module is provided with a silica gel layer.
The novel LED three-dimensional light source according to claim 1, wherein the Teflon single-strand copper wire and the central hole of the polygonal copper sheet are formed into one body by laser welding or tin welding, and the Teflon single-strand copper wire is formed into one body by laser welding or tin welding. The stranded copper wire includes a wire insulation layer made of either Teflon material or FEP material, and the length of the wire insulation layer is greater than the length of the red copper cylinder.
The novel LED three-dimensional light source according to claim 1, wherein the high temperature resistant insulating pads are nylon gaskets, Teflon gaskets and ceramic gaskets.
The novel LED stereo light source according to claim 2, wherein the diameter of the second central hole is less than 1.2 mm, and the second central hole passes through the polygonal prism and extends to the first column by 3 mm Above, the diameter of the copper core of the Teflon single-strand copper wire is greater than 0.5 mm, and the thickness of the Teflon single-strand copper wire covered with the wire insulation layer is smaller than the second central hole.
The novel LED three-dimensional light source according to claim 1, wherein the polygonal copper sheet and the bottom surface of the polygonal prism are aligned and connected side-to-side, and the sides of the polygonal prism are regular polygons.
The novel LED stereo light source according to claim 1, wherein the thickness of the electroplated silver layer is more than 60 μm, and the thickness of the electroplated nickel layer or the electroplated chromium layer is more than 40 μm.
The novel LED stereo light source of claim 2, wherein the LED module comprises an LED substrate, an LED flip chip, a substrate insulating layer and a fluorescent film coating, and the LED substrate is an aluminum nitride ceramic substrate , any one of alumina ceramic substrate, superconducting aluminum substrate or copper substrate, the back of the LED substrate is provided with a positive electrode and a negative electrode, and the positive electrode and the negative electrode are separated by the insulating layer of the substrate open.
The novel LED stereo light source according to claim 1, wherein the polygonal prism is coated with solder paste, and the solder paste is coated on the welding part of the Teflon single-strand copper wire and the polygonal copper sheet.
The novel LED three-dimensional light source according to claim 1, wherein the first cylinder and the second cylinder are cylinders, and the diameter of the second cylinder is larger than the diameter of the first cylinder .
The novel LED three-dimensional light source according to claim 1, wherein the silica gel layer is attached to the peripheral surface of the LED module through a glue-filling cavity molding.