WO2013007815A1 - Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp - Google Patents
Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp Download PDFInfo
- Publication number
- WO2013007815A1 WO2013007815A1 PCT/EP2012/063780 EP2012063780W WO2013007815A1 WO 2013007815 A1 WO2013007815 A1 WO 2013007815A1 EP 2012063780 W EP2012063780 W EP 2012063780W WO 2013007815 A1 WO2013007815 A1 WO 2013007815A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- emitting diode
- abovementioned
- lamp
- bulb
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 133
- 238000004519 manufacturing process Methods 0.000 title claims description 43
- 239000011521 glass Substances 0.000 claims abstract description 225
- 230000008569 process Effects 0.000 claims description 106
- 238000002347 injection Methods 0.000 claims description 61
- 239000007924 injection Substances 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 45
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 27
- 239000003381 stabilizer Substances 0.000 claims description 20
- 238000005429 filling process Methods 0.000 claims description 19
- 239000011261 inert gas Substances 0.000 claims description 13
- 229920002050 silicone resin Polymers 0.000 claims description 12
- 239000007789 gas Substances 0.000 claims description 10
- PRPINYUDVPFIRX-UHFFFAOYSA-N 1-naphthaleneacetic acid Chemical compound C1=CC=C2C(CC(=O)O)=CC=CC2=C1 PRPINYUDVPFIRX-UHFFFAOYSA-N 0.000 claims description 8
- 230000015556 catabolic process Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 241001052209 Cylinder Species 0.000 claims 1
- 235000012571 Ficus glomerata Nutrition 0.000 claims 1
- 240000000365 Ficus racemosa Species 0.000 claims 1
- 235000015125 Sterculia urens Nutrition 0.000 claims 1
- 238000009826 distribution Methods 0.000 abstract description 11
- 229920001296 polysiloxane Polymers 0.000 description 81
- 229940090044 injection Drugs 0.000 description 55
- 238000010586 diagram Methods 0.000 description 40
- 230000008901 benefit Effects 0.000 description 39
- 230000017525 heat dissipation Effects 0.000 description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 21
- 239000007788 liquid Substances 0.000 description 18
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 13
- 230000007423 decrease Effects 0.000 description 10
- 229910001873 dinitrogen Inorganic materials 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000012530 fluid Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000007872 degassing Methods 0.000 description 4
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 4
- 229920000136 polysorbate Polymers 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WJDOMTAMQVNRCX-OBJOEFQTSA-N Isopolygonal Natural products C1=C(C=O)[C@@H](O)C[C@H]2C(C)(C)CCC[C@]21C WJDOMTAMQVNRCX-OBJOEFQTSA-N 0.000 description 1
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 1
- WJDOMTAMQVNRCX-DYEKYZERSA-N Polygonal Natural products C1=C(C=O)[C@H](O)C[C@H]2C(C)(C)CCC[C@]21C WJDOMTAMQVNRCX-DYEKYZERSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229940000425 combination drug Drugs 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
- F21S8/086—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/08—Lighting devices intended for fixed installation with a standard
- F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
- F21S8/088—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device mounted on top of the standard, e.g. for pedestrian zones
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Definitions
- Patent literature article 1 Japanese Patent Kokai 2009- 4130
- the width w of one side surface of the abo ⁇ vementioned support member is fixed at a prescribed width
- the distance Ak from the center of one side surface of the abovementioned support member to the inner surface of the bulb is fixed at a prescribed distance
- n is a value whereby the abovementioned light- emitting diode unit can be arranged inside a cylindrical bulb having the abovementioned prescribed bulb diameter, and is a value which is determined based on the abovementioned prescribed bulb diameter, prescribed width and prescribed distance .
- the street light according to the present invention is characterized in that it is provided with a light-emitting di ⁇ ode lamp having an E-type cap,
- FIG. 45 Perspective view of the glass bulb 21 in embodiment 7.
- lamps filled with a perfluorocarbon liquid have a higher color temperature than those which are not filled (filled only with nitrogen) , and the lamp color is shifted in the blue direction and appears brighter. Also, because the color temperature of the lamp is raised it is possible to use a light-emitting diode 11 that has a lower color temperature. By this means it is possible to reduce the amount of yellow YAG phosphor used, this being a cause of deterioration in the most typical type of pseudo-white light-emitting diode 11 comprising a blue light-emitting diode 11 to which yellow YAG phosphor is applied.
- Width of one surface of the light-emitting diode unit 10 b Distance from the center of the glass bulb 21 to the light-emitting diode 11
- the inner surface of the glass cover is in close proximity of 5mm or less with light-emitting diodes 11 mounted on the side surfaces of the prismatic or cylindrical support member 13 of the light-emitting diode unit 10 it is possible for heat to be dissipated efficiently from the side surfaces of the light-emitting diode unit 10, and it is possible to provide a light-emitting diode lamp 20 having a longer operating life.
- the support member 13 is made of metal, heat generated by the light-emitting diodes 11 can be effi- ciently absorbed and dissipated.
- Figure 35 is a conceptual diagram showing comparative example 1 of the silicone injection method.
- Figure 39 is an illustration of the support member 13 of the light-emitting diode unit 10, in an unfolded state.
- Figure 39 The difference between Figure 39 and Figure 7 lies in the existence of U-shaped incisions 218 and semicircular incisions 219.
- the incisions 218 and 219 have the advantage of facilitating folding when folding the support member and the advantage of facilitating positioning during folding.
- the incisions 218 and 219 are U-shaped and semicircular, but they may also be triangular, rectangular, circular or trapezoidal .
- Figure 40 is a drawing illustrating the flare tube 22.
- the flare tube 22 is glass.
- Two lead wires 17 penetrate through the flare tube 22.
- An axial support strut 15 is embedded at the center of one end of the flare tube 22.
- An exhaust tube 221 extends from the center of the other end of the flare tube 22 toward the axial support strut 15. The exhaust tube 221 penetrates the middle of the flare tube 22, but it is bent obliguely ahead of the axial support strut forming an exhaust port 222.
- the light-emitting diode unit 10 is inserted into a test tube-shaped glass bulb 21, the outer circumference of the flare tube 22 and the inner circumference of the glass bulb 21 are fused together, and the glass bulb 21 is sealed. This completes the assembly process S20.
- the diameter of the dispenser injection needle depends on the diameter of the exhaust tube 221 being used.
- a thicker dispenser injection needle is advantageous in terms of sili ⁇ cone injection, but because the gap to the tip tube is narrowed, it becomes impossible to exhaust the air.
- the range of outer diameter of the dispenser injection needle is be- tween a minimum outer diameter of ⁇ 0.5mm (minimum inner diameter of ⁇ 0.2mm) and a maximum outer diameter of ⁇ 4.5mm (minimum outer diameter of ⁇ 4.0mm), based on the relationship with the abovementioned exhaust tube 221.
- an injection needle having an outer diameter that is smaller than the inner diameter of the exhaust tube 221 is inserted into the exhaust tube 221 and the thermally conductive medium is injected in- to the glass bulb through the injection needle, and injection of the thermally conductive medium by means of the injection needle and exhaustion by means of the exhaust tube 221 are performed simultaneously.
- the silicone 290 which is injected may be colorless and transparent, or it may be a colored silicone, or it may be a hybrid silicone comprising silicone and another substance such as an epoxy. Also, in order to increase heat dissipation characteristics further, heat dissipating silicone into which metal particles have been mixed, having excellent heat dissipation characteristics, may be used.
- the length LI of the outer bulb 211 is greater than the length L2 of the inner bulb 212.
- Figure 53 is a dimensioned drawing of the light-emitting diode lamp 20 of embodiment 7.
- the difference compared with Figure 14 lies in the addition of the following dimensions which relate to the outer bulb 211 and the inner bulb 212.
- the method of manufacturing a light-emitting lamp of embodiment 7 is characterized in that it is provided with a process Sll in which a glass bulb 21 having a double tube section is manufactured,
- the light-emitting diode unit 10 is manufactured by following the processes explained in embodiments 1 to 5.
- the pyramid 18 is not prepared.
- the metal base plate 299 is also not used.
- DC circuit and has two output terminals which output to two cables a constant direct current of approximately 20V- 700mA or 40V-350mA or 80V-200mA, from the 100V or 200V alternating-current commercial power supply.
- an existing HID lamp street light can be modified to a light-emitting diode lamp street light with the minimum of work, and by reusing existing equipment.
- components of the existing street light are reused as far as possible, and conversion to an energy-efficient LED lamp is possible.
- a glass bulb 21 envelops a portion of a support member 13 of a light-emitting diode unit 10, and another portion of the support member 13 is exposed to the atmosphere. There is an opening in the top portion of the glass bulb 21, and the other portion of the support member 13 of the light-emitting diode unit 10 is exposed and protrudes through the opening.
- the section in which light-emitting diodes 11 exist is en- veloped by the glass bulb 21. Only the support member 13 is exposed and protrudes.
- the support member 13 is a metal such as aluminum, and heat dissipation characteristics are im- proved by the end portion of the support member coming into direct contact with the atmosphere.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
[Problem] To provide a light-emitting diode lamp with which it is possible to obtain a broader light distribution and light emission intensity in the length direction of the lamp, and with which heat can be dissipated efficiently and which therefore has a longer operating life. [Means of overcoming the problem] A light-emitting diode lamp (20) is provided with a light-emitting diode unit (10) in which light-emitting diodes (11) are mounted on the side surfaces of a prismatic support member (13), and a cylindrical glass bulb (21) having a prescribed bulb diameter, inside which the abovementioned light-emitting diode unit (10) is arranged, and if the width w of one side surface of the above-mentioned support member (13) is fixed at a prescribed width w, the distance k from the center of one side surface of the abovementioned support member (13) to the inner surface of the bulb is fixed at a prescribed distance, and the cross- section through the abovementioned prismatic support member (13) is a regular n-sided polygon, then the abovementioned n is a value whereby the abovementioned light-emitting diode unit (10) can be arranged inside a cylindrical bulb having the abovementioned prescribed bulb diameter, and is a value which is determined based on the abovementioned prescribed bulb diameter, prescribed width and prescribed distance.
Description
Description
Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp
[Technical field]
[0001]
The present invention relates for example to LED (light- emitting diode element) bulbs for street lighting. In particular the present invention aims to obtain an LED bulb having a broad distribution of light similar to that of HID lamps (High Intensity Discharge lamps) used for street ligh- ting and for security lighting.
[Background art]
[0002]
(1) Conventional HID lamp:
A. The emitted luminous flux is large and broad, and can illuminate a long distance, and these lamps are therefore used widely in outdoor applications such as street lighting and security lighting. Further, they are used in both base- down and base-up fixtures.
B. Power consumption is high and operating life is short (approximately 10,000 hours).
C. Light emission is through mercury discharge, and so it takes time for the mercury in the light-emitting tube to vaporize and for the brightness to stabilize.
[0003]
(2) Bulb-shaped LED:
A. Good light directionality, suitable for illuminating in a fixed direction, such as improving directly-downward illumination intensity in the downward direction (Patent literature article 1: Japanese Patent Kokai 2009-4130) .
In this case, it is sufficient to install a few lamps, the amount of heat generated by the LED itself is low, and an operating life that is long compared with discharge lamps
such as HID lamps, approximately 40,000 hours, can be maintained.
[0004]
B. Lamps such as the following have been devised as LED lamps to replace conventional HID lamps for outdoor use.
Compatibility with conventional discharge lamps is achieved easily by filling a glass bulb 21 with an inert gas and sealing it, and then fitting a screw-shaped cap 23, in the same way as with a conventional discharge lamp, while at the same time the radiation angle of the LED light is extended by providing a concave mirror behind the LED (Patent literature article 2: Japanese Patent Kokai 1987-124781) .
[Prior art literature]
[Patent literature]
[0005]
[Patent literature article 1] Japanese Patent Kokai 2009- 4130
[Patent literature article 2] Japanese Patent Kokai 1987- 124781
[Patent literature article 3] Japanese Patent Kokai 2010-
55993
[Patent literature article 4] Japanese Patent Kokai 2010- 182796
[Summary of the invention]
[Problems to be resolved by the invention]
[0006]
A. In street lighting and security lighting fixtures which are in widespread use, in order to illuminate outdoors broadly and for a long distance, as with conventional HID lamps, by exchanging only the lighting device and using the reflector plate and lamp holder without modification, the light distribution and light emission intensity must not in practical terms be inferior to those of an HID lamp.
B. If the light distribution is not oriented, but the light from the light-emitting diodes 11 is distributed in approxi¬ mately all directions then the lamp is not only applicable to street lights which are lit in a substantially horizontal
direction and which predominantly illuminate a lower surface, but also to base-down and base-up fixtures.
C. With the LED lamp in patent literature article 2 it is difficult to obtain a light distribution and light emission intensity that are comparable to an HID lamp, and it is necessary to increase the number of LEDs significantly and to orient the LED light in all directions, as with an HID lamp.
D. By grouping a large number of LEDs together the inside of the lamp becomes hot, the LEDs deteriorate rapidly, and it is difficult to maintain an operating life such as that of an LED lamp such as that in Patent literature article 1. Further, if a metal heat dissipator such as that in Patent literature article 1 is installed on the lower surface of the LED substrate in order to allow heat generated by the LEDs to escape, then because there is a large number of LEDs and the LEDs are arranged along an elongated cylindrical bulb, not only is the heat dissipator heavy, but also the heat dissipation efficiency deteriorates as the length of the elongated arrangement increases.
E. In order to orient the LED light in all directions as in an HID lamp, using a large number of LEDs, LEDs must be arranged so that they are distributed in the length direction and the circumferential direction of the lamp, and both the material cost and the manufacturing cost of manufacturing an LED substrate having such a shape are high.
[Means of overcoming the problem]
[0007]
The light-emitting diode lamp according to the present invention is characterized in that it is provided with a light-emitting diode unit in which light-emitting diodes are mounted on the side surfaces of a prismatic support member, and a cylindrical bulb having a prescribed bulb diameter, inside which the abovementioned light-emitting diode unit is arranged,
and in that if the width w of one side surface of the abo¬ vementioned support member is fixed at a prescribed width,
the distance Ak from the center of one side surface of the abovementioned support member to the inner surface of the bulb is fixed at a prescribed distance,
and the cross-section through the abovementioned prismatic support member is a regular n-sided polygon, then the above- mentioned n is a value whereby the abovementioned light- emitting diode unit can be arranged inside a cylindrical bulb having the abovementioned prescribed bulb diameter, and is a value which is determined based on the abovementioned prescribed bulb diameter, prescribed width and prescribed distance .
[0008]
A characteristic is that light-emitting diodes are arranged in a row in the axial direction of the abovementioned sup- port member on the side surfaces of the abovementioned support member,
the circumcircle of the abovementioned regular polygon is arranged concentrically with the abovementioned cylindrical bulb,
and the abovementioned n is the largest value whereby the abovementioned light-emitting diode unit can be arranged inside the cylindrical bulb having the abovementioned prescribed bulb diameter.
[0009]
A characteristic is that the abovementioned support member is formed into a three-dimensional prismatic shape by folding an integrated sheet, forming a plurality of surfaces.
[0010]
A characteristic is that the width w of a side surface of the abovementioned support member is between 5mm and 20mm.
[0011]
A characteristic is that the abovementioned distance Ak is between 1mm and 6mm.
[0012]
A characteristic is that the side surfaces of the abovemen¬ tioned support member also function as light-emitting diode element substrates, and the light-emitting diodes are mounted directly on the outer surface of the support member.
[0013]
A characteristic is that the abovementioned light-emitting diode unit is configured by affixing light-emitting diode element substrates to the plurality of surfaces of the abo- vementioned support member.
[0014]
A characteristic is that the width of the abovementioned light-emitting diode element substrates is approximately 10mm.
[0015]
A characteristic is that the abovementioned light-emitting diode element substrates are ribbon-shaped flexible substrates .
[0016]
A characteristic is that the bottom surface of the above- mentioned polygonal prism is a polygon comprising a regular n-sided polygon of which a portion of the vertices has been omitted .
[0017]
A characteristic is that the abovementioned support member
13 is made of metal.
[0018]
A characteristic is that the height of the abovementioned support member is larger than the diameter of the circumcir- cle of the abovementioned support member.
[0019]
A characteristic is that shape of the top portion of the abovementioned support member is a polygonal pyramid shape or a trapezoidal polygonal pyramid shape, and light-emitting diodes are arranged on each surface of the abovementioned polygonal pyramid shape.
[0020]
The lighting fixture according to the present invention is characterized by being provided with the abovementioned light-emitting diode lamp and a lighting device.
[0021]
The light-emitting diode lamp according to the present invention is characterized in that it is provided with a
light-emitting diode unit on which light-emitting diodes are mounted,
a housing having a glass cover which envelops the light emitting surface of the abovementioned light-emitting diode unit and which is arranged inside the light-emitting diode unit,
and a thermally conductive medium with which a gap between the light emitting surface of the abovementioned light- emitting diode unit and the inner surface of the glass cover is filled.
[0022]
A characteristic is that the abovementioned thermally conductive medium is either a thermally conductive medium comprising a silicone resin that is transparent and electri- cally insulating, or a thermally conductive medium containing the abovementioned silicone resin.
[0023]
The method of manufacturing a light-emitting lamp according to the present invention is a method of manufacturing a light-emitting lamp in which the inside of a glass bulb is filled with a thermally conductive medium, characterized in that it is provided with
an assembly process in which a flare tube with an attached exhaust tube is fused to a glass bulb,
after the assembly process, a filling process in which the inside of the glass bulb is filled through the exhaust tube with a thermally conductive medium,
after the filling process, an exhaust process in which gas within the glass bulb is drawn from the exhaust tube by vac- uum,
and after the exhaust process, a tip-off process in which the exhaust tube is sealed.
[0024]
A characteristic is that in abovementioned filling process an injection needle having an outer diameter that is smaller than the inner diameter of the exhaust tube is inserted into the exhaust tube and the thermally conductive medium is injected into the glass bulb through the injection needle,
and injection of the thermally conductive medium by means of the injection needle and exhaustion by means of the exhaust tube are performed simultaneously.
[0025]
A characteristic is that in abovementioned filling process an injection needle that is longer than the exhaust tube is inserted through the exhaust tube, and a thermally conductive medium is injected into the glass bulb through the injection needle.
[0026]
A characteristic is that in abovementioned filling process a thermally conductive medium having a viscosity of 100 pascal seconds or less is injected.
[0027]
A characteristic is that in the abovementioned sealing process
an exhaust tube having an outer diameter of 4mm or more and 8mm or less, an inner diameter which is smaller than the outer diameter of the tube and which is 0.7mm or more and 5.0mm or less, and a length of 30mm or more and 200mm or less is fitted.
[0028]
A characteristic is that in abovementioned filling process a thermally conductive medium is injected into the inside of the glass bulb using an injection needle having an outer diameter which is smaller than the inner diameter of the exhaust tube and is 0.5mm or more and 4.5mm or less, and an inner diameter which is smaller than the outer diameter of the needle and is 0.2mm or more and 4.0mm or less.
[0029]
A characteristic is that the abovementioned exhaust process comprises a vacuum drawing process in which vacuum drawing is performed with a vacuum degree of 30.3 kilopascals or more and 101.3 kilopascals or less.
[0030]
A characteristic is that the abovementioned exhaust process is further comprises a replacement process in which gas inside the glass bulb is replaced with an inert gas
and the vacuum drawing process and replacement process are repeated a plurality of times.
[0031]
The light-emitting diode lamp according to the present in- vention is characterized in that it is provided with a light-emitting diode unit which is provided with a cylindri- cally shaped cylinder portion on which light-emitting diodes are arranged,
an inner bulb provided inside the cylinder portion of the light-emitting diode unit, and an outer bulb provided out¬ side the cylinder portion of the light-emitting diode unit.
[0032]
A characteristic is that the cylinder portion of the above- mentioned glass bulb is arranged in the space between the outer bulb and the inner bulb,
and the abovementioned light-emitting diode unit is enclosed in the abovementioned glass bulb.
[0033]
A characteristic is that the abovementioned inner bulb is a glass bulb in the shape of a bottomed cylinder which is open at one end and closed at the other end and which has a hollow section at its center,
and the abovementioned outer bulb is a cylindrical glass bulb which is longer than the inner bulb,
and the abovementioned glass bulb is provided with an annular end portion where one end of the inner bulb is attached in a sealed fashion to one end of the outer bulb, and a sea¬ ling portion where the other end of the outer bulb is sealed.
[0034]
The abovementioned light-emitting diode lamp is further characterized in that
a heat dissipating member is provided in the hollow section of the abovementioned inner bulb.
[0035]
The abovementioned light-emitting diode lamp is further characterized in that
a heat dissipating member is provided on at least the inner surface or the outer surface of the abovementioned outer bulb .
[0036]
The method of manufacturing a light-emitting diode lamp according to the present invention is characterized in that it is provided with a process in which a glass bulb having a double tube section is manufactured,
a process in which a light-emitting diode unit provided with a cylindrical cylinder portion on which light-emitting elements are arranged is manufactured,
a process in which light-emitting elements are arranged in the space within the double tube section of the abovementioned glass bulb,
and a process in which the abovementioned glass bulb is sealed.
[0037]
A characteristic is that the process in which the abovemen¬ tioned glass bulb is manufactured comprises a process in which an inner bulb in the shape of a bottomed cylinder one end of which is open, the other end of which is closed and which has at its center a hollow section is inserted into a cylindrical outer bulb which is open at both ends and which is longer than the inner bulb, and one end of the inner bulb is attached in a sealed fashion to one end of the outer bulb,
the process in which the abovementioned light-emitting ele¬ ments are arranged comprises a process in which the light- emitting diode unit provided with a cylindrical cylinder portion on which light-emitting elements are arranged is inserted into the other end of the outer bulb, and the cylin¬ der portion is arranged in the space between the outer bulb and the inner bulb,
and the process in which the abovementioned glass bulb is sealed comprises a process in which the other end of the ou¬ ter bulb is sealed.
[0038]
The street light according to the present invention is characterized in that it is provided with a light-emitting di¬ ode lamp having an E-type cap,
an E-type socket to which the E-type cap of the light- emitting diode lamp fits, fixing the light-emitting diode lamp, and which supplies power to the E-type cap of the light-emitting diode lamp,
two in-support-post electric cables connected to the E-type socket,
a direct-current power supply which supplies direct-current power to the two in-support-post electric cables,
and a support post within which the in-support-post electric cables are housed, and which has in its lower portion a power supply arrangement portion in which the direct-current power supply is arranged, and which is provided in its upper portion with a socket arrangement portion in which the E- type socket is arranged.
[0039]
A characteristic is that each of the abovementioned two in- support-post electric cables is a cable having a cross sectional area of at least 2.0 square mm.
[0040]
A characteristic is that the abovementioned two in-support- post electric cables are cables which will not suffer insu- lation breakdown even when conducting an alternating current of 1000V or more.
[0041]
A characteristic is that the abovementioned light-emitting diode lamp is an electrically insulated lamp in which an electrical circuit is hermetically sealed by means of a glass bulb.
[0042]
The method of exchanging a lamp according to the present invention is a method of exchanging a lamp of a street light employing a high-intensity discharge lamp having an E-type cap, characterized in that it is provided with
a lamp exchange process in which a high-intensity discharge lamp having an E-type cap is exchanged for a light-emitting diode lamp having an E-type cap,
and a power supply exchange process in which an alternat- ing-current stabilizer which supplies power to the high- intensity discharge lamp is exchanged for a direct-current power supply which supplies power to the light-emitting diode lamp.
[0043]
A characteristic is that in the abovementioned lamp ex¬ change process the E-type socket is not exchanged, and a light-emitting diode lamp having an E-type cap is fitted to the E-type socket which has not been exchanged,
and in the abovementioned power supply exchange process the in-support-post electric cables are not exchanged, and the direct-current power supply is connected to the in-support- post electric cables which have not been exchanged.
[0044]
The light-emitting diode lamp according to the present in- vention is characterized in that it is provided with a light-emitting diode unit having light-emitting diodes and a support member on which the light-emitting diodes are mounted,
a glass bulb which envelops a portion of the support member of the abovementioned light-emitting diode unit and from an opening of which another portion of the support member is exposed to the atmosphere,
and a sealing portion where the opening of the abovementioned glass bulb and the support member are sealed.
[0045]
The light-emitting diode lamp according to the present invention is characterized in that it is provided with a light-emitting diode unit having light-emitting diodes, a glass bulb which envelops the abovementioned light- emitting diode unit,
and a metal fin fitted to the perimeter of the abovementioned glass bulb.
[Advantages of the invention]
[0046]
According to the present invention, the width of the side surfaces of the support member and the distance from the light-emitting diodes arranged on the side surfaces to the inner surface of the glass bulb are maintained as fixed values, and it is thus possible to obtain a light-emitting di¬ ode lamp with which heat from the light-emitting diodes can be efficiently allowed to escape to the glass bulb, which is low-cost and is highly compatible with lighting fixtures, and which has a long operating life
[Brief explanation of the figures]
[0047]
[Figure 1] Front side view of the light-emitting diode unit 10 of embodiment 1.
[Figure 2] Plan view of the light-emitting diode unit 10 of embodiment 1.
[Figure 3] Front side view of the light-emitting diode lamp 20 of embodiment 1.
[Figure 4] Plan view of the light-emitting diode lamp 20 of embodiment 1.
[Figure 5] Front side view of the light-emitting diode lamp 20 of embodiment 1 without the cap 23.
[Figure 6] Diagram illustrating the variation in color tem¬ perature of the light-emitting diode lamp 20 of embodiment 1.
[Figure 7] Illustration of the support member 13 of the light-emitting diode unit 10 of embodiment 3, in an unfolded state .
[Figure 8] Front side view of the support member 13 of the light-emitting diode unit 10 of embodiment 3.
[Figure 9] Plan view of the support member 13 of the light- emitting diode unit 10 of embodiment 3.
[Figure 10] Front side view of the light-emitting diode unit 10 of embodiment 3.
[Figure 11] Plan view of the light-emitting diode unit 10 of embodiment 3.
[Figure 12] Front side view of the light-emitting diode lamp 20 of embodiment 3.
[Figure 13] Plan view of the light-emitting diode lamp 20 of embodiment 3.
[Figure 14] Dimensioned drawing of the light-emitting diode lamp 20 of embodiment 3.
[Figure 15] Diagram showing Table 1, Table 2 and Table 3 of embodiment 3.
[Figure 16] Diagram showing Table 4 of embodiment 3.
[Figure 17] Plan view of the light-emitting diode lamp 20 of embodiment 3 with a light-emitting diode unit 10 in the shape of a hexagonal prism.
[Figure 18] Diagram showing Table 5 of embodiment 3.
[Figure 19] Diagram showing tables of comparative examples in embodiment 3.
[Figure 20] Front side view of the light-emitting diode unit 10 of embodiment 4.
[Figure 21] Plan view of the light-emitting diode unit 10 of embodiment 4.
[Figure 22] Front side view of the light-emitting diode lamp 20 of embodiment 4.
[Figure 23] Plan view of the light-emitting diode lamp 20 of embodiment 4.
[Figure 24] Diagram showing Table 6 of embodiment 4.
[Figure 25] Diagram showing a graph of h/D against bulb surface temperature from Table 6 of embodiment 4.
[Figure 26] Diagram showing Table 7 of embodiment 4.
[Figure 27] Diagram showing a graph of h/D against bulb surface temperature from Table 7 of embodiment 4.
[Figure 28] Diagram showing Table 8 of embodiment 4.
[Figure 29] Diagram showing a graph of Ad against bulb surface temperature from Table 8 of embodiment 4.
[Figure 30] Diagram illustrating the light-emitting diode lamp 20 of embodiment 5 with an octagonal prismatic support member 13.
[Figure 31] Diagram illustrating the light-emitting diode lamp 20 of embodiment 5 with a hexagonal prismatic support member 13.
[Figure 32] Diagram illustrating a lighting fixture equipped with the light-emitting diode lamp 20 of embodiment 5.
[Figure 33] Diagram illustrating a lighting fixture equipped with the light-emitting diode lamp 20 of embodiment 5.
[Figure 34] Diagram illustrating a lighting fixture equipped with the light-emitting diode lamp 20 of embodiment 5.
[Figure 35] Conceptual diagram showing comparative example
1 of the silicone injection method in embodiment 6.
[Figure 36] Conceptual diagram showing comparative example
2 of the silicone injection method in embodiment 6.
[Figure 37] Conceptual diagram showing the silicone injec- tion method in embodiment 6.
[Figure 38] Flow diagram illustrating the method of manufacturing the light-emitting diode lamp 20 in embodiment 6 (silicone injection method) .
[Figure 39] Illustration of the support member 13 of the light-emitting diode unit 10, in an unfolded state.
[Figure 40] Drawing illustrating the flare tube 22.
[Figure 41] Drawing illustrating the state upon completion of the assembly process S20.
[Figure 42] Drawing illustrating the state during silicone injection.
[Figure 43] Drawing illustrating a light-emitting diode 11 enveloped in silicone 290 between the support member and the glass bulb 21.
[Figure 44] Drawing illustrating a glass sheet 240 adhered to the outer surface of a light-emitting diode 11 package.
[Figure 45] Perspective view of the glass bulb 21 in embodiment 7.
[Figure 46] Perspective view of the glass bulb 21 in embodiment 7.
[Figure 47] Cross sectional view of the glass bulb 21 in embodiment 7, through AA in Figure 45.
[Figure 48] Front side view of the light-emitting diode unit 10 of embodiment 7.
[Figure 49] Plan view of the light-emitting diode unit 10 of embodiment 7.
[Figure 50] Front side view of the light-emitting diode lamp 20 of embodiment 7.
[Figure 51] Plan view of the light-emitting diode lamp 20 of embodiment 7.
[Figure 52] Front side view of the light-emitting diode lamp 20 of embodiment 7 without the cap 23.
[Figure 53] Dimensioned drawing of the light-emitting diode lamp 20 of embodiment 7.
[Figure 54] Diagram illustrating the method of manufacturing the light-emitting diode lamp of embodiment 7.
[Figure 55] Diagram illustrating an example of a street light in embodiment 8.
[Figure 56] Comparison of specifications of street lights employing HID lamps and street lights employing LED lamps.
[Figure 57] Comparison of results using the correct combination of lamp and power supply.
[Figure 58] Comparison of results using the incorrect combination of lamp and power supply.
[Figure 59] Diagram illustrating an example of a light- emitting diode lamp 20 with improved heat dissipation characteristics in embodiment 9.
[Figure 60] Diagram illustrating another example of a light-emitting diode lamp 20 with improved heat dissipation characteristics in embodiment 9.
[Modes of embodying the invention]
[0048]
Embodiment 1.
(1) First embodiment (Figure 1 to Figure 6)
Figure 1 shows a front side view of a light-emitting diode unit 10, and Figure 2 shows a plan view thereof.
A light-emitting diode unit 10 is provided with an aluminum octagonal prismatic support member 13. The support member 13 is a retaining member which retains light-emitting diodes 11. The light-emitting diode unit 10 is provided at the top portion of the support member 13 with a trapezoidal pyramid 18 having eight surfaces.
[0049]
Ribbon-shaped flexible substrates 12 (light-emitting diode substrates) each of which is equipped with one light- emitting diode 11 are affixed to the eight surfaces of the
pyramid 18 using heat-resistant adhesive. Further, ribbon- shaped flexible substrates 12 (light-emitting diode sub¬ strates) each of which are equipped with three light- emitting diodes 11 are affixed to the eight side surfaces of the octagonal prism using heat-resistant adhesive.
[0050]
A pair of base portion support struts 14 are fitted in the axial direction of the octagonal prism to the base portions of one side surface of the octagonal prism and the opposing side surface thereof (the base portions on the cap 23 side of a pair of opposing side surfaces) . Further, an axial support strut 15 is also fitted in the axial direction of the octagonal prismatic support member 13, at the center of the bottom surface of the octagonal prism.
[0051]
Lead wires 17 through which a direct current enters and leaves the light-emitting diodes 11 are led out from the bottom surface of the octagonal prismatic support member 13.
[0052]
These three support struts are linked to a separate linking support strut 16 that is oriented in a direction that is perpendicular to the axial direction of the octagonal prismatic support member 13.
Each of these support struts is made from stainless steel.
[0053]
For example, the diameter of the circumcircle of the bottom surface of the octagonal prismatic support member 13 is 50mm, and the height of the section of the octagonal prismatic support member 13 not including the cone section is 150mm.
The substrates equipped with light-emitting diodes 11 are the flexible substrates 12. The flexible substrates 12 are equipped with the light-emitting diodes 11, and the flexible substrates 12 are affixed to an aluminum substrate. A poly- hedral structure in the shape of a prism is formed by link¬ ing the oblong substrates. By arranging that the top portion of the polyhedral structure in the shape of a prism is in the shape of a pyramid, it can be made to conform to a hemi-
spherical or dome-shaped top portion of a glass bulb 21. A light-emitting diode 11 may be arranged on the pyramid- shaped section. The angle of bend of the pyramid-shaped section is determined according to the radius R of the top por- tion of the glass bulb 21.
[0054]
Figure 3 shows a front side view of a light-emitting diode lamp 20, and Figure 4 shows a plan view thereof. Figure 5 shows a front side view without the cap 23.
The light-emitting diode lamp 20 is provided with a housing
24. The housing 24 is provided with a glass bulb 21 and a flare tube 22. All of the housing 24 is transparent. Alternatively, the lower portion of the housing 24 where light- emitting diodes 11 are not arranged may be non-transparent. The glass bulb 21 is in the shape of a cylinder having a hemispherical upper portion.
[0055]
The light-emitting diode unit 10 is inserted into the glass bulb 21. A transparent thermally conductive silicone resin (silicone rubber KE109 manufactured by Shin-Etsu Silicone; not shown in the diagrams) fills the space between the glass bulb 21 and the light-emitting diode unit 10 from the inner surface of the hemispherical top portion of the glass bulb 21 to the height of the bottom surface of the octagonal prismatic support member 13 of the light-emitting diode unit 10.
[0056]
The flare tube 22 is a glass sealing portion which is fusion bonded to the end portion of the glass bulb 21. The ax- ial support strut 15 which leads out from the center of the bottom surface of the octagonal prismatic support member 13 in the axial direction of the octagonal prismatic support member 13 is implanted in the flare tube 22 such that the end portion of the axial support strut 15 becomes embedded when the flare tube 22 is pinched. The lead wires 17 which lead out from the bottom surface of the octagonal prismatic support member 13 are implanted in the flare tube 22 such that the end portions of the lead wires 17 lead out from the
end portion of the flare tube 22 when the glass flare tube 22 which is fusion bonded to the end portion of the glass bulb 21 is pinched.
[0057]
When the tip tube at the end portion of the glass bulb 21 is sealed, air inside the bulb is replaced by filling it with nitrogen gas.
[0058]
The two lead wires 17 are wired to an E39 cap 23 that is installed at the end portion of the glass bulb 21.
[0059]
As shown in Figure 6, lamps filled with thermally conductive silicone resin have a higher color temperature than those which are not filled (filled only with nitrogen), and the lamp color is shifted in the blue direction and appears brighter. Also, because the color temperature of the lamp is raised it is possible to use a light-emitting diode 11 that has a lower color temperature. By this means it is possible to reduce the amount of yellow YAG phosphor used, this being a cause of deterioration in the most typical type of pseudo- white light-emitting diode 11 comprising a blue light- emitting diode 11 to which yellow YAG phosphor is applied.
[0060]
With regard to the reason why the color of the lamp shifts in the blue direction when the lamp is filled with thermally conductive silicone resin, it is thought that this is due to absorption of colors from infra-red to red by organic sub¬ stances such as silicone resin, although this is not certain .
[0061]
It should be noted that an E39 cap 23 is used for the cap 23, but an E26 cap 23 compatible with HID lamps may also be used .
[0062]
Embodiment 2.
(2) Second embodiment (no diagrams)
Instead of the transparent thermally conductive silicone resin used in the first embodiment, filling may be performed
using a perfluorocarbon liquid, as a transparent thermally conductive liquid. Perfluorocarbon liquids have a high den¬ sity and efficiently absorb heat generated by the light- emitting diodes 11 and transfer it to the glass bulb 21.
Perfluorocarbon liquids are electrically insulating liquids, and so there is no danger of shorting even if the liquid co¬ mes into contact with wiring such as the lead wires 17.
[0063]
As shown in Figure 6, lamps filled with a perfluorocarbon liquid have a higher color temperature than those which are not filled (filled only with nitrogen) , and the lamp color is shifted in the blue direction and appears brighter. Also, because the color temperature of the lamp is raised it is possible to use a light-emitting diode 11 that has a lower color temperature. By this means it is possible to reduce the amount of yellow YAG phosphor used, this being a cause of deterioration in the most typical type of pseudo-white light-emitting diode 11 comprising a blue light-emitting diode 11 to which yellow YAG phosphor is applied.
[0064]
With regard to the reason why the color of the lamp shifts in the blue direction when the lamp is filled with a per- fluorocarbon liquid, it is thought that this is due to ab¬ sorption of colors from infra-red to red by the perfluoro- carbon liquid, although this is not certain.
[0065]
The lamp is filled, for example, with 'Fluorinert' ('Fluo- rinert' is a registered trade mark) FC-3283 manufactured by Sumitomo 3M Ltd, which has a density of 1.83 (kg/m3 @25°C) , a specific heat of 1.050 (J/kgK @25°C) , a dielectric strength of 43kV(2.54mm Gap @25°C) , and a conductivity of 1.91kV (@25°C) [1kHz] .
[0066]
It should be noted that perfluorocarbon liquids are trans- parent and electrically insulating, and if the density is higher than that of water and the specific heat is similar to that of water then the liquid can directly cool the light-emitting diode substrate while electricity is being
conducted, and also heat dissipation efficiency is better than with cooling water, and so a density of 1.5 (kg/m3@25°C) or more is sufficient.
[0067]
' Fluorinert ' ( ' Fluorinert ' is a registered trade mark) FC-
72 manufactured by Sumitomo 3M Ltd, which has a density of 1.68 (kg/m3 @25°C) , a specific heat of 1.050 (J/kgK @25°C) , a dielectric strength of 38kV(2.54mm Gap @25°C) , and a conductivity of 1.76kV (@25°C) [1kHz] may for example also be used.
[0068]
Embodiment 3.
(3) Third embodiment (Figure 7 to Figure 13)
An explanation will now be given regarding the differences compared with embodiments 1 and 2.
Figure 7 shows an illustration of a support member 13 of a light-emitting diode unit 10 in an unfolded state.
Figure 8 and Figure 9 show a front side view and a plan view of the light-emitting diode unit 10.
[0069]
As shown in the drawings, the support member 13 is formed into a three-dimensional shape by folding an integrated aluminum sheet, forming a plurality of surfaces. The thermal conductivity is improved by forming the support member by folding an integrated sheet.
[0070]
Figure 10 shows a front side view of the light-emitting di¬ ode unit 10, and Figure 11 shows a plan view thereof.
[0071]
The aluminum octagonal prismatic support member 13 is provided at its top portion with an aluminum octagonal pyramid.
Four of the eight surfaces of the octagonal pyramid are each equipped with one light-emitting diode 11. Further, each of the eight surfaces of the octagonal prismatic sup- port member 13 is equipped with a row of three light- emitting diodes 11.
The abovementioned support member 13 is treated such that it is electrically insulating, and it also functions as the light-emitting diode substrate.
[0072]
Figure 12 shows a front side view of a light-emitting diode lamp 20, and Figure 13 shows a plan view thereof.
[0073]
The light-emitting diode unit 10 is inserted into a cylindrical glass bulb 21 having a hemispherical upper portion, and a transparent thermally conductive medium (not shown in the diagrams) which fills the space between the glass bulb 21 and the light-emitting diode unit 10 is the same as in embodiments 1 and 2.
[0074]
The width w, in a direction perpendicular to the axis of the octagonal prismatic support member 13, of the side surfaces of the octagonal prismatic support member 13 of the abovementioned lamp (the width w of one side surface of the octagonal prism) is 17.15mm; the distance Ak from the point at which a line extending perpendicular to a side surface of the octagonal prismatic support member 13 from the center of a cross section through the cylindrical bulb intersects the side surface of the octagonal prismatic support member 13, to the point at which the perpendicularly extended line in- tersects the inner surface of the bulb (the distance Ak from the center of one surface of the abovementioned support member 13 to the inner surface of the bulb) is 2.4mm; and the internal bulb diameter of a glass bulb 21 having an E39 cap 23 specification is 48mm.
[0075]
The diameter d of the circumcircle of the octagon is
44.8mm, and the height h of the octagonal prismatic support member 13 is 110mm.
[0076]
(Determining n for the polygon)
A polygon is selected which satisfies the following criteria: the width w of a side surface of the polygonal prism in a direction perpendicular to the axis of the polygonal prism
is 17.15mm; the distance Ak from the point at which a line extending perpendicular to a side surface of the polygonal prism from the center of a cross section through the cylindrical bulb intersects the side surface of the polygonal prism, to the point at which the perpendicularly extended line intersects the inner surface of the bulb is 3.0mm; and the internal diameter D of a glass bulb 21 which is compatible with an HID lamp having an E39 cap 23 specification is 48mm.
[0077]
The meaning of the symbols in the dimensioned drawing in Figure 14 are as follows.
D: Internal diameter of the glass bulb 21
d: Diameter of the circumcircle of the light-emitting diode unit 10
w: Width of one surface of the light-emitting diode unit 10 b: Distance from the center of the glass bulb 21 to the light-emitting diode 11
Ar: Difference between the inner diameter D of the glass bulb 21 and the diameter d of the circumcircle
Ak: Distance in the radial direction from the light- emitting diode 11 to the inner surface of the glass bulb 21
Ag: Distance in the radial direction from the light- emitting diode 11 to the circumcircle
The width w of one side surface of the light-emitting diode unit 10 is equal to or greater than the size in the width direction of the light-emitting diode 11, and is equal to or greater than a width that permits wiring of signal wires. Further, if a flexible substrate is to be affixed, the width w is equal to or greater than the width of the flexible substrate and is equal to or greater than a width that permits wiring of signal wires.
[0078]
If the width w is increased then n decreases, with the fol- lowing merits.
1. The number of folds of the support member 13 decreases.
2. Positioning the pyramid 18 at the top portion is simpler .
[0079]
If the width w is decreased then n increases, with the fol¬ lowing merits .
1. The light-emitting diodes 11 move closer to the inner surface of the glass bulb 21.
2. Heat dissipation effects are increased (embodiment 4 de¬ scribed hereinbelow) .
[0080]
The diameter d of the circumcircle of the n-sided polygon having sides of a length equal to the width w of a side sur¬ face of the polygonal prism in a direction perpendicular to the axis of the polygonal prism can be expressed, based on the following equation,
Sin (180°/n) =w/d
as
d=w/Sm (180°/n) .
[0081]
The difference Ag between (d/2) and the distance b between the center of the polygon and the point at which a line ex- tending from the center perpendicular to a side of the polygon intersects the side can be expressed, based on the following equations,
Ag=d/2-b
b=V( (d/2)2- (w/2)2)
as
Ag=(d/2)-V( (d/2) 2- (w/2) 2)
[0082]
The distance Ar between the inner circumference of the bulb and the circumference of the circumcircle of the polygon, arranged concentrically, can be expressed as
Ar=Ak-Ag
[0083]
For a given value of w, the internal diameter D of a bulb satisfying Ak can be expressed as follows
D=d+2Ar
=d+2 (Ak-Ag)
=d+2 (Ak- (d/2) +V ( (d/2) 2- (w/2) 2) )
=d+2Ak-d+2V ( (d/2) 2- (w/2) 2)
=2Ak+2 ( (d/2) 2- (w/2) 2)
=2Ak+2 ( (w/2 Sin (180°/n) ) 2- (w/2) 2)
[0084]
This equation shows that the internal diameter D of the glass bulb 21 is a function of Ak, w and n. It also shows that if Ak and w are fixed then the internal diameter D of the glass bulb 21 is a function of n. Conversely, it also shows that if the values of Ak, w and the internal diameter D are prescribed, then n is determined.
[0085]
If w=17.15mm and Ak=3.0mm, then according to Table 1 in Figure 15, the closest value to the target value of D=48mm is D=47.40, obtained when n=8.
[0086]
If the target value is equal to or less than D=48mm then the largest value of n corresponding to the value equal to or less than D=48mm should be selected.
[0087]
As described above, it can be seen that if the width w of one side surface of the support member 13 is fixed at a prescribed width w=17.15mm, and the distance Ak from the center of one side surface of the abovementioned support member 13 to the inner surface of the bulb is fixed at a prescribed distance Ak=3.0mm, then the regular n-sided polygon whereby the abovementioned light-emitting diode unit 10 can be arranged inside a cylindrical bulb having a prescribed bulb diameter D=48mm is a regular octagon. In other words, the optimal value of n for a regular n-sided polygon whereby the abovementioned light-emitting diode unit 10 can be arranged inside a cylindrical bulb having the prescribed bulb diameter is 8.
[0088]
If w=17.15mm and Ak=4.0mm, then according to Table 1 in Figure 15, the closest value to the target value of D=48mm is D=49.40, obtained when n=8.
[0089]
According to Table 4 in Figure 16, when in practice D=48mm is adopted, Ak becomes 3.3mm.
Further, a polygon that satisfies the 38.6mm internal diameter criterion for a glass bulb 21 which is compatible with an HID lamp having an E26 cap 23 specification can be selected from the tables in Figure 15.
[0090]
According to Table 2 and Table 3 in Figure 15, the closest values to the target value of D=38.6mm are D=37.7 and
D=39.7, obtained when n=6 (Figure 17) .
[0091]
According to Table 4 in Figure 16, when in practice
D=38.6mm is adopted, Ak becomes 4.5mm.
[0092]
A value of w=17.15mm is preferred because a target value of D=48mm and a target value of D=38.6mm can be achieved using values of n of between 6 and 8.
[0093]
Ideally the abovementioned light-emitting diode unit 10 should preferably be in the shape of a circular prism, but flat surfaces are necessary in order to arrange the light- emitting diodes 11. It is thus formed in the shape of a polygon, but this polygon should ideally be similar to a circular prism. However, although n increases if the width w decreases, and so the shape approaches that of a circular prism, there is a concomitant complication of the manufac- turing process due to an increase in the number of folds.
[0094]
If the width w is increased then n decreases, and the light-emitting diode unit 10 becomes a triangular prism or a square prism, having a shape that is far from that of a cir- cular prism.
[0095]
Table 5 in Figure 18 describes cases in which w=5mm, 15mm and 20mm, and Ak=5.0mm.
[0096]
A value of w=5mm is not suitable to achieve a target value of D=48mm because D does not reach 40mm or more even if n=18 when w=5mm.
[0097]
A value of w=15mm is preferred because a target value of D=48mm and a target value of D=38.6mm can be achieved using values of n of between 6 and 8.
[0098]
A value of w=20mm is not suitable to achieve a target value of D=38.6mm because D does not reach 40mm or less even if n=6 when w=20mm.
[0099]
Figure 19 shows tables for cases in which Ak=1.5mm and Ak=2.0mm, where w=17.15mm. A negative value of Ar indicates that the light-emitting diode unit 10 cannot be housed within the glass bulb 21. Although the light-emitting diode unit 10 can theoretically be housed within the glass bulb 21 when Ar is less than 1mm, insertion of the light-emitting diode unit 10 into the glass bulb 21 during assembly is difficult due to dimensional variations in the glass bulb 21 (plus or minus 1 to 2mm) and the like.
[0100]
Figure 15, Figure 16, Figure 18 and Figure 19 show calcu- lated values of w/d and w/D.
As explained hereinabove, because Sin (180°/n) =w/d, according to this equation if n is determined then the ratio between w and d can be found.
[0101]
When n=4, Sin ( 180 ° /n) =0.7 l=w/d
When n=5, Sin ( 180 ° /n) =0.59=w/d
When n=6, Sin (180°/n) =0.50=w/d
When n=7, Sin (180°/n) =0.43=w/d
When n=8, Sin (180°/n) =0.38=w/d
When n=9, Sin ( 180 ° /n) =0.34=w/d
When n=10, Sin (180°/n) =0.31=w/d
Therefore, to obtain a value of n of between 4 and 10, w should be equal to d multiplied by between 0.71 and 0.31. To obtain a value of n of between 6 and 8, w should be equal to d multiplied by between 0.5 and 0.38.
[0102]
In practice, as shown in Figure 15, Figure 16, Figure 18 and Figure 19, if n and Ak are defined then the ratio be¬ tween w and D can be obtained from the following equation
D=2Ak+2V ( (w/2Sin (180°/n) ) 2- (w/2) 2) )
[0103]
According to Table 1 of Figure 15, to obtain a value of n of between 4 and 10 when Ak=3.0mm, w should be equal to D multiplied by between 0.74 and 0.29. To obtain a value of n of between 6 and 8, w should be equal to D multiplied by be- tween 0.48 and 0.36.
[0104]
According to Table 2 of Figure 15, to obtain a value of n of between 4 and 10 when Ak=4.0mm, w should be equal to D multiplied by between 0.68 and 0.28. To obtain a value of n of between 6 and 8, w should be equal to D multiplied by between 0.45 and 0.35.
[0105]
According to Table 3 of Figure 15, to obtain a value of n of between 4 and 10 when Ak=5.0mm, w should be equal to D multiplied by between 0.63 and 0.27. To obtain a value of n of between 6 and 8, w should be equal to D multiplied by between 0.43 and 0.33.
[0106]
According to Table 4 of Figure 16,
when D=48mm, w=17.15mm is 0.36 times the value of D.
when D=38.6mm, w=17.15mm is 0.44 times the value of D.
[0107]
As described above, w should be in the range of 0.27 to 0.74 multiplied by D. Preferably w should be in the range of 0.33 to 0.38 multiplied by D. Further, because it is preferable for Ak to be small, w should be in the range of 0.48 to 0.36 multiplied by D.
[0108]
According to Figure 15 to Figure 19, preferred values of n to obtain values of D that are closest to the target D=48mm are as follows.
When w=17.15mm and Ak=3.0mm, n=8
When w=17.15mm and Ak=4.0mm, n=8
When w=15.00mm and Ak=5.0mm, n=8
When w=20.00mm and Ak=5.0mm, n=6
[0109]
Preferred values of n to obtain values of D that are clos- est to the target D=36.8mm are as follows.
When w=17.15mm and Ak=3.0mm, n=6
When w=17.15mm and Ak=4.0mm, n=6
When w=15.00mm and Ak=5.0mm, n=6
When w=5.00mm and Ak=5.0mm, n=17
[0110]
It should be noted that n may be an odd number, but if it is an even number, the structure of the support struts is simplified, facilitating manufacture.
[0111]
An advantage of employing a regular n-sided polygonal light-emitting diode unit 10, where a preferred value of n has been determined in this way, is that it is not necessary to alter the width w of the side surfaces of the light- emitting diode unit 10 even if the diameter of the glass bulb 21 is varied, and thus components of the light-emitting diode unit 10 can be standardized.
[0112]
A further advantage of employing a regular n-sided polygo¬ nal light-emitting diode unit 10 having a preferred value of n is that the distance Ak between the light-emitting diodes 11 and the inner surface of the glass bulb 21 can be maintained at a fixed or substantially fixed value even if the diameter D of the glass bulb 21 is varied. If the distance Ak between the light-emitting diodes 11 and the inner sur- face of the glass bulb 21 is set such that it is a distance that allows heat from the light-emitting diodes 11 to escape efficiently to the glass bulb 21 (a distance described in embodiment 4 hereinbelow) , then a lamp having a high heat dissipation effect can be obtained. Lamps having the same or substantially the same heat dissipation effect can be ob¬ tained even when lamps are manufactured using glass bulbs 21 of different diameters.
[0113]
Embodiment 4.
(4) Fourth embodiment (Figure 20 to Figure 29)
Preferred ratios between the height and the diameter of the light-emitting diode unit 10, and the distance between the light-emitting diodes 11 and the diametrically inner portion of the glass bulb 21 will now be discussed.
[0114]
(Test procedure)
(Figure 20 to Figure 23)
· Light-emitting diode units 10 in which the diameter D of the circumcircle of the octagonal prismatic support member 13 and the height h of the octagonal prismatic support member 13 were varied, were prepared using aluminum support members that also function as light-emitting diode sub- strates, in the same way as in embodiment 3 (Figure 22, Figure 21).
• The octagonal pyramid at the top portion was omitted. Each side surface of the octagonal prismatic support member 13 was equipped with a longitudinal row of three light- emitting diodes 11.
• The light-emitting diode unit 10 was equipped in total with 24 light-emitting diodes 11, with one mounted at each of the following three locations:
A. The midpoint of each surface in the height direction (point b)
B. The midpoint between the light-emitting diode 11 in the location mentioned in A hereinabove and the top edge of the side surface (point a)
C. The midpoint between the light-emitting diode 11 in the location mentioned in A hereinabove and the bottom edge of the side surface (point c)
• The end portion of the glass bulb 21 was sealed in the same way as in embodiment 1 and embodiment 3, and the lamp was prepared using a method whereby a screw-type cap 23 was fitted.
• Two types of lamp were prepared (Figure 22), namely one filled only with nitrogen gas and sealed, and one in which substantially all of the space was filled with a perfluoro-
carbon after which it was sealed while nitrogen gas was being injected.
[0115]
In all cases the distance 1 between the upper surface of the light-emitting diode unit 10 and the inner surface of the top portion of the glass bulb 21 was 20mm.
• The volume V defined by the diameter of the circumcircle of the light-emitting diode unit 10 and the height of the prism was unified such that it was possible to compare light-emitting diode units 10 having different D:h ratios. Although the ease with which a lamp is fitted to a fixture is also influenced greatly by the shape of the fixture, the conditions relating to the ease with which lamps employing light-emitting diode units 10 having different D:h ratios were fitted to a fixture were readily aligned by unifying the values of the abovementioned V.
• The distance Ad between the light-emitting diodes 11 and the diametrically inner portion of the glass bulb 21 was va¬ ried by altering the diameter of the glass bulb 21 (Figure 23) .
• Conditions such as the power, voltage and current of each lamp were unified, and the lamps were lit with the cap 23 portion at the bottom. The temperature of the outer surface of the glass bulb 21 was measured at the following three points.
A point corresponding to the location of the upper portion light-emitting diode 11 (B. mentioned above) : point a
A point corresponding to the location of the middle portion light-emitting diode 11 (A. mentioned above) : point b
A point corresponding to the location of the lower portion light-emitting diode 11 (C. mentioned above) : point c
[0116]
(Results)
(Preferred h/D)
· Figure 24, Table 6: Nitrogen gas filling, no transparent thermally conductive medium.
As shown in Figure 25, the temperature decreases as h/D increases. In the range in which h/D is approximately 1.5 and
larger, even point a which has the highest temperature is lower than 100°C. Also, the gradient of temperature decrease becomes more gradual as h/D increases from approximately 1.5 to 2.0. This trend becomes more marked in the vicinity of the light-emitting diodes 11 and at point a which is in the upper portion of the lamp.
• Figure 26, Table 7: Nitrogen gas filling, with transparent thermally conductive medium (perfluorocarbon liquid) . As shown in Figure 27, the overall temperature is lower than in Table 6. This is an effect of the transparent ther¬ mally conductive medium (perfluorocarbon liquid) .
The temperature decreases as h/D increases. The gradient of temperature decrease becomes more gradual as h/D increases from approximately 1.5 to 2.0. This trend becomes more mark- ed in the vicinity of the light-emitting diodes 11 and at point a which is in the upper portion of the lamp, and these and other effects show similar trends to those observed without the transparent thermally conductive medium, al¬ though not so marked.
[0117]
It should be noted that although the temperature decreases as h/D increases, the trend is almost negligible for values of h/D above approximately 3.0.
[0118]
Also, when h/D exceeds 3.5, the lamp must be elongated in shape, and the dimensions are markedly different from those of HID lamps used in conventional street lights, and thus ease of fitting to a fixture deteriorates.
[0119]
The value of h/D is preferably in a range of between 1.5 and 3.5, and more preferably in a range of between 2.0 and 3.0.
[0120]
(Preferred Ad and preferred Ak)
Preferred values of the distance between the light-emitting diodes 11 and the inner surface of the glass bulb 21 will now be discussed.
• Figure 28, Table 8: Nitrogen gas filling, with transparent thermally conductive medium (perfluorocarbon liquid) .
• The distance Ad in the diametrical direction between the outer surface of the light-emitting diodes 11 and the inner surface of the glass bulb 21 was varied by altering the diameter of the glass bulb 21 (Figure 23) .
[0121]
As shown in Figure 29, the temperature increases as the light-emitting diodes 11 move away from the inner surface of the bulb.
[0122]
There is a difference of 20°C to 35°C between the cases in which the light-emitting diodes 11 are in contact with the inner surface of the bulb and the cases in which they are separated from the inner surface of the bulb by 20mm.
[0123]
It is advantageous in terms of temperature for the light- emitting diodes 11 to be in contact with the inner surface of the bulb or close to the inner surface of the bulb as heat dissipation effects are improved.
[0124]
When the light-emitting diodes 11 are separated from the inner surface of the bulb, either the bulb must be made fat¬ ter or the light-emitting diode unit 10 made thinner. Making the bulb fatter is disadvantageous in terms of ease of fitting to a fixture, and making the light-emitting diode unit 10 thinner is disadvantageous in terms of light distribu¬ tion.
[0125]
As shown in Figure 29, the temperature gradient in the range in which Ad is 5mm or less is steeper than the tempera¬ ture gradient in the range of 5mm and above, and it is thus preferable for Ad to be 5mm or less and as close as possible to 0mm.
[0126]
Thus the preferred range of Ad is 0mm or more and 5mm or less. Ad is preferably close to 0mm.
[0127]
The thickness X of the light-emitting diodes 11 is at least lmm. Because Ak=Ad+X, the preferred range of Ak is 1mm or more and 6mm or less.
[0128]
There are, in practice, errors in manufacturing and design such as dimensional variations between the surfaces of the prismatic support member 13, variations in the height (dimension X) of the light-emitting diodes 11, variations in the height at which the light-emitting diodes 11 are ad- hered, and variations in the dimensions of the glass bulb 21.
[0129]
Using a design specification whereby the light-emitting diodes 11 are in contact with the inner surface of the bulb, or a design specification whereby they are close to the inner surface of the bulb, insertion of the light-emitting diode unit 10 into the glass bulb 21 during assembly is difficult because variations between the heights of the light- emitting diodes 11 are approximately lmm, due to the above- mentioned dimensional variations. In order to insert the light-emitting diode unit 10 into the glass bulb 21 during assembly it is necessary to have a minimum clearance (Ar) around the full 360° in the circumferential direction.
[0130]
If the height (thickness X) of the light-emitting diodes 11 is Ag or less, then a clearance (Ar) can be provided around the full 360° in the circumferential direction without the outer surface of the light-emitting diodes 11 protruding from the circumcircle .
[0131]
According to Figure 19 of embodiment 3, the clearance (Ar) is less than lmm when Ak is 2mm or less, and this is not desirable. Therefore a more preferred range of Ak is 2mm or more and 6mm or less. From the viewpoint of the heat dissi- pation effect it is preferable for Ak to be 2mm or close to 2mm .
[0132]
Embodiment 5.
(5) Fifth embodiment (Figure 30 to Figure 34)
Figure 30 is a diagram illustrating a light-emitting diode lamp 20 with an octagonal prismatic support member 13.
Figure 31 is a diagram illustrating a light-emitting diode lamp 20 with a hexagonal prismatic support member 13.
Figure 32 to Figure 34 show a lighting fixture equipped with a light-emitting diode lamp 20. Because the light distribution is not oriented, but the light from the light- emitting diodes 11 is distributed in approximately all di- rections, the lamp is not only applicable to street lights which are lit in a substantially horizontal direction and which predominantly illuminate a lower surface (Figure 32) but also to base-down and base-up lighting fixtures (Figure 33, Figure 34) .
[0133]
The characteristics of the configurations of the light- emitting diode lamp 20 in the abovementioned embodiments 1 to 5 can be divided broadly into two groups, and the charac¬ teristics and advantages will now be described.
[0134]
*** First characteristic group ***
Characteristic 1.
A light-emitting diode lamp 20 in which a light-emitting diode unit 10 comprising a prismatic or cylindrical support member 13 on which light-emitting diodes 11 are mounted is arranged inside a housing 24, and lead wires 17 which lead out from the abovementioned light-emitting diode unit 10 are wired to a cap 23 which mates with the end portion of the abovementioned housing 24, characterized in that: the light emitting surface of the abovementioned light-emitting diode unit 10 is enveloped by a glass cover comprising part of the abovementioned housing 24; the inner surface of the above- mentioned glass cover is in close proximity with or in contact with light-emitting diodes 11 mounted on the side sur- faces of the prismatic or cylindrical support member 13 of the abovementioned light-emitting diode unit 10; and the height of the abovementioned light-emitting diode unit 10 in the axial direction of the prismatic or cylindrical support
member 13 is longer than the diameter of the circumcircle of the bottom surface of the abovementioned prismatic support member 13 or the diameter of the bottom surface of the abovementioned cylindrical support member 13.
[0135]
Characteristic 2.
A characteristic is that the height in the axial direction of the prismatic or cylindrical support member 13 of the abovementioned light-emitting diode unit 10 is a length of between 1.5 times and 3.5 times the diameter of the circum¬ circle of the bottom surface of the abovementioned prismatic support member 13 or the diameter of the bottom surface of the abovementioned cylindrical support member 13.
[0136]
Characteristic 3.
A characteristic is that the inner surface of the abovementioned glass cover is in close proximity to, namely 5mm or less from, light-emitting diodes 11 mounted on the side sur¬ faces of the prismatic or cylindrical support member 13 of the abovementioned light-emitting diode unit 10.
[0137]
Characteristic 4.
A characteristic is that a space between the light emitting surface of the abovementioned light-emitting diode unit 10 and the inner surface of the glass cover is filled with a thermally conductive medium which is transparent and electrically insulating.
[0138]
Characteristic 5.
A characteristic is that the abovementioned thermally conductive medium which is transparent and electrically insu¬ lating is a silicone resin.
[0139]
Characteristic 6.
A characteristic is that the abovementioned thermally con¬ ductive medium which is transparent and electrically insulating is a fluid of density 1.5 or more.
[0140]
Characteristic 7.
A characteristic is that the abovementioned thermally con¬ ductive fluid of density 1.5 or more which is transparent and electrically insulating is a perfluorocarbon liquid.
[0141]
Characteristic 8.
A characteristic is that all of the abovementioned housing 24 including the abovementioned glass envelope comprises a glass bulb; the inside of the abovementioned glass bulb 21 is filled with an inert gas; and the end portion of the glass bulb 21 through which the lead wires 17 leading out from the abovementioned light-emitting diode unit 10 lead out to the outside of the glass bulb 21 is closed and hermetically sealed.
[0142]
Characteristic 9.
A characteristic is that the abovementioned light-emitting diode unit 10 is retained by support struts which are im¬ planted in the seal portion side of the abovementioned glass bulb 21.
[0143]
Characteristic 10.
A characteristic is that the abovementioned light-emitting diodes 11 are mounted on substrates, and in that the above- mentioned substrates are installed on the side surfaces and the upper surface of the abovementioned support member 13.
[0144]
Characteristic 11.
A characteristic is that the abovementioned light-emitting diodes 11 are mounted directly on the side surfaces and the upper surface of the abovementioned support member 13.
[0145]
Characteristic 12.
A characteristic is that a screw-type metallic cap 23 is fitted to the sealed end of the abovementioned glass bulb 21.
[0146]
Characteristic 13.
Also, a lighting fixture characterized in that the above- mentioned light-emitting diode lamp 20 and a lighting device are arranged therein.
[0147]
The advantages of each characteristic of the abovementioned light-emitting diode lamp 20 are as follows.
[0148]
Advantages of characteristic 1
By arranging that the light-emitting diodes 11 on the light emitting surface of the side surfaces of the light-emitting diode unit 10 are enveloped in and are in close proximity to or are in contact with a glass cover having a larger thermal capacity than a resin cover, and arranging the light- emitting diode unit 10 such that the height in the axial di- rection of the prismatic or cylindrical support member 13 is longer than the diameter of the circumcircle of the bottom surface of the prismatic support member 13 or the diameter of the bottom surface of the cylindrical support member 13, it is possible to obtain a broader light distribution and light emission intensity in the length direction of the lamp in the same way as with an HID lamp, and because heat can be dissipated efficiently from the side surfaces of the light- emitting diode unit 10 it is possible to provide a light- emitting diode lamp having a longer operating life.
[0149]
Advantages of characteristic 2
By arranging that the height in the axial direction of the prismatic or cylindrical portion of the prismatic or cylindrical support member 13 of the light-emitting diode unit 10 is set to be a length of between 1.5 times and 3.5 times the diameter of the circumcircle of the bottom surface of the prismatic support member 13 or the diameter of the bottom surface of the cylindrical support member 13, it is possible to obtain a broader light distribution and light emission intensity in the length direction of the lamp in the same way as with an HID lamp, and because heat can be dissipated efficiently from the side surfaces of the light-emitting di-
ode unit 10 it is possible to provide a light-emitting diode lamp having a longer operating life.
[0150]
Advantages of characteristic 3
By arranging that the inner surface of the glass cover is in close proximity of 5mm or less with light-emitting diodes 11 mounted on the side surfaces of the prismatic or cylindrical support member 13 of the light-emitting diode unit 10 it is possible for heat to be dissipated efficiently from the side surfaces of the light-emitting diode unit 10, and it is possible to provide a light-emitting diode lamp 20 having a longer operating life.
[0151]
Advantages of characteristic 4
By arranging that the space between the light emitting surface of the light-emitting diode unit 10 and the inner surface of the glass cover is filled with a thermally conductive medium which is transparent and electrically insulating it is possible for heat to be dissipated efficiently from the side surfaces of the light-emitting diode unit 10, and it is possible to provide a light-emitting diode lamp 20 having a longer operating life.
[0152]
Advantages of characteristic 5
By arranging that the thermally conductive medium which is transparent and electrically insulating is a silicone resin it is possible to improve the electrical insulation proper¬ ties and to ensure the electrical safety of the LEDs and wiring. Also, the color of the lamp is shifted towards the higher color temperature side and thus appears brighter.
[0153]
Advantages of characteristic 6
By arranging that the thermally conductive medium which is transparent and electrically insulating is a fluid of den- sity 1.5 or more, heat can be transferred and released to low-temperature portions, namely the glass bulb 21 or the cap 23, by means of the convection of the high-thermal capacity fluid, and it is possible to provide a light-emitting
diode lamp 20 having an improved heat dissipation efficiency .
[0154]
Advantages of characteristic 7
By arranging that the thermally conductive fluid of density
1.5 or more which is transparent and electrically insulating is a perfluorocarbon liquid, it is possible to ensure the electrical safety of the LEDs and wiring, and to provide a light-emitting diode lamp 20 having an improved heat dissi- pation efficiency. Also, the color of the lamp is shifted towards the higher color temperature side and thus appears brighter .
[0155]
Advantages of characteristic 8
By arranging that all of the housing 24 including the glass envelope comprises a glass bulb; that the inside of the glass bulb 21 is filled with an inert gas;
[0156]
and that the end portion of the glass bulb 21 through which the lead wires 17 leading out from the light-emitting diode unit 10 lead out to the outside of the glass bulb 21 is closed and hermetically sealed, there is no need to form the housing 24 by adhering a resin housing to the base portion of the glass bulb 21, and thus material costs can be reduced and the housing 24 can be produced using existing HID lamp equipment. Also, because the housing 24 is filled with an inert gas and is hermetically sealed, corrosion of metal parts therein such as the lead wires 17 can be prevented, and because the construction is water resistant, outdoor use is also possible. Further, filling with the thermally conductive liquid medium can be performed without the need for a special sealing structure that employs a non-metallic seal or the like.
[0157]
Advantages of characteristic 9
By arranging that the light-emitting diode unit 10 is retained by support struts which are implanted in the seal portion side of the glass bulb 21 it is possible to provide
a light-emitting diode lamp 20 that is similar in shape to a conventional HID lamp.
[0158]
Advantages of characteristic 10
By arranging that the light-emitting diodes 11 are mounted on substrates, and that the substrates are installed on the side surfaces and the upper surface of the support member 13 it is possible for the shape of the light-emitting diode unit 10 to be similar to that of a cylindrical bulb, and it is possible to provide a light-emitting diode lamp 20 having a light distribution and shape that are similar to those of a conventional HID lamp.
[0159]
Advantages of characteristic 11
By arranging that the light-emitting diodes 11 are mounted directly on the side surfaces and the upper surface of the support member 13 it is possible to omit the light-emitting diode substrate, and is thus possible to produce the light- emitting diode lamp 20 more economically.
[0160]
Advantages of characteristic 12
By arranging that a screw-type metallic cap 23 is fitted to the sealed end of the glass bulb 21 it is possible provide a light-emitting diode lamp 20 which has substantially the sa- me shape as a conventional HID lamp.
[0161]
Advantages of characteristic 13
In combination with a lighting device, the abovementioned light-emitting diode lamp 20 can readily be used as a re- placement in lighting fixtures such as street lights and security lights in which conventional HID lamps have been used, and it is thus possible to provide a lighting fixture such as a street light or a security light having high energy efficiency.
[0162]
*** Second characteristic group ***
Characteristic 1.
A light-emitting diode lamp 20 in which a light-emitting diode unit 10 configured by arranging light-emitting diodes 11 on a plurality of surfaces of a support member 13 that has been formed into a three-dimensional shape is installed in a housing 24 formed from a transparent cylindrical bulb and a cap 23 which conducts electricity to the abovemen¬ tioned light-emitting diode unit 10, and wires leading from the abovementioned light-emitting diode unit 10 are led out to the outside of the housing 24 via the cap 23, in which the abovementioned support member 13 is in the shape of a polygonal prism the bottom surface of which is a regular polygon, the circumcircle of the abovementioned regular polygonal bottom surface is arranged concentrically with the abovementioned cylindrical bulb, and which has a polygonal prismatic light-emitting diode unit 10 comprising a regular polygon of which the value of n has been adjusted so as to obtain the desired bulb diameter, where the width w of a side surface of the abovementioned polygonal prism in a direc¬ tion perpendicular to the axis of the abovementioned polygo- nal prism, and the distance Ak from the point at which a line extending perpendicular to a side surface of the above- mentioned polygonal prism from the center of a cross section through the abovementioned cylindrical bulb intersects the side surface of the abovementioned polygonal prism, to the point at which the abovementioned perpendicularly extended line intersects the inner surface of the abovementioned bulb are fixed, and the regular polygon comprising the bottom surface of the abovementioned polygonal prism is a regular n-sided polygon.
[0163]
Characteristic 2.
A light-emitting diode lamp 20 in which a light-emitting diode unit 10 configured by arranging light-emitting diodes 11 on a plurality of surfaces of a support member 13 that has been formed into a three-dimensional shape is installed in a housing 24 formed from a transparent cylindrical bulb and a cap 23 which conducts electricity to the abovementioned light-emitting diode unit 10, and wires leading from
the abovementioned light-emitting diode unit 10 are led out to the outside of the housing 24 via the cap 23, character¬ ized in that the abovementioned support member 13 is in the shape of a polygonal prism the bottom surface of which is a regular polygon, the circumcircle of the abovementioned regular polygonal bottom surface is arranged concentrically with the abovementioned cylindrical bulb, and light-emitting diodes 11 are arranged in a row in the axial direction of the abovementioned polygonal prism on the side surfaces of the abovementioned polygonal prism.
[0164]
Characteristic 3.
A characteristic is that the abovementioned support member 13 is formed into a three-dimensional shape by folding an integrated sheet, forming a plurality of surfaces.
[0165]
Characteristic 4.
A characteristic is that the width w of a side surface of the abovementioned polygonal prism in a direction perpen- dicular to the axis of the abovementioned polygonal prism is between 5mm and 20mm.
[0166]
Characteristic 5.
A characteristic is that the distance Ak from the point at which a line extending perpendicular to a side surface of the abovementioned polygonal prism from the center of a cross section through the abovementioned cylindrical bulb intersects the side surface of the abovementioned polygonal prism, to the point at which the abovementioned perpendicu- larly extended line intersects the inner surface of the abovementioned bulb is between 1mm and 6mm.
[0167]
Characteristic 6.
A characteristic is that the plurality of surfaces of the abovementioned support member 13 which has been formed into a three-dimensional shape also function as light-emitting diode element substrates, and the light-emitting diodes 11
are mounted directly on the outer surface of the support member 13.
[0168]
Characteristic 7.
A characteristic is that the light-emitting diode unit 10 is configured by affixing light-emitting diode element sub¬ strates to the plurality of surfaces of the abovementioned support member 13.
[0169]
Characteristic 8.
A characteristic is that the width of the abovementioned light-emitting diode element substrates is approximately 10mm.
[0170]
Characteristic 9.
A characteristic is that the abovementioned light-emitting diode element substrates are ribbon-shaped flexible substrates 12.
[0171]
Characteristic 10.
A characteristic is that the bottom surface of the above- mentioned polygonal prism is a polygon comprising a regular n-sided polygon of which a portion of the vertices has been omitted .
[0172]
Characteristic 11.
A characteristic is that the abovementioned support member 13 is made of metal.
[0173]
Characteristic 12.
A characteristic is that the height of the abovementioned polygonal prism is larger than the diameter of the abovementioned circumcircle .
[0174]
Characteristic 13.
A characteristic is that on the top surface of the above- mentioned heat dissipator there is a polygonal pyramid shape or a trapezoidal polygonal pyramid shape, and light-emitting
diodes 11 are arranged on each surface of the abovementioned polygonal pyramid shape.
[0175]
Characteristic 14.
A lighting fixture characterized in that the abovementioned light-emitting diode lamp 20 and a lighting device are arranged therein.
[0176]
The advantages of each characteristic of the abovementioned light-emitting diode lamp 20 are as follows.
[0177]
Advantages of characteristic 1
By arranging that the light-emitting diode lamp 20 is a one in which a light-emitting diode unit 10 configured by ar- ranging light-emitting diodes 11 on a plurality of surfaces of a support member 13 that has been formed into a three- dimensional shape is installed in a housing 24 formed from a transparent cylindrical bulb and a cap 23 which conducts electricity to the light-emitting diode unit 10, and wires leading from the light-emitting diode unit 10 are led out to the outside of the housing 24 via the cap 23, in which the support member 13 is in the shape of a polygonal prism the bottom surface of which is a regular polygon, the circumcir- cle of the regular polygonal bottom surface is arranged con- centrically with the cylindrical bulb, and which has a polygonal prismatic light-emitting diode unit 10 comprising a regular polygon of which the value of n has been adjusted so as to obtain the desired bulb diameter, where the width w of a side surface of the polygonal prism in a direction perpen- dicular to the axis of the polygonal prism, and the distance Ak from the point at which a line extending perpendicular to a side surface of the polygonal prism from the center of a cross section through the cylindrical bulb intersects the side surface of the polygonal prism, to the point at which the perpendicularly extended line intersects the inner sur¬ face of the bulb are fixed, and the regular polygon comprising the bottom surface of the polygonal prism is a regular n-sided polygon, it is possible to obtain a light-emitting
diode lamp 20 with which components can be standardized and manufacturing processes can be standardized even if the di¬ ameter of the glass bulb 21 and the brightness of the light- emitting diode lamp 20 are varied while maintaining as fixed values the width of the side surfaces of the polygonal prism and the distance from the light-emitting diodes 11 arranged on the side surfaces to the inner surface of the glass bulb 21; with which heat from the light-emitting diodes 11 can be efficiently allowed to escape to the glass bulb 21; which is low-cost and is highly compatible with lighting fixtures; and which has a long operating life.
[0178]
Advantages of characteristic 2
In a light-emitting diode lamp 20 in which a light-emitting diode unit 10 configured by arranging light-emitting diodes 11 on a plurality of surfaces of a support member 13 that has been formed into a three-dimensional shape is installed in a housing 24 formed from a transparent cylindrical bulb and a cap 23 which conducts electricity to the light- emitting diode unit 10, and wires leading from the light- emitting diode unit 10 are led out to the outside of the housing 24 via the cap 23, by arranging that the support member 13 is in the shape of a polygonal prism the bottom surface of which is a regular polygon, the circumcircle of the regular polygonal bottom surface is arranged concentrically with the cylindrical bulb, and light-emitting diodes 11 are arranged in a row in the axial direction of the po¬ lygonal prism on the side surfaces of the polygonal prism, it is possible to obtain a light-emitting diode lamp 20 with which components can be standardized and manufacturing processes can be standardized even if the diameter of the glass bulb 21 and the brightness of the light-emitting diode lamp 20 are varied while maintaining as fixed values the width of the side surfaces of the polygonal prism and the distance from the light-emitting diodes 11 arranged on the side sur¬ faces to the inner surface of the glass bulb 21; with which heat from the light-emitting diodes 11 can be efficiently allowed to escape to the glass bulb 21; which is low-cost
and is highly compatible with lighting fixtures; and which has a long operating life.
[0179]
Advantages of characteristic 3
By arranging that in the support member 13, a plurality of surfaces is formed by folding an integrated sheet, it is possible to obtain a light-emitting diode lamp 20 which enhances standardization of components, reduction in the number of components, and standardization of manufacturing pro- cesses.
[0180]
Advantages of characteristic 4
By arranging that the width w of a side surface of the po¬ lygonal prism in a direction perpendicular to the axis of the polygonal prism is between 5mm and 20mm, the number of side surfaces of the polygonal prism can be readily adjusted in a state in which light-emitting diodes 11 are arranged in a row in the axial direction of the polygonal prism on the side surfaces of the polygonal prism, and by obtaining a light-emitting diode lamp 20 having the desired bulb diame¬ ter it is possible to obtain a light-emitting diode lamp 20 with which components can be standardized and manufacturing processes can be standardized even if the diameter of the glass bulb 21 and the brightness of the light-emitting diode lamp 20 are varied while maintaining as fixed values the width of the side surfaces of the polygonal prism and the distance from the light-emitting diodes 11 arranged on the side surfaces to the inner surface of the glass bulb 21;
with which heat from the light-emitting diodes 11 can be ef- ficiently allowed to escape to the glass bulb 21; which is low-cost and is highly compatible with lighting fixtures; and which has a long operating life.
[0181]
Advantages of characteristic 5
By arranging that the distance Ak from the point at which a line extending perpendicular to a side surface of the above- mentioned polygonal prism from the center of a cross section through the abovementioned cylindrical bulb intersects the
side surface of the abovementioned polygonal prism, to the point at which the abovementioned perpendicularly extended line intersects the inner surface of the abovementioned bulb is between 1mm and 6mm, the light-emitting diode unit 10 can be readily inserted into the glass bulb 21 with a high yield, and it is possible to obtain a light-emitting diode lamp 20 with which heat from the light-emitting diodes 11 can be efficiently allowed to escape to the glass bulb 21, which is low-cost and is highly compatible with lighting fixtures, and which has a long operating life.
[0182]
Advantages of characteristic 6
By arranging that the plurality of surfaces of the support member 13 which has been formed into a three-dimensional shape also function as light-emitting diode element substrates, and that the light-emitting diodes 11 are mounted directly on the outer surface of the support member 13 it is possible to omit the light-emitting diode substrate, and is thus possible to produce the light-emitting diode lamp 20 more economically.
[0183]
Advantages of characteristic 7
By arranging that the light-emitting diode unit 10 is con¬ figured by affixing light-emitting diode element substrates to the plurality of surfaces of the support member 13 it is possible to make use of an existing generic light-emitting diode element substrate.
[0184]
Advantages of characteristic 8
By arranging that the width of the light-emitting diode element substrates is approximately 10mm it is possible to make use of a more generic light-emitting diode element substrate that is already generally available.
[0185]
Advantages of characteristic 9
By arranging that the light-emitting diode element substrates are ribbon-shaped flexible substrates 12 it is pos-
sible to make use of a more generic light-emitting diode element substrate that is already generally available.
[0186]
Advantages of characteristic 10
By arranging that the bottom surface of the polygonal prism is a polygon comprising a regular n-sided polygon of which a portion of the vertices has been omitted it is possible to obtain a light-emitting diode unit 10 that is adapted to a particular shape of fixture or a particular light distribu- tion.
[0187]
Advantages of characteristic 11
By arranging that the support member 13 is made of metal, heat generated by the light-emitting diodes 11 can be effi- ciently absorbed and dissipated.
[0188]
Advantages of characteristic 12
By arranging that the height of the polygonal prism is lar¬ ger than the diameter of the circumcircle heat generated by the light-emitting diodes 11 can be efficiently dissipated.
[0189]
Advantages of characteristic 13
By arranging that on the top surface of the heat dissipator there is a polygonal pyramid shape or a polygonal pyramid shape of which the longitudinal section in the direction of the central axis is trapezoidal, and light-emitting diodes 11 are arranged on each surface of the polygonal pyramid shape, light at the top portion of the lamp can be distributed perfectly.
[0190]
Advantages of characteristic 14
In combination with a lighting device, the abovementioned light-emitting diode lamp 20 can readily be used as a replacement in lighting fixtures such as street lights and se- curity lights in which conventional HID lamps have been used, and it is thus possible to provide a street light or a security light having high energy efficiency.
[0191]
Also, because the light distribution is not oriented, but the light from the light-emitting diodes 11 is distributed in approximately all directions, the lamp is not only applicable to street lights which are lit in a substantially ho- rizontal direction and which predominantly illuminate a lower surface, but also to base-down and base-up fixtures.
[0192]
Embodiment 6.
In embodiment 6 an explanation is provided of a method of filling a space between a light-emitting diode unit 10 comprising a prismatic or cylindrical support member on which LEDs are mounted and the inner surface of a glass bulb 21 with a thermally conductive medium (for example silicone) in the form of a liquid or a paste having a substantially uni- formly high transmittance in the visible range.
[0193]
Figure 35 is a conceptual diagram showing comparative example 1 of the silicone injection method.
When silicone 290 is injected into a conventional HID lamp an inner tube bulb is inserted into an outer tube bulb, and the outer tube bulb is sealed. Here, in the same way a light-emitting diode unit 10 was inserted into a glass bulb 21, and a gap to the inner surface of the glass bulb 21 was filled with a thermally conductive medium, after which the glass bulb 21 was sealed. However, the thermally conductive medium became burnt due to the heat during sealing, and as a result could not be used. For example, silicone 290 is li¬ able to be lost if it reaches a temperature of 200°C or more, and as the sealing temperature is at least 1000°C the silicone 290 deteriorates.
[0194]
Figure 36 is a conceptual diagram showing comparative example 2 of the silicone injection method.
A proposal was considered whereby after a glass bulb 21 has been sealed using the same manufacturing method as in the manufacture of an HID lamp, a opening hole is made in the glass bulb 21, a thermally conductive medium is injected through the opening hole, and after injection the opening
hole is sealed by applying heat. In this way it is possible to achieve the aim of filling with the thermally conductive medium, but the operation is complex and costly, and is not industrially suitable.
[0195]
Figure 37 is a conceptual diagram showing the silicone in¬ jection method of embodiment 6.
The original idea was to inject the silicone using an exhaust tube which is employed in vacuum drawing. An injection needle was inserted into the exhaust tube, and a thermally conductive medium was injected through the injection needle into the inside of the glass bulb 21. In this way it is possible to inject the thermally conductive medium efficiently, and by industrial means.
[0196]
Figure 38 is a flow diagram illustrating the method of manufacturing the light-emitting diode lamp 20 in embodiment 6, in particular a silicone injection method. The process of manufacturing the light-emitting diode lamp 20 comprises an assembly process S20 and a sealing process S30.
[0197]
1. Assembly process: S20
The method of manufacturing the light-emitting diode lamp 20 is provided with an assembly process S20 in which a light-emitting diode unit 10 is prepared, the light-emitting diode unit 10 and a flare tube 22 are fitted, and the light- emitting diode unit 10 is inserted into the glass bulb 21 and sealed.
[0198]
Figure 39 is an illustration of the support member 13 of the light-emitting diode unit 10, in an unfolded state.
The difference between Figure 39 and Figure 7 lies in the existence of U-shaped incisions 218 and semicircular incisions 219. The incisions 218 and 219 have the advantage of facilitating folding when folding the support member and the advantage of facilitating positioning during folding. The incisions 218 and 219 are U-shaped and semicircular, but
they may also be triangular, rectangular, circular or trapezoidal .
[0199]
Figure 40 is a drawing illustrating the flare tube 22. The flare tube 22 is glass. Two lead wires 17 penetrate through the flare tube 22. An axial support strut 15 is embedded at the center of one end of the flare tube 22. An exhaust tube 221 extends from the center of the other end of the flare tube 22 toward the axial support strut 15. The exhaust tube 221 penetrates the middle of the flare tube 22, but it is bent obliguely ahead of the axial support strut forming an exhaust port 222.
[0200]
Firstly, the axial support strut 15 and a linking support strut 16 are connected together by soldering or welding, fixing the light-emitting diode unit 10 and the flare tube 22. Further, the two lead wires 17 are connected by soldering to circuit terminals of the light-emitting diode unit 10 such that an electrical connection is possible.
[0201]
Next, the light-emitting diode unit 10 is inserted into a test tube-shaped glass bulb 21, the outer circumference of the flare tube 22 and the inner circumference of the glass bulb 21 are fused together, and the glass bulb 21 is sealed. This completes the assembly process S20.
A thin metal support strut of approximately 0.3 to 1.5mm is employed as the axial support strut 15 in order to provide flexibility in a direction perpendicular to the axis of the axial support strut such that the light-emitting diode unit 10 can be inserted readily into the glass bulb. Ultimately, as the injected silicone supports the light-emitting diode unit, the axial support strut may be thin in this way.
[0202]
Figure 41 is a drawing illustrating the state upon comple- tion of the assembly process S20. The flare tube 22 and the glass bulb 21 are sealed at a sealing portion 216, and the inside of the glass bulb 21 communicates with the outside air only via the exhaust port 222 and the exhaust tube 221.
[0203]
In Figure 41, ventilation holes 19 exist as holes penetrat¬ ing from the inside to the outside of the light-emitting diode unit 10. Eight ventilation holes 19 are provided in the corners of the end portion of the octagonal prism. The ventilation holes 19 are holes formed by the incisions 219 and a metal base plate 299.
[0204]
Further, Figure 41 shows a stainless steel injection needle 230 of a silicone dispenser. The injection needle 230 is a substantially straight needle, but the distal end is bent such that it can protrude from the end of the exhaust port 222. The distal end of the injection needle 230 is bent to the extent that it can pass through the inside of the ex- haust port 222. The injection needle 230 can therefore be inserted into the exhaust port 222.
[0205]
2. Sealing process: S30
Next, the method of manufacturing the light-emitting diode lamp 20 is provided with a sealing process in which filling with a thermally conductive medium is performed through the exhaust tube 221, gas is removed, and sealing is performed. In the sealing process S30 the following three process are executed successively.
[0206]
(1) Filling process: S31
The injection needle of the silicone dispenser is inserted into the exhaust tube 221, and silicone 290 that is forced out from the silicone dispenser is injected into the glass bulb 21. At this time, the injection needle of the dispenser is inserted with the open portion of the exhaust tube 221 facing upwards. In other words, the LED lamp is arranged such that the base side to which a cap will be fitted is facing upward, and silicone 290 is injected by being allowed to drip under gravity from the distal end of the injection needle .
At the same time that the silicone 290 is being injected, air inside the glass bulb 21 equal in volume to the volume
of the injected silicone 290 flows out through a gap between the injection needle 230 and the inner surface of the ex¬ haust port 222.
[0207]
Figure 42 is a drawing illustrating the state during silicone injection. Because the purpose of the silicone 290 is to dissipate heat from the light-emitting diodes, it is sufficient to fill only up to the height of the section in which light-emitting diodes are arranged. Further, if the inside of the light-emitting diode unit 10 is also filled with silicone 290 then a large amount of silicone 290 will be used and the weight will become greater, and therefore the top portion of the light-emitting diode unit 10 (the lower portion in Figure 41 and Figure 42) should be hermeti- cally sealed such that silicone 290 does not enter the inside of the light-emitting diode unit 10. In order to prevent silicone 290 from entering the inside of the light- emitting diode unit 10 there should be no gaps in the light- emitting diode unit 10 up to the height to which the sili- cone 290 is to be injected. Specifically, an adhesive silicone is applied as a filler from the inside of the light- emitting diode unit 10 when it is formed from the state in Figure 7 into the state in Figure 8. If the color of the ad¬ hesive silicone is arranged so as to be the same color as the support member 13 then even if adhesive silicone appears on the outer surface it will not be conspicuous on the outer surface. It should be noted that holes formed by the inci¬ sions 218 should be filled, but holes formed by the incisions 219 are not enveloped by the silicone 290 and are in addition used as ventilation holes 19 and should therefore not be filled.
[0208]
(2) Exhaust process: S32
The injection needle is extracted, and vacuum drawing is performed through the exhaust tube (vacuum drawing process) . This is performed for the purpose of degassing (vacuum degassing) , and at this time vacuum drawing is not performed all at once but is divided and performed severally. As the
pressure decreases, gas in the silicone expands and rises to the upper portion of the silicone 290, and thus bubbles in the silicone 290 are eliminated. When the pressure is returned from a state of vacuum to atmospheric pressure, an inert gas such as nitrogen is injected (replacement process) . By repeating the vacuum drawing process and the re¬ placement process several times, degassing and replacement with an inert gas to the inside can be performed simultaneously. Air within the glass bulb 21 is gradually replaced with nitrogen by performing vacuum drawing several times.
[0209]
In order to replace air inside the light-emitting diode unit 10 with nitrogen gas, the light-emitting diode unit 10 has ventilation holes 19 formed by the metal base plate 299 of the light-emitting diode unit 10 and the incisions 219. By means of vacuum drawing, air inside the light-emitting diode unit 10 flows out through the ventilation holes 19 and is exhausted through the exhaust port 222. In its place, an inert gas such as nitrogen flows in through the exhaust port 22 when the pressure is returned from a state of vacuum to atmospheric pressure, and the nitrogen gas enters the inside of the light-emitting diode unit 10 through the ventilation holes 19.
[0210]
(3) Tip-off process: S33
Tip-off of the exhaust tube 221 is performed.
A cap is then affixed.
[0211]
A. Specification of silicone 290
The viscosity (hardness) of the silicone 290 is preferably
100Pa-s or less. If this is exceeded then discharge at the dispenser becomes difficult, and in addition injected silicone 290 no longer penetrates uniformly into the gaps between the housing and the glass bulb. In particular, 50Pa*s or less is preferable, and in order to be able to fill nar¬ rower gaps the viscosity should be between 1 and several Pa-s and preferably 1.0Pa*s.
[0212]
B. Specification of exhaust tube 221
The thickness of the exhaust tube should satisfy the fol¬ lowing conditions, namely a minimum outer diameter of ø 4.0mm (minimum inner diameter of ø 0.7mm) and a maximum outer diameter of ø 8.0mm (maximum inner diameter of ø
5.0mm) . If the maximum outer diameter exceeds ø 8.0mm then it is not possible to manufacture it as a flare tube 22 (stem) , and if the minimum outer diameter is lower than ø 4.0mm then the silicone injection and air exhaust functions cannot be realized, as described hereinbelow.
The length of the exhaust tube 221 should be a minimum of 30mm and a maximum of 200mm. Although a shorter exhaust tube 221 is advantageous in terms of silicone injection, the tip- off operation following injection of the silicone cannot be performed if the length is less than the minimum length 30mm. Further, if the length exceeds the maximum length 200mm then this is significantly disadvantageous in terms of silicone injection.
[0213]
C. Specification of dispenser injection needle
There are two reasons for using a dispenser injection needle
The first is in order to performed silicone injection and air exhaustion simultaneously.
The second is in order to prevent silicone 290 from becoming attached to the inside of the exhaust tube 221.
If by any chance silicone 290 were to become attached to the inside of the exhaust tube 221 then there would be the danger of silicone 290 contaminating the inside of the mel- ted glass bulb during the tip-off operation, resulting in defects such as discoloration and cracking.
[0214]
The diameter of the dispenser injection needle depends on the diameter of the exhaust tube 221 being used. A thicker dispenser injection needle is advantageous in terms of sili¬ cone injection, but because the gap to the tip tube is narrowed, it becomes impossible to exhaust the air. The range of outer diameter of the dispenser injection needle is be-
tween a minimum outer diameter of ø 0.5mm (minimum inner diameter of ø 0.2mm) and a maximum outer diameter of ø 4.5mm (minimum outer diameter of ø 4.0mm), based on the relationship with the abovementioned exhaust tube 221.
[0215]
D. Specification of vacuum drawing
The vacuum drawing conditions for degassing and replacement with an inert gas such as nitrogen are a vacuum degree of at least 21.33 kilopascals and less than 101.3 kilopascals . If it is lower than 21.0 kilopascals then there is a danger that the physical properties of the silicone 290 will be compromised. The vacuum degree should be at least 25 kilopascals and 50 kilopascals or less, specifically at least 30 kilopascals and 40 kilopascals or less, and preferably 33.3 kilopascals .
Further, for replacement with inert gas, the pressure must be returned to atmospheric pressure at least once. To achieve complete degassing and inert gas replacement, approxi¬ mately 10 cycles of approximately 20 minutes each should be performed.
[0216]
E. Determination method
It should be noted that as the thermally conductive medium that has dripped from the exhaust port 222 leaves traces on the flare tube 22, the base portion support strut 14, the axial support strut 15, the linking support strut 16 and the lead wires 17, it is possible to determine visually from the thermally conductive medium traces and drips that the product has been manufactured by adopting the method of inject- ing silicone through the exhaust tube 221.
[0217]
The method of manufacturing a light-emitting lamp of embodiment 6 is provided with
an assembly process in which an exhaust tube 221 is fitted and a glass bulb is sealed,
and a sealing process in which filling with a thermally conductive medium is performed through the exhaust tube 221, gas is removed, and sealing is performed.
[0218]
The sealing process is provided with
after the assembly process, a filling process in which the inside of the glass bulb is filled through the exhaust tube with a thermally conductive medium; after the filling process, an exhaust process in which gas within the glass bulb is drawn from the exhaust tube by vacuum; and after the exhaust process, a tip-off process in which the exhaust tube 221 is sealed.
[0219]
In the abovementioned filling process, an injection needle having an outer diameter that is smaller than the inner diameter of the exhaust tube 221 is inserted into the exhaust tube 221 and the thermally conductive medium is injected in- to the glass bulb through the injection needle, and injection of the thermally conductive medium by means of the injection needle and exhaustion by means of the exhaust tube 221 are performed simultaneously.
In the abovementioned filling process, an injection needle that is longer than the exhaust tube 221 is inserted through the exhaust tube 221, and a thermally conductive medium is injected into the glass bulb through the injection needle.
In the abovementioned filling process, a thermally conduc¬ tive medium having a viscosity of 100 pascal seconds or less is injected.
[0220]
In the abovementioned sealing process, an exhaust tube 221 having an outer diameter of 4mm or more and 8mm or less, an inner diameter which is smaller than the outer diameter of the tube and which is 0.7mm or more and 5.0mm or less, and a length of 30mm or more and 200mm or less is fitted.
[0221]
In the abovementioned filling process, a thermally conductive medium is injected into the inside of the glass bulb using an injection needle having an outer diameter which is smaller than the inner diameter of the exhaust tube 221 and is 0.5mm or more and 4.5mm or less, and an inner diameter
which is smaller than the outer diameter of the needle and is 0.2mm or more and 4.0mm or less.
[0222]
The abovementioned exhaust process comprises a vacuum draw- ing process in which vacuum drawing is performed with a vacuum degree of 21.0 kilopascals or more and 101.3 kilopascals or less.
The abovementioned exhaust process comprises a replacement process in which, when the vacuum drawing process is re- peated a plurality of times, gas inside the glass bulb is replaced with an inert gas between vacuum drawing processes.
[0223]
By means of a method of manufacture such as that described above, it is possible to manufacture a light-emitting diode lamp provided with a light-emitting diode unit on which light-emitting diodes are mounted, a housing having a glass cover which envelops the light emitting surface of the abovementioned light-emitting diode unit and inside which the light-emitting diode unit is arranged, and a thermally con- ductive medium with which gaps between the light emitting surface of the abovementioned light-emitting diode unit and the inner surface of the glass cover are filled.
[0224]
The abovementioned thermally conductive medium is either a thermally conductive medium comprising a silicone resin that is transparent and electrically insulating, or a thermally conductive medium containing the abovementioned silicone re¬ sin .
Filling with silicone 290 has the following advantages. (1) Heat from the light-emitting diodes is more readily transferred to the glass bulb 21.
(2) Sections which are enveloped by the silicone 290 do not oxidi ze .
(3) The glass bulb 21 is less liable to break even if sub- jected to an external force.
(4) It has the effect of preventing glass fragments from flying off even if the glass bulb 21 cracks, and has the ef-
feet of insulating portions which are enveloped with the silicone 290.
[0225]
The silicone 290 which is injected may be colorless and transparent, or it may be a colored silicone, or it may be a hybrid silicone comprising silicone and another substance such as an epoxy. Also, in order to increase heat dissipation characteristics further, heat dissipating silicone into which metal particles have been mixed, having excellent heat dissipation characteristics, may be used.
[0226]
Figure 41 and Figure 42 illustrate a case in which the exhaust tube 221 bends in the flare tube 22, but the exhaust tube may go straight through the center of the flare tube 22. In this case the injection needle may also be straight, reducing the possibility that silicone 290 will become attached to the inner surface of the exhaust tube 221 and facilitating injection of the silicone 290.
[0227]
It should be noted that Figure 41 and Figure 42 illustrate a case in which injection of silicone 290 and exhaustion are performed only via the exhaust tube 221, but an injection tube (not shown in the diagrams) through which silicone 290 is injected may also be provided parallel to the exhaust tu- be 221. If an injection tube is provided, then exhaustion can be performed efficiently and reliably without silicone 290 becoming attached to the exhaust tube 221. If an injec¬ tion tube is provided, then when vacuum drawing is being performed, it is possible to draw the vacuum through the ex- haust tube and inject nitrogen gas through the injection tube. Vacuum drawing can also be performed through both the exhaust tube 221 and the injection tube, and nitrogen gas can be introduced through both. Finally, both the exhaust tube 221 and the injection tube should be subjected to the tip-off process.
[0228]
An explanation will now be given of measures for lighting the light-emitting diodes 11, based on Figure 43 and Figure 44.
Figure 43 illustrates a case in which a light-emitting di- ode 11 is enveloped in silicone 290 between the support member and the glass bulb 21. There is an element at the middle of the outer shell of the light-emitting diode 11, and the element and bonding wires are enveloped in resin 250. When the temperature rises, the silicone 290 undergoes thermal expansion, applying expansion pressure to the outer surface of the resin 250, and there is the possibility that it will deform such that it crushes the resin 250. The glass bulb 21 and the support member have lower thermal expansion coefficients than the silicone 290 and they therefore do not ex- pand as much as the silicone 290, and it is thought that since the silicone 290 has nowhere else to go it will apply pressure to the relatively flexible resin 250. There is thus the possibility that the bonding wires 251 inside the resin 250 will become disconnected or suffer from a poor connec- tion, resulting in lighting failure of the element.
[0229]
Thus, as shown in Figure 44, it is advantageous to fit a transparent glass sheet 240 in the form of a thin sheet to the outer surface of the light-emitting diode 11 package. The glass sheet 240 allows the expansion pressure applied to the resin 250 to be alleviated. For example, the thickness of the resin 250 is 0.12 to 0.17mm, but in order to afford high light permeability it should be 0.12mm. The shape of the glass sheet 240 should be the same shape as the outer surface of the light-emitting diode 11 package. The shape of the glass sheet 240 should be circular or rectangular, tou¬ ching 360° of the peripheral outer shell of the light- emitting diode 11 package.
[0230]
Embodiment 7.
In embodiment 7, an explanation will be given regarding in particular the differences compared with embodiments 1 to 6.
Characteristic points of embodiment 7 are the shape of the glass bulb 21 and the light-emitting diode unit 10.
[0231]
In a glass filled type of LED lamp it is very important to improve the heat dissipation characteristics. In the present embodiment 7 an explanation will be given of a case in which the heat dissipation performance is improved. In particular, an explanation will be given of a case in which the heat dissipation performance is improved by altering the designs of the shape of the glass bulb 21 and the light-emitting di¬ ode unit 10.
[0232]
Figure 45 is a perspective view of the glass bulb 21 in embodiment 7.
Figure 46 is a perspective view of the glass bulb 21 in embodiment 7, from the opposite direction to that in Figure 45.
Figure 47 is a cross sectional view of the glass bulb 21 in embodiment 7, through AA in Figure 45.
[0233]
The glass bulb 21 comprises an outer bulb 211 and an inner bulb 212. The outer bulb 211 has at one end thereof an aperture 289.
[0234]
The inner diameter of the outer bulb 211 is larger than the outer diameter of the inner bulb 212, and a gap of width F exists uniformly through 360° between the outer bulb 211 and the inner bulb 212.
Inner diameter of outer bulb 211 > Outer diameter of inner bulb 212
Gap of width F = ((inner diameter of outer bulb 211 - outer diameter of inner bulb 212) ÷2)
Gap of width F > 0
[0235]
The length LI of the outer bulb 211 is greater than the length L2 of the inner bulb 212.
Length LI of outer bulb 211 > Length L2 of inner bulb 212 [0236]
A hollow section 214 exists inside the inner bulb 212. The outer circumference of one end of the inner bulb 212 is con¬ nected to the outer bulb 211. The middle section of one end of the inner bulb 212 is open, and air can flow into the hollow section 214. There is a bottom portion 215 at the other end of the inner bulb 212, and the bottom of the inner bulb 212 is blind. The overall shape of the inner bulb 212 is similar to a test tube.
[0237]
The section of the glass bulb in which the inner bulb 212 exists has a 2-layer construction, and the section of the glass bulb in which the inner bulb 212 does not exist has a 1-layer construction.
[0238]
Figure 48 is a front side view of the light-emitting diode unit 10 of embodiment 7. Figure 49 is a plan view of the light-emitting diode unit 10 of embodiment 7.
[0239]
The characteristic of the light-emitting diode unit 10 in embodiment 7 lies in the absence of a pyramid 18 at the top portion of the support member 13 of the light-emitting diode unit 10. Further, the support member 13 of the light- emitting diode unit 10 also does not have a metal base plate 299. Because there is neither a pyramid 18 nor a metal base plate 299, the light-emitting diode unit 10 thus comprises a cylindrical cylinder portion 220 of length L3 which is open at both ends. Light-emitting diodes are all arranged on the outer surface of the cylinder portion 220. The axial support strut 15 is connected only to the linking support strut 16.
[0240]
If the length of the light-emitting diode unit 10 is L4, then the following relationship holds.
LI > L4 > L3 > L2
[0241]
In Figure 49, if the difference between the radii of the inner circumferential circle and the outer circumferential circle of the light-emitting diode unit 10 is I, then
Gap of width F > Thickness I.
[0242]
With the narrowest gap of width F,
Gap of width F = Thickness I.
In order to improve the heat dissipation characteristic it is preferable that the gap of width F = thickness I.
[0243]
Figure 50 is a front side view of the light-emitting diode lamp 20 of embodiment 7.
Figure 51 is a plan view of the light-emitting diode lamp 20 of embodiment 7.
Figure 52 is a front side view of the light-emitting diode lamp 20 of embodiment 7 without the cap 23.
Figure 53 is a dimensioned drawing of the light-emitting diode lamp 20 of embodiment 7.
[0244]
The light-emitting diode lamp 20 in embodiment 7 comprises a light-emitting diode unit 10 and a glass bulb 21.
The light-emitting diode unit 10 comprises a cylindrically shaped cylinder portion 220 on which light-emitting diodes 11 are arranged.
The glass bulb 21 comprises an inner bulb 212 provided inside the cylinder portion 220 of the light-emitting diode unit 10, and an outer bulb 211 provided outside the cylinder portion 220 of the light-emitting diode unit 10.
[0245]
In the abovementioned glass bulb, the cylinder portion 220 is arranged in the space between the outer bulb 211 and the inner bulb 212.
The abovementioned light-emitting diode unit 10 is enclosed in the abovementioned glass bulb 21.
The abovementioned inner bulb 212 is a glass bulb in the shape of a bottomed cylinder which is open at one end and closed at the other end and which has a hollow section at its center. The abovementioned outer bulb 211 is a cylindri- cal glass bulb which is longer than the inner bulb 212.
The abovementioned glass bulb 21 comprises an annular end portion 213 where one end of the inner bulb 212 is attached in a sealed fashion to one end of the outer bulb 211, and a
sealing portion 216 where the other end of the outer bulb 211 is sealed.
[0246]
Figure 53 is a dimensioned drawing of the light-emitting diode lamp 20 of embodiment 7. The difference compared with Figure 14 lies in the addition of the following dimensions which relate to the outer bulb 211 and the inner bulb 212.
E: Diameter of outer bulb 211,
F: Gap width,
H: Radius of inner surface of outer bulb 211
I: Thickness of light-emitting diode unit 10
[0247]
Figures 45 to 53 show a light-emitting diode unit 10 having an octagonal cross section, but the cross section may be he- xagonal or another polygonal shape. The cross section of the light-emitting diode unit 10 may also be circular.
[0248]
The glass bulb 21 may be filled with silicone 290, although this is not shown in the diagrams. Silicone 290 preferably fills the whole of the space between the outer bulb 211 and the inner bulb 212. This is because silicone 290 fills the space on both the outer surface side and the reverse surface side of the light-emitting diode unit 10, facilitating pro¬ motion both of conduction of heat from the outer surface of the light-emitting diode unit 10 to the outer bulb 211 and conduction of heat from the reverse surface of the light- emitting diode unit 10 to the inner bulb 212.
[0249]
Further, because the purpose of the silicone 290 is to dis- sipate heat from the light-emitting diodes 11, it is sufficient to fill only the double tube section in which the cyl¬ inder portion 220 on which light-emitting diodes 11 are arranged exists .
Although not shown in the diagrams, a metal heat dissipat- ing member such as an aluminum fin or the like may be provided in the hollow section 214 of the abovementioned inner bulb 212 of the light-emitting diode lamp 20.
[0250]
Also, although not shown in the diagrams, a heat dissipating coating constituting a heat dissipating member may be applied to either or both of the inner surface and the outer surface of the abovementioned outer bulb 211.
[0251]
Also, although not shown in the diagrams, a heat dissipat¬ ing coating constituting a heat dissipating member may be applied to either or both of the inner surface and the outer surface of the abovementioned inner bulb.
The heat dissipating coating is preferably transparent in order to maintain brightness, but in order to improve the heat dissipation characteristics it may be a gray or light- colored heat dissipating coating or heat dissipating silicone into which metal particles have been mixed.
[0252]
The light-emitting diode lamp in embodiment 7 has the advantage that heat dissipation can also be promoted from the hollow section 214 of the inner bulb 212. By improving the heat dissipation characteristics, luminous flux degradation is reduced and an extended operating life can be achieved.
Also, a portion that is recessed from the center of the distal end is formed, and it is thus possible to provide a light-emitting diode lamp rich with unprecedented aesthetic and design possibilities.
[0253]
Figure 54 is a diagram illustrating the method of manufacturing the light-emitting diode lamp of embodiment 7.
The method of manufacturing a light-emitting lamp of embodiment 7 is characterized in that it is provided with a process Sll in which a glass bulb 21 having a double tube section is manufactured,
a process S12 in which a light-emitting diode unit 10 provided with a cylindrical cylinder portion on which light- emitting elements are arranged is manufactured,
an assembly process S2 in which the light-emitting diode unit 10 is arranged in the space within the double tube section of the abovementioned glass bulb 21,
and a sealing process S3 in which the abovementioned glass bulb 21 is sealed.
[0254]
The process Sll in which the abovementioned glass bulb 21 is manufactured comprises a process in which an inner bulb 212 in the shape of a bottomed cylinder one end of which is open, the other end of which is closed and which has at its center a hollow section is inserted into a cylindrical outer bulb 211 which is open at both ends and which is longer than the inner bulb 212, and one end of the inner bulb 212 is at¬ tached in a sealed fashion to one end of the outer bulb 211.
[0255]
The glass bulb 21 shown in Figure 45, Figure 46 and Figure 47 is prepared using this process.
In a process S12 in which the abovementioned light-emitting diode unit 10 is manufactured, the light-emitting diode unit 10 is manufactured by following the processes explained in embodiments 1 to 5. However, the pyramid 18 is not prepared. The metal base plate 299 is also not used.
[0256]
The light-emitting diode unit 10 shown in Figure 48 is prepared using this process.
The order in which the process Sll to manufacture the abo¬ vementioned glass bulb 21 and the process S12 to manufacture the abovementioned light-emitting diode unit 10 are performed is not important.
In the abovementioned assembly process S2, a flare tube 22 is fitted to the light-emitting diode unit 10 provided with a cylindrical cylinder portion on which light-emitting ele- ments are arranged. Then the light-emitting diode unit 10 is inserted through the aperture 289 of the outer bulb 211, and the cylinder portion 220 is arranged in the space between the outer bulb 211 and the inner bulb 212.
[0257]
The abovementioned sealing process S3 comprises a process in which silicone 290 is injected, gas is exhausted through the exhaust tube 221 and the exhaust tube 221 is sealed.
For the abovementioned assembly process S2 and the above- mentioned sealing process S3, the method of filling the glass bulb 21 with silicone 290 described in embodiment 6 can be employed.
[0258]
Embodiment 8.
In embodiment 8 an explanation will be given of a case in which the light-emitting diode lamp 20 described in embodiments 1 to 7 is used in a street light. Conventionally ex- isting street lights use high-intensity discharge lamps (HID lamps) such as mercury lamps. However, LED lamps are starting to be used as lamps for street lights.
[0259]
Figure 55 is a diagram illustrating an example of a street light.
A support post 310 is erected at ground level by embedding its lower end in the ground. The support post 310 has at its lower portion a power supply arrangement portion 311 in which a power supply is arranged, and is provided at its up- per portion with a socket arrangement portion 312 in which an E-type socket is arranged, and has housed within it two in-support-post electric cables 313 which join the power supply to the socket. Each of the two in-support-post elec¬ tric cables 313 is a cable having a cross sectional area of at least 2.0 square mm. The two in-support-post electric cables 313 are cables which will not suffer insulation breakdown even if conducting an alternating current of 1000V or more or 1500V or more.
[0260]
An E-type socket 314 has two functions, namely to fix the light-emitting diode lamp 20 by being fitted to the E-type cap of the light-emitting diode lamp 20, and to supply power to the E-type cap of the light-emitting diode lamp 20.
[0261]
Either a direct-current power supply 315 or an alternating- current stabilizer 316 is arranged in the power supply arrangement portion 311. The direct-current power supply 315 and alternating-current stabilizer 316 have two input termi-
nals which are connected to a 100V or 200V alternating- current commercial power supply cable which is routed through the ground and is fed in through the lower end of the support post.
The direct-current power supply 315 has a constant current
DC circuit and has two output terminals which output to two cables a constant direct current of approximately 20V- 700mA or 40V-350mA or 80V-200mA, from the 100V or 200V alternating-current commercial power supply.
[0262]
The alternating-current stabilizer 316 has an alternating- current step-up circuit, and has two output terminals which output to two cables an alternating current of 1,000V or 1,500V, from the 100V or 200V alternating-current commercial power supply.
The light-emitting diode lamp 20 is enveloped in a lamp cover 318.
[0263]
Figure 56 is a comparison of specifications of street lights employing HID lamps and street lights employing LED lamps .
A street light consists of a support post, a lamp, a socket, a power supply, electric cables and the like, and com¬ mon causes of malfunction are fused lamps or power supply circuit failure. Therefore, when repairing a street light it is necessary to bring a replacement lamp or a replacement power supply and carry out a replacement.
[0264]
When a street light in which an HID lamp has conventionally been used breaks or reaches the end of its operating life, in order to exchange the HID lamp for an LED lamp, the light-emitting diode lamp 20 described in embodiments 1 to 7 should use an E-type cap which is compatible with the E-type cap of the HID lamp. Also at the same time that the HID lamp is replaced with the LED lamp, the alternating-current sta¬ bilizer for the HID lamp should also be replaced with a direct-current power supply for the LED lamp.
[0265]
Hereafter, streets will contain a mixture of street lights that use conventional HID lamps and street lights that use LED lamps. As shown in Figure 56, the specifications of street lights that use HID lamps differ from those of street lights that use LED lamps, and it must thus be possible to identify clearly street lights that use HID lamps and street lights that use LED lamps when carrying out repairs or replacements .
[0266]
In particular, if the light-emitting diode lamp 20 described in embodiments 1 to 7 uses an E-type cap which is compatible with the E-type cap of HID lamps, then the light- emitting diode lamp 20 described in embodiments 1 to 7 will be physically interchangeable with an HID lamp, and because the alternating-current stabilizer and the direct-current power supply both have two input terminals and two output terminals, thus if they are of a size that can be arranged in the power supply arrangement portion of the support post then the alternating-current power supply and the direct- current power supply will also be physically interchangeable, so there is the possibility of confusion.
[0267]
(1) Correct combination of lamp and power supply
Figure 57 illustrates a case in which although the combina- tion of lamp and power supply is correct, a malfunction occurs due to the thickness of the electric cables. HID lamps operate using an alternating current of at least 1,000V (se¬ veral thousand V) , and they thus employ cables having a cross sectional area of at least 2 square mm, but because LED lamps operate using a direct current of 80V or less, cables having a cross sectional area of 0.75 square mm are em¬ ployed. Therefore if an alternating current of 1,000V or more flows through cables having a cross sectional area of 0.75 square mm then there is the possibility of shorting be- tween the cables, or disconnection or breakage or the like, resulting in an electric shock hazard. In particular, as it is common for support posts to be made of metal, electric shocks and earth leakage can be very dangerous. Thus in the
street light of embodiment 8, thick cables having a cross sectional area of at least 2 square mm are used. If a street light employs thick cables, HID lamps or LED lamps can be lit safely. In other words, a street light that employs thick cables has the advantages of safety and peace of mind in that there is no problem for an HID lamp and an alternat¬ ing-current stabilizer to be replaced with an LED lamp and a direct-current power supply, or for an LED lamp and a direct-current power supply and to be replaced with an HID lamp and an alternating-current stabilizer.
[0268]
(2) Incorrect combination of lamp and power supply
Figure 58 illustrates a case in which the combination of lamp and power supply is incorrect, and a malfunction occurs due to the thickness of the electric cables. If an HID lamp is combined with a direct-current power supply then the HID lamp does not light, but there is no other danger.
[0269]
Further, if thick cables are used with a combination of an LED lamp and an alternating-current stabilizer then the LED lamp does not light, but there is no other danger. With this combination of an LED lamp and an alternating-current power supply, there is a possibility that a voltage of 1,000V or more will be applied to the LED lamp and the electrical cir- cuits within the LED lamp will break, but the electrical circuit of the light-emitting diode lamp 20 is insulated and hermetically sealed within the glass bulb 21, so there is no electric shock hazard, and even in the worst case only the circuit of the LED lamp will be damaged.
[0270]
On the other hand, if thin cables are used with a combina¬ tion of an LED lamp and an alternating-current stabilizer then if the electrical circuit within the LED lamp short circuits, then an alternating current of 1,000V or more flows through the cables having a cross sectional area of
0.75 square mm, and there is the possibility of shorting between the cables, or disconnection or breakage or the like, resulting in an electric shock hazard. Thus for this reason
also, in the street light of embodiment 8, thick cables having a cross sectional area of at least 2 square mm are used. A street light that employs thick cables has the advantage that there is no danger of electric shock even if there is a mistake in the combination of the lamp and the power supply.
[0271]
The street light according to embodiment 8 is characterized in that a light-emitting diode lamp 20 having an E-type cap is used. It is further characterized in that thick cables having a cross sectional area of 2 square mm or more are used .
[0272]
The light-emitting diode lamp 20 is an insulated and water- resistant lamp in which the light-emitting diodes and the electrical circuits are completely closed and completely hermetically sealed by means of the glass bulb 21. Further, if filled with silicone 290, then it is a robust lamp with which glass damage can be prevented, and is a lamp in which the insulation of the section enveloped by the silicone 290 can be maintained even if the glass cracks.
[0273]
An explanation will now be given of a case in which a HID lamp in an existing street light is exchanged for an LED lamp .
Replacing an entire street light including the pole (support post) with an LED lamp street light, not only has a high cost in terms of removing the existing street light, and purchasing and installing a new LED lamp street light, but an environmental burden issue also arises in that a pole that can still be used is disposed of.
[0274]
In other words, there are issues regarding how to replace the light source of a street light that uses an HID lamp such as a mercury lamp that has a relatively low efficiency with a high-efficiency light-emitting diode lamp, while re¬ using equipment such as the support post (pole) of the existing street light in order to reduce the initial equipment
investment, and regarding how to achieve the renewal with the minimum of work.
[0275]
In the present embodiment 8, (1) Equipment to be reused, (2) Equipment to be exchanged, and (3) Method of exchanging, for a case in which an HID lamp in an existing street light is exchanged for an LED lamp, are as follows.
[0276]
(1) Equipment to be reused
Support post 310,
Power supply arrangement portion 311,
Socket arrangement portion 312,
In-support-post electric cables 313,
Lamp socket (E-type socket) 314,
Alternating current commercial power supply cable 317,
Lamp cover 318.
[0277]
(2) Equipment to be exchanged
HID (mercury, metal halide, sodium) lamp -> light-emitting diode lamp 20, alternating-current stabilizer 316 -> direct- current power supply 315.
[0278]
(3) Method of exchanging lamp
The LED lamp used in embodiment 8 is the light-emitting di- ode lamp 20 described in embodiments 1 to 7, power is supplied from an E-type cap, and a power supply for the above- mentioned LED is not contained within the light source por¬ tion including the integral cap.
[0279]
Next, the E-type socket of the existing street light is used without modification, and the E-type socket is provided with the functions of fixing the abovementioned light- emitting diode lamp and supplying it with power.
In addition, the existing fixtures including the pole are reused, and the light-emitting diode lamp power supply is arranged in the space from which the exiting alternating- current stabilizer has been removed.
A direct current is supplied to the E-type socket to drive the LED.
[0280]
The length, width and height of the direct-current power supply 315 for the abovementioned light-emitting diode lamp are all the same as or smaller than the length, width and height of the existing HID stabilizer (alternating-current stabilizer 316) .
The means for fitting the light-emitting diode lamp direct- current power supply, for example screw holes for fixing, holes for fixing, or hooks for fixing, are in the same or similar locations to the means for fitting the existing HID stabilizer, and after the HID stabilizer has been removed from the power supply arrangement portion the light-emitting diode lamp power supply can be installed in the power supply arrangement portion without modification.
[0281]
The E-type cap and E-type socket of the abovementioned light-emitting diode lamp 20 are connected such that the central portion power supply terminal side is positive, and the circumferential side is at ground voltage.
[0282]
Thus an existing HID lamp street light can be modified to a light-emitting diode lamp street light with the minimum of work, and by reusing existing equipment.
[0283]
As described above, the method of exchanging a lamp accord¬ ing to embodiment 8 is a method of exchanging a lamp of a street light which uses a high-intensity discharge lamp hav- ing an E-type cap.
[0284]
The method of exchanging a lamp according to embodiment 8 is provided with
a lamp exchange process in which a high-intensity discharge lamp having an E-type cap is exchanged for a light-emitting diode lamp having an E-type cap,
and a power supply exchange process in which an alternating-current stabilizer which supplies power to the high-
intensity discharge lamp is exchanged for a direct-current power supply which supplies power to the light-emitting di¬ ode lamp.
[0285]
In the abovementioned lamp exchange process the E-type socket is not exchanged, and a light-emitting diode lamp hav¬ ing an E-type cap is fitted to the E-type socket which has not been exchanged.
In the abovementioned power supply exchange process the electric cables are not exchanged, and the direct-current power supply is connected to the electric cables which have not been exchanged.
[0286]
Replacing an entire street light including the pole (sup- port post) with an LED lamp street light, has a high cost associated with removing the existing street light and purchasing and installing a new LED lamp street light, and in addition an environmental burden arises in that a pole that can still be used is disposed of.
[0287]
According to the method of exchanging a lamp of embodiment 8, components of the existing street light are reused as far as possible, and conversion to an energy-efficient LED lamp is possible.
With an HID lamp light in an indoor gymnasium the stabilizer is installed in the vicinity of the ceiling, whereas the lamp stabilizer of an outdoor street light is normally in a location in the lower portion of the support post that allows exchange work to be performed readily, and work to additionally install or exchange an LED power supply can be performed easily by removing a cover. From the point of view of recycling, exchange rather than additional installation is preferable.
[0288]
Two wires run to the socket to which the lamp is connected, and conventionally an alternating current for lighting the HID lamp flows through these, but a direct current for lighting the LED lamp can flow using the existing two electric
cables, and if they have no problems from the point of view of deterioration then the two existing wires can also be re¬ used, with just the lamp being exchanged from a relatively low-efficiency mercury lamp to the abovementioned LED lamp.
[0289]
Here, if the HID lamp to be exchanged is one which has a relatively low efficiency such as a mercury lamp then the beneficial effects of the exchange are enhanced. There are beneficial effects even when sodium lamps or metal hydrate lamps which have a relatively high efficiency are exchanged.
[0290]
It should be noted that as shown in Figure 32 to Figure 34, the street light equipped with the light-emitting diode lamp 20 may be lit in a substantially horizontal direction (Fig- ure 32), or in a base-down (Figure 33) or base-up (Figure 34) configuration.
[0291]
Further, the E-type socket and E-type cap may be either E26 type or E39 type. Further, they need not be E type provided that they fulfill the two functions of fixing the lamp and supplying power, and provided that there is physical fitting compatibility and electrical contact compatibility between the HID lamp and the LED lamp.
[0292]
Embodiment 9.
Figure 59 illustrates an example of a light-emitting diode lamp 20 with improved heat dissipation characteristics.
A glass bulb 21 envelops a portion of a support member 13 of a light-emitting diode unit 10, and another portion of the support member 13 is exposed to the atmosphere. There is an opening in the top portion of the glass bulb 21, and the other portion of the support member 13 of the light-emitting diode unit 10 is exposed and protrudes through the opening. The section in which light-emitting diodes 11 exist is en- veloped by the glass bulb 21. Only the support member 13 is exposed and protrudes. The support member 13 is a metal such as aluminum, and heat dissipation characteristics are im-
proved by the end portion of the support member coming into direct contact with the atmosphere.
[0293]
The open section has a sealing portion 320, and the sealing portion 320 is coated (sealed) using silicone rubber or a glass epoxy type adhesive in order to ensure that it is wa¬ terproof.
[0294]
It should be noted that the cap section may also be coated (sealed) using silicone rubber or a glass epoxy type adhe¬ sive. Coating allows the manufacturing process to be simplified and allows cost to be reduced.
The heat dissipating effect is improved further if the inner surface and the outer surface of the glass bulb 21 are coated with a heat dissipating coating. The limit for glass- enclosed LED lamps is 18w class, but when embodiment 9 is employed the heat dissipation characteristics are improved and thus the capacity can be increased.
[0295]
Figure 60 is another example of a light-emitting diode lamp
20 with improved heat dissipation characteristics.
A metal fin 241 is fitted to the base portion in the vicinity of the cap of the glass bulb 21. The metal fin 241 is annular and its inner diameter is the same as the outer di- ameter of the glass bulb 21, and it is fitted onto the glass bulb 21 by sliding. The metal fin 241 is a metal vane made of aluminum or the like, and dissipation of heat from the glass bulb 21 is improved by the metal fin 241 coming into direct contact with the atmosphere.
[0296]
The metal fin 241 is fitted on as far as a protuberance 242 on the glass bulb 21 in order to fix its location.
The metal fin 241 is fixed in place using silicone rubber or a glass epoxy type adhesive so that it does not come off. The shape and size of the metal fin 214 are set so as not to be a hindrance to the lamp cover 318 for example. Depending on the space in which the metal fin 241 is to be installed, its size and shape may be selected arbitrarily.
In this case, arrangements are made such that the metal fin 241 can be attached and removed.
[0297]
The heat dissipation characteristics are further improved if the inside of the glass bulb 21 is completely filled with silicone 290 or if the glass bulb 21 is filled with silicone 290 up to the portion on which the metal fin 241 exists.
[0298]
Further, the heat dissipating effect is improved if the in- ner surface and the outer surface of the glass bulb 21 are coated with a heat dissipating coating. The limit for glass- enclosed LED lamps is 18w class, but when embodiment 9 is employed the heat dissipation characteristics are improved and thus the capacity can be increased.
[Explanation of the reference numbers]
[0299]
10 light-emitting diode unit, 11 light-emitting diode, 12 flexible substrate, 13 support member, 14 base portion sup¬ port strut, 15 axial support strut, 16 linking support strut, 17 lead wire, 18 pyramid, 20 light-emitting diode lamp, 21 glass bulb, 22 flare tube, 23 cap, 24 housing, 211 outer bulb, 212 inner bulb, 213 annular end portion, 214 hollow section, 216, 320 sealing portion, 218, 219 incision, 220 cylinder portion, 221 exhaust tube, 222 exhaust port, 230 injection needle, 240 glass sheet, 241 metal fin, 242 protuberance, 250 resin, 251 bonding wire, 289 aperture, 290 silicone, 299 metal base plate, 310 support post, 311 power supply arrangement portion, 312 socket arrangement portion, 313 in-support-post electric cable, 314 E-type socket, 315 direct-current power supply, 316 alternating-current stabilizer, 317 alternating-current commercial power supply ca¬ ble, 318 lamp cover.
Claims
Patent claims [Claim 1]
A light-emitting diode lamp characterized in that it is provided with a light-emitting diode unit in which light- emitting diodes are mounted on the side surfaces of a pris¬ matic support member,
and a cylindrical bulb having a prescribed bulb diameter, inside which the abovementioned light-emitting diode unit is arranged,
and in that if the width w of one side surface of the abovementioned support member is fixed at a prescribed width, the distance A from the center of one side surface of the abovementioned support member to the inner surface of the bulb is fixed at a prescribed distance,
and the cross-section through the abovementioned prismatic support member is a regular n-sided polygon, then the above- mentioned n is a value whereby the abovementioned light- emitting diode unit can be arranged inside a cylindrical bulb having the abovementioned prescribed bulb diameter, and is a value which is determined based on the abovementioned prescribed bulb diameter, prescribed width and prescribed distance .
[Claim 2]
The light-emitting diode lamp as claimed in claim 1, characterized in that light-emitting diodes are arranged in a row in the axial direction of the abovementioned support member on the side surfaces of the abovementioned support member,
the circumcircle of the abovementioned regular polygon is arranged concentrically with the abovementioned cylindrical bulb,
and the abovementioned n is the largest value whereby the abovementioned light-emitting diode unit can be arranged in- side the cylindrical bulb having the abovementioned pre¬ scribed bulb diameter.
[Claim 3] The light-emitting diode lamp as claimed in claim 1 or 2, characterized in that the abovementioned support member is formed into a three-dimensional prismatic shape by folding an integrated sheet, forming a plurality of surfaces.
[Claim 4]
The light-emitting diode lamp as claimed in any of claims 1 to 3, characterized in that the width w of a side surface of the abovementioned support member is between 5mm and 20mm.
[Claim 5]
The light-emitting diode lamp as claimed in any of claims 1 to 4, characterized in that the abovementioned distance Ak is between 1mm and 6mm.
[Claim 6]
The light-emitting diode lamp as claimed in any of claims 1 to 5, characterized in that the side surfaces of the above- mentioned support member also function as light-emitting diode element substrates, and the light-emitting diodes are mounted directly on the outer surface of the support member.
[Claim 7]
The light-emitting diode lamp as claimed in any of claims 1 to 5, characterized in that the abovementioned light- emitting diode unit is configured by affixing light-emitting diode element substrates to the plurality of surfaces of the abovementioned support member.
[Claim 8]
The light-emitting diode lamp as claimed in claim 7, characterized in that the width of the abovementioned light- emitting diode element substrates is approximately 10mm.
[Claim 9]
The light-emitting diode lamp as claimed in claim 7 or 8, characterized in that the abovementioned light-emitting di¬ ode element substrates are ribbon-shaped flexible substrates .
[Claim 10]
The light-emitting diode lamp as claimed in any of claims 1 to 9, characterized in that that the bottom surface of the abovementioned polygonal prism is a polygon comprising a re- gular n-sided polygon of which a portion of the vertices has been omitted.
[Claim 11]
The light-emitting diode lamp as claimed in any of claims 1 to 10, characterized in that the abovementioned support member is made of metal.
[Claim 12]
The light-emitting diode lamp as claimed in any of claims 1 to 11, characterized in that the height of the abovemen- tioned support member is larger than the diameter of the circumcircle of the abovementioned support member.
[Claim 13]
The light-emitting diode lamp as claimed in any of claims 1 to 12, characterized in that the shape of the top portion of the abovementioned support member is a polygonal pyramid shape or a trapezoidal polygonal pyramid shape, and light- emitting diodes are arranged on each surface of the above- mentioned polygonal pyramid shape.
[Claim 14]
A lighting fixture characterized in that it is provided with a lighting device and the light-emitting diode lamp as claimed in any of the abovementioned claims 1 to 13.
[Claim 15]
A light-emitting diode lamp characterized in that it is provided with a light-emitting diode unit on which light- emitting diodes are mounted,
a housing having a glass cover which envelops the light emitting surface of the abovementioned light-emitting diode unit and which is arranged inside the light-emitting diode unit,
and a thermally conductive medium with which a gap between the light emitting surface of the abovementioned light- emitting diode unit and the inner surface of the glass cover is filled.
[Claim 16]
The light-emitting diode lamp as claimed in claim 15, characterized in that the abovementioned thermally conductive medium is either a thermally conductive medium comprising a silicone resin that is transparent and electrically insulating, or a thermally conductive medium containing the above- mentioned silicone resin.
[Claim 17]
A method of manufacturing a light-emitting lamp in which the inside of a glass bulb is filled with a thermally con¬ ductive medium, characterized in that it is provided with an assembly process in which a flare tube with an attached exhaust tube is fused to a glass bulb,
after the assembly process, a filling process in which the inside of the glass bulb is filled through the exhaust tube with a thermally conductive medium,
after the filling process, an exhaust process in which gas within the glass bulb is drawn from the exhaust tube by vac- uum,
and after the exhaust process, a tip-off process in which the exhaust tube is sealed.
[Claim 18]
The method of manufacturing a light-emitting lamp as clai- med in claim 17, characterized in that in the abovementioned filling process
an injection needle having an outer diameter that is smaller than the inner diameter of the exhaust tube is inserted into the exhaust tube and the thermally conductive medium is injected into the glass bulb through the injection needle, and injection of the thermally conductive medium by means of the injection needle and exhaustion by means of the exhaust tube are performed simultaneously.
[Claim 19]
The method of manufacturing a light-emitting lamp as claimed in claim 17 or claim 18, characterized in that in the abovementioned filling process
an injection needle that is longer than the exhaust tube is inserted through the exhaust tube, and a thermally conduc- tive medium is injected into the glass bulb through the in¬ jection needle.
[Claim 20] The method of manufacturing a light-emitting lamp as claimed in any of claims 17 to 19, characterized in that in the abovementioned filling process
a thermally conductive medium having a viscosity of 100 pascal seconds or less is injected.
[Claim 21]
The method of manufacturing a light-emitting lamp as claimed in any of claims 17 to 20, characterized in that in the abovementioned sealing process
an exhaust tube having an outer diameter of 4mm or more and
8mm or less, an inner diameter which is smaller than the outer diameter of the tube and which is 0.7mm or more and 5.0mm or less, and a length of 30mm or more and 200mm or less is fitted.
[Claim 22]
The method of manufacturing a light-emitting lamp as claimed in any of claims 17 to 21, characterized in that in the abovementioned filling process
a thermally conductive medium is injected into the inside of the glass bulb using an injection needle having an outer diameter which is smaller than the inner diameter of the exhaust tube and is 0.5mm or more and 4.5mm or less, and an inner diameter which is smaller than the outer diameter of the needle and is 0.2mm or more and 4.0mm or less.
[Claim 23]
The method of manufacturing a light-emitting lamp as claimed in any of claims 17 to 22, characterized in that the abovementioned exhaust process
comprises a vacuum drawing process in which vacuum drawing is performed with a vacuum degree of 30.3 kilopascals or more and 101.3 kilopascals or less.
[Claim 24]
The method of manufacturing a light-emitting lamp as claimed in any of claims 17 to 23, characterized in that the abovementioned exhaust process further comprises a replace¬ ment process in which gas inside the glass bulb is replaced with an inert gas and the vacuum drawing process and replacement process are repeated a plurality of times.
[Claim 25]
A light-emitting diode lamp characterized in that it is provided with a light-emitting diode unit which is provided with a cylindrically shaped cylinder portion on which light- emitting diodes are arranged,
an inner bulb provided inside the cylinder portion of the light-emitting diode unit, and an outer bulb provided out- side the cylinder portion of the light-emitting diode unit.
[Claim 26]
The light-emitting diode lamp as claimed in claim 25, characterized in that the cylinder portion of the abovementioned glass bulb is arranged in the space between the outer bulb and the inner bulb,
and the abovementioned light-emitting diode unit is enclosed in the abovementioned glass bulb.
[Claim 27]
The light-emitting diode lamp as claimed in claim 25 or claim 26, characterized in that the abovementioned inner bulb is a glass bulb in the shape of a bottomed cylinder which is open at one end and closed at the other end and which has a hollow section at its center,
and the abovementioned outer bulb is a cylindrical glass bulb which is longer than the inner bulb,
and the abovementioned glass bulb is provided with an annular end portion where one end of the inner bulb is attached in a sealed fashion to one end of the outer bulb, and a sealing portion where the other end of the outer bulb is sea- led.
[Claim 28]
The light-emitting diode lamp as claimed in claim 27, characterized in that the abovementioned light-emitting diode lamp is further provided in the hollow section of the above- mentioned inner bulb with a heat dissipating member.
[Claim 29] The light-emitting diode lamp as claimed in any of claims 25 to 28, characterized in that the abovementioned light- emitting diode lamp is further
provided with a heat dissipating member on at least the in- ner surface or the outer surface of the abovementioned outer bulb .
[Claim 30]
A method of manufacturing a light-emitting diode lamp, characterized in that it is provided with a process in which a glass bulb having a double tube section is manufactured, a process in which a light-emitting diode unit provided with a cylindrical cylinder portion on which light-emitting elements are arranged is manufactured,
a process in which light-emitting elements are arranged in the space within the double tube section of the abovementioned glass bulb,
and a process in which the abovementioned glass bulb is sealed.
[Claim 31]
The method of manufacturing a light-emitting diode lamp as claimed in claim 30, characterized in that the process in which the abovementioned glass bulb is manufactured comprises a process in which an inner bulb in the shape of a bottomed cylinder one end of which is open, the other end of which is closed and which has at its center a hollow section is inserted into a cylindrical outer bulb which is open at both ends and which is longer than the inner bulb, and one end of the inner bulb is attached in a sealed fashion to one end of the outer bulb,
the process in which the abovementioned light-emitting elements are arranged comprises a process in which the light- emitting diode unit provided with a cylindrical cylinder portion on which light-emitting elements are arranged is inserted into the other end of the outer bulb, and the cylin- der portion is arranged in the space between the outer bulb and the inner bulb, and the process in which the abovementioned glass bulb is sealed comprises a process in which the other end of the ou¬ ter bulb is sealed.
[Claim 32]
A street light characterized in that it is provided with a light-emitting diode lamp having an E-type cap,
an E-type socket to which the E-type cap of the light- emitting diode lamp fits, fixing the light-emitting diode lamp, and which supplies power to the E-type cap of the light-emitting diode lamp,
two in-support-post electric cables connected to the E-type socket,
a direct-current power supply which supplies direct-current power to the two in-support-post electric cables,
and a support post within which the in-support-post electric cables are housed, and which has in its lower portion a power supply arrangement portion in which the direct-current power supply is arranged, and which is provided in its upper portion with a socket arrangement portion in which the E- type socket is arranged.
[Claim 33]
The street light as claimed in claim 32, characterized in that each of the abovementioned two in-support-post electric cables is a cable having a cross sectional area of at least 2.0 square mm.
[Claim 34]
The street light as claimed in claim 32 or claim 33, char¬ acterized in that the abovementioned two in-support-post electric cables are cables which will not suffer insulation breakdown even when conducting an alternating current of 1000V or more.
[Claim 35]
The street light as claimed in any of claims 32 to 34, characterized in that the abovementioned light-emitting diode lamp is an electrically insulated lamp in which an electrical circuit is hermetically sealed by means of a glass bulb.
[Claim 36] A method of exchanging a lamp, being a method of exchanging a lamp of a street light employing a high-intensity dis¬ charge lamp having an E-type cap, characterized in that it is provided with
a lamp exchange process in which a high-intensity discharge lamp having an E-type cap is exchanged for a light-emitting diode lamp having an E-type cap,
and a power supply exchange process in which an alternating-current stabilizer which supplies power to the high- intensity discharge lamp is exchanged for a direct-current power supply which supplies power to the light-emitting diode lamp.
[Claim 37]
The method of exchanging a lamp as claimed in claim 36, characterized in that in the abovementioned lamp exchange process the E-type socket is not exchanged, and a light- emitting diode lamp having an E-type cap is fitted to the E- type socket which has not been exchanged,
and in the abovementioned power supply exchange process the in-support-post electric cables are not exchanged, and the direct-current power supply is connected to the in-support- post electric cables which have not been exchanged.
[Claim 38]
A light-emitting diode lamp characterized in that it is provided with a light-emitting diode unit having light- emitting diodes and a support member on which the light- emitting diodes are mounted,
a glass bulb which envelops a portion of the support member of the abovementioned light-emitting diode unit and from an opening of which another portion of the support member is exposed to the atmosphere,
and a sealing portion where the opening of the abovementioned glass bulb and the support member are sealed.
[Claim 39]
A light-emitting diode lamp characterized in that it is provided with a light-emitting diode unit having light- emitting diodes, a glass bulb which envelops the abovementioned light- emitting diode unit,
and a metal fin fitted to the perimeter of the abovementioned glass bulb.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-155744 | 2011-07-14 | ||
| JP2011155744 | 2011-07-14 | ||
| JP2011244426 | 2011-11-08 | ||
| JP2011-244426 | 2011-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2013007815A1 true WO2013007815A1 (en) | 2013-01-17 |
Family
ID=46634113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2012/063780 WO2013007815A1 (en) | 2011-07-14 | 2012-07-13 | Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp |
Country Status (2)
| Country | Link |
|---|---|
| JP (5) | JP6161872B2 (en) |
| WO (1) | WO2013007815A1 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014180689A1 (en) * | 2013-05-08 | 2014-11-13 | Koninklijke Philips N.V. | Lighting device |
| WO2016154156A1 (en) * | 2015-03-20 | 2016-09-29 | Eye Lighting International Of North Amercia, Inc. | Glass jacketed led lamp |
| WO2017182094A1 (en) * | 2016-04-22 | 2017-10-26 | Osram Opto Semiconductors Gmbh | Led module and method for producing an led module |
| EP3205395A4 (en) * | 2014-10-09 | 2018-04-11 | Toray Industries, Inc. | Photoirradiation device, photoreaction method using same, and method for producing lactam |
| WO2018096027A1 (en) * | 2016-11-25 | 2018-05-31 | Philips Lighting Holding B.V. | Ssl lamp for replacing gas discharge lamp |
| US9995437B2 (en) | 2014-01-29 | 2018-06-12 | Philips Lighting Holding B.V. | LED bulb |
| US10161575B2 (en) | 2015-04-30 | 2018-12-25 | Philips Lighting Holding B.V. | Solid state lighting device and luminaire |
| RU196996U1 (en) * | 2019-10-16 | 2020-03-24 | Юрий Борисович Соколов | LED LAMP |
| WO2022028022A1 (en) * | 2020-08-04 | 2022-02-10 | 东莞市瑞拓科技有限公司 | Novel led stereoscopic light source |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2524097C2 (en) | 2009-06-12 | 2014-07-27 | Марс, Инкорпорейтед | Chocolate compositions containing ethyl cellulose |
| GB2485421B (en) | 2010-11-15 | 2016-05-25 | Mars Inc | Dough products exhibiting reduced oil migration |
| BR112015006942B1 (en) | 2012-09-28 | 2021-04-13 | Mars, Incorporated | FAT-BASED SWEET AND METHOD FOR MAKING A FAT-BASED SWEET |
| JP6288993B2 (en) * | 2013-09-03 | 2018-03-07 | 三菱電機株式会社 | Lighting lamp and lighting device |
| JP6234119B2 (en) * | 2013-09-03 | 2017-11-22 | 三菱電機株式会社 | Lighting lamp and lighting device |
| JP2016115649A (en) * | 2014-12-18 | 2016-06-23 | 岩崎電気株式会社 | LED lamp |
| JP7035499B2 (en) * | 2017-12-14 | 2022-03-15 | 豊田合成株式会社 | Ultraviolet light irradiation sterilizer |
| CN109956517A (en) * | 2017-12-14 | 2019-07-02 | 丰田合成株式会社 | Ultraviolet light sterilizing unit and fluid sterilizing unit |
| JP6897602B2 (en) * | 2018-02-27 | 2021-06-30 | 豊田合成株式会社 | Fluid sterilizer |
| KR20220034456A (en) * | 2020-09-11 | 2022-03-18 | 주식회사 싸이큐어 | Surface and Space LED Sterilization Light Unit |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124781A (en) | 1985-11-25 | 1987-06-06 | Stanley Electric Co Ltd | Led lamp for outdoors |
| JP2009004130A (en) | 2007-06-19 | 2009-01-08 | Sharp Corp | Illuminating device |
| WO2009045438A1 (en) * | 2007-10-03 | 2009-04-09 | Superbulbs, Inc. | Glass led light bulbs |
| EP2108880A2 (en) * | 2008-03-21 | 2009-10-14 | Liquidleds Lighting Corporation | LED lamp and production method of the same |
| JP2010055993A (en) | 2008-08-29 | 2010-03-11 | Toshiba Lighting & Technology Corp | Lighting system and luminaire |
| JP2010182796A (en) | 2009-02-04 | 2010-08-19 | Rohm Co Ltd | Led lamp |
| US20110074296A1 (en) * | 2009-09-28 | 2011-03-31 | Yu-Nung Shen | Light-Emitting Diode Illumination Apparatuses |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52126977A (en) * | 1976-04-19 | 1977-10-25 | Toshiba Corp | Sealing method of filier in bulb |
| JPH0248866Y2 (en) * | 1985-10-15 | 1990-12-21 | ||
| JP2593359B2 (en) * | 1990-07-30 | 1997-03-26 | 株式会社小糸製作所 | How to make a light bulb |
| JPH0697511A (en) * | 1992-07-30 | 1994-04-08 | Kyocera Corp | Imaging device |
| JPH0714549U (en) * | 1993-08-12 | 1995-03-10 | 岩崎電気株式会社 | Electrodeless fluorescent lamp |
| JP2876954B2 (en) * | 1993-09-14 | 1999-03-31 | 日新電機株式会社 | Lighting device |
| JP3366955B2 (en) * | 1995-08-07 | 2003-01-14 | 第一工業製薬株式会社 | Detergent composition for hybrid integrated circuits |
| JP3753291B2 (en) * | 1998-09-30 | 2006-03-08 | 東芝ライテック株式会社 | Light bulb shaped fluorescent lamp |
| JP2004134249A (en) * | 2002-10-10 | 2004-04-30 | Mitsubishi Electric Corp | Lighting device |
| US20040201990A1 (en) * | 2003-04-10 | 2004-10-14 | Meyer William E. | LED lamp |
| JP2005005546A (en) * | 2003-06-13 | 2005-01-06 | Hitachi Lighting Ltd | Led lighting device |
| JP2005108700A (en) * | 2003-09-30 | 2005-04-21 | Toshiba Lighting & Technology Corp | Light source |
| JP3106448U (en) * | 2004-07-08 | 2005-01-06 | 近畿コンクリート工業株式会社 | Outdoor lighting |
| JP3116268U (en) * | 2005-08-30 | 2005-12-02 | 末広産業株式会社 | Lamp unit |
| JP2007165811A (en) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | Light emitting device |
| US20070253198A1 (en) * | 2006-04-29 | 2007-11-01 | Steven John Pelegrin | Street light |
| US7922359B2 (en) * | 2006-07-17 | 2011-04-12 | Liquidleds Lighting Corp. | Liquid-filled LED lamp with heat dissipation means |
| EP2225768B1 (en) * | 2007-11-28 | 2012-05-16 | General Electric Company | Bulb-shaped outer envelope for lamps, method for manufacture thereof, and compact fluorescent lamp therewith |
| JP2011108424A (en) * | 2009-11-13 | 2011-06-02 | Keiji Iimura | Led lamp equipped with fluorescent tube |
| JP2011090843A (en) * | 2009-10-21 | 2011-05-06 | Toshiba Lighting & Technology Corp | Lighting apparatus and lighting fixture |
| JP2011081919A (en) * | 2009-10-02 | 2011-04-21 | Inaba Denki Seisakusho:Kk | Led illumination lamp |
| JP2011096453A (en) * | 2009-10-28 | 2011-05-12 | World Wide Engineering Kk | Led lighting having irradiation direction adjustment mechanism and street light using the same |
| JP2011134442A (en) * | 2009-12-22 | 2011-07-07 | Toshiba Lighting & Technology Corp | Lighting system |
| TW201207315A (en) * | 2010-08-05 | 2012-02-16 | Liquidleds Lighting Corp | Method for manufacturing LED light |
| JP2012064526A (en) * | 2010-09-17 | 2012-03-29 | Toshiba Lighting & Technology Corp | Light-emitting device and lighting fixture |
-
2012
- 2012-04-04 JP JP2012085193A patent/JP6161872B2/en not_active Expired - Fee Related
- 2012-07-13 WO PCT/EP2012/063780 patent/WO2013007815A1/en active Application Filing
-
2015
- 2015-03-09 JP JP2015046272A patent/JP6058052B2/en active Active
- 2015-03-09 JP JP2015046271A patent/JP5968482B2/en active Active
-
2016
- 2016-07-06 JP JP2016134317A patent/JP6289553B2/en not_active Expired - Fee Related
-
2017
- 2017-06-14 JP JP2017116485A patent/JP6391769B2/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124781A (en) | 1985-11-25 | 1987-06-06 | Stanley Electric Co Ltd | Led lamp for outdoors |
| JP2009004130A (en) | 2007-06-19 | 2009-01-08 | Sharp Corp | Illuminating device |
| WO2009045438A1 (en) * | 2007-10-03 | 2009-04-09 | Superbulbs, Inc. | Glass led light bulbs |
| EP2108880A2 (en) * | 2008-03-21 | 2009-10-14 | Liquidleds Lighting Corporation | LED lamp and production method of the same |
| JP2010055993A (en) | 2008-08-29 | 2010-03-11 | Toshiba Lighting & Technology Corp | Lighting system and luminaire |
| JP2010182796A (en) | 2009-02-04 | 2010-08-19 | Rohm Co Ltd | Led lamp |
| US20110074296A1 (en) * | 2009-09-28 | 2011-03-31 | Yu-Nung Shen | Light-Emitting Diode Illumination Apparatuses |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014180689A1 (en) * | 2013-05-08 | 2014-11-13 | Koninklijke Philips N.V. | Lighting device |
| US9989194B2 (en) | 2013-05-08 | 2018-06-05 | Philips Lighting Holding B.V. | Lighting device |
| US9995437B2 (en) | 2014-01-29 | 2018-06-12 | Philips Lighting Holding B.V. | LED bulb |
| EP3205395A4 (en) * | 2014-10-09 | 2018-04-11 | Toray Industries, Inc. | Photoirradiation device, photoreaction method using same, and method for producing lactam |
| WO2016154156A1 (en) * | 2015-03-20 | 2016-09-29 | Eye Lighting International Of North Amercia, Inc. | Glass jacketed led lamp |
| US9958116B2 (en) | 2015-03-20 | 2018-05-01 | Eye Lighting International Of North America, Inc. | Glass jacketed LED lamp |
| US10161575B2 (en) | 2015-04-30 | 2018-12-25 | Philips Lighting Holding B.V. | Solid state lighting device and luminaire |
| WO2017182094A1 (en) * | 2016-04-22 | 2017-10-26 | Osram Opto Semiconductors Gmbh | Led module and method for producing an led module |
| WO2018096027A1 (en) * | 2016-11-25 | 2018-05-31 | Philips Lighting Holding B.V. | Ssl lamp for replacing gas discharge lamp |
| US11022258B2 (en) | 2016-11-25 | 2021-06-01 | Signify Holding B.V. | SSL lamp for replacing gas discharge lamp |
| RU196996U1 (en) * | 2019-10-16 | 2020-03-24 | Юрий Борисович Соколов | LED LAMP |
| WO2022028022A1 (en) * | 2020-08-04 | 2022-02-10 | 东莞市瑞拓科技有限公司 | Novel led stereoscopic light source |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6161872B2 (en) | 2017-07-12 |
| JP2013123027A (en) | 2013-06-20 |
| JP5968482B2 (en) | 2016-08-10 |
| JP2017168454A (en) | 2017-09-21 |
| JP6391769B2 (en) | 2018-09-19 |
| JP6058052B2 (en) | 2017-01-11 |
| JP2015135824A (en) | 2015-07-27 |
| JP6289553B2 (en) | 2018-03-07 |
| JP2016189346A (en) | 2016-11-04 |
| JP2015135825A (en) | 2015-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2013007815A1 (en) | Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp | |
| CA2687529C (en) | Led light bulb with improved illumination and heat dissipation | |
| JP2013123027A5 (en) | ||
| US9080757B2 (en) | Bulb-shaped lamp and lighting device | |
| CN105065945A (en) | LED bulb lamp | |
| WO2013007814A2 (en) | Light-emitting diode lamp and lighting fixture | |
| CN202546349U (en) | Light-emitting diode (LED) bulb | |
| CN204879582U (en) | LED ball bubble lamp | |
| CN103307464A (en) | Light-emitting diode (LED) bulb | |
| CN102770706A (en) | Illumination device | |
| CN104132261A (en) | Efficient radiating type LED lamp | |
| JP6261174B2 (en) | Light emitting diode lamp and lighting device | |
| JP6176901B2 (en) | Light emitting diode lamp and lighting fixture | |
| JP2013026053A (en) | Lamp and lighting fixture | |
| WO2013175689A1 (en) | Lamp and lighting device | |
| CN105987297B (en) | A kind of complete cycle light LED lamp tube | |
| WO2013014822A1 (en) | Lamp and lighting device | |
| CN102865558A (en) | Semiconductor illuminating device | |
| JP6176902B2 (en) | Light emitting diode lamp and lighting fixture | |
| WO2013084407A1 (en) | Lamp and illuminating apparatus | |
| JP6067074B2 (en) | Light emitting diode lamp and method for manufacturing light emitting diode unit | |
| WO2021256818A1 (en) | Incandescent light bulb-type led lamp having heat-dissipation function | |
| WO2013084389A1 (en) | Lamp and illumination device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12743695 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 12743695 Country of ref document: EP Kind code of ref document: A1 |