JP2012064526A - Light-emitting device and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device with improved heat-radiating performance and improved adaptability to a lighting fixture and the lighting fixture having the light-emitting device.SOLUTION: The light-emitting device 1 includes a light-emitting body 2 having semiconductor light-emitting elements 8, a device body 3 for mounting the light-emitting body 2 at one end side 3a and having a base 25 at the other end side 3b, a lighting-up device 4 stored in the device body 3 and operated with supply of power through the base 25 for lighting up the semiconductor light-emitting elements 8, an enclosure 5 made of a material having translucency and flexibility and mounted at the one end side 3a of the device body 3 so as to cover the light-emitting body 2, and a filler 6 made of a material having tranlucency and fluidity and filled in the enclosure 5.

Description

  One embodiment of the present invention relates to a light-emitting device that uses a semiconductor light-emitting element as a light source and uses the emitted light of the semiconductor light-emitting element for illumination, and a lighting fixture including the light-emitting device.

  In recent years, as a measure against global warming, environmental protection, and the like, LED bulbs that consume less power and have a longer life are used instead of general incandescent bulbs and bulb-type fluorescent lamps. An LED bulb is usually a light emitting body (LED module) formed by mounting a plurality of light emitting diodes on a substrate, an apparatus main body in which this light emitting body is disposed on one end side and a base is attached to the other end side ( Casing), a lighting device that is provided in the device main body and lights a light emitting diode, and an enclosure such as a glove attached to one end of the device main body.

  In order to obtain a predetermined light output, the LED bulb is equipped with a high output type light emitting diode and a large number of light emitting diodes in the light emitting body, and therefore, it is a problem to efficiently dissipate heat generated from the light emitting diode. It has become. For this reason, for example, the apparatus body is formed of a metal having a relatively high thermal conductivity such as aluminum (Al), and a large number of wing-like irregularities (radiation fins) are formed on the outer surface of the apparatus body to increase the heat radiation area. is doing.

  In addition, an LED bulb has been proposed in which a bulb-shaped shell (enclosure) is attached to a base (base) configured to be fitted in an electric socket, and a thermally conductive plastic material is filled in the shell. (See Patent Document 1). In this LED bulb, the shell is made of a plastic such as polycarbonate, and the plastic material filled in the shell is cured at a temperature lower than a temperature at which the light emitting diode can be damaged.

  Furthermore, an LED bulb that fills a shell with a thermally conductive fluid has been proposed (see Patent Document 2). The fluid is, for example, water or mineral oil, and is completely or partially filled in the shell.

JP-T 2009-535783 (pages 12-13, FIG. 1) JP-T 2009-535784 (page 11, FIG. 1)

  Since an LED bulb is a rigid body having a predetermined shape (globe), the enclosure is an instrument when it is intended to be attached to an existing lighting fixture to which a general incandescent bulb or a bulb-type fluorescent lamp is attached. You may not be able to wear it by hitting it.

  An object of this invention is to provide the light-emitting device which heat dissipation improves, and the adaptability to a lighting fixture improves, and the lighting fixture which comprises this light-emitting device.

  A light emitting device according to an embodiment of the present invention includes a light emitter, a device body, a lighting device, and an enclosure.

  The light emitter has a semiconductor light emitting element. Here, the semiconductor light emitting element is a light emitting diode (LED) or an organic electroluminescence (EL) element provided on one surface side of the substrate.

  The main body of the apparatus has a light emitter attached to one end thereof and a base on the other end thereof. The base is connected to the input side of the lighting device and allows the lighting device to input an external power source, and is formed of, for example, an E shape or a pin shape.

  The lighting device is accommodated in the device main body. The lighting device is configured to operate by being supplied with power through a base of the device body, and to light the semiconductor light emitting element.

  The enclosure is made of a material having translucency and flexibility, and is attached to one end side of the apparatus main body so as to cover the light emitter. The enclosure is filled with a filler made of a material having translucency and fluidity, for example.

  According to the embodiment of the present invention, the envelope is made of a flexible material. Therefore, when the envelope is filled with a filler made of air or a material having translucency and fluidity, The outer shape can be deformed by pressing, and it can be expected that the suitability of the light emitting device to the lighting fixture is improved. Further, by using or containing a material having thermal conductivity in the filling material filled in the enclosure, it is possible to quickly dissipate the heat generated by the semiconductor light emitting element also from the enclosure side. It can be expected to improve.

It is a schematic side view of the light-emitting device showing Example 1 of the present invention. Similarly, it is a schematic sectional side view of a light-emitting device. Similarly, it is an enlarged view of the apparatus main body in FIG. Similarly, it is a partially cutaway schematic side view in which the outer shape of the light emitting device is deformed. It is a schematic sectional side view of the light-emitting device which shows Example 2 of this invention. It is a partial notch schematic side view of the lighting fixture which shows Example 3 of this invention. It is a partial notch schematic side view of the lighting fixture which shows Example 4 of this invention. Similarly, it is a schematic perspective view of a lighting fixture.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  A light emitting device 1 according to an embodiment of the present invention is configured as shown in FIGS. In FIG. 2, the light emitting device 1 is an LED light bulb that is attached to and detached from a light bulb socket, and includes a light emitting body 2, a device body 3, a lighting device 4, an enclosure 5, and a filler 6.

  As shown in FIG. 3, the light emitter 2 is formed by including a substrate 7, a plurality of LED chips 8 as semiconductor light emitting elements, and a sealing resin 9. The substrate 7 is made of, for example, an aluminum (Al) metal plate, and has an outer shape of, for example, a substantially square shape. The LED chip 8 is formed to emit blue light, for example, and is mounted on the substrate 7 by a COB (Chip On board) method. That is, the light emitter 2 includes a plurality of LED chips 8 mounted in a matrix on one surface side 7a of the substrate 7 via an insulating layer having high thermal conductivity (not shown). A bank 10 is provided. The bank 10 is filled with a sealing resin 9 such as a silicone resin for covering and sealing the LED chip 8. The sealing resin 9 is mixed with a yellow phosphor (not shown) that is excited by a part of blue light from the LED chip 8 and emits yellow light. In the light emitting body 2, the surface of the sealing resin 9 becomes a light emitting surface, and white light is emitted from the light emitting surface.

  And the board | substrate 7 has attached the heat sink 11 to the other surface 7b. The heat radiating plate 11 is made of a metal plate having high thermal conductivity, such as an aluminum (Al) plate, and is formed in a circular shape, for example, and is fixed to the substrate 7 with a high thermal conductive adhesive. The heat radiating plate 11 transfers heat generated from the lighting (light emission) of the LED chip 8 from the substrate 7 and transfers the heat to the apparatus main body 3.

  In addition, the board | substrate 7 may be formed with resin materials, such as a glass epoxy material and a paper phenol material, and may itself be formed with the ceramic board etc. which have insulation.

  The apparatus body 3 includes a metal case 12 and a resin case 13. The metal case 12 is made of a metal material such as aluminum (Al) having a high thermal conductivity, and is formed so as to increase in diameter from the other end side 12b toward the one end side 12a. Here, the metal case 12 is made of aluminum (Al). Note that the metal case 12 may be formed of a resin or ceramic having good thermal conductivity.

  The metal case 12 has a plurality of heat radiation fins 14 extending radially from the outer surface 12c along the direction from the one end side 12a to the other end side 12b. A flat mounting portion 15 to which the heat radiating plate 11 is mounted in surface contact is formed on the upper surface of the one end side 12a, and a peripheral wall portion 16 is formed so as to protrude outward from the mounting portion 15. Has been. An annular step 17 to which the enclosure 5 is attached is formed on the outer side of the peripheral wall 16.

  A through hole 18 is formed in the center of the attachment portion 15 so as to penetrate from the attachment portion 15 to the outer surface 12c on the other end side 12b. The through-hole 18 is formed in a tapered truncated cone shape that gradually decreases in diameter from the attachment portion 15 toward the other end 12b. A square fitting recess 19 is formed at the edge of the through hole 18 of the attachment portion 15. A plurality of fitting recesses 19 are formed at equal intervals around the through hole 18. The mounting portion 15 is formed with a plurality of screw holes (not shown) for screwing the heat sink 11. Furthermore, an annular groove 20 along the peripheral wall portion 16 is formed in the attachment portion 15.

  The heat sink 11 is attached to the mounting portion 15 by screwing a screw (not shown) into a screw hole (not shown) via the heat sink 11. Here, the heat sink 11 is formed in a size that covers the through hole 18 and covers the fitting recess 19. That is, the other surface 7 b of the substrate 7 of the light emitter 2 is attached to the attachment portion 15 via the heat radiating plate 11, and the light emitter 2 is attached. Thus, the metal case 12 has the substrate 7 of the light emitter 2 attached to one end side 12a thereof.

  A mounting plate 21 that surrounds the light emitter 2 and the heat radiating plate 11 is fitted in the groove 20 of the mounting portion 15. The upper surface of the mounting plate 20 and the upper surface of the peripheral wall portion 16 are substantially in the same plane.

  The heat radiating fins 14 are formed so as to be smoothly inclined so that the protruding amount in the radial direction increases from the other end side 12b of the metal case 12 to the one end side 12a. Further, as shown in FIG. 1, the radiating fins 14 are formed radially at substantially equal intervals in the circumferential direction of the metal case 12, and a gap 22 is formed between the radiating fins 14, 14. The gap 22 is opened toward the other end side 12 b and the periphery of the metal case 12, and is closed on the one end side 12 a of the metal case 12. An annular peripheral wall 16 is formed on one end side of the radiating fin 14 and the gap 22. The metal case 12 is molded as described above, for example, by aluminum die casting.

  The resin case 13 of the apparatus main body 3 is formed of an electrically insulating synthetic resin such as polybutylene terephthalate (PBT) resin. As shown in FIG. 3, the outer peripheral surface 13 c is formed so as to be close to the inner wall surface 18 a of the through hole 18 of the metal case 12 and along the inner wall surface 18 a of the through hole 18. That is, the portion having the outer peripheral surface 13c is formed in a substantially truncated cone shape. And the fitting convex part 23 which protrudes outward from the outer peripheral surface 13c is formed in the edge part of the one end side 13a of the outer peripheral surface 13c. The fitting projections 23 are formed, for example, in a rectangular shape having a predetermined thickness, and two are formed so as to face each other at intervals of 180 ° around the opening edge of the outer peripheral surface 13c. . That is, the fitting convex portion 23 is provided corresponding to the fitting concave portion 19 of the metal case 12 and is fitted into the fitting concave portion 19. The resin case 13 is disposed inside the through hole 18 of the metal case 12 by fitting the fitting convex portion 23 and the fitting concave portion 19 together.

  The fitting convex portion 23 is formed in a shape and size to be fitted into the fitting concave portion 19, and is formed so that the heat radiating plate 11 does not ride on. That is, the fitting projection 23 is formed in a shape or size that does not protrude from the fitting recess 19 to the mounting portion 15. In the resin case 13, the fitting convex portion 23 is fitted into the fitting concave portion 19 of the metal case 12, and the fitting convex portion 23 and the fitting concave portion 19 are fitted to each other to restrict mutual rotation, thereby It is fixed to the case 12.

  In the resin case 13, the other end side 13b of the outer peripheral surface 13c protrudes outward from the outer surface 12c of the other end side 12b of the metal case 12, and a cylindrical protruding portion 24 having a bottom on the other end side 13b. Is formed. The outer diameter of the protrusion 24 is somewhat smaller than the other end side 13 b of the resin case 13. The projection 24 is provided with a base 25 by caulking, for example. As described above, the apparatus body 3 has the base 25 on the other end side 12 b of the metal case 12 via the protruding portion 24.

  In addition, a groove 27 is formed in the bottom plate portion 26 of the protruding portion 24, and the lighting device 4 is supported in the groove 27. Further, the bottom plate portion 26 is provided with an insertion hole (not shown) through which a lead wire (not shown) that electrically connects the lighting device 4 and the base 25 is inserted.

  The base 25 can be connected to, for example, a socket for an E17 general lighting bulb. The base 25 is fitted to the protruding portion 24 of the resin case 13 and fixed by being crimped, an insulating portion 29 provided on the other end side of the shell portion 28, and a top portion of the insulating portion 29. The eyelet portion 30 is provided. A lead wire (not shown) is connected to the shell portion 28 and the eyelet portion 30. The lead wire is introduced into the resin case 13 through an insertion hole (not shown) provided in the bottom plate portion 26 of the projecting portion 24 and is electrically connected to the lighting device 4.

  The lighting device 4 lights the LED chip 8 of the light emitter 2 and is accommodated in the resin case 13. That is, it is accommodated inside the apparatus main body 3. The lighting device 4 includes a substrate 31 and electrical components such as a transformer T1 and an electronic component 32 mounted on the substrate 31. The substrate 31 is made of a synthetic resin plate such as a glass epoxy material or a metal plate such as aluminum (Al). In the case of a metal plate, an insulating layer is formed and electric parts are mounted. And since the outer peripheral surface 13c of the resin case 13 is formed in the tapered substantially truncated cone shape which diameter is gradually reduced as it goes to the other end side 13b from the one end side 13a, the board | substrate 31 is the other end side 31b from the one end side 31a. It is formed to be narrower step by step as it goes to.

  The substrate 31 is inserted into the groove 27 of the bottom plate portion 26 of the resin case 13 and supported by the bottom plate portion 26. In addition, support plates 33 a to 33 d are attached to the substrate 31. The support plates 33a to 33d are fixed to the inner wall surface 13d of the resin case 13 with an adhesive. Thus, the lighting device 4 is housed inside the resin case 13 and is fixed to the resin case 13. The lighting device 4 is connected to the base 25 and the substrate 7 of the light emitter 2 by lead wires (not shown).

  The lighting device 4 operates by being supplied with power from an external power source via a base 25 and a lead wire (not shown), rectifies and smoothes the AC voltage of the external power source, and supplies a constant current to the light emitter 2. . The LED chip 8 is lit (emitted) when a constant current is supplied. And white light is radiated | emitted from the light-emitting body 2, this white light passes the filler 6 and the enclosure 5, and is radiated | emitted to external space.

  The envelope 5 is made of a film-like material (resin) having translucency and flexibility, for example, silicone rubber, and is formed in a shape substantially similar to the glass shape of a general incandescent bulb as shown in FIG. 1 or FIG. ing. The enclosure 5 is firmly attached to the peripheral wall portion 16 whose opening end 5 b side is one end side 3 a of the apparatus main body 3 by an annular body 34 and covers the light emitting body 2. Then, as shown in FIG. 2, the enclosure 5 is filled with a filler 6.

  In this embodiment, before the enclosure 5 is attached to the apparatus main body 3, the top 5a is on the lower side with respect to the gravitational direction, and the opening end 5b side is on the upper side with respect to the gravitational direction. Filler 6 is filled. At this time, the enclosure 5 has an unillustrated extending portion that extends from the opening end 5b in FIG. 2, and the filler 6 is filled up to the portion that becomes the opening end 5b. And the ring-shaped annular body 34 is engage | inserted by the outer surface by the side of the opening end 5b.

  Then, when the apparatus main body 3 is inserted up to the opening end 5 b side and the light emitter 2 is embedded in the filler 6, the annular body 34 is fitted into the stepped portion 17 formed on the peripheral wall portion 16 of the apparatus main body 3. To. At this time, the extending portion of the enclosure 5 covers the heat radiating fins 14. As a result, the enclosure 5 filled with the filler 6 is firmly sandwiched between the peripheral wall portion 17 of the apparatus main body 3 and the annular body 34 at the stepped portion 17 of the apparatus main body 3.

  And the annular body 34 is formed in the magnitude | size in which a clearance gap is formed between the side wall by the side of the radiation fin 14 of the surrounding wall part 16. As shown in FIG. The extending part of the enclosure 5 extends in the gap. The extension portion is cut at the step portion 17 by a cutter. Thus, the opening end 5 b side of the enclosure 5 is attached to the one end side 3 a of the apparatus main body 3.

  The annular body 34 is made of a thin metal such as brass, and is formed in a ring shape that can sandwich the enclosure 5. The annular body 34 may be formed into a two-part body that sandwiches the circumference of the peripheral wall portion 16 of the apparatus main body 3 in half.

  In order to further strengthen the attachment of the enclosure 5 and the annular body 34 in the apparatus main body 3, as shown in FIG. 3, the gap between the annular body 34 and the peripheral wall portion 16 is made of, for example, a silicone resin. The adhesive 35 is applied over the circumference of the peripheral wall 16.

  The filler 6 is made of a material having translucency and fluidity, such as urethane resin, and is filled in the envelope 5 in a gel form. The specific gravity of the filler 6 is relatively small, for example, 1.04. On the other hand, the envelope 5 made of silicone rubber has a thickness of 1 mm and a hardness of 10 ° (according to JIS K 6253). Therefore, the envelope 5 has a shape that is generally similar to the glass shape of the original general incandescent bulb, regardless of the installation direction of the light emitting device 1. And since the enclosure 5 has a softness | flexibility, when it presses from the outside, as shown in FIG. 4, a pressure will act on the filler 6 with which the enclosure 5 was filled, and the filler 6 will flow. Thus, the outer shape is deformed. At this time, since the surrounding body 5 has a predetermined hardness, for example, 10 °, it is not easily damaged by deformation.

  When the filling material 6 is filled, as shown in FIG. 3, the insulating portion made of, for example, polypropylene (PP) resin or polycarbonate (PC) resin is provided on the charging portion of the light emitter 2 on one side 7 a of the substrate 7 of the light emitter 2. A film 36 is provided. The insulating film 36 electrically insulates the filler 6 and the charged portion of the light emitter 2 and is attached to the substrate 7 with an insulating adhesive. Here, since the urethane resin as the filler 6 has electrical insulation, the insulating film 36 may not be provided. However, the insulating film 36 is provided in order to make the electrical connection at the charging portion of the light emitter 2 due to thermal expansion and contraction of the filler 6 more secure. That is, it is desirable to provide the insulating film 36.

  The filler 6 may contain a heat conductive material or a light diffusing material. The urethane resin of the filler 6 has a low thermal conductivity, but appropriately transfers the heat generated in the light emitter 2 to the enclosure 5 side. By including a heat conductive material in the urethane resin, the heat generated in the light emitter 2 is quickly transferred from the filler 6 to the envelope 5 and radiated from the envelope 5 to the external space. Moreover, by having a light diffusing material, the white light radiated | emitted from the light-emitting body 2 is diffused, and is radiated | emitted from the enclosure 5 to external space.

  Moreover, you may make it make the filler 6 contain the bubble 37, as shown in FIG. Bubbles 37 can be contained by injecting air into the inside of the filler 6 using, for example, a syringe when the enclosure 5 is filled with the filler 6.

  Next, the operation of the first embodiment of the present invention will be described.

  The light emitting device 1 is mounted on a light bulb socket of a lighting fixture. When an external power supply is supplied to the base 25, the lighting device 4 is operated, and a constant current (electric power) is supplied from the lighting device 4 to the plurality of LED chips 8 of the light emitter 2. The plurality of LED chips 8 emit light, and white light is emitted from the light emitter 2. This radiated light passes through the filler 6 and is radiated from the enclosure 5 to the external space.

  When the light diffusing material is contained in the filler 6, the white light emitted from the light emitter 2 is diffused and emitted from the enclosure 5 to the external space. Thereby, a part of white light is emitted also from the opening end 5b side of the enclosure 5, white light is emitted from the entire enclosure 5, and the entire enclosure 5 appears to shine.

  In addition, when the filler 6 contains bubbles 37, part of the white light emitted from the light emitter 2 is irregularly reflected by the bubbles 37. Thereby, it seems that a part of the enclosure 5 is particularly shining.

  Further, when the LED chip 8 emits light, heat is generated from the light emitter 2. Since the light emitter 2 has a plurality of LED chips 8, corresponding light is generated in the light emitter 2. The heat of the light emitter 2 is transferred to the heat radiating plate 11, transferred from the heat radiating plate 11 to the metal case 12 of the apparatus main body 3, and released from the heat radiating fins 14 and the outer surface 12 c of the metal case 12 to the external space. The The heat of the luminous body 2 is transferred to the filler 6, transferred from the filler 6 to the enclosure 5, and released from the enclosure 5 to the external space. Thereby, the temperature rise of the light-emitting body 2 is suppressed, and the luminous efficiency of the LED chip 8 is prevented from being lowered, the service life is shortened, and the color tone is changed. And if the filler 6 contains a heat transfer material, the heat of the light emitter 2 is more quickly transferred from the filler 6 to the enclosure 5, and the temperature rise of the light emitter 2 is further suppressed.

  Since the envelope 6 has flexibility and the filler 6 has fluidity, when the envelope 6 is pressed against an interference, for example, the filler 6 flows and the envelope 6 The outer shape of is deformed. The white light emitted from the light emitter 2 is emitted from the outer surface of the deformed enclosure 6 to the external space.

  As described above, according to the present embodiment, the enclosure 5 is made of a flexible film-like material such as silicone rubber, and the filler 6 is made of a fluid resin such as a gel-like urethane resin. The outer shape of the surrounding body 5 can be deformed by pressing an interference object or the like, and the compatibility of the light emitting device 1 with the lighting fixture is improved.

  Moreover, since the filler 6 contains a heat conductive material, the heat generated by the light emitter 2 can be quickly dissipated from the surrounding body 5 side, so that the heat dissipation of the light emitting device 1 is improved. Further, the inclusion of the bubbles 37 in the filler 6 has an effect that the radiated light emitted from the light emitter 2 can be specifically emitted and diffused.

  The light emitter 2 uses the LED chip 8 as a semiconductor light emitting element, but is not limited thereto, and may be formed using an LED package. An electroluminescence (EL) element may be used as the semiconductor light emitting element.

  In addition, the filling material 6 is filled in the enclosure 5 after the enclosure 5 is attached to the one end side 3a of the apparatus main body 3, and then a pipe is inserted into the enclosure 5 from the inside of the apparatus main body 3, for example. May be injected through.

  Further, the base attached to the other end side 3b of the apparatus main body 3 is not limited to the E-type base, but may be a GX53 type, G23, or the like.

  FIG. 5 is a schematic cross-sectional side view of a light-emitting device showing Example 2 of the present invention. The same parts as those in FIG.

  The light emitting device 1A shown in FIG. 5 is the same as the light emitting device 1 shown in FIG. 2, except that the enclosure 5 is not filled with the filler 6 but is filled with air 37A. Here, the air 37 </ b> A is filled in the enclosure 5 at atmospheric pressure, but may be filled so as to have a predetermined pressure in the enclosure 5. In addition, when the envelope 5 is not pressed from the outside, the envelope 5 maintains a shape substantially similar to the glass shape of the original general incandescent bulb.

  According to the present embodiment, the envelope body 5 is made of a flexible film-like material such as silicone rubber, and the envelope body 5 is air 37A. Therefore, the outer shape of the envelope body 5 is deformed by pressing an interference object or the like. It becomes possible and it has the effect that the adaptability to the lighting fixture of the light-emitting device 1 improves. And since the filler 6 is not filled in the enclosure 5, it has the effect that the light-emitting device 1A can be made cheap.

  FIG. 6 is a partially cutaway schematic side view of a lighting fixture showing Embodiment 3 of the present invention. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  A lighting fixture 38 shown in FIG. 6 is a downlight that uses the light emitting device (LED bulb) 1 shown in FIG. 1 and is embedded in a ceiling (not shown). Then, a light bulb socket 40 as a socket is disposed on an instrument body 39 formed on a bottomed substantially rectangular object. That is, a mounting plate 43 having a substantially square cross section is attached to a mounting base 41 provided on the upper surface 39 a of the instrument body 39 by a plurality of screws 42. An opening 44 is provided on the upper surface 39 a side of the side surface 39 b of the instrument main body 39. The light bulb socket 40 is attached to the attachment plate 43 such that the light bulb socket 40 is inserted into the opening 44 and the light bulb socket 40 faces the lower surface 39c of the instrument body 39.

  The bulb socket 40 can be connected to the E17-type base 25 of the light-emitting device 1. However, the instrument main body 39 is formed in a size that can accommodate a light-emitting device (bulb) that is smaller than the light-emitting device 1. The instrument body 39 is clamped and fixed to the ceiling by a cover body 45 provided integrally with the instrument body 39 and a pair of leaf springs (not shown).

In the light emitting device 1, the envelope body 5 (not shown) is screwed into the bulb socket 40 by pressing and deforming the enclosure 5 with a finger. After the base 25 is completely screwed (connected) to the light bulb socket 40, the envelope 5 is not pressed with a finger. At this time, the outer surface 5 c of the enclosure 5 of the light emitting device 1 contacts the inner surface 39 d of the instrument main body 39 and deforms according to the drag of the instrument main body 39. The light emitting device 1 is attached to the instrument main body 39 while maintaining the deformation.

When the light bulb socket 40 is energized, the lighting device 4 (not shown) of the light emitting device 1 operates, and power is supplied to each LED chip 8 of the light emitting body 2 (not shown). As a result, white light is emitted from the light emitter 2 and white light is emitted from the outer surface 5 c of the deformed enclosure 5. The radiated light is emitted directly from the opening 46 of the cover body 45 to the lower surface side (floor surface side) as direct light and reflected light reflected by the inner surface 39 d of the instrument main body 39.

  Since the lighting fixture 38 includes the light bulb socket 40 to which the base 25 of the light emitting device 1 can be connected, the light emitting device 1 can be disposed by deforming the enclosure 5 of the light emitting device 1. In other words, the light emitting device 1 has the effect of improving the adaptability to various lighting fixtures because the outer shape of the enclosure 5 can be deformed by the drag (pressing) from the fixture main body 39.

  7 and 8 show a fourth embodiment of the present invention, FIG. 7 is a partially cutaway schematic side view of the luminaire, and FIG. 8 is a schematic perspective view of the luminaire. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  The lighting fixture 47 shown in FIG. 6 is a spotlight that can freely change the irradiation direction, and a light bulb socket 48 as a socket is disposed inside the fixture main body 49. The instrument body 49 is formed in a truncated cone whose upper side 49a is formed into a bottomed cylinder and whose lower side 49b is expanded downward. Then, a light bulb socket 48 is attached to the bottom surface 49c of the upper side 49a via a mounting bracket 50. The E17 type base 25 of the light emitting device 1 is screwed and connected to the socket 48 for the light bulb. The instrument body 49 has a lower side 49b that expands downward, so that its inner surface 49d does not abut (interfere) with the enclosure 5 of the light-emitting device 1 connected to the socket 48 for a light bulb. ing. The instrument body 49 is made of, for example, aluminum (Al), and an inner surface 49d is formed on a reflective surface by white coating.

  As for the instrument main body 49, the universal instrument 51 is attached to the upper surface 49e. The universal device 51 is attached to a plug 53 via an arm 52. As shown in FIG. 8, the plug 53 is attached to a lighting rail 54 attached to the ceiling, for example, so as to be movable on a straight line. And the inclination angle and the inclination direction of the instrument main body 49 are freely adjusted by adjusting the knob 51 a of the universal instrument 51. Thereby, the emission direction of the white light emitted from the light emitting device 1 can be freely changed.

  In the light emitting device 1, when a light diffusing material or a bubble 37 (not shown) is contained in the filler 6, white light is also emitted from the opening end 5 b side of the enclosure 5 as shown in FIG. 7. The white light emitted from the enclosure 5 is emitted directly from the opening 55 of the instrument main body 49 to the lower surface (floor side) as reflected light reflected from the inner surface 49d of the instrument main body 49. And when the white light radiated | emitted from the opening end 5b side of the enclosure 5 becomes reflected light and is radiate | emitted from the opening 55 of the instrument main body 49, it will shine to the back | inner side inside the lower part 49b of the instrument main body 49. looks like. Thereby, white light from the light emitting device 1 appears to be emitted from the entire opening 55 of the instrument body 49, glare due to the directivity of the emitted light of the LED chip 8 is alleviated, and discomfort and discomfort due to the emitted light. Etc. are suppressed.

  In addition, the light emitting device 1 is an instrument made of aluminum (Al) having good heat conductivity from the heat radiation fin 14 and the enclosure 5 of the light emitting body 2 (not shown) through the internal space of the instrument main body 49. Since the heat is transferred to the main body 49 and discharged from the instrument main body 49 to the outside external space, the heat dissipation performance is improved even if the main body 49 is disposed in the substantially sealed instrument main body 49.

DESCRIPTION OF SYMBOLS 1,1A ... LED light bulb as a light-emitting device, 2 ... Light-emitting body, 3 ... Device main body, 4 ... Lighting apparatus, 5 ... Enclosure, 6 ... Filler, 7 ... Substrate, 8 ... LED chip as a semiconductor light-emitting device, 25 ... Base, 37 ... Air bubbles, 38, 47 ... Lighting equipment, 39, 49 ... Main body, 40, 48 ... Light bulb socket as socket

Claims (5)

A light emitter having a semiconductor light emitting element;
An apparatus main body having the light emitter attached to one end side and having a base on the other end side;
A lighting device housed in the device main body, operated by being supplied with power through the base, and lighting the semiconductor light emitting element;
An enclosure made of a material having translucency and flexibility, and attached to one end of the apparatus main body so as to cover the light emitter;
A light-emitting device comprising:   The light emitting device according to claim 1, wherein the enclosure is filled with a filler made of a material having translucency and fluidity.   The light emitting device according to claim 2, wherein the filler has electrical insulation.   The light emitting device according to claim 2, wherein the filler includes bubbles. A light emitting device according to any one of claims 1 to 4;
An instrument body having a socket to which the base of the light emitting device is connected;
The lighting fixture characterized by comprising.

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