JP2011249158A - Light emitting device and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device in which an enclosure covering a semiconductor light-emitting element has fire-retardancy complying with a UL standard and diffusion light is emitted from the enclosure, and a lighting fixture equipped with this light-emitting device.SOLUTION: The light emitting device 1 is equipped with a light emitting body 2 having semiconductor light-emitting elements 7, a device body 3 of which on one end side 3a, the light emitting body 2 is installed and power supply parts 17, 17 are fitted on the other end side 3b, a lighting device 4 which is housed in the device body 3, operates supplied with power through the power supply parts 17, 17, and lights the semiconductor light-emitting elements 7, a resin-made enclosure 5 which is translucent and has fire-retardancy of V0 or more of the UL standard and is installed on one end side 3a of the device body 3 so as to cover the light emitting body 2, and a diffusion body 6 which has translucency and light diffusion property and is installed between the light emitting body 2 and the enclosure 5 so as to cover the semiconductor light-emitting elements 7.

Description

  The present invention relates to a light-emitting device and a lighting fixture that use a semiconductor light-emitting element as a light source and use the emitted light for illumination.

  An LED lamp using a light-emitting diode as a semiconductor light-emitting element as a light source is provided with a glove (enclosure) so as to cover the light-emitting diode, and is formed so that light emitted from the glove is diffused. There is something that is. For example, a glove that has been subjected to diffusion processing (see, for example, Patent Document 1) and a glove that has a diffusion sheet attached to substantially the entire outer surface of the globe (for example, see Patent Document 2) have been proposed. The globe is made of glass or synthetic resin.

  In an LED lamp having a synthetic resin globe, the globe may ignite due to an internal factor such as an ignition caused by an abnormal operation of a lighting device for lighting a light emitting diode or an external factor such as an external fire. For this reason, it is desirable that the globe is made of a synthetic resin and is made of a synthetic resin having flame retardancy. In addition, LED lamps may be exported overseas, and in North America and the like, it is necessary to conform to UL standards.

JP 2009-170114 A (6th page, FIG. 1) JP 2008-91140 A (page 5, FIG. 1)

In the synthetic resin in which the light diffusing fine particles are mixed, a resin having a flame retardant grade conforming to the UL standard is not provided. Moreover, it is troublesome to apply diffusion processing to the synthetic resin, such as scraping the surface of the synthetic resin having flame retardancy or applying silica (SiO ₂ ) to the surface, and the LED lamp is expensive. Has drawbacks.
Further, the glass globe has the disadvantages that it is difficult to be molded into a predetermined shape, is easy to break, is heavier than a resin, and is expensive.

  The present invention provides a light emitting device in which an envelope covering a semiconductor light emitting element has flame retardancy conforming to the UL standard, and diffused light is emitted from the envelope, and a lighting fixture including the light emitting device. Objective.

  The light emitting device according to the embodiment of the present invention includes a light emitter, a device main body, a lighting device, an enclosure, and a diffuser.

  In the embodiment of the present invention, the light emitter is formed by including a substrate and a semiconductor light emitting element provided on one surface (one surface) side of the substrate. The semiconductor light emitting device is a light emitting diode (LED) or an organic electroluminescence (EL) device. The substrate may be either synthetic resin or metal. In the case of metal, an insulating layer is formed, and a semiconductor light emitting element is provided on the insulating layer.

The apparatus main body is formed with a light emitter attached to one end side and a power feeding portion on the other end side. The power supply unit inputs an external power source, and includes a base, a connection pin, a connection terminal, a lead wire (electric wire), a connector, a terminal block, and the like. The light emitter is attached to one end side so that the emitted light of the semiconductor light emitting element is emitted to the outside of the apparatus main body. One end side may be formed with an opening, and a light emitter may be provided in the opening.
Further, the entire device body may be formed of resin, or may be formed of metal by being electrically insulated from the power feeding unit. The higher the heat dissipation, the better the device body.

  The lighting device is accommodated in the device main body, the input side is connected to the power feeding unit of the device main body, and the output side is connected to the semiconductor light emitting element of the light emitter. The lighting device is configured to operate when an external power supply is supplied via the power supply unit, to supply current to the semiconductor light emitting element, and to light the semiconductor light emitting element.

  The envelope is a generic term for a glove, a cover, and the like, and is attached to one end of the apparatus main body so as to cover the light emitter. The enclosure is made of a resin that is translucent and has flame retardancy (flame retardant grade) of UL standard V0 or higher.

The diffuser has translucency and light diffusibility, and is formed so as to cover the semiconductor light emitting element and be provided between the light emitter and the enclosure. The diffuser may be formed of either glass or resin. In addition, light diffusing fine particles may be mixed to have light diffusibility, and irregularities may be formed on the inner surface or outer surface, or silica (SiO ₂ ) or the like may be applied to have light diffusibility. May be.

  According to the first aspect of the present invention, the light emitting device is translucent and has flame retardancy equal to or higher than UL standard V0, and is made of a resin attached to one end side of the device main body so as to cover the light emitting body. Since it has an envelope and a diffuser that has translucency and light diffusibility and is provided between the light emitter and the envelope so as to cover the semiconductor light emitting device, the light emitted from the semiconductor light emitting device is diffused. As a result, it can be emitted from the enclosure to the external space, and even if ignition of the lighting device or a fire occurs in the external space, ignition of the enclosure can be suppressed, and the UL standard can be satisfied.

  According to the second aspect of the invention, since the light emitting device according to the first aspect is provided, the emitted light of the semiconductor light emitting element is diffused and emitted from the fixture body, and ignition of the enclosure of the light emitting device is suppressed. Thus, it is possible to provide a lighting apparatus in which the light emitting device can satisfy the UL standard.

BRIEF DESCRIPTION OF THE DRAWINGS It is a light-emitting device which shows Example 1 of this invention, (a) is a schematic front view, (b) is a schematic bottom view. Similarly, the partially notched schematic front view of a light-emitting device. The schematic front view of the light-emitting device which shows Example 2 of this invention. Similarly, the schematic longitudinal cross-sectional view of a light-emitting device. The schematic perspective view of the lighting fixture which shows Example 3 of this invention. Similarly, the partially cutaway schematic front view of the lighting fixture. The partial notch schematic front view of the lighting fixture which shows Example 4 of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

1 and 2 show a light emitting device according to a first embodiment of the present invention. FIG. 1A is a schematic front view, FIG. 1B is a schematic bottom view, and FIG. 2 is a partially cut schematic front view. It is.
In FIG. 2, the light emitting device 1 includes a light emitter 2, a device body 3, a lighting device 4, an enclosure 5 and a diffuser 6.

  The light emitter 2 is formed by having a light emitting diode 7 as a semiconductor light emitting element and a substrate 8. The light emitting diode 7 is formed having, for example, an LED chip (not shown) that emits blue light and a phosphor (not shown) that covers the LED chip, and emits visible light such as white light. A plurality of the light emitting diodes 7 are mounted on one surface (one surface) 8a of the substrate 8 at substantially equal intervals on, for example, concentric circles.

  The substrate 8 is made of, for example, an aluminum (Al) plate, and is formed in a substantially circular shape. The light emitting diode 7 is mounted on one surface 8a via an insulating layer (not shown) to form a wiring pattern (not shown). The light emitting diodes 7 are connected in series by a wiring pattern. A connector 9 is disposed on one surface 8 a of the substrate 8, and the output cord 10 of the lighting device 4 is connected to the connector 9.

  The apparatus body 3 is configured such that one end side 3 a is a light source unit 11 and the other end side 3 b is a base unit 12. The light source unit 11 is formed by, for example, aluminum die casting, is larger in diameter than the base unit 12, and is formed in a substantially bottomed cylinder having an opening 13. Then, the other surface (the other surface) 8b of the substrate 8 of the light-emitting body 2 is fixed to the center portion of the flat mounting portion (bottom surface portion) 11a with, for example, an adhesive. That is, the light source unit 11 is a mounting unit on which the light emitter 2 is mounted so that the light emitted from the light emitting diode 7 is emitted from the opening 13 to the outside of the light source unit 11. ing.

  On the outer peripheral surface 11c of the side wall 11b of the light source unit 11, as shown in FIG. 1 (a), substantially rectangular recesses 14 having a short width in the outer peripheral direction are formed at substantially equal intervals in the outer peripheral direction. . The maximum depth of the recess 14 is, for example, about ½ of the thickness of the side wall 11b. The concave portion 14 increases the surface area of the outer peripheral surface 11c of the side wall portion 11b, and serves as a heat radiating means that makes it easy to dissipate heat generated in the light emitting diode 7 to the external space.

  In FIG. 2, the outer shape of the base part 12 is formed so as to form a GX53 type base structure, and has a base part main body 15, a projecting part 16, and a pair of connection pins 17, 17 as a power feeding part. Is formed.

  The base part main body 15 and the protruding part 16 are integrally molded into a cylindrical shape having flat upper surfaces 15a and 16a, respectively, by a synthetic resin such as polybutylene terephthalate (PBT) resin. The protruding portion 16 protrudes in the direction of the other end side 3b of the apparatus main body 3 at the central portion of the upper surface 15a of the base body 15, and is formed to have a size that can be inserted into an insertion hole of a well-known socket device (not shown). ing.

  The pair of connection pins 17 and 17 are made of, for example, brass, and are fitted into a hole (not shown) formed on the upper surface 15a of the base body 15 so as to protrude from the upper surface 15a, and are adjacent to the protrusion 16 and It is provided at a position that is 180 ° rotationally symmetrical with the protrusion 16 interposed therebetween. The front ends of the connection pins 17 and 17 are formed with a large diameter.

  The pair of connection pins 17 and 17 are connected to the input lines 19 and 19 connected to the input terminal 18 of the lighting device 4 by, for example, wrapping in the base body 15. The pair of connection pins 17 and 17 are electrically connected to a pair of receptacles of a socket device (not shown).

  A plurality of cylindrical bodies 20 protrude from the inner surface 15 b opposite to the upper surface 15 a of the base body 15. For example, three cylindrical bodies 20 are provided at intervals of 120 ° in the circumferential direction of the base body 15. A screw hole (not shown) is formed in the cylindrical body 20, and a screw 22 is screwed into the screw hole from the mounting portion 11 a of the light source unit 11 through an insulating member 21. As a result, the light source unit 11 has an outer surface (upper surface) 11 e opposite to the mounting portion 11 a in contact with the base unit body 15 and is integrated with the base unit 12.

  The insulating member 21 is made of, for example, polybutylene terephthalate (PBT) resin, and is formed in a dish shape having a flat bottom plate portion 21a. The insulating member 21 firmly connects the light source unit 11 and the base unit 12, and insulates the metal light source unit 11 from the lighting device 4, the pair of connection pins 17 and 17, and the input lines 19 and 19. It plays a role. Holes (not shown) through which the screws 22 are inserted are formed in the mounting portion 11a of the light source portion 11 and the bottom plate portion 21a of the insulating member 21, respectively. Similarly, holes 24 and 25 through which the output cord 10 that connects the output terminal 23 of the lighting device 4 and the connector 9 of the light emitter 2 are inserted are formed.

  Thus, the apparatus main body 3 is formed by integrating the light source portion 11 to which the light emitter 2 is attached on one end side 3a and the base portion 12 having a pair of connection pins 17 and 17 as power feeding portions on the other end side 3b. .

  The lighting device 4 includes a circuit board 26 and lighting circuit components mounted on the circuit board 26. The circuit board 26 is made of, for example, a glass epoxy material, is formed in a substantially circular shape, and a lighting circuit component made up of many types and many electronic components such as a resistor R1, electrolytic capacitors C1 and C2, and a transformer T1 on one surface 26a. Has been implemented.

  The circuit board 26 is provided with the input terminal 18 and the output terminal 23 on one surface 26a thereof. As described above, the input terminal 19 is connected to the input lines 19 and 19 that are electrically connected to the pair of connection pins 17 and 17 of the apparatus body 3, and the external power supply is connected via the input lines 19 and 19. An AC voltage (for example, AC 100 V) is input to the lighting device 4. The output terminal 23 is connected to the output cord 10 connected to the connector 9 of the light emitter 2 as described above.

  Thus, the lighting device 4 is formed with the lighting circuit 27 for lighting the light emitting diode 7 by the lighting circuit components. In other words, it operates when an external power supply is supplied via the input lines 19, 19, rectifies and smoothes the AC voltage of the external power supply, converts it to a predetermined DC voltage, and sets the light emitting diode 7 via the output cord 10. It is configured to supply current.

  The lighting device 4 is accommodated in the protruding portion 16 of the device body 3. That is, the apparatus main body 3 is formed with an upright piece 29 having an upright piece 28 and a locking claw 29a on the inner surface 16b opposite to the upper surface 16a of the protruding portion 16. The circuit board 26 of the lighting device 4 is sandwiched between the standing pieces 28 and 29 in a state in which one surface 26 a side is locked to the locking claw 29 a of the standing piece 29.

  The enclosure 5 is attached to the opening 13 side of the light source unit 11 provided on the one end side 3 a of the apparatus main body 3. The enclosure 5 is formed in a substantially bowl shape with, for example, polycarbonate (PC) resin having translucency and flame retardancy equal to or higher than V0 of UL standard, and a locking piece 30 having a claw portion 30a on the tip side inside thereof. Are provided as a pair. The enclosure 5 is fitted into the outer peripheral surface 11 c on the opening 13 side of the light source unit 11, and the claw portion 30 a of the locking piece 30 is engaged with a locking recess 31 formed on the inner surface 11 d of the side wall portion 11 b of the light source unit 11. It is stopped and attached to the light source unit 11. Thus, the enclosure 5 closes the opening 13 of the apparatus main body 3 and is integrated with the light source 11 to cover the light emitter 2.

  The UL standard is a standard created by a private organization in the United States (Underwriter ’s Laboratolies Incorporated), and is socially trusted as the highest authority on the safety standards of materials, products, equipment and systems in the world. At present, UL standards are generally used as flame retardant certification standards, and vertical combustion test grades (V2, V1, V0, V5) having self-digestibility are used. The flame retardancy is excellent in the order of 5V> V0> V1> V2. The enclosure 5 is formed of 5V or V0 class resin.

  A plurality of protrusions 32 are formed on the outer surface 5 a on the bottom side of the enclosure 5. As shown in FIG. 1B, the protrusions 32 are formed to be 180 ° rotationally symmetric. The protrusion 32 functions as a slip stopper when the enclosure 5 is fitted into the light source unit 11 by hand. The entire enclosure 5 transmits the light emitted from the light emitting diode 7.

  In FIG. 2, the diffuser 6 is made of, for example, polycarbonate (PC) resin having light diffusibility and translucency mixed with light diffusing fine particles such as titanium oxide (TiO 2) and silica (SiO 2). Molded in a bowl shape. And the said polycarbonate (PC) resin has the low flame retardance of V2 of UL specification, for example. The diffuser 6 is sized to cover the light emitter 2 and is sized to be accommodated inside the light source unit 11 and the enclosure 5. The diffuser 6 is fixed to the mounting surface 11 a of the light source unit 11 with an adhesive 33 such as a silicone resin so as to cover the light emitter 2.

  Note that the diffuser 6 may not be fixed to the light source unit 11. That is, for example, a regulation object such as a bank or a wall that regulates the movement of the diffuser 6 on the attachment surface 11 a side is provided on the attachment surface 11 a of the light source unit 11, and the inner surface of the enclosure 5 is disposed on the outer surface side of the diffuser 6. Protrusions or the like that come into contact with each other may be provided so as to be movable with a predetermined clearance. The diffuser 6 may be provided on the one surface 8 a of the substrate 8 of the light emitter 2. That is, the diffuser 6 may be provided between the light emitter 2 and the enclosure 5 so as to cover the light emitting diode 7.

Further, the diffuser 6 may have light diffusibility not by mixing light diffusing fine particles but by surface processing thereof. The diffuser 6 is not limited to a substantially bowl-like shape, and may be, for example, a substantially square box shape, and the shape is not limited.
Next, the operation of the first embodiment of the present invention will be described.

  The protrusion 16 of the device body 3 is inserted into the insertion hole of the socket device (not shown), the pair of connection pins 17 and 17 are inserted into the connection holes of the socket device, and the device body 3 is rotated, so that a pair of The connection pins 17 and 17 are electrically connected to a pair of sockets of the socket device. Thereby, the lighting device 4 can supply an external power supply via the socket device.

  When the external power supply is turned on, an AC voltage (for example, AC 100V) of the external power supply is input to the lighting device 4 via the pair of connection pins 17 and 17 and the input lines 19 and 19. In the lighting device 4, the lighting circuit 27 operates to supply a constant current to the light emitter 2 via the output code line 10. Thereby, the light emitting diode 7 is turned on to emit visible light, for example, white light. The emitted light enters the diffuser 6, is diffused by the diffuser 6, and is emitted from the diffuser 6. The radiated light emitted from the diffuser 6 is transmitted through the enclosure 5 to illuminate the outer surface to be irradiated and the object to be irradiated. The illuminated surface, the illuminated object, and the like are illuminated substantially uniformly by being illuminated by the light diffused radiation.

  If the lighting device 4 operates abnormally and generates heat and ignites, and a flame is generated in the resin-made diffuser 6, a fire or the like may occur on the outside of the light source unit 11 or the enclosure 6 of the device body 3. Even if a flame is generated by the above, the enclosure 5 is formed of a resin having flame retardancy equal to or higher than UL standard V0, so that it is difficult to ignite.

  As described above, the light emitting device 1 of the present embodiment is translucent and has flame retardancy equal to or higher than UL standard V0, and is provided on one end side 3 a of the device body 3 so as to cover the light emitter 2. The resin-made enclosure 5 attached to the light source 11 and the diffuser 6 provided between the light-emitting body 2 and the enclosure 5 so as to cover the light-emitting diode 7 and have translucency and light diffusibility. Therefore, the light emitted from the light-emitting diode 7 can be diffused and emitted from the enclosure 5, and the enclosure 5 can be made difficult to ignite, thereby suppressing the fire of the entire light-emitting device 1. It has the effect of being possible and can meet the UL standard.

  Although the light emitter 2 is formed using the substrate 8, it may be formed such that the light emitting diode 7 is provided on the attachment portion 11 a of the light source unit 11 without using the substrate 8. That is, you may use the attaching part 11a of the light source part 11 as a board | substrate.

  3 and 4 are light-emitting devices showing Example 2 of the present invention, FIG. 3 is a schematic front view, and FIG. 4 is a schematic longitudinal sectional view. The same parts as those in FIG. 2 are denoted by the same reference numerals.

  In FIG. 4, the light emitting device 34 is a mini-krypton bulb-type LED bulb that is attached to and detached from the bulb socket, and includes a light emitter 35, a device body 36, a lighting device 37, an enclosure 38, and a diffuser 39. Has been. The apparatus main body 36 is formed in a metal case 40 and a resin case 41.

  The light emitter 2 is formed by having a substrate 42 and a light emitting diode 43 as a semiconductor light emitting element. The light emitting body 35 is provided with a plurality of light emitting diodes 43 on one side 42 a of the substrate 42. The substrate 42 is made of, for example, an aluminum (Al) metal plate, and has an outer shape of, for example, a substantially square shape.

  The light emitting diode 43 includes, for example, an LED chip 44 that emits blue light, and the LED chip 44 is mounted on the substrate 42 by a COB (Chip On board) method. That is, the LED chip 44 is mounted on one surface side 42a of the substrate 42 via an insulating layer having high thermal conductivity (not shown), and the LED chip 44 is covered and sealed in a dome shape, for example, a sealing resin 45 such as a silicone resin. Is formed. The sealing resin 45 is mixed with a yellow phosphor that is excited by a part of the blue light from the LED chip 44 and emits yellow light. Therefore, the surface of the sealing resin 45 becomes a light emitting surface, and white light is emitted from this light emitting surface.

  And the board | substrate 42 has attached the heat sink 46 to the other surface 42b. The heat radiating plate 46 is made of a metal plate having high thermal conductivity, such as an aluminum (Al) plate, and is formed in a circular shape, for example, and is fixed to the substrate 42 with an adhesive having high thermal conductivity. In the heat radiating plate 46, heat generated with the lighting (light emission) of the LED chip 44 is transferred from the substrate 42, and the heat is transferred to the metal case 40 of the apparatus main body 36.

  The apparatus main body 36 includes a metal case 40 and a resin case 41. The metal case 40 is made of a metal material having high thermal conductivity, and is formed so as to expand in diameter from the other end side 40b toward the one end side 40a. Here, the metal case 40 is made of aluminum (Al).

  In addition, the metal case 40 has a plurality of radiating fins 47 radially formed on the outer surface 40c along the direction from the one end side 40a to the other end side 40b. A flat mounting portion 48 of the light emitter 35 to which the heat radiating plate 46 is mounted in surface contact is formed on the upper surface of the one end side 40a, and an annular envelope mounting portion 49 for mounting the envelope 38 is provided. It is formed so as to protrude outward from the mounting portion 48. The enclosure attachment portion 49 is a maximum outer diameter portion of the apparatus main body 36.

  A through hole 50 is formed in the center of the attachment portion 48 so as to penetrate from the attachment portion 48 to the outer surface 40c on the other end side 40b. The through-hole 50 is formed in a tapered truncated cone shape that gradually decreases in diameter from the attachment portion 48 toward the other end side 40b. A square fitting recess 51 is formed at the edge of the through hole 50 of the mounting portion 48. A plurality of fitting recesses 51 are formed at equal intervals around the through hole 50. The mounting portion 48 is formed with a plurality of screw holes (not shown) for screwing the heat radiating plate 46. Further, an annular groove 52 is formed in the attachment portion 48 along the peripheral wall portion of the enclosure attachment portion 49.

  The heat sink 46 is attached to the mounting portion 48 by screwing screws (not shown) through screw holes (not shown) through screw holes (not shown). Here, the heat radiating plate 46 is formed in a size that covers the through hole 50 and covers the fitting recess 51. That is, the other surface 42 b of the substrate 42 of the light emitter 35 is attached to the attachment portion 48 via the heat radiating plate 46, and the light emitter 35 is attached. Thus, the metal case 40 has the substrate 42 of the light emitter 35 attached to one end side 40a thereof. In addition, although it is preferable that the heat sink 46 is formed in the magnitude | size which covers the whole region of the fitting recessed part 51, you may be formed in the magnitude | size which covers a part of fitting recessed part 51. FIG.

  A mounting plate 53 that surrounds the light emitter 35 and the heat radiating plate 46 is fitted in the groove 52 of the mounting portion 48. A gap 54 is formed between the mounting plate 53 and the peripheral wall portion of the enclosure mounting portion 49. The upper surface of the mounting plate 53 and the upper surface of the enclosure mounting portion 49 are substantially flush.

  The radiating fins 47 are formed so as to be smoothly inclined so that the amount of protrusion in the radial direction increases from the other end side 40b of the metal case 40 to the one end side 40a. Further, as shown in FIG. 3, the radiating fins 47 are formed radially at substantially equal intervals in the circumferential direction of the metal case 40, and a gap 55 is formed between the radiating fins 47, 47. The gap 55 is opened toward the other end side 40 b and the periphery of the metal case 40, and is closed on the one end side 40 a of the metal case 40. An annular enclosure mounting portion 49 is formed on one end side of the heat radiation fin 47 and the gap 55. The metal case 40 is formed as described above, for example, by aluminum die casting.

  The enclosure 38 is attached to the enclosure attachment part 49. The enclosure 38 is made of, for example, polycarbonate (PC) resin having translucency and flame retardancy equal to or higher than UL standard V0, and is molded into a substantially spherical shape so as to cover the light emitting body 35.

  As shown in FIG. 4, the other end side 38 b of the enclosure 38 is opened, and the opening edge is fitted into a gap 54 between the enclosure attachment portion 49 and the attachment plate 53 of the metal case 40. A fitting portion 56 is formed. The enclosure 38 has a fitting portion 56 fitted in the gap 54 and is fixed with an adhesive or the like. Thus, the enclosure 38 is attached to the one end side 40 a of the metal case 40 so as to cover the light emitter 35.

  The resin case 41 of the apparatus main body 36 is formed of an electrically insulating synthetic resin such as polybutylene terephthalate (PBT) resin. The outer peripheral surface 41 c is formed so as to be close to the inner wall surface 50 a of the through hole 50 of the metal case 40 and along the inner wall surface 50 a of the through hole 50. That is, the portion having the outer peripheral surface 41c is formed in a substantially truncated cone shape. And the fitting convex part 57 which protrudes outward from the outer peripheral surface 41c is formed in the edge part of the one end side 41a of the outer peripheral surface 41c. The fitting projections 57 are formed in, for example, a quadrangular shape having a predetermined thickness, and two are formed so as to face each other at intervals of 180 ° around the opening edge of the outer peripheral surface 41c. . That is, the fitting convex portion 57 is provided corresponding to the fitting concave portion 51 of the metal case 40 and is fitted into the fitting concave portion 51. The resin case 41 is disposed inside the through hole 50 of the metal case 40 by fitting the fitting convex portion 57 and the fitting concave portion 51 together.

  The fitting convex portion 57 is formed in a shape and size to be fitted into the fitting concave portion 51, and is formed so that the heat radiating plate 46 does not ride on. That is, the fitting convex portion 57 is formed in a shape or size that does not protrude from the fitting concave portion 51 to the attachment portion 48. In the resin case 41, the fitting convex portion 57 is fitted into the fitting concave portion 51 of the metal case 40, and the fitting convex portion 57 and the fitting concave portion 51 are fitted to each other to restrict mutual rotation, thereby It is fixed to the case 40.

  In the resin case 41, the other end side 41b of the outer peripheral surface 41c protrudes outward from the outer surface 40c of the other end side 40b of the metal case 40, and a bottomed cylindrical protruding portion 58 on the other end side 41b. Is formed. The outer diameter of the protrusion 58 is somewhat smaller than the other end 41 b of the resin case 41. The protrusion 58 is provided with a base 59 as a power feeding portion by caulking, for example. As described above, the apparatus main body 36 has the base 59 on the other end side 40 b of the metal case 40 via the protruding portion 58.

  In addition, a groove 61 is formed in the bottom plate portion 60 of the protruding portion 58, and the lighting device 37 is supported in the groove 61. Further, the bottom plate portion 60 is provided with an insertion hole (not shown) through which a lead wire (not shown) for electrically connecting the lighting device 37 and the base 59 is inserted.

  The base 59 can be connected to a socket for an E17 type general lighting bulb. The base 59 is fitted to the projecting portion 58 of the resin case 41 and caulked and fixed, an insulating portion 63 provided on the other end side of the shell portion 62, and a top portion of the insulating portion 63. The eyelet part 64 is provided. A lead wire (not shown) is connected to the shell portion 62 and the eyelet portion 64. The lead wire is introduced into the resin case 41 from an insertion hole (not shown) provided in the bottom plate portion 60 of the protruding portion 58 and is electrically connected to the lighting device 37.

  The lighting device 37 lights the light emitting diode 43 of the light emitter 35 and is housed inside the resin case 41. That is, it is accommodated inside the apparatus main body 36. The lighting device 37 includes a substrate 65 and electric components such as a transformer T1 and an electronic component 66 mounted on the substrate 65. The substrate 65 is made of a synthetic resin plate such as a glass epoxy material or a metal plate such as aluminum (Al). In the case of a metal plate, an insulating layer is formed and electric parts are mounted. And since the outer peripheral surface 41c of the resin case 41 is formed in the tapered substantially truncated cone shape which diameter is gradually reduced as it goes to the other end side 41b from the one end side 41a, the board | substrate 65 is the other end side 65b from the one end side 65a. It is formed to be narrower step by step as it goes to.

  The substrate 65 is inserted into the groove 61 of the bottom plate portion 60 of the resin case 41 and supported by the bottom plate portion 60. Further, support plates 67 a to 67 d are attached to the substrate 65. The support plates 67a to 67d are fixed to the inner wall surface 41d of the resin case 41 with an adhesive. Thus, the lighting device 37 is housed inside the resin case 41 and is fixed to the resin case 41. The lighting device 37 is connected to the base 59 and the substrate 42 of the light emitting body 35 by lead wires (not shown).

  The lighting device 37 operates by being supplied with power from an external power source via a base 59 and a lead wire (not shown), rectifies and smoothes the AC voltage of the external power source, and supplies a constant current to the light emitter 35. . The LED chip 44 of the light emitting diode 43 is lit (emits light) when a constant current is supplied. Then, white light is emitted from the light emitting diode 43.

The diffuser 39 has a light diffusibility and is formed into a substantially hemispherical shape using a light-transmitting synthetic resin such as polycarbonate (PC) resin. And the said polycarbonate (PC) resin has the low flame retardance of V2 of UL specification, for example. The diffuser 39 is sized to cover the light emitter 35 and is sized to be accommodated inside the enclosure 38. The diffuser 39 is fixed to the mounting plate 53 with the adhesive 33 so as to cover the light emitter 35, that is, to cover the plurality of light emitting diodes 43.
Next, the operation of the second embodiment of the present invention will be described.

  The light emitting device (LED light bulb) 34 is mounted on, for example, an E17 type light bulb socket of a lighting fixture. When an external power supply is supplied to the base 59, the lighting device 37 operates, and constant current (electric power) is supplied from the lighting device 37 to the plurality of LED chips 44 of the light emitter 35. The plurality of light emitting diodes 43 are lit to emit white light.

  The emitted light is incident on the diffuser 39 covering the light emitter 35, is diffused in the diffuser 39, and passes through the diffuser 39. The radiated light that has passed through the diffuser 39 passes through the translucent enclosure 38 and is irradiated on the outer surface to be irradiated or the object to be irradiated. The irradiated surface, the irradiated object, and the like are illuminated substantially uniformly by being irradiated with the light diffused radiation.

  Even if a fire or the like occurs outside the luminaire or the luminaire to which the light-emitting device 34 is attached and a flame occurs outside the enclosure 38, the enclosure 38 is difficult to meet the UL standard V0 or higher. Since it is formed of a resin having flammability, it is difficult to ignite.

  As described above, the light emitting device 34 of the present embodiment is translucent and has flame retardancy equal to or higher than UL standard V0, and is attached to the one end side 40a of the device main body 36 so as to cover the light emitting body 35. Since it includes a resin-made enclosure 38 and a diffusing body 39 that has translucency and light diffusibility and is provided between the light-emitting body 35 and the enclosure 38 so as to cover the light-emitting diode 43, The light emitted from the light emitting diode 43 can be diffused and emitted from the enclosure 38, the enclosure 38 can be made difficult to ignite, and the fire of the entire light emitting device 34 can be suppressed. The UL standard can be satisfied.

  In addition, although the apparatus main body 36 was formed in the metal case 40 and the resin case 41, you may integrally mold these by aluminum die-casting, for example. In this case, the device main body 36, the lighting device 37, and the base 59 may be electrically insulated with an insulating material or the like. Further, the apparatus main body 36 may be formed in a cylindrical shape having one end side 40 a and the other end side 40 b having the same diameter or substantially the same diameter, and the enclosure 38 is larger in diameter than the maximum outer diameter portion of the apparatus main body 36. It may be formed.

  FIGS. 5 and 6 are lighting fixtures showing Embodiment 3 of the present invention, FIG. 5 is a schematic perspective view, and FIG. 6 is a partially cut schematic front view. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  The lighting fixture 68 shown in FIGS. 5 and 6 is a downlight embedded in a ceiling or the like. In FIG. 5, the lighting fixture 68 includes a fixture main body 70 having a socket device 69 as a socket portion and the light emitting device 1 shown in FIG.

  The instrument body 70 is molded by aluminum die casting, has an opening 71 on the lower end side 70a and an annular flange portion 72 protruding outward, closes the upper end side 70b on the upper end side 70b, and is formed in a flat shape. It is formed in a substantially cylindrical box having an upper plate portion 73. Further, on the outer surface 70c of the instrument body 70, reinforcing pieces 74 and 75 that also serve as a plurality of heat radiation fins are formed. Furthermore, a pair of attachment springs 76, 76 are provided on the lower end side 70a of the outer surface 70c so as to sandwich the ceiling or the like with the flange portion 72. And the inner surface 70d of the instrument main body 70 is formed in the reflective surface by white coating, for example.

  A top plate 77 is attached to the outer surface of the upper plate portion 73 with screws 78 or the like. As shown in FIG. 5, the top plate 77 has a terminal block 79 attached to its lower surface 77a. The terminal block 79 is connected to a power line (not shown) from an external power source and a lead line (not shown) connected to the socket device 69.

  And as shown in FIG. 6, the socket apparatus 69 is attached to the inner surface of the upper board part 73 with the screw which is not shown in figure. The socket device 69 is formed with a well-known configuration for mounting the base portion 12 of the apparatus main body 3 which is a GX53 type base. The light emitting device 1 is attached to the socket device 69. In the light emitting device 1, the protrusion 16 of the device main body 3 is inserted into an insertion hole (not shown) of the socket device 69, and the pair of connection pins 17 and 17 are inserted into a pair of connection holes (not shown) of the socket device 69. By being rotated, the socket device 69 is fixed, and the pair of connection pins 17 and 17 are electrically connected to a pair of sockets (not shown) of the socket device 69.

  When external power is supplied to the terminal block 79, the light emitting diode 7 of the light emitting device 1 is turned on to emit visible light such as white light, and the white light is emitted from the enclosure 5. Since the white light is diffuse light, it is emitted directly from the opening 71 of the instrument body 70 as a direct light or reflected light reflected by the inner surface 70d of the instrument body 70, and illuminates the illuminated surface, for example, the floor surface.

  Even if the enclosure 5 of the light emitting device 1 is made of resin and has flame retardancy of UL standard V0 or higher, even if abnormal heat generation occurs in the light emitting device 1, a flame is generated around the instrument body 70. Even if it is difficult to ignite. Therefore, there is an effect that it is possible to provide the lighting fixture 68 in which the light emitting device 1 satisfies the UL standard and the quality and reliability are improved.

  FIG. 7: is a partially notched schematic front view of the lighting fixture which shows Example 3 of this invention. The same parts as those in FIG.

  A lighting fixture 80 shown in FIG. 7 is a downlight that uses the light emitting device 34 shown in FIG. 3, and is embedded in the ceiling 81. A light bulb socket 83 as a socket portion is disposed on an instrument body 82 having an outer shape formed in a substantially cylindrical shape with a bottom. The instrument main body 82 is sandwiched between the ceiling 81 and fixed to the ceiling 81 by a cover body 84 and plate springs 85, 85 that are provided integrally with the instrument main body 82. The light emitting device 34 is attached to the socket 83 for the light bulb.

  When the light bulb socket 83 is energized, the lighting device 37 of the light emitting device 34 operates, and power is supplied to each LED chip 44 of the light emitting body 35. Thereby, the plurality of light emitting diodes 43 are turned on, and white light is emitted from each of the light emitting diodes 43. The emitted light is diffused by the diffuser 39 and emitted from the outer surface of the enclosure 38 as diffused light. The diffused light becomes direct light and reflected light reflected by the inner surface of the instrument body 70 and is emitted from the opening 85 of the cover body 84 to the lower surface side.

  Since the envelope 38 of the light emitting device 34 is a resin having flame retardancy equal to or higher than UL standard V0, the flame generated around the envelope 38 is difficult to ignite. Therefore, it has the effect that the light-emitting device 34 can provide the lighting fixture 80 which satisfy | fills UL specification and improves quality and reliability.

  DESCRIPTION OF SYMBOLS 1,34 ... Light-emitting device, 2,35 ... Light-emitting body, 3,36 ... Device main body, 4,37 ... Lighting device, 5,38 ... Enclosure, 6,39 ... Diffuser, 68,80 ... Lighting fixture, 70 , 82 ... Instrument body

Claims (2)

A light emitter having a semiconductor light emitting element;
An apparatus main body having a light emitter attached to one end and a power feeding unit on the other end;
A lighting device housed in the device main body and operated by being supplied with power through the power supply unit to light the semiconductor light emitting element;
A resin enclosure that is translucent and has flame retardancy equal to or greater than UL standard V0 and is attached to one end of the device body so as to cover the light emitter;
A diffuser having translucency and light diffusivity and provided between the light emitter and the enclosure so as to cover the semiconductor light emitting element;
A light-emitting device comprising: A light emitting device according to claim 1;
An instrument body having a socket part to which the power feeding part of the light emitting device is electrically connected;
The lighting fixture characterized by comprising.