JP2011253787A - Light-emitting device and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of improving extraction efficiency of light and attaining desired light distribution such as parallel beam light and thinning or miniaturizing, and a lighting fixture having the light-emitting device.SOLUTION: The light-emitting device 1 includes a light-emitting body 2 having a semiconductor light-emitting element 7 arranged on a plane, a device body 3 wherein the light-emitting body 2 is mounted at one end side 3a and a base 13 is prepared at the other end side 3b, a lighting-up device 4 stored in the device body 3 and operated with power supplied through the base 13 and lighting up the semiconductor light-emitting element 7, and a light-transmitting envelope 5 having a plane section 31 opposite to the light-emitting body 2 and a Fresnel lens 36 formed to be a zone larger than a light-emitting surface 2a of the light-emitting body 2 at a light-emitting body 2 side of the plane section 31 and mounted at one end side 3a of the device body 3 so as to cover the light-emitting body 2.

Description

  The present invention relates to a light-emitting device and a lighting fixture that use a semiconductor light-emitting element as a light source and use the emitted light for illumination.

  Some LED lamps using a light emitting diode as a semiconductor light emitting element as a light source are provided with an enclosure such as a globe or a cover so as to cover the light emitting diode and are made thinner. As this thin LED lamp, for example, an LED lamp having an IEC standard GX53 type base has been proposed (for example, see Patent Document 1).

  Some LED lamps control the light distribution of light emitted from light emitting diodes. This light distribution control is performed, for example, by providing, for example, a truncated cone-shaped reflecting plate or lens on each light emitting diode element or LED chip. For example, a convex lens is used as the lens (see, for example, Patent Document 2).

JP 2007-157690 (page 3-4, FIG. 1) JP 2007-258114 A (page 4, FIG. 2)

  The LED lamp uses a transparent or milky white material for its enclosure, or has light diffusibility by, for example, prism processing, and performs light extraction according to the application. Here, the transparent enclosure may cause glare light due to glare from the light emitted from the light emitting diode. In addition, in the envelope having light diffusibility, part of the emitted light of the light emitting diode is not emitted from the enclosure due to irregular reflection at the enclosure, and part of the diffused light emitted from the enclosure becomes leakage light. There is a disadvantage that the irradiated surface is not irradiated and the radiation light extraction efficiency with respect to the irradiated surface is thereby lowered.

  In addition, in order to obtain a desired light distribution such as beam-like illumination light, if a light-emitting diode element or an LED chip is provided with a reflector or a convex lens, there is a disadvantage that the cost of the LED lamp increases, The height of the enclosure may become large, and it may be difficult to make the LED lamp thinner or smaller.

  The present invention provides a light emitting device that can improve the light extraction efficiency, obtain a desired light distribution such as parallel light beams, and can be thinned or miniaturized, and a lighting fixture including the light emitting device. For the purpose.

  The light emitting device according to the embodiment of the present invention includes a light emitter, a device main body, a lighting device, and an enclosure.

  The light emitter is formed, for example, having a substrate and a semiconductor light emitting element provided on one surface (one surface) side of the substrate. The semiconductor light emitting device is a light emitting diode (LED) or an organic electroluminescence (EL) device. The substrate may be either synthetic resin or metal. In the case of metal, an insulating layer is formed, and a semiconductor light emitting element is provided on the insulating layer.

  The apparatus main body is formed with a light emitter attached to one end side and a base such as GX53 type or E type on the other end side. The shape of the base is not limited to the GX53 type or E type. The light emitter is attached to one end side so that the emitted light of the semiconductor light emitting element is emitted to the outside of the apparatus main body. The one end side may be formed in a flat shape or may be formed in a box shape having an opening. In the latter case, a light emitter may be provided in the opening.

  Further, the entire device body may be formed of resin, or may be formed of metal by being electrically insulated from the base. In either case of resin or metal, the greater the heat dissipation, the better.

  The lighting device is housed in the device body, and in terms of electrical relation, the input side is connected to the base of the device body, and the output side is connected to the semiconductor light emitting element of the light emitter. The lighting device is formed so that, for example, when commercial power is supplied from the outside through the base, the lighting device operates, converts it into desired power, and stably lights the semiconductor light emitting element.

  The envelope is a generic term for a glove, a cover, and the like, and is attached to one end of the apparatus main body so as to cover the light emitter. The envelope body is translucent and has a flat portion facing the light emitter, and a Fresnel lens is formed on the light emitter side of the flat portion so as to be an area larger than the light emitting surface of the light emitter. ing. Here, the surrounding body may be provided with a side wall portion having light diffusivity standing along the outer periphery at an edge portion of the flat portion, and the side wall portion may be attached to one end side of the apparatus main body. Further, the plane portion may have light diffusibility.

  Further, a cylindrical reflector that houses the semiconductor light emitting element and emits the emitted light of the semiconductor light emitting element to the Fresnel lens may be provided between the apparatus main body and the enclosure.

  According to the present invention, since the light emitting device has the Fresnel lens formed in the area larger than the light emitting surface of the light emitter in the flat portion of the enclosure, the emitted light of the semiconductor light emitting element is, for example, parallel beam light by the Fresnel lens. It is possible to radiate from the envelope with a desired light distribution such as the above, and it is possible to improve the extraction efficiency of the radiated light on the irradiated surface. In addition, the light distribution control of the radiated light of the semiconductor light emitting element is performed by the Fresnel lens, and the reflector and the lens are not individually provided in the semiconductor light emitting element, so that the interval between the light emitting body and the flat portion of the enclosure is increased. Thus, the light emitting device can be reduced in size and thickness.

BRIEF DESCRIPTION OF THE DRAWINGS It is a light-emitting device which shows Example 1 of this invention, (a) is a schematic front view, (b) is a schematic bottom view. Similarly, the schematic longitudinal cross-sectional view of a light-emitting device. The schematic longitudinal cross-sectional view of the light-emitting device which shows Example 2 of this invention. The schematic longitudinal cross-sectional view of the light-emitting device which shows Example 3 of this invention. The schematic front view of the light-emitting device which shows Example 4 of this invention. Similarly, the schematic longitudinal cross-sectional view of a light-emitting device. The schematic perspective view of the lighting fixture which shows Example 5 of this invention. Similarly, the partially cutaway schematic front view of the lighting fixture. The partial notch schematic front view of the lighting fixture which shows Example 6 of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 and 2 show a light emitting device according to a first embodiment of the present invention. FIG. 1A is a schematic front view, FIG. 1B is a schematic bottom view, and FIG. 2 is a schematic longitudinal sectional view.

  In FIG. 2, the light-emitting device 1 includes a light-emitting body 2, a device body 3, a lighting device 4, and an enclosure 5.

  The light-emitting body 2 is formed by including a flat substrate 6, a plurality of LED chips 7 as semiconductor light-emitting elements provided on one surface 6 a of the substrate 6, and a sealing resin 8 that covers the LED chips 7. . The substrate 6 is made of, for example, an aluminum (Al) plate, and is formed in a substantially circular shape. The LED chip 7 is mounted on one surface 6a via an insulating layer (not shown) to form a wiring pattern (not shown). The LED chips 7 are connected in series by a wiring pattern. A connector 9 is disposed on one surface 6 a of the substrate 6, and the output cord 10 of the lighting device 4 is connected to the connector 9.

  The LED chips 7 are provided in a planar shape by being mounted on one surface 6 a of the flat substrate 6, and a plurality of the LED chips 7 are mounted on the concentric circles at substantially equal intervals. The LED chip 7 emits blue light, for example. On one surface 6 a of the substrate 6, for example, a silicone resin bank 11 is formed in a circular shape so as to surround the plurality of LED chips 7. The inside of the bank 11 is filled with a sealing resin 8 to fill the LED chip 7. The outer surface of the sealing resin 8 is formed in a flat shape.

  The sealing resin 8 is a translucent silicone resin, for example, and is mixed with a yellow phosphor (not shown). When the blue light emitted from the LED chip 7 is incident, the yellow phosphor converts the wavelength of the blue light into yellow light. The yellow light and the blue light emitted from the LED chip 7 are emitted from the outer surface of the sealing resin 8 and mixed (mixed light), whereby white light is emitted from the light emitter 2. The outer surface of the sealing resin 8 is a light emitting surface 2 a of the light emitter 2.

  In the apparatus main body 3, one end side 3a is constituted by a light source part 12, and the other end side 3b is constituted by a base part 13 as a GX53 type base. The light source unit 12 is molded by, for example, aluminum die casting, is larger in diameter than the base unit 13, and is formed in a bottomed substantially cylindrical shape having an opening 14. And the other surface 6b of the board | substrate 6 of the light-emitting body 2 is being fixed to the center part of the planar attachment part (bottom part) 12a, for example with the adhesive material. That is, the light source unit 12 is a mounting unit on which the light emitter 2 is disposed so that the emitted light of the LED chip 7 is emitted from the opening 14 to the outside of the light source unit 12. ing.

  On the outer peripheral surface 12c of the side wall portion 12b of the light source unit 12, as shown in FIG. 1A, substantially rectangular recesses 15 having a short width in the outer peripheral direction are formed at substantially equal intervals in the outer peripheral direction. . The maximum depth of the recess 15 is, for example, about ½ of the thickness of the side wall 12b. The concave portion 15 increases the surface area of the outer peripheral surface 12c of the side wall portion 12b, and serves as a heat radiating means that makes it easy to dissipate heat generated in the LED chip 7 to the external space. That is, the outer peripheral surface 12c of the side wall part 12b has a heat dissipating part having a knurled structure.

  In FIG. 2, the base portion 13 is formed in an IEC standard GX53 type base structure, and has a base portion main body 16, a projecting portion 17, and a pair of connection pins 18 and 18.

  The base part main body 16 and the projecting part 17 are integrally molded into a cylindrical shape having flat upper surfaces 16a and 17a by synthetic resin such as polybutylene terephthalate (PBT) resin. The protruding portion 17 protrudes in the direction of the other end side 3b of the apparatus main body 3 at the central portion of the upper surface 16a of the base portion main body 16, and is formed in a size that can be inserted into an insertion hole of a well-known socket device (not shown). ing.

  The pair of connection pins 18 and 18 are made of, for example, brass, and are fitted into a hole (not shown) formed in the upper surface 16a of the base body 16 so as to protrude from the upper surface 16a, and are adjacent to the protrusion 17 and It is provided at a position that is 180 ° rotationally symmetrical across the protrusion 17. The front ends of the connection pins 18, 18 are formed with a large diameter.

  The pair of connection pins 18 and 18 are connected to the input wires 20 and 20 connected to the input terminal 19 of the lighting device 4 by, for example, wrapping inside the base body 16. The pair of connection pins 18 and 18 are electrically connected to a pair of receptacles of a socket device (not shown).

  A plurality of cylindrical bodies 21 protrude from the inner surface 16 b opposite to the upper surface 16 a of the base part body 16. For example, three cylindrical bodies 21 are provided at intervals of 120 ° in the circumferential direction of the base body 16. A screw hole (not shown) is formed in the cylindrical body 21, and a screw 23 is screwed into the screw hole from the mounting portion 12 a of the light source unit 12 via the insulating member 22. As a result, the outer surface (upper surface) 12 e on the opposite side of the mounting portion 12 a is in contact with the base portion main body 16 and is integrated with the base portion 13.

  The insulating member 22 is made of, for example, polybutylene terephthalate (PBT) resin, and is formed in a dish shape having a flat bottom plate portion 22a. The insulating member 22 firmly connects the light source unit 12 and the base unit 13, and insulates the metal light source unit 12 from the lighting device 4, the pair of connection pins 18 and 18, the input lines 20 and 20, and the like. It plays a role. The mounting portion 12a of the light source portion 12 and the bottom plate portion 22a of the insulating member 22 are respectively formed with holes (not shown) through which the screws 23 are inserted. Similarly, holes 25 and 26 through which the output cord 10 for connecting the output terminal 24 of the lighting device 4 and the connector 9 of the light emitter 2 are inserted are formed.

  Thus, the apparatus main body 3 is formed by integrating the light source part 12 to which the light emitter 2 is attached on one end side 3a and the base part 13 as a GX53-type base on the other end side 3b.

  The lighting device 4 includes a circuit board 27 and lighting circuit components mounted on the circuit board 27. The circuit board 27 is made of, for example, a glass epoxy material, is formed in a substantially circular shape, and a lighting circuit component made up of many types and many electronic components such as a resistor R1, electrolytic capacitors C1 and C2, and a transformer T1 on one surface 27a. Has been implemented.

  The circuit board 27 has the input terminal 19 and the output terminal 24 disposed on one surface 27a thereof. As described above, the input terminals 19 are connected to the input lines 20 and 20 that are electrically connected to the pair of connection pins 18 and 18 of the apparatus body 3, and the external power supply is connected via the input lines 20 and 20. An AC voltage (for example, AC 100 V) is input to the lighting device 4. The output terminal 24 is connected to the output cord 10 connected to the connector 9 of the light emitter 2 as described above.

  Thus, the lighting device 4 is formed with the lighting circuit 28 for lighting the LED chip 7 by the lighting circuit components. In other words, it operates when an external power supply is supplied via the input lines 20, 20, rectifies and smoothes the AC voltage of the external power supply, converts it to a predetermined DC voltage, and sets it to the LED chip 7 via the output cord 10. It is configured to supply current.

  The lighting device 4 is accommodated in the protruding portion 17 of the device body 3. That is, the apparatus main body 3 is formed with an upright piece 30 having an upright piece 29 and an engaging claw 30a on the inner surface 17b opposite to the upper surface 17a of the protruding portion 17. The circuit board 27 of the lighting device 4 is sandwiched between the standing pieces 29 and 30 in a state where one surface 27 a side is locked to the locking claw 30 a of the standing piece 30.

  The enclosure 5 is attached to the opening 14 side of the light source unit 12 provided on one end side 3 a of the apparatus main body 3. The enclosure 5 is formed in a substantially bowl shape using, for example, a polycarbonate (PC) resin having translucency, and includes a flat portion 31, an inclined portion 32, a side wall portion 33, and a pair of locking pieces 34 and 34. Is formed.

  The plane part 31 is circular, and the outer surface 31a and the inner surface 31b are formed in a planar shape. The inclined portion 32 is connected to the edge portion (outer peripheral edge) of the flat portion 31 over its circumference and is formed to be slightly inclined toward the inner surface 31 b side of the flat portion 31. The side wall portion 33 is formed so as to be continuous with the edge portion (outer peripheral edge) of the inclined portion 32 over its circumference and to stand substantially perpendicular to the flat surface portion 31. That is, the side wall part 33 stands up substantially at right angles along the outer periphery of the edge part of the flat part 31 via the inclined part 32.

  The pair of locking pieces 34, 34 are provided on the side wall portion 33 at a position where the side wall portion 33 is 180 ° rotationally symmetric, and are provided upright at a substantially right angle with respect to the flat surface portion 31. 34a, 34a. In the enclosure 5, the side wall 33 fits the outer peripheral surface 12 c on the opening 14 side of the light source unit 12, and the claw portion 34 a of the locking piece 34 is formed on the inner surface 12 d of the side wall 12 b of the light source unit 12. The light source portion 12 is attached to the stop recess 35. That is, the enclosure 5 is attached to the light source unit 12 whose side wall 33 is one end side 3 a of the apparatus body 3 by a pair of locking pieces 34 and 34. Thus, the envelope 5 has the flat portion 31 facing the light emitter 2, closes the opening 14 of the apparatus body 3, and covers the light emitter 2 integrally with the light source portion 12.

  A Fresnel lens 36 is formed on the inner surface 31b of the flat portion 31 on the light emitter 2 side. A plurality of Fresnel lenses 36 are formed concentrically outward from the circular center 31 c of the flat portion 31, and the formation region 36 d is formed to be as large as possible than the light emitting surface 2 a of the light emitter 2. is doing. Further, the shape of the Fresnel lens 36 is changed from the circular center 31 c of the plane portion 31 so that the emitted light from the light emitter 2 is mainly emitted from the plane portion 31 as a desired light distribution, for example, parallel beam light A. As it goes outward, it gradually changes. The Fresnel lens 36 can be formed by cutting or molding with a mold material.

  Concave and convex portions 37 are formed on the inner surfaces of the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34. The irregularities 37 are formed so as to be dense with a small shape. Moreover, in the inclination part 32 and the side wall part 33, it forms over those circumference | surroundings. The unevenness 37 diffuses light incident on itself among the light emitted from the light emitter 2. That is, the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34 are formed to have light diffusibility.

  A plurality of protrusions 38 are formed on the outer surface 32 a of the inclined portion 32. As shown in FIG. 1B, the protrusions 38 are formed to be 180 ° rotationally symmetric. The protrusion 38 functions as a slip stopper when the enclosure 5 is fitted into the light source unit 12 by hand.

  Next, the operation of the first embodiment of the present invention will be described.

  The protrusion 17 of the device body 3 is inserted into an insertion hole of a socket device (not shown), the pair of connection pins 18 and 18 are inserted into the connection holes of the socket device, and the device body 3 is rotated, whereby a pair of The connection pins 18, 18 are electrically connected to a pair of sockets of the socket device. Thereby, the lighting device 4 can supply an external power supply via the socket device.

  When the external power source is turned on, an AC voltage (for example, AC 100V) of the external power source is input to the lighting device 4 via the pair of connection pins 18 and 18 and the input lines 20 and 20. In the lighting device 4, the lighting circuit 28 operates to supply a constant current to the light emitter 2 through the output code line 10. As a result, the LED chip 7 is turned on, and white light is emitted from the light emitter 2. The emitted light is refracted by the Fresnel lens 36 formed on the inner surface 31b side of the flat surface portion 31 of the enclosure 5 in the direction of the circular center 31c side of the flat surface portion 31, and is mainly parallel, for example, as shown in FIG. The light beam A is emitted to the front side of the enclosure 5. The emitted light illuminates the outer surface to be irradiated and the object to be irradiated with a desired light distribution.

  Further, part of the emitted light (leakage light) of the light emitter 2 is incident on the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34 of the enclosure 5. Since the inner surfaces of the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34 are formed on the unevenness 37, the incident light is diffused by the unevenness 37, and the light is diffused from the inclined portion 32 and the sidewall portion 33. Diffused light is emitted outward. This diffused light reduces spike-like light distribution and reduces glare for people.

  Since the Fresnel lens 36 is formed so as to face the light emitter 2 and to be a region larger than the light emitting surface 2a of the light emitter 2, the Fresnel lens 36 has an appropriate shape so that the emission of the light emitter 2 is achieved. The light can be refracted to a desired beam angle and radiated light having a desired light distribution can be emitted from the enclosure 5. Here, the light emitting surface 2a of the light emitter 2 is made as small as possible, the formation region 36d of the Fresnel lens 36 is made as large as possible, and the interval (distance) between the light emitter 2 and the Fresnel lens 36 is large. The more the light emitted from the light emitter 2 is controlled (refracted) to a desired light distribution by the Fresnel lens 36, the amount of light emitted from the enclosure 5 and the light source 12 of the apparatus body 3 and the thinness of the enclosure 5 are reduced. What is necessary is just to set suitably in consideration of shaping. The light source portion 12 of the apparatus main body 3 can be formed in a substantially cylindrical shape having the same diameter as the base portion 13 when the size of the light emitting surface 2a of the light emitter 2 is smaller than that shown in FIG.

  As described above, the light emitting device 1 of the present embodiment has a light transmitting device that has the Fresnel lens 36 formed in a region larger than the light emitting surface 2 a of the light emitter 2 on the inner surface 31 b side of the flat portion 31 facing the light emitter 2. Since the luminescent enclosure 5 is provided, the emitted light of the illuminator 2 can be emitted mainly to the front side of the enclosure 5, and the extraction efficiency of the emitted light of the illuminator 2 with respect to the irradiation surface (irradiation region) can be improved. At the same time, the desired light distribution can be obtained.

  Further, since the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34 of the enclosure 5 have light diffusibility due to the unevenness 37, the glare light emitted from the inclined portion 32 and the side wall portion 33 is reduced. In addition, the inside of the light source unit 12 of the apparatus main body 3 can be made difficult to see. That is, it becomes difficult to see the light emitter 2, the screw 22, the connector 9, the output cord 10 and the like provided in the light source unit 12, and the lamp image of the light emitting device 1 can be improved.

  And since the control of the emitted light of the light emitter 2 is performed by the Fresnel lens 36 formed on the inner surface 31b side of the flat portion 31 of the envelope 5, the height of the envelope 5 can be suppressed, The body 5 can be thinned. Thereby, the whole light-emitting device 1 can be reduced in thickness. In addition, since the Fresnel lens 36 is formed on the inner surface 31 b side of the flat portion 31 of the enclosure 5, the appearance of the light emitting device 1 can be prevented from being damaged.

The enclosure 5 may be formed of a light-transmitting synthetic resin such as polycarbonate (PC) resin in which light diffusing fine particles such as titanium oxide (TiO ₂ ) and silica (SiO ₂ ) are mixed. Since the surrounding body 5 has light diffusibility, it is possible to prevent the uneven portion 37 from being formed on the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34 and 34. Here, the light diffusibility should just be a thing which can reduce the color nonuniformity by the Fresnel lens 36. FIG.

  Further, although the light emitter 2 is formed using the substrate 6, the LED chip 7 may be formed on the mounting portion 12 a of the light source unit 12 without using the substrate 6. That is, you may use the attaching part 12a of the light source part 12 as a board | substrate. In this case, since the light source part 12 is a metal, an insulating layer is formed in the attachment part 12a, and LED chip 7 etc. are mounted on this insulating layer.

  FIG. 3 is a schematic longitudinal sectional view of a light-emitting device showing Example 2 of the present invention. The same parts as those in FIG.

  The light-emitting device 39 shown in FIG. 3 is the light-emitting device 1 shown in FIG. 2 in which a reflector 40 is provided between the mounting portion 12a of the light source portion 12 of the device main body 3 and the flat portion 31 of the enclosure 5. It is. Further, the uneven portion 37 is not formed on the inclined portion 32, the side wall portion 33, and the pair of locking pieces 34, 34 of the enclosure 5.

  The reflector 40 is made of, for example, aluminum (Al). The reflector 40 has an opening 41a on one end side 40a and an opening 41b on the other end side 40b, and gradually decreases in diameter from the one end side 40a toward the other end side 40b. It is formed in a shape. The one end side opening 41 a is formed to have a size capable of containing the formation region 36 d of the Fresnel lens 36 formed in the flat portion 31 of the enclosure 5, and the other end side opening 41 b is formed of the light emitter 2 and the output cord 10. The holes 25 and 26, the screw 22 and the like can be included. In addition, when the outer peripheral edge of the other end side 40b is in contact with the mounting portion 12a of the light source unit 12, the reflector 40 has the outer peripheral edge of the one end side 40a close to the inner surface 31b of the flat plate portion 31, that is, the Fresnel lens 36. It is formed so as to be close to each other. In other words, it is sufficient that the reflector 40 is formed so as to be able to irradiate the entire light amount (substantially total light amount) of the radiated light of the light emitter 2 and to irradiate the incident light over almost the entire region 36d of the Fresnel lens 36. It is.

  In the reflector 40, for example, a silicone resin adhesive 42 is applied to the outer peripheral surface 40 c of the other end side 40 b in a state where the outer peripheral edge of the other end side 40 b is in contact with the mounting portion 12 a of the light source unit 12. Are fixed to the mounting portion 12a. That is, the reflector 40 has the other end side 40 b on the light emitter 2 side, and the light emitter 2 is accommodated in the other end side 40 b of the reflector 40. The inner surface 40d of the reflector 40 is formed as a white reflecting surface.

  Next, the operation of the second embodiment of the present invention will be described.

  The light emitted from the light emitting surface 2 a of the light emitting body 2 mainly enters the Fresnel lens 36 of the enclosure 5 as direct light. A part of the light emitted from the light emitting surface 2 a is emitted so as to spread from the light emitting surface 2 a, is reflected by the inner surface 40 d of the reflector 40, and enters the Fresnel lens 36. Almost all the light emitted from the light emitter 2 is incident on the Fresnel lens 36. The Fresnel lens 36 refracts the emitted light so that the emitted light of the light emitter 2 forms a desired light distribution.

  The light emitting device 39 of the present embodiment accommodates the light emitter 2 on the other end side 40b with the other end side 40b on the LED chip 7 side of the light emitter 2, and the emitted light of the light emitter 2 is emitted from the one end side opening 40a. Since the cylindrical reflector 40 provided between the apparatus main body 3 and the enclosure 5 so as to enter the Fresnel lens 36 is provided, almost the entire amount of the emitted light of the light emitter 2 is irradiated on the irradiation surface (with a desired light distribution). (Irradiation area) can be emitted, and the extraction efficiency of the emitted light of the light emitter 2 on the irradiation surface (irradiation area) is further improved.

  Further, since the light emitted from the light emitter 2 is not radiated from the inclined portion 32 and the side wall portion 33 of the enclosure 5 due to the provision of the reflector 40, the glare light of the light emitted from the light emitter 2 is reduced. Can do.

  The reflector 40 may not be fixed to the light source unit 12 of the apparatus main body 3. That is, for example, the mounting surface 12a of the light source unit 12 is provided with a regulating object such as a bank or a wall that restricts movement of the reflector 40 on the mounting surface 12a side, and the outer peripheral edge of the one end side 40a is a flat plate of the enclosure 5 When the outer peripheral edge of the other end side 40b comes close to the mounting part 12a of the light source part 12 when it comes into contact with the inner surface 31b of the part 31, and when the outer peripheral edge of the other end side 40b comes into contact with the mounting part 12a of the light source part 12 The outer peripheral edge of the side 40a may be moved close to the inner surface 31b of the flat plate portion 31 with a predetermined clearance.

  Moreover, although the reflector 40 was formed in the cylinder shape of a truncated cone, it is not restricted to this, You may form in arbitrary cylinder shapes. That is, the amount of light reflected by the reflector 40 out of the radiated light of the light emitter 2 is very small compared to the amount of light that is directly incident on the Fresnel lens 36. Therefore, the change in light distribution due to the difference in the cylindrical shape. Is extremely small. However, the reflector 40 is preferably formed to be rotationally symmetric, such as a regular pyramid.

  Further, the reflector 40 is not limited to a metal and may be formed of a synthetic resin. In this case, the synthetic resin may be any resin that has light reflectivity and is coated with a non-light-transmitting or non-light-transmitting reflective film. Further, the synthetic resin preferably has a heat dissipation property. As the synthetic resin, for example, poly ASA resin (mixture of polycarbonate resin and ASA resin) can be used.

  Even when the LED chip 7 as a semiconductor light emitting element is mounted on the mounting portion 12a of the light source section 12 via an insulating layer to form a light emitting body, the reflector 40 is attached to the outer peripheral edge of the other end side 40b. The other end side 40b is set to the LED chip 7 side of the light emitting body 2 and is provided by being fixed to the portion 12a with an adhesive 42 or the like. In this case, the LED chip 7 is accommodated in the other end side 40 b of the reflector 40.

  FIG. 4 is a schematic longitudinal sectional view of a light-emitting device showing Example 3 of the present invention. The same parts as those in FIG.

A light emitting device 43 shown in FIG. 4 is obtained by attaching a surrounding body 44 to the light source unit 12 of the apparatus main body 3 instead of the surrounding body 5 in the light emitting device 1 shown in FIG. The enclosure 44 is formed of a translucent synthetic resin such as polycarbonate (PC) resin mixed with light diffusing fine particles such as titanium oxide (TiO ₂ ) and silica (SiO ₂ ), and has a flat surface 45, an annular wall 46 and a pair of locking pieces 47, 47. It should be noted that the light diffusibility of the surrounding body 44 only needs to be such that color unevenness due to the Fresnel lens 36 can be reduced.

  The flat portion 45 has a circular shape, and an outer surface 45a and an inner surface 45b are formed in a flat shape, and a Fresnel lens 36 is formed on the inner surface 45b in the same manner as the enclosure 5. A plurality of Fresnel lenses 36 are formed so as to be concentric with the circular center 45 c of the flat portion 45 as the center, and the area of the inner surface 45 b of the flat portion 45 is larger than the area of the inner surface 31 b of the flat portion 31 of the enclosure 5. The larger the quantity, the larger the quantity. That is, the formation region 36e of the Fresnel lens 36 in the flat portion 45 is larger than the formation region 36d of the flat portion 31 shown in FIG.

  The annular wall 46 rises from the inner surface 45b of the flat surface portion 45 along the outer peripheral edge of the flat surface portion 45, and is formed so that the standing length becomes small. The annular wall 46 strengthens the flat surface portion 45 against deformation, and fits the outer peripheral surface 12 c on the opening 14 side of the light source portion 12 of the apparatus main body 3, so that the emitted light from the light emitter 2 is emitted from the light source portion 12. This prevents leakage to the outside on the side wall portion 12b side.

  The pair of locking pieces 47, 47 are on the outer peripheral side of the inner surface 45 b of the flat part 45, and are 180 ° rotationally symmetric about the circular center 45 c of the flat part 45 with respect to the flat part 31. It has claw portions 47a, 47a which are provided upright at a substantially right angle and move away from each other on the tip side.

  Further, a plurality of protrusions 38 are provided on the outer peripheral edge side of the outer surface 45 a of the flat part 45 at 180 ° rotationally symmetric positions around the center 45 c of the flat part 45. The protrusion 38 functions as a slip stopper when the enclosure body 44 is fitted into the outer peripheral surface 12c on the opening 14 side of the light source unit 12 by hand.

  In the enclosure 44, the annular wall 46 is fitted into the outer peripheral surface 12 c on the opening 14 side of the light source unit 12, and the claws 47 a and 47 a of the pair of locking pieces 47 and 47 are the inner surface 12 d of the side wall portion 12 b of the light source unit 12. The light-emitting body 2 is attached to the light source unit 12 so as to cover the light-emitting body 2 by being locked in the locking recess 35 formed in the above.

  Next, the operation of the third embodiment of the present invention will be described.

  The distance (distance) between the light emitter 2 and the flat portion 45 of the enclosure 44 is larger than the interval (distance) between the light emitter 2 and the flat portion 31 of the envelope 5 shown in FIG. It ’s getting smaller. Further, the formation region 36 e of the Fresnel lens 36 formed on the flat portion 45 is larger than the formation region 36 d of the flat portion 31 of the enclosure 5. Therefore, the light emitted from the light emitting surface 2 a of the light emitter 2 is incident on the Fresnel lens 36 formed on the substantially flat portion 45. The Fresnel lens 36 refracts the emitted light so that the emitted light of the light emitter 2 forms a desired light distribution.

  The radiated light refracted by the Fresnel lens 36 is light-diffused and emitted from the outer surface 45a of the flat part 45 to the front side of the flat part 45 because the enclosure 44 is a synthetic resin having light diffusibility. The emitted light illuminates an outer surface to be irradiated, an object to be irradiated, and the like with a desired light distribution with diffused light.

  In the light emitting device 43 of the present embodiment, the envelope body 44 is made of a synthetic resin having light diffusibility, and the flat portion 45 on which the Fresnel lens 36 is formed has light diffusibility, so that the radiation refracted by the Fresnel lens 36 is emitted. The light can be diffused and emitted, thereby reducing the color unevenness due to the Fresnel lens 36 and reducing the glare when looking up at the enclosure 44 side. Further, depending on the degree of light diffusion, it is possible to emit emitted light having a desired beam angle in a direction wider than the beam angle formed by refraction of the Fresnel lens 36.

  Note that the envelope body 44 may have light diffusibility by using, for example, a texture (unevenness) on the outer surface 45a of the flat portion 45 without using a synthetic resin having light diffusibility.

  5 and 6 are light-emitting devices showing Example 4 of the present invention, FIG. 5 is a schematic front view, and FIG. 6 is a schematic longitudinal sectional view. The same parts as those in FIG. 2 are denoted by the same reference numerals.

  In FIG. 6, the light emitting device 48 is a mini-krypton bulb-type LED bulb that is attached to and detached from the bulb socket, and includes a light emitter 49, a device body 50, a lighting device 51, and an enclosure 52. The apparatus main body 50 is formed in a metal case 53 and a resin case 54.

  The light emitter 2 is formed by having a substrate 55 and a light emitting diode 56 as a semiconductor light emitting element. The light emitter 49 is provided with a plurality of light emitting diodes 56 on the one surface 55 a side of the substrate 55. The substrate 55 is made of, for example, an aluminum (Al) metal plate, and both surfaces 55a and 55b are planar, and the outer shape is formed, for example, in a substantially rectangular shape.

  The light emitting diode 56 has, for example, an LED chip 57 that emits blue light, and the LED chip 57 is mounted on the substrate 55 by a COB (Chip On board) method. That is, the LED chip 57 is mounted on the one surface 55a of the substrate 55 via an insulating layer having high thermal conductivity (not shown), and a sealing resin 58 such as a silicone resin for sealing the LED chip 57 in a dome shape is provided. Is formed. The sealing resin 58 is mixed with a yellow phosphor that emits yellow light when excited by part of the blue light from the LED chip 57. Therefore, the surface of the sealing resin 58 becomes the light emitting surface of the light emitting diode 56, and white light is emitted from this light emitting surface.

  A plurality of the light emitting diodes 56 are provided in a planar shape and are mounted so as to be densely packed on the one surface 55 a side of the substrate 55, and the surface of the sealing resin 58 of each light emitting diode 56 and the light emitting diode 56. , 56 is a light emitting surface 49a of the light emitter 49.

  And the board | substrate 55 has attached the heat sink 59 to the other surface 55b. The heat radiating plate 59 is made of a metal plate having high thermal conductivity, such as an aluminum (Al) plate, and is formed in a circular shape, for example, and is fixed to the substrate 55 with a high thermal conductive adhesive. In the heat radiating plate 59, heat generated when the LED chip 57 is turned on (light emission) is transferred from the substrate 55, and the heat is transferred to the metal case 53 of the apparatus main body 50.

  The apparatus main body 50 includes a metal case 53 and a resin case 54. The metal case 53 is made of a metal material having high thermal conductivity, and is formed so as to increase in diameter from the other end side 53b toward the one end side 53a. Here, the metal case 53 is formed of aluminum (Al).

  Further, the metal case 53 has a plurality of heat radiation fins 60 radially projecting from the outer surface 53c along the direction from the one end side 53a to the other end side 53b. And, on the upper surface of the one end side 53a, there is formed a mounting portion 61 for a flat light emitter 49 to which the heat radiating plate 59 is mounted in surface contact, and an annular envelope mounting portion 62 for mounting the envelope 52. It is formed so as to protrude outward from the attachment portion 61. The enclosure attachment portion 62 is a maximum outer diameter portion of the apparatus main body 50.

  A through hole 63 is formed in the center of the attachment portion 61 so as to penetrate from the attachment portion 61 to the outer surface 53c on the other end side 53b. The through hole 63 is formed in a tapered truncated cone shape that gradually decreases in diameter from the attachment portion 61 toward the other end side 53b. A square fitting recess 64 is formed at the edge of the through hole 63 of the mounting portion 61. A plurality of fitting recesses 64 are formed at equal intervals around the through hole 63. In addition, the mounting portion 61 is formed with a plurality of screw holes (not shown) for screwing the heat radiating plate 59. Furthermore, an annular groove 65 is formed in the attachment portion 61 along the peripheral wall portion of the enclosure attachment portion 62.

  A heat radiating plate 59 is attached to the mounting portion 61 by screwing a screw (not shown) into a screw hole (not shown) via a heat radiating plate 59. Here, the heat radiating plate 59 is formed in a size that covers the through hole 63 and covers the fitting recess 64. That is, the other surface 55 b of the substrate 55 of the light emitter 49 is attached to the attachment portion 61 via the heat radiating plate 59, and the light emitter 49 is attached. As described above, the metal case 53 has the substrate 55 of the light emitter 49 attached to one end side 53a thereof. In addition, although it is preferable that the heat sink 59 is formed in the magnitude | size which covers the whole region of the fitting recessed part 64, you may be formed in the magnitude | size which covers a part of fitting recessed part 64. FIG.

  An attachment plate 66 that surrounds the light emitter 49 and the heat radiating plate 59 is fitted in the groove 65 of the attachment portion 61. A gap 67 is formed between the mounting plate 66 and the peripheral wall portion of the enclosure mounting portion 62. The upper surface of the mounting plate 66 and the upper surface of the enclosure mounting portion 62 are substantially in the same plane.

  The radiating fins 60 are formed so as to be smoothly inclined so that the amount of protrusion in the radial direction increases from the other end side 53b of the metal case 53 to the one end side 53a. Further, as shown in FIG. 5, the radiating fins 60 are formed radially at substantially equal intervals in the circumferential direction of the metal case 53, and a gap 68 is formed between the radiating fins 60, 60. The gap 68 is opened toward the other end side 53 b and the periphery of the metal case 53, and is closed at the one end side 53 a of the metal case 53. An annular enclosure mounting portion 62 is formed on one end side of the heat radiation fin 60 and the gap 68. The metal case 53 is formed as described above, for example, by aluminum die casting. The enclosure 52 is attached to the annular enclosure attachment portion 62.

  In FIG. 6, the enclosure 52 is attached to one end side 53 a of the metal case 53 of the apparatus main body 50 so as to cover the light emitter 49. The enclosure 52 is made of, for example, a polycarbonate (PC) resin having translucency, and is formed in a substantially dish shape having a flat portion 69 and an annular side wall portion 70. A Fresnel lens 36 is formed on the inner surface 69 b of the flat portion 69.

  The plane portion 69 has a circular shape whose size is somewhat smaller than the maximum outer diameter portion of the apparatus main body 50, and the outer surface 69a and the inner surface 69b are formed in a flat shape. The annular side wall portion 70 is provided on the edge (outer peripheral edge) of the flat surface portion 69 so as to stand upright at a right angle with respect to the flat surface portion 69 over the outer periphery, and is formed to have a larger thickness than the flat surface portion 69. Yes. A fitting portion 71 is formed on the plane of the annular side wall portion 70 so as to be fitted in the gap 67 between the enclosure attachment portion 62 and the attachment plate 66. The enclosure 52 has a fitting portion 71 fitted in the gap 67 and is fixed with an adhesive or the like. Thus, the enclosure 52 is attached to the one end side 53 a of the metal case 53 so as to cover the light emitter 49, and the annular side wall portion 70 causes the flat portion 69 to face the light emitter 49 and the flat portion 69. And the luminous body 49 are regulated to a predetermined interval (distance).

  The Fresnel lens 36 is formed on the inner surface 69b of the flat portion 69 in the same manner as the enclosure 5 shown in FIG. That is, it is formed concentrically around the circular center 69c of the flat portion 69. Further, the Fresnel lens 36 is formed in almost the entire region of the inner surface 69b of the flat portion 69 so as to be as large as possible than the light emitting surface 49a of the light emitter 49.

  The resin case 54 of the apparatus main body 50 is formed of an electrically insulating synthetic resin such as polybutylene terephthalate (PBT) resin. The outer peripheral surface 54 c is formed so as to be close to the inner wall surface 63 a of the through hole 63 of the metal case 53 and along the inner wall surface 63 a of the through hole 63. That is, the portion having the outer peripheral surface 54c is formed in a substantially truncated cone shape. And the fitting convex part 72 which protrudes outward from the outer peripheral surface 54c is formed in the edge part of the one end side 54a of the outer peripheral surface 54c. The fitting protrusions 72 are formed in, for example, a quadrangle having a predetermined thickness, and two are formed so as to face each other at intervals of 180 ° around the opening edge of the outer peripheral surface 54c. . That is, the fitting convex portion 72 is provided corresponding to the fitting concave portion 64 of the metal case 53 and is fitted into the fitting concave portion 64. The resin case 54 is disposed inside the through hole 63 of the metal case 53 by fitting the fitting convex portion 72 and the fitting concave portion 64 together.

  The fitting convex portion 72 is formed in a shape and size to be fitted into the fitting concave portion 64 and is formed so that the heat radiating plate 59 does not ride on. That is, the fitting convex portion 72 is formed in a shape or size that does not protrude from the fitting concave portion 64 to the attachment portion 61. In the resin case 54, the fitting convex portion 72 is fitted into the fitting concave portion 64 of the metal case 53, and the fitting convex portion 72 and the fitting concave portion 64 are fitted to each other to restrict mutual rotation, thereby It is fixed to the case 53.

  In the resin case 54, the other end side 54b of the outer peripheral surface 54c protrudes outward from the outer surface 53c of the other end side 53b of the metal case 53, and a bottomed cylindrical protruding portion 73 is formed on the other end side 54b. Is formed. The outer diameter of the protruding portion 73 is somewhat smaller than the other end side 54 b of the resin case 54. The protrusion 73 is provided with an E17-shaped base 74 by caulking, for example. As described above, the apparatus main body 50 has the base 74 on the other end side 53 b of the metal case 53 via the protrusion 73.

  In addition, a groove 76 is formed in the bottom plate portion 75 of the protruding portion 73, and the lighting device 51 is supported in the groove 76. Further, the bottom plate portion 75 is provided with an insertion hole (not shown) through which a lead wire (not shown) that electrically connects the lighting device 51 and the base 74 is inserted.

  The base 74 can be connected to a socket for an E17 type general lighting bulb. The base 74 is fitted to the projecting portion 73 of the resin case 54 and fixed by being crimped thereto, an insulating portion 78 provided on the other end side of the shell portion 77, and a top portion of the insulating portion 78. The eyelet portion 79 is provided. A lead wire (not shown) is connected to the shell portion 77 and the eyelet portion 79. This lead wire is introduced into the resin case 54 through an insertion hole (not shown) provided in the bottom plate portion 75 of the projecting portion 73 and is electrically connected to the lighting device 51.

  The lighting device 51 lights the light emitting diode 56 of the light emitter 49 and is housed inside the resin case 54. That is, it is housed inside the apparatus main body 50. The lighting device 51 includes a circuit board 80 and electrical components such as a transformer T1 and an electronic component 81 mounted on the circuit board 80. The circuit board 80 is made of a synthetic resin plate such as a glass epoxy material or a metal plate such as aluminum (Al). In the case of a metal plate, an insulating layer is formed and electric parts are mounted. Since the outer peripheral surface 54c of the resin case 54 is formed in a tapered truncated cone shape that gradually decreases in diameter from the one end side 54a toward the other end side 54b, the circuit board 80 is connected to the other end side from the one end side 80a. As it goes to 80b, the width is gradually reduced.

  The circuit board 80 is fitted into the groove 76 of the bottom plate portion 75 of the resin case 54 and supported by the bottom plate portion 75. In addition, support plates 82 a to 82 d are attached to the circuit board 80. The support plates 82a to 82d are fixed to the inner wall surface 54d of the resin case 54 with an adhesive. Thus, the lighting device 51 is housed inside the resin case 54 and is fixed to the resin case 54. The lighting device 51 is connected to the base 74 and the substrate 55 of the light emitter 49 by lead wires (not shown).

  The lighting device 51 is operated by being supplied with power from an external power source through a base 74 and a lead wire (not shown), rectifies and smoothes the AC voltage of the external power source, and supplies a constant current to the light emitter 49. . The LED chip 57 of the light emitting diode 56 is lit (emits light) when a constant current is supplied. Then, white light is emitted from the light emitting diode 56.

  Next, the operation of the fourth embodiment of the present invention will be described.

  The light emitting device (LED light bulb) 48 is attached to, for example, a socket for E17 type light bulb of a lighting fixture. When an external power source is supplied to the base 74, the lighting device 51 operates, and constant current (electric power) is supplied from the lighting device 51 to the plurality of LED chips 57 of the light emitter 49. The plurality of light emitting diodes 56 are lit and emit white light.

  The emitted light is incident on the inner surface 69b of the flat portion 69 of the enclosure 52 facing the light emitter 49, is refracted by the Fresnel lens 36 toward the center 69c of the flat portion 69, and becomes substantially parallel beam light. The light is radiated from the outer surface 69 a of the flat portion 69 to the front side of the flat portion 69. The light beam emitted from the flat portion 69 irradiates an outer surface to be irradiated or an object to be irradiated.

  The light emitting device 48 according to the present embodiment includes a translucent enclosure 52 having a Fresnel lens 36 formed in a region larger than the light emitting surface 49 a of the light emitter 49 on the inner surface 69 b side of the flat portion 69 facing the light emitter 49. Therefore, the emitted light of the light emitter 49 can be refracted to the circular center 69c side of the flat plate portion 69 and radiated to the front surface side of the enclosure 52, and the light emitter 49 with respect to the irradiation surface (irradiation region) can be emitted. The radiation light extraction efficiency can be improved, and a desired light distribution can be obtained.

  And since the light distribution of the emitted light of the light emitter 2 is controlled by the Fresnel lens 36 formed on the flat portion 69 of the enclosure 52, the height dimension of the annular side wall portion 70 of the enclosure 52 is suppressed. Thus, the enclosure 52 can be thinned. As a result, the light emitting device can be downsized.

  In addition, although the apparatus main body 50 was formed in the metal case 53 and the resin case 54, you may integrally mold these by aluminum die-casting, for example. In this case, the apparatus main body 50, the lighting device 51, and the base 74 may be electrically insulated with an insulating material or the like. Further, the apparatus main body 50 may be formed in a cylindrical shape having one end side 53 a and the other end side 53 b having the same diameter or substantially the same diameter, and the enclosure 52 is larger in diameter than the maximum outer diameter portion of the apparatus main body 50. It may be formed.

  FIGS. 7 and 8 are lighting fixtures showing Embodiment 5 of the present invention, FIG. 7 is a schematic perspective view, and FIG. 8 is a partially cut schematic front view. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  7 and 8 is a downlight embedded in a ceiling or the like. In FIG. 8, the lighting fixture 83 includes a fixture body 85 having a socket device 84 as a socket and the light emitting device 1 shown in FIGS. 1 and 2.

  The instrument body 85 is molded by aluminum die casting, has an opening 86 on the lower end side 85a and an annular flange portion 87 protruding outward, closes the upper end side 85b on the upper end side 85b, and is formed in a flat shape. It is formed in a substantially cylindrical box having an upper plate portion 88. The outer surface 85c of the instrument body 85 is formed with reinforcing pieces 89 and 90 that also serve as a plurality of heat dissipating fins. Furthermore, a pair of attachment springs 91 and 91 are provided on the lower end side 85a of the outer surface 85c to hold the ceiling or the like between the flange portion 87 and the like. And the inner surface 85d of the instrument main body 85 is formed in the reflective surface by white coating, for example.

  A top plate 92 is attached to the outer surface of the upper plate portion 88 with screws 93 or the like. As shown in FIG. 7, the top plate 92 has a terminal block 94 attached to its lower surface 92a. A power supply line (not shown) from an external power source and a lead wire (not shown) connected to the socket device 84 are connected to the terminal block 94.

  And as shown in FIG. 8, the socket apparatus 84 is attached to the inner surface of the upper board part 88 with the screw which is not shown in figure. The socket device 84 is formed with a well-known configuration for mounting the base portion 13 of the apparatus main body 3 which is a GX53 type base. The light emitting device 1 is mounted on the socket device 84. In the light emitting device 1, the projecting portion 17 (not shown) of the device body 3 is inserted into an insertion hole (not shown) of the socket device 84, and a pair of connection pins 18 and 18 (not shown) are shown of the socket device 84. The pair of connection pins 18 and 18 are electrically connected to a pair of sockets (not shown) of the socket device 84 while being fixed to the socket device 84 by being rotated after being inserted into the pair of connection holes. Yes.

  When external power is supplied to the terminal block 94, the LED chip 7 (not shown) of the light emitting device 1 is turned on to emit white light, and the white light is emitted from the enclosure 5. The white light is emitted outward from the opening 86 of the instrument main body 85 and illuminates the irradiated surface, for example, the floor surface.

  Since the light emitting device 1 is thin and emits radiated light having a desired light distribution, the lighting fixture 83 can be formed small on the depth side embedded in the ceiling or the like, and an irradiated surface such as a floor surface can be formed. It has the effect that it can be illuminated with a desired light distribution.

  FIG. 9 is a partially cutaway schematic front view of a lighting fixture showing Embodiment 6 of the present invention. The same parts as those in FIG.

  The lighting fixture 95 shown in FIG. 9 is a downlight that uses the light emitting device (LED bulb) 48 shown in FIG. 5 and is embedded in the ceiling 96. A light bulb socket 98 as a socket is disposed on an instrument body 97 having an outer shape formed in a substantially cylindrical shape with a bottom. The instrument body 97 is sandwiched between the ceiling 96 and fixed to the ceiling 96 by a cover body 99 and leaf springs 100, 100 provided integrally with the instrument body 97. The light emitting device 48 is attached to the socket 98 for the light bulb.

  When the light bulb socket 98 is energized, the lighting device 51 (not shown) of the light emitting device 48 operates, and power is supplied to each light emitting diode 56 (not shown) of the light emitter 49 (not shown). . As a result, the plurality of light emitting diodes 56 are turned on, and white light of a desired light distribution, for example, substantially parallel light beams, is emitted from the enclosure 52 of each light emitting diode 56. The white light is emitted from the opening 101 of the cover body 99 to the floor surface side.

  Since the light emitting device 48 is miniaturized, the radiation light extraction efficiency of the light emitter 49 is high, and the emitted light of the desired light distribution is emitted, the lighting fixture 95 can be miniaturized and the floor surface side is desired. It has the effect of being able to illuminate with high light efficiency with a high light distribution.

  DESCRIPTION OF SYMBOLS 1,39,43,48 ... Light-emitting device, 2,49 ... Light-emitting body, 3,50 ... Device main body, 4,51 ... Lighting device, 5,44,52 ... Enclosure, 83,95 ... Lighting fixture, 85, 97 ... The instrument body

Claims (5)

A light emitter having a semiconductor light emitting element provided in a planar shape;
An apparatus main body having the light emitter attached to one end side and having a base on the other end side;
A lighting device housed in the device main body, operated by being supplied with power through the base, and lighting the semiconductor light emitting element;
A flat portion facing the light emitter and a Fresnel lens formed on the light emitter side of the flat portion so as to be an area larger than the light emitting surface of the light emitter, and covering the light emitter. A translucent enclosure attached to one end;
A light-emitting device comprising:   The light-emitting device according to claim 1, wherein the enclosure includes a side wall portion having light diffusibility standing on an edge portion of the flat portion, and the side wall portion is attached to one end side of the apparatus main body. .   A cylindrical reflector having openings on both end sides and gradually decreasing in diameter from one end side toward the other end side, the reflector having the other end side as the semiconductor light emitting element side of the light emitter, and a semiconductor light emitting element The light emitting device according to claim 1, wherein the radiated light is provided between the device main body and the enclosure so that the emitted light is emitted from the opening on one end side and is incident on the Fresnel lens of the enclosure.   The light emitting device according to any one of claims 1 to 3, wherein the flat portion of the enclosure has light diffusibility. A light emitting device according to any one of claims 1 to 4;
An instrument body having a socket to which the base of the light emitting device is electrically connected;
The lighting fixture characterized by comprising.