KR20100044632A - Lighting apparatus having led and circuit module therefor - Google Patents

Lighting apparatus having led and circuit module therefor Download PDF

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Publication number
KR20100044632A
KR20100044632A KR1020080103841A KR20080103841A KR20100044632A KR 20100044632 A KR20100044632 A KR 20100044632A KR 1020080103841 A KR1020080103841 A KR 1020080103841A KR 20080103841 A KR20080103841 A KR 20080103841A KR 20100044632 A KR20100044632 A KR 20100044632A
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KR
South Korea
Prior art keywords
base
circuit module
led lighting
led
fpc
Prior art date
Application number
KR1020080103841A
Other languages
Korean (ko)
Inventor
이우필
Original Assignee
주식회사 루미시스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 루미시스 filed Critical 주식회사 루미시스
Priority to KR1020080103841A priority Critical patent/KR20100044632A/en
Publication of KR20100044632A publication Critical patent/KR20100044632A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/0025Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

PURPOSE: A circuit module for an LED device and the LED device including the same are provided to improve light diffusion property and an illuminance property by improving an arrangement structure of the LED device. CONSTITUTION: A circuit module(2) for an LED device is bent with a polygonal shape. A circuit module for an LED device includes a base(20), a FPCB(Flexible Printed Circuit Board)(30) and a frame(40). The base is made of metal or ceramic materials and includes a central surface and at least one side. The FPCB is attached to a part of the base. At least one LED device(10) is mounted on the FPCB. The frame supports the base and the FPCB.

Description

Circuit module for LED lighting device and LED lighting device including the same {Lighting apparatus having LED and circuit module therefor}
The present invention relates to a lighting apparatus, and more particularly, to a circuit module for an LED lighting apparatus for illuminating using the LED and an LED lighting apparatus comprising the same.
In general, the lighting device is widely used as a lighting means such as indoor or outdoor lighting, a traffic light, a warning light.
As a lighting device, a filament that emits light while being heated to a high temperature is used when a current is supplied, and in recent years, a lighting device using an LED (LED) that consumes less power, has excellent light brightness, and has a long lifespan is attracting attention. I am getting it.
However, the LED has a low light diffusion property due to the strong straightness of the light, and the side roughness is insufficient in the present situation is insufficient to replace the conventional lighting device using the filament.
The present invention has been made to solve the above problems, an object of the present invention is to provide an LED lighting device circuit module and LED lighting device comprising the LED element can be arranged to have excellent diffusion characteristics and roughness characteristics. .
Another object of the present invention is to provide an LED lighting device circuit module and an LED lighting device including the same, which can easily form a circuit module for an LED lighting device in various shapes.
Still another object of the present invention is to provide a circuit module for an LED lighting device having excellent heat dissipation of an LED element and an LED lighting device including the same.
The present invention and the base to solve the above problems; A circuit module for LED lighting apparatus comprising a FPC bonded to at least a portion of the base and at least one LED element is installed, wherein the circuit module is bent to form a polygonal surface in a state in which the base and the FPC are bonded to each other. The circuit module for the LED lighting device is presented.
The base may be made of a metal or ceramic material, the FPC and the base may be separated from the bent portion.
At least one of the FPC and the base may be provided with a mask for preventing the bonding in the bent portion.
The invention also provides a base; A circuit module for an LED lighting apparatus, comprising a PCB bonded to at least a portion of the base and at least one LED element is installed, wherein the circuit module is bent to form a polygonal surface in which the base and the PC are bonded. The PCBs installed on each of the polygonal surfaces present circuit modules for LED lighting apparatuses connected by bending circuit parts.
The polygonal surface may include a central plane constituting a polygon and at least one side surface inclining the central plane on at least some of each side of the central plane, and the side surface may be bent at least once.
The polygonal surface may further include a center surface forming a polygon, and side surfaces forming an inclination with the center surface respectively coupled to each side of the center surface, and further including a frame coupled to the ends of the side surfaces.
The polygonal surface may include side surfaces forming a horn shape.
Further comprising a frame coupled with the base; At least one fitting protrusion may be formed at any one of the base and the frame, and a fitting portion into which the fitting protrusion may be inserted may be formed at the other one.
Further comprising a frame coupled with the base; One of the base and the frame may have a pin connector having a plurality of pin grooves, and the other may have at least one pin that can fit into the pin groove of the pin connector.
It may further include a frame coupled to the base and having a thermal conductivity.
The FPC and the base may be bonded by a thermally conductive bonding material.
The base may have a bending guide line formed at the bent portion.
The present invention also provides an LED lighting device comprising the circuit module for the LED lighting device.
It may further include a frame coupled to the base, and having a power supply unit for supplying power for lighting the LED element, and an intermediate circuit unit for connecting the FPC.
The circuit module for LED lighting apparatus and the LED lighting apparatus including the LED lighting apparatus according to the present invention are formed to have a plurality of multi-facets, so that light can be widely spread in various directions, so that the illumination intensity and the light diffusing property can be excellent. Can be.
In addition, the LED lighting device circuit module and the LED lighting device including the same according to the present invention, by installing the LED element on the FPC or by connecting the PCs by the connection circuit, it is possible to three-dimensional circuit wiring and excellent bending resistance, There is an advantage that the circuit module for the LED lighting device can be formed in various shapes.
In addition, the LED lighting device circuit module and the LED lighting device comprising the same according to the present invention by installing the LED element on the FPC or by connecting the PCs by the connection circuit, the advantage that can be prevented even if the circuit is formed to have multiple sides There is this.
In addition, the LED lighting device circuit module and the LED lighting device comprising the same according to the present invention, when the LED element is installed on the FPCB, the FPCB is prevented from joining at the bent portion of the base, it is more sure the FPCB deformation and circuit cutting There is an advantage that can be prevented.
In addition, the LED lighting device circuit module and the LED lighting device including the same according to the present invention may have an advantage of excellent heat dissipation by installing the LED element on the base of a metal or ceramic material having excellent heat dissipation.
In addition, the LED lighting device circuit module and the LED lighting device including the same according to the present invention can be advantageously easy to manufacture by forming a multi-sided by bending after bonding the base of the metal or ceramic material having excellent heat radiation and heat resistance have.
Hereinafter, with reference to the accompanying Figures 1 to 3 will be described in detail with respect to the first embodiment of the present invention.
As shown, the LED lighting apparatus according to the first embodiment of the present invention includes a circuit module 2 for LED lighting apparatus having at least one LED element 10 for illumination.
The LED lighting device circuit module 2 may be configured to include a base 20 and the FPC (30) bonded to at least a portion of the base 20 and at least one LED element 10 is installed. have. At this time, the circuit module 2 constituted by the base 20 and the FPC 30 is bent in an adhesive state to form a plurality of surfaces, that is, multiple surfaces.
In order to have heat dissipation, the base 20 is preferably formed of a metal or ceramic material such as aluminum or copper.
The base 20 has a center plane 22 that forms a polygon, and the center plane 22 on at least some of each side of the center plane 22 so that the circuit module 2 can be formed in a polygonal plane. It may be configured to include at least one side 24 to be inclined.
The center plane 22 may be formed in an octagonal shape as in the present embodiment, but is not limited thereto, and may be variously formed in a circle, polygon, irregular shape, etc. according to lighting conditions. The center plane 22 of the base 20 may be formed in a plane as in the present embodiment according to the lighting purpose, or in other embodiments may be formed of a curved surface or a combination of a flat surface and a curved surface.
The side surface 24 may be configured in plural to be coupled to each of the walls of the polygonal surface, and may be formed in a flat plane as in the present embodiment according to the lighting purpose, or in other embodiments by a curved surface or a combination of a flat surface and a curved surface. It may be formed.
In addition, the side surface 24, as in the embodiment of the present invention, may be composed of a plurality of side surfaces 24A, 24B in one plane or bent more than once. In particular, when the side is bent more than once there is an advantage that the light emitted from the LED element 10 can also be irradiated to the upper side.
The plurality of side surfaces 24A and 24B may be formed to be spaced apart from the side surfaces 24A and 24B of the sides of other polygonal surfaces, as shown in the present embodiment, and may be in contact with the neighboring side surfaces 24 although not shown. Can be. Alternatively, the side surface 24 may have a ring shape like the circumferential surface of the cylinder in order to secure a wide range of the illumination direction.
The bending angle θ between the polygonal surfaces may be determined according to an illumination purpose. That is, when the angle θ between the central plane 22 and the side surface 24 is large, light by the LED element 10 may be widely spread, and thus, it is preferable to illuminate a wide range of places such as a park. In addition, by reducing the angle θ between the central plane 22 and the side surface 24, it may be useful for spotlighting a specific area such as a security lamp.
In addition to the present embodiment, the polygonal surface may be formed of only the side surfaces 24 without the central surface 22 according to the lighting purpose and take the shape of a horn. In addition, the polygonal surface may have a shape in which two or more central surfaces 22 are formed and connected by the side surfaces 24.
The FPC 30 is preferably formed integrally so that one or more LED elements 10 can be turned on by one circuit. To this end, in particular, the FPC 30 is a flexible printed circuit board (FPCB) that is flexible, that is, bendable so that the circuit is not broken due to the bending between the surfaces at the bent portion 20A of the base 20. It is preferably formed. Of course, if the PCB can be used in addition to the FPC ratio of course, the present invention is not limited to FPCB.
The FPC 30 may be combined with the base 20 by various methods.
In particular, the FPC 30 may be tightly coupled to the base 20 by a bonding method. Further, the FPC 30 is more preferably bonded to the base 20 in a state separated from the bent portion 20A of the base 20. That is, the FPC 30 is deformed or disconnected due to bending of the base 20 by maintaining a state in which the portion 30A corresponding to the bent portion 20A is separated from the base 20. Losing problems can be prevented.
The bonding method may be both a method using a bonding agent 32 and a method using a bonding tape, and a thermally conductive material is more preferable as a bonding material for heat dissipation of the LED element 10 by the base 20. Do.
Meanwhile, the LED lighting device circuit module 2 may further include a frame 40 supporting the bonded base 20 and the PCC 30.
The frame 40 may be coupled to support the base 20 and the FPC 30 bonded thereto. In this case, preferably, the frame 40 may be coupled to the end of the side surface 24.
The frame 40 may be coupled to at least one of the base 20 and the FPC 30, preferably the base 20 in various ways.
As an example for coupling at least one of the frame 40, the base 20, and the FPC 30, any one of the base 20, the FPC 30 and the frame 40 At least one fitting protrusion 26 may be formed, and a fitting portion 42 into which the fitting protrusion 26 may be inserted may be formed in the other one of the fitting protrusions 26. That is, as shown in this embodiment, any one of the base 20 and the FPC 30 has a plurality of fitting protrusions 26, and the frame 40 has a plurality of fitting portions 42 having a hole structure. Can be formed. In this case, preferably, the base 20 and the FPC ratio (so that all of the plurality of side surfaces 24 of any one of the frame 40, the base 20, and the FPC ratio 30 may be coupled to each other). At least one fitting protrusion 26 may be formed on all of the plurality of side surfaces 24 of any one of 30).
As another example for coupling any one of the frame 40, the base 20, and the FPCB 30, as illustrated in FIG. 9, the base 20 and the FPCB 30 are provided. And one of the frames 40 has a pin connector 44 having a plurality of pin grooves 44A, the other of which is at least one that can fit into the pin grooves 44A of the pin connector 44. It may have a pin 28 of. That is, as in the present embodiment, the pin 28 is formed on the base 20 and the FPCB 30, and the pin connector 44 may be provided on the frame 40. Accordingly, as shown in FIGS. 1 to 3, the FPC 30 may be directly connected to the intermediate circuit part 41, which will be described later, or the FPCB through the pin connector 44 as shown in FIG. 9. 30 may be connected.
The frame 40 may include an intermediate circuit part 41 so that the power supply unit for supplying power for turning on the LED element 10 and the epic ratio 30 can be connected in a circuit. In this case, each of the LED elements 10 may be connected to the power supply unit in a series circuit structure, or may be connected in a parallel circuit structure.
The frame 40 may be formed of a material having thermal conductivity such as metal or ceramic for heat dissipation of the LED device 10.
On the other hand, the LED lighting apparatus according to the present invention may further include a body for the protection and aesthetics of the circuit module (2) for the LED lighting apparatus.
Looking at the manufacturing process of the LED lighting device circuit module 2 configured as described above with reference to Figures 4 to 8, as follows.
4 is an exploded view of the base 20, and FIG. 5 is a cross-sectional view taken along the line B-B in FIG.
First, as shown in FIGS. 4 and 5, the base 20 in a deployed state is prepared.
And, as shown in FIG. 6, the bonding agent 32 for bonding with the FPCB 30 is applied to the front of the base 20 in the developed state or a bonding tape is attached. In this case, a mask M may be formed on the bent portion 20A of the base 20 so that the bonding agent 32 is not applied or the bonding tape is not adhered to prevent the bonding with the FPC 30. Can be. In this case, the mask M may be bonded to at least one of the FPC 30 and the base 20.
Next, as shown in Fig. 7, the base 20 and the FPC 30 in the developed state are bonded. Then, the base 20 and the FPC 30 are closely coupled to each other except the bent portion 20A of the base 20 so that the base 20 and the FPC ratio 30 are bent portions 20A. ) Can be separated from each other.
After the base 20 and the FPC 30 are coupled as described above, as shown in FIG. 8, the base 20 is bent between the surfaces of the base 20 so that the base 20 may have a shape having a polygonal surface. Do the work.
In this case, since the FPCB 30 is coupled with the base 20, the FPCB 30 is bent together with the base 20 to take a shape having a polygonal surface, except that the FPCB 30 is formed of the base 20. Since the portion 30A corresponding to the bent portion 20A is separated from the base 20, it is not damaged due to the inter-plane bending of the base 20.
Meanwhile, a tool such as a jig may be used for ease of bending, accuracy, or automation of the base 20.
Thereafter, when the base 20 and the frame 40 are coupled to each other, and the intermediate circuit 41 of the frame 40 and the PCC 30 are connected in a circuit, the circuit module for the LED lighting device ( 2) can be manufactured.
On the other hand, the LED element 10 may be installed in the FPC after the coupling of the FPC 30 and the base 20 as shown in Figure 7, as shown in Figure 8 It may be installed on the FPCB 30 after the inter-surface bending of the base 20.
FIG. 10 is a view corresponding to FIG. 2 and illustrates an LED lighting apparatus according to a third embodiment of the present invention.
In describing the present embodiment, the same as the first embodiment of the present invention described above, in order not to distract from the gist of the present embodiment, duplicate description is omitted and the same as the first embodiment of the present invention. Indicate by number.
As shown, the circuit module 102 for the LED lighting apparatus according to the present embodiment, the base 120, one that is bonded to at least a portion of the base 120 and at least one LED element 110 is installed It is comprised including the PC 130 of the above.
The circuit module 102 is bent in a state in which the PCB 130 and the base 120 are bonded to form a polygonal surface, and the PCBs 130 installed on the polygonal surfaces are connected to the connection circuit unit 150 that can be bent. Is connected.
That is, since the circuit module 102 for the LED lighting device can be connected to one circuit by the connection circuit unit 150, it can be implemented as a general PC 130 without flexibility.
 The connection circuit unit 150 is the PCB 130 is separated around the bending portion 120A of the base 120, the connection of the PCB 130 in the bending portion (120A) of the base 120 It is desirable to be installed in all.
In particular, the connection circuit unit 150 is preferably formed to have a material that can be bent so as not to be deformed or the circuit is broken by bending between the surfaces of the base 120 in the bent portion (120A) of the base 120. . In the drawing, reference numeral 140 denotes a frame.
FIG. 11 is a view corresponding to an enlarged portion of FIG. 2, and illustrates an LED lighting apparatus according to a fourth embodiment of the present invention, and FIG. 12 is a view illustrating a pre-production state of FIG. 11.
In describing the present embodiment, the same as the first embodiment of the present invention described above, in order not to distract from the gist of the present embodiment, duplicate description is omitted and the same as the first embodiment of the present invention. Indicate by number.
As shown, in the LED lighting device circuit module 202 according to the present embodiment, a bending guide line 221 may be formed at the bent portion of the base 220 to facilitate bending of the base 220. .
The bending guide line 221 may be formed by one groove 221A as in the present embodiment, and in other embodiments, one hole or a plurality of grooves 221A or a plurality of holes or grooves 221A. It can be formed by a combination of holes.
When the bending guide line 221 is formed by the groove 221A, the bending guide line 221 may be formed on the back surface where the FPC 230 is not bonded as in the present embodiment according to the bending direction of the base 220, Contrary to this embodiment, the base 220 may be formed on the front of the base 220 as another embodiment so that the base 220 may be bent. It may be.
In particular, when the bending guide line 221 is formed by the groove 221A, the bending angle of the base 220 may be limited according to the shape of the groove 221A, such as a cross-sectional shape, a depth, a cross-sectional size, and the like. Therefore, a work for adjusting the bending angle of the base 220 after the bending work of the base 220 and a separate configuration for maintaining the bending angle of the base 220 are not necessary. In addition, the bending work of the base 220 can be automated by using a jig or the like.
That is, FIG. 12 shows a part of the developed state of the LED lighting device circuit module 202 according to the present embodiment, and the groove 221A constituting the bending guide line 221 before the bending operation of the base 220. Keep this circle. As shown in FIG. 11, when the base 220 is bent, the groove 221A constituting the bending guide line 221 overlaps and takes a line shape, whereby the surface and the surface of the base 220 are formed. This causes interference with each other so that the bending angle of the base 220 can be determined.
By adjusting the depth and width of the groove 221A constituting the bending guide line 221, the bending angle of the base 220 can be freely set, and in the groove 221A constituting the bending guide line 221 even during assembly. It is controlled by the advantage that the manufacturing is easy.
Since the above has been described only with respect to some of the preferred embodiments that can be implemented by the present invention, the scope of the present invention, as is well known, should not be construed as limited to the above embodiments, the present invention described above It will be said that both the technical idea and the technical idea which together with the base are included in the scope of the present invention.
1 is a perspective view of an essential part of a circuit module for an LED lighting apparatus according to a first embodiment of the present invention.
2 is a cross-sectional view of FIG. 1.
3 is an exploded perspective view of portion 'A' of FIG. 1.
4 to 8 are diagrams illustrating a manufacturing process of a circuit module for LED lighting apparatus according to a first embodiment of the present invention.
FIG. 9 is a view corresponding to FIG. 3 and illustrates a circuit module for an LED lighting apparatus according to a second embodiment of the present invention.
FIG. 10 is a view corresponding to FIG. 2 and illustrates a circuit module for an LED lighting apparatus according to a third embodiment of the present invention.
FIG. 11 is a view corresponding to the enlarged part of FIG. 2 and illustrates a circuit module for an LED lighting apparatus according to a fourth embodiment of the present invention.
FIG. 12 is a view illustrating a state before manufacture of FIG. 11.
<Explanation of symbols on main parts of the drawings>
2; A circuit module 10 for an LED lighting device; LED element
20; Base 22; Center plane
24; Side 26; Snapping
30; FPC 40; frame
42: fitting

Claims (17)

  1. A base; A circuit module for an LED lighting device comprising a FPCB bonded to at least a portion of the base and installed with at least one LED element,
    The circuit module is a circuit module for the LED lighting device is bent to form a multi-faced state in which the base and the FPC is bonded.
  2. The method according to claim 1,
    The base is a circuit module for an LED lighting device, characterized in that the metal or ceramic material.
  3. The method according to claim 1 or 2,
    The FPC and the base circuit module for an LED lighting device, characterized in that separated from the bent portion.
  4. The method according to claim 3,
    At least one of the FPC and the base circuit module for LED lighting apparatus, characterized in that the bent portion is formed with a mask for preventing the bonding.
  5. A base; A circuit module for an LED lighting device comprising a PCB bonded to at least a portion of the base and installed with at least one LED element,
    The circuit module is bent to form a polygonal surface in the state in which the base and the PCB is bonded, and the PCBs installed in each of the polygonal surface is a circuit module for an LED lighting device is connected by a bendable connection circuit.
  6. The method according to any one of claims 1, 2, 4 and 5,
    The polygonal surface is a circuit module for an LED lighting device, characterized in that it comprises a central plane forming a polygon, and at least one side of the inclined with the central plane on at least part of each side of the central plane.
  7. The method according to claim 6,
    The side surface of the LED lighting device circuit module, characterized in that bent more than once.
  8. The method according to claim 6,
    The sides are respectively coupled to each side of the central plane,
    And a frame coupled to the ends of the side surfaces.
  9. The method according to any one of claims 1, 2, 4 and 5,
    The multi-faceted circuit module for an LED lighting device, characterized in that it comprises a side surface coupled to each other to form a horn shape.
  10. The method according to any one of claims 1, 2, 4 and 5,
    Further comprising a frame coupled with the base;
    At least one fitting protrusion is formed on any one of the base and the frame, and the fitting module to which the fitting protrusion is fitted is formed at the other one of the base and the frame.
  11. The method according to any one of claims 1, 2, 4 and 5,
    Further comprising a frame coupled with the base;
    One of the base and the frame has a pin connector having a plurality of pin grooves, and the other has at least one pin that can be fitted into the pin groove of the pin connector. module.
  12. The method according to any one of claims 1, 2, 4 and 5,
    Combined with the base, the circuit module for LED lighting apparatus further comprises a frame having a thermal conductivity.
  13. The method according to any one of claims 1, 2, 4 and 5,
    The FPC and the base is a circuit module for an LED lighting device, characterized in that bonded by a thermally conductive bonding material.
  14. The method according to any one of claims 1, 2, 4 and 5,
    The base is a circuit module for LED lighting device, characterized in that the bending guide line is formed in the bent portion.
  15. The method according to claim 5,
    The base is a circuit module for an LED lighting device, characterized in that the metal or ceramic material.
  16. LED lighting apparatus comprising a circuit module for LED lighting apparatus according to any one of claims 1, 2, 4 to 5.
  17. The method of claim 16,
    LED lighting device further comprises a frame coupled to the base, the power supply for supplying power for lighting the LED element, and the intermediate circuit portion for connecting the FPC.
KR1020080103841A 2008-10-22 2008-10-22 Lighting apparatus having led and circuit module therefor KR20100044632A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020080103841A KR20100044632A (en) 2008-10-22 2008-10-22 Lighting apparatus having led and circuit module therefor

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Publication Number Publication Date
KR20100044632A true KR20100044632A (en) 2010-04-30

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101253199B1 (en) * 2011-07-25 2013-04-10 엘지전자 주식회사 Lighting apparatus
KR101295126B1 (en) * 2011-10-07 2013-08-09 삼성전자주식회사 Illumination device
US8727574B2 (en) 2010-09-21 2014-05-20 Federal-Mogul Corporation LED light module with light pipe and reflectors
US10362679B2 (en) 2012-06-04 2019-07-23 Signify Holding B.V. Lamp comprising a flexible printed circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8727574B2 (en) 2010-09-21 2014-05-20 Federal-Mogul Corporation LED light module with light pipe and reflectors
KR101253199B1 (en) * 2011-07-25 2013-04-10 엘지전자 주식회사 Lighting apparatus
US8888330B2 (en) 2011-07-25 2014-11-18 Lg Electronics Inc. Omnidirectional LED lighting apparatus
KR101295126B1 (en) * 2011-10-07 2013-08-09 삼성전자주식회사 Illumination device
US10362679B2 (en) 2012-06-04 2019-07-23 Signify Holding B.V. Lamp comprising a flexible printed circuit board

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