AU2007100197A4 - Arrangement of light-emitting diodes of LED lamp - Google Patents
Arrangement of light-emitting diodes of LED lamp Download PDFInfo
- Publication number
- AU2007100197A4 AU2007100197A4 AU2007100197A AU2007100197A AU2007100197A4 AU 2007100197 A4 AU2007100197 A4 AU 2007100197A4 AU 2007100197 A AU2007100197 A AU 2007100197A AU 2007100197 A AU2007100197 A AU 2007100197A AU 2007100197 A4 AU2007100197 A4 AU 2007100197A4
- Authority
- AU
- Australia
- Prior art keywords
- light
- emitting diodes
- arrangement
- led lamp
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
P/00/009A Section 29
AUSTRALIA
Patents Act 1990 INNOVATION PATENT SPECIFICATION Invention Title: Applicant: ARRANGEMENT OF LIGHT-EMITTING DIODES OF LED LAMP Augux Co., Ltd The invention is described in the following statement: 7019 ARRANGEMENT OF LIGHT-EMITTING DIODES OF LED LAMP SBACKGROUND OF THE INVENTION 00 1. Field of the Invention The present invention relates to an improved arrangement of light-emitting diodes of a LED lamp, and in particular to an improved arrangement of light-emitting diodes of a LED lamp, in which the light-emitting diodes are arranged in a circular form.
S2. Description of Prior Art Since light-emitting diodes (LED) are high-intensity, energy-saved and long-life, they are widely used in the illumination of electronic devices or lamps. Further, in order to increase the illuminating range and intensity thereof, a plurality of light-emitting diodes are usually combined to form a LED lamp set, thereby to form an illuminating surface by those light-emitting diodes.
The illuminating surface of a common lamp is usually formed into a circular shape.
However, the light-emitting diodes provided on the LED lamp set are currently arranged on its circuit board in an array, which is not suitable for the design of the second-ordered optical lens of 1 5 the circular illuminating surface of the common lamp. Further, the layout on the circuit is also inconvenient.
In view of the above, the inventor proposes the present invention to overcome the above problems based on his expert experiences and deliberate researches.
SUMMARY OF THE INVENTION The present invention is to provide an improved arrangement of light-emitting diodes of a LED lamp, which cooperates with the circular illuminating surface of the common lamp to allow each light-emitting diode to be arranged in a circular form. In this way, it is not only helpful to design the second-ordered optical lens of the LED lamp, but also to produce a conductive circuit O by means of series connection, parallel connection or the combination of the two. Thus, the conductive circuit will not be affected by the arrangement of each light-emitting diode to cause the difficulty in layout and design.
00 The present invention provides an improved arrangement of light-emitting diodes of a LED 5 lamp, which comprises a circuit board and a plurality of light-emitting diodes. The surface of the circuit board is provided with a layer of conductive circuit, so that the light-emitting diodes can be arranged on the circuit board and electrically connected to the conductive circuit. On the Osurface of the circuit board provided with the conductive circuit, an imaginary circle is defined.
Further, the light-emitting diodes are distributed on the circuit board along the imaginary circle to form a circular arrangement. With the circular arrangement of each light-emitting diode, the above objects can be achieved.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. I is a perspective view of the first embodiment of the present invention; Fig. 2 is a top plan view of the first embodiment of the present invention; Fig. 3 is a cross-sectional view taken along the line 3-3 in Fig. 2; Fig. 4 is a top plan view of the second embodiment of the present invention; Fig. 5 is a top plan view of the third embodiment of the present invention; and Fig. 6 is a cross-sectional view taken along the line 6-6 in Fig. DETAILED DESCRIPTION OF THE INVENTION In order to make the Examiner better understand the characteristics and the technical contents of the present invention, the following detailed description will be made with reference to the accompanying drawings. However, it should be understood that the drawings are illustrative but not used to limit the scope of the present invention.
SWith reference to Fig. I and Fig. 2, which are a perspective view and a top plane view of the first embodiment of the present invention, respectively. The present invention provides an improved arrangement of light-emitting diodes of a LED lamp, which comprises a circuit board I 00 O and a plurality of light-emitting diodes (LED) 2 provided on the circuit board 1.
t 5 The circuit board 1 is an insulating plate. A layer of conductive circuit 10 formed of metallic conductive materials such as copper foil is plated on the surface of the circuit board, so that each light-emitting diode 2 arranged thereon can be electrically connected in series Oconnection or parallel connection. The external appearance and the size of the circuit board I can be designed according to the lamps to be used. Further, the number of the light-emitting diodes 2 can be determined according to the conditions in practice.
The characteristic of the present invention lies in that the arrangement of the light-emitting diodes 2 on the circuit board I is formed into a circular shape or several concentric circles.
Further, after the light-emitting diodes 2 are electrically connected via the above conductive circuit 10, the positive and negative contacts 100, 101 are located at the outer periphery of the light-emitting diodes 2. Such arrangement is very suitable for the design of the second-ordered optical lens of the circular illuminating surface of a common lamp. Further, it is easier to produce a series-connection or parallel-connection circuit.
The circular arrangement can be defined as follows. First, on the surface of the circuit board 1 provided with the conductive circuit 10, at least one imaginary circle 11 is defined (Fig.
Then, the light-emitting diodes 2 are distributed on the imaginary circle 11. Further, when the arrangement is formed of several concentric circles, a plurality of imaginary circles 11 can be defined to arrange in a concentric way. Then, the light-emitting diodes 2 are distributed on each imaginary circle 11. The light-emitting diodes 2 on the inner and outer imaginary circles 11 can be further staggered.
With reference to Figs. 1 to 3 again, in the first embodiment of the present invention, the 3 O light-emitting diodes 2 are electrically connected to the conductive circuit 10 in series connection. At the same time, at the position in which each light-emitting diode 2 is arranged on the circuit board 1, a recess 12 is provided for receiving each light-emitting diode 2, thereby to 00 perform the packaging procedure of each light-emitting diode 2. A first-ordered lens 20 is r 5 formed above each recess 12. After each first-ordered lens 20 is formed on each light-emitting diode 2, the light-emitting diodes 2 can be subjected to a so-called second-ordered optical lens treatment, thereby to complete the LED lamp set.
OIn addition, as shown in Fig. 4, in the second embodiment of the present invention, every three adjacent light-emitting diodes 2 are electrically connected in series on the conductive circuit 10, and the thus-connected light-emitting diodes 2 are electrically connected in parallel connection. Since the light-emitting diodes are arranged in a circular shape and the lightemitting diodes 2 in the inner and outer imaginary circles 11 are staggered, each light-emitting diode 2 has a sufficient space for the design and layout of the conductive circuit 10. In other words, in the present invention, the circular arrangement of each light-emitting diode 2 helps to produce the conductive circuit 10 in series connection, parallel connection or the combination of the two. Also, the conductive circuit 10 will not be affected by the arrangement of each lightemitting diode to cause the difficulty in layout and design.
Further, as shown in Fig. 5 and Fig. 6, at the position in which each light-emitting diode 2 is arranged on the circuit board 1, it is not necessary to provide the recess 12 for receiving each light-emitting diode 2 (Fig. That means each light-emitting diode 2 is directly arranged on the surface of the circuit board 1, so that the packaging procedure of the light-emitting diodes 2 can be similarly performed.
According to the above, the present invention indeed achieves the desired effects and overcomes the drawbacks of prior art. Therefore, the present invention involves the novelty and inventive steps, and conforms to the requirements for an invention patent.
4 Although the present invention has been described with reference to the foregoing preferred t embodiments, it will be understood that the invention is not limited to the details thereof.
Various equivalent variations and modifications can still be occurred to those skilled in this art in 00 view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
Claims (4)
1. An arrangement of light-emitting diodes of a LED lamp, comprising: a circuit board provided on one surface thereof with a layer of conductive circuit; and 00 a plurality of light-emitting diodes respectively provided on the circuit board to be 5 electrically connected to the conductive circuit, wherein on the surface of the circuit board provided with the conductive circuit, an imaginary circle is defined, and the light-emitting diodes are distributed on the circuit board along the imaginary circle to form a circular arrangement.
2. The arrangement of light-emitting diodes of a LED lamp according to claim 1, wherein a plurality of imaginary circles are further defined, each imaginary circle is arranged in a concentric way, and the light-emitting diodes are distributed on each imaginary circle.
3. The arrangement of light-emitting diodes of a LED lamp according to claim 2, wherein each light-emitting diode on inner and outer imaginary circles is staggered.
4. The arrangement of light-emitting diodes of a LED lamp according to claim 1, wherein a position in which each light-emitting diode is arranged on the circuit board is provided with a recess for receiving each light-emitting diode. The arrangement of light-emitting diodes of a LED lamp according to claim 1 or wherein each light-emitting diode is formed with a first-ordered lens thereon.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095211388U TWM304623U (en) | 2006-06-29 | 2006-06-29 | Improved structure on arrangement of LEDs of a LED lamp |
| TW095211388 | 2006-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2007100197A4 true AU2007100197A4 (en) | 2007-04-19 |
Family
ID=37576243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2007100197A Ceased AU2007100197A4 (en) | 2006-06-29 | 2007-03-08 | Arrangement of light-emitting diodes of LED lamp |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3133397U (en) |
| KR (1) | KR200449626Y1 (en) |
| AU (1) | AU2007100197A4 (en) |
| DE (1) | DE202006015882U1 (en) |
| TW (1) | TWM304623U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
| KR101308698B1 (en) * | 2013-03-12 | 2013-09-13 | 주식회사 이디엠아이 | Thermally superior led circuit board |
| US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002328094A (en) | 2001-05-02 | 2002-11-15 | Nidec Tosok Corp | Led ring lighting and image inspecting device with it |
| JP2005159262A (en) | 2003-10-30 | 2005-06-16 | Kyocera Corp | Package for housing light emitting element, light emitting device, and lighting system |
| KR100750666B1 (en) | 2006-09-28 | 2007-08-23 | (주)애니칩 | A fountain illuminator |
-
2006
- 2006-06-29 TW TW095211388U patent/TWM304623U/en not_active IP Right Cessation
- 2006-10-17 DE DE202006015882U patent/DE202006015882U1/en not_active Expired - Lifetime
-
2007
- 2007-03-08 AU AU2007100197A patent/AU2007100197A4/en not_active Ceased
- 2007-03-21 KR KR2020070004643U patent/KR200449626Y1/en not_active IP Right Cessation
- 2007-03-27 JP JP2007002047U patent/JP3133397U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3133397U (en) | 2007-07-12 |
| DE202006015882U1 (en) | 2006-12-21 |
| KR20080000007U (en) | 2008-01-03 |
| KR200449626Y1 (en) | 2010-07-23 |
| TWM304623U (en) | 2007-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGI | Letters patent sealed or granted (innovation patent) | ||
| PC | Assignment registered |
Owner name: PYROSWIFT HOLDING CO., LIMITED Free format text: FORMER OWNER WAS: AUGUX CO., LTD |
|
| MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |