JP2003303504A - Illumination apparatus using light emitting diode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination apparatus using a light emitting diode which provides excellent waterproof and dust-proof performance and low failure rate even if installed outdoors, is free from brightness degrading of light emitting diode due to such as invaded dust, and is capable of reducing failures caused by inadequate connection work. <P>SOLUTION: A conductor pattern 7 for power transmission is formed on a surface 2a of a printed board 2 and a plurality of light emitting diodes D are arrayed and mounted on the surface as well. Electronic devices connected to a conductor pattern branched from the conductor pattern 7, for driving the light emitting diodes D are mounted on the back surface. The printed board 2 mounting these devices is housed and fixed in a housing 1 having a transparent surface opposing to the light emitting diodes D. The inside of the housing 1 is filled with transparent resin having high flexibility and thermal conductivity to resin-mold 3 the entire of the plurality of light emitting diodes D and the electronic devices to form the illumination apparatus with lead wires 4a, 4b connected to the conductor pattern 7. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting fixture using a light emitting diode.

[0002]

2. Description of the Related Art For example, lighting devices have been installed on stairs and their handrails or balustrades of pedestrian bridges to display their positions and to illuminate their feet. As such a lighting fixture, it has been developed to use, for example, a light emitting diode that emits light of a color close to daylight as a light source for illumination. A lighting fixture using such a light emitting diode generally has a large number of light emitting diodes arrayed and mounted on one surface (hereinafter referred to as the front surface) of a printed circuit board on which a conductor circuit is formed, and the other surface (hereinafter referred to as the back surface). The electronic components that make up the lighting drive circuit for causing the light emitting diodes to emit light are mounted. It is configured to be housed in an appropriate light-transmitting box.

[0003]

A luminaire using a light emitting diode having such a structure is liable to cause a failure particularly when it is installed outdoors where it is exposed to wind and rain or dust, and has a short life as a luminaire. Further, there is a problem that the desired brightness cannot be obtained due to the decrease in the brightness of the light emitting diode due to the dirt such as dust. In addition, most of the lighting fixtures installed are not installed individually but are often connected.
In this case, it is conceivable to wire the electric wire supplied to the connected lighting equipment inside or outside the lighting equipment.
There is a problem that the wiring work is difficult to perform, a construction failure such as a short circuit of a power supply line or a ground fault is likely to occur, and other devices are adversely affected.

The present invention has been made in order to solve such a problem, is excellent in waterproof and dustproof, is less likely to cause a failure even when installed outdoors, and is reduced in luminance of a light emitting diode due to entry of dust or the like. It is also an object of the present invention to provide a lighting fixture using a light emitting diode that can reduce the occurrence of a failure due to a connection failure or the like.

[0005]

According to a first aspect of the present invention, a front surface and a back surface of a substrate having a large number of light emitting diodes arranged and mounted on a front surface thereof and electronic components for lighting and driving the plurality of light emitting diodes mounted on a rear surface thereof. It is characterized in that the entire surface is resin-molded.

According to a second aspect of the present invention, a plurality of light emitting diodes are arranged and mounted on a front surface, and a substrate on which electronic components for lighting and driving the plurality of light emitting diodes are mounted on a back surface is housed in a housing, and It is characterized in that the housing is filled with a transparent resin having high flexibility and high thermal conductivity, and the large number of light emitting diodes and the electronic parts are resin-molded.

The present invention according to claim 3 is characterized in that the substrate according to the present invention according to claim 1 or 2 is provided with a through hole through which air bubbles for resin molding are inserted.
The present invention according to claim 4 is characterized in that the surface of the substrate is colored.

The present invention according to claim 5 provides the invention according to claim 1.
Alternatively, a conductor pattern for power supply extending from one end to the other end and a conductor pattern for power supply branched from the conductor pattern and connected to an electronic component of the substrate are formed on the substrate in the present invention according to claim 2. It is characterized by
According to a sixth aspect of the present invention, in the present invention according to the fifth aspect, a protective fuse is provided on a conductor pattern for a power source that is connected to an electronic component of the substrate branched from a conductor pattern for a power source that extends from the one end to the other end. The present invention according to claim 7 is characterized in that a connecting connector is connected to a conductor pattern for power supply extending from the one end to the other end.

In the present invention, since a large number of light emitting diodes are arranged and mounted on the front surface, and the entire substrate formed by mounting electronic components for driving the large number of light emitting diodes on the back surface is resin-molded, failure due to water or dust is prevented. Occurrence and decrease in brightness can be reduced. In addition, by making the resin to be molded a transparent resin with high flexibility and high thermal conductivity, thermal conductivity is improved without giving mechanical stress to the light emitting diode and electronic parts mounted on the substrate, and The temperature can be reduced and the life of the lighting fixture can be extended. In this case, if the substrate is provided with a through hole through which bubbles are inserted, in addition to vacuum degassing during molding, degassing can be completed more completely and in a shorter time.

Further, by combining the color of the light emitting diode and the color of the surface of the substrate, the reflectance and the effect of production can be enhanced, and a conductor pattern for power supply extending from one end to the other end is formed on the substrate. Then, wiring work of the power supply line when connecting can be facilitated, power supply short circuit and ground fault can be reduced, and the power supply for connecting to the electronic component of the board branched from the conductor pattern for the power supply can be reduced. If a protective fuse is provided on the conductor pattern of (1), even if a short circuit failure occurs in the drive circuit of the board, it becomes possible to secure the power supply of the connected lighting equipment.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic structure of a lighting fixture using a light emitting diode according to an embodiment of the present invention. (A) is a plan view, (b) is a cross-sectional view, and (c).
2 is a vertical sectional view, FIG. 2 is a circuit diagram showing a connected state of a lighting fixture using the light emitting diode of FIG. 1, and FIG. 3 is a vertical sectional view showing a mounting state of a lighting fixture using the light emitting diode.

In FIG. 1, reference numeral 1 denotes a bottom surface 1 having a U-shaped vertical section.
a is a case made of a transparent acrylic resin or the like, 2 is a board (printed board) having a rectangular shape in plan view on which a conductor circuit is formed, and 3 is a resin mold made of a transparent silicone resin having high flexibility and thermal conductivity. Layer, 4a is a lead wire on the power input side, 4b is a lead wire on the power feed side, 5a, 5b
Is a waterproof connector, 6 is a void portion, 7 is a conductor pattern, D is a light emitting diode, and E is an electronic component such as a semiconductor device, a resistor, and a capacitor that constitute a lighting drive circuit for driving the light emitting diode D to light.

On the front surface 2a of the printed board 2, a large number of light emitting diodes D are mounted in a line along the longitudinal direction at the central portion, and conductor patterns 7 for power supply extending from one end to the other end are provided at both end portions. It is formed (this conductor pattern 7 may be formed on the back surface 2b of the substrate 2). On the back surface 2b of the printed circuit board 2, electronic components E such as diodes, resistors and capacitors that constitute a lighting drive circuit for driving the plurality of light emitting diodes D arranged on the front surface 2a are mounted. Are properly connected to a conductor pattern 8 (see FIG. 2) formed by branching from the conductor pattern 7 for power supply. The lead wire 4a is connected to one end of the conductor pattern 7, the lead wire 4b is connected to the other end of the conductor pattern 7, and the lead wires 4a and 4b are led out from the resin mold layer 3.

The resin mold layer is generally formed by mounting the substrate 2 formed by mounting the light emitting diode D and the electronic component E as described above, with the surface mounting the light emitting diode D facing the bottom surface 1a of the housing 1. Then, it is inserted into the housing 1 and fixed to the housing 1 by an appropriate means. Then, a transparent silicon resin liquid having high flexibility and high thermal conductivity is filled in the housing 1 in a vacuum chamber to a position at which a large number of light emitting diodes D and electronic components E are sufficiently covered, and then the silicone resin is cured. It is formed by

Bubbles are generated when the resin is filled. The bubbles are removed from the resin by vacuuming, that is, degassed. However, as shown in FIG. 4, when the through holes 2c and the notches 2d for inserting the bubbles are formed at appropriate positions of the substrate 2, Reliable degassing can be done in a short time. In addition, the resin is improved around and it becomes easy to mold the entire substrate with resin. As a result, it is possible to reduce deterioration of appearance and poor heat conduction (adverse effects such as temperature rise) by performing reliable degassing. In addition, in FIG. 4, portions corresponding to the portions shown in FIG. 1 are denoted by the same reference numerals.

As shown in FIG. 5, if a large number of lenses 15 are formed on the U-shaped bottom surface 1a of the housing 1, that is, the light emitting surface of the light emitting diode D, the light emitted from the light emitting diode is appropriately emitted by the lenses. It can be efficiently focused on the outside.

Further, the surface 2a of the substrate 2 on which the light emitting diodes D are arranged and mounted is, for example, a white light emitting diode D.
In the case where the LEDs are arrayed, the reflectance can be increased by coloring in white to compensate for the decrease in the brightness, and when the light emitting diode D is arrayed to emit red light or orange light, the color of the surface 2a of the substrate 2 can be increased. When the is colored black, it is possible to obtain a lighting fixture having a high effect of production. The color for coloring the surface 2a of the substrate 2 and the emission color of the light emitting diode may be selected appropriately.

The luminaire constructed as above is shown in FIG.
As shown in FIG. 3, the work frame 10 made of a non-combustible material such as aluminum having a U-shaped vertical cross section is put on the U-shaped opening of the housing 1. The attachment to the structure 11 is performed by attaching and fixing the work frame 10 to the structure 11 by an appropriate fixing means such as a bolt and fitting the opening side of the lighting fixture into the fixed work frame 10.

At the time of this attachment, a plurality of lighting fixtures are usually connected. FIG. 2 shows an example of this connected state. In FIG. 2, 2 and 21 are substrates of a lighting fixture configured in the same manner as the lighting fixture shown in FIG. 1, 9 is an AC or DC power supply, and 12, 13 Is a protective fuse, and 14 is a lighting drive circuit. The same parts as those of the lighting equipment shown in FIG. 1 are designated by the same reference numerals. The power of the power source 9 is supplied to the board 2 by connecting the connector on the power supply side and the connector 5a of the board 2, and the board 21 is connected to the connector 5b of the board 2 and the board 2
The power of the power source 9 is supplied through the conductor pattern 7 for feeding the power source of the substrate 2 by the connection with the connector 5a.

In this example, a protective fuse 13 is connected to a conductor pattern 7 for power supply and a protective fuse 12 is connected to a conductor pattern 8 formed by branching from the conductor pattern 7 on the substrate 2 on the power source 9 side. In the substrate 21 connected to the substrate 2, the protective fuse 12 is connected to the conductor pattern 8 formed by branching from the conductor pattern 7.
The protection fuse 13 and the protection fuse 12 on the substrate 2 are selected such that even if a short circuit occurs, for example, at AA, the protection fuse 13 melts before the copper foil of the conductor pattern 7 melts due to this short circuit. If the lighting drive circuit 14 is abnormal, the protection fuse 12 is blown before the protection fuse 13 is blown. This selection is for avoiding a state in which all the light emitting diodes of the connected lighting equipment are extinguished when the protective fuse 13 is blown before the protective fuse 12 is blown. Although the substrate 21 is not provided with the protective fuse 13, the protective fuse 13 may be provided. In this case, although it takes time to provide the protective fuse 13 in all the lighting fixtures, it is provided on the power supply side. It is not necessary to distinguish between the luminaire and the luminaire provided on the connection side.

In the above embodiment, a large number of light emitting diodes D are arranged in a straight line. However, the arrangement of a large number of light emitting diodes D is not limited to one arranged in a straight line and may be arranged in a plurality of columns or randomly. Is also good. Further, the connection can be performed not only in one horizontal line but also in a vertical line, and it is possible to appropriately cope with the facility that requires illumination. Furthermore, although the luminaire is formed to be elongated, the shape of the luminaire may be arbitrary. 6 to 8 are examples of other embodiments in which the lighting fixture is formed in a circular shape. 6 to 7, parts corresponding to those of the embodiment shown in FIG. 1 are designated by the same reference numerals, and, in FIG. 8, parts corresponding to those of the embodiment shown in FIG. Is attached and the description of the overlapping portion is omitted.

In the actual embodiment shown in FIGS. 6 to 7, the printed circuit board 2 is formed in a circular shape in plan view, and a large number of light emitting diodes D are arranged on the surface 2a of the printed circuit board 2 symmetrically with respect to the center of the printed circuit board 2. The light emitting diodes are arranged so that the temperature distribution during operation is uniform. On the back surface of the printed circuit board 2, electronic components for driving a large number of light emitting diodes D are mounted concentrically in the vicinity of the outer periphery of the printed circuit board 2 in consideration of the heat radiation effect (not shown). 14a is pulled out.

The housing 1 has a U-shaped cross section and a circular shape in a plan view, and is integrally molded with a transparent acrylic resin or the like. As shown in FIG. A large number of lenses 15 are formed on the bottom surface 1a, and a flange 1b is provided on the outer circumference. Many light emitting diodes D
A printed circuit board 2 on which electronic components are mounted is housed and fixed inside the housing 1, and a resin mold layer 3 is formed by filling a transparent silicone resin having high flexibility and thermal conductivity. A work frame 16 is covered on the opening having a U-shaped cross section, and the work frame 16 is screwed and fixed to a metal fitting 17 hooked on the flange 1b. For attachment to the structure, the work frame 16 is removed, and the structure 1 is fixed to the structure with appropriate fixing means such as bolts, and the housing 1
The opening side of is fitted and the metal fitting 17 is tightened and fixed.
Even if the substrate 2 is formed into a circular shape as described above, if a through hole 2c for inserting bubbles during resin molding is provided in an appropriate portion of the substrate as shown in FIG. 8, more reliable deaeration can be performed in a short time.
In addition, the resin is improved around and it becomes easy to mold the entire substrate with resin. As a result, it is possible to reduce deterioration of appearance and poor heat conduction (adverse effects such as temperature rise) by performing reliable degassing.

The U-shaped bottom surface facing the light emitting diode may be transparent or anti-transparent, and the peripheral surface other than the bottom surface may not be transparent or anti-transparent. Furthermore, in each of the embodiments, the resin mold layer is formed by filling the inside of the housing 1 with resin, but resin molding may be performed separately.

[0025]

As described in detail above, according to the present invention, it is excellent in waterproofing and dustproof and is less likely to malfunction even when installed outdoors.
In addition, it is possible to obtain a lighting fixture using a light emitting diode having a long life as the lighting fixture.

[Brief description of drawings]

FIG. 1 shows a schematic structure of a lighting fixture using a light emitting diode according to an embodiment of the present invention, (a) is a plan view, (b) is a cross-sectional view, and (c) is a vertical cross-sectional view. is there.

FIG. 2 is a circuit diagram showing a connected state of a lighting fixture using the light emitting diode of FIG.

FIG. 3 is a vertical sectional view showing a mounting state of a lighting fixture using the light emitting diode of FIG.

FIG. 4 is a plan view of another example of the lighting fixture using the light emitting diode according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view of another example of the lighting fixture using the light emitting diode according to the embodiment of the invention.

FIG. 6 is a plan view of a substrate of a lighting fixture using a light emitting diode according to another embodiment of the present invention.

7 is a cross-sectional view of a lighting fixture using a light emitting diode including the substrate of FIG.

FIG. 8 is a plan view of another example of the lighting fixture using the light emitting diode according to the embodiment of the invention.

[Explanation of symbols]

1 case 2,21 circuit board (printed circuit board) 2a surface 2b back side 2c through hole 2d cutout 3 Resin mold layer 4a, 4b Lead wire 5a, 5b Waterproof connector 6 void 7 Conductor pattern for power supply 8 branch conductor pattern 9 power supplies 10, 16 work frame 12, 13 Protection fuse 14 Lighting drive circuit 15 lenses D light emitting diode E electronic parts

Continued front page    (72) Inventor Katsuyuki Doi             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. (72) Inventor Motoharu Iwasaki             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. (72) Inventor Hiroki Fujimoto             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. F term (reference) 3K014 AA01 DA05 LA01 LB04                 5F041 AA43 DA13 DA20 DA43 DA57                       DA83 DB07 DB08 DC07 DC23                       DC83 DC84 FF11

Claims (7)

[Claims] 1. A substrate comprising a large number of light emitting diodes arranged and mounted on a front surface thereof, and a plurality of the light emitting diodes mounted on a rear surface of which electronic components constituting a lighting drive circuit are mounted, which are molded by resin. Lighting equipment using a light emitting diode. 2. A substrate, in which a large number of light emitting diodes are arranged and mounted on a front surface, and electronic components constituting a lighting drive circuit are mounted on the rear surface, are housed in a housing,
A lighting fixture using a light-emitting diode, characterized in that the housing is filled with a transparent resin having high flexibility and high thermal conductivity, and the large number of light-emitting diodes and the electronic parts are resin-molded. 3. A lighting fixture using a light emitting diode according to claim 1 or 2, wherein the substrate is provided with a through hole for inserting bubbles during resin molding. 4. The lighting fixture using a light emitting diode according to claim 1, wherein the surface of the substrate is colored. 5. The substrate is provided with a conductor pattern for power supply extending from one end to the other end and a conductor pattern for power supply branched from the conductor pattern and connected to an electronic component of the substrate. A lighting fixture using the light emitting diode according to claim 1 or 2. 6. A protective fuse is provided on a conductor pattern for power supply which is branched from a conductor pattern for power supply extending from the one end to the other end and is connected to an electronic component of the substrate. Lighting equipment using light emitting diodes. 7. The lighting fixture using a light emitting diode according to claim 5, wherein a connecting connector is connected to a conductor pattern for power supply extending from the one end to the other end.