JP2003303504A - Illumination apparatus using light emitting diode - Google Patents

Illumination apparatus using light emitting diode

Info

Publication number
JP2003303504A
JP2003303504A JP2002107257A JP2002107257A JP2003303504A JP 2003303504 A JP2003303504 A JP 2003303504A JP 2002107257 A JP2002107257 A JP 2002107257A JP 2002107257 A JP2002107257 A JP 2002107257A JP 2003303504 A JP2003303504 A JP 2003303504A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
conductor pattern
substrate
emitting diodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002107257A
Other languages
Japanese (ja)
Inventor
Ryutaro Omae
龍太郎 大前
Akihiro Naka
明弘 中
Katsuyuki Doi
勝之 土井
Motoharu Iwasaki
元治 岩崎
Hiroki Fujimoto
浩喜 藤本
Original Assignee
Meiji Natl Ind Co Ltd
明治ナショナル工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meiji Natl Ind Co Ltd, 明治ナショナル工業株式会社 filed Critical Meiji Natl Ind Co Ltd
Priority to JP2002107257A priority Critical patent/JP2003303504A/en
Publication of JP2003303504A publication Critical patent/JP2003303504A/en
Pending legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination apparatus using a light emitting diode which provides excellent waterproof and dust-proof performance and low failure rate even if installed outdoors, is free from brightness degrading of light emitting diode due to such as invaded dust, and is capable of reducing failures caused by inadequate connection work. <P>SOLUTION: A conductor pattern 7 for power transmission is formed on a surface 2a of a printed board 2 and a plurality of light emitting diodes D are arrayed and mounted on the surface as well. Electronic devices connected to a conductor pattern branched from the conductor pattern 7, for driving the light emitting diodes D are mounted on the back surface. The printed board 2 mounting these devices is housed and fixed in a housing 1 having a transparent surface opposing to the light emitting diodes D. The inside of the housing 1 is filled with transparent resin having high flexibility and thermal conductivity to resin-mold 3 the entire of the plurality of light emitting diodes D and the electronic devices to form the illumination apparatus with lead wires 4a, 4b connected to the conductor pattern 7. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【発明の属する技術分野】本発明は、発光ダイオードを
用いた照明器具に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lighting fixture using a light emitting diode.
【0002】[0002]
【従来の技術】例えば階段やその手摺りあるいは歩道橋
の欄干などに照明器具を設置し、それらの存在位置を表
示したり足元などを照明することが行われている。この
ような照明器具として、たとえば昼光色に近い色の光を
発光する発光ダイオードを照明用の光源として用いるこ
とが開発されている。このような発光ダイオードを用い
た照明器具は、一般に導体回路を形成した基板いわゆる
プリント基板の一方の面(以下表面という)に多数の発
光ダイオードを配列実装し、他方の面(以下裏面とい
う)にそれらの発光ダイオードを発光させるための点灯
駆動回路を構成する電子部品が実装され、これらを実装
したプリント基板を、プリント基板の表面(発光ダイオ
ードを実装している側の面)と対向する面を光透過性と
した適宜の函体内に収納して構成されている。
2. Description of the Related Art For example, lighting devices have been installed on stairs and their handrails or balustrades of pedestrian bridges to display their positions and to illuminate their feet. As such a lighting fixture, it has been developed to use, for example, a light emitting diode that emits light of a color close to daylight as a light source for illumination. A lighting fixture using such a light emitting diode generally has a large number of light emitting diodes arrayed and mounted on one surface (hereinafter referred to as the front surface) of a printed circuit board on which a conductor circuit is formed, and the other surface (hereinafter referred to as the back surface). The electronic components that make up the lighting drive circuit for causing the light emitting diodes to emit light are mounted. It is configured to be housed in an appropriate light-transmitting box.
【0003】[0003]
【発明が解決しようとする課題】このように構成された
発光ダイオードを用いた照明器具は、特に風雨や塵埃に
晒される屋外に設置すると故障が発生しやすく、また照
明器具として寿命が短かく、さらにその塵埃などの汚れ
による発光ダイオードの輝度低下により所望の輝度が得
られなくなるという問題がある。また、設置される照明
器具は、単独での設置は少なく連結による設置が多い。
この場合、連結する照明器具に供給する電線を照明器具
内または器具外側にて引きまわすことが考えられるが、
その配線工事が行ないにくく、電源線の短絡や地絡など
の施工不良を発生しやすく、他の機器に悪影響を及ぼし
易いという問題がある。
A luminaire using a light emitting diode having such a structure is liable to cause a failure particularly when it is installed outdoors where it is exposed to wind and rain or dust, and has a short life as a luminaire. Further, there is a problem that the desired brightness cannot be obtained due to the decrease in the brightness of the light emitting diode due to the dirt such as dust. In addition, most of the lighting fixtures installed are not installed individually but are often connected.
In this case, it is conceivable to wire the electric wire supplied to the connected lighting equipment inside or outside the lighting equipment.
There is a problem that the wiring work is difficult to perform, a construction failure such as a short circuit of a power supply line or a ground fault is likely to occur, and other devices are adversely affected.
【0004】本発明は、このような問題を解消すべくな
されたもので、防水、防塵に優れ、屋外に設置しても故
障の発生が少なく、塵埃等の侵入による発光ダイオード
の輝度の低下がなく、また、連結による施工不良などに
よる故障の発生を低減することのできる発光ダイオード
を用いた照明器具を提供することを目的とする。
The present invention has been made in order to solve such a problem, is excellent in waterproof and dustproof, is less likely to cause a failure even when installed outdoors, and is reduced in luminance of a light emitting diode due to entry of dust or the like. It is also an object of the present invention to provide a lighting fixture using a light emitting diode that can reduce the occurrence of a failure due to a connection failure or the like.
【0005】[0005]
【課題を解決するための手段】請求項1に係る本発明
は、表面に多数の発光ダイオードを配列実装し、裏面に
前記多数の発光ダイオードを点灯駆動する電子部品を実
装してなる基板の表裏全面を樹脂モールドしてなること
を特徴とする。
According to a first aspect of the present invention, a front surface and a back surface of a substrate having a large number of light emitting diodes arranged and mounted on a front surface thereof and electronic components for lighting and driving the plurality of light emitting diodes mounted on a rear surface thereof. It is characterized in that the entire surface is resin-molded.
【0006】請求項2に係る本発明は、表面に多数の発
光ダイオードを配列実装し、裏面に前記多数の発光ダイ
オードを点灯駆動する電子部品を実装してなる基板を筐
体に収納し、前記筐体内に柔軟性および熱伝導性の高い
透明樹脂を充填して前記多数の発光ダイオードおよび前
記電子部品を樹脂モールドしてなることを特徴とする。
According to a second aspect of the present invention, a plurality of light emitting diodes are arranged and mounted on a front surface, and a substrate on which electronic components for lighting and driving the plurality of light emitting diodes are mounted on a back surface is housed in a housing, and It is characterized in that the housing is filled with a transparent resin having high flexibility and high thermal conductivity, and the large number of light emitting diodes and the electronic parts are resin-molded.
【0007】請求項3に係る本発明は、請求項1又は請
求項2に係る本発明における前記基板に樹脂モールド時
の気泡を挿通する貫通孔を設けてなることを特徴とし、
請求項4に係る本発明は、前記基板の表面を着色してな
ることを特徴とする。
The present invention according to claim 3 is characterized in that the substrate according to the present invention according to claim 1 or 2 is provided with a through hole through which air bubbles for resin molding are inserted.
The present invention according to claim 4 is characterized in that the surface of the substrate is colored.
【0008】また、請求項5に係る本発明は、請求項1
又は請求項2記載の本発明における前記基板には、その
一端から他端に伸びる電源用の導体パターンと前記導体
パターンから分岐し、前記基板の電子部品に接続する電
源用の導体パターンが形成されてなることを特徴とし、
請求項6に係る本発明は、請求項5に係る本発明におけ
る前記一端から他端に伸びる電源用の導体パターンから
分岐した前記基板の電子部品に接続する電源用の導体パ
ターンに保護ヒューズを設けてなることを特徴とし、請
求項7に係る本発明は、前記一端から他端に伸びる電力
供給用の導体パターンに連結用コネクタを接続してなる
ことを特徴とする。
The present invention according to claim 5 provides the invention according to claim 1.
Alternatively, a conductor pattern for power supply extending from one end to the other end and a conductor pattern for power supply branched from the conductor pattern and connected to an electronic component of the substrate are formed on the substrate in the present invention according to claim 2. It is characterized by
According to a sixth aspect of the present invention, in the present invention according to the fifth aspect, a protective fuse is provided on a conductor pattern for a power source that is connected to an electronic component of the substrate branched from a conductor pattern for a power source that extends from the one end to the other end. The present invention according to claim 7 is characterized in that a connecting connector is connected to a conductor pattern for power supply extending from the one end to the other end.
【0009】本発明では、表面に多数の発光ダイオード
を配列実装し、裏面に前記多数の発光ダイオードを駆動
する電子部品を実装してなる基板の全体を樹脂モールド
するので、水や塵埃による故障の発生や輝度の低下を低
減することができる。また、モールドする樹脂を柔軟性
および熱伝導性の高い透明樹脂にすることで、基板に実
装した発光ダイオードや電子部品に機械的なストレスを
与えず熱伝導が良くなり、電子部品及び発光ダイオード
の温度を低減でき照明器具としての寿命を長くすること
ができる。この場合、基板に気泡を挿通する貫通孔を設
けると、モールド時の真空脱気に加えより完全にかつ短
時間に脱気することができる。
In the present invention, since a large number of light emitting diodes are arranged and mounted on the front surface, and the entire substrate formed by mounting electronic components for driving the large number of light emitting diodes on the back surface is resin-molded, failure due to water or dust is prevented. Occurrence and decrease in brightness can be reduced. In addition, by making the resin to be molded a transparent resin with high flexibility and high thermal conductivity, thermal conductivity is improved without giving mechanical stress to the light emitting diode and electronic parts mounted on the substrate, and The temperature can be reduced and the life of the lighting fixture can be extended. In this case, if the substrate is provided with a through hole through which bubbles are inserted, in addition to vacuum degassing during molding, degassing can be completed more completely and in a shorter time.
【0010】さらに、発光ダイオードの色と基板表面の
色とを組み合わせることによって、反射率や演出効果を
高めたりすることができ、さらにまた基板に一端から他
端に伸びる電源用の導体パターンを形成すると、連結す
る場合の電源線の配線施工も容易になり、電源短絡や地
絡の故障を低減することができ、またその電源用の導体
パターンから分岐したその基板の電子部品に接続する電
源用の導体パターンに保護ヒューズを設けると、その基
板の駆動回路に短絡故障が発生しても連結した照明器具
の電源を確保することが可能となる。
Further, by combining the color of the light emitting diode and the color of the surface of the substrate, the reflectance and the effect of production can be enhanced, and a conductor pattern for power supply extending from one end to the other end is formed on the substrate. Then, wiring work of the power supply line when connecting can be facilitated, power supply short circuit and ground fault can be reduced, and the power supply for connecting to the electronic component of the board branched from the conductor pattern for the power supply can be reduced. If a protective fuse is provided on the conductor pattern of (1), even if a short circuit failure occurs in the drive circuit of the board, it becomes possible to secure the power supply of the connected lighting equipment.
【0011】[0011]
【発明の実施の形態】以下、本発明の実施の形態につい
て図を参照して説明する。図1は本発明の一実施の形態
に係る発光ダイオードを用いた照明器具の概略構造を示
すもので、(a)は平面図、(b)は横断面図、(c)
は縦断面図、図2は図1の発光ダイオードを用いた照明
器具の連結状態を示す回路図、図3は同発光ダイオード
を用いた照明器具の取り付け状態を示す縦断面図であ
る。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic structure of a lighting fixture using a light emitting diode according to an embodiment of the present invention. (A) is a plan view, (b) is a cross-sectional view, and (c).
2 is a vertical sectional view, FIG. 2 is a circuit diagram showing a connected state of a lighting fixture using the light emitting diode of FIG. 1, and FIG. 3 is a vertical sectional view showing a mounting state of a lighting fixture using the light emitting diode.
【0012】図1において、1は縦断面コ字状の底面1
aが透明のアクリル樹脂などからなる筐体、2は導体回
路を形成した平面視細長い長方形をなす基板(プリント
基板)、3は柔軟性および熱伝導性の高い透明なシリコ
ン樹脂などからなる樹脂モールド層、4aは電源入力側
の口出し線、4bは電源送り側の口出し線、5a,5b
は防水コネクタ、6は空隙部、7は導体パターン、Dは
発光ダイオード、Eは発光ダイオードDを点灯駆動する
ための点灯駆動回路を構成する半導体装置、抵抗体、コ
ンデンサなどの電子部品である。
In FIG. 1, reference numeral 1 denotes a bottom surface 1 having a U-shaped vertical section.
a is a case made of a transparent acrylic resin or the like, 2 is a board (printed board) having a rectangular shape in plan view on which a conductor circuit is formed, and 3 is a resin mold made of a transparent silicone resin having high flexibility and thermal conductivity. Layer, 4a is a lead wire on the power input side, 4b is a lead wire on the power feed side, 5a, 5b
Is a waterproof connector, 6 is a void portion, 7 is a conductor pattern, D is a light emitting diode, and E is an electronic component such as a semiconductor device, a resistor, and a capacitor that constitute a lighting drive circuit for driving the light emitting diode D to light.
【0013】プリント基板2の表面2aには、中央部に
長手方向に沿って一列に多数の発光ダイオードDが実装
され、両側の端部に一端から他端に伸びる電源送り用の
導体パターン7が形成されている(なお、この導体パタ
ーン7は基板2の裏面2bに形成してもよい。)。プリ
ント基板2の裏面2bには、表面2aに配列された多数
の発光ダイオードDを点灯駆動するための点灯駆動回路
を構成するダイオード、抵抗体、コンデンサなどの電子
部品Eが実装され、電子部品Eは電源送り用の導体パタ
ーン7から分岐して形成された導体パターン8(図2参
照)に適宜接続されている。口出し線4aは導体パター
ン7の一方の端部に、口出し線4bは導体パターン7の
他方の端部に接続され、口出し線4a、4bは樹脂モー
ルド層3から引き出されている。
On the front surface 2a of the printed board 2, a large number of light emitting diodes D are mounted in a line along the longitudinal direction at the central portion, and conductor patterns 7 for power supply extending from one end to the other end are provided at both end portions. It is formed (this conductor pattern 7 may be formed on the back surface 2b of the substrate 2). On the back surface 2b of the printed circuit board 2, electronic components E such as diodes, resistors and capacitors that constitute a lighting drive circuit for driving the plurality of light emitting diodes D arranged on the front surface 2a are mounted. Are properly connected to a conductor pattern 8 (see FIG. 2) formed by branching from the conductor pattern 7 for power supply. The lead wire 4a is connected to one end of the conductor pattern 7, the lead wire 4b is connected to the other end of the conductor pattern 7, and the lead wires 4a and 4b are led out from the resin mold layer 3.
【0014】樹脂モールド層の形成は、概略、以上のよ
うに発光ダイオードDおよび電子部品Eを実装して構成
された基板2を、発光ダイオードDを実装した表面を筐
体1の底面1aに対向させて筐体1内に挿入して適宜の
手段によって筐体1に固定する。そして、真空槽内で柔
軟性および熱伝導性の高い透明のシリコン樹脂液を筐体
1内に、多数の発光ダイオードDおよび電子部品Eを充
分に覆う位置まで充填し、そのあとシリコン樹脂を硬化
することにより形成される。
The resin mold layer is generally formed by mounting the substrate 2 formed by mounting the light emitting diode D and the electronic component E as described above, with the surface mounting the light emitting diode D facing the bottom surface 1a of the housing 1. Then, it is inserted into the housing 1 and fixed to the housing 1 by an appropriate means. Then, a transparent silicon resin liquid having high flexibility and high thermal conductivity is filled in the housing 1 in a vacuum chamber to a position at which a large number of light emitting diodes D and electronic components E are sufficiently covered, and then the silicone resin is cured. It is formed by
【0015】この樹脂充填の際、気泡が発生する。この
気泡は真空引きによって樹脂内から取り除かれる、すな
わち脱気されるが、図4に示すように基板2の適宜位置
に気泡を挿通する貫通孔2cや切欠き2dを形成してお
くと、より確実な脱気を短時間で行なえる。また、樹脂
の回りが良くなり、基板全体を樹脂モールドしやすくな
る。延いては確実な脱気を行なえることによって見栄え
の悪化や熱伝導の悪さ(温度上昇などの悪影響)を低減
することができる。なお、図4において、図1に示す部
分に対応する箇所には同一の符号を付している。
Bubbles are generated when the resin is filled. The bubbles are removed from the resin by vacuuming, that is, degassed. However, as shown in FIG. 4, when the through holes 2c and the notches 2d for inserting the bubbles are formed at appropriate positions of the substrate 2, Reliable degassing can be done in a short time. In addition, the resin is improved around and it becomes easy to mold the entire substrate with resin. As a result, it is possible to reduce deterioration of appearance and poor heat conduction (adverse effects such as temperature rise) by performing reliable degassing. In addition, in FIG. 4, portions corresponding to the portions shown in FIG. 1 are denoted by the same reference numerals.
【0016】なお、図5に示すように、筐体1のコ字状
の底面1a、すなわち発光ダイオードDの光出射面に多
数のレンズ15を形成すると、発光ダイオードから放射
した光はレンズで適宜に集光され、効率良く外部に照射
することができる。
As shown in FIG. 5, if a large number of lenses 15 are formed on the U-shaped bottom surface 1a of the housing 1, that is, the light emitting surface of the light emitting diode D, the light emitted from the light emitting diode is appropriately emitted by the lenses. It can be efficiently focused on the outside.
【0017】また、発光ダイオードDを配列実装した基
板2の表面2aを、たとえば白色光の発光ダイオードD
を配列した場合に、白色に着色すると反射率を高め、輝
度の低下を補うことができ、また、赤色光や橙色光の発
光に発光ダイオードDを配列した場合に、基板2の表面
2aの色を黒色に着色すると演出効果の高い照明器具を
得ることができる。なお、基板2の表面2aに着色する
色と発光ダイオードの発光色は適宜に選択すればよい。
Further, the surface 2a of the substrate 2 on which the light emitting diodes D are arranged and mounted is, for example, a white light emitting diode D.
In the case where the LEDs are arrayed, the reflectance can be increased by coloring in white to compensate for the decrease in the brightness, and when the light emitting diode D is arrayed to emit red light or orange light, the color of the surface 2a of the substrate 2 can be increased. When the is colored black, it is possible to obtain a lighting fixture having a high effect of production. The color for coloring the surface 2a of the substrate 2 and the emission color of the light emitting diode may be selected appropriately.
【0018】以上のように構成された照明器具は、図3
に示すように縦断面コ字状のアルミニウムなどの不燃性
材で形成された工枠10が、筐体1のコ字状の開口部に
被せられる。構築物11への取り付けは、工枠10を構
築物11にボルトなどの適宜の固定手段によって取付け
固定し、固定した工枠10に照明器具の開口部側を嵌め
込むことにより行われる。
The luminaire constructed as above is shown in FIG.
As shown in FIG. 3, the work frame 10 made of a non-combustible material such as aluminum having a U-shaped vertical cross section is put on the U-shaped opening of the housing 1. The attachment to the structure 11 is performed by attaching and fixing the work frame 10 to the structure 11 by an appropriate fixing means such as a bolt and fitting the opening side of the lighting fixture into the fixed work frame 10.
【0019】この取り付けに際し、通常、複数の照明器
具が連結される。図2はこの連結した状態の一例を示す
もので、図2において、2および21は図1に示す照明
器具と同様に構成された照明器具の基板、9は交流また
は直流の電源、12,13は保護ヒューズ、14は点灯
駆動回路である。なお、図1に示す照明器具と同一部分
には同一の符号を付している。基板2は電源側のコネク
タと基板2のコネクタ5aとの接続により電源9の電力
が供給され、基板21は基板2のコネクタ5bと基板2
1のコネクタ5aとの接続により基板2の電源送り用の
導体パターン7を介して電源9の電力が供給される。
At the time of this attachment, a plurality of lighting fixtures are usually connected. FIG. 2 shows an example of this connected state. In FIG. 2, 2 and 21 are substrates of a lighting fixture configured in the same manner as the lighting fixture shown in FIG. 1, 9 is an AC or DC power supply, and 12, 13 Is a protective fuse, and 14 is a lighting drive circuit. The same parts as those of the lighting equipment shown in FIG. 1 are designated by the same reference numerals. The power of the power source 9 is supplied to the board 2 by connecting the connector on the power supply side and the connector 5a of the board 2, and the board 21 is connected to the connector 5b of the board 2 and the board 2
The power of the power source 9 is supplied through the conductor pattern 7 for feeding the power source of the substrate 2 by the connection with the connector 5a.
【0020】この例では、電源9側の基板2には、電源
送り用の導体パターン7に保護ヒューズ13が、この導
体パターン7から分岐して形成された導体パターン8に
保護ヒューズ12が接続されており、基板2に連結した
基板21には、導体パターン7から分岐して形成された
導体パターン8に保護ヒューズ12が接続されている。
基板2における保護ヒューズ13と保護ヒューズ12と
の選定は、たとえばA−Aで短絡しても、この短絡によ
る導体パターン7の銅箔が溶断するよりも先に保護ヒュ
ーズ13が溶断し、また、点灯駆動回路14の異常の場
合には、保護ヒューズ13の溶断よりも先に保護ヒュー
ズ12が溶断する選定である。この選定は、保護ヒュー
ズ12の溶断よりも先に保護ヒューズ13が溶断する
と、連結した照明器具のすべての発光ダイオードが消灯
する状態を避けるためである。なお、基板21には、保
護ヒューズ13を設けていないが、保護ヒューズ13を
設けるようにしても良い、この場合、全ての照明器具に
保護ヒューズ13を設ける分手間はかかるが、電源側に
設ける照明器具と連結側に設ける照明器具とを区別する
必要はなくなる。
In this example, a protective fuse 13 is connected to a conductor pattern 7 for power supply and a protective fuse 12 is connected to a conductor pattern 8 formed by branching from the conductor pattern 7 on the substrate 2 on the power source 9 side. In the substrate 21 connected to the substrate 2, the protective fuse 12 is connected to the conductor pattern 8 formed by branching from the conductor pattern 7.
The protection fuse 13 and the protection fuse 12 on the substrate 2 are selected such that even if a short circuit occurs, for example, at AA, the protection fuse 13 melts before the copper foil of the conductor pattern 7 melts due to this short circuit. If the lighting drive circuit 14 is abnormal, the protection fuse 12 is blown before the protection fuse 13 is blown. This selection is for avoiding a state in which all the light emitting diodes of the connected lighting equipment are extinguished when the protective fuse 13 is blown before the protective fuse 12 is blown. Although the substrate 21 is not provided with the protective fuse 13, the protective fuse 13 may be provided. In this case, although it takes time to provide the protective fuse 13 in all the lighting fixtures, it is provided on the power supply side. It is not necessary to distinguish between the luminaire and the luminaire provided on the connection side.
【0021】以上の実施の形態では、多数の発光ダイオ
ードDを一直線状に配列しているが、多数の発光ダイオ
ードDの配列は一直線状に配列するものに限らず複数列
やランダムに配列しても良い。また、連結は横一列に限
らず縦列に行なうこともでき、照明を必要とする施設に
応じて適切に対応することができる。さらに、照明器具
を細長く形成しているが、照明器具の形状は任意であっ
て良い。図6〜図8は照明器具を円形状に形成した他の
実施の形態に係る例である。なお、図6〜図7におい
て、図1に示す実施の形態と対応する部分には同一の符
号を付し、また図8において、図4に示す実施の形態と
対応する部分には同一の符号を付し、重複する部分の説
明は省略する。
In the above embodiment, a large number of light emitting diodes D are arranged in a straight line. However, the arrangement of a large number of light emitting diodes D is not limited to one arranged in a straight line and may be arranged in a plurality of columns or randomly. Is also good. Further, the connection can be performed not only in one horizontal line but also in a vertical line, and it is possible to appropriately cope with the facility that requires illumination. Furthermore, although the luminaire is formed to be elongated, the shape of the luminaire may be arbitrary. 6 to 8 are examples of other embodiments in which the lighting fixture is formed in a circular shape. 6 to 7, parts corresponding to those of the embodiment shown in FIG. 1 are designated by the same reference numerals, and, in FIG. 8, parts corresponding to those of the embodiment shown in FIG. Is attached and the description of the overlapping portion is omitted.
【0022】図6〜図7に示す実の形態では、プリント
基板2は平面視円形に形成され、その表面2aに多数の
発光ダイオードDがプリント基板2の中心に対して、互
いに対称となる位置に実装しており、発光ダイオードの
動作時の温度分布が均等になるように配列している。こ
のプリント基板2の裏面には多数の発光ダイオードDを
点灯駆動するための電子部品が放熱効果を考慮してプリ
ント基板2の外周付近に同心円状に実装され(図示な
し)、中央部から口出し線14aが引き出されている。
In the actual embodiment shown in FIGS. 6 to 7, the printed circuit board 2 is formed in a circular shape in plan view, and a large number of light emitting diodes D are arranged on the surface 2a of the printed circuit board 2 symmetrically with respect to the center of the printed circuit board 2. The light emitting diodes are arranged so that the temperature distribution during operation is uniform. On the back surface of the printed circuit board 2, electronic components for driving a large number of light emitting diodes D are mounted concentrically in the vicinity of the outer periphery of the printed circuit board 2 in consideration of the heat radiation effect (not shown). 14a is pulled out.
【0023】筐体1は断面コ字状であって平面視円形を
なし、透明のアクリル樹脂などで一体的に成形され、図
7に示すように多数の発光ダイオードDと対向するコ字
状の底面1aに多数のレンズ15が形成され、外周にフ
ランジ1bが設けられている。多数の発光ダイオードD
や電子部品を実装したプリント基板2がこの筐体1の内
部に収納固定され、柔軟性および熱伝導性の高い透明の
シリコン樹脂を充填して樹脂モールド層3が形成されて
いる。断面コ字状の開口部には工枠16が被せられ、工
枠16はフランジ1bに掛け止めた金具17にねじ込み
固定されている。構築物への取り付けは工枠16を外し
構築物にボルトなどの適宜の固定手段で固定し、筐体1
の開口部側を嵌め込み金具17を締め付けて固定する。
このように基板2を円形にしても、図8に示すように基
板の適宜箇所に樹脂モールド時の気泡を挿通する貫通孔
2cを設けると、より確実な脱気を短時間で行なえる。
また、樹脂の回りが良くなり、基板全体を樹脂モールド
しやすくなる。延いては確実な脱気を行なえることによ
って見栄えの悪化や熱伝導の悪さ(温度上昇などの悪影
響)を低減することができる。
The housing 1 has a U-shaped cross section and a circular shape in a plan view, and is integrally molded with a transparent acrylic resin or the like. As shown in FIG. A large number of lenses 15 are formed on the bottom surface 1a, and a flange 1b is provided on the outer circumference. Many light emitting diodes D
A printed circuit board 2 on which electronic components are mounted is housed and fixed inside the housing 1, and a resin mold layer 3 is formed by filling a transparent silicone resin having high flexibility and thermal conductivity. A work frame 16 is covered on the opening having a U-shaped cross section, and the work frame 16 is screwed and fixed to a metal fitting 17 hooked on the flange 1b. For attachment to the structure, the work frame 16 is removed, and the structure 1 is fixed to the structure with appropriate fixing means such as bolts, and the housing 1
The opening side of is fitted and the metal fitting 17 is tightened and fixed.
Even if the substrate 2 is formed into a circular shape as described above, if a through hole 2c for inserting bubbles during resin molding is provided in an appropriate portion of the substrate as shown in FIG. 8, more reliable deaeration can be performed in a short time.
In addition, the resin is improved around and it becomes easy to mold the entire substrate with resin. As a result, it is possible to reduce deterioration of appearance and poor heat conduction (adverse effects such as temperature rise) by performing reliable degassing.
【0024】なお、発光ダイオードと対向するコ字状の
底面は、透明または反透明であれば良く、底面以外の周
面は透明または反透明でなくても良い。さらに各実施の
形態では、筐体1内に樹脂を充填して樹脂モールド層を
形成しているが、樹脂モールドは別に行なうようにして
も良い。
The U-shaped bottom surface facing the light emitting diode may be transparent or anti-transparent, and the peripheral surface other than the bottom surface may not be transparent or anti-transparent. Furthermore, in each of the embodiments, the resin mold layer is formed by filling the inside of the housing 1 with resin, but resin molding may be performed separately.
【0025】[0025]
【発明の効果】以上詳述したように本発明によれば、防
水、防塵に優れ屋外に設置しても故障の発生が少なく、
かつ照明器具として寿命の長い発光ダイオードを用いた
照明器具を得ることができる。
As described in detail above, according to the present invention, it is excellent in waterproofing and dustproof and is less likely to malfunction even when installed outdoors.
In addition, it is possible to obtain a lighting fixture using a light emitting diode having a long life as the lighting fixture.
【図面の簡単な説明】[Brief description of drawings]
【図1】本発明の実施の形態に係る発光ダイオードを用
いた照明器具の概略構造を示すもので、(a)は平面
図、(b)は横断面図、(c)は縦断面図である。
FIG. 1 shows a schematic structure of a lighting fixture using a light emitting diode according to an embodiment of the present invention, (a) is a plan view, (b) is a cross-sectional view, and (c) is a vertical cross-sectional view. is there.
【図2】図1の発光ダイオードを用いた照明器具の連結
状態を示す回路図である。
FIG. 2 is a circuit diagram showing a connected state of a lighting fixture using the light emitting diode of FIG.
【図3】図1の発光ダイオードを用いた照明器具の取り
付け状態を示す縦断面図である。
FIG. 3 is a vertical sectional view showing a mounting state of a lighting fixture using the light emitting diode of FIG.
【図4】本発明の実施の形態に係る発光ダイオードを用
いた照明器具の他の例の平面図である。
FIG. 4 is a plan view of another example of the lighting fixture using the light emitting diode according to the embodiment of the present invention.
【図5】本発明の実施の形態に係る発光ダイオードを用
いた照明器具の他の例の横断面図である。
FIG. 5 is a cross-sectional view of another example of the lighting fixture using the light emitting diode according to the embodiment of the invention.
【図6】本発明の他の実施の形態に係る発光ダイオード
を用いた照明器具の基板の平面図である。
FIG. 6 is a plan view of a substrate of a lighting fixture using a light emitting diode according to another embodiment of the present invention.
【図7】図6の基板を備える発光ダイオードを用いた照
明器具の断面図である。
7 is a cross-sectional view of a lighting fixture using a light emitting diode including the substrate of FIG.
【図8】本発明の実施の形態に係る発光ダイオードを用
いた照明器具の他の例の平面図である。
FIG. 8 is a plan view of another example of the lighting fixture using the light emitting diode according to the embodiment of the invention.
【符号の説明】[Explanation of symbols]
1 筐体 2、21 基板(プリント基板) 2a 表面 2b 裏面 2c 貫通孔 2d 切欠き 3 樹脂モールド層 4a、4b 口出し線 5a、5b 防水コネクタ 6 空隙部 7 電源送り用の導体パターン 8 分岐導体パターン 9 電源 10、16 工枠 12、13 保護ヒューズ 14 点灯駆動回路 15 レンズ D 発光ダイオード E 電子部品 1 case 2,21 circuit board (printed circuit board) 2a surface 2b back side 2c through hole 2d cutout 3 Resin mold layer 4a, 4b Lead wire 5a, 5b Waterproof connector 6 void 7 Conductor pattern for power supply 8 branch conductor pattern 9 power supplies 10, 16 work frame 12, 13 Protection fuse 14 Lighting drive circuit 15 lenses D light emitting diode E electronic parts
フロントページの続き (72)発明者 土井 勝之 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内 (72)発明者 岩崎 元治 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内 (72)発明者 藤本 浩喜 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内 Fターム(参考) 3K014 AA01 DA05 LA01 LB04 5F041 AA43 DA13 DA20 DA43 DA57 DA83 DB07 DB08 DC07 DC23 DC83 DC84 FF11 Continued front page    (72) Inventor Katsuyuki Doi             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. (72) Inventor Motoharu Iwasaki             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. (72) Inventor Hiroki Fujimoto             Meiji Na 3-9-14 Shintaka, Yodogawa-ku, Osaka-shi             Within Sonal Industry Co., Ltd. F term (reference) 3K014 AA01 DA05 LA01 LB04                 5F041 AA43 DA13 DA20 DA43 DA57                       DA83 DB07 DB08 DC07 DC23                       DC83 DC84 FF11

Claims (7)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 表面に多数の発光ダイオードを配列実装
    し、裏面に前記多数の発光ダイオードを点灯駆動回路を
    構成する電子部品を実装してなる基板の表裏全面を樹脂
    モールドしてなることを特徴とする発光ダイオードを用
    いた照明器具。
    1. A substrate comprising a large number of light emitting diodes arranged and mounted on a front surface thereof, and a plurality of the light emitting diodes mounted on a rear surface of which electronic components constituting a lighting drive circuit are mounted, which are molded by resin. Lighting equipment using a light emitting diode.
  2. 【請求項2】 表面に多数の発光ダイオードを配列実装
    し、裏面に前記多数の発光ダイオードを点灯駆動回路を
    構成する電子部品を実装してなる基板を筐体に収納し、
    前記筐体内に柔軟性および熱伝導性の高い透明樹脂を充
    填して前記多数の発光ダイオードおよび前記電子部品を
    樹脂モールドしてなることを特徴とする発光ダイオード
    を用いた照明器具。
    2. A substrate, in which a large number of light emitting diodes are arranged and mounted on a front surface, and electronic components constituting a lighting drive circuit are mounted on the rear surface, are housed in a housing,
    A lighting fixture using a light-emitting diode, characterized in that the housing is filled with a transparent resin having high flexibility and high thermal conductivity, and the large number of light-emitting diodes and the electronic parts are resin-molded.
  3. 【請求項3】 前記基板に樹脂モールド時の気泡を挿通
    する貫通孔を設けてなることを特徴とする請求項1又は
    請求項2記載の発光ダイオードを用いた照明器具。
    3. A lighting fixture using a light emitting diode according to claim 1 or 2, wherein the substrate is provided with a through hole for inserting bubbles during resin molding.
  4. 【請求項4】 前記基板の表面を着色してなることを特
    徴とする請求項1又は請求項2記載の発光ダイオードを
    用いた照明器具。
    4. The lighting fixture using a light emitting diode according to claim 1, wherein the surface of the substrate is colored.
  5. 【請求項5】 前記基板には、その一端から他端に伸び
    る電源用の導体パターンと前記導体パターンから分岐
    し、前記基板の電子部品に接続する電源用の導体パター
    ンが形成されてなることを特徴とする請求項1又は請求
    項2記載の発光ダイオードを用いた照明器具。
    5. The substrate is provided with a conductor pattern for power supply extending from one end to the other end and a conductor pattern for power supply branched from the conductor pattern and connected to an electronic component of the substrate. A lighting fixture using the light emitting diode according to claim 1 or 2.
  6. 【請求項6】 前記一端から他端に伸びる電源用の導体
    パターンから分岐した前記基板の電子部品に接続する電
    源用の導体パターンに保護ヒューズを設けてなることを
    特徴とする請求項5記載の発光ダイオードを用いた照明
    器具。
    6. A protective fuse is provided on a conductor pattern for power supply which is branched from a conductor pattern for power supply extending from the one end to the other end and is connected to an electronic component of the substrate. Lighting equipment using light emitting diodes.
  7. 【請求項7】 前記一端から他端に伸びる電力供給用の
    導体パターンに連結用コネクタを接続してなることを特
    徴とする請求項5又は請求項6記載の発光ダイオードを
    用いた照明器具。
    7. The lighting fixture using a light emitting diode according to claim 5, wherein a connecting connector is connected to a conductor pattern for power supply extending from the one end to the other end.
JP2002107257A 2002-04-10 2002-04-10 Illumination apparatus using light emitting diode Pending JP2003303504A (en)

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