JP2003303504A - Illumination apparatus using light emitting diode - Google Patents

Illumination apparatus using light emitting diode

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Publication number
JP2003303504A
JP2003303504A JP2002107257A JP2002107257A JP2003303504A JP 2003303504 A JP2003303504 A JP 2003303504A JP 2002107257 A JP2002107257 A JP 2002107257A JP 2002107257 A JP2002107257 A JP 2002107257A JP 2003303504 A JP2003303504 A JP 2003303504A
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light emitting
emitting diode
substrate
conductor pattern
surface
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JP2002107257A
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Japanese (ja)
Inventor
Katsuyuki Doi
Hiroki Fujimoto
Motoharu Iwasaki
Akihiro Naka
Ryutaro Omae
明弘 中
勝之 土井
龍太郎 大前
元治 岩崎
浩喜 藤本
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Meiji Natl Ind Co Ltd
明治ナショナル工業株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide an illumination apparatus using a light emitting diode which provides excellent waterproof and dust-proof performance and low failure rate even if installed outdoors, is free from brightness degrading of light emitting diode due to such as invaded dust, and is capable of reducing failures caused by inadequate connection work.
SOLUTION: A conductor pattern 7 for power transmission is formed on a surface 2a of a printed board 2 and a plurality of light emitting diodes D are arrayed and mounted on the surface as well. Electronic devices connected to a conductor pattern branched from the conductor pattern 7, for driving the light emitting diodes D are mounted on the back surface. The printed board 2 mounting these devices is housed and fixed in a housing 1 having a transparent surface opposing to the light emitting diodes D. The inside of the housing 1 is filled with transparent resin having high flexibility and thermal conductivity to resin-mold 3 the entire of the plurality of light emitting diodes D and the electronic devices to form the illumination apparatus with lead wires 4a, 4b connected to the conductor pattern 7.
COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】 【0001】 【発明の属する技術分野】本発明は、発光ダイオードを用いた照明器具に関するものである。 BACKGROUND OF THE INVENTION [0001] [Technical Field of the Invention The present invention relates to an illumination fixture using a light emitting diode. 【0002】 【従来の技術】例えば階段やその手摺りあるいは歩道橋の欄干などに照明器具を設置し、それらの存在位置を表示したり足元などを照明することが行われている。 [0002] such as installing the lighting fixture of the Prior Art For example stairs or railing of the handrail or footbridge, be illuminated and feet to view their existing position have been made. このような照明器具として、たとえば昼光色に近い色の光を発光する発光ダイオードを照明用の光源として用いることが開発されている。 Such luminaires, be used as a light source for illuminating a light emitting diode for example which emit colors of light close to daylight color have been developed. このような発光ダイオードを用いた照明器具は、一般に導体回路を形成した基板いわゆるプリント基板の一方の面(以下表面という)に多数の発光ダイオードを配列実装し、他方の面(以下裏面という)にそれらの発光ダイオードを発光させるための点灯駆動回路を構成する電子部品が実装され、これらを実装したプリント基板を、プリント基板の表面(発光ダイオードを実装している側の面)と対向する面を光透過性とした適宜の函体内に収納して構成されている。 Illumination fixture using such a light-emitting diode is generally a large number of light-emitting diodes are arranged mounted on one surface of the substrate so printed substrate formed with the conductor circuit (hereinafter referred to as surface), on the other surface (hereinafter referred to as rear surface) are electronic components constituting the lighting drive circuit for emitting their light emitting diodes mounted, the printed board mounted with these, facing the surface of the printed circuit board (the surface that implement light emitting diode) plane is constructed by housing the appropriate box making body was a light transmitting property. 【0003】 【発明が解決しようとする課題】このように構成された発光ダイオードを用いた照明器具は、特に風雨や塵埃に晒される屋外に設置すると故障が発生しやすく、また照明器具として寿命が短かく、さらにその塵埃などの汚れによる発光ダイオードの輝度低下により所望の輝度が得られなくなるという問題がある。 [0003] [Problem that the Invention is to Solve lighting fixture using the thus configured light emitting diode, in particular a failure is likely to occur installed outdoors exposed to rain and wind and dust, also life as luminaire short, there is a problem that a desired luminance can not be obtained by further reduction in luminance of the light emitting diode due to contamination such as the dust. また、設置される照明器具は、単独での設置は少なく連結による設置が多い。 Also, lighting equipment to be installed, installation alone less installable connection often.
この場合、連結する照明器具に供給する電線を照明器具内または器具外側にて引きまわすことが考えられるが、 In this case, it is conceivable to turn pulling in luminaires within or instrument outside the wire is fed into an illumination device for connecting,
その配線工事が行ないにくく、電源線の短絡や地絡などの施工不良を発生しやすく、他の機器に悪影響を及ぼし易いという問題がある。 The wiring work is hardly done, the construction defects likely to occur, such as a short circuit or ground fault of the power supply line, there is a problem that tends to have an adverse effect on other equipment. 【0004】本発明は、このような問題を解消すべくなされたもので、防水、防塵に優れ、屋外に設置しても故障の発生が少なく、塵埃等の侵入による発光ダイオードの輝度の低下がなく、また、連結による施工不良などによる故障の発生を低減することのできる発光ダイオードを用いた照明器具を提供することを目的とする。 [0004] The present invention has to have been made to solve such a problem, waterproof, excellent dustproof, less occurrence of a failure even when installed outdoors, the reduction in the brightness of the light emitting diode by invasion of dust or the like without also an object to provide a lighting fixture using a light emitting diode capable of reducing the occurrence of a failure due to poor construction by ligation. 【0005】 【課題を解決するための手段】請求項1に係る本発明は、表面に多数の発光ダイオードを配列実装し、裏面に前記多数の発光ダイオードを点灯駆動する電子部品を実装してなる基板の表裏全面を樹脂モールドしてなることを特徴とする。 [0005] Means for Solving the Problems] According to claim 1 the present invention, a plurality of light emitting diodes are arranged mounted on the surface, formed by mounting electronic components for lighting and driving the plurality of light emitting diodes on the back the front and back surface of the substrate, characterized by comprising a resin molding. 【0006】請求項2に係る本発明は、表面に多数の発光ダイオードを配列実装し、裏面に前記多数の発光ダイオードを点灯駆動する電子部品を実装してなる基板を筐体に収納し、前記筐体内に柔軟性および熱伝導性の高い透明樹脂を充填して前記多数の発光ダイオードおよび前記電子部品を樹脂モールドしてなることを特徴とする。 [0006] The present invention according to claim 2, a plurality of light emitting diodes are arranged mounted on a surface, and accommodating a substrate formed by mounting electronic components for lighting and driving the plurality of light emitting diodes on the back surface in the housing, wherein filled with flexibility and a high thermal conductivity transparent resin in a housing of the plurality of light emitting diodes and the electronic component is characterized by being resin-molded. 【0007】請求項3に係る本発明は、請求項1又は請求項2に係る本発明における前記基板に樹脂モールド時の気泡を挿通する貫通孔を設けてなることを特徴とし、 [0007] The present invention according to claim 3, characterized by comprising a through hole for inserting the air bubble at the time of resin molding on the substrate in the present invention according to claim 1 or claim 2,
請求項4に係る本発明は、前記基板の表面を着色してなることを特徴とする。 The present invention according to claim 4 characterized by being obtained by coloring the surface of the substrate. 【0008】また、請求項5に係る本発明は、請求項1 Further, the present invention according to claim 5, claim 1
又は請求項2記載の本発明における前記基板には、その一端から他端に伸びる電源用の導体パターンと前記導体パターンから分岐し、前記基板の電子部品に接続する電源用の導体パターンが形成されてなることを特徴とし、 Or, the substrate in the present invention of claim 2, wherein, branched off from the conductor pattern and the conductor pattern of the power supply extending to the other from one end, the conductor pattern for power supply connected to the electronic component of the substrate is formed and characterized in that it comprises Te,
請求項6に係る本発明は、請求項5に係る本発明における前記一端から他端に伸びる電源用の導体パターンから分岐した前記基板の電子部品に接続する電源用の導体パターンに保護ヒューズを設けてなることを特徴とし、請求項7に係る本発明は、前記一端から他端に伸びる電力供給用の導体パターンに連結用コネクタを接続してなることを特徴とする。 The present invention according to claim 6, provided with a protective fuse to the conductor pattern of the power supply to be connected to the electronic part of the substrate that has branched from the conductor pattern of the power supply extending to the other from the one end in the present invention according to claim 5 characterized by comprising Te, the present invention according to claim 7, characterized by comprising connecting the coupling connector to the conductor pattern of the power supply extending to the other end from the one end. 【0009】本発明では、表面に多数の発光ダイオードを配列実装し、裏面に前記多数の発光ダイオードを駆動する電子部品を実装してなる基板の全体を樹脂モールドするので、水や塵埃による故障の発生や輝度の低下を低減することができる。 [0009] In the present invention, a plurality of light emitting diodes are arranged mounted on a surface, the entire substrate formed by mounting electronic components for driving the plurality of light emitting diodes on the back because the resin mold, the failure due to water and dust it is possible to reduce the decrease in the occurrence and intensity. また、モールドする樹脂を柔軟性および熱伝導性の高い透明樹脂にすることで、基板に実装した発光ダイオードや電子部品に機械的なストレスを与えず熱伝導が良くなり、電子部品及び発光ダイオードの温度を低減でき照明器具としての寿命を長くすることができる。 Further, the mold to resin by the flexibility and high thermal conductivity transparent resin, the thermal conductivity without causing mechanical stresses to the light-emitting diode and electronic components mounted on the substrate is improved, the electronic component and the light emitting diode life of the luminaire can reduce the temperature can be increased. この場合、基板に気泡を挿通する貫通孔を設けると、モールド時の真空脱気に加えより完全にかつ短時間に脱気することができる。 In this case, when providing a through hole for inserting the air bubble to the substrate, it is possible to degas completely in a short time from the addition to the vacuum degassing at the time of molding. 【0010】さらに、発光ダイオードの色と基板表面の色とを組み合わせることによって、反射率や演出効果を高めたりすることができ、さらにまた基板に一端から他端に伸びる電源用の導体パターンを形成すると、連結する場合の電源線の配線施工も容易になり、電源短絡や地絡の故障を低減することができ、またその電源用の導体パターンから分岐したその基板の電子部品に接続する電源用の導体パターンに保護ヒューズを設けると、その基板の駆動回路に短絡故障が発生しても連結した照明器具の電源を確保することが可能となる。 Furthermore, formed by combining the color of the substrate surface of the light-emitting diodes, can and increasing the reflectance and produce effects, furthermore conductive pattern for power supply extending from one end to the other end to the substrate then, even the wiring construction of the power supply lines when connecting easier, it is possible to reduce the failure of the power supply short circuit or ground fault, also for power supply connected to the electronic components of the substrate branching from the conductive pattern for its power supply When the conductor pattern to provide a protective fuse, it is possible to ensure the power supply of the luminaire short circuit fault are linked be generated in the driving circuit of the substrate. 【0011】 【発明の実施の形態】以下、本発明の実施の形態について図を参照して説明する。 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, will be explained with reference to the drawings embodiments of the present invention. 図1は本発明の一実施の形態に係る発光ダイオードを用いた照明器具の概略構造を示すもので、(a)は平面図、(b)は横断面図、(c) Figure 1 shows a schematic structure of an illumination fixture using a light emitting diode according to an embodiment of the present invention, (a) is a plan view, (b) is a cross-sectional view, (c)
は縦断面図、図2は図1の発光ダイオードを用いた照明器具の連結状態を示す回路図、図3は同発光ダイオードを用いた照明器具の取り付け状態を示す縦断面図である。 Is a longitudinal sectional view, FIG. 2 is a circuit diagram showing a connection state of an illumination fixture using a light emitting diode of FIG. 1, FIG. 3 is a longitudinal sectional view showing a mounting state of the illumination fixture using the same light-emitting diode. 【0012】図1において、1は縦断面コ字状の底面1 [0012] In FIG. 1, 1 is the bottom of the vertical section U-shaped 1
aが透明のアクリル樹脂などからなる筐体、2は導体回路を形成した平面視細長い長方形をなす基板(プリント基板)、3は柔軟性および熱伝導性の高い透明なシリコン樹脂などからなる樹脂モールド層、4aは電源入力側の口出し線、4bは電源送り側の口出し線、5a,5b Housing a is made of transparent acrylic resin, the substrate (printed circuit board) forming a planar view elongated rectangular forming the conductor circuit 2, 3 made of flexible and having high thermal conductivity transparent silicone resin resin mold layers, 4a is the power input side of the lead wire, 4b power feeding side of the lead wire, 5a, 5b
は防水コネクタ、6は空隙部、7は導体パターン、Dは発光ダイオード、Eは発光ダイオードDを点灯駆動するための点灯駆動回路を構成する半導体装置、抵抗体、コンデンサなどの電子部品である。 The waterproof connector, 6 gap portion, 7 denotes a semiconductor device, the resistor conductor pattern, D is a light emitting diode, E is constituting the lighting drive circuit for driving and lighting the light emitting diode D, which is an electronic component such as a capacitor. 【0013】プリント基板2の表面2aには、中央部に長手方向に沿って一列に多数の発光ダイオードDが実装され、両側の端部に一端から他端に伸びる電源送り用の導体パターン7が形成されている(なお、この導体パターン7は基板2の裏面2bに形成してもよい。)。 [0013] surface 2a of the printed circuit board 2 includes a plurality of light-emitting diode D in a row along the longitudinal direction are mounted on the central portion, the conductor pattern 7 for power feed extending from one end to the opposite ends it is formed (Note that the conductor pattern 7 may be formed on the back surface 2b of the substrate 2.). プリント基板2の裏面2bには、表面2aに配列された多数の発光ダイオードDを点灯駆動するための点灯駆動回路を構成するダイオード、抵抗体、コンデンサなどの電子部品Eが実装され、電子部品Eは電源送り用の導体パターン7から分岐して形成された導体パターン8(図2参照)に適宜接続されている。 On the rear surface 2b of the printed circuit board 2, diodes constituting a lighting drive circuit for driving and lighting the plurality of light emitting diodes D which are arranged on the surface 2a, resistors, electronic components E such as a capacitor are mounted, the electronic components E It is appropriately connected to the conductive pattern 8, which is formed by branching from the conductive pattern 7 for power feeding (see Fig. 2) is. 口出し線4aは導体パターン7の一方の端部に、口出し線4bは導体パターン7の他方の端部に接続され、口出し線4a、4bは樹脂モールド層3から引き出されている。 At one end of the lead wire 4a conductor pattern 7, the output wire 4b is connected to the other end of the conductor pattern 7, the output wires 4a, 4b are led out from the resin mold layer 3. 【0014】樹脂モールド層の形成は、概略、以上のように発光ダイオードDおよび電子部品Eを実装して構成された基板2を、発光ダイオードDを実装した表面を筐体1の底面1aに対向させて筐体1内に挿入して適宜の手段によって筐体1に固定する。 [0014] Formation of the resin mold layer is opposed schematically, the light emitting diode D and the electronic component E substrate 2 composed implements as described above, the surface mounting the light emitting diode D on the bottom surface 1a of the housing 1 It is not fixed to the housing 1 by suitable means and inserted into the housing 1. そして、真空槽内で柔軟性および熱伝導性の高い透明のシリコン樹脂液を筐体1内に、多数の発光ダイオードDおよび電子部品Eを充分に覆う位置まで充填し、そのあとシリコン樹脂を硬化することにより形成される。 The flexibility and high heat conductivity transparent silicon resin solution in a vacuum chamber in the housing 1, was charged to a position sufficiently cover the plurality of light-emitting diodes D and the electronic component E, cured after which a silicone resin It is formed by. 【0015】この樹脂充填の際、気泡が発生する。 [0015] During this resin filling, bubbles are generated. この気泡は真空引きによって樹脂内から取り除かれる、すなわち脱気されるが、図4に示すように基板2の適宜位置に気泡を挿通する貫通孔2cや切欠き2dを形成しておくと、より確実な脱気を短時間で行なえる。 The bubbles are removed from the resin by vacuum, i.e. is degassed, the previously formed a through hole 2c and the notch 2d for inserting the bubbles at an appropriate position of the substrate 2 as shown in FIG. 4, and more perform a reliable degassing in a short period of time. また、樹脂の回りが良くなり、基板全体を樹脂モールドしやすくなる。 Also, better around the resin becomes the entire substrate easily molded with resin. 延いては確実な脱気を行なえることによって見栄えの悪化や熱伝導の悪さ(温度上昇などの悪影響)を低減することができる。 In its turn, it is possible to reduce the deterioration and poor thermal conductivity of appearance (adverse effects such as temperature rise) by perform a reliable degassing. なお、図4において、図1に示す部分に対応する箇所には同一の符号を付している。 In FIG. 4, the same reference numerals are the portion corresponding to the portion shown in FIG. 【0016】なお、図5に示すように、筐体1のコ字状の底面1a、すなわち発光ダイオードDの光出射面に多数のレンズ15を形成すると、発光ダイオードから放射した光はレンズで適宜に集光され、効率良く外部に照射することができる。 [0016] Incidentally, as shown in FIG. 5, a U-shaped bottom surface 1a of the housing 1, that is, to form a number of lenses 15 on the light emitting surface of the light-emitting diode D, light emitted from the light emitting diode is appropriately lens is focused on, it can be efficiently radiated to the outside. 【0017】また、発光ダイオードDを配列実装した基板2の表面2aを、たとえば白色光の発光ダイオードD Further, the light emitting diode D of the surface 2a of the substrate 2 which are arranged mounting the light-emitting diode D, for example, white light
を配列した場合に、白色に着色すると反射率を高め、輝度の低下を補うことができ、また、赤色光や橙色光の発光に発光ダイオードDを配列した場合に、基板2の表面2aの色を黒色に着色すると演出効果の高い照明器具を得ることができる。 When arranged to increase the reflectivity to colored white, can compensate for a decrease of luminance, also when an array of light-emitting diode D to the emission of red light or orange light, the color of the surface 2a of the substrate 2 it is possible to obtain a high luminaires rendering effect and be colored black. なお、基板2の表面2aに着色する色と発光ダイオードの発光色は適宜に選択すればよい。 The emission color of the color light-emitting diodes for coloring on the surface 2a of the substrate 2 may be selected as appropriate. 【0018】以上のように構成された照明器具は、図3 The above constructed luminaire as is Figure 3
に示すように縦断面コ字状のアルミニウムなどの不燃性材で形成された工枠10が、筐体1のコ字状の開口部に被せられる。 It is factory frame 10 formed by the nonflammable material, such as vertical section a U-shaped aluminum as shown in, is put in a U-shaped opening of the housing 1. 構築物11への取り付けは、工枠10を構築物11にボルトなどの適宜の固定手段によって取付け固定し、固定した工枠10に照明器具の開口部側を嵌め込むことにより行われる。 Attachment to construct 11 mounted and fixed by suitable fixing means such as bolts and Engineering frame 10 to construct 11 is performed by fitting the opening side of the luminaire fixed factory frame 10. 【0019】この取り付けに際し、通常、複数の照明器具が連結される。 [0019] Upon this attachment, usually a plurality of lighting fixtures are connected. 図2はこの連結した状態の一例を示すもので、図2において、2および21は図1に示す照明器具と同様に構成された照明器具の基板、9は交流または直流の電源、12,13は保護ヒューズ、14は点灯駆動回路である。 Figure 2 shows one example of a state in which this connection, in FIG. 2, the substrate 2 and 21 similarly configured lighting fixtures and lighting fixture shown in Figure 1, the AC or DC power source 9, 12, 13 the protection fuse, 14 is a lamp drive circuit. なお、図1に示す照明器具と同一部分には同一の符号を付している。 Note that the same reference numerals are given to the same parts as the luminaire shown in FIG. 基板2は電源側のコネクタと基板2のコネクタ5aとの接続により電源9の電力が供給され、基板21は基板2のコネクタ5bと基板2 Substrate 2 is power of the power supply 9 is supplied by connection to a power supply side connector and the board 2 the connector 5a, the substrate 21 of the substrate 2 connector 5b and the substrate 2
1のコネクタ5aとの接続により基板2の電源送り用の導体パターン7を介して電源9の電力が供給される。 Power supply 9 via a conductor pattern 7 for power supply feeding of the substrate 2 by the connection between the first connector 5a is supplied. 【0020】この例では、電源9側の基板2には、電源送り用の導体パターン7に保護ヒューズ13が、この導体パターン7から分岐して形成された導体パターン8に保護ヒューズ12が接続されており、基板2に連結した基板21には、導体パターン7から分岐して形成された導体パターン8に保護ヒューズ12が接続されている。 [0020] In this example, the substrate 2 of the power source 9 side, fuse protection 13 to the conductor pattern 7 for power feed, the protective fuse 12 is connected to the conductor pattern 8 formed by branching from the conductive pattern 7 and, on the substrate 21 which is connected to the substrate 2, a protective fuse 12 is connected to the conductor pattern 8 formed by branching from the conductive pattern 7.
基板2における保護ヒューズ13と保護ヒューズ12との選定は、たとえばA−Aで短絡しても、この短絡による導体パターン7の銅箔が溶断するよりも先に保護ヒューズ13が溶断し、また、点灯駆動回路14の異常の場合には、保護ヒューズ13の溶断よりも先に保護ヒューズ12が溶断する選定である。 Selection of a protective fuse 13 in the substrate 2 and the protective fuse 12, for example also by short-circuit A-A, the protection previously fuse 13 is blown than copper foil conductor pattern 7 is blown by the short-circuit, also, in the case of the lighting drive circuit 14 abnormalities, protective fuse 12 before the blowing of the protection fuse 13 is selected to be blown. この選定は、保護ヒューズ12の溶断よりも先に保護ヒューズ13が溶断すると、連結した照明器具のすべての発光ダイオードが消灯する状態を避けるためである。 This selection is the protection previously fuse 13 than blown protection fuse 12 is blown, in order to avoid a state where all the light emitting diodes of connected luminaire is turned off. なお、基板21には、保護ヒューズ13を設けていないが、保護ヒューズ13を設けるようにしても良い、この場合、全ての照明器具に保護ヒューズ13を設ける分手間はかかるが、電源側に設ける照明器具と連結側に設ける照明器具とを区別する必要はなくなる。 Note that the substrate 21, is not provided with a protective fuse 13 may be provided with protective fuses 13, in this case, minute effort to all luminaires provide a protective fuse 13 such but, providing the power supply side necessary to distinguish between lighting fixture provided on the side connected with the luminaire will not. 【0021】以上の実施の形態では、多数の発光ダイオードDを一直線状に配列しているが、多数の発光ダイオードDの配列は一直線状に配列するものに限らず複数列やランダムに配列しても良い。 [0021] In the above embodiment has been arranged a number of light-emitting diode D in a straight line, a number of light-emitting array of diodes D are arranged in a plurality of rows and random not limited to be arranged in a straight line it may be. また、連結は横一列に限らず縦列に行なうこともでき、照明を必要とする施設に応じて適切に対応することができる。 The coupling can also be carried out in tandem not only in a row, it is possible to appropriately respond in accordance with the facilities that require illumination. さらに、照明器具を細長く形成しているが、照明器具の形状は任意であって良い。 Furthermore, although elongated form luminaire, the shape of the luminaire may be arbitrary. 図6〜図8は照明器具を円形状に形成した他の実施の形態に係る例である。 6 to 8 are examples according to another embodiment of the formation of the luminaire in a circular shape. なお、図6〜図7において、図1に示す実施の形態と対応する部分には同一の符号を付し、また図8において、図4に示す実施の形態と対応する部分には同一の符号を付し、重複する部分の説明は省略する。 Note that in FIGS. 6 and 7, the same reference numerals subjected, also FIG. 8 the parts corresponding to the embodiment shown in FIG. 1, the parts corresponding to the embodiment shown in FIG. 4 the same reference numerals subjected, description of the same portions will be omitted. 【0022】図6〜図7に示す実の形態では、プリント基板2は平面視円形に形成され、その表面2aに多数の発光ダイオードDがプリント基板2の中心に対して、互いに対称となる位置に実装しており、発光ダイオードの動作時の温度分布が均等になるように配列している。 [0022] In actual embodiment shown in FIGS. 6 and 7, the printed circuit board 2 is formed in a circular shape in plan view, for a number of light-emitting diode D is the center of the printed circuit board 2 on the surface 2a, a symmetrical position implements, the temperature distribution during operation of the light emitting diodes are arranged so as to be equal. このプリント基板2の裏面には多数の発光ダイオードDを点灯駆動するための電子部品が放熱効果を考慮してプリント基板2の外周付近に同心円状に実装され(図示なし)、中央部から口出し線14aが引き出されている。 The print on the back surface of the substrate 2 a number of light emitting diodes electronic components for driving and lighting the D is mounted concentrically around the outer periphery of the printed circuit board 2 in consideration of the heat radiation effect (not shown), the output wire from the central portion 14a is pulled out. 【0023】筐体1は断面コ字状であって平面視円形をなし、透明のアクリル樹脂などで一体的に成形され、図7に示すように多数の発光ダイオードDと対向するコ字状の底面1aに多数のレンズ15が形成され、外周にフランジ1bが設けられている。 The housing 1 forms a circular shape in plan view a U-shaped cross section, integrally molded such as a transparent acrylic resin, a number of 7 light-emitting diode D facing the U-shaped number of lenses 15 are formed on the bottom surface 1a, flange 1b is provided on the outer periphery. 多数の発光ダイオードD Plurality of light-emitting diode D
や電子部品を実装したプリント基板2がこの筐体1の内部に収納固定され、柔軟性および熱伝導性の高い透明のシリコン樹脂を充填して樹脂モールド層3が形成されている。 And electronic printed circuit board 2 parts was mounted is housed fixed to the inside of the casing 1, by filling a flexibility and a high thermal conductivity transparent silicone resin is a resin mold layer 3 is formed. 断面コ字状の開口部には工枠16が被せられ、工枠16はフランジ1bに掛け止めた金具17にねじ込み固定されている。 The opening of the U-shaped cross section Kowaku 16 is put, Engineering frame 16 is screwed to stop the metal piece 17 applied to the flange 1b. 構築物への取り付けは工枠16を外し構築物にボルトなどの適宜の固定手段で固定し、筐体1 Attachment to construct fixed with suitable fixing means such as bolts to construct Remove Kowaku 16, the housing 1
の開口部側を嵌め込み金具17を締め付けて固定する。 And fastening and fixing the opening fitted to the side bracket 17 of the.
このように基板2を円形にしても、図8に示すように基板の適宜箇所に樹脂モールド時の気泡を挿通する貫通孔2cを設けると、より確実な脱気を短時間で行なえる。 In this way, the substrate 2 is circular and provided with a through hole 2c for inserting a bubble at the time of resin molding the appropriate position of the substrate shown in FIG. 8, performed in a short time more reliable degassing.
また、樹脂の回りが良くなり、基板全体を樹脂モールドしやすくなる。 Also, better around the resin becomes the entire substrate easily molded with resin. 延いては確実な脱気を行なえることによって見栄えの悪化や熱伝導の悪さ(温度上昇などの悪影響)を低減することができる。 In its turn, it is possible to reduce the deterioration and poor thermal conductivity of appearance (adverse effects such as temperature rise) by perform a reliable degassing. 【0024】なお、発光ダイオードと対向するコ字状の底面は、透明または反透明であれば良く、底面以外の周面は透明または反透明でなくても良い。 [0024] Incidentally, a U-shaped bottom of the light emitting diode facing may be transparent or anti-transparent peripheral surface other than the bottom surface may not be transparent or anti-transparent. さらに各実施の形態では、筐体1内に樹脂を充填して樹脂モールド層を形成しているが、樹脂モールドは別に行なうようにしても良い。 In yet each embodiment, by filling the resin in the casing 1 to form a resin mold layer, but the resin molding may be performed separately. 【0025】 【発明の効果】以上詳述したように本発明によれば、防水、防塵に優れ屋外に設置しても故障の発生が少なく、 According to the present invention as described in detail above, waterproof, less occurrence of a failure be installed in excellent outdoor dustproof,
かつ照明器具として寿命の長い発光ダイオードを用いた照明器具を得ることができる。 It is possible to obtain a lighting fixture using the long light emitting diode lifetime as luminaires.

【図面の簡単な説明】 【図1】本発明の実施の形態に係る発光ダイオードを用いた照明器具の概略構造を示すもので、(a)は平面図、(b)は横断面図、(c)は縦断面図である。 BRIEF DESCRIPTION OF THE DRAWINGS [Figure 1] shows the schematic structure of an illumination fixture using a light emitting diode according to an embodiment of the present invention, (a) is a plan view, (b) is a cross-sectional view, ( c) it is a longitudinal sectional view. 【図2】図1の発光ダイオードを用いた照明器具の連結状態を示す回路図である。 2 is a circuit diagram showing a connection state of an illumination fixture using a light emitting diode of FIG. 【図3】図1の発光ダイオードを用いた照明器具の取り付け状態を示す縦断面図である。 3 is a longitudinal sectional view showing a mounting state of an illumination fixture using a light emitting diode of FIG. 【図4】本発明の実施の形態に係る発光ダイオードを用いた照明器具の他の例の平面図である。 It is a plan view of another example of the illumination fixture using a light emitting diode according to an embodiment of the present invention; FIG. 【図5】本発明の実施の形態に係る発光ダイオードを用いた照明器具の他の例の横断面図である。 5 is a cross-sectional view of another example of the illumination fixture using a light emitting diode according to an embodiment of the present invention. 【図6】本発明の他の実施の形態に係る発光ダイオードを用いた照明器具の基板の平面図である。 6 is a plan view of a substrate of a lighting fixture using a light emitting diode according to another embodiment of the present invention. 【図7】図6の基板を備える発光ダイオードを用いた照明器具の断面図である。 7 is a cross-sectional view of lighting equipment using the light-emitting diode comprising a substrate of FIG. 【図8】本発明の実施の形態に係る発光ダイオードを用いた照明器具の他の例の平面図である。 8 is another example plan view of a lighting fixture using a light emitting diode according to the embodiment of the present invention. 【符号の説明】 1 筐体2、21 基板(プリント基板) 2a 表面2b 裏面2c 貫通孔2d 切欠き3 樹脂モールド層4a、4b 口出し線5a、5b 防水コネクタ6 空隙部7 電源送り用の導体パターン8 分岐導体パターン9 電源10、16 工枠12、13 保護ヒューズ14 点灯駆動回路15 レンズD 発光ダイオードE 電子部品 [EXPLANATION OF SYMBOLS] 1 housing 2, 21 substrate (printed circuit board) 2a surface 2b rear surface 2c through hole 2d notch 3 resin mold layer 4a, 4b output wires 5a, the conductor pattern for 5b waterproof connector 6 air gap 7 Power feed 8 branch conductive pattern 9 supply 10, 16 Industrial frame 12 protection fuse 14 lamp drive circuit 15 lens D-emitting diodes E electronic component

フロントページの続き (72)発明者 土井 勝之 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内(72)発明者 岩崎 元治 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内(72)発明者 藤本 浩喜 大阪市淀川区新高3丁目9番14号 明治ナ ショナル工業株式会社内Fターム(参考) 3K014 AA01 DA05 LA01 LB04 5F041 AA43 DA13 DA20 DA43 DA57 DA83 DB07 DB08 DC07 DC23 DC83 DC84 FF11 Of the front page Continued (72) inventor Katsuyuki Doi Yodogawa-ku, Osaka new high 3-chome No. 9 No. 14 Meiji Na relational in Industry Co., Ltd. (72) inventor Motoharu Iwasaki Yodogawa-ku, Osaka new high 3-chome No. 9 No. 14 Meiji Na relational industry Co., Ltd. in the (72) inventor Fujimoto, Hiroki Yodogawa-ku, Osaka new high 3-chome No. 9 No. 14 Meiji Na relational industrial Co., Ltd. in the F-term (reference) 3K014 AA01 DA05 LA01 LB04 5F041 AA43 DA13 DA20 DA43 DA57 DA83 DB07 DB08 DC07 DC23 DC83 DC84 FF11

Claims (1)

  1. 【特許請求の範囲】 【請求項1】 表面に多数の発光ダイオードを配列実装し、裏面に前記多数の発光ダイオードを点灯駆動回路を構成する電子部品を実装してなる基板の表裏全面を樹脂モールドしてなることを特徴とする発光ダイオードを用いた照明器具。 The plurality of light emitting diodes arranged mounted to the Claims 1 surface, front and back entire resin molding of a substrate formed by mounting electronic components of the lighting drive circuit said plurality of light emitting diodes on the back illumination fixture using a light emitting diode, characterized in that to become to. 【請求項2】 表面に多数の発光ダイオードを配列実装し、裏面に前記多数の発光ダイオードを点灯駆動回路を構成する電子部品を実装してなる基板を筐体に収納し、 Wherein the plurality of light emitting diodes are arranged mounted on a surface, and accommodating a substrate formed by mounting electronic components of the lighting drive circuit said plurality of light emitting diodes on the back surface in the housing,
    前記筐体内に柔軟性および熱伝導性の高い透明樹脂を充填して前記多数の発光ダイオードおよび前記電子部品を樹脂モールドしてなることを特徴とする発光ダイオードを用いた照明器具。 The luminaire housing in flexibility and thermal conductivity highly transparent resin is filled many of the light-emitting diode and the electronic component using a light-emitting diode, characterized in that formed by resin molding. 【請求項3】 前記基板に樹脂モールド時の気泡を挿通する貫通孔を設けてなることを特徴とする請求項1又は請求項2記載の発光ダイオードを用いた照明器具。 3. A lighting fixture using the claim 1 or claim 2 light emitting diode according to characterized by comprising a through hole for inserting the air bubble at the time of resin molding on the substrate. 【請求項4】 前記基板の表面を着色してなることを特徴とする請求項1又は請求項2記載の発光ダイオードを用いた照明器具。 4. A lighting fixture using the claim 1 or claim 2 light emitting diode, wherein a obtained by coloring the surface of the substrate. 【請求項5】 前記基板には、その一端から他端に伸びる電源用の導体パターンと前記導体パターンから分岐し、前記基板の電子部品に接続する電源用の導体パターンが形成されてなることを特徴とする請求項1又は請求項2記載の発光ダイオードを用いた照明器具。 Wherein the substrate, that branches from the conductor pattern and the conductor pattern of the power supply extending to the other from one end, the conductor pattern for power supply connected to the electronic component of the substrate is formed illumination fixture using the claim 1 or claim 2 light emitting diode, wherein. 【請求項6】 前記一端から他端に伸びる電源用の導体パターンから分岐した前記基板の電子部品に接続する電源用の導体パターンに保護ヒューズを設けてなることを特徴とする請求項5記載の発光ダイオードを用いた照明器具。 6. A according to claim 5, characterized in that a protective fuse to the conductor pattern of the power supply to be connected to the electronic part of the substrate that has branched from the conductor pattern of the power supply extending to the other from the one end illumination fixture using a light emitting diode. 【請求項7】 前記一端から他端に伸びる電力供給用の導体パターンに連結用コネクタを接続してなることを特徴とする請求項5又は請求項6記載の発光ダイオードを用いた照明器具。 7. A lighting fixture using a light emitting diode according to claim 5 or claim 6, wherein a formed by connecting the connection connector to the conductor pattern of the power supply extending to the other end from the one end.
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