JP2009054617A - Light-emitting module and light-emitting device - Google Patents

Light-emitting module and light-emitting device Download PDF

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JP2009054617A
JP2009054617A JP2007217005A JP2007217005A JP2009054617A JP 2009054617 A JP2009054617 A JP 2009054617A JP 2007217005 A JP2007217005 A JP 2007217005A JP 2007217005 A JP2007217005 A JP 2007217005A JP 2009054617 A JP2009054617 A JP 2009054617A
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substrate
case body
printed circuit
board
circuit board
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JP2009054617A5 (en
JP4957965B2 (en
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Iwatomo Moriyama
厳與 森山
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module and an light-emitting device which can secure water proofness and dust proofness of a mounting board, suppress the occurrence of board deformation, prevent cracks, or the like, of a soldered portion, and to provide a desired light distribution. <P>SOLUTION: The light-emitting module 1 has a case body 3; a board 20 on the surface of which a plurality of light sources 4 are arranged, the board 20 sliding in a board surface direction to be stored and supported by the case body 30; reinforcing means 12 which are provided on the inner wall of the case body 3 and arranged along the surface of the board 20; and a filler 30 which is made of resin and is filled into the case body 3 including the board 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、LED等の光源を用いた発光モジュール及び発光装置に関する。   The present invention relates to a light emitting module and a light emitting device using a light source such as an LED.

LED等の光源を用いた発光モジュールにおいて、特に屋外で使用する場合には、防水や防塵の対策を講ずる必要がある。このため、LEDを用いた照明器具に関して、LEDを配列実装したプリント基板を筐体内に収納固定し、その筐体内に透明樹脂を充填し、LED及び電子部品全体を樹脂モールドして照明器具を構成したものが提案されている(特許文献1参照)。
特開2003−303504号公報
In light emitting modules using light sources such as LEDs, it is necessary to take measures for waterproofing and dustproofing, particularly when used outdoors. For this reason, with regard to lighting equipment using LEDs, a printed circuit board on which LEDs are arrayed and mounted is housed and fixed in a housing, transparent resin is filled in the housing, and the entire LED and electronic components are resin molded to form the lighting equipment. Has been proposed (see Patent Document 1).
JP 2003-303504 A

しかしながら、特許文献1に示されたものでは、プリント基板が熱により、すなわち、樹脂を充填し、硬化させる過程における熱や照明器具の使用中における実装部品による熱等で反りを生じ、変形し、はんだ部分にクラックが発生したり、また、プリント基板の変形により、プリント基板に実装されたLEDの光の出射方向が乱れて、所望の配光が得にくいといった不都合が生じる。   However, in the one shown in Patent Document 1, the printed circuit board is warped and deformed by heat, that is, heat in the process of filling and curing the resin, heat by the mounting component during use of the lighting fixture, and the like, Cracks occur in the solder portion, and the deformation of the printed circuit board disturbs the light emission direction of the LED mounted on the printed circuit board, which makes it difficult to obtain a desired light distribution.

そこで、本発明は、上記不都合を解消しようとするもので、実装基板の防水性、防塵性を確保できるとともに、基板の変形の発生を抑制し、はんだ部分のクラック等を防止し、また、所望の配光を得ることができる発光モジュール及び発光装置を提供することを目的とする。   Therefore, the present invention is intended to solve the above inconveniences, and can secure the waterproofness and dustproofness of the mounting board, suppress the occurrence of deformation of the board, prevent cracking of the solder part, and the like. It is an object of the present invention to provide a light emitting module and a light emitting device capable of obtaining the above light distribution.

請求項1に記載の発光モジュールは、ケース本体と、複数の光源が配設される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される基板と、ケース本体の内壁に設けられ、前記基板の面に沿って配設される補強手段と、ケース本体内に、前記基板を含んで充填された樹脂製の充填材とを具備することを特徴とする。 The light emitting module according to claim 1 has a case main body, a substrate surface on which a plurality of light sources are disposed, a substrate that is slidably housed and supported on the case main body, and an inner wall of the case main body. And reinforcing means disposed along the surface of the substrate, and a resin filler filled with the substrate in the case main body.

本発明及び以下の発明において、特に指定しない限り用語の定義及び技術的意味は次による。ケース本体は、直方体、円柱、三角柱等で構成でき、その形状には限定されない。光源は、LEDで構成するのが好適であるが、有機EL等の固体発光素子、サブミニチュアランプ等で構成してもよい。補強手段は、基板の変形の発生を抑制する機能を発揮し得れば足り、その形状等には限定されない。また、補強手段は、基板の表面又は裏面に沿って配設してもよいし、両面に配設してもよい。さらに、基板のケース本体への支持は、特別に支持部を構成してもよいし、補強手段で兼用してもよい。充填材としては、シリコーン系樹脂、ウレタン系樹脂、ポリエステル系樹脂等、適宜選択できる。   In the present invention and the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified. A case main body can be comprised by a rectangular parallelepiped, a cylinder, a triangular prism, etc., and is not limited to the shape. The light source is preferably composed of an LED, but may be composed of a solid light emitting element such as an organic EL, a subminiature lamp, or the like. The reinforcing means only needs to exhibit a function of suppressing the occurrence of deformation of the substrate, and is not limited to its shape. Further, the reinforcing means may be disposed along the front surface or the back surface of the substrate, or may be disposed on both surfaces. Further, the support of the substrate to the case main body may specially constitute a support part or may be shared by a reinforcing means. As the filler, a silicone resin, a urethane resin, a polyester resin, or the like can be appropriately selected.

請求項2に記載の発光モジュールは、ケース本体と、複数の光源が配設される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される第1の基板と、光源を点灯する点灯回路部品が実装される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される第2の基板と、ケース本体の内壁に設けられ、第1の基板の表裏両面に沿い、該基板の長手方向の両端部付近と中央部付近に、該基板を挟むように配設される補強手段と、ケース本体の内壁に設けられ、第2の基板の上面に沿い配設される補強手段と、ケース本体内に、前記両基板を含んで充填された樹脂製の充填材とを具備することを特徴とする。本発明は、光源が配設された第1の基板と点灯回路部品が実装された第2の基板との2枚の基板を設けたものであるが、例えば、第1の基板及び第2の基板に加えて第3の基板を設けることを排斥するものではない。   The light-emitting module according to claim 2 has a case main body and a substrate surface on which a plurality of light sources are arranged, a first substrate that is slidably housed and supported by the case main body in the substrate surface direction, and a light source A board surface on which a lighting circuit component for lighting is mounted, a second board that is slidably housed and supported on the case body, and is provided on the inner wall of the case body. Along the front and back surfaces, near the both ends and the center of the substrate in the longitudinal direction, reinforcing means disposed so as to sandwich the substrate, and provided on the inner wall of the case body, along the upper surface of the second substrate It is characterized by comprising reinforcing means to be disposed and a resin filler filled in the case body including the two substrates. The present invention is provided with two substrates, a first substrate on which a light source is disposed and a second substrate on which a lighting circuit component is mounted. For example, the first substrate and the second substrate are provided. The provision of the third substrate in addition to the substrate is not excluded.

請求項3に記載の発光モジュールは、請求項2に記載の発光モジュールにおいて、第2の基板の上面に配設される補強手段は、該基板の面と直交する方向に許容寸法を有するようにテーパ状に構成されていることを特徴とする。   The light emitting module according to claim 3 is the light emitting module according to claim 2, wherein the reinforcing means disposed on the upper surface of the second substrate has an allowable dimension in a direction perpendicular to the surface of the substrate. It is characterized by being tapered.

請求項4に記載の発光装置は、装置本体と、この装置本体に組込まれた請求項1乃至請求項3に記載の発光モジュールとを具備したことを特徴とする。本発明の発光装置は、ディスプレイ装置やいわゆる空間を照らす照明器具を含む概念である。   According to a fourth aspect of the present invention, there is provided a light emitting device including the device main body and the light emitting module according to any one of the first to third aspects incorporated in the device main body. The light emitting device of the present invention is a concept including a display device and a lighting fixture that illuminates a so-called space.

本発明は、実装基板の防水性、防塵性を確保できるとともに、基板の変形の発生を抑制し、はんだ部分のクラック等を防止し、また、所望の配光を得ることができる。   The present invention can secure the waterproofness and dustproofness of the mounting substrate, suppress the occurrence of deformation of the substrate, prevent the solder portion from cracking, and obtain desired light distribution.

以下、本発明の発光モジュールの第1の実施形態について図1乃至図6を参照して詳細に説明する。まず、図1は、発光モジュールを示す斜視図である。発光モジュール1は、発光面2を開口部となした箱状の合成樹脂製のケース本体3と、この本体3の開口部に配設された光源である複数個のLED4・・・とから構成されている。LED4は、いわゆる砲弾型の白色LEDであり、10個のLED4・・・がそれぞれ所定間隔を空けて直線状に配設されている。また、これらLED4・・・は、透光性のシリコーン樹脂製の保護キャップで覆われている。また、本体3には、LED4・・・の駆動回路、配線基板等が内蔵されており、本体3からは電源コード5が導出されている。   Hereinafter, a first embodiment of a light emitting module of the present invention will be described in detail with reference to FIGS. First, FIG. 1 is a perspective view showing a light emitting module. The light emitting module 1 is composed of a box-shaped synthetic resin case main body 3 having a light emitting surface 2 as an opening, and a plurality of LEDs 4... Serving as a light source disposed in the opening of the main body 3. Has been. The LED 4 is a so-called bullet-type white LED, and ten LEDs 4... Are linearly arranged at predetermined intervals. Moreover, these LED4 ... is covered with the protective cap made from translucent silicone resin. The main body 3 incorporates a drive circuit for the LEDs 4..., A wiring board, and the like, and a power cord 5 is led out from the main body 3.

次に、図2は、発光モジュール1を分解して示す斜視図である。ケース本体3は、断面L字状の基体部材6と、この基体部材6に組合わさる蓋部材7とから構成されている。そして、基体部材6は、底面板6a、背面板6b、側面板6cから構成されている。基体部材6の図示上、底内壁8には、長手方向と幅方向にそれぞれ底内壁8から突出した支持部9が形成されている。さらに、底内壁8から背面内壁10にわたって上方へ延出し、かつ上端面が幅方向に延出した2つの半円形柱状の補強手段11、11が形成されている。また、背面内壁10には、上段に3つの第1の補強手段12・・、下段に2つの第2の補強手段13、13が形成されている。第1の補強手段12・・は、円柱状をなし、背面内壁10から幅方向に延出しており、先端部には凹溝12aが形成されている。続いて、第2の補強手段13、13は、円錐柱状をなし、背面内壁10から幅方向に先細りのテーパ状をなして延出している。なお、基体部材6の底面板6a及び側面板6cの端面には、蓋部材7が係合する切欠き6aa、6ccが形成されている。   Next, FIG. 2 is an exploded perspective view showing the light emitting module 1. The case body 3 includes a base member 6 having an L-shaped cross section and a lid member 7 combined with the base member 6. The base member 6 includes a bottom plate 6a, a back plate 6b, and a side plate 6c. In the illustration of the base member 6, the bottom inner wall 8 is formed with support portions 9 that protrude from the bottom inner wall 8 in the longitudinal direction and the width direction, respectively. Further, two semicircular columnar reinforcing means 11 are formed extending upward from the bottom inner wall 8 to the rear inner wall 10 and having an upper end surface extending in the width direction. The back inner wall 10 is formed with three first reinforcing means 12... At the upper stage and two second reinforcing means 13, 13 at the lower stage. The first reinforcing means 12... Has a columnar shape, extends in the width direction from the back inner wall 10, and has a concave groove 12 a at the tip. Subsequently, the second reinforcing means 13, 13 has a conical column shape, and extends from the back inner wall 10 in a taper shape that tapers in the width direction. Notches 6aa and 6cc with which the lid member 7 engages are formed on the end surfaces of the bottom plate 6a and the side plate 6c of the base member 6.

次に、ケース本体3に収納支持される実装基板について説明する。基板は、例えば、プリント基板であり、第1のプリント基板20と第2のプリント基板21との2枚が設けられている。第1のプリント基板20は、ガラスエポキシ基板であり、細長の長方形状をなしている。この基板20面上に10個の砲弾型のLED4・・・が実装されている。また、複数個の貫通孔20a・・・が形成されている。さらに、第2のプリント基板21は、第1のプリント基板20と同様に、ガラスエポキシ基板であり、細長の長方形状をなしている。この基板21面上には、LED4・・・を点灯するための整流素子や抵抗素子、バリスタ、ヒューズ等の点灯回路部品21cが実装されている。また、複数個の貫通孔21a・・・及び前記基体部材6の半円形柱状の補強手段11、11に対応する切欠き21bが形成されている。   Next, the mounting substrate that is housed and supported in the case body 3 will be described. The board is, for example, a printed board, and two sheets of a first printed board 20 and a second printed board 21 are provided. The first printed circuit board 20 is a glass epoxy board and has an elongated rectangular shape. Ten bullet-type LEDs 4... Are mounted on the surface of the substrate 20. Moreover, a plurality of through holes 20a... Are formed. Further, the second printed circuit board 21 is a glass epoxy board, like the first printed circuit board 20, and has an elongated rectangular shape. On the surface of the substrate 21, lighting circuit components 21 c such as rectifying elements, resistance elements, varistors, and fuses for lighting the LEDs 4. Further, a plurality of through holes 21a... And notches 21b corresponding to the semicircular columnar reinforcing means 11, 11 of the base member 6 are formed.

蓋部材7は、ケース本体3の正面壁を構成するものであり、側端部及び底端部には、基体部6の切欠き6aa、6ccと係合する突起7aaが形成されている。なお、蓋部材7の内面には、詳細を後述するプリント基板の支持部等が形成されている。   The lid member 7 constitutes the front wall of the case body 3, and projections 7 aa that engage with the notches 6 aa and 6 cc of the base body 6 are formed at the side end and the bottom end. Note that, on the inner surface of the lid member 7, a support portion for a printed circuit board, which will be described in detail later, and the like are formed.

以上のような構成において、その組立て方法の概略を図2及び図3を参照して説明する。図3は、プリント基板の設置状態を示す斜視図である。なお、同図においては、プリント基板に実装される部品等は省略している。まず、第1のプリント基板20と第2のプリント基板21とを基体部材6の正面側から、基板面方向にスライドさせて、基体部材6にセットする。このセット状態では、第1のプリント基板20は、裏面側が半円形柱状の補強手段11、11の上端面に載置支持され、表面側が第1の補強手段12・・に接触し、動きが規制された状態となっている。すなわち、補強手段11、11及び12・・は、プリント基板20の表裏面の幅方向に沿って、かつ基板20の長手方向の両端部付近と中央部付近を共同して基板20を挟むように配設されている。なお、ここで、プリント基板20の表面側が補強手段12・・に必ずしも接触している必要はなく、若干の隙間の存在は許容するものである。続いて、第2のプリント基板21は、裏面側が支持部9に載置支持されるとともに、切欠き21bが半円形状の補強手段11、11に嵌合し、表面側が第2の補強手段13、13の円錐柱状の根元部に接触し、動きが規制された状態となっている。すなわち、補強手段13、13は、テーパ状にプリント基板21の表面の幅方向に沿って配設されている。そして、蓋部材7の突起7aaを基体部6の切欠き6aa、6ccに係合し、蓋部材7を基体部6に組合わせる。このケース本体3に第1のプリント基板20と第2のプリント基板21とを収納した状態で、両プリント基板20、21を覆うように充填材を充填する。   With the above configuration, an outline of the assembly method will be described with reference to FIGS. FIG. 3 is a perspective view showing an installed state of the printed circuit board. In the figure, components mounted on the printed circuit board are omitted. First, the first printed board 20 and the second printed board 21 are slid from the front side of the base member 6 toward the board surface and set on the base member 6. In this set state, the first printed circuit board 20 is placed and supported on the upper end surface of the semicircular columnar reinforcing means 11 and 11 on the back side, and the front side is in contact with the first reinforcing means 12. It has become a state. That is, the reinforcing means 11, 11 and 12... Sandwich the substrate 20 along the width direction of the front and back surfaces of the printed circuit board 20 and in the vicinity of both ends and the center of the substrate 20 in the longitudinal direction. It is arranged. Here, the surface side of the printed circuit board 20 is not necessarily in contact with the reinforcing means 12..., And a slight gap is allowed. Subsequently, the second printed circuit board 21 is mounted and supported on the back surface side by the support portion 9, the notch 21 b is fitted in the semicircular reinforcing means 11, 11, and the front surface side is the second reinforcing means 13. , 13 in contact with the base of the conical column shape, and the movement is restricted. That is, the reinforcing means 13 are arranged in a taper shape along the width direction of the surface of the printed board 21. Then, the protrusion 7aa of the lid member 7 is engaged with the cutouts 6aa and 6cc of the base portion 6, and the lid member 7 is combined with the base portion 6. In a state where the first printed circuit board 20 and the second printed circuit board 21 are accommodated in the case body 3, a filler is filled so as to cover both the printed circuit boards 20 and 21.

次に、図4乃至図6を参照して、さらに具体的に説明を加える。図4は、発光モジュール1において、ケース本体3の蓋部材7を取外して示す正面図、図5は、図4のA−A線に沿う断面図、図6は、図4のB−B線に沿う断面図である。なお、上述の図1乃至図3と同一部分には同一符号を付しその重複した説明は省略する。まず、図4において、第1のプリント基板20と第2のプリント基板21とがケース本体3内に収納支持されている。また、それぞれ補強手段11、11、第1の補強手段12・・及び第2の補強手段13、13がプリント基板20、21の面に沿って配設されている。そして、シリコーン樹脂製の充填材30がLED4・・・の頭部を残して第1のプリント基板20及び第2のプリント基板21を覆うように充填されている(図上破線で示す)。   Next, a more specific description will be given with reference to FIGS. 4 is a front view of the light emitting module 1 with the cover member 7 removed from the case body 3, FIG. 5 is a cross-sectional view taken along line AA in FIG. 4, and FIG. 6 is a line BB in FIG. FIG. The same parts as those in FIGS. 1 to 3 described above are denoted by the same reference numerals, and redundant description thereof is omitted. First, in FIG. 4, the first printed circuit board 20 and the second printed circuit board 21 are housed and supported in the case body 3. Reinforcing means 11, 11, first reinforcing means 12... And second reinforcing means 13, 13 are arranged along the surfaces of the printed circuit boards 20, 21, respectively. The filling material 30 made of silicone resin is filled so as to cover the first printed circuit board 20 and the second printed circuit board 21 with the heads of the LEDs 4...

次に、図5及び図6を参照して説明する。同図においては、プリント基板20、21の実装部品の詳細は省略している。まず、蓋部材7の内面には、第1の補強手段12・・の凹溝12aに嵌合する嵌合突起7b、第1のプリント基板20の裏面を支持する山型突起7c、第2の補強手段13、13の先端が嵌合する凹溝7d、第2のプリント基板21が支持される支持部7eが形成されている。そして、第1のプリント基板20及び第2のプリント基板21が収納支持され、充填材30が充填されている。   Next, a description will be given with reference to FIGS. In the figure, details of the mounted components of the printed circuit boards 20 and 21 are omitted. First, on the inner surface of the lid member 7, a fitting protrusion 7 b that fits into the concave groove 12 a of the first reinforcing means 12, a mountain-shaped protrusion 7 c that supports the back surface of the first printed circuit board 20, and a second A concave groove 7d into which the tips of the reinforcing means 13, 13 are fitted, and a support portion 7e for supporting the second printed circuit board 21 are formed. The first printed circuit board 20 and the second printed circuit board 21 are housed and supported and filled with the filler 30.

ここで、第1のプリント基板20は、光源であるLED4・・・が実装されているため、その指向性の強い配光を所望のものとするため、プリント基板20が傾いて取付けられたり、熱によってプリント基板20が反ったりするのを回避しなければならない。したがって、第1のプリント基板20は、半円形状の補強手段11、11や第1の補強手段12・・と蓋部材7等との寸法関係において、所定の精度をもって取付けられなければならない。一方、第2のプリント基板21は、熱によって反ったりするのを回避しなければならないが、光源が実装されているわけではないので、第1のプリント基板20ほどの取付け精度は要求されないといえる。そこで、基体部材6に蓋部材7を組合わせるに際し、まず、第1のプリント基板20に関係する第1の補強手段12・・の凹溝12aに嵌合突起7bを嵌合すること等を優先し、次いで、第2のプリント基板21を蓋部材7の支持部7eに適合するように組合わせる。この場合、第2の補強手段13、13は、テーパ状に形成されているため、第2のプリント基板21の面と直交する方向に許容寸法を有して配設されているということになる。つまり、第2のプリント基板21は、蓋部材7を組合わせるとき、矢印Aで示す方向(図6)に許容寸法、いわゆる遊びをもって組合わせることができる。したがって、蓋部材7との関係において、第1のプリント基板20の取付け寸法を厳格に設定しても、第2のプリント基板21の取付けでは、第2のプリント基板21を許容寸法内で矢印A方向に動かして蓋部材7の支持部7eと寸法合わせを行うことができ、すなわち、寸法誤差等を吸収することができ、基体部材6への蓋部材7の組合わせを容易化することが可能となる。なお、第2の補強手段13、13のテーパの勾配は適宜選択して設計すればよい。   Here, since the first printed circuit board 20 is mounted with the LEDs 4... That are light sources, the printed circuit board 20 is inclined and attached in order to obtain a light distribution with strong directivity. It is necessary to avoid the printed circuit board 20 from warping due to heat. Therefore, the first printed circuit board 20 must be attached with a predetermined accuracy in the dimensional relationship between the semicircular reinforcing means 11, 11, the first reinforcing means 12, and the lid member 7. On the other hand, the second printed circuit board 21 must avoid warping due to heat, but since the light source is not mounted, it can be said that the mounting accuracy as high as the first printed circuit board 20 is not required. . Therefore, when the lid member 7 is combined with the base member 6, first, priority is given to fitting the fitting protrusion 7b into the concave groove 12a of the first reinforcing means 12 related to the first printed circuit board 20. Then, the second printed circuit board 21 is assembled so as to fit the support portion 7e of the lid member 7. In this case, since the second reinforcing means 13 is formed in a tapered shape, the second reinforcing means 13 is disposed with an allowable dimension in a direction orthogonal to the surface of the second printed circuit board 21. . That is, the second printed circuit board 21 can be combined with an allowable dimension, so-called play, in the direction indicated by the arrow A (FIG. 6) when the lid member 7 is combined. Therefore, even if the mounting dimension of the first printed circuit board 20 is strictly set in relation to the lid member 7, the second printed circuit board 21 is mounted within the allowable dimension by the arrow A even when the second printed circuit board 21 is mounted. It can be moved in the direction to be dimensioned with the support portion 7e of the lid member 7, that is, it can absorb dimensional errors and the like, and the combination of the lid member 7 to the base member 6 can be facilitated. It becomes. In addition, what is necessary is just to select and design the taper gradient of the 2nd reinforcement means 13 and 13 suitably.

次に、充填材30について説明する。充填材30は、シリコーン樹脂製であり、絶縁性、熱伝導性を有している。この充填材30の充填方法は、まず、100℃以上の液状の充填材30をケース本体3の上面開口部から注入する。上から注入された充填材30は、第1のプリント基板20に形成された貫通孔20aを通過し、第2のプリント基板21に至り、さらに、第2のプリント基板21の貫通孔21aを通過して、プリント基板21の下側へまで流れ込む。そして、充填材30の注入量は、第1のプリント基板20及び第2のプリント基板21が覆われ、LED4・・・の頭部が露出するレベルとする。充填材30の注入終了後は、充填材30が硬化し、安定するまで所要時間放置し、保管する。   Next, the filler 30 will be described. The filler 30 is made of a silicone resin and has insulating properties and thermal conductivity. In this filling method of the filling material 30, first, a liquid filling material 30 of 100 ° C. or more is injected from the upper surface opening of the case body 3. The filler 30 injected from above passes through the through hole 20a formed in the first printed circuit board 20, reaches the second printed circuit board 21, and further passes through the through hole 21a of the second printed circuit board 21. Then, it flows down to the lower side of the printed circuit board 21. The filling amount of the filler 30 is set to a level at which the first printed circuit board 20 and the second printed circuit board 21 are covered and the heads of the LEDs 4. After the filling of the filling material 30 is completed, the filling material 30 is left for a required time until it is cured and stabilized.

上述の充填材30の充填過程において、プリント基板20、21は、充填材30の熱を受け、反りを生じたり、変形する可能性を含んでいるが、第1のプリント基板20に対しては、その表裏面に沿って補強手段11、11及び第1の補強手段12・・が配設されているので、基板20の反り、変形を抑制できる。また、第2のプリント基板21に対しては、その表面に沿って第2の補強手段13、13が配設されているので、基板20の反り、変形を抑制できる。なお、発光モジュールの使用中には、実装部品から熱が発生し、この場合にもプリント基板20、21は、その熱を受け、反りを生じたり、変形する可能性を含んでいるが、同様に、補強手段11、11、12・・・、13、13により基板20,21の反り、変形を抑制することができる。   In the filling process of the filler 30 described above, the printed boards 20 and 21 receive the heat of the filler 30 and may be warped or deformed. Since the reinforcing means 11 and 11 and the first reinforcing means 12... Are disposed along the front and back surfaces, warping and deformation of the substrate 20 can be suppressed. In addition, since the second reinforcing means 13 and 13 are disposed along the surface of the second printed circuit board 21, warping and deformation of the circuit board 20 can be suppressed. During use of the light emitting module, heat is generated from the mounted components. In this case as well, the printed circuit boards 20 and 21 receive the heat and may be warped or deformed. In addition, the warping and deformation of the substrates 20 and 21 can be suppressed by the reinforcing means 11, 11, 12,.

以上のように本実施形態によれば、ケース本体内に樹脂製の充填材を充填したので、プリント基板の防水性、防塵性を確保できるとともに、プリント基板の変形の発生を抑制し、はんだ部分のクラック等を防止し、また、所望の配光を得ることができる。さらに、第2の補強手段は、第2のプリント基板の面と直交する方向に許容寸法を有して配設されているので、基体部材への蓋部材の組合わせを容易化することが可能となる。   As described above, according to the present embodiment, the case main body is filled with the resin filler, so that the waterproofness and dustproofness of the printed circuit board can be secured, and the occurrence of deformation of the printed circuit board is suppressed, and the solder portion Cracks and the like, and a desired light distribution can be obtained. Further, since the second reinforcing means is disposed with an allowable dimension in a direction orthogonal to the surface of the second printed circuit board, it is possible to facilitate the combination of the lid member to the base member. It becomes.

次に、本発明の第2の実施形態を図7を参照して説明する。図7は発光モジュールを示し、(a)は側面図、(b)は、ケース本体の蓋部材を取外して示す正面図である。なお、第1の実施形態と同一又は相当部分には同一符号を付し、その重複した説明は省略する。本実施形態においては、図上破線で示すように充填材30の表面を傾斜して形成している。そして、傾斜端の側面板6cには、円形の水抜き貫通孔6dが形成されている。したがって、この発光モジュール1を屋外で使用する場合、雨水等がケース本体3の開口部に溜まることなく、傾斜に沿って流れ、水抜き貫通孔6dから排出させることができる。   Next, a second embodiment of the present invention will be described with reference to FIG. 7A and 7B show a light emitting module, FIG. 7A is a side view, and FIG. 7B is a front view showing a case body with a cover member removed. In addition, the same code | symbol is attached | subjected to the part which is the same as that of 1st Embodiment, or an equivalent part, and the duplicate description is abbreviate | omitted. In the present embodiment, the surface of the filler 30 is formed so as to be inclined as indicated by a broken line in the drawing. A circular drainage through hole 6d is formed in the side plate 6c at the inclined end. Therefore, when the light emitting module 1 is used outdoors, rainwater or the like can flow along the slope without being collected in the opening of the case body 3 and can be discharged from the drain through hole 6d.

以上のように本実施形態によれば、第1の実施形態の効果に加え、ケース本体に雨水等を滞らせることなく、ケース本体から雨水等を排出させることができ、一層防水性を向上できる効果が期待できる。   As described above, according to the present embodiment, in addition to the effects of the first embodiment, rainwater and the like can be discharged from the case main body without causing rainwater or the like to stagnate in the case main body, thereby further improving waterproofness. The effect can be expected.

さらに、本発明の第3の実施形態について説明する。図示は省略するが、上記各実施形態の発光モジュールは、装置本体に組込み発光装置として構成できる。例えば、屋外で使用される庭園灯や表札灯、看板灯等の各種ディスプレイ装置、また、屋内で使用される廊下、階段に設置される足元灯等の照明器具に適用可能である。よって、このような発光装置によれば、上記各実施形態の効果を奏する発光装置を提供できる。   Furthermore, a third embodiment of the present invention will be described. Although illustration is omitted, the light emitting module of each of the above embodiments can be configured as a light emitting device built in the apparatus main body. For example, the present invention can be applied to various display devices such as garden lamps, nameplate lamps, and signboard lamps used outdoors, and lighting fixtures such as foot lamps installed in corridors and stairs used indoors. Therefore, according to such a light emitting device, it is possible to provide a light emitting device having the effects of the above embodiments.

なお、以上の各実施形態において、光源としてのLEDは、白色発光のものを用いることに限定されず、例えば、青色、緑色、赤色の発光色のものを用いてもよく、また、表面実装タイプのものを用いてもよい。さらに、プリント基板は、表面側にLEDを実装し、裏面側に点灯回路部品を実装するような両面実装タイプのものを適用してもよい。   In each of the above embodiments, the LED as the light source is not limited to using a white light emitting LED. For example, blue, green, and red light emitting colors may be used. May be used. Further, the printed circuit board may be a double-sided mounting type in which LEDs are mounted on the front surface side and lighting circuit components are mounted on the back surface side.

本発明の発光モジュールの第1の実施形態を示す斜視図である。1 is a perspective view showing a first embodiment of a light emitting module of the present invention. 同第1の実施形態のケース本体を分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows the case main body of the 1st Embodiment. 同第1の実施形態のプリント基板の設置状態を示す斜視図である。It is a perspective view which shows the installation state of the printed circuit board of the 1st embodiment. 同第1の実施形態の本体ケースの蓋部材を取外して示す正面図である。It is a front view which removes and shows the cover member of the main body case of the 1st embodiment. 図4のA−A線に沿う断面図である。It is sectional drawing which follows the AA line of FIG. 図4のB−B線に沿う断面図である。It is sectional drawing which follows the BB line of FIG. 同第2の実施形態の側面図及び本体ケースの蓋部材を取外して示す正面図である。It is the front view which removes and shows the side view of the said 2nd Embodiment, and the cover member of a main body case.

符号の説明Explanation of symbols

1 発光モジュール
3 ケース本体
4 光源(LED)
11、12、13 補強手段
20、21 プリント基板
30 充填材
1 Light Emitting Module 3 Case Body 4 Light Source (LED)
11, 12, 13 Reinforcing means 20, 21 Printed circuit board 30 Filler

Claims (4)

ケース本体と;
複数の光源が配設される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される基板と;
ケース本体の内壁に設けられ、前記基板の面に沿って配設される補強手段と;
ケース本体内に、前記基板を含んで充填された樹脂製の充填材と;
を具備することを特徴とする発光モジュール。
With the case body;
A substrate having a substrate surface on which a plurality of light sources are disposed, and being stored and supported by sliding in the substrate surface direction on the case body;
Reinforcing means provided on the inner wall of the case body and disposed along the surface of the substrate;
A resin filler filled with the substrate in the case body;
A light emitting module comprising:
ケース本体と;
複数の光源が配設される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される第1の基板と;
光源を点灯する点灯回路部品が実装される基板面を有し、ケース本体に、基板面方向にスライドして収納支持される第2の基板と;
ケース本体の内壁に設けられ、第1の基板の表裏両面に沿い、該基板の長手方向の両端部付近と中央部付近に、該基板を挟むように配設される補強手段と;
ケース本体の内壁に設けられ、第2の基板の上面に沿い配設される補強手段と;
ケース本体内に、前記両基板を含んで充填された樹脂製の充填材と;
を具備することを特徴とする発光モジュール。
With the case body;
A first substrate having a substrate surface on which a plurality of light sources are disposed, and being housed and supported on the case body by sliding in the substrate surface direction;
A second board having a board surface on which a lighting circuit component for lighting a light source is mounted, and being housed and supported by sliding in the board surface direction on the case body;
Reinforcing means provided on the inner wall of the case main body and disposed along both the front and back surfaces of the first substrate so as to sandwich the substrate between both ends and the center of the substrate in the longitudinal direction;
Reinforcing means provided on the inner wall of the case body and disposed along the upper surface of the second substrate;
A resin filler filled in the case body including the two substrates;
A light emitting module comprising:
前記第2の基板の上面に配設される補強手段は、該基板の面と直交する方向に許容寸法を有するようにテーパ状に構成されていることを特徴とする請求項2に記載の発光モジュール。   The light emitting device according to claim 2, wherein the reinforcing means disposed on the upper surface of the second substrate is configured to have a tapered shape so as to have an allowable dimension in a direction orthogonal to the surface of the substrate. module. 装置本体と;
この装置本体に組込まれた請求項1乃至請求項3に記載の発光モジュールと;
を具備したことを特徴とする発光装置。
The device body;
The light emitting module according to claim 1, which is incorporated in the apparatus main body;
A light emitting device comprising:
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JP2020038810A (en) * 2018-09-05 2020-03-12 パナソニックIpマネジメント株式会社 Board housing case and luminaire comprising the same

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JP2003511817A (en) * 1999-10-04 2003-03-25 ハッチンス,ニコラス,ディー Slender light emitting diode lighting system
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JPS59168656A (en) * 1983-03-04 1984-09-22 ブラウン・ボバリ・ウント・シ−・アクチエンゲゼルシヤフト Rectifier module with stationary swell
JPS61112392A (en) * 1984-11-07 1986-05-30 Hitachi Ltd Semiconductor laser and manufacture thereof
JPH01154643A (en) * 1987-12-11 1989-06-16 Fujitsu Ltd Transmission control system
JPH11249607A (en) * 1998-03-03 1999-09-17 Abikkusu Kk Led illumination unit and its installation structure
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020038810A (en) * 2018-09-05 2020-03-12 パナソニックIpマネジメント株式会社 Board housing case and luminaire comprising the same
JP7170242B2 (en) 2018-09-05 2022-11-14 パナソニックIpマネジメント株式会社 lighting equipment

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