JP4480736B2

JP4480736B2 - Light emitting device

Info

Publication number: JP4480736B2
Application number: JP2007083930A
Authority: JP
Inventors: 大輔作本; 真吾松浦
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2003-06-26
Filing date: 2007-03-28
Publication date: 2010-06-16
Anticipated expiration: 2024-03-12
Also published as: JP2007180585A

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device with high intensity of radiation light and high luminance, by maintaining well the desired surface precision of the reflection plane disposed to the surroundings of the light emitting element thereof in such a manner that absorption and transmission of light of the light emitting element of the upper surface of the substrate thereof are effectively prevented, and distortion of the reflection member thereof due to heat is prevented. <P>SOLUTION: The light emitting device of the present invention includes: a light emitting element 1 generating first light; a substrate 2 with a placing section 2a for the light emitting element 1, extending upward and provided with a light reflection layer 2c on the side thereof; and a reflection member 3 with a first plane 3a surrounding the light emitting element 1 and reflecting the first light, and a second plane contacting with the light reflection layer of the placing section. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、発光素子を収容するための発光素子収納用パッケージおよび発光装置ならびに照明装置に関する。 The present invention relates to a light emitting element storage package for accommodating a light emitting element, a light emitting device, and an illumination device.

従来の発光ダイオード（ＬＥＤ）等の発光素子11を収容するための発光素子収納用パッケージ（以下、単にパッケージともいう）を図６に示す。図６において、パッケージは、上面の中央部に発光素子11を載置するための載置部12ａを有し、載置部12ａおよびその周辺からパッケージの内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体（図示せず）が形成された絶縁体からなる基体12と、基体12の上面に接着固定され、内周面が上側に向かうに伴って外側に広がるように傾斜しているとともに内周面が発光素子11が発光する光を反射する反射面13ａとされている枠状の反射部材13とから主に構成されている。 FIG. 6 shows a light-emitting element housing package (hereinafter also simply referred to as a package) for housing a light-emitting element 11 such as a conventional light-emitting diode (LED). In FIG. 6, the package has a mounting portion 12a for mounting the light emitting element 11 in the central portion of the upper surface, and leads terminals that electrically connect the mounting portion 12a and its periphery to the inside and outside of the package. A base 12 made of an insulator on which a wiring conductor (not shown) made of metallized wiring or the like is formed, and is bonded and fixed to the upper surface of the base 12 and is inclined so that the inner peripheral surface extends outward as it goes upward. In addition, the inner peripheral surface is mainly composed of a frame-like reflecting member 13 which is a reflecting surface 13a that reflects light emitted from the light emitting element 11.

基体12は、酸化アルミニウム質焼結体（アルミナセラミックス）や窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体12がセラミックスから成る場合、その上面に配線導体がタングステン（Ｗ），モリブデン（Ｍｏ）−マンガン（Ｍｎ）等から成る金属ペーストを高温で焼成して形成される。また、基体12が樹脂から成る場合、銅（Ｃｕ）や鉄（Ｆｅ）−ニッケル（Ｎｉ）合金等から成るリード端子がモールド成型されて基体12の内部に設置固定される。 The substrate 12 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, the wiring conductor is formed on the upper surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn) or the like at a high temperature. When the base 12 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 12.

また、反射部材13は、アルミニウム（Ａｌ）やＦｅ−Ｎｉ−コバルト（Ｃｏ）合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。 The reflecting member 13 is made of metal such as aluminum (Al) or Fe-Ni-cobalt (Co) alloy, ceramics such as alumina ceramics or resin such as epoxy resin, and is used for cutting, die molding or extrusion molding. Formed by molding technique.

さらに、反射部材13は、内周面が発光素子11が発光する光を反射する反射面13ａとされており、この反射面13ａはＡｌ等の金属が蒸着法やメッキ法により被着されることにより形成される。そして、反射部材13は、半田，銀（Ａｇ）ロウ等のロウ材または樹脂接着材等の接合材により、載置部12ａを反射部材13の内周面で取り囲むように基体12の上面に接合される。 Further, the reflection member 13 has an inner peripheral surface that is a reflection surface 13a that reflects light emitted from the light emitting element 11, and the reflection surface 13a is coated with a metal such as Al by vapor deposition or plating. It is formed by. Then, the reflecting member 13 is bonded to the upper surface of the base 12 so that the mounting portion 12a is surrounded by the inner peripheral surface of the reflecting member 13 by a soldering material such as solder, silver (Ag) brazing, or a resin adhesive. Is done.

そして、載置部12ａの周辺に配置した配線導体と発光素子11の電極とをボンディングワイヤ14を介して電気的に接続し、しかる後、反射部材13の内側にエポキシ樹脂やシリコーン樹脂等の透明樹脂（図示せず）により発光素子11を覆うように充填し熱硬化させることにより発光装置となし得る。または、発光素子11の周囲または表面に蛍光体や蛍光体を混入した透明樹脂を塗布した後に、反射部材13の内側に透明樹脂を充填し熱硬化させることで、発光素子11からの光を蛍光体により波長変換し所望の波長スペクトルを有する光を取り出せる発光装置となし得る。
特開2003−37298号公報 And the wiring conductor arrange | positioned around the mounting part 12a and the electrode of the light emitting element 11 are electrically connected through the bonding wire 14, and after that, transparent, such as an epoxy resin or a silicone resin, is formed inside the reflecting member 13. A light emitting device can be obtained by filling the light emitting element 11 with a resin (not shown) so as to cover it and thermosetting it. Alternatively, after applying a fluorescent material or a transparent resin mixed with a fluorescent material around or on the surface of the light emitting element 11, the inside of the reflective member 13 is filled with the transparent resin and thermally cured, so that the light from the light emitting element 11 is fluorescent. A light-emitting device capable of taking out light having a desired wavelength spectrum after wavelength conversion by a body can be obtained.
Japanese Patent Laid-Open No. 2003-37298

しかしながら、上記従来のパッケージにおいては、発光素子11から出射される光やパッケージ内部で乱反射した光が、反射面13ａ以外の部位、即ち、基体12の上面の反射部材13に覆われていない部位に吸収，透過され易い。その結果、発光素子11から透明樹脂を透過して発光装置の外部に出射される光の強度や輝度が著しく劣化するという問題点があった。 However, in the conventional package described above, the light emitted from the light emitting element 11 or the light irregularly reflected inside the package is exposed to a part other than the reflecting surface 13a, that is, a part not covered with the reflecting member 13 on the upper surface of the substrate 12. Easy to absorb and transmit. As a result, there has been a problem that the intensity and luminance of the light transmitted from the light emitting element 11 through the transparent resin and emitted to the outside of the light emitting device are significantly deteriorated.

そこで、反射部材13の内周面の下端を発光素子11の周辺まで延出し、基体12の上面のほとんどが反射部材13で覆われるようにすると、反射部材13と基体12との接合面積が大きくなるため、反射部材13を基体12に接合する際等に熱が加えられたときに反射部材13と基体12との熱膨張差が大きくなって反射部材13が歪み易くなり、発光素子11の周囲に設けた反射面13ａの所望の面精度（例えば、パッケージの断面において、発光素子11を間に挟んで発光素子11の両側に設けられた反射面13ａが対称になっている状態）がくずれて乱反射が生じるという問題点を有していた。その結果、反射光強度にむらを生じたり、反射光強度が低下したりして十分な放射光強度および輝度が得られないという問題点を有していた。 Therefore, when the lower end of the inner peripheral surface of the reflecting member 13 is extended to the periphery of the light emitting element 11 so that most of the upper surface of the base 12 is covered with the reflecting member 13, the bonding area between the reflecting member 13 and the base 12 is large. Therefore, when heat is applied, for example, when the reflecting member 13 is bonded to the base 12, the difference in thermal expansion between the reflecting member 13 and the base 12 becomes large, and the reflecting member 13 is easily distorted. The desired surface accuracy of the reflecting surface 13a provided on the light-emitting element (for example, a state where the reflecting surfaces 13a provided on both sides of the light-emitting element 11 are symmetric with respect to the light-emitting element 11 in the cross section of the package) is broken. There was a problem that irregular reflection occurred. As a result, there is a problem in that the reflected light intensity is uneven or the reflected light intensity is lowered, so that sufficient radiated light intensity and luminance cannot be obtained.

また、反射部材13の内周面を発光素子11の周辺まで延出した場合、反射部材13と基体12とを取着するための接合材が反射部材13の内側にはみ出し、このはみ出した接合材が発光素子11の側面や反射面13ａを這い上がることによって、発光素子11の発光機能や反射面13ａの反射機能を劣化させるという問題点も有していた。 Further, when the inner peripheral surface of the reflecting member 13 is extended to the periphery of the light emitting element 11, the bonding material for attaching the reflecting member 13 and the base body 12 protrudes inside the reflecting member 13, and this protruding bonding material However, there is a problem that the light emitting function of the light emitting element 11 and the reflecting function of the reflecting surface 13a are deteriorated by scooping up the side surface and the reflecting surface 13a of the light emitting element 11.

したがって、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、発光素子の光が基体上面に吸収，透過されるのを有効に防止するとともに、反射部材の熱による歪みを防止して発光素子の周囲に設けた反射面の所望の面精度を良好に維持し、高い放射光強度および高輝度を有する発光素子収納用パッケージおよび発光装置を提供することである。 Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to effectively prevent light from the light emitting element from being absorbed and transmitted to the upper surface of the substrate and to be caused by the heat of the reflecting member. Disclosed is a light-emitting element storage package and a light-emitting device that prevent distortion and maintain a desired surface accuracy of a reflecting surface provided around a light-emitting element, and have high radiation light intensity and high luminance.

本発明の一つの態様によれば、発光装置は、発光素子、基体および電気接続用パターンを有している。発光装置は、光反射層および反射部材をさらに有している。基体は、上方に突出した発光素子の載置部を備えている。電気接続用パターンは、載置部に形成されており、発光素子に電気的に接続されている。光反射層は、金属材料からなり、載置部の側面および上面に形成されているとともに、電気接続用パターンとは別に設けられている。反射部材は、金属材料からなり、第１の面および第２の面を有している。第１の面は、発光素子を囲んでいる。第１の面は、光反射層を囲んでいる。第１の面は、発光素子から放射された光を反射する。第２の面は、載置部の光反射層に接する。 According to one aspect of the present invention, a light emitting device includes a light emitting element, a base, and an electrical connection pattern. The light emitting device further includes a light reflecting layer and a reflecting member. The base includes a light emitting element mounting portion protruding upward. The electrical connection pattern is formed on the mounting portion and is electrically connected to the light emitting element. Light reflecting layer is made of a metallic material, with which is formed on the side surface and the upper surface of the mounting portion is provided separately from the electric connection pattern. The reflecting member is made of a metal material and has a first surface and a second surface. The first surface surrounds the light emitting element. The first surface surrounds the light reflecting layer. The first surface reflects the light emitted from the light emitting element. The second surface is in contact with the light reflecting layer of the placement unit.

本発明の発光素子収納用パッケージは、上方に突出しており側面に光反射層が設けられた発光素子の載置部を備えた基体と、発光素子を囲み第１の光を反射する第１の面と、載置部の光反射層に接する第２の面とを有する反射部材とを有することから、発光素子から発生した熱を光反射層を介して反射部材に効率よく伝達することができ、発光素子の劣化を有効に抑制することができる。 The light emitting element storage package according to the present invention includes a base body including a light emitting element mounting portion protruding upward and having a light reflecting layer provided on a side surface thereof, and a first light that surrounds the light emitting element and reflects the first light. And a reflection member having a second surface in contact with the light reflection layer of the mounting portion, heat generated from the light emitting element can be efficiently transmitted to the reflection member through the light reflection layer. Therefore, deterioration of the light emitting element can be effectively suppressed.

本発明の発光素子収納用パッケージについて以下に詳細に説明する。図１，３，４は本発明のパッケージの実施の形態の各種例を示す断面図であり、図２は図１の部分拡大断面図である。これらの図において、２は基体、３は反射部材であり、主としてこれらで発光素子１を収納するためのパッケージが構成される。 The light emitting element storage package of the present invention will be described in detail below. 1, 3 and 4 are sectional views showing various examples of embodiments of the package of the present invention, and FIG. 2 is a partially enlarged sectional view of FIG. In these drawings, 2 is a base, and 3 is a reflecting member, and these mainly constitute a package for housing the light emitting element 1.

本発明における基体２は、アルミナセラミックスや窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、Ｆｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属、または、エポキシ樹脂等の樹脂から成る。また、基体２は図１〜４に示すように、発光素子１が載置される載置部２ａが基体２の上面から突出している。 The substrate 2 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, metals such as Fe-Ni-Co alloys and Cu-W, or resins such as epoxy resins. Consists of. In addition, as shown in FIGS. 1 to 4, the substrate 2 has a mounting portion 2 a on which the light emitting element 1 is mounted protruding from the upper surface of the substrate 2.

載置部２ａは、アルミナセラミックスや窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス等のセラミックス、Ｆｅ−Ｎｉ−Ｃｏ合金やＣｕ−Ｗ等の金属、または、エポキシ樹脂等の樹脂から成る部材を基体２の上面にロウ材や接着剤等の接合材により取着することによって、または、基体２の中央部に設けた貫通孔に、上記のセラミックス，金属または樹脂から成る部材をその上側が基体２の上面から突出するように嵌着して取着することによって設けることができる。 The mounting portion 2a is made of alumina ceramic, aluminum nitride sintered body, mullite sintered body, ceramic such as glass ceramic, metal such as Fe-Ni-Co alloy or Cu-W, or resin such as epoxy resin. The member made of the above ceramic, metal or resin is attached to the upper surface of the base 2 with a bonding material such as a brazing material or an adhesive, or the through hole provided in the central portion of the base 2 It can be provided by fitting and attaching so that the upper side protrudes from the upper surface of the base 2.

好ましくは、載置部２ａと基体２とを同じ材質にするのがよい。これにより、載置部２ａと基体２との熱膨張差を小さくすることができ、載置部２ａに歪みが生じて発光素子１の位置がずれ、発光強度が低下するのを有効に抑制できる。 Preferably, the mounting portion 2a and the base 2 are made of the same material. As a result, the difference in thermal expansion between the mounting portion 2a and the base body 2 can be reduced, and it is possible to effectively suppress the displacement of the mounting portion 2a resulting in the displacement of the light emitting element 1 and the decrease in the light emission intensity. .

また、載置部２ａは、基体２と一体となっていてもよい。載置部２ａが基体２と一体となっている場合、例えば、載置部２ａや基体２と成るセラミックグリーンシートを積層して同時焼成することによって、切削加工等の金属加工方法によって、または、射出成型等で樹脂をモールド成型することによって作製することができる。 Further, the placing portion 2 a may be integrated with the base body 2. When the mounting portion 2a is integrated with the base body 2, for example, by stacking and simultaneously firing ceramic green sheets to be the mounting portion 2a and the base body 2, by a metal processing method such as cutting, or It can be produced by molding a resin by injection molding or the like.

載置部２ａには、発光素子１が電気的に接続されるための電気接続用パターン（図示せず）が形成されている。この電気接続用パターンが基体２内部に形成された配線層（図示せず）を介してパッケージの外表面に導出されて外部電気回路基板に接続されることにより、発光素子１と外部電気回路とが電気的に接続されることとなる。 On the mounting portion 2a, an electrical connection pattern (not shown) for electrically connecting the light emitting element 1 is formed. The electrical connection pattern is led to the outer surface of the package through a wiring layer (not shown) formed inside the base body 2 and connected to the external electrical circuit board, whereby the light emitting element 1 and the external electrical circuit are connected. Are electrically connected.

発光素子１を電気接続用パターンに接続する方法としては、ワイヤボンディングを介して接続する方法、または、発光素子１の下面で半田バンプにより接続するフリップチップボンディング方式を用いた方法等が用いられる。好ましくは、フリップチップボンディング方式により接続するのがよい。これにより、電気接続用パターンを発光素子１の直下に設けることができるため、発光素子１の周辺の基体２の上面に電気接続用パターンを設けるためのスペースを設ける必要がなくなる。 As a method of connecting the light emitting element 1 to the electrical connection pattern, a method of connecting via wire bonding, a method using a flip chip bonding method of connecting the lower surface of the light emitting element 1 with a solder bump, or the like is used. Preferably, the connection is made by a flip chip bonding method. Thereby, since the electrical connection pattern can be provided immediately below the light emitting element 1, it is not necessary to provide a space for providing the electrical connection pattern on the upper surface of the base 2 around the light emitting element 1.

よって、発光素子１から発光された第１の光がこの基体２の電気接続用パターン用のスペースで吸収されて放射光強度が低下するのを有効に抑制することができる。 Therefore, it is possible to effectively suppress the first light emitted from the light emitting element 1 from being absorbed by the space for the electrical connection pattern of the base 2 and the intensity of the emitted light being lowered.

この電気接続用パターンは、例えば、Ｗ，Ｍｏ，Ｃｕ，Ａｇ等の金属粉末のメタライズ層を形成することによって、Ｆｅ−Ｎｉ−Ｃｏ合金等のリード端子を埋設することによって、または、配線導体が形成された絶縁体から成る入出力端子を基体２に設けた貫通孔に嵌着接合させることによって設けられる。 This electrical connection pattern can be formed, for example, by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag, by embedding a lead terminal such as an Fe-Ni-Co alloy, or when the wiring conductor is The input / output terminal made of the formed insulator is provided by being fitted and joined to a through hole provided in the base 2.

なお、電気接続用パターンの露出する表面には、Ｎｉや金（Ａｕ）等の耐食性に優れる金属を１〜20μｍ程度の厚さで被着させておくのが良く、電気接続用パターンの酸化腐食を有効に防止し得るともに、発光素子１と電気接続用パターンとの接続を強固にし得る。したがって、電気接続用パターンの露出表面には、例えば、厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのがより好ましい。 The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 1 and the electrical connection pattern can be strengthened. Therefore, for example, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

また、載置部２ａは、その上面で発光素子１の載置領域２ｂの周囲の部位から載置部２ａの側面の下端にかけて光反射層２ｃが形成されている。なお、図１〜４に示すように、光反射層２ｃは、発光素子１と電気的に接続される電気接続用パターンと絶縁されていれば発光素子１の載置領域２ｂの内側に形成されていても良い。これにより、発光素子１から発光された第１の光や反射面（第１の面）３ａから反射された光が発光素子１の下側に入り込んだとしても、載置領域２ｂの内側の光反射層２ｃで反射して載置領域２ｂで吸収されるのを有効に抑制することができる。 Further, the mounting portion 2a has a light reflection layer 2c formed on the upper surface thereof from a portion around the mounting region 2b of the light emitting element 1 to the lower end of the side surface of the mounting portion 2a. As shown in FIGS. 1 to 4, the light reflecting layer 2 c is formed inside the mounting region 2 b of the light emitting element 1 if it is insulated from the electrical connection pattern electrically connected to the light emitting element 1. May be. As a result, even if the first light emitted from the light emitting element 1 or the light reflected from the reflecting surface (first surface) 3a enters the lower side of the light emitting element 1, the light inside the placement region 2b. It is possible to effectively suppress reflection by the reflection layer 2c and absorption by the placement region 2b.

光反射層２ｃは、Ａｌ，Ａｇ，Ａｕ，白金（Ｐｔ），チタン（Ｔｉ），クロム（Ｃｒ），Ｃｕ等の光反射率の高い金属により形成される。具体的には、メッキ法やメタライズ法，蒸着法等により薄い金属層を形成することによって、または、メッキ法等よりも厚い金属板を載置部２ａの表面にＡｇロウや半田，エポキシ樹脂等により接合させることにより形成される。 The light reflecting layer 2c is formed of a metal having a high light reflectance such as Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr), and Cu. Specifically, a thin metal layer is formed by a plating method, a metallizing method, a vapor deposition method or the like, or a metal plate thicker than the plating method is formed on the surface of the mounting portion 2a by Ag brazing, solder, epoxy resin, or the like. Formed by bonding.

光反射層２ｃをメッキ法やメタライズ法，蒸着法等により形成した薄い金属層とした場合、載置部２ａと光反射層２ｃとの熱膨張差が生じても薄い光反射層２ｃが載置部２ａに与える応力は非常に小さいため、光反射層２ｃが載置部２ａから剥がれる等の問題を有効に抑制できる。また、非常に微細な加工，形成ができるためＡｕ−Ｓｎバンプと光反射層２ｃとの電気的ショートを容易に回避できる。 When the light reflecting layer 2c is a thin metal layer formed by plating, metallizing, vapor deposition or the like, the thin light reflecting layer 2c is placed even if a difference in thermal expansion occurs between the placing portion 2a and the light reflecting layer 2c. Since the stress applied to the portion 2a is very small, problems such as the light reflecting layer 2c peeling off from the placement portion 2a can be effectively suppressed. In addition, since very fine processing and formation can be performed, an electrical short circuit between the Au—Sn bump and the light reflecting layer 2c can be easily avoided.

また、光反射層２ｃを金属板とした場合、載置部２ａの粗さが比較的粗い表面に形成された薄い金属層の場合に比し、表面状態の算術平均粗さが非常に小さく密であるため、発光素子１の光が載置部２ａの表面の粗さに起因した乱反射を生じるのを有効に抑制でき、放射光強度および輝度の劣化を有効に防止できる。 Further, when the light reflecting layer 2c is a metal plate, the arithmetic average roughness of the surface state is very small and dense as compared with the case of the thin metal layer formed on the surface where the mounting portion 2a is relatively rough. Therefore, it is possible to effectively suppress the irregular reflection caused by the light of the surface of the mounting portion 2a by the light of the light emitting element 1, and to effectively prevent the deterioration of the emitted light intensity and the luminance.

さらに、光反射層２ｃが金属板である場合には、光反射層２ｃの熱伝導率がより大きくなるため、発光素子１から発生した熱がＡｕ−Ｓｎバンプ等の半田バンプを介して載置部２ａに伝わった後、その熱を光反射層２ｃで効率よく放散できる。その結果、発光素子１の作動性が劣化するのを有効に抑制できる。 Further, when the light reflecting layer 2c is a metal plate, the heat conductivity of the light reflecting layer 2c is increased, so that the heat generated from the light emitting element 1 is placed via a solder bump such as an Au-Sn bump. After being transmitted to the part 2a, the heat can be efficiently dissipated by the light reflecting layer 2c. As a result, it is possible to effectively suppress the deterioration of the operability of the light emitting element 1.

また、基体２の上面には、反射部材３が半田，Ａｇロウ等のロウ材やエポキシ樹脂等の接着剤等の接合材により取着される。反射部材３は、基体２の上面の載置部２ａ以外の如何なる部位に取着されてもよいが、発光素子１の周囲に所望の面精度（例えば、パッケージの断面において、発光素子１を間に挟んで発光素子１の両側に設けられた反射面３ａが対称になっている状態）で反射面３ａが設けられるように取着されるのがよい。これにより、発光素子１からの光を反射面３ａで均一にむらなく反射させることができ、放射光強度および輝度を効果的に向上させることができる。 Further, the reflecting member 3 is attached to the upper surface of the base 2 by a bonding material such as solder, a brazing material such as Ag brazing, or an adhesive such as an epoxy resin. The reflecting member 3 may be attached to any part other than the mounting portion 2a on the upper surface of the base 2, but a desired surface accuracy around the light emitting element 1 (for example, the light emitting element 1 is interposed in the package cross section). The reflective surface 3a is preferably attached so that the reflective surface 3a is provided in a state in which the reflective surfaces 3a provided on both sides of the light-emitting element 1 are symmetrical. Thereby, the light from the light emitting element 1 can be uniformly reflected by the reflective surface 3a, and the emitted light intensity and the brightness can be effectively improved.

本発明の載置部２ａは、基体２の上面より突出していることから、この載置部２ａを基準として反射部材３を位置精度よく取着することができる。また、載置部２ａは、その側面に反射部材３の内周面の下端が接触するように反射部材３が基体２の上面に取着されているので、反射部材３を基体２に取着する際に加えられる熱によって生じる反射部材３の熱膨張を阻止して反射部材３の熱歪み（反射面３ａ表面の熱歪み、および反射部材３自体の熱歪みによる位置ずれ）を有効に抑制する機能を有する。よって載置部２ａは、反射部材３に対する熱膨張抑制材として機能する。 Since the mounting portion 2a of the present invention protrudes from the upper surface of the base 2, the reflecting member 3 can be attached with high positional accuracy using the mounting portion 2a as a reference. Moreover, since the reflecting member 3 is attached to the upper surface of the base 2 so that the lower end of the inner peripheral surface of the reflecting member 3 contacts the side surface of the mounting portion 2a, the reflecting member 3 is attached to the base 2 The thermal expansion of the reflecting member 3 caused by the heat applied at the time is prevented, and the thermal distortion of the reflecting member 3 (the positional deviation due to the thermal distortion of the reflecting surface 3a and the thermal distortion of the reflecting member 3 itself) is effectively suppressed. It has a function. Therefore, the mounting portion 2 a functions as a thermal expansion suppressing material for the reflecting member 3.

このような反射部材３の熱膨張抑制機能によって、基体２および反射部材３として互いに熱膨張や硬度が大きく異なる材料を用いることができる。例えば硬質なアルミナセラミックスを基体２として、軟質なＡｌを反射部材３として互いに接合しても、載置部２ａが熱膨張抑制材として有効に機能して、反射部材３の歪みを有効に抑制することができる。これによって、硬質なアルミナセラミックスからなる基体２によりパッケージを高強度にすることができるとともに、軟質で加工が容易な高熱伝導性のＡｌからなる反射部材３により、反射面３ａを良好な反射特性を有するものとし、また、発光素子１から発生した熱を良好に放散し得るものとすることができる。 Due to the thermal expansion suppressing function of the reflecting member 3, materials having greatly different thermal expansion and hardness can be used as the base 2 and the reflecting member 3. For example, even if hard alumina ceramic is used as the base 2 and soft Al is used as the reflecting member 3, the mounting portion 2 a functions effectively as a thermal expansion suppressing material and effectively suppresses distortion of the reflecting member 3. be able to. As a result, the strength of the package can be increased by the base 2 made of hard alumina ceramics, and the reflective surface 3a can be made to have good reflection characteristics by the reflective member 3 made of Al that is soft and easy to process. In addition, the heat generated from the light emitting element 1 can be dissipated well.

載置部２ａは、特に図３に示すように、反射部材３の第１の面３ａの下方に配置された第２の面が載置部２ａに接触する面積が大きいほど、反射部材３が載置部２ａの側面をより広範囲に覆うことができるため、発光素子１から発光された光が載置部２ａに吸収されるのをより有効に抑制することができ、放射光強度，輝度をより向上させることができる。また、発光素子１が作動時に発する熱を載置部２ａから反射部材３に効率よく伝達できるため、発光素子１の作動性の劣化をより有効に防止し得る。 As shown in FIG. 3 in particular, the mounting portion 2a has a larger area in which the second surface disposed below the first surface 3a of the reflecting member 3 is in contact with the mounting portion 2a. Since the side surface of the mounting portion 2a can be covered in a wider range, the light emitted from the light emitting element 1 can be more effectively suppressed from being absorbed by the mounting portion 2a, and the emitted light intensity and luminance can be reduced. It can be improved further. Further, since heat generated by the light emitting element 1 during operation can be efficiently transmitted from the mounting portion 2 a to the reflecting member 3, deterioration of the operability of the light emitting element 1 can be more effectively prevented.

なお、載置部２ａが基体２の上面から突出していない場合、すなわち発光素子１を基体２に搭載し、発光素子１のごく近傍まで反射部材３の内周面を延出した場合、基体２と反射部材３とを取着する接合材が、厚さの非常に薄い発光素子１の表面や反射面３ａ表面まで這い上がってくるため、発光素子１の発光機能や反射面３ａの反射機能を劣化させるという問題を生じた。また、反射部材３と基体２との接合時の反射部材３の熱膨張により、反射部材３が発光素子１を圧縮し発光素子１を破損させるという問題も生じた。 When the mounting portion 2 a does not protrude from the upper surface of the base 2, that is, when the light emitting element 1 is mounted on the base 2 and the inner peripheral surface of the reflecting member 3 extends to the very vicinity of the light emitting element 1, the base 2 And the reflecting member 3 are attached to the surface of the light emitting element 1 and the reflecting surface 3a, which are very thin, so that the light emitting function of the light emitting element 1 and the reflecting function of the reflecting surface 3a are improved. The problem of deteriorating occurred. In addition, due to the thermal expansion of the reflecting member 3 when the reflecting member 3 and the substrate 2 are joined, the reflecting member 3 compresses the light emitting element 1 and damages the light emitting element 1.

これに対して、本発明のパッケージの場合には、基体２と反射部材３とを接合する接合材は、反射部材３と載置部２ａ側面とが接触されているわずかな隙間に多少入り込むものの、この隙間を完全に埋めるものではなく、隙間にとどまって発光素子１表面や反射面３ａ表面にまで這い上がってくることはなかった。このように、反射部材３と載置部２ａ側面とが接触されているわずかな隙間は、基体２と反射部材３とを接合する接合材が発光素子１表面や反射面３ａ表面に達するのを防止するための、いわゆる接合材ダムとして機能することが分かった。 On the other hand, in the case of the package of the present invention, the bonding material for bonding the base body 2 and the reflecting member 3 slightly enters the slight gap where the reflecting member 3 and the side surface of the mounting portion 2a are in contact. However, this gap was not completely filled, and it did not crawl up to the surface of the light emitting element 1 or the reflecting surface 3a without staying in the gap. Thus, the slight gap where the reflecting member 3 and the side surface of the mounting portion 2a are in contact with each other allows the bonding material for bonding the base 2 and the reflecting member 3 to reach the surface of the light emitting element 1 or the surface of the reflecting surface 3a. It has been found that it functions as a so-called bonding material dam for prevention.

なお、光反射層２ｃと反射部材３とがロウ材や樹脂等により接合されている場合であっても、基体２と反射部材３とを接合する接合材が這い上がってくるのを防止できることになるが、この場合には、基体２と反射部材３との接合時に、光反射層２ｃと反射部材３との熱膨張差により反射面３ａが熱歪みを起こし易くなる。すなわち、光反射層２ｃと反射部材３との接合部位が反射面３ａに隣接しているため、その接合時における熱膨張差の影響を反射面３ａが直接的に受けることになり、反射面３ａが熱歪みを起こし易くなる。その結果、熱歪みを起こした反射面３ａにより放射光強度や輝度が劣化し易くなる。 Even when the light reflecting layer 2c and the reflecting member 3 are bonded with a brazing material or a resin, it is possible to prevent the bonding material for bonding the base 2 and the reflecting member 3 from creeping up. In this case, however, the reflective surface 3a is likely to be thermally distorted due to a difference in thermal expansion between the light reflecting layer 2c and the reflecting member 3 when the base 2 and the reflecting member 3 are joined. That is, since the joining portion between the light reflecting layer 2c and the reflecting member 3 is adjacent to the reflecting surface 3a, the reflecting surface 3a is directly affected by the difference in thermal expansion during the joining, and the reflecting surface 3a. Tends to cause thermal distortion. As a result, the intensity and brightness of the radiated light easily deteriorate due to the reflective surface 3a that has undergone thermal distortion.

つまり、反射部材３と載置部２ａの側面の光反射層２ｃとが接触しているわずかな隙間は、基体２と反射部材３との接合時における熱応力を緩和する応力緩衝機能をも有する。 In other words, the slight gap where the reflecting member 3 and the light reflecting layer 2c on the side surface of the mounting portion 2a are in contact also has a stress buffering function to relieve the thermal stress when the base 2 and the reflecting member 3 are joined. .

よって、光反射層２ｃと反射部材３とは接触しているだけで、接合されていないことが重要である。また、基体２と反射部材３との熱膨張差による応力が反射面３ａに伝わり難くするため、反射面３ａは基体２と反射部材３との接合面から離れているのがよい。つまり、反射面３ａは、図３，４に示すように、反射部材３の内周面における傾斜面の表面に設けられており、その反射面３ａの下辺（傾斜面の下辺）が、できるだけ載置部２ａの側面の上方に位置しているほうが良い（載置部２ａの側面と反射部材３との隙間をできるだけ高くしておくほうが良い）。 Therefore, it is important that the light reflecting layer 2c and the reflecting member 3 are in contact with each other but not joined. Further, in order to make it difficult for stress due to the difference in thermal expansion between the base 2 and the reflecting member 3 to be transmitted to the reflecting surface 3 a, the reflecting surface 3 a is preferably separated from the joint surface between the base 2 and the reflecting member 3. That is, as shown in FIGS. 3 and 4, the reflecting surface 3a is provided on the surface of the inclined surface on the inner peripheral surface of the reflecting member 3, and the lower side of the reflecting surface 3a (the lower side of the inclined surface) is mounted as much as possible. It is better to be located above the side surface of the mounting portion 2a (the gap between the side surface of the mounting portion 2a and the reflecting member 3 should be as high as possible).

なお、載置部２ａの高さは、接合材の体積や基体２上面と反射部材３下面との距離，放射光強度，輝度，熱伝達効率，接合材ダム機能を考慮したうえで適宜選定される。 The height of the mounting portion 2a is appropriately selected in consideration of the volume of the bonding material, the distance between the upper surface of the substrate 2 and the lower surface of the reflecting member 3, the intensity of the radiated light, the luminance, the heat transfer efficiency, and the bonding material dam function. The

一方、載置部２ａの基体２の上面に平行な長さは、基体２と反射部材３との接合時における熱歪み（反射面３ａ表面の熱歪み、および反射部材３自体の熱歪みによる位置ずれ）を有効に抑制し得る大きさであれば良く、基体２，反射部材３の大きさにより適宜選定される。 On the other hand, the length of the mounting portion 2a parallel to the upper surface of the base 2 is the position due to thermal strain (bonding of the surface of the reflective surface 3a and the thermal strain of the reflective member 3 itself) when the base 2 and the reflective member 3 are joined. The size of the base 2 and the reflecting member 3 is appropriately selected as long as the size can effectively suppress the deviation).

また、反射部材３は、内周面が上側に向かうに伴って外側に広がるように傾斜しているとともに内周面が発光素子１が発光する光を反射する反射面３ａとされている枠状体であり、その内周面の下端が載置部２ａの側面と接している。 Further, the reflecting member 3 is inclined so that the inner peripheral surface spreads outward as it goes upward, and the inner peripheral surface is a frame-like shape that reflects the light emitted by the light emitting element 1. The lower end of the inner peripheral surface is in contact with the side surface of the mounting portion 2a.

反射部材３は、この構成により、基体２上面（載置部２ａの外側周辺部）に反射面３ａが広範囲に形成されることになるため、発光素子１の光が基体２上面に吸収，透過されるのを効果的に抑制できる。すなわち、従来構成（図６）に比し反射面３ａにて光を反射する面積が非常に増大するため、放射光強度や輝度を著しく向上できる。 With this configuration, the reflecting member 3 has the reflecting surface 3a formed in a wide range on the upper surface of the base 2 (outer peripheral portion of the mounting portion 2a), so that the light of the light emitting element 1 is absorbed and transmitted to the upper surface of the base 2 Can be effectively suppressed. That is, since the area where light is reflected by the reflecting surface 3a is greatly increased as compared with the conventional configuration (FIG. 6), the intensity of emitted light and the luminance can be significantly improved.

なお、反射部材３は、内周面において少なくとも傾斜面の表面に発光素子１の光を高い反射率で反射させ得る反射面３ａを有している。このような反射面３ａは、Ａｌ，Ａｇ，Ａｕ，Ｐｔ，Ｔｉ，Ｃｒ，Ｃｕ等の高反射率の金属から成る。 In addition, the reflection member 3 has the reflective surface 3a which can reflect the light of the light emitting element 1 with a high reflectance at least on the surface of the inclined surface on the inner peripheral surface. Such a reflective surface 3a is made of a highly reflective metal such as Al, Ag, Au, Pt, Ti, Cr, Cu.

反射面３ａは、反射部材３が金属からなる場合、反射部材３に対して切削加工や金型成形等を行うことにより形成される。あるいは、反射部材３がセラミックスや樹脂等の絶縁体からなる場合（反射部材３が金属の場合も含む）、メッキや蒸着等により金属薄膜を形成することにより反射面３ａを形成してもよい。なお、反射面３ａがＡｇやＣｕ等の酸化により変色し易い金属からなる場合には、その表面に、例えば厚さ１〜10μｍ程度のＮｉメッキ層と厚さ0.1〜３μｍ程度のＡｕメッキ層とが電解メッキ法や無電解メッキ法により順次被着されているのが良い。これにより反射面３ａの耐腐食性が向上する。 When the reflecting member 3 is made of metal, the reflecting surface 3a is formed by performing cutting or molding on the reflecting member 3. Alternatively, when the reflecting member 3 is made of an insulator such as ceramics or resin (including the case where the reflecting member 3 is a metal), the reflecting surface 3a may be formed by forming a metal thin film by plating or vapor deposition. When the reflecting surface 3a is made of a metal that is easily discolored by oxidation such as Ag or Cu, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are formed on the surface. Is preferably deposited sequentially by electrolytic plating or electroless plating. Thereby, the corrosion resistance of the reflective surface 3a improves.

また、反射面３ａ表面の算術平均粗さＲａは、0.004〜４μｍであるのが良く、これにより、反射面３ａが発光素子１の光を良好に反射し得る。Ｒａが４μｍを超えると、発光素子１の光を均一に反射させ得ず、パッケージ内部で乱反射する。一方、0.004μｍ未満では、そのような面を安定かつ効率良く形成することが困難となる傾向にある。 In addition, the arithmetic average roughness Ra of the surface of the reflecting surface 3a is preferably 0.004 to 4 μm, whereby the reflecting surface 3a can reflect the light of the light emitting element 1 well. When Ra exceeds 4 μm, the light of the light emitting element 1 cannot be reflected uniformly, and is irregularly reflected inside the package. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

また、反射面３ａは、その表面が図１，３に示すように平坦（直線状）であってもよく、また、図４に示すように円弧状（曲線状）であってもよい。好ましくは、円弧状とするのがよく、これにより、発光素子１の光を万遍なく反射させて外部に均一に放射することができる。 Further, the reflection surface 3a may have a flat surface (linear shape) as shown in FIGS. 1 and 3, or may have an arc shape (curve shape) as shown in FIG. Preferably, it is in the shape of an arc, whereby the light from the light emitting element 1 can be uniformly reflected and radiated uniformly to the outside.

かくして、本発明の発光装置は、載置部２ａ上面の載置領域２ｂにフリップチップ方式等により発光素子１を載置固定した後、反射部材３を、内周面の下端が載置部２ａの側面に接触されるように基体２の上面に接合し、しかる後、反射部材３の内部に発光素子１を覆うようにシリコーン樹脂等からなる透光性部材（図示せず）を設けることにより発光装置となる。 Thus, in the light emitting device of the present invention, after the light emitting element 1 is placed and fixed on the placement region 2b on the top surface of the placement portion 2a by the flip chip method or the like, the reflecting member 3 is placed on the placement portion 2a at the lower end of the inner peripheral surface. By joining to the upper surface of the base 2 so as to be in contact with the side surface of the substrate, and then providing a translucent member (not shown) made of silicone resin or the like so as to cover the light emitting element 1 inside the reflecting member 3. It becomes a light emitting device.

また、本発明の発光装置は、１個のものを所定の配置となるように設置したことにより、または複数個を、例えば、格子状や千鳥状，放射状，複数の発光装置から成る、円状や多角形状の発光装置群を同心状に複数群形成したもの等の所定の配置となるように設置したことにより、照明装置とすることができる。これにより、半導体から成る発光素子１の電子の再結合による発光を利用しているため、従来の放電を用いた照明装置よりも低消費電力かつ長寿命とすることが可能であり、発熱の小さな小型の照明装置とすることができる。その結果、発光素子１から発生する光の中心波長の変動を抑制することができ、長期間にわたり安定した放射光強度かつ放射光角度（配光分布）で光を照射することができるとともに、照射面における色むらや照度分布の偏りが抑制された照明装置とすることができる。 In addition, the light emitting device of the present invention is a circular shape in which one device is installed in a predetermined arrangement, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, or a plurality of light emitting devices. In addition, a lighting device can be obtained by installing the light emitting device groups in a plurality of concentric shapes so as to have a predetermined arrangement. Thereby, since light emission by recombination of electrons of the light emitting element 1 made of a semiconductor is used, it is possible to achieve lower power consumption and longer life than a lighting device using a conventional discharge, and generate less heat. It can be set as a small illuminating device. As a result, fluctuations in the center wavelength of the light generated from the light emitting element 1 can be suppressed, and light can be emitted with a stable radiant light intensity and radiant light angle (light distribution distribution) over a long period of time. It can be set as the illuminating device by which the color nonuniformity in the surface and the bias of illuminance distribution were suppressed.

また、本発明の発光装置を光源として所定の配置に設置するとともに、これらの発光装置の周囲に任意の形状に光学設計した反射治具や光学レンズ、光拡散板等を設置することにより、任意の配光分布の光を放射できる照明装置とすることができる。 In addition, the light emitting device of the present invention is installed in a predetermined arrangement as a light source, and by installing a reflection jig, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, It can be set as the illuminating device which can radiate | emit the light of this light distribution.

例えば、図７，図８に示す平面図，断面図のように複数個の発光装置４が発光装置駆動回路基板６に複数列に配置され、発光装置４の周囲に任意の形状に光学設計した反射治具５が設置されて成る照明装置の場合、隣接する一列上に配置された複数個の発光装置４において、隣り合う発光装置４との間隔が最短に成らないような配置、いわゆる千鳥状とすることが好ましい。 For example, a plurality of light emitting devices 4 are arranged in a plurality of rows on the light emitting device driving circuit board 6 as shown in the plan view and the cross-sectional view shown in FIGS. 7 and 8, and are optically designed in an arbitrary shape around the light emitting device 4. In the case of an illuminating device in which the reflecting jig 5 is installed, in a plurality of light emitting devices 4 arranged on one adjacent row, an arrangement in which the interval between adjacent light emitting devices 4 is not shortest, a so-called staggered pattern It is preferable that

即ち、発光装置４が格子状に配置される際には、光源となる発光装置４が直線上に配列されることによりグレアが強くなり、このような照明装置が人の視覚に入ってくることにより、不快感や目の障害を起こしやすくなるのに対し、千鳥状とすることにより、グレアが抑制され人間の目に対する不快感や目に及ぼす障害を低減することができる。 That is, when the light emitting devices 4 are arranged in a grid, the glare is strengthened by arranging the light emitting devices 4 serving as light sources on a straight line, and such a lighting device enters human vision. Thus, discomfort and eye damage are likely to occur, but by forming a staggered pattern, glare is suppressed and discomfort and damage to the eyes of the human eye can be reduced.

さらに、隣り合う発光装置４間の距離が長くなることにより、隣接する発光装置４間の熱的な干渉が有効に抑制され、発光装置４が実装された発光装置駆動回路基板６内における熱のこもりが抑制され、発光装置４の外部に効率よく熱が放散される。 Furthermore, since the distance between the adjacent light emitting devices 4 is increased, thermal interference between the adjacent light emitting devices 4 is effectively suppressed, and heat in the light emitting device driving circuit board 6 on which the light emitting devices 4 are mounted is reduced. Clouding is suppressed and heat is efficiently dissipated outside the light emitting device 4.

その結果、人の目に対しても障害の小さい長期間にわたり光学特性の安定した長寿命の照明装置を作製することができる。 As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with less obstacles to human eyes.

また、照明装置が、図９，図10に示す平面図，断面図のような発光装置駆動回路基板６上に複数の発光装置４から成る円状や多角形状の発光装置４群を、同心状に複数群形成した照明装置の場合、１つの円状や多角形状の発光装置４群における発光装置４の配置数を照明装置の中央側より外周側ほど多くすることが好ましい。これにより、発光装置４同士の間隔を適度に保ちながら発光装置４をより多く配置することができ、照明装置の照度をより向上させることができる。また、照明装置の中央部の発光装置４の密度を低くして発光装置駆動回路基板６の中央部における熱のこもりを抑制することができる。よって、発光装置駆動回路基板６内における温度分布が一様となり、照明装置を設置した外部電気回路基板やヒートシンクに効率よく熱が伝達され、発光装置４の温度上昇を抑制することができる。その結果、発光装置４は長期間にわたり安定して動作することができるとともに長寿命の照明装置を作製することができる。 In addition, the lighting device is a concentric arrangement of circular or polygonal light emitting device groups of a plurality of light emitting devices 4 on the light emitting device driving circuit board 6 as shown in the plan view and the cross-sectional view shown in FIGS. In the case of the illuminating device formed in a plurality of groups, it is preferable that the number of light emitting devices 4 arranged in one circular or polygonal light emitting device 4 group is increased from the center side of the illuminating device toward the outer peripheral side. Thereby, more light-emitting devices 4 can be arrange | positioned maintaining the space | interval of light-emitting devices 4 moderately, and the illumination intensity of an illuminating device can be improved more. Moreover, the density of the light-emitting device 4 in the central part of the lighting device can be reduced to suppress heat accumulation in the central part of the light-emitting device drive circuit board 6. Therefore, the temperature distribution in the light emitting device drive circuit board 6 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 4 can be suppressed. As a result, the light emitting device 4 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

このような照明装置としては、例えば、室内や室外で用いられる、一般照明用器具、シャンデリア用照明器具、住宅用照明器具、オフィス用照明器具、店装，展示用照明器具、街路用照明器具、誘導灯器具及び信号装置、舞台及びスタジオ用の照明器具、広告灯、照明用ポール、水中照明用ライト、ストロボ用ライト、スポットライト、電柱等に埋め込む防犯用照明、非常用照明器具、懐中電灯、電光掲示板等や、調光器、自動点滅器、ディスプレイ等のバックライト、動画装置、装飾品、照光式スイッチ、光センサ、医療用ライト、車載ライト等が挙げられる。 Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, street lighting fixtures, used indoors and outdoors. Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights, Examples include electronic bulletin boards and the like, backlights for dimmers, automatic flashers, displays and the like, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

本発明のパッケージおよび発光装置について以下に実施例を示す。 Examples of the package and the light emitting device of the present invention are shown below.

まず、基体２となるアルミナセラミックス基板を準備した。なお、基体２は載置部２ａとなる部位も一体的に形成されており、載置部２ａの上面と載置部２ａ以外の部位の基体２の上面とを平行にした。 First, an alumina ceramic substrate to be the base 2 was prepared. In addition, the base | substrate 2 also integrally formed the site | part used as the mounting part 2a, and made the upper surface of the mounting part 2a and the upper surface of the base | substrate 2 other than the mounting part 2a in parallel.

基体２は、幅８ｍｍ×奥行き８ｍｍ×厚さ0.5ｍｍの直方体の上面中央部に幅0.35ｍｍ×奥行き0.35ｍｍ×厚さ0.15ｍｍの直方体の載置部２ａが形成されたものであった。 The base body 2 was obtained by forming a rectangular parallelepiped mounting portion 2a having a width of 0.35 mm, a depth of 0.35 mm, and a thickness of 0.15 mm at the center of the upper surface of a rectangular parallelepiped having a width of 8 mm, a depth of 8 mm, and a thickness of 0.5 mm.

また、載置部２ａの上面で発光素子１の載置領域２ｂに、発光素子１と外部電気回路基板とを基体２の内部に形成した内部配線を介して電気的に接続するための電気接続用パターンを形成した。電気接続用パターンは、Ｍｏ−Ｍｎ粉末からなるメタライズ層により0.1ｍｍΦの円形パッドに成形され、その表面には厚さ３μｍのＮｉメッキ層と厚さ２μｍのＡｕメッキ層とが被着された。また、基体２内部の内部配線は、貫通導体からなる電気接続部、いわゆるスルーホールによって形成された。このスルーホールについても電気接続用パターンと同様にＭｏ−Ｍｎ粉末からなるメタライズ導体で成形された。 In addition, an electrical connection for electrically connecting the light emitting element 1 and the external electric circuit board to the mounting region 2b of the light emitting element 1 on the upper surface of the mounting portion 2a through an internal wiring formed inside the base body 2. A pattern was formed. The electrical connection pattern was formed into a 0.1 mmφ circular pad by a metallized layer made of Mo—Mn powder, and a 3 μm thick Ni plating layer and a 2 μm thick Au plating layer were deposited on the surface. Further, the internal wiring inside the base body 2 was formed by an electrical connection portion made of a through conductor, a so-called through hole. This through hole was also formed with a metallized conductor made of Mo-Mn powder in the same manner as the electrical connection pattern.

さらに、基体２上面の載置部２ａ以外の部位の全面に、基体２と反射部材３とをＡｕ−錫（Ｓｎ）ロウにより接合するための接合部を形成した。この接合部は、Ｍｏ−Ｍｎ粉末からなるメタライズ層の表面に厚さ３μｍのＮｉメッキ層と厚さ２μｍのＡｕメッキ層とが被着されたものであった。 Further, a joining portion for joining the base 2 and the reflecting member 3 with Au—tin (Sn) brazing was formed on the entire surface of the portion other than the mounting portion 2 a on the top surface of the base 2. This joint was obtained by depositing a Ni plating layer having a thickness of 3 μm and an Au plating layer having a thickness of 2 μm on the surface of a metallized layer made of Mo—Mn powder.

また、載置部２ａの側面および上面の電気接続用パターンを除く部位に、Ｍｏ−Ｍｎ粉末からなるメタライズ層（第１の層）を形成した後、その表面に厚さ３μｍのＮｉメッキ層（第２の層）と厚さ２μｍのＡｕメッキ層とを被着し、発光素子１の光を反射し得る光反射層２ｃを形成した。 In addition, after forming a metallized layer (first layer) made of Mo-Mn powder on the portion excluding the electrical connection pattern on the side surface and the upper surface of the mounting portion 2a, a Ni plating layer having a thickness of 3 μm is formed on the surface (first layer). A second layer) and an Au plating layer having a thickness of 2 μm were deposited to form a light reflecting layer 2 c that can reflect the light of the light emitting element 1.

さらにまた、反射部材３を用意した。反射部材３は、内周面の最上端（パッケージとした際の最上端部位）の直径が６ｍｍで高さが1.5ｍｍであり、内周面の下端（載置部２ａの側面に接触される部位）の高さ（基体２上面に接合される下面から内周面の傾斜面の下辺までの高さ）が0.1ｍｍであった。さらに、内周面における傾斜面は、基体２上面に対してなす角度が45度の平坦な面とされ、その傾斜面の表面が、Ｒａが0.1μｍの反射面３ａとされた。 Furthermore, the reflection member 3 was prepared. The reflecting member 3 has a diameter of 6 mm and a height of 1.5 mm at the uppermost end (uppermost end portion when packaged) of the inner peripheral surface, and is in contact with the lower end of the inner peripheral surface (side surface of the mounting portion 2a). The height of the portion) (the height from the lower surface joined to the upper surface of the base 2 to the lower side of the inclined surface of the inner peripheral surface) was 0.1 mm. Further, the inclined surface on the inner peripheral surface was a flat surface having an angle of 45 degrees with respect to the upper surface of the substrate 2, and the surface of the inclined surface was the reflecting surface 3a with Ra of 0.1 μm.

次に、発光素子１にＡｕ−Ｓｎバンプを設けておき、このＡｕ−Ｓｎバンプを介して発光素子１を電気接続用パターンに接合するとともに、反射部材３を基体２の上面の接合部にＡｕ−Ｓｎロウで接合した。このとき、基体２と反射部材３との接合は、反射部材３の内周面の下端（反射面３ａの下辺）が載置部２ａの側面の光反射層２ｃに接触するようにした。 Next, an Au—Sn bump is provided on the light emitting element 1, and the light emitting element 1 is bonded to the electrical connection pattern via the Au—Sn bump, and the reflecting member 3 is attached to the bonding portion on the upper surface of the base 2. -Joined with Sn solder. At this time, the base 2 and the reflecting member 3 were joined such that the lower end of the inner peripheral surface of the reflecting member 3 (the lower side of the reflecting surface 3a) was in contact with the light reflecting layer 2c on the side surface of the mounting portion 2a.

このようにして作製したパッケージについて、反射部材３と光反射層２ｃとの接触部を断面観察したところ、反射部材３と光反射層２ｃとが接触しているわずかな隙間にＡｕ−Ｓｎロウが多少入り込んでいるのを確認したが、この隙間を完全に埋めるものではなく、Ａｕ−Ｓｎロウはその隙間にとどまって発光素子１までは這い上がっていなかった。つまり、反射部材３と光反射層２ｃとが接触されているわずかな隙間は、Ａｕ−Ｓｎロウを発光素子１まで這い上がらせない、いわゆる接合材ダムとして機能することがわかった。 When the cross section of the contact portion between the reflecting member 3 and the light reflecting layer 2c was observed with respect to the package manufactured in this manner, Au—Sn solder was found in a slight gap where the reflecting member 3 and the light reflecting layer 2c were in contact. Although some penetration was confirmed, this gap was not completely filled, and the Au—Sn brazing stayed in the gap and did not crawl up to the light emitting element 1. That is, it was found that the slight gap where the reflecting member 3 and the light reflecting layer 2c are in contact functions as a so-called bonding material dam that prevents the Au—Sn brazing from reaching up to the light emitting element 1.

一方、載置部２ａを形成しないこと以外は上記と同様にして作製した比較用のパッケージについて、同様の評価を行なったところ、Ａｕ−Ｓｎロウが発光素子１の発光部まで這い上がり、発光強度が低下しているのが確認された。よって、本発明のパッケージが優れていることがわかった。 On the other hand, when a similar evaluation was performed on a comparative package manufactured in the same manner as described above except that the mounting portion 2a was not formed, the Au—Sn solder creeped up to the light emitting portion of the light emitting element 1, and the light emission intensity. Was confirmed to be decreasing. Therefore, it was found that the package of the present invention is excellent.

なお、本発明は以上の実施の形態の例および実施例に限定されず、本発明の要旨を逸脱しない範囲内であれば種々の変更を行なうことは何等支障ない。 It should be noted that the present invention is not limited to the above-described embodiments and examples, and various modifications can be made without departing from the scope of the present invention.

例えば、図５に部分拡大断面図を示すように、反射部材３の光反射層２ｃに接触する部位の下端部を切り欠いて切欠き部３ｂを形成してもよい。 For example, as shown in a partially enlarged cross-sectional view in FIG. 5, the notched portion 3 b may be formed by notching the lower end portion of the reflecting member 3 that contacts the light reflecting layer 2 c.

これにより、切欠き部３ｂ，光反射層２ｃおよび基体２上面の接合部（メタライズ層）で囲まれる空間（接合材ダム）を形成することができ、基体２と反射部材３とを接合するための接合材を溜めることができる。この接合材ダムにより、基体２と反射部材３とを接合する接合材の量が非常に多い場合であっても、接合材が光反射層２ｃと反射部材３との隙間に入り込むのを有効に防止できる。したがって、切欠き部３ｂは、基体２と反射部材３とを接合した場合に、光反射層２ｃと反射部材３との間に常に隙間を設けさせておく機能を有し、基体２と反射部材３との接合時における熱応力を緩和する応力緩衝機能を十分に発揮させ得る。 Thereby, a space (bonding material dam) surrounded by the notch 3b, the light reflecting layer 2c, and the joint (metallized layer) on the upper surface of the base 2 can be formed, and the base 2 and the reflecting member 3 are joined. It is possible to store the bonding material. This bonding material dam effectively allows the bonding material to enter the gap between the light reflecting layer 2c and the reflecting member 3 even when the amount of the bonding material for bonding the base 2 and the reflecting member 3 is very large. Can be prevented. Therefore, the notch 3b has a function of always providing a gap between the light reflecting layer 2c and the reflecting member 3 when the base 2 and the reflecting member 3 are joined. 3 can sufficiently exert a stress buffering function to relieve thermal stress at the time of joining to the steel plate 3.

また、本発明の照明装置は、複数個の発光装置４を所定の配置となるように設置したものだけでなく、１個の発光装置４を所定の配置となるように設置したものでもよい。 In addition, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 4 are installed in a predetermined arrangement, but may be one in which one light emitting device 4 is installed in a predetermined arrangement.

本発明の発光素子収納用パッケージの実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light emitting element storage package of this invention. 図１の発光素子収納用パッケージの部分拡大断面図である。FIG. 2 is a partially enlarged cross-sectional view of the light emitting element storage package of FIG. 1. 本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. 本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。It is sectional drawing which shows the other example of embodiment of the light emitting element storage package of this invention. 本発明の発光素子収納用パッケージの実施の形態の他の例を示す部分拡大断面図である。It is a partial expanded sectional view which shows the other example of embodiment of the light emitting element storage package of this invention. 従来の発光素子収納用パッケージの断面図である。It is sectional drawing of the conventional package for light emitting element accommodation. 本発明の照明装置の実施の形態の一例を示す平面図である。It is a top view which shows an example of embodiment of the illuminating device of this invention. 図７の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG. 本発明の照明装置の実施の形態の他の例を示す平面図である。It is a top view which shows the other example of embodiment of the illuminating device of this invention. 図９の照明装置の断面図である。It is sectional drawing of the illuminating device of FIG.

Explanation of symbols

１：発光素子
２：基体
２ａ：載置部
２ｂ：載置領域
２ｃ：光反射層
３：反射部材
３ａ：反射面（第１の面）
４：発光装置
５：反射治具
６：発光装置駆動回路基板 1: Light-emitting element 2: Base 2a: Placement portion 2b: Placement region 2c: Light reflection layer 3: Reflection member 3a: Reflection surface (first surface)
4: Light emitting device 5: Reflective jig 6: Light emitting device drive circuit board

Claims

A light emitting element;
A base including a mounting portion for the light emitting element protruding upward;
An electrical connection pattern formed on the mounting portion and electrically connected to the light emitting element;
Provided separately from the electrical connection pattern, a light reflecting layer made of a metal material formed on the side surface and the upper surface of the mounting portion,
A first surface that surrounds the light emitting element and the light reflecting layer and reflects light emitted from the light emitting element; and a second surface that contacts the light reflecting layer of the mounting portion. A reflective member made of a metal material;
A light emitting device comprising:

2. The light emitting device according to claim 1 , wherein the light reflecting layer has a structure in which a first layer containing molybdenum and a second layer containing nickel are stacked.

Emitting device according to the upper surface of the mounting section to claim 1 or claim 2, characterized in that it is provided toward the side surface of the light reflecting layer is said substrate.

The light emitting device, light emitting device according to any one of claims 1 to 3, characterized in that is flip-chip mounted on the mounting section of the base.