JP4947332B2 - LED heat block and LED device using the same - Google Patents

LED heat block and LED device using the same Download PDF

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Publication number
JP4947332B2
JP4947332B2 JP2005021195A JP2005021195A JP4947332B2 JP 4947332 B2 JP4947332 B2 JP 4947332B2 JP 2005021195 A JP2005021195 A JP 2005021195A JP 2005021195 A JP2005021195 A JP 2005021195A JP 4947332 B2 JP4947332 B2 JP 4947332B2
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Japan
Prior art keywords
led
heat block
wiring board
printed wiring
block
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Expired - Fee Related
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JP2005021195A
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Japanese (ja)
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JP2006210677A (en
Inventor
良治 杉浦
正幸 桜井
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日立化成工業株式会社
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Application granted granted Critical
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Application status is Expired - Fee Related legal-status Critical
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Description

  The present invention relates to an LED heat block composed of an LED heat sink / reflector plate with improved heat dissipation and reflection efficiency of an LED chip to be mounted, and an LED device using the same.

In recent years, LED chips with higher brightness have been developed and are not only used for numeric keypad lighting and spot lighting for mobile phones so far, but are also starting to be used for relatively wide lighting such as desk lamps. Therefore, higher heat dissipation is required.
In the conventional LED device, a through hole is formed in an insulating substrate, an opening on one side of the through hole is covered with a metal plate, and a metal film is formed by plating on the wall surface of the through hole, the surface of the metal plate, and the surface of the insulating substrate. In some cases, an LED chip is mounted on a metal plate, and the LED chip and a metal film on an insulating substrate are electrically connected by wire bonding (for example, see Patent Document 1).
In addition, as shown in FIG. 6, there is also an LED device having a structure in which a lead frame formed of a thin metal plate is resin-molded and an LED chip is mounted on the lead frame. That is, a mortar-shaped recess 101 is provided in the molding resin 100, a lead frame 102 is embedded in the bottom of the recess 101, an LED chip 103 is mounted on the lead frame 102, and terminals of the LED chip 103 and the lead frame 102 are provided. The part 104 is connected by wire bonding with a thin metal wire.
Note that the latter of the above-described prior arts is not publicly known as long as the applicant knows at the time of filing. Further, the applicant has not found any prior art documents closely related to the present invention by the time of filing other than the prior art documents specified by the prior art document information described in this specification.
Japanese Patent No. 3137823 (paragraphs “0027” to “0037”).

In the former case of the conventional LED device described above, the metal film on the wall surface of the through hole is formed by plating, so there is a limit to increasing the film thickness of the metal film, and thus heat dissipation is reduced. There was a problem that it could not be improved.
In the latter case, the heat dissipation is improved by the lead frame 102, but when a large capacity of heat dissipation is required, the lead frame 102 is further thickened and the molding accuracy is deteriorated. In addition, a metal mold for molding a complicated lead frame 102 by bending and a mold for molding a resin are not only expensive, but also metal plating with a uniform film thickness on the surface of the molding resin 100 Therefore, there is a problem that the reflection efficiency is lowered.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to form a new heat block-shaped chip mounting portion to improve heat dissipation and reflection efficiency of the LED device. At the same time, the manufacturing cost is to be reduced.

To this end, the invention according to claim 1, the LED chip mounting portion LED chip is mounted, possess a reflection frame formed in a frame shape surrounding the LED chip mounting portion, the printed circuit board a cylindrical heat block is fitted into the through holes provided to fix the, disposed at the lower end outside the upper external or the heat block of the reflective frame, you joined to the conductor pattern of the printed wiring board surface a flange, said possess a longitudinal shaped protrusions formed in the longitudinal direction from the rear surface of the flange to the cylindrical outside of the heat block, said longitudinal-shaped projections are tapered der having an increased who are in close proximity to the flange LED heat block .

The invention according to claim 2 is the LED heat block according to claim 1, wherein the LED chip mounting portion, the reflection frame, the collar, and the vertical protrusion are integrally formed from a metal block or a metal plate.

The invention according to claim 3 is the LED heat block according to claim 1 or 2 , the plated through hole or the non-plated through hole in which the LED heat block is inserted, and LED mounting of the LED heat block. And a printed wiring board provided with a terminal part to which the LED chip is electrically connected. The invention according to claim 4 is the conductor pattern or circuit conductor according to the invention according to claim 3 , wherein the lower end surface of the LED heat block inserted in the through hole of the printed wiring board is on the lower surface of the printed wiring board. The LED device is formed higher on the lower surface. The invention according to claim 5 is the LED device according to claim 4, wherein a heat sink casing is attached to the bottom of the lower surface of the LED heat block.

  According to the present invention, the LED chip is mounted on the LED chip mounting portion on the heat radiation block having a large heat conduction volume (heat conduction capacity) formed by the LED heat block which is a metal lump (metal block). The heat dissipation is greatly improved compared to a metal thin plate-like wiring board or metal plate lead frame known in the prior art.

In addition, since the chip mounting part and the reflection frame (reflection part) are integrally formed with a metal block having a large heat conduction volume, this reflection frame (reflection plate) also has good heat dissipation due to heat generation and light emission, so that LED components Brightness deterioration can be prevented. Furthermore, since the roughness of the surface of the LED heat block can be evenly smoothed, the reflection efficiency can be improved by a mirror effect such as precious metal plating or aluminum deposition formed on the inner surface of the reflecting frame (reflecting plate). it can.
Moreover, since it is only necessary to prepare a mold for molding the heat block, the cost for the mold can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing an entire heat block which is a heat sink / reflector for LED according to the present invention, FIG. 2 is a cross-sectional view of the LED heat block, and FIG. 3 is an LED heat block according to the present invention. Sectional drawing for demonstrating the printed wiring board provided with the through-hole to insert, FIG. 4 is sectional drawing for demonstrating the state which inserted the heat block for LED which concerns on this invention, FIG. 5 concerns on this invention It is sectional drawing which shows an LED apparatus.

  1 is a column-shaped heat block for an LED, and includes a chip mounting portion (land) 2 on which an LED chip is mounted, and a reflection frame formed in a frame shape surrounding the LED chip mounting portion. 3, a flange 4 connected to the outside of the upper end of the reflection frame 3, and a vertical protrusion 5 connected and fixed to the columnar outside of the LED heat block 1.

  This LED heat block 1 is formed by stamping or drawing a thick metal plate (thickness 0.5 to 2.0 mm) made of a single piece of aluminum, brass, copper, Ni, Fe, stainless steel, or the like. Thus, the chip mounting portion 2, the reflective frame (reflecting plate) 3 formed in a frame shape surrounding the LED chip mounting portion 2, the flange 4 connected to the outside of the upper end of the reflective frame 3, and the columnar block. The vertical projections 5 connected and fixed to the columnar exterior of the heat block 1 are integrally formed by a single metal plate or metal lump (block).

Alternatively, the LED heat block 1 may be formed from a metal block (block) such as a cylinder or a prism by plastic working such as pressing.
That is, the LED heat block 1 is formed by forming the chip mounting portion 2, the reflection frame 3, the flange 4, and the vertical protrusion 5 as a single metal block from a metal material such as a metal block or a metal plate. .

  As an example of the present invention, a heat block for LED 1 as shown in the cross-sectional view of FIG. The chip mounting portion 2 land on which the LED chip shown in the cross-sectional view of FIG. 2 is mounted is the LED chip mounting portion 2 having a flat bottom surface that has been depressed into a concave shape by press drawing with a mold. A space 10 having a truncated conical shape composed of a reflective frame 3 that is inclined toward the upper surface from the LED chip mounting portion 2 (inclination angle 60 degrees) and a ridge 4 provided outside the upper end of the reflective frame 3. Is depressed and provided.

  The vertical protrusion 5 connected and fixed to the outside of the columnar shape of the heat block 1 is a truncated cone-shaped conical shape, and the tapered vertical protrusion 5 is larger in the vicinity of the flange 4 provided outside the upper end. 4-8 pieces were connected and added. Further, the reflection frame 3 is a reflector, and the angle of inclination extending toward the upper surface is 45 to 75 degrees, and the inner surface is a reflection plate plated with good reflection efficiency.

  In addition to the tapered shape, the reflecting portion of the LED heat block 1 in which the recessed space 10 extending from the LED chip mounting portion 2 shown in the cross-sectional view of FIG. It is also possible to provide an LED device with high reflection efficiency as a stepped taper shape.

The height T1 of the space 10 recessed in the concave shape (the height from the upper surface of the ridge 4 to the LED chip mounting portion 2 of the LED heat block) was set to 0.8 mm. The total thickness T2 of the LED heat block 1 is 1.2 mm, and this T2 is preferably formed to be substantially the same as or thicker than the thickness of the printed wiring board. Further, the bottom shape of the flat LED chip mounting portion 2 is circular, oval, rectangular or the like, and is determined by the LED chip on which the bottom size and depth are mounted. In this example, it is a circular shape of Φ1.0.
In addition, as a manufacturing method of the LED heat block 1, the drawing process is performed after the punching process as described above. However, the drawing process may be performed after the drawing process, or the drawing process may be performed. And punching may be performed simultaneously.

In this way, the inner surface of the flat reflecting frame 3 of the LED heat block 1 formed with a uniform and smooth surface roughness of the metal block is subjected to base plating by nickel plating, and noble metal plating of gold and silver is performed thereon. . Further, the reflective surface treatment may be performed by aluminum vapor deposition or white plating.
In this case, since plating is performed on the surface of the reflection frame 3 formed by the metal block, the thickness of the nickel plating as the base plating formed on the surface of the metal block is uniformly formed throughout. For this reason, since the surface of the gold, silver, or aluminum plating formed on the nickel plating is formed in a mirror shape with extremely little roughness (unevenness) over the entire surface, the reflection efficiency of the surface of the reflection frame 3 is improved. Can be made.

Moreover, the 2nd heat block for LED which concerns on this invention shown in FIG. 7 is demonstrated.
That is, the vertical protrusion 5 that is provided by connecting the flange 4 of the LED heat block 1 to the outer periphery of the lower end of the heat block at the lower part of the LED chip mounting portion 2 and connecting and fixing the columnar outside of the heat block 1 is a truncated cone. A vertical projection 5 having a tapered shape with a larger conical shape and a larger portion close to the flange 4 provided on the outer periphery of the lower end is formed. The second LED heat block is inserted into the through hole of the printed wiring board from below.

Next, the printed wiring board 11 provided with the through hole 12 into which the LED heat block according to the present invention is inserted will be described with reference to FIG.
In the figure, for the sake of convenience of explanation, only the printed wiring board provided with the through holes 12 into which one LED heat block is inserted is shown. However, the printed wiring board for LEDs is actually in a matrix. A plurality of through holes are arranged.
A through hole 12 is provided by a drill at a predetermined location of the printed wiring board 11, and predetermined circuit conductors 17 and 17 are formed on both surfaces of the printed wiring board 11, and the periphery of the upper end of the through hole 12 into which the LED heat block is inserted. Are formed with conductor patterns 14 and 14 for fixing the collar 4 provided on the surface of the reflection frame 3 of the LED heat block 1, and the predetermined circuit conductors 17 and 17 are electrically connected to the LED chip at necessary portions. The printed wiring board 11 is provided with a plurality of wire bonding terminal portions 16 and 16 to be connected.

Further, it is preferable that the wiring circuit conductors 17 and 17 other than the wire bonding terminal portions 16 and 16 and the solder connection lands to be electrically connected are covered with the solder resist 18.
Next, the printed wiring board 11 is formed by performing noble metal plating with nickel and gold or silver on the wire bonding connection terminals 16 and 16 and the solder connection lands that are electrically connected. The through hole 12 may be a plated through hole in which a plated film is formed on the inner wall of the hole or a non-plated through hole without a plated film.

Next, a method for manufacturing an LED device using the printed wiring board 11 formed as described above and the LED heat block 1 described above will be described with reference to FIG.
In the same figure, on the conductor patterns 14 and 14 for fixing the flange 4 of the LED heat block 1 provided around the upper end of the through hole 12 described in FIG. 3 for fitting the LED heat block 1 of the printed wiring board 11. Apply cream solder.
After that, in the state where the lower end of the flange 4 provided on the surface of the reflection frame 3 of the LED heat block 1 is fitted into the through hole 12 of the printed wiring board 11, the LED is inserted into the through hole 12 of the printed wiring board 11. The heat block 1 is placed and fixed.
The LED heat block 1 has a total thickness T2 that is greater than the thickness of the printed wiring board, and the lower end surface of the heat dissipating block at the lower portion of the chip mounting portion of the LED heat block is the circuit conductor 17 for wiring. You may make it protrude higher than 17.

  In this state, the printed wiring board 11 and the LED heat block 1 are heated in a heating furnace to remelt the cream solder, and the LED heat block 1 is formed on the conductor patterns 14 and 14 of the printed wiring board 11. The collar 4 is joined, and the LED heat block 1 is fitted into the through hole 12 of the printed wiring board 11 and joined as shown in FIG. Also, when electrical connection between the LED heat block 1 and the conductor patterns 14 and 14 of the printed wiring board 11 is not required, it should be fixed with adhesive, ultrasonic welding, laser welding or the like without using cream solder. You can also.

  The vertical protrusion 5 connected and fixed to the outside of the upper end of the column of the heat block 1 has a tapered shape in which the one close to the flange 4 provided outside the upper end of the truncated cone shape is enlarged. It becomes a guide (the role of a wedge) when the heat block 1 is inserted (pressed) into the through hole 12 and press-fitted to the flange 4, so that the insertion position becomes constant and the temporarily fixed state is stabilized.

Next, a state where the second LED heat block according to the present invention shown in FIG. 8 is inserted will be described.
The second LED heat block according to the present invention shown in FIG. 7 is inserted into the through hole 12 of the printed wiring board 11 from the lower surface. That is, the flange 4 of the LED heat block 1 is joined to the conductor patterns 14 and 14 on the lower surface around the through hole 12 of the printed wiring board 11, and the LED heat block 1 is connected to the printed wiring board as shown in FIG. 11 is inserted into the through hole 12 from the lower surface and joined. Therefore, the lower end surface of the heat dissipating block below the chip mounting portion of the LED heat block is formed higher on the lower surface than the conductor patterns 14 and 14 on the lower surface of the printed wiring board 11 and the circuit conductors 17 and 17 for wiring. . The housing of the component case can be brought into contact with or connected to the lower end surface of the heat dissipation block at the lower part of the LED heat block.

Next, as shown in FIG. 5, the LED heat block 1 has the LED chip 22 mounted on the chip mounting portion 2 by die bonding, and the terminals of the LED chip 22 and the fine metal wires 23 are bonded to the printed wiring board 11 by wire bonding. The terminal portion 16 is electrically connected by wire bonding. (In this figure, both + terminal and-terminal are wire bonding connections)
As shown in the figure, the chip mounting portion 2 of the LED heat block 1, the LED chip 22, and the terminal portion 16 of the printed wiring board 11 are made to convert a transparent mold resin that transmits the emitted light and the light emission color into white light. The LED device 30 is formed as a single unit by resin sealing with a primary mold resin 24 such as a white conversion mold resin. After the primary mold resin 24 is cured, a transparent secondary mold resin 25 serving as a lens mold resin for condensing or dispersing emitted light so as to cover the upper surface of the primary mold resin 24 is projected. Brightness is improved by covering the curved surface.

  By attaching a separate heat sink casing as an LED component casing to the bottom surface of the LED heat block 1 of the LED device 30, the heat generated from the LED chip 22 is transmitted from the LED heat block 1 via the heat sink to the LED device. 30 is discharged to the outside. At this time, since the LED heat block 1 on which the LED chip 22 is mounted is formed of a metal block, the heat block can be uniformly formed to have a thickness equal to or greater than a predetermined thickness, thereby further improving heat dissipation. improves.

It is an external appearance perspective view which shows the whole heat block for LED which concerns on this invention. It is sectional drawing of the heat block for LED which concerns on this invention. It is sectional drawing for demonstrating the printed wiring board provided with the through-hole which inserts the heat block for LED which concerns on this invention. Sectional drawing for demonstrating the state which inserted the heat block for LED which concerns on this invention. It is sectional drawing which shows the LED device which concerns on this invention. It is sectional drawing of the conventional LED device. It is sectional drawing of the 2nd heat block for LED which concerns on this invention. Sectional drawing explaining the state which inserted the 2nd heat block for LED which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Heat block, 2 ... Chip mounting part, 3 ... Reflection frame for LED, 4 ... 鍔, 5 ... Vertical protrusion,
DESCRIPTION OF SYMBOLS 10 ... Space, 11 ... Printed wiring board, 12 ... Through-hole, 14 ... Conductor pattern, 16 ... Terminal part,
17 ... Circuit conductor, 18 ... Solder resist, 22 ... LED chip, 23 ... Metal fine wire,
24 ... primary mold resin, 25 ... secondary mold resin, 30 ... LED device.

Claims (5)

  1. An LED chip mounting portion LED chip is mounted, possess a reflection frame formed in a frame shape surrounding the LED chip mounting portion, a cylindrical heat of fixing is fitted in a through hole provided on the printed wiring board Block,
    Disposed at the lower end outside the upper external or the heat block of the reflective frame, a collar you joined to the conductor pattern of the printed wiring board surface, is formed in the longitudinal direction from the rear surface of the flange to the cylindrical outside of the heat block possess a longitudinal-like projection, the longitudinal shape projections, the LED for heat block is largely a tapered shape towards in close proximity to the flange.
  2. In claim 1,
    An LED heat block in which an LED chip mounting portion, a reflection frame, a collar, and a vertical protrusion are integrally formed from a metal block or a metal plate.
  3. The heat block for LED of Claim 1 or 2,
    A through hole which is a plated through hole or a non-plated through hole in which the LED heat block is inserted, an LED chip mounted on the LED mounting portion of the LED heat block, and a terminal to which the LED chip is electrically connected A printed wiring board provided with a section;
    An LED device comprising:
  4. In claim 3,
    An LED device in which a lower end surface of an LED heat block inserted into a through hole of a printed wiring board is formed higher on a lower surface than a conductor pattern or a circuit conductor on a lower surface of the printed wiring board.
  5. In claim 4,
    The LED device which attached the heat sink housing | casing to the lower surface bottom part of the heat block for LED.
JP2005021195A 2005-01-28 2005-01-28 LED heat block and LED device using the same Expired - Fee Related JP4947332B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005021195A JP4947332B2 (en) 2005-01-28 2005-01-28 LED heat block and LED device using the same

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Application Number Priority Date Filing Date Title
JP2005021195A JP4947332B2 (en) 2005-01-28 2005-01-28 LED heat block and LED device using the same

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JP4947332B2 true JP4947332B2 (en) 2012-06-06

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JP5074696B2 (en) * 2006-03-07 2012-11-14 アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド Light emitting diode
CN101681962B (en) 2007-05-17 2013-02-20 昭和电工株式会社 Semiconductor light-emitting device
KR20100135223A (en) * 2008-04-18 2010-12-24 아사히 가라스 가부시키가이샤 Light-emitting diode package
US20110204386A1 (en) * 2010-01-25 2011-08-25 Vishay Sprague, Inc. Metal based electronic component package and the method of manufacturing the same
JP5771124B2 (en) * 2011-03-18 2015-08-26 株式会社神戸製鋼所 LED lead frame and manufacturing method thereof

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JPH0782142B2 (en) * 1989-06-29 1995-09-06 スタンレー電気株式会社 A method of assembling a Led eraser
JPH098359A (en) * 1995-06-22 1997-01-10 Rohm Co Ltd Light emitting device
JP3948789B2 (en) * 1997-07-02 2007-07-25 シチズン電子株式会社 Infrared data communication module
JPH11145522A (en) * 1997-11-14 1999-05-28 Fujitsu Ltd Light module drive device
JP3783572B2 (en) * 2001-03-05 2006-06-07 日亜化学工業株式会社 Light emitting device
JP4211359B2 (en) * 2002-03-06 2009-01-21 日亜化学工業株式会社 Manufacturing method of semiconductor device
JP4123105B2 (en) * 2003-05-26 2008-07-23 松下電工株式会社 Light emitting device

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