JP2006261286A - Package for containing light emitting element and its manufacturing process - Google Patents

Package for containing light emitting element and its manufacturing process Download PDF

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JP2006261286A
JP2006261286A JP2005074752A JP2005074752A JP2006261286A JP 2006261286 A JP2006261286 A JP 2006261286A JP 2005074752 A JP2005074752 A JP 2005074752A JP 2005074752 A JP2005074752 A JP 2005074752A JP 2006261286 A JP2006261286 A JP 2006261286A
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ceramic
emitting element
light emitting
hole
ceramic substrate
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Takuji Ikeda
拓児 池田
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Sumitomo Metal SMI Electronics Device Inc
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Sumitomo Metal SMI Electronics Device Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for containing a light emitting element in which the conical through hole of a ceramic substrate has such a wall surface as emission efficiency of the light emitting element can be enhanced, and to provide its manufacturing process. <P>SOLUTION: The package 10 for containing a light emitting element is produced by bonding a planar first ceramic substrate 11 having a region 13 for mounting a light emitting element 12 on the upper surface, and a second ceramic substrate 15 having a conical through hole 14 for exposing the mounting region 13 of the first ceramic substrate 11 wherein the opening of the through hole is larger on the upper surface side than on the lower surface side, i. e. the side being bonded to the first ceramic substrate 11. Ceramic paste composed of the same ceramic material as that of the second ceramic substrate 15 is applied to the wall surface of the conical through hole 14 and sintered to form a ceramic film 16. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｓｓｉｏｎ Ｄｉｏｄｅ）等の発光素子を搭載して収納するための多層のセラミック基板を用いた発光素子収納用のパッケージ及びその製造方法に関する。   The present invention relates to a light-emitting element storage package using a multilayer ceramic substrate for mounting and storing light-emitting elements such as LEDs (Light Emission Diode), and a method for manufacturing the same.

従来からＬＥＤ等の発光素子を収納するための発光素子収納用パッケージとしては、プラスチックや、セラミックを用いて製造されたものが用いられている。また、近年の発光素子には、光出力を大きくすることが要求されているが、この要求に対応するのに発光素子にかけられる電流を増加させることで対応しようとすると、発光素子自体の温度も上昇し、発光素子を収納するためのパッケージがプラスチック製では、耐熱性が十分でないという問題が発生している。従って、最近では、発光素子収納用パッケージ及びその製造方法においては、耐熱性の高いアルミナ（Ａｌ２Ｏ３）等からなるセラミックを用いたものが多く用いられている。また、セラミック製の発光素子収納用パッケージには、発行素子を載置して囲繞する部分であるキャビティ部の壁面に、発行素子から発せられる光を反射させて発光効率を向上させることができる反射層を設けるものが開発されている。 Conventionally, as a light emitting element storage package for storing a light emitting element such as an LED, a package manufactured using plastic or ceramic has been used. Further, recent light emitting devices are required to increase the light output, but to meet this requirement by increasing the current applied to the light emitting device, the temperature of the light emitting device itself is also increased. When the package for housing the light emitting element is made of plastic, there is a problem that the heat resistance is not sufficient. Therefore, recently, in the light emitting element storage package and the manufacturing method thereof, a ceramic package made of alumina (Al 2 O 3 ) or the like having high heat resistance is often used. The light emitting element storage package made of ceramic is a reflection that can improve the light emission efficiency by reflecting the light emitted from the issuing element to the wall surface of the cavity part where the issuing element is placed and surrounded. Those that provide layers have been developed.

パッケージの壁面部に光を反射させるための反射層を設ける従来のセラミック製の発光素子収納用パッケージ及びその製造方法には、導体配線が形成されたセラミックグリーンシートに発光素子を載置すべきキャビティ部を形成するに際し、セラミックグリーンシートをキャビティ部が開口方向に広くなるようにプレス成形し、脱脂、焼成した後、キャビティ部壁面の導体層に貴金属めっきを施したものや、その製造方法が提案されている（例えば、特許文献１参照）。また、パッケージの壁面部に光を反射させるための反射層を設ける従来のセラミック製の発光素子収納用パッケージ及びその製造方法には、上面に発光素子を搭載するための搭載部を有する略平板状のセラミック基体の上面に、発光素子を収納するための貫通孔を有するセラミック枠体を積層してなり、貫通孔内壁がセラミック基体上面に対して５５〜７０度の角度で外側に広がっていると共に、その表面に中心線平均粗さＲａが１〜３μｍで且つ発光素子が発光する光に対する反射率が８０％以上の金属層が被着されているものや、その製造方法が提案されている（例えば、特許文献２参照）。   A conventional ceramic light-emitting element storage package having a reflective layer for reflecting light on the wall surface of the package and its manufacturing method include a cavity in which a light-emitting element is to be placed on a ceramic green sheet on which conductor wiring is formed. When forming the part, the ceramic green sheet is press-molded so that the cavity part becomes wider in the opening direction, degreased and fired, and then the conductor layer on the cavity part wall surface is plated with noble metal and its manufacturing method is proposed (For example, refer to Patent Document 1). In addition, a conventional ceramic light emitting element storage package having a reflective layer for reflecting light on the wall surface of the package and a method for manufacturing the same include a substantially flat plate shape having a mounting portion for mounting the light emitting element on an upper surface. A ceramic frame having a through hole for accommodating a light emitting element is laminated on the upper surface of the ceramic substrate, and the inner wall of the through hole extends outward at an angle of 55 to 70 degrees with respect to the upper surface of the ceramic substrate. Further, a metal layer having a center line average roughness Ra of 1 to 3 μm and a reflectance of 80% or more for light emitted from the light emitting element is applied to the surface, and a method for manufacturing the same is proposed ( For example, see Patent Document 2).

特開平９−４５９６５号公報JP 9-45965 A 特開２００２−２３２０１７号公報Japanese Patent Laid-Open No. 2002-232017

しかしながら、前述したような従来の発光素子収納用パッケージ及びその製造方法は、次のような問題がある。
（１）発光素子搭載部であるキャビティ部を形成するのに、セラミックグリーンシートをキャビティ部の開口方向に広くなるようにプレス成形して凹部を形成する場合には、セラミックグリーンシートが屈折する部分に亀裂や、破断等が発生し、絶縁体としての機能が発揮できなくなっている。
（２）発光素子搭載部であるキャビティ部のすり鉢状貫通孔は、打ち抜き金型のパンチとダイスとの間のクリアランスを大きくしてセラミックグリーンシートを打ち抜くことで形成することができるが、すり鉢状貫通孔の壁面は、安定した形状でなく、大きな凸凹が発生している。このような形状の壁面を反射板とする場合には、光の拡散が大きくなって、安定した反射光を得ることができないので、発光素子の発光効率を向上させることが難しくなっている。
本発明は、かかる事情に鑑みてなされたものであって、セラミック基板のすり鉢状貫通孔の壁面を発光素子の発光効率を向上できる壁面とすることができる発光素子収納用パッケージ及びその製造方法を提供することを目的とする。 However, the conventional light emitting element storage package and the manufacturing method thereof have the following problems.
(1) When forming a cavity part, which is a light emitting element mounting part, by pressing the ceramic green sheet so as to be wide in the opening direction of the cavity part, a part where the ceramic green sheet is refracted Cracks, fractures, etc. occur in the film, making it impossible to exhibit the function as an insulator.
(2) The mortar-shaped through-hole in the cavity portion, which is the light-emitting element mounting portion, can be formed by punching out the ceramic green sheet by increasing the clearance between the punch and die of the punching die. The wall surface of the through hole is not a stable shape, and large irregularities are generated. When the wall surface having such a shape is used as a reflecting plate, the diffusion of light increases, and stable reflected light cannot be obtained. Therefore, it is difficult to improve the light emission efficiency of the light emitting element.
The present invention has been made in view of such circumstances, and provides a light emitting element storage package and a method for manufacturing the same, in which a wall surface of a mortar-shaped through hole of a ceramic substrate can be used as a wall surface capable of improving the light emission efficiency of the light emitting element. The purpose is to provide.

前記目的に沿う本発明に係る発光素子収納用パッケージは、発行素子を上面に搭載するための実装領域を有する平板状の第１のセラミック基板と、第１のセラミック基板の実装領域を開口部として露出して開口部の大きさが第１のセラミック基板との接合側である下面側より上面側が大きいすり鉢状貫通孔を有する第２のセラミック基板との接合体からなる発行素子収納用パッケージであって、すり鉢状貫通孔の壁面に第２のセラミック基板と同じセラミック材からなるセラミックペーストが塗布、焼成されるセラミック膜を有する。   The light-emitting element storage package according to the present invention that meets the above-described object includes a flat plate-like first ceramic substrate having a mounting region for mounting an issuing element on the upper surface, and a mounting region of the first ceramic substrate as an opening. An issuance element storage package comprising a joined body with a second ceramic substrate that has a mortar-shaped through-hole that is exposed and has a larger opening on the upper surface side than the lower surface side that is the joining side with the first ceramic substrate. Then, a ceramic film made of the same ceramic material as that of the second ceramic substrate is applied to the wall surface of the mortar-shaped through-hole and fired.

前記目的に沿う本発明に係る発光素子収納用パッケージの製造方法は、第１のセラミック基板の導体配線パターン用の導体印刷パターンを備える１又は複数枚からなる第１のセラミックグリーンシートと、第２のセラミック基板のすり鉢状貫通孔用の挿通孔を備える１又は複数枚からなる第２のセラミックグリーンシートを積層し、焼成して形成する発行素子収納用パッケージの製造方法において、第１のセラミックグリーンシートに導体ペーストを用いてスクリーン印刷で導体印刷パターンを形成する工程と、第２のセラミックグリーンシートにすり鉢状の挿通孔を成形し、挿通孔の壁面に第２のセラミックグリーンシートと同じセラミック材からなるセラミックペーストをスクリーン印刷で塗布する工程と、第１のセラミックグリーンシートと第２のセラミックグリーンシートを積層し、焼成してすり鉢状貫通孔の壁面にセラミック膜を形成する工程を有する。   The manufacturing method of the light emitting element storage package according to the present invention in accordance with the above object includes a first ceramic green sheet comprising one or a plurality of conductor printing patterns for a conductor wiring pattern of a first ceramic substrate, and a second method. In the manufacturing method of a package for storing an issuing element, in which one or a plurality of second ceramic green sheets each having an insertion hole for a mortar-shaped through-hole of a ceramic substrate are laminated and fired, the first ceramic green Forming a conductor print pattern by screen printing using a conductive paste on the sheet, forming a mortar-shaped insertion hole in the second ceramic green sheet, and the same ceramic material as the second ceramic green sheet on the wall surface of the insertion hole A step of applying a ceramic paste comprising: a screen printing; and a first ceramic green sheet. Laminating the door and a second ceramic green sheet, a step of forming a ceramic film on the wall surface of the bowl-shaped through-holes and then fired.

請求項１記載の発光素子収納用パッケージは、平板状の第１のセラミック基板と、すり鉢状貫通孔を有する第２のセラミック基板との接合体からなる発行素子収納用パッケージであって、すり鉢状貫通孔の壁面に第２のセラミック基板と同じセラミック材からなるセラミックペーストが塗布、焼成されるセラミック膜を有するので、すり鉢状貫通孔の壁面がセラミックペーストで平坦面化されたセラミック膜によって、発光素子からの発光を効率よく反射できる反射面とすることができ、発光素子の発光効率を向上させることができる。また、例えば、セラミック膜の上面に金属膜を形成したとしても平坦面化された金属膜を形成でき、発光素子の発光効率を向上させる反射面とすることができる。   The light emitting element storage package according to claim 1 is an issuance element storage package comprising a joined body of a flat plate-like first ceramic substrate and a second ceramic substrate having a mortar-shaped through-hole, Since a ceramic paste made of the same ceramic material as the second ceramic substrate is applied to the wall surface of the through hole and fired, the ceramic film in which the wall surface of the mortar-shaped through hole is flattened with the ceramic paste emits light. It can be set as the reflective surface which can reflect the light emission from an element efficiently, and the light emission efficiency of a light emitting element can be improved. Further, for example, even if a metal film is formed on the upper surface of the ceramic film, a flattened metal film can be formed, and a reflective surface that improves the light emission efficiency of the light emitting element can be obtained.

請求項２記載の発光素子収納用パッケージの製造方法は、第１のセラミックグリーンシートに導体ペーストを用いてスクリーン印刷で導体印刷パターンを形成する工程と、第２のセラミックグリーンシートにすり鉢状の挿通孔を成形し、挿通孔の壁面に第２のセラミックグリーンシートと同じセラミック材からなるセラミックペーストをスクリーン印刷で塗布する工程と、第１のセラミックグリーンシートと第２のセラミックグリーンシートを積層し、焼成してすり鉢状貫通孔の壁面にセラミック膜を形成する工程を有するので、導体印刷パターンによって外部と電気的に導通状態が可能となる発光素子が搭載できる導体配線パターンが形成でき、セラミックペーストによって挿通孔の壁面が平坦面化されたセラミック膜面とすることができ、発光素子からの発光効率を向上させることができる発光素子収納用パッケージの製造方法を提供することができる。   The method for manufacturing a light emitting element storage package according to claim 2 includes a step of forming a conductor print pattern by screen printing using a conductor paste on the first ceramic green sheet, and a mortar-like insertion through the second ceramic green sheet. Forming a hole, applying a ceramic paste made of the same ceramic material as the second ceramic green sheet to the wall surface of the insertion hole by screen printing, laminating the first ceramic green sheet and the second ceramic green sheet, Since it has a step of forming a ceramic film on the wall surface of the mortar-shaped through hole, a conductor wiring pattern on which a light emitting element that can be electrically connected to the outside can be formed by a conductor printing pattern, and a ceramic paste can be used. The wall surface of the insertion hole can be a flat ceramic film surface. Method of manufacturing a light-emitting element storing package which can improve the luminous efficiency of the light emitting element can be provided.

続いて、添付した図面を参照しつつ、本発明を具体化した実施するための最良の形態について説明し、本発明の理解に供する。
ここに、図１（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図、図２（Ａ）〜（Ｄ）はそれぞれ同発光素子収納用パッケージの製造方法の説明図である。 Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
Here, FIGS. 1A and 1B are a plan view, a longitudinal sectional view taken along line AA ′, and FIGS. 2A to 2D, respectively, of a light emitting element storage package according to an embodiment of the present invention. These are explanatory drawings of the manufacturing method of the light emitting element storage package, respectively.

図１（Ａ）、（Ｂ）に示すように、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、平面視して、矩形状や、多角形や、円形等からなるアルミナ（Ａｌ２Ｏ３）や、窒化アルミニウム（ＡｌＮ）等の１又は複数枚からなる平板状の第１のセラミック基板１１の両主面のうちの一方に、ＬＥＤ等の発光素子１２を搭載するための実装領域１３を有している。また、本発明の一実施の形態に係る発光素子収納用パッケージ１０は、第１のセラミック基板１１の実装領域１３を開口部として露出して、この開口部の大きさが第１のセラミック基板１１との接合側である下面側より上面側が大きい断面視してすり鉢状貫通孔１４を有するアルミナや、窒化アルミニウム等の１又は複数枚からなる第２のセラミック基板１５を有している。この第２のセラミック基板１５のすり鉢状貫通孔１４の壁面には、この第２のセラミック基板１５と同じセラミック材からなるセラミックペーストがスクリーン印刷して塗布され、焼成されて形成されるセラミック膜１６を有している。このセラミック膜１６は、第２のセラミック基板１５のすり鉢状貫通孔１４の凸凹状態の壁面を平坦な表面とすることができるので、発光素子１２からの発光を効果的に反射させることができる。また、このセラミック膜１６の表面には、発光素子１２からの発光を更に効果的に反射させるために、めっき被膜が設けられることがある。 As shown in FIGS. 1A and 1B, a light emitting element storage package 10 according to an embodiment of the present invention has an alumina (rectangular, polygonal, circular, etc.) in plan view. For mounting a light emitting element 12 such as an LED on one of both main surfaces of a flat plate-like first ceramic substrate 11 made of one or more of Al 2 O 3 ), aluminum nitride (AlN), or the like. A mounting area 13 is provided. In addition, the light emitting element storage package 10 according to the embodiment of the present invention exposes the mounting region 13 of the first ceramic substrate 11 as an opening, and the size of the opening is the first ceramic substrate 11. And a second ceramic substrate 15 made of one or a plurality of sheets such as alumina or aluminum nitride having a mortar-like through hole 14 in a cross-sectional view in which the upper surface side is larger than the lower surface side which is the bonding side. A ceramic paste made of the same ceramic material as the second ceramic substrate 15 is applied to the wall surface of the mortar-shaped through-hole 14 of the second ceramic substrate 15 by screen printing and fired to form a ceramic film 16. have. Since the ceramic film 16 can make the uneven wall surface of the mortar-shaped through-hole 14 of the second ceramic substrate 15 a flat surface, the light emitted from the light emitting element 12 can be effectively reflected. In addition, a plating film may be provided on the surface of the ceramic film 16 in order to reflect light emitted from the light emitting element 12 more effectively.

この発光素子収納用パッケージ１０に形成される上下層を電気的に導通状態とするためのビア導体１７を含む導体配線パターン１８は、第１のセラミック基板１１の一方の主面側である実装領域１３に、発光素子１２を載置するためのダイボンドパッド１９や、発光素子１２とボンディングワイヤ２０で接続するワイヤボンド方式（図１ではこの方式を図示）を用いて電気的に導通状態とするためのボンディングパッド２１等として形成されている。あるいは、導体配線パターン１８は、第１のセラミック基板１１の一方の主面側である実装領域１３に、発光素子１２に設ける接続用バンプで直接接続するフリップチップ方式を用いて電気的に導通状態とするためのボンディングパッド２１等として形成されている。また、導体配線パターン１８は、第１のセラミック基板１１の他方の主面側で、あるいは、第２のセラミック基板１５の上面側で外部と接続して電気的に導通状態とするための外部接続端子パッド２２等として形成されている。   A conductor wiring pattern 18 including via conductors 17 for electrically connecting upper and lower layers formed in the light emitting element storage package 10 is a mounting region on one main surface side of the first ceramic substrate 11. 13, in order to make it electrically conductive by using a die bond pad 19 for mounting the light emitting element 12 and a wire bond system (this system is shown in FIG. 1) connected to the light emitting element 12 by a bonding wire 20. The bonding pad 21 is formed. Alternatively, the conductor wiring pattern 18 is in an electrically conductive state by using a flip chip method in which a connection bump provided on the light emitting element 12 is directly connected to the mounting region 13 on one main surface side of the first ceramic substrate 11. It is formed as a bonding pad 21 or the like. In addition, the conductor wiring pattern 18 is connected to the outside on the other main surface side of the first ceramic substrate 11 or on the upper surface side of the second ceramic substrate 15 so as to be in an electrically conductive state. It is formed as a terminal pad 22 or the like.

次いで、図２（Ａ）〜（Ｄ）を参照しながら、本発明の一実施の形態に係る発光素子収納用パッケージ１０の製造方法を説明する。発光素子収納用パッケージ１０の製造方法には、Ａｌ２Ｏ３や、ＡｌＮ等のセラミックからなるセラミックグリーンシートが用いられている。このセラミックグリーンシートが例えば、Ａｌ２Ｏ３セラミックからなる場合には、Ａｌ２Ｏ３粉末にマグネシア、シリカ、カルシア等の焼結助剤を適当量加えた粉末に、ジオクチルフタレート等の可塑剤と、アクリル樹脂等のバインダー、及び、トルエン、キシレン、アルコール類等の溶剤が加えられ、十分に混練した後、脱泡して粘度２０００〜４００００ｃｐｓのスラリーが作成され、ドクターブレード法等によって、例えば、厚さ０．２５ｍｍのロール状のシートに形成され、適当な大きさにカットしてセラミックグリーンシートが作製されている。 2A to 2D, a method for manufacturing the light emitting element storage package 10 according to the embodiment of the present invention will be described. A ceramic green sheet made of ceramic such as Al 2 O 3 or AlN is used in the method for manufacturing the light emitting element storage package 10. When this ceramic green sheet is made of, for example, Al 2 O 3 ceramic, a powder obtained by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to Al 2 O 3 powder and a plasticizer such as dioctyl phthalate Then, a binder such as an acrylic resin, and a solvent such as toluene, xylene, and alcohols are added and sufficiently kneaded, and then defoamed to create a slurry having a viscosity of 2000 to 40000 cps. It is formed into a roll sheet having a thickness of 0.25 mm, and is cut into an appropriate size to produce a ceramic green sheet.

図２（Ａ）に示すように、セラミックグリーンシートは、第１のセラミック基板１１用として１又は複数枚が準備されるが、ここでは、例えば、２枚からなる第１のセラミックグリーンシート２３、２３ａを準備している。この２枚からなる第１のセラミックグリーンシート２３、２３ａには、必要に応じてビア導体１７を形成するためのビア用貫通孔２４を打抜き金型や、パンチングマシーン等を用いて穿設して形成している。そして、この２枚の内の上方側の第１のセラミックグリーンシート２３には、タングステン（Ｗ）や、モリブデン（Ｍｏ）等の高融点金属からなる導体ペーストを用いてスクリーン印刷してダイボンドパッド１９、ボンディングパッド２１、及びビア導体１７等の導体配線パターン１８（図２（Ｄ）参照）用の導体印刷パターン２５を形成している。また、２枚の内の下方側の第１のセラミックグリーンシート２３ａには、タングステン（Ｗ）や、モリブデン（Ｍｏ）等のセラミックと同時焼成が可能な高融点金属からなる導体ペーストを用いてスクリーン印刷してそれぞれの第１のセラミックグリーンシート２３、２３ａに形成するビア導体１７間を接続させるための繋ぎ配線パターン、ビア導体１７、及び外部接続端子パッド２２等の導体配線パターン１８（図２（Ｄ）参照）用の導体印刷パターン２５ａを形成している。   As shown in FIG. 2A, one or a plurality of ceramic green sheets are prepared for the first ceramic substrate 11. Here, for example, the first ceramic green sheet 23 composed of two sheets, 23a is prepared. The two first ceramic green sheets 23 and 23a are provided with via holes 24 for forming the via conductors 17 as necessary using a punching die or a punching machine. Forming. The first ceramic green sheet 23 on the upper side of the two sheets is screen-printed using a conductive paste made of a refractory metal such as tungsten (W) or molybdenum (Mo), and the die bond pad 19. The conductor printed pattern 25 for the conductor wiring pattern 18 (see FIG. 2D) such as the bonding pad 21 and the via conductor 17 is formed. The first ceramic green sheet 23a on the lower side of the two sheets is screened using a conductive paste made of a refractory metal that can be fired simultaneously with a ceramic such as tungsten (W) or molybdenum (Mo). Conductor wiring patterns 18 such as connecting wiring patterns for connecting the via conductors 17 formed on the first ceramic green sheets 23 and 23a by printing, via conductors 17 and external connection terminal pads 22 (FIG. 2 ( The conductive printed pattern 25a for reference D) is formed.

図２（Ｂ）に示すように、セラミックグリーンシートは、第２のセラミック基板１５用として１又は複数枚が準備されるが、ここでは、例えば、１枚からなる第２のセラミックグリーンシート２６を準備している。この第２のセラミックグリーンシート２６には、ピンと、このピンの径より大きい孔径を設けたダイスからなる打抜き金型で打抜いて、すり鉢状貫通孔１４用の挿通孔２７を形成している。ピンと、このピンの径より大きい孔径を設けたダイスからなる打抜き金型は、ピンの外径と、ダイスの孔径との間のクリアランスによって、ダイス上に載置された第２のセラミックグリーンシート２６を上からピンで押圧して打抜いた時に、第２のセラミックグリーンシート２６には、ピンと接する側に小さい孔径、ダイスと接する側に大きい孔径となるすり鉢状の挿通孔２７を形成することができる。そして、このすり鉢状の挿通孔２７の壁面には、第２のセラミックグリーンシート２６と同じセラミック材からなるセラミックペーストを用いてスクリーン印刷で塗布してセラミック膜１６用のセラミック印刷パターン２８を形成している。このスクリーン印刷では、すり鉢状の挿通孔２７部分をスクリーン印刷機の印刷台の下から吸引できるようにしてセラミックペーストをスクリーン印刷することですり鉢状の挿通孔２７の壁面に容易にセラミック印刷パターン２８を形成することができる。また、ここで用いるセラミックペーストは、比較的粘性が低く、流動性に富んでいるので、すり鉢状の挿通孔２７壁面の凸凹状態を平坦性のある表面にすることができる。なお、すり鉢状の挿通孔２７の壁面に設けるセラミック印刷パターン２８の上面には、必要に応じて、導体ペーストを用いてスクリーン印刷して導体金属膜を設ける場合がある。この導体金属膜上には、Ａｇめっき被膜等が形成でき発光素子１２からの発光を更に効果的に反射できる反射層を形成することができる。   As shown in FIG. 2B, one or more ceramic green sheets are prepared for the second ceramic substrate 15. Here, for example, the second ceramic green sheet 26 made of one sheet is prepared. I'm preparing. The second ceramic green sheet 26 is punched with a punching die comprising a pin and a die having a hole diameter larger than the diameter of the pin to form an insertion hole 27 for the mortar-shaped through hole 14. A punching die composed of a pin and a die having a hole diameter larger than the diameter of the pin has a second ceramic green sheet 26 placed on the die by a clearance between the outer diameter of the pin and the hole diameter of the die. The second ceramic green sheet 26 is formed with a mortar-shaped insertion hole 27 having a small hole diameter on the side in contact with the pin and a large hole diameter on the side in contact with the die. it can. A ceramic printing pattern 28 for the ceramic film 16 is formed on the wall surface of the mortar-shaped insertion hole 27 by applying screen printing using a ceramic paste made of the same ceramic material as the second ceramic green sheet 26. ing. In this screen printing, ceramic paste is easily printed on the wall surface of the mortar-shaped insertion hole 27 by screen-printing ceramic paste so that the portion of the mortar-shaped insertion hole 27 can be sucked from the bottom of the printing stand of the screen printer. Can be formed. Moreover, since the ceramic paste used here is relatively low in viscosity and rich in fluidity, the uneven state of the wall surface of the mortar-shaped insertion hole 27 can be made a flat surface. In addition, on the upper surface of the ceramic printing pattern 28 provided on the wall surface of the mortar-shaped insertion hole 27, a conductive metal film may be provided by screen printing using a conductive paste as necessary. On this conductive metal film, an Ag plating film or the like can be formed, and a reflective layer that can more effectively reflect the light emitted from the light emitting element 12 can be formed.

次に、図２（Ｃ）に示すように、第１のセラミックグリーンシート２３、２３ａと、第２のセラミックグリーンシート２６は、重ね合わされて温度と圧力をかけて積層され、積層体２９を形成している。次いで、図２（Ｄ）に示すように、この積層体２９は、還元雰囲気中の１６５０℃程度の温度で第１のセラミックグリーンシート２３、２３ａ、第２のセラミックグリーンシート２６、導体印刷パターン２５、２５ａ、及びセラミック印刷パターン２８を同時焼成して焼成体を形成している。この焼成体は、同時焼成によって積層体２９から約３０％程度収縮して、導体配線パターン１８を設ける第１のセラミック基板１１、すり鉢状貫通孔１４の壁面にセラミック膜１６を設ける第２のセラミック基板１５の接合体からなる発光素子収納用パッケージ１０としている。なお、発光素子収納用パッケージ１０には、必要に応じて、外部に露出する金属部分にＮｉめっき被膜及びＡｕめっき被膜や、Ａｇめっき被膜等の貴金属めっき被膜が施される。   Next, as shown in FIG. 2C, the first ceramic green sheets 23 and 23 a and the second ceramic green sheet 26 are overlapped and stacked by applying temperature and pressure to form a stacked body 29. is doing. Next, as shown in FIG. 2D, the laminate 29 is composed of the first ceramic green sheets 23 and 23a, the second ceramic green sheet 26, and the conductor printed pattern 25 at a temperature of about 1650 ° C. in a reducing atmosphere. 25a and the ceramic printed pattern 28 are simultaneously fired to form a fired body. This fired body shrinks about 30% from the laminate 29 by simultaneous firing, and the first ceramic substrate 11 provided with the conductor wiring pattern 18 and the second ceramic provided with the ceramic film 16 on the wall surface of the mortar-shaped through-hole 14. The light emitting element storage package 10 is formed of a bonded body of the substrate 15. The light emitting element storage package 10 is provided with a noble metal plating film such as a Ni plating film, an Au plating film, or an Ag plating film on a metal portion exposed to the outside as necessary.

本発明の発光素子収納用パッケージは、ＬＥＤ等の発光素子を搭載させて発光効率を向上できる照明や、ディスプレイ等に用いることができる。   The light emitting element storage package of the present invention can be used for illumination, a display, or the like that can be equipped with a light emitting element such as an LED to improve the light emission efficiency.

（Ａ）、（Ｂ）はそれぞれ本発明の一実施の形態に係る発光素子収納用パッケージの平面図、Ａ−Ａ’線縦断面図である。(A), (B) is a top view of the light emitting element storage package which concerns on one embodiment of this invention, respectively, and an A-A 'line longitudinal cross-sectional view. （Ａ）〜（Ｄ）はそれぞれ同発光素子収納用パッケージの製造方法の説明図である。(A)-(D) is explanatory drawing of the manufacturing method of the package for the said light emitting element accommodation, respectively.

符号の説明Explanation of symbols

１０：発光素子収納用パッケージ、１１：第１のセラミック基板、１２：発光素子、１３：実装領域、１４：すり鉢状貫通孔、１５：第２のセラミック基板、１６：セラミック膜、１７：ビア導体、１８：導体配線パターン、１９：ダイボンドパッド、２０：ボンディングワイヤ、２１：ボンディングパッド、２２：外部接続端子パッド、２３、２３ａ：第１のセラミックグリーンシート、２４：ビア用貫通孔、２５、２５ａ：導体印刷パターン、２６：第２のセラミックグリーンシート、２７：挿通孔、２８：セラミック印刷パターン、２９：積層体   10: Light-emitting element storage package, 11: First ceramic substrate, 12: Light-emitting element, 13: Mounting area, 14: Mortar-shaped through hole, 15: Second ceramic substrate, 16: Ceramic film, 17: Via conductor , 18: conductor wiring pattern, 19: die bond pad, 20: bonding wire, 21: bonding pad, 22: external connection terminal pad, 23, 23a: first ceramic green sheet, 24: through-hole for via, 25, 25a : Conductor print pattern, 26: Second ceramic green sheet, 27: Insertion hole, 28: Ceramic print pattern, 29: Laminate

Claims (2)

発行素子を上面に搭載するための実装領域を有する平板状の第１のセラミック基板と、該第１のセラミック基板の前記実装領域を開口部として露出して該開口部の大きさが前記第１のセラミック基板との接合側である下面側より上面側が大きいすり鉢状貫通孔を有する第２のセラミック基板との接合体からなる発行素子収納用パッケージであって、
前記すり鉢状貫通孔の壁面に前記第２のセラミック基板と同じセラミック材からなるセラミックペーストが塗布、焼成されるセラミック膜を有することを特徴とする発行素子収納用パッケージ。 A flat plate-like first ceramic substrate having a mounting region for mounting the issuing element on the upper surface, and the mounting region of the first ceramic substrate is exposed as an opening, and the size of the opening is the first An issuance element storage package comprising a joined body with a second ceramic substrate having a mortar-shaped through hole whose upper surface side is larger than the lower surface side which is the bonding side with the ceramic substrate
A package for receiving element storage, comprising a ceramic film on which a ceramic paste made of the same ceramic material as that of the second ceramic substrate is applied and fired on a wall surface of the mortar-shaped through hole. 第１のセラミック基板の導体配線パターン用の導体印刷パターンを備える１又は複数枚からなる第１のセラミックグリーンシートと、第２のセラミック基板のすり鉢状貫通孔用の挿通孔を備える１又は複数枚からなる第２のセラミックグリーンシートを積層し、焼成して形成する発行素子収納用パッケージの製造方法において、
前記第１のセラミックグリーンシートに導体ペーストを用いてスクリーン印刷で前記導体印刷パターンを形成する工程と、
前記第２のセラミックグリーンシートにすり鉢状の前記挿通孔を成形し、該挿通孔の壁面に前記第２のセラミックグリーンシートと同じセラミック材からなるセラミックペーストをスクリーン印刷で塗布する工程と、
前記第１のセラミックグリーンシートと前記第２のセラミックグリーンシートを積層し、焼成して前記すり鉢状貫通孔の壁面にセラミック膜を形成する工程を有することを特徴とする発行素子収納用パッケージの製造方法。 One or a plurality of first ceramic green sheets each having a conductor printed pattern for a conductor wiring pattern of a first ceramic substrate, and one or a plurality of sheets having an insertion hole for a mortar-shaped through hole of a second ceramic substrate In the manufacturing method of the package for storage of the issuing element formed by laminating and firing the second ceramic green sheet comprising:
Forming the conductor print pattern by screen printing using a conductor paste on the first ceramic green sheet;
Forming the mortar-shaped insertion hole in the second ceramic green sheet, and applying a ceramic paste made of the same ceramic material as the second ceramic green sheet to the wall surface of the insertion hole by screen printing;
A manufacturing method for an issuance element storage package, comprising: laminating the first ceramic green sheet and the second ceramic green sheet and firing to form a ceramic film on a wall surface of the mortar-shaped through-hole. Method.
JP2005074752A 2005-03-16 2005-03-16 Package for containing light emitting element and its manufacturing process Pending JP2006261286A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246057A (en) * 2008-03-31 2009-10-22 Ngk Spark Plug Co Ltd Production process of wiring board for packaging light emitting device
JP2010009784A (en) * 2008-06-24 2010-01-14 Panasonic Electric Works Co Ltd Illuminating device and luminaire using it
JP2015207755A (en) * 2014-04-09 2015-11-19 日亜化学工業株式会社 light-emitting device
CN106876563A (en) * 2015-12-14 2017-06-20 亿光电子工业股份有限公司 Light emitting diode packaging structure and manufacturing method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246057A (en) * 2008-03-31 2009-10-22 Ngk Spark Plug Co Ltd Production process of wiring board for packaging light emitting device
JP2010009784A (en) * 2008-06-24 2010-01-14 Panasonic Electric Works Co Ltd Illuminating device and luminaire using it
JP2015207755A (en) * 2014-04-09 2015-11-19 日亜化学工業株式会社 light-emitting device
JP2019165246A (en) * 2014-04-09 2019-09-26 日亜化学工業株式会社 Light-emitting device
CN106876563A (en) * 2015-12-14 2017-06-20 亿光电子工业股份有限公司 Light emitting diode packaging structure and manufacturing method thereof
US10347795B2 (en) 2015-12-14 2019-07-09 Everlight Electronics Co., Ltd. Light emitting diode package structure with large luminous intensity in particular directions and manufacturing method thereof

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