JP2006049807A - Package for light emitting element - Google Patents

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JP2006049807A
JP2006049807A JP2005035937A JP2005035937A JP2006049807A JP 2006049807 A JP2006049807 A JP 2006049807A JP 2005035937 A JP2005035937 A JP 2005035937A JP 2005035937 A JP2005035937 A JP 2005035937A JP 2006049807 A JP2006049807 A JP 2006049807A
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light emitting
emitting element
light
substrate
package
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Setsuo Yada
節男 矢田
Kunihisa Hanai
邦壽 花井
Masahito Morita
雅仁 森田
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a light emitting element having a good light reflecting surface for reflecting a light emitting flux from a mounted light emitting element to the outside. <P>SOLUTION: The package for the light emitting element includes a substrate body having a mounting region of the light emitting element formed, and an upper substrate having a through hole formed. The through hole has a light outgoing side opening from which the light emitting flux from the light emitting element is radiated, a substrate body side opening with a smaller opening area than that of the light outgoing side opening, and an inner wall face. The shape of the inner wall face cut in a plane passing through the center of the light outgoing side opening and parallel to the lamination direction is formed to be a curve. Further, the light reflecting surface is formed on the inner wall face in one of spherical, parabola and hyperbola forms. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光ダイオード（Light emission diode：以下、ＬＥＤ素子とも記す）などの発光素子用パッケージに関するものである。   The present invention relates to a package for a light emitting element such as a light emission diode (hereinafter also referred to as an LED element).

発光素子の一つである発光ダイオード（ＬＥＤ素子）のパッケージとしては、従来からセラミック基板に実装するものが用いられている。その一例を図１１に示す。ＬＥＤ素子１は第一セラミック基板７１上に載置されており、金属配線７３ａ，７３ｂと電気的に接続されている。また、ＬＥＤ素子１を収容するキャビティ７４ができている。キャビティ７４は、第二セラミック基板７２を貫通するように形成されており、第一セラミック基板７１および第二セラミック基板７２は接着されている。発光素子用パッケージの大きさは数ミリ程度で、多数集めることで所望の光量を得ることができる。キャビティ７４の内周面には金属層７２が形成されており、ＬＥＤ素子１からの発光光束を反射する構成となっている。   As a package of a light emitting diode (LED element) which is one of the light emitting elements, a package mounted on a ceramic substrate has been conventionally used. An example is shown in FIG. The LED element 1 is placed on the first ceramic substrate 71 and is electrically connected to the metal wirings 73a and 73b. Further, a cavity 74 for accommodating the LED element 1 is formed. The cavity 74 is formed so as to penetrate the second ceramic substrate 72, and the first ceramic substrate 71 and the second ceramic substrate 72 are bonded together. The size of the light emitting element package is about several millimeters, and a desired amount of light can be obtained by collecting a large number. A metal layer 72 is formed on the inner peripheral surface of the cavity 74 and is configured to reflect the luminous flux from the LED element 1.

上記発光素子用パッケージは、例えばグリーンシート積層法により製造される。第一セラミック基板７１となるべきセラミックグリーンシートに、金属配線７３ａ，７３ｂとなるメタライズペーストを塗布するとともに、第二セラミック基板７２を打ち抜いてキャビティ７４を形成し、該キャビティ７４の内周面に金属層７２となるメタライズペーストを塗布する。その後、各セラミック基板７１，７２を接着し、高温で焼結して、各セラミック基板７１，７２が一体となった焼結体を得る。そして、金属層７２上にニッケルメッキ層や金メッキ層などを、周知の無電解メッキ法や電解メッキ法で被着させる。   The light emitting element package is manufactured by, for example, a green sheet lamination method. A metallized paste to be the metal wirings 73a and 73b is applied to the ceramic green sheet to be the first ceramic substrate 71, and the second ceramic substrate 72 is punched to form a cavity 74. A metal is formed on the inner peripheral surface of the cavity 74. A metallized paste to be the layer 72 is applied. Thereafter, the ceramic substrates 71 and 72 are bonded and sintered at a high temperature to obtain a sintered body in which the ceramic substrates 71 and 72 are integrated. Then, a nickel plating layer, a gold plating layer, or the like is deposited on the metal layer 72 by a known electroless plating method or electrolytic plating method.

ところが上記キャビティ７４は、第二セラミック基板７２を打ち抜いて形成するために角度θが直角になり、ＬＥＤ素子１からの発光光束が外部に放出されず、望ましい視野角と輝度が得られない問題があった。そこで下記特許文献１などのように、角度θが５５°〜７０°となるように穿孔し、且つ金属層の中心線平均粗さＲａを１〜３μｍ、光反射率を８０％以上とすることで、高い発光効率が得られる発光素子用パッケージが提案されている。
特開２００２−２３２０１７号公報 However, since the cavity 74 is formed by punching the second ceramic substrate 72, the angle θ becomes a right angle, the luminous flux from the LED element 1 is not emitted to the outside, and the desired viewing angle and brightness cannot be obtained. there were. Therefore, as described in Patent Document 1 below, the angle θ is 55 ° to 70 °, the center line average roughness Ra of the metal layer is 1 to 3 μm, and the light reflectance is 80% or more. Thus, a package for a light-emitting element capable of obtaining high luminous efficiency has been proposed.
Japanese Patent Laid-Open No. 2002-232017

ところが、角度θが常に一定の角度となるように穿孔するのは難しく、量産すると角度θにバラツキが生じてしまう問題があった。また、メタライズペーストをグリーンシートに塗布して、セラミックとの同時焼成によって金属層を形成すると、表面に屈曲が生じ易く、良質の光反射面を形成するのが難しい。そのため、輝度や視野角のバラツキが大きくなるという問題があった。   However, it is difficult to perforate so that the angle θ is always a constant angle, and there is a problem that the angle θ varies when it is mass-produced. Further, when a metallized paste is applied to a green sheet and a metal layer is formed by simultaneous firing with ceramic, the surface is likely to be bent, and it is difficult to form a high-quality light reflecting surface. Therefore, there has been a problem that variations in luminance and viewing angle become large.

上記問題から、本発明の課題は、実装された発光素子からの発光光束を外部に反射する良好な光反射面を有する発光素子用パッケージを提供することである。   In view of the above problems, an object of the present invention is to provide a package for a light emitting element having a good light reflecting surface that reflects a light beam emitted from a mounted light emitting element to the outside.

課題を解決するための手段および発明の効果Means for Solving the Problems and Effects of the Invention

上記課題を解決するための本発明の発光素子用パッケージは、
発光素子の実装領域が形成された基板本体部と、
貫通孔が形成された上部基板とを備え、
貫通孔は、発光素子からの発光光束が放射される光取出し側開口部と、その光取出し側開口部よりも開口部の面積の小さい基板本体部側開口部と、内壁面とを有し、
内壁面には発光素子からの発光光束を反射する光反射面が形成され、
上部基板は、基板本体部の実装領域が形成された面上に開口部から実装領域が露出するように積層され、
光取出し側開口部の中心を通り積層方向に平行な平面で切断した場合の内壁面の形状が湾曲形状となっている。 The package for a light emitting device of the present invention for solving the above problems is
A substrate body portion on which a light emitting element mounting region is formed;
An upper substrate formed with a through hole,
The through-hole has a light extraction side opening from which the luminous flux from the light emitting element is radiated, a substrate main body side opening having a smaller area than the light extraction side opening, and an inner wall surface,
A light reflecting surface for reflecting the luminous flux from the light emitting element is formed on the inner wall surface,
The upper substrate is laminated so that the mounting region is exposed from the opening on the surface of the substrate main body where the mounting region is formed,
The shape of the inner wall surface when cut along a plane passing through the center of the light extraction side opening and parallel to the stacking direction is a curved shape.

開口が底面よりも広くなるように、発光素子を取り囲む経路に沿って、厚み方向の断面が凹状の湾曲面形態に形成された内壁面を有するキャビティによりＬＥＤ素子が取り囲まれる形状とする。このように凹状の湾曲面形態に内壁面が形成されていることから、この内壁面に形成された光反射面によって、効率よく発光素子からの発光光束を開口より取り出すことができる。   The LED element is surrounded by a cavity having an inner wall surface formed in a curved surface having a concave cross section in the thickness direction along a path surrounding the light emitting element so that the opening is wider than the bottom surface. Thus, since the inner wall surface is formed in the concave curved surface form, the emitted light flux from the light emitting element can be efficiently taken out from the opening by the light reflecting surface formed on the inner wall surface.

そして、発光素子用パッケージの湾曲面に形成された光反射面は、球面、パラボラ、双曲面のいずれかとなる形状に形成することができる。または発光素子用パッケージの内壁面の湾曲形状を、球面、パラボラ、双曲面のいずれかとなる形状に形成し、さらに光反射面も内壁面の湾曲形状に対応した球面、パラボラ、双曲面としてもよい。どの形状に湾曲面を作製するかによって、取り出す光の指向性や反射光の焦点を変えることができる。具体的には、指向性は、双曲面、球面、パラボラ形状の順に高くなる。また頂点から焦点までの距離は、双曲面、球面、パラボラの順に長くなる。したがって所望の指向性が得られるように選択するとよい。またこのような形状を採ることにより、効率よく発光素子からの光を取り出すことができる。   The light reflecting surface formed on the curved surface of the light emitting device package can be formed into a spherical shape, a parabola, or a hyperboloid. Alternatively, the curved shape of the inner wall surface of the light emitting element package may be a spherical surface, parabola, or hyperboloid, and the light reflecting surface may be a spherical surface, parabola, or hyperboloid corresponding to the curved shape of the inner wall surface. . The directivity of the extracted light and the focus of the reflected light can be changed depending on the shape of the curved surface to be produced. Specifically, the directivity increases in the order of hyperboloid, spherical surface, and parabolic shape. The distance from the vertex to the focal point becomes longer in the order of hyperboloid, spherical surface, and parabola. Therefore, it is preferable to select so as to obtain a desired directivity. Further, by adopting such a shape, light from the light emitting element can be extracted efficiently.

キャビティの開口は、円状に形成され、反射面は、開口に沿う円周状経路に沿って形成するとよい。このように開口を円状に形成することによって、発光素子から放出されたあらゆる方向の光を、効率よくパッケージ外へ取り出すことができる。   The opening of the cavity is preferably formed in a circular shape, and the reflecting surface is preferably formed along a circumferential path along the opening. By forming the opening in a circular shape in this way, light in all directions emitted from the light emitting element can be efficiently extracted out of the package.

光反射面は、金属を含む材料により形成する。例えば、Ｍｏ−Ｍｎ、Ｍｏ、Ｗ、Ｗ−Ｍｎ等により形成することができる。しかし、以上の金属には限られない。特に光反射率の高い金属材料で作製すると、効率よく光を取り出すことができる。   The light reflecting surface is formed of a material containing metal. For example, it can be formed of Mo-Mn, Mo, W, W-Mn, or the like. However, it is not limited to the above metals. In particular, when a metal material having a high light reflectance is used, light can be extracted efficiently.

上部基板は、複数の基板を積層した積層体により形成することができる。このような上部基板は、セラミックにより形成することができる。さらにこの上部基板は、セラミックグリーンシートを積層圧着して形成することができる。   The upper substrate can be formed by a stacked body in which a plurality of substrates are stacked. Such an upper substrate can be formed of ceramic. Further, the upper substrate can be formed by laminating and bonding ceramic green sheets.

上部基板と光反射面とを、金属により一体として形成することもできる。この場合、上部基板とセラミック本体部とは、ロウ材により接着するとよい。接着に用いるロウ材としては、Ａｇ系、Ｐｂ−Ｓｎ系、Ａｇ−Ｃｕ系、Ａｕ−Ｓｉ系、Ａｕ−Ｇｅ系などを挙げることができる。   The upper substrate and the light reflecting surface can be integrally formed of metal. In this case, the upper substrate and the ceramic main body may be bonded with a brazing material. Examples of the brazing material used for bonding include Ag-based, Pb-Sn-based, Ag-Cu-based, Au-Si-based, and Au-Ge-based.

光反射面は、金属を含むロウ材により形成することができる。このようなロウ材としては、銀系、ニッケル系、アルミニウム系などが挙げられるが、銀ロウ材を使用することが特によい。積層体により階段状に形成され、その厚み方向の断面において階段の各エッジが凹状の湾曲面形態に形成された場合は、その階段形状をなくし湾曲形状とするための銀ロウ材で階段部分を覆うとよい。さらに金属により上部基板を形成し、その厚み方向の断面において階段の各エッジが凹状の湾曲面形態に形成して、銀ロウ材により、階段形状をなくして湾曲形状となるようにすることもできる。銀ロウ材は、主成分（７０％以上を含むものとする）のＡｇと、Ｃｕとを含む合金から成る。例えば、Ａｇを質量換算で最も多く含有するＡｇ−２８Ｃｕロウ材（これは一般的なＡｇロウ材）が使用できる。この銀ロウ材に湾曲面を覆うことで良好な光反射面を形成することができる。   The light reflecting surface can be formed of a brazing material containing metal. Examples of such a brazing material include silver-based, nickel-based, and aluminum-based materials, and it is particularly preferable to use a silver brazing material. If the laminate is formed in a staircase shape and each edge of the staircase is formed in a concave curved surface shape in the cross section in the thickness direction, the staircase portion is made of silver brazing material to eliminate the staircase shape and make it a curved shape. Cover it. Furthermore, the upper substrate can be formed of metal, and each edge of the staircase can be formed into a concave curved surface shape in the cross section in the thickness direction, and the silver brazing material can be used to eliminate the staircase shape and to have a curved shape. . The silver brazing material is made of an alloy containing Ag as a main component (including 70% or more) and Cu. For example, an Ag-28Cu brazing material (this is a general Ag brazing material) containing the most Ag in terms of mass can be used. A good light reflecting surface can be formed by covering the silver brazing material with the curved surface.

さらに上記課題を解決するために、本発明の発光素子用パッケージは、基板本体部の実装領域に、発光素子を設置するための実装部材を有する。そして、その実装部材に発光素子を搭載することにより、発光素子を基板本体部から光取出し側開口部側へ離れた位置に実装する。このように実装部材を基板本体部に設置し、その上に発光素子を設置すると、基板本体部から離れた光取出し側開口部に発光素子が近くなることから、発光素子からの発光光束を効率よく外部に放出することができる。また発光素子の側方方向から放出される発光光束も光反射面によって反射して外部に取り出しやすくなる。   Furthermore, in order to solve the said subject, the package for light emitting elements of this invention has the mounting member for installing a light emitting element in the mounting area | region of a board | substrate main-body part. Then, by mounting the light emitting element on the mounting member, the light emitting element is mounted at a position away from the substrate main body portion toward the light extraction side opening. When the mounting member is installed on the board body and the light emitting element is placed thereon, the light emitting element is close to the light extraction side opening away from the board body, so that the luminous flux from the light emitting element is efficiently used. Can be released to the outside well. In addition, the luminous flux emitted from the side direction of the light emitting element is also reflected by the light reflecting surface and is easily taken out.

そして実装部材は、絶縁材料により形成される。絶縁材料としては、例えば、基板本体部と同様のセラミックにより構成するとよい。但し、実装部材の材料は、これに限られず、他の絶縁材料を用いてもよい。そして実装部材を、絶縁材料により構成することにより、実装部材には、発光素子へ外部から給電するために接続される導体配線を内層することができる。   The mounting member is made of an insulating material. As the insulating material, for example, it may be made of the same ceramic as the substrate body. However, the material of the mounting member is not limited to this, and other insulating materials may be used. By configuring the mounting member with an insulating material, the mounting member can be provided with an inner layer of conductor wiring that is connected to supply power to the light emitting element from the outside.

基板本体部に上部基板が積層された発光素子用パッケージにおいて、基板本体部と上部基板との間に絶縁層を有し、上部基板に形成された光反射面と基板本体部とが間隙を有するように構成してもよい。このように基板本体部と上部基板との間に絶縁層を有するように構成すると、光反射面が基板本体部から断絶された状態となり、光反射面と基板本体部とが絶縁される。このため、光反射面と発光素子または基板本体部の導体配線との短絡を防ぐことができる。   In a package for a light emitting device in which an upper substrate is stacked on a substrate main body, an insulating layer is provided between the substrate main body and the upper substrate, and a light reflection surface formed on the upper substrate and the substrate main body have a gap. You may comprise as follows. Thus, when it comprises so that it may have an insulating layer between a board | substrate body part and an upper board | substrate, it will be in the state from which the light reflection surface was interrupted | isolated from the board | substrate body part, and a light reflection surface and a board | substrate body part are insulated. For this reason, it is possible to prevent a short circuit between the light reflecting surface and the light emitting element or the conductor wiring of the substrate body.

そして上部基板が金属により形成された場合に、基板本体部と絶縁層との接着、及び絶縁層と上部基板との接着の少なくとも一方を、ロウ材により接着することができる。   When the upper substrate is made of metal, at least one of the adhesion between the substrate body and the insulating layer and the adhesion between the insulating layer and the upper substrate can be bonded with a brazing material.

以下、図を参照しつつ本発明の実施形態について説明する。図１（ａ）は本発明の発光素子用パッケージの一実施形態を示す要部断面図であり、図１（ｂ）は同じく平面図である。セラミック基板１５は、セラミック基板本体部１７、貫通孔を備える上部基板１８とが一体として形成されている。セラミック基板１５は、例えば酸化アルミニウムや窒化アルミニウム等のセラミック材料からなる略四角平板であり、一方の主表面に有底のキャビティ３を有している。キャビティ３の光取出し側開口部は、キャビティ底面１６（基板本体部側開口部）より広く、内壁面４は、厚み方向の断面が凹状の湾曲面形態に形成されている。キャビティ底面１６上にＬＥＤ素子１の実装領域２５を有しており、ＬＥＤ素子１の支持基板として機能する。キャビティ底面１６には金属パッド８ａ，８ｂが構成されている。ＬＥＤ素子１は、実装領域２５に接着されるとともに、ボンディングワイヤ２を介して金属パッド８ａ，８ｂと電気的に接続されている。金属パッド８ａ，８ｂはセラミック基板１５の裏面にある外部端子２６ａ，２６ｂと導通しており、ここからＬＥＤ素子１の駆動電流を流す。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig.1 (a) is principal part sectional drawing which shows one Embodiment of the package for light emitting elements of this invention, FIG.1 (b) is a top view similarly. The ceramic substrate 15 is integrally formed with a ceramic substrate body 17 and an upper substrate 18 having a through hole. The ceramic substrate 15 is a substantially rectangular flat plate made of a ceramic material such as aluminum oxide or aluminum nitride, and has a bottomed cavity 3 on one main surface. The light extraction side opening of the cavity 3 is wider than the cavity bottom surface 16 (substrate body side opening), and the inner wall surface 4 is formed in a curved surface with a concave section in the thickness direction. The mounting area 25 of the LED element 1 is provided on the cavity bottom surface 16 and functions as a support substrate for the LED element 1. Metal pads 8 a and 8 b are formed on the cavity bottom surface 16. The LED element 1 is bonded to the mounting region 25 and is electrically connected to the metal pads 8a and 8b via the bonding wires 2. The metal pads 8a and 8b are electrically connected to the external terminals 26a and 26b on the back surface of the ceramic substrate 15, and a driving current for the LED element 1 flows from here.

内壁面４には、例えばＭｏ−Ｍｎ、Ｍｏ、Ｗ、Ｗ−Ｍｎ等からなるメタライズ層（金属層）７が、ＬＥＤ素子１を取り囲む経路に沿って形成されている。メタライズ層７が、光反射面６を形成する。この光反射面６が、ＬＥＤ素子１からの発光光束を外部へ反射する。あるいは、メタライズ層７の表面を覆う形態で銀ロウ材によって光反射面６が形成されていてもよい。銀ロウ材は、主成分（７０％以上を含むものとする）のＡｇと、Ｃｕとを含む合金から成る。例えば、Ａｇを質量換算で最も多く含有するＡｇ−２８Ｃｕロウ材（これは一般的なＡｇロウ材）が使用される。また光反射面６の表面に電解メッキ法や無電解メッキ法によりニッケルや銀、白金、パラジウム等などのメッキを施して、光の反射率をより高めることもできる。特に、表面に銀メッキを施すと高い反射効率が得られる。   On the inner wall surface 4, a metallized layer (metal layer) 7 made of, for example, Mo—Mn, Mo, W, W—Mn or the like is formed along a path surrounding the LED element 1. The metallized layer 7 forms the light reflecting surface 6. The light reflecting surface 6 reflects the emitted light beam from the LED element 1 to the outside. Alternatively, the light reflecting surface 6 may be formed of a silver brazing material so as to cover the surface of the metallized layer 7. The silver brazing material is made of an alloy containing Ag as a main component (including 70% or more) and Cu. For example, an Ag-28Cu brazing material (this is a general Ag brazing material) containing the most Ag in terms of mass is used. Further, the light reflectance can be further increased by plating the surface of the light reflecting surface 6 with nickel, silver, platinum, palladium or the like by electrolytic plating or electroless plating. In particular, when the surface is plated with silver, high reflection efficiency can be obtained.

キャビティ３の開口５は、図１（ｂ）に示すようにＬＥＤ素子１を中心とした円周状に形成されていることが望ましい。その理由は、ＬＥＤ素子１からの発光光束を光反射面６が均一に反射して、外部に放出できるからである。   The opening 5 of the cavity 3 is preferably formed in a circumferential shape centering on the LED element 1 as shown in FIG. The reason is that the luminous flux from the LED element 1 can be uniformly reflected by the light reflecting surface 6 and emitted to the outside.

図２に上部基板の拡大図を示す。（ａ）は、開口５の中心を通る軸４１上の開口部上方に中心４２を有する球面状に光反射面６が形成されたセラミック基板１５を示す。また（ｂ）は、開口５の中心４３上に中心を有する球面状に光反射面が形成されたセラミック基板１５を示す。内壁面４は、中心からの距離がＲの球面上に位置する。またメタライズ層７の光反射面６の角度は、中心４２，４３からの光反射面６までの距離Ｒ’およびＲ中心位置によって決定される。この光反射面６の形状は、視野角および輝度に影響を与える重要なパラメータであり、Ｒ’およびＲ中心位置は、ユーザーの要求する視野角や輝度を満たすように設計される。   FIG. 2 shows an enlarged view of the upper substrate. (A) shows the ceramic substrate 15 in which the light reflecting surface 6 is formed in a spherical shape having a center 42 above the opening on the axis 41 passing through the center of the opening 5. (B) shows the ceramic substrate 15 in which the light reflecting surface is formed in a spherical shape having a center on the center 43 of the opening 5. The inner wall surface 4 is located on a spherical surface whose distance from the center is R. The angle of the light reflection surface 6 of the metallized layer 7 is determined by the distance R ′ from the centers 42 and 43 to the light reflection surface 6 and the R center position. The shape of the light reflecting surface 6 is an important parameter that affects the viewing angle and luminance, and the R ′ and R center positions are designed to satisfy the viewing angle and luminance required by the user.

図３，４を用いて発光素子用パッケージの製造方法に係わる一実施形態を、説明する。まず、図３（ａ）に示すように上部セラミック基板となるべきグリーンシート１０ａ，１０ｂを用意する。このようなグリーンシートは、セラミック微粉末と有機結合材、可塑剤、溶剤などの混合スリップを、周知のドクタープレード法やカレンダー法で薄板状にすることで作成される。   An embodiment relating to a method of manufacturing a light emitting device package will be described with reference to FIGS. First, as shown in FIG. 3A, green sheets 10a and 10b to be upper ceramic substrates are prepared. Such a green sheet is produced by making a mixed slip of ceramic fine powder and an organic binder, a plasticizer, a solvent, etc. into a thin plate shape by a well-known doctor blade method or calendar method.

図３（ｂ）に示すように、グリーンシート１０ａ，１０ｂを合わせて、（ｃ）に示すように、パンチによってテーパ状に打ち抜き、貫通孔４６を形成する。このときこの貫通孔４６は、円形状に形成される。このようにパンチによって打ち抜きを行う前に、少なくとも貫通孔形成領域をセラミックグリーンシートの軟化温度まで上げておくとよい。続いて（ｄ）に示すように、設置台４８上にこのグリーンシート１０ａ，１０ｂを置いて、Ｒ形成治具４７の先端部を貫通孔４６に押し当てる。これにより内壁面をＲ形状とできる。   As shown in FIG. 3B, the green sheets 10a and 10b are put together, and as shown in FIG. At this time, the through hole 46 is formed in a circular shape. Thus, before punching with a punch, it is preferable to raise at least the through hole forming region to the softening temperature of the ceramic green sheet. Subsequently, as shown in (d), the green sheets 10 a and 10 b are placed on the installation table 48, and the tip of the R forming jig 47 is pressed against the through hole 46. Thereby, an inner wall surface can be made into R shape.

図４（ａ）に、Ｒ形成治具４７の先端部を貫通孔４６に押し当てたところを示す。そしてＲ形成治具４７を外すと、（ｂ）に示すように、Ｒ形状の貫通孔４６が形成される。異なる先端形状を有するＲ形成治具を使用することで、異なったＲ形状を形成することが可能である。設置する発光素子の種類や、個数、外部に取りだす光の幅等を考慮して、目的にあった形状のＲ形成治具を使用する。   FIG. 4A shows a state where the tip of the R forming jig 47 is pressed against the through hole 46. When the R forming jig 47 is removed, an R-shaped through hole 46 is formed as shown in FIG. By using R forming jigs having different tip shapes, it is possible to form different R shapes. In consideration of the type and number of light emitting elements to be installed, the width of light extracted outside, etc., an R forming jig having a shape suitable for the purpose is used.

次に図４（ｃ）に示すように、上部セラミック基板用のグリーンシート１０ａ，１０ｂの形成された貫通孔４６の内周面にメタライズ層７用のメタライズペーストを印刷する。なお貫通孔４６の図の上面側が光取出し側開口部、下面側が基板本体部側開口部となる。またセラミック基板本体部１７用のグリーンシート１７ａにスルーホールを形成する。そしてメタライズペーストによりスルーホール導体２７ａ，２７ｂを形成する。裏面に外部端子２６ａ，２６ｂ用、上面に金属パッド８ａ，８ｂ用のメタライズペーストを、スクリーン印刷法により印刷する。   Next, as shown in FIG. 4C, the metallized paste for the metallized layer 7 is printed on the inner peripheral surface of the through hole 46 in which the green sheets 10a and 10b for the upper ceramic substrate are formed. The upper surface side of the through hole 46 in the figure is the light extraction side opening, and the lower surface side is the substrate body side opening. In addition, a through hole is formed in the green sheet 17 a for the ceramic substrate body 17. Then, through-hole conductors 27a and 27b are formed by metallized paste. Metallized paste for external terminals 26a and 26b on the back surface and metal pads 8a and 8b on the top surface is printed by a screen printing method.

図４（ｄ）に示すように、セラミック基板となるべきグリーンシート１０ａ，１０ｂ，１７ａを積層し、接着して一体化する。これにより前工程で形成されたＲ形状の貫通穴４６は、ＬＥＤ素子を収容するキャビティ３となる。その後、グリーンシートを焼成すると、セラミック基板１０ａ，１０ｂ，１７ａが一体化し、キャビティ３を有し、上部基板１８とセラミック基板本体部１７とを有する焼結体が得られる。   As shown in FIG. 4 (d), green sheets 10a, 10b, and 17a to be ceramic substrates are stacked and bonded and integrated. Thereby, the R-shaped through hole 46 formed in the previous step becomes the cavity 3 for accommodating the LED element. Thereafter, when the green sheet is fired, the ceramic substrates 10a, 10b, and 17a are integrated, and a sintered body having the cavity 3 and having the upper substrate 18 and the ceramic substrate body 17 is obtained.

その後、メタライズ層をＡｇ系ロウ材で覆って光反射面６としてもよい。このＡｇ形ロウ材による光反射面６は、メタライズ層７にＡｇ系ロウ材の粒子を載置し、例えば８００℃程度の高温処理を施すことにより、粒子が融解し、Ａｇ系ロウ材によってメタライズ層７が覆われることによって形成される。これにより、ＬＥＤ素子１からの発光光束を効率的に外部へ反射できるようになる。さらに、上記光反射面６上に、図示しないニッケルメッキ層および銀メッキ層をこの順に形成してもよい。表面に銀メッキ層を形成することで、光反射率をさらに高めることができる。   Thereafter, the light reflecting surface 6 may be formed by covering the metallized layer with an Ag-based brazing material. The light-reflecting surface 6 made of this Ag-shaped brazing material is obtained by placing Ag-based brazing particles on the metallized layer 7 and subjecting them to high-temperature treatment, for example, about 800 ° C., so that the particles are melted. It is formed by covering the layer 7. As a result, the luminous flux from the LED element 1 can be efficiently reflected to the outside. Further, a nickel plating layer and a silver plating layer (not shown) may be formed on the light reflecting surface 6 in this order. By forming a silver plating layer on the surface, the light reflectance can be further increased.

図５（ａ）に発光素子用パッケージの他の実施形態を、図５（ｂ）に上部基板１８の内壁面周囲の拡大図を示す。セラミック基板３０は、セラミック基板本体部１７、上部基板１８とが一体として形成されている。セラミック基板１５は、例えば酸化アルミニウムや窒化アルミニウム等のセラミック材料からなる略四角平板であり、一方の主表面に有底のキャビティ３を有している。   FIG. 5A shows another embodiment of the light emitting device package, and FIG. 5B shows an enlarged view around the inner wall surface of the upper substrate 18. The ceramic substrate 30 is formed integrally with the ceramic substrate body 17 and the upper substrate 18. The ceramic substrate 15 is a substantially rectangular flat plate made of a ceramic material such as aluminum oxide or aluminum nitride, and has a bottomed cavity 3 on one main surface.

図５（ｂ）に示すように、キャビティ３の開口は、キャビティ底面１６より広く、上部基板１８は、内端面３４と上端面３５とにより、階段状に形成されている。そして、各段のエッジ３１は、半径Ｒの球面に位置するように形成されている。さらにこの内端面３４と上端面３５とには、メタライズ層７が形成され、このメタライズ層７の各段のエッジ３２は、半径Ｒ’の球面に位置するように形成されている。そして各段を埋めるように、フィレット部３７が、ロウ材により形成されている。フィレット部３７の表面が、光反射面３９をなす。   As shown in FIG. 5B, the opening of the cavity 3 is wider than the cavity bottom surface 16, and the upper substrate 18 is formed in a stepped shape by an inner end surface 34 and an upper end surface 35. The edge 31 of each step is formed so as to be positioned on a spherical surface having a radius R. Further, a metallized layer 7 is formed on the inner end surface 34 and the upper end surface 35, and the edge 32 of each step of the metallized layer 7 is formed so as to be positioned on a spherical surface having a radius R '. And the fillet part 37 is formed with the brazing material so that each step may be filled. The surface of the fillet portion 37 forms a light reflecting surface 39.

図６を用いて、図５の発光素子用パッケージ３０の球面状の光反射面の形成方法について説明する。（ａ）に示すように上部基板１８は、セラミックグリーンシート１０ａが複数階段状に積層されている。そしてその厚み方向の断面において階段の各エッジ３１が凹状の半径Ｒの球面上に形成されている。次に図５（ｂ）に示すように、内端面３４と上端面３５とに、メタライズ層７を形成するために、メタライズペーストを塗布する。メタライズペーストには、例えば、モリブデン、タングステン、銀、銅などの金属粉末が用いられる。メタライズ層７の各エッジ３２も、半径Ｒ’の球面上に形成される。   A method for forming a spherical light reflecting surface of the light emitting element package 30 of FIG. 5 will be described with reference to FIG. As shown in (a), the upper substrate 18 has a plurality of ceramic green sheets 10a stacked in a staircase pattern. In the cross section in the thickness direction, each edge 31 of the staircase is formed on a spherical surface having a concave radius R. Next, as shown in FIG. 5B, a metallized paste is applied to the inner end surface 34 and the upper end surface 35 in order to form the metallized layer 7. For the metallized paste, for example, metal powder such as molybdenum, tungsten, silver, or copper is used. Each edge 32 of the metallized layer 7 is also formed on a spherical surface having a radius R ′.

図６（ｃ）に示すように、銀ロウ材の粒子３６をキャビティへ流し込み、メタライズ層７上に粒子３６を載置する。そして、例えば８００℃程度の高温処理を施すと、粒子３６が融解して、（ｄ）に示すようにフィレット部３７が形成される。このフィレット部により、球面状の光反射面３９が形成される。この方法によれば、パンチによる打ち抜きや、Ｒ形成治具の使用が不要となる。   As shown in FIG. 6C, silver brazing material particles 36 are poured into the cavity, and the particles 36 are placed on the metallized layer 7. For example, when a high temperature treatment of about 800 ° C. is performed, the particles 36 are melted and the fillet portion 37 is formed as shown in FIG. A spherical light reflecting surface 39 is formed by the fillet portion. This method eliminates the need for punching and the use of an R forming jig.

上部基板４８を金属によって形成した実施例を図７に示す。発光素子用パッケージ４５は、上部基板４８が金属で形成され、基板本体部１７は、前述の実施例と同様にセラミックにより形成されている。上部基板４８は、板状の金属板であり、その金属板に、キャビティとなる貫通孔を球面状に形成し、セラミック基板本体部１７に載せて、ロウ材などを接着剤として一体として発光素子用パッケージとする。上部基板４８に用いる金属としては、例えば、Ｎｉ合金系、コバール、４２アロイ、ＣｕＷ、Ｃｕ系材、Ａｌ系材などを用いることができる。接着に用いるロウ材としては、Ａｇ系、Ｐｂ−Ｓｎ系、Ａｇ−Ｃｕ系、Ａｕ−Ｓｉ系、Ａｕ−Ｇｅ系などを挙げることができる。内壁面４は、球面形状に形成され、これが光反射面６をなす。金属により、上部基板４８が形成されているため、メタライズペーストを塗布して、メタライズ層を形成する必要はない。   An embodiment in which the upper substrate 48 is made of metal is shown in FIG. In the light emitting element package 45, the upper substrate 48 is made of metal, and the substrate body 17 is made of ceramic as in the above-described embodiment. The upper substrate 48 is a plate-like metal plate. A through-hole serving as a cavity is formed in a spherical shape in the metal plate, and is placed on the ceramic substrate main body portion 17. Package. As the metal used for the upper substrate 48, for example, Ni alloy-based, Kovar, 42 alloy, CuW, Cu-based material, Al-based material, or the like can be used. Examples of the brazing material used for bonding include Ag-based, Pb-Sn-based, Ag-Cu-based, Au-Si-based, and Au-Ge-based. The inner wall surface 4 is formed in a spherical shape, which forms a light reflecting surface 6. Since the upper substrate 48 is made of metal, it is not necessary to apply a metallized paste to form a metallized layer.

以上の実施例において、光反射面の形状は、球面であったが、球面に限られない。図８に光反射面をパラボラ（放物曲面）として形成した発光素子用パッケージ５０を示す。光反射面の形状をパラボラ（放物曲面）とし、放物面の焦点に発光素子を設置すれば、この発光素子から発光した光が、光反射面によって反射され、放物面の対称軸方向と平行に揃った良好な指向特性を示す。この光反射面の形状は、球面、パラボラ以外に、双曲面などにすることもでき、用途に合わせて、形状を選択するとよい。   In the above embodiments, the shape of the light reflecting surface is a spherical surface, but is not limited to a spherical surface. FIG. 8 shows a light emitting device package 50 in which the light reflecting surface is formed as a parabola (parabolic curved surface). If the shape of the light reflecting surface is parabolic (parabolic curved surface) and a light emitting element is installed at the focal point of the parabolic surface, the light emitted from the light emitting element is reflected by the light reflecting surface, and the axis of symmetry of the parabolic surface. Good directional characteristics aligned in parallel. The shape of the light reflecting surface may be a hyperboloid other than a spherical surface and a parabola, and the shape may be selected according to the application.

図９に基板本体部に実装部材６１を備え、実装部材６１を介して発光素子１を設置する例を示す。発光素子用パッケージ６０は、上部基板４８が金属で形成され、基板本体部１７は、セラミックにより形成されている。上部基板４８は、板状の金属板であり、その金属板に、キャビティとなる貫通孔を球面状に形成し、セラミック基板本体部１７に載せて、ロウ材などを接着剤として一体として発光素子用パッケージ６０とする。   FIG. 9 shows an example in which the mounting member 61 is provided in the substrate body and the light emitting element 1 is installed through the mounting member 61. In the light emitting element package 60, the upper substrate 48 is made of metal, and the substrate body 17 is made of ceramic. The upper substrate 48 is a plate-like metal plate. A through-hole serving as a cavity is formed in a spherical shape in the metal plate, and is placed on the ceramic substrate main body portion 17. Package 60.

基板本体部１７の実装領域２５には、絶縁材（セラミックシート）により実装部材６１が形成されている。実装部材６１は、基板本体部１７を形成する際に、セラミック基板となるグリーンシートを積層して焼成することにより、形成することができる。実装部材６１には、導体配線（配線パターン）２７が内層されて形成され、この導体配線２７は、実装部材の光取出し側開口側の面６１ａから、基板本体部１７を経て基板本体部１７の裏面の外部端子２６ａ，２６ｂまで形成されて、外部から発光素子１に給電するために用いられる。実装部材（セラミックシート）６１の厚みは、５０μｍ以上２００μｍ以下とするとよい。このような積層厚を有する実装部材６１により、発光素子１の搭載面１ａをキャビティ底面から底上げすると、発光素子１からの発光光束を効率よく外部に放出することができる。   A mounting member 61 is formed of an insulating material (ceramic sheet) in the mounting region 25 of the substrate body 17. The mounting member 61 can be formed by laminating and firing a green sheet to be a ceramic substrate when forming the substrate body portion 17. A conductor wiring (wiring pattern) 27 is formed on the mounting member 61 as an inner layer, and the conductor wiring 27 is formed on the light extraction side opening side surface 61a of the mounting member through the substrate body 17 and the substrate body 17. The external terminals 26a and 26b on the back surface are formed and used to supply power to the light emitting element 1 from the outside. The thickness of the mounting member (ceramic sheet) 61 is preferably 50 μm or more and 200 μm or less. When the mounting surface 1a of the light emitting element 1 is raised from the bottom surface of the cavity by the mounting member 61 having such a laminated thickness, the luminous flux from the light emitting element 1 can be efficiently emitted to the outside.

金属により形成された上部基板４８の内壁面４によって形成される光反射面６は、実装部材６１の表面６１ａより下方（基板本体部側）へ延びている。言い換えると、実装部材６１が基板本体部１７の表面（実装領域２５）よりも上方（開口側）へ積層されているため、その実装部材６１に設置される発光素子１は、光反射面６の下端よりは、上方に浮いた位置に実装されることになる。このような位置に発光素子１を設置することにより、発光素子１から発光される光束を効率よく外部に放出することができる。   The light reflecting surface 6 formed by the inner wall surface 4 of the upper substrate 48 formed of metal extends downward (substrate body side) from the surface 61 a of the mounting member 61. In other words, since the mounting member 61 is laminated above (opening side) the surface (mounting region 25) of the substrate main body portion 17, the light emitting element 1 installed on the mounting member 61 has the light reflecting surface 6. It is mounted at a position floating above the lower end. By installing the light emitting element 1 at such a position, the light emitted from the light emitting element 1 can be efficiently emitted to the outside.

この実施例においては、上部基板４８の光反射面６が球面である場合を示したが、放物曲面である場合にでも、実装部材を備え発光素子を底上げした位置に設置することができる。また金属によって構成される上部基板４８をセラミックによって構成される上部基板１８とした場合においても、実装部材６１を備える構造とすることができる。   In this embodiment, the case where the light reflecting surface 6 of the upper substrate 48 is a spherical surface is shown. However, even when the light reflecting surface 6 is a parabolic curved surface, the mounting member is provided and the light emitting element can be installed at the raised position. Even when the upper substrate 48 made of metal is the upper substrate 18 made of ceramic, a structure including the mounting member 61 can be provided.

図１０（ａ），図１０（ｂ）に、基板本体部１７と上部基板４８との間に絶縁層６６が形成された実施例を示す。図１０（ａ）に示すように、発光素子用パッケージ６５には、基板本体部１７にキャビティ６８が形成されてキャビティ底面が実装領域とされて発光素子１が設置されている。また発光素子１は、ボンディングワイヤ２を介して導体配線２７ａに接続され、その導体配線２７ａは、基板本体部６７のＳＭＤ（Solder Mask Defined）パッド２６ａと接続されている。また発光素子１の搭載面１ｓから導体配線２７ｂが、基板本体部６７の裏面に接続され、外部端子２６ｂが形成されている。   FIGS. 10A and 10B show an embodiment in which an insulating layer 66 is formed between the substrate body 17 and the upper substrate 48. As shown in FIG. 10A, in the light emitting element package 65, the light emitting element 1 is installed with a cavity 68 formed in the substrate body 17 and the bottom surface of the cavity as a mounting region. The light emitting element 1 is connected to the conductor wiring 27 a via the bonding wire 2, and the conductor wiring 27 a is connected to the SMD (Solder Mask Defined) pad 26 a of the substrate body 67. Further, the conductor wiring 27b is connected to the back surface of the substrate body 67 from the mounting surface 1s of the light emitting element 1, and the external terminal 26b is formed.

上部基板４８は、金属により構成され、内壁面４が光反射面６とされている。そして、この光反射面６、上部基板４８と、基板本体部１７とを電気的に絶縁するために、上部基板４８と基板本体部１７との間に絶縁層６６が形成されている。この部分の拡大図を図１０（ｂ）に示す。基板本体部１７の主表面１７ｓ上に導体配線２７ａが形成されている。そして、その導体配線２７ａ上にロウ材６７により絶縁層６６が接着され、さらにその絶縁層６６上にロウ材６７により上部基板４８が接着されている。接着に用いるロウ材６７は、前述の実施例同様に、Ａｇ系、Ｐｂ−Ｓｎ系、Ａｇ−Ｃｕ系、Ａｕ−Ｓｉ系、Ａｕ−Ｇｅ系などを用いることができる。このようにロウ材を利用することにより、基板本体部１７上に、絶縁層６６及び上部基板４８を容易に接着することができる。このように基板本体部１７と上部基板４８との間に絶縁層６６を介在させることにより、導体配線２７ａ、基板本体部１７、発光素子１等と、上部基板４８とに間隙ができるため、これらが短絡することを防ぐことができる。   The upper substrate 48 is made of metal, and the inner wall surface 4 is a light reflecting surface 6. An insulating layer 66 is formed between the upper substrate 48 and the substrate body 17 in order to electrically insulate the light reflecting surface 6, the upper substrate 48 and the substrate body 17. An enlarged view of this part is shown in FIG. Conductor wiring 27 a is formed on main surface 17 s of substrate body portion 17. An insulating layer 66 is bonded to the conductor wiring 27 a by a brazing material 67, and an upper substrate 48 is bonded to the insulating layer 66 by a brazing material 67. As the brazing material 67 used for bonding, Ag-based, Pb-Sn-based, Ag-Cu-based, Au-Si-based, Au-Ge-based, and the like can be used as in the above-described embodiments. By using the brazing material in this way, the insulating layer 66 and the upper substrate 48 can be easily bonded onto the substrate main body portion 17. Since the insulating layer 66 is interposed between the substrate main body portion 17 and the upper substrate 48 in this manner, a gap is formed between the conductor wiring 27a, the substrate main body portion 17, the light emitting element 1 and the like and the upper substrate 48. Can be prevented from short-circuiting.

以上のように、パッケージに搭載される発光素子を囲むように形成されている上部基板の光反射面の形状を、球面や放物面等の湾曲形状とすることにより、搭載された発光素子からの発光光束を効率よく外部に放出することができる。さらに基板本体部の実装領域に、発光素子の搭載位置を光取出し側開口方向へ底上げするための実装部材を備えることにより、より効率よく発光素子からの発光光束を取り出すことができる。   As described above, by changing the shape of the light reflecting surface of the upper substrate formed so as to surround the light emitting element mounted on the package to a curved shape such as a spherical surface or a parabolic surface, Can be efficiently emitted to the outside. Furthermore, by providing a mounting member for raising the mounting position of the light emitting element toward the light extraction side opening in the mounting area of the substrate main body, it is possible to extract the luminous flux from the light emitting element more efficiently.

本発明の一実施形態を示す概略断面図と平面図。BRIEF DESCRIPTION OF THE DRAWINGS The schematic sectional drawing and top view which show one Embodiment of this invention. 上部基板の光反射面の形状を説明する図。The figure explaining the shape of the light reflection surface of an upper board | substrate. 本発明の発光素子用パッケージの工程図。FIG. 6 is a process diagram of the light-emitting element package of the present invention. 図３に続く工程図。Process drawing following FIG. エッジが球面上に位置するように形成された発光素子用パッケージの実施例。An example of a package for a light emitting element formed so that an edge is located on a spherical surface. 光反射面の形状の他の作製方法を説明する図。8A and 8B illustrate another method for manufacturing a shape of a light reflecting surface. 上部基板が金属によって形成された実施形態を示す概略断面図。FIG. 3 is a schematic cross-sectional view showing an embodiment in which an upper substrate is made of metal. 光反射面の形状が放物面として形成されている実施例。An example in which the shape of the light reflecting surface is formed as a parabolic surface. 実装部材を有する発光素子用パッケージを示す図。The figure which shows the package for light emitting elements which has a mounting member. 基板本体部と上部基板との間に絶縁層を有する発光素子用パッケージを示す図。The figure which shows the package for light emitting elements which has an insulating layer between a board | substrate main-body part and an upper board | substrate. 従来例を示す断面図。Sectional drawing which shows a prior art example.

符号の説明Explanation of symbols

１ ＬＥＤ素子
３ キャビティ
４ 内壁面
５ キャビティ開口
６ 光反射面
７ メタライズ層
１５ セラミック基板
１７ セラミック基板本体部
１８ 上部基板
４８ 金属上部基板
６１ 実装部材
DESCRIPTION OF SYMBOLS 1 LED element 3 Cavity 4 Inner wall surface 5 Cavity opening 6 Light reflection surface 7 Metallized layer 15 Ceramic substrate 17 Ceramic substrate main-body part 18 Upper substrate 48 Metal upper substrate 61 Mounting member

Claims (5)

発光素子の実装領域が形成された基板本体部と、
貫通孔が形成された上部基板とを備え、
前記貫通孔は、前記発光素子からの発光光束が放射される光取出し側開口部と、その光取出し側開口部よりも開口部の面積の小さい基板本体部側開口部と、内壁面とを有し、
前記内壁面には前記発光素子からの発光光束を反射する光反射面が形成され、
前記上部基板は、前記基板本体部の前記実装領域が形成された面上に前記開口部から前記実装領域が露出するように積層され、
前記光取出し側開口部の中心を通り積層方向に平行な平面で切断した場合の前記内壁面の形状が湾曲形状となっていることを特徴とする発光素子用パッケージ。 A substrate body portion on which a light emitting element mounting region is formed;
An upper substrate formed with a through hole,
The through hole has a light extraction side opening from which the luminous flux from the light emitting element is radiated, a substrate main body side opening having a smaller opening area than the light extraction side opening, and an inner wall surface. And
The inner wall surface is formed with a light reflecting surface for reflecting the luminous flux from the light emitting element,
The upper substrate is laminated so that the mounting region is exposed from the opening on the surface of the substrate main body where the mounting region is formed.
A package for a light-emitting element, wherein a shape of the inner wall surface is a curved shape when cut along a plane passing through the center of the light extraction side opening and parallel to the stacking direction. 前記光反射面は、球面、パラボラ、双曲面のいずれかとなる形状に形成された請求項１に記載の発光素子用パッケージ。   The light-emitting element package according to claim 1, wherein the light reflecting surface is formed in a shape that is any one of a spherical surface, a parabola, and a hyperboloid. 前記基板本体部の前記実装領域に、前記発光素子を設置するための実装部材を有し、その実装部材に前記発光素子を搭載することにより、前記発光素子を前記基板本体部から前記光取出し側開口部側へ離れた位置に実装する請求項１または２に記載の発光素子用パッケージ。   A mounting member for installing the light emitting element is provided in the mounting region of the substrate body, and the light emitting element is mounted on the mounting member so that the light emitting element is removed from the substrate body. The light emitting device package according to claim 1, wherein the light emitting device package is mounted at a position away from the opening. 前記実装部材は、絶縁材料により形成された請求項３に記載の発光素子用パッケージ。   The light emitting element package according to claim 3, wherein the mounting member is formed of an insulating material. 前記実装部材は、前記発光素子へ外部から給電するために接続される導体配線を内層する請求項３または４に記載の発光素子用パッケージ。
5. The light emitting element package according to claim 3, wherein the mounting member includes a conductor wiring connected to supply power to the light emitting element from the outside.
JP2005035937A 2004-07-05 2005-02-14 Package for light emitting element Pending JP2006049807A (en)

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JP2008085211A (en) * 2006-09-28 2008-04-10 Koa Corp Ceramic multilayer substrate with cavity and method for manufacturing it
JP2008153553A (en) * 2006-12-19 2008-07-03 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing same
WO2019222592A1 (en) * 2018-05-18 2019-11-21 Lumileds Llc Led device holder, led lighting system, and method of manufacture
CN111640846A (en) * 2020-05-25 2020-09-08 旭宇光电（深圳）股份有限公司 Deep ultraviolet LED packaging and lamp

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JP2000183407A (en) * 1998-12-16 2000-06-30 Rohm Co Ltd Optical semiconductor device
WO2004005216A1 (en) * 2002-07-09 2004-01-15 Kenichiro Miyahara Substrate for forming thin film, thin film substrate, optical wave guide, luminescent element and substrate for carrying luminescent element

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Publication number Priority date Publication date Assignee Title
JPH10215001A (en) * 1997-01-31 1998-08-11 Nichia Chem Ind Ltd Light emitting device
JPH11345999A (en) * 1998-06-01 1999-12-14 Matsushita Electron Corp Photoelectric conversion device
JP2000183407A (en) * 1998-12-16 2000-06-30 Rohm Co Ltd Optical semiconductor device
WO2004005216A1 (en) * 2002-07-09 2004-01-15 Kenichiro Miyahara Substrate for forming thin film, thin film substrate, optical wave guide, luminescent element and substrate for carrying luminescent element

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008085211A (en) * 2006-09-28 2008-04-10 Koa Corp Ceramic multilayer substrate with cavity and method for manufacturing it
JP2008153553A (en) * 2006-12-19 2008-07-03 Nichia Chem Ind Ltd Light-emitting device and method of manufacturing same
WO2019222592A1 (en) * 2018-05-18 2019-11-21 Lumileds Llc Led device holder, led lighting system, and method of manufacture
US10655821B2 (en) 2018-05-18 2020-05-19 Lumileds Llc LED device holder, LED lighting system, and method of manufacture
US11015786B2 (en) 2018-05-18 2021-05-25 Lumileds Llc LED device holder, LED lighting system, and method of manufacture
CN111640846A (en) * 2020-05-25 2020-09-08 旭宇光电（深圳）股份有限公司 Deep ultraviolet LED packaging and lamp
CN111640846B (en) * 2020-05-25 2021-05-14 旭宇光电（深圳）股份有限公司 Deep ultraviolet LED packaging and lamp

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