JP2005243738A - Accommodating light-emitting device and package therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for accommodating a light-emitting device that can efficiently radiate light emitted by a light-emitting element and has high visibility, and to provide the light-emitting device. <P>SOLUTION: The package for accommodating light-emitting elements comprises an insulating substrate 1 that has a recess 4 for accommodating the light-emitting element 3 on the upper surface, and forms a mounting section 2 of the light-emitting element 3 at the center of the bottom surface of the recess 4; and wiring conductors 5a, 5b that are formed on the bottom surface of the recess 4 and allow the electrodes of the light-emitting element 3 to be electrically connected. A frame body 8 in which inner dimensions gradually decrease toward the upper opening from the lower one and an inner-periphery surface is inwardly convex is fitted to the inner surface of the recess 4. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light-emitting element storage package and a light-emitting device for storing a light-emitting element, which are used in a display device using a light-emitting element such as a light-emitting diode.

  Conventionally, a ceramic package has been used as a light-emitting element storage package (hereinafter also referred to as a package) for storing light-emitting elements such as light-emitting diodes, and an example thereof is shown in FIG. Reference 1). As shown in the figure, the conventional package has a plurality of ceramics in which a concave portion 14 is formed on the top surface and a mounting portion 12 including a conductor layer for mounting the light emitting element 13 is provided on the bottom surface of the concave portion 14. It is mainly composed of a rectangular parallelepiped insulating base 11 in which layers are laminated, and a pair of wiring conductors 15 formed from the mounting portion 12 of the insulating base 11 and its periphery to the lower surface of the insulating base 11. Further, the inner peripheral surface of the recess 14 of the insulating base 11 is formed so as to spread outward from the bottom surface of the recess 14 to the upper surface of the insulating base 11 in order to radiate light to the outside satisfactorily.

  Then, the light emitting element 13 is placed and fixed on the mounting portion 12 to which one end of one wiring conductor 15 is electrically connected via a conductive adhesive, solder, and the like, and is electrically connected. By electrically connecting the electrode and the other wiring conductor 15 via the bonding wire 16, and then filling the recess 14 of the insulating base 11 with a transparent resin (not shown) to seal the light emitting element 13. A light emitting device is manufactured.

  Further, in order to reflect the light of the light emitting element 13 on the inner peripheral surface of the recess 14 and to emit light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the recess 14. A metal layer 17 made of a metallized layer on the surface may be deposited.

  The above package is manufactured by the ceramic green sheet lamination method as follows. First, a ceramic green sheet (hereinafter referred to as green sheet A) for forming a portion below the plane on which the mounting portion 12 of the insulating base 11 is located, and a ceramic for forming the side wall of the recess 14 of the insulating base 11. A green sheet (hereinafter referred to as “green sheet B”) is prepared, and through holes for forming the wiring conductor 15 in these green sheets A and B and through holes to be the recesses 14 are formed by a punching method.

  Next, a conductive paste for forming a wiring conductor 15 made of a metallized layer is printed and applied to a through hole and a predetermined portion of the green sheet A by a screen printing method or the like. A conductor paste for forming the metal layer 17 is printed on the inner peripheral surface by screen printing or the like.

Next, the green sheet A and the green sheet B are laminated and bonded to form a laminated body for forming the insulating substrate 11, which is cut into a predetermined size to form a molded body, which is fired at a high temperature (about 1600 ° C.). To make a sintered body. Thereafter, a package is manufactured by depositing a plated metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring conductor 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
Japanese Patent Laid-Open No. 2002-232017

  However, in the above conventional package, the inner peripheral surface of the recess 14 is formed so as to spread outward from the bottom surface of the recess 14 toward the upper surface of the insulating base. From the opening, there is a problem that light emitted from the light emitting element 13 is easily emitted over a wide range, and the directivity of the light from the light emitting element 13 in the front direction is lowered. For this reason, there are problems that the luminance in the front direction is lowered, the contour in the vicinity of the opening of the recess 14 is blurred, and the visibility from the front direction is lowered.

  Therefore, the present invention has been completed in view of the above-described conventional problems, and an object of the present invention is to efficiently emit light emitted from the light emitting element and to achieve high visibility. It is an object to provide a light emitting element storage package and a light emitting device.

  The light emitting element storage package of the present invention includes an insulating base having a recess for receiving the light emitting element on the top surface and a mounting portion of the light emitting element formed at the center of the bottom surface of the recess, and a bottom surface of the recess. And a wiring conductor to which the electrode of the light emitting element is electrically connected. The inner dimension of the inner surface of the recess gradually decreases from the lower opening toward the upper opening. A frame body having an inner peripheral surface protruding inward is fitted.

  In the light emitting element storage package according to the present invention, preferably, the insulating base is characterized in that the exposed portion of the bottom surface of the recess is a light reflecting surface.

  In the light emitting element storage package of the present invention, it is preferable that the frame body has an upper opening edge that coincides with an outer periphery of the light emitting element in a plan view or is on an inner side of the outer periphery.

  In the light emitting element storage package according to the present invention, it is preferable that the frame body contains at least one of aluminum, silver, gold, palladium, and platinum as a main component.

  In the light emitting element storage package according to the present invention, preferably, the frame body has a metal layer mainly composed of at least one of aluminum, silver, gold, palladium and platinum attached to the inner peripheral surface. It is characterized by.

  The light emitting device of the present invention includes a light emitting element storage package according to the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring conductor, and a translucent member covering the light emitting element. It is characterized by comprising.

  In the light emitting element storage package of the present invention, the inner dimension gradually decreases from the lower opening toward the upper opening on the inner surface of the recess, and the inner peripheral surface protrudes inward on the inner surface of the recess. Since the frame is fitted, the light emitted from the light emitting element in the upward direction can be radiated well from the upper opening of the frame, and emitted from the light emitting element at a small radiation angle. By reflecting light traveling in a slightly obliquely upward direction from the directly upward direction as light having a small incident angle with respect to the inner peripheral surface on the upper side of the frame body, the light can be concentrated and emitted in the upward direction. Further, light emitted from the light emitting element at a large radiation angle and traveling at a large angle obliquely with respect to the upward direction is reflected by the inner peripheral surface of the frame body and confined inside the frame body, and the upper opening of the frame body Only light traveling at a very small radiation angle in the upward direction can be radiated to the outside of the frame to concentrate the light at high density. As a result, the luminance with respect to the direction in which the light is concentrated is improved, the outline of the opening on the upper side of the frame is bright and clear, and the visibility is high.

  In addition, after the light emitted obliquely upward is blocked by the frame body, reflection is repeated between the frame body and the insulating base at a high reflectance inside the recess, and the light is confined to some extent inside the frame body. When the radiation angle is close to a right angle with respect to the mounting portion, the radiation can be emitted in the front direction from the upper opening of the frame. Therefore, leakage and attenuation of light can be suppressed, light emitted from the light emitting element can be radiated very efficiently, and directivity and radiated light intensity can be increased.

  In addition, since the inner dimension gradually decreases from the lower opening toward the upper opening, the light emitting element mounting portion can be formed wide, and a large light emitting element or a plurality of light emitting elements can be mounted. , The luminance can be higher and aggregated.

  In the light emitting element storage package of the present invention, preferably, the exposed portion of the bottom surface of the concave portion of the insulating base is a light reflecting surface, so that the light emitted from the light emitting element or the inner peripheral surface of the frame is reflected. The reflected light can be reflected with low loss, and the light emission efficiency can be improved.

  In the light emitting element storage package of the present invention, it is preferable that the opening edge on the upper side of the frame body coincides with the outer periphery of the light emitting element in a plan view or is on the inner side of the outer periphery. Among them, it is possible to block light obliquely upward more effectively, and to have higher directivity.

  In the light emitting element storage package according to the present invention, preferably, the frame body mainly includes at least one of aluminum, silver, gold, palladium, and platinum, so that light emitted obliquely upward from the light emitting element is framed. It can be reflected better by the body, and it is confined inside the frame body, effectively suppressing light loss when repeatedly reflecting between the frame body and the insulating substrate, and having high luminous efficiency. it can.

  In the light emitting element storage package of the present invention, preferably, the frame body has a metal layer mainly composed of at least one of aluminum, silver, gold, palladium and platinum attached to the inner peripheral surface. The frame material can be made of a material that does not easily generate stress due to the difference in thermal expansion coefficient between the insulating base and the light emitting element storage package, and can be effectively prevented from being damaged, and obliquely upward from the light emitting element. The emitted light can be reflected better by the metal layer, and it is confined inside the frame and effectively suppresses light loss when it is repeatedly reflected between the metal layer and the insulating substrate, thereby improving the luminous efficiency. Can be expensive.

  A light-emitting device of the present invention includes the above-described light-emitting element storage package of the present invention, a light-emitting element mounted on the mounting portion and electrically connected to the wiring conductor, and a translucent member that covers the light-emitting element. Therefore, the light emitted from the light-emitting element, which has the characteristics of the light-emitting element storage package of the present invention, can be efficiently emitted and can be highly visible. Therefore, it is suitable for a display device or the like.

  The light emitting element storage package of the present invention will be described in detail below. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. FIG. 2 is a plan view of the package in FIG. 1. In these drawings, 1 is an insulating substrate, 2 is a light-emitting element 3 mounted. Reference numeral 3 denotes a light emitting element, 4 denotes a recess for accommodating the light emitting element 3, and 8 denotes a frame.

  The package of the present invention has an insulative substrate 1 having a recess 4 for accommodating the light emitting element 3 on the top surface and a mounting portion 2 of the light emitting element 3 formed at the center of the bottom surface of the recess 4, and a bottom surface of the recess 4. Wiring conductors 5a and 5b to which the electrodes of the light emitting element 3 are electrically connected are formed, and the inner dimensions gradually increase from the lower opening to the upper opening on the inner surface of the recess 4. A frame 8 having a smaller inner diameter and an inner convex surface is fitted.

  The insulating substrate 1 of the present invention is made of ceramics or resin, and when made of ceramics, for example, it is made of ceramics such as aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, and glass ceramics. It is a rectangular parallelepiped box-shaped body formed by laminating a plurality of insulating layers, and a recess 4 for accommodating the light emitting element 3 is formed in the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. A ceramic green sheet (ceramic raw sheet) is obtained by molding into a sheet shape by a conventionally known doctor blade method, calendar roll method, etc., and then a through hole for the recess 4 is formed by punching in the ceramic green sheet, A plurality of ceramic green sheets for mounting the light emitting element 3 and ceramic green sheets for the side walls of the recesses 4 are stacked, fired at a high temperature (about 1600 ° C.), and integrated.

  A mounting portion 2 made of a conductor layer for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4. The mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver ( It consists of a metallized layer of metal powder such as Ag).

  In addition, the insulating base 1 is formed by adhering wiring conductors 5 a and 5 b formed from the mounting portion 2 and its periphery to the lower surface of the insulating base 1. The wiring conductors 5a and 5b are made of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 accommodated in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 with a conductive bonding material such as gold (Au) -silicon (Si) alloy or Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring conductor 5b through the bonding wire 6 or the like. The wiring conductors 5a and 5b on the lower surface of the insulating base 1 are connected to the respective wiring electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and driving signals are supplied to the light emitting element 3. The Further, the light emitting element 3 may be connected to the mounting portion 2 and the wiring conductor 5b by flip chip mounting.

  For the wiring conductors 5a and 5b, for example, a metal paste obtained by adding and mixing an appropriate organic solvent and solvent to a metal powder such as W or Mo is preliminarily printed in a predetermined pattern on a green sheet serving as the insulating substrate 1 by a screen printing method. By doing so, the insulating base 1 is deposited on a predetermined position.

  It is to be noted that a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), Ag or the like is deposited on the exposed surfaces of the wiring conductors 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. The wiring conductors 5a and 5b and the mounting portion 2 can be effectively prevented from being oxidized and corroded, and the mounting portion 2 and the light emitting element 3 are fixed to each other, the wiring conductor 5b and the bonding wire 6 are joined, and the wiring conductors 5a and 5b. And the wiring conductor of the external electric circuit board can be firmly joined. Therefore, on the exposed surfaces of the wiring conductors 5a and 5b and the mounting portion 2, a Ni plating layer with a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer with a thickness of about 0.1 to 3 μm More preferably, the electrodes are sequentially deposited by electrolytic plating.

  And in this invention, the frame 8 by which the internal dimension became small gradually and the inner peripheral surface became convex inside is attached to the inner surface of the recessed part 4 as it goes to an upper side opening from a lower side opening. . Thereby, the light emitted from the light emitting element 3 in the upward direction can be favorably emitted from the upper opening of the frame body 8, and the light emitted from the light emitting element 3 at a small radiation angle is slightly higher than the direct upward direction. The light traveling in the obliquely upward direction is reflected as light having a small incident angle with respect to the inner peripheral surface on the upper side of the frame body 8 so as to be collected and emitted in the directly upward direction. Further, the light emitted from the light emitting element 3 at a large radiation angle and traveling at a large angle obliquely with respect to the upward direction is reflected by the inner peripheral surface of the frame body 8 and confined inside the frame body 8. Only the light traveling at a very small radiation angle in the direction directly above the upper opening of the light can be emitted to the outside of the frame body 8 so that the light can be concentrated at a high density. As a result, the luminance in the direction in which the light is concentrated is improved, and the outline of the opening on the upper side of the frame 8 is bright and clear, so that the visibility is high.

  In addition, after light emitted obliquely upward is blocked by the frame body 8, reflection is repeated between the frame body 8 and the insulating substrate 1 at a high reflectance inside the recess 4, and the inside of the frame body 8. Since the light is confined to a certain extent and the radiation angle is close to the right angle with respect to the mounting portion 2, it can be emitted in the front direction from the upper opening of the frame body 8, so that unnecessary leakage of light can be suppressed. The light emitted from the light emitting element 3 can be efficiently emitted. Therefore, leakage and attenuation of light can be suppressed, light emitted from the light emitting element 3 can be radiated very efficiently, and directivity and radiated light intensity can be increased.

  Further, since the inner dimension gradually decreases from the lower opening toward the upper opening, the mounting portion 2 of the light emitting element 3 is formed wide, and a large light emitting element 3 or a plurality of light emitting elements 3 is mounted. Therefore, the luminance can be made higher and aggregated.

  The frame 8 is made of metal, ceramics, resin, glass, or the like, and even if a light reflection layer with high light reflectance such as metal is attached to the inner peripheral surface in order to increase the light reflectance of the inner peripheral surface. Good. Preferably, the frame 8 is made of metal. Thereby, it is easy to make the surface state of the inner peripheral surface of the frame body 8 stable, and to easily radiate the heat generated by the light emitting element 3 to the outside.

  The frame body 8 may be fitted and adhered to the inner side surface of the recess 4 with a resin adhesive, or a bonding metallization layer is formed on the inner side surface of the recess 4 and brazed with Ag brazing or the like. It may be joined. Further, after accommodating the light emitting element 3 in the recess 4 and making electrical connection via the bonding wire 6 or the like, the frame 8 is fitted in the recess 4 and a transparent resin is enclosed, and light is emitted by the transparent resin. The frame body 8 may be joined to the recess 4 by covering the element 3 and fixing the frame body 8. When the frame body 8 is fitted into the recess 4 after the light emitting element 3 is accommodated, the size of the light emitting element 3 can be made larger than the opening on the upper side of the frame body 8. 3 and the wiring conductor 5b can be positioned outside the opening edge on the upper side of the frame body 8 in plan view, so that light is absorbed by the bonding wire 6 and unevenness in strength is obtained. It is possible to effectively prevent the directivity from being lowered due to the light coming in contact with the bonding wire 6, and higher directivity can be achieved.

  In addition, a resin containing a fluorescent material or the like may be applied to the bottom surface of the recess 4 or a portion of the side wall where the insulating base 1 is exposed so that light can be favorably reflected in the recess 4. Become.

  Further, a dark-colored paste or the like may be applied to the opening edge of the frame body 8, the upper surface of the frame body 8, or the upper surface of the insulating base 1, so that the opening edge of the frame body 8 when viewed from the front direction. In addition, the distinction between the upper surface of the frame body 8 and the upper surface of the insulating substrate 1 can be clarified, and the visibility of the light-emitting device when viewed from the front can be further enhanced.

  Further, as shown in the sectional view of FIG. 3, the protruding portion 8 a may be formed so that the opening edge on the upper side of the frame body 8 is narrower than the inner peripheral surface of the frame body 8. Thereby, the light radiated | emitted from the opening of the upper side of the frame 8 can be gathered more, and can be made to become a direct upward direction.

  In addition, the recess 4 in which the frame body 8 is fitted may have a cross-sectional shape that is circular, oval, elliptical, rectangular, or the like. Further, as shown in the cross-sectional view of FIG. 4, the inner surface of the recess 4 and the outer peripheral surface of the frame 8 are inclined at a slight angle so as to spread outward from the bottom surface of the recess 4 toward the upper surface of the insulating base 1. Is good. Preferably, the angle θ formed by the plane extending outward from the bottom surface of the recess 4 and the inner surface of the recess 4 is 75 to 85 degrees, and in this case, the inner surface and upper end of the recess 4 are slightly deformed. Even if warpage or the like occurs, the frame body 8 can be easily inserted into the recess 4 without being greatly affected by the deformation or warpage.

  In FIG. 2, a frame body 8 having a circular cross section formed in a through hole having a circular cross section is fitted to a recess 4 having a circular cross section. The cross-sectional shape of the through-hole 8 may be different, and the frame body 8 in which the through-hole having a circular cross-sectional shape is formed in the concave portion 4 having a square cross-sectional shape may be fitted, A frame body 8 in which a through-hole having a quadrangular pyramid shape having a quadrangular cross-sectional shape is formed in the concave portion 4 having a circular cross-sectional shape may be fitted.

  Further, the arithmetic average roughness of the inner peripheral surface serving as the reflective layer may be different between the upper side and the lower side of the frame body 8. For example, the arithmetic average roughness of the upper inner peripheral surface of the frame 8 may be 3 μm or less, and the arithmetic average roughness of the lower inner peripheral surface may be 3 μm or more. Thereby, the transparent resin can be firmly attached to the inner peripheral surface on the lower side of the frame body 8, and the light reflected on the upper side of the inner peripheral surface can be easily directed to the upper side of the frame body 8. . Further, it is possible to increase the probability that the light reflected on the lower side of the inner peripheral surface is scattered and travels upward.

  Further, as shown in the cross-sectional view of the package in FIG. 5, the frame body 8 may be divided into a plurality of parts, and the shape of the inner peripheral surface of the frame body 8 can be easily formed. 8 is easy to form with good dimensional accuracy.

  Further, as shown in the sectional view of the package in FIG. 6, the inner peripheral surface of the frame body 8 may be an arc-shaped convex.

  Preferably, the exposed portion of the bottom surface of the recess 4 of the insulating base 1 is a light reflecting surface. Thereby, the light emitted from the light emitting element 3 and the light reflected on the inner peripheral surface of the frame body 8 can be reflected with low loss, and the light emission efficiency can be improved. Such a light reflecting surface can be formed by depositing a metal layer on the upper surface of the insulating substrate 1 by metallization or plating, or applying a resin containing a fluorescent material. The wiring conductors 5a and 5b may be used as light reflecting surfaces by increasing the area so that the wiring conductors 5a and 5b are not short-circuited. Alternatively, the exposed surface of the insulating substrate 1 can be used as a light reflecting surface by configuring the insulating substrate 1 with a material having a high light reflectance, such as white alumina ceramics.

  Preferably, the opening edge on the upper side of the frame body 8 is coincident with the outer periphery of the light-emitting element 3 in a plan view or on the inner side of the outer periphery. Thereby, the diagonally upward light among the light emitted from the light emitting element 3 can be blocked more effectively, and the directivity can be made higher. More preferably, the upper opening shape of the frame 8 should be similar to the outer shape of the light emitting element 3 in plan view. Thereby, the light directly emitted from the upper opening of the frame body 8 from the light emitting element 3 is increased, and the emission intensity is higher and the directivity is higher.

  The frame body 8 is preferably composed mainly of at least one of aluminum, silver, gold, palladium and platinum. Thereby, the light emitted obliquely upward from the light emitting element 3 can be reflected more favorably by the frame body 8, and is confined inside the frame body 8 and reflected between the frame body 8 and the insulating substrate 1. Light loss during repetition can be effectively suppressed, and the light emission efficiency can be increased. In particular, the frame body 8 is preferably made of aluminum. In this case, the frame body 8 is not easily oxidatively corroded, and the variation in light reflectance due to the variation in the light wavelength of the light emitting element 3 is reduced. can do.

A cylindrical metal member may be interposed between the insulating base 1 and the frame 8 in order to relieve stress generated between the insulating base 1 and the frame 8. Preferably, the thermal expansion coefficient of the metal member is between the thermal expansion coefficient of the insulating substrate 1 and the thermal expansion coefficient of the frame body 8. For example, the frame 8 is made of aluminum (coefficient of thermal expansion of about 23.5 × 10 ⁻⁶ / ° C.), silver (coefficient of thermal expansion of about 19.1 × 10 ⁻⁶ / ° C.), gold (coefficient of thermal expansion of about 14.1 × 10 ^−6). / C), palladium (coefficient of thermal expansion of about 11.8 × 10 ⁻⁶ / ° C.) or platinum (coefficient of thermal expansion of about 8.8 × 10 ⁻⁶ / ° C.) and alumina ceramic (coefficient of thermal expansion of 7) as the insulating substrate 1. × when using those consisting of ^{10 -6} ~8 × 10 ^{-6 /} ℃ about), etc., in order to relax the thermal stress generated by thermal expansion coefficient difference between the insulating substrate 1 and the frame body 8, an insulating substrate 1 Fe-Ni-Co alloy (thermal expansion coefficient: 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.), Cu—W alloy (thermal expansion coefficient: 6 × 10 ^{−6 to} 11 × 10) between the frame 8 ^{-6 /} ° C. C.) and the like of the metal member may have to use, preferably, the thermal expansion coefficients of these frame 8 and the thermal expansion coefficient of the insulating base 1 It is preferable to select as an Fe-Ni-Co alloy and Cu-W alloy as the thermal expansion coefficient between. Thereby, the thermal stress generated by the difference in thermal expansion coefficient between the insulating substrate 1 and the frame body 8 can be relaxed, and peeling of the frame body 8 can be effectively prevented.

  The frame body 8 may be an alloy mainly composed of aluminum, silver, gold, palladium, or platinum.

  In the frame body 8 in the present invention, it is preferable that a metal layer 8b containing at least one of aluminum, silver, gold, palladium and platinum as a main component is deposited on the inner peripheral surface. As a result, the material of the frame 8 can be made of a material that is unlikely to generate stress due to a difference in thermal expansion coefficient between the frame 8 and the insulating base 1, and it is possible to effectively prevent the light emitting element storage package from being damaged and to emit light. Light emitted obliquely upward from the element 3 can be more favorably reflected by the metal layer 8 b, and is light confined inside the frame body 8 and repeatedly reflected between the metal layer 8 b and the insulating substrate 1. Loss can be effectively suppressed and light emission efficiency can be increased. For example, as shown in FIG. 7, such a frame 8 is formed by depositing a metal layer 8 b made of any of aluminum, silver, gold, palladium, or platinum on the inner peripheral surface of the frame 8. In particular, the metal layer 8b is preferably made of aluminum, is less susceptible to problems such as oxidative corrosion and migration, and also has a small variation in light reflectance due to variation in the light wavelength of the light emitting element 3, so that it can be used in a wide range of applications. can do.

The frame 8 may be made of a material having a thermal expansion coefficient close to that of the insulating base 1. For example, the insulating substrate 1 is made of alumina ceramic (thermal expansion coefficient: 7 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / ° C.) or the like, and the frame 8 is Fe—Ni having a thermal expansion coefficient close to that of the insulating substrate 1. When a -Co alloy (coefficient of thermal expansion 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.) or the like is used, peeling between the frame 8 and the insulating substrate 1 can be effectively prevented. When the metal layer 8b is attached to the inner peripheral surface of the frame body 8 made of such a material, the frame body 8 can be firmly fitted to the insulating base 1 and the light reflectance of the light emitted from the light emitting element 3 can be increased. Can be high.

  In addition, the metal layer 8 b may be attached only to the surface (inner peripheral surface) of the frame body 8 on the light emitting element 3 side, or may be attached to the entire surface of the frame body 8.

  Note that the metal layer 8b may be an alloy layer mainly composed of aluminum, silver, gold, palladium, or platinum.

  In addition, as shown in FIG. 8, the light emitting element storage package and the light emitting device of the present invention are arranged in a dot matrix, so that it can be used as a suitable display device. Further, the type of the frame body 8 and the type of the metal layer 8 b may be different for each recess 4.

  The light emitting device of the present invention includes the package of the present invention, the light emitting element 3 mounted on the mounting portion 2, and a translucent member that covers the light emitting element 3. As a result, the light emitted from the light emitting element 3 is well reflected and can be radiated to the outside uniformly and efficiently.

  As the translucent member, a transparent resin such as silicone, or a transparent resin plate or a glass plate is used. In the case of a transparent resin, the transparent resin may cover only the light emitting element 3 and its periphery, or may be filled in the recess 4 to cover the light emitting element 3. Further, when the translucent member is a transparent resin plate or a glass plate, the translucent member is attached so as to close the through hole of the frame body 8 on the upper surface or inner peripheral surface of the frame body 8.

  Furthermore, the light emitted from the light emitting device may be converted into a desired light spectrum by converting the wavelength of the light emitted from the light emitting element 3 by adding or attaching a fluorescent material to the translucent member. .

  Moreover, it can use as an illuminating device by installing one or several light-emitting device of this invention so that it may become predetermined arrangement | positioning vertically and horizontally. Such lighting devices include, for example, lighting fixtures used indoors and outdoors, electronic bulletin boards, traffic lights, displays and other backlights (liquid crystal backlights and touch panels such as mobile phones), car headlamps, cameras and mobile phones. Examples include a flashlight such as a telephone, a light source for exposure of a printing machine such as a scanner, a moving image device, and a decoration.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package in FIG. 9, the mounting portion 2 is a light emitting element as a mounting region on the top surface of the insulating base 1 on the bottom surface of the concave portion 4 via a bonding material such as a resin adhesive. 3 may be directly mounted, and wiring conductors 5 a and 5 b to which the electrodes of the light emitting element 3 are connected may be formed around the mounting portion 2. In this case, the light emitting element 3 is mounted on the mounting portion 2, and the electrodes of the light emitting element 3 are electrically connected to the wiring conductors 5a and 5b via the bonding wires 6a and 6b. Further, a metal layer made of nickel or the like may be interposed between the frame body 8 and the metal layer 8b formed on the inner peripheral surface of the frame body 8. Further, a plurality of light emitting elements 3 may be mounted or a wiring conductor may be formed, and the light emitting elements 3 may be mounted in addition to the central portion of the recess 4.

It is sectional drawing which shows an example of embodiment about the light emitting element accommodation package of this invention. It is a top view of the light emitting element storage package of FIG. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing which shows the other example of embodiment about the light emitting element storage package of this invention. It is sectional drawing of the conventional package for light emitting element accommodation.

Explanation of symbols

1: Insulating substrate 2: Mounting portion 3: Light emitting element 4: Recesses 5a, 5b: Wiring conductor 8: Frame body 8b: Metal layer

Claims (6)

An insulating base having a recess for accommodating the light emitting element on the top surface and having a mounting portion for the light emitting element formed at the center of the bottom surface of the recess, and an electrode of the light emitting element formed on the bottom surface of the recess A wiring conductor that is electrically connected to the inner surface of the recess, the inner dimension gradually decreases and the inner peripheral surface protrudes inward from the lower opening toward the upper opening. A package for housing a light emitting element, wherein a frame is fitted. 2. The light emitting element storage package according to claim 1, wherein the insulating base has a light reflecting surface at an exposed portion of the bottom surface of the recess. 3. The light emitting element storage package according to claim 1, wherein the frame has an upper opening edge that coincides with an outer periphery of the light emitting element in a plan view or is on an inner side of the outer periphery. The light emitting element storage package according to any one of claims 1 to 3, wherein the frame body includes at least one of aluminum, silver, gold, palladium, and platinum as a main component. 5. The frame according to claim 1, wherein a metal layer mainly composed of at least one of aluminum, silver, gold, palladium, and platinum is attached to the inner peripheral surface of the frame. The light emitting element storage package according to claim 1. The light emitting element storage package according to any one of claims 1 to 5, a light emitting element mounted on the mounting portion and electrically connected to the wiring conductor, and a translucency covering the light emitting element A light emitting device comprising: a member.

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