JP4822980B2 - Electronic component mounting substrate, electronic device, and method of manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate and an electronic device for rigidly joining a resin material to a base material without leaving a large amount of processing liquids such as a plating liquid or the like to a hole of the base material. <P>SOLUTION: The base material 1 provided includes a part 1a for mounting an electronic component 4 provided to one principal surface, and a hole to be filled with a resin material opening to the one principal surface. In the hole 2, a segment 2a connecting the last positions of each depth is substantially continuous in the perspective side view along one direction B orthogonally crossing the depthwise direction D. Moreover, the segment 2a is formed of any one or both regions of the region substantially extending only in the depthwise direction D as the depth increases, and the region extends gradually or step by step toward the front side in one direction B as the depth increases. In addition, the hole 2 includes a ceiling region 2b where a part of the internal surface crosses the upper direction inverted from the depthwise direction D. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

Description

  The present invention relates to an electronic component mounting board and an electronic device for mounting an electronic component, and a method for manufacturing the electronic device.

  Conventionally, a ceramic package is used as a light emitting element storage package (hereinafter also referred to as a package) for accommodating a light emitting element such as a light emitting diode. A conventional ceramic package has a mounting portion made of a conductor layer for mounting a light emitting element in the center of the upper surface, and has a substantially rectangular parallelepiped shape having a pair of wiring layers led out from the mounting portion and its periphery to the lower surface. A ceramic base body, and a substantially square frame-shaped ceramic frame body which is bonded to the upper surface of the base body and has a through-hole for accommodating a light emitting element in the center.

  Then, the light emitting element is fixed to the mounting portion connected to one wiring layer led out on the upper surface of the substrate through a conductive bonding material or the like, and the electrode of the light emitting element and the other wiring layer are bonded to the bonding wire or the like. After that, a light emitting device is obtained by filling a transparent resin material in the through hole of the frame body and sealing the light emitting element (for example, see Patent Document 1 below).

  Such a ceramic package is manufactured by a ceramic green sheet (hereinafter also referred to as “green sheet”) lamination method, and specifically manufactured as follows. For example, in the case where the substrate is made of an aluminum oxide sintered body, a green sheet for a substrate and a green sheet for a frame containing ceramic powder mainly composed of aluminum oxide and an organic binder and a green sheet for a frame are prepared. A through hole for leading out the wiring layer and a through hole for accommodating the light emitting element are punched and formed.

  Next, a conductor paste made of a refractory metal powder such as tungsten (W) or molybdenum (Mo) for forming a wiring layer is applied from the upper surface to the lower surface of the green sheet for the substrate by a conventionally known screen printing method or the like. A conductor paste for forming a metallized metal layer is applied to the inner surface of the through hole of the body green sheet by a screen printing method or the like.

  A green sheet for a substrate and a green sheet for a frame are stacked one above the other, and then fired at a high temperature to form a sintered body.

  After that, a plating metal layer made of a metal such as nickel (Ni), gold (Au), silver (Ag) or the like is applied to the exposed surfaces of the wiring layer and the metallized metal layer by an electroless plating method or an electrolytic plating method. Produced. For example, when depositing a plating layer by an electrolytic plating method, such a plating layer is arranged by leaning a package so as to be parallel to an electrode plate vertically installed in a plating solution, It can be deposited by applying current to the electrode plate and the package.

In recent years, with the increase in luminance of light emitting devices, the amount of heat generated by the light emitting elements has increased, and it is required to increase the adhesion strength between the resin material and the package. Therefore, in order to suppress the resin material from being peeled off from the package, as it goes in the depth direction from the opening on the upper surface of the base body, similarly to the region extending forward in one direction orthogonal to the depth direction, There has been proposed a light emitting element storage package in which a hole including a region orthogonal to the depth direction and extending rearward opposite to the front in one direction is formed.
Japanese Patent Application Laid-Open No. 2004-228531

  However, in such a conventional light emitting element storage package, when the package is stood substantially vertically, the hole is opened in the lateral direction, and there is an area located below the opening portion inside the hole. Exists. For this reason, there is a concern that the plating solution may remain inside the hole when the package is pulled up from the plating solution after the standing package is immersed in the plating solution to deposit the plating metal layer on the wiring layer. The If the plating solution remains inside the hole, there is a problem that a stain due to the plating solution is generated on the substrate and the wiring layer around the hole.

  When the base and the wiring layer are stained, the adhesion strength between the resin material and the base and the wiring layer is lowered, and the resin material is easily peeled off from the base and the wiring layer.

  The present invention has been completed in view of the above problems, and its purpose is to firmly bond a resin material to a substrate without leaving a large amount of a processing solution such as a plating solution in the hole of the substrate. It is an object to provide an electronic component mounting substrate and an electronic device that can be used.

  The electronic component mounting board of the present invention has a mounting portion for mounting the electronic component on at least one main surface, and a plurality of holes for filling a part of the resin material to be attached to the electronic component Is an electronic component mounting board having an opening, and when the hole is viewed in plan, the entire internal space is located in front of the rearmost end of the opening in one direction, and a part of the internal space Are extended outward from the outer periphery of the opening so that the inner surface of the hole does not form a convex portion protruding forward in the one direction.

The electronic component mounting board of the present invention includes a base having a mounting portion for electronic components provided on at least one main surface and a plurality of holes for filling a resin material opened on the one main surface. In the side perspective view along one direction orthogonal to the depth direction, the portion is substantially continuous with a line segment connecting the rearmost positions at each depth, and the line segment has a depth of A region extending substantially only in the depth direction as the depth increases, and the line segment extends gradually or stepwise toward the front side in the one direction as the depth increases. The hole includes only one or both of the regions, and the hole extends so that a part of the inner surface intersects the upward direction opposite to the depth direction and has a ceiling region on the front side in the one direction. together are characterized in that does not extend to the rear side of said one direction

  In the present invention, the front side in one direction refers to the front side in one direction of the region divided by a virtual line along the depth direction and the direction orthogonal to the one direction.

  The electronic device of the present invention is characterized in that the plurality of hole portions are distributed and positioned around the mounting portion in a plan view.

  An electronic device according to the present invention includes the above-described electronic component mounting substrate, an electronic component mounted on the mounting portion of the electronic component mounting substrate, and a resin that covers the electronic component and fills the plurality of holes. And a material.

  The electronic device manufacturing method of the present invention is a first step in which the electronic component mounting substrate described above is prepared, and the electronic component mounting substrate is immersed in a processing solution, and the one direction is substantially upward. In the state where the electronic component mounting substrate is arranged as described above, the second step of pulling up from the processing liquid, the third step of mounting the electronic component on the mounting portion, covering the electronic component with the resin material, A fourth step of filling the hole with a resin material is sequentially performed.

  According to the present invention, with the above configuration, the processing liquid inside the hole can be easily discharged by pulling up from the processing liquid in a state where the electronic component mounting substrate is arranged so that one direction is substantially upward. An electronic component mounting substrate that can be manufactured can be provided, and the possibility of stains occurring on the substrate and the wiring layer is reduced.

  In addition, since it has a region extending forward in one direction, when a part of the resin material covering the electronic component is filled in the plurality of holes, a part of the resin material filled in the hole is Peeling of the resin material can be suppressed and can be held well, and the adhesion strength between the resin material, the substrate and the wiring layer can be improved.

  Preferably, according to the electronic component mounting substrate of the present invention, the plurality of hole portions are distributed and positioned around the mounting portion in a plan view, so that the resin material is dispersed by the plurality of hole portions. By holding, the resin material can be satisfactorily held around the electronic component, and the electronic device on which the electronic component is mounted can be made highly reliable.

  An electronic device of the present invention includes the electronic component mounting substrate of the present invention, an electronic component mounted on a mounting portion of the electronic component mounting substrate, and a resin material that covers the electronic component and is filled in the hole. Therefore, since the electronic component mounting substrate is formed with a reduced possibility of occurrence of stains on the base and the wiring layer, the resin material adheres well to the electronic component mounting substrate and the resin material The possibility of peeling off from the electronic component mounting substrate can be reduced, and the electronic device is excellent in reliability.

  According to the electronic device of the present invention, the electronic component is a light emitting element. Therefore, since the resin material is satisfactorily adhered to the electronic component mounting substrate, even if a light emitting element having high heat generation is used as the electronic component, the electronic device can be made a highly reliable light emitting device. it can.

  According to the electronic device manufacturing method of the present invention, the electronic component mounting substrate of the present invention is prepared, the first step of immersing the electronic component mounting substrate in the treatment liquid, the one direction is directed upward In a state where the electronic component mounting substrate is arranged, a second step of pulling up from the processing liquid, a third step of mounting the electronic component on the mounting portion, a fourth step of filling the hole with the resin material covering the electronic component Since the process is performed sequentially, the occurrence of stains due to the processing liquid on the electronic component mounting substrate can be suppressed, so that the possibility that the resin material is peeled off from the electronic component mounting substrate can be reduced, and the electronic device has excellent reliability. Can be produced.

  Embodiments of the present invention are described in detail below. FIG. 1 is a plan view showing an example of the embodiment of the package of the present invention, and FIG. 2 is a cross-sectional view showing an example of the embodiment along the line AA ′ of the electronic component mounting board of FIG. is there. In these drawings, 1 is a base, 1a is a mounting portion, 2 is a hole, 3 is a wiring layer, and 4 is an electronic component.

An electronic component mounting board according to the present invention includes a base 1 having a mounting portion 1a for an electronic component 4 provided on one main surface and a plurality of hole portions 2 for filling a resin material opened on one main surface. In the side see-through along one direction B orthogonal to the depth direction D, the part 2 is substantially continuous with a line segment 2a connecting the rearmost positions at each depth, and the line segment 2a is The region extending substantially only in the depth direction D as the depth increases and the line segment 2a gradually or stepwise in front of the one direction B as the depth increases. The hole 2 includes only one or both of the extending regions, and the hole 2 has a part of the inner surface that intersects the upward direction opposite to the depth direction D, and the ceiling region 2b on the front side in one direction B. And does not extend to the rear side in one direction B.

  In the present invention, the front side in one direction B refers to the front side in one direction B in a region divided by a virtual line L along a direction perpendicular to the depth direction D and the one direction B.

The substrate 1 applicable to the present invention is made of ceramics or a resin material. For example, an electrical insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, or a silicon carbide sintered body. Consists of. When the substrate 1 is made of an aluminum oxide sintered body, an organic solvent or solvent suitable for raw material powders such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. Is added to and mixed to make a mud-like shape, and a ceramic green sheet (ceramic green sheet) is obtained by forming the sheet into a sheet shape using a conventionally known doctor blade method or calendar roll method. A suitable punching process is performed, and a plurality of sheets are laminated and fired at a high temperature (about 1500 to 1800 ° C.).

  The base body 1 includes a mounting portion 1a for mounting the electronic component 4 on at least one main surface and a plurality of holes 2 opened on one main surface, and the base 1 is mounted on or around the mounting portion 1a. A wiring layer 3 leading to the other main surface or the side surface is formed.

  The inside of the hole 2 is filled with a resin material after the electronic component 4 is mounted on the mounting portion 1a and used for fixing the resin material. Such holes 2 are formed by forming through holes for holes 2 in some of the ceramic green sheets for the substrate 1 by a punching method using a die or punching or a processing method such as laser processing. It is formed by laminating with a green sheet.

  The wiring layer 3 is made of metal powder metallization such as tungsten, molybdenum, copper, or silver, and is a conductive path for electrically connecting the electronic component 4 to the outside. The wiring layer 3 is formed by applying a metallized paste for the wiring layer 3 to the ceramic green sheet for the substrate 1 by a printing means such as a screen printing method, and firing it together with the ceramic green sheet for the substrate 1. Is formed on the substrate. The metallized paste for the wiring layer 3 is mixed and kneaded by kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc., with an organic binder, an organic solvent, and a dispersant as necessary added to the main component metal powder. Will be produced. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the laminated substrate after sintering.

  Further, the wiring layer 3 formed on the surface and inside of the base body 1 is electrically connected by a through conductor penetrating the base body 1 as necessary. Such a through conductor is formed for the through conductor by a punching method using a die or punching or a processing method such as laser processing on a ceramic green sheet for the substrate 1 prior to the printing application of the metallized paste for forming the wiring layer 3. Each region is formed by forming a through hole, filling the through hole for the through conductor with a metallized paste for the through conductor by a printing means such as a screen printing method, and firing this together with the ceramic green sheet for the substrate 1. Formed. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring layer 3, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or the organic solvent.

  Further, a portion of the wiring layer 3 exposed on the outer surface of the substrate 1 is coated with a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), silver (Ag), etc. with a thickness of about 1 to 20 μm. The wiring layer 3 can be effectively prevented from being oxidatively corroded, and the wiring layer 3 and the electronic component 4 can be fixed or the wiring conductor 3 can be electrically connected to the bonding wire 5 or the solder bump. 3 and the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surface of the wiring layer 3, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 5 μm are electroplating or electroless plating. It is more preferable that the layers are sequentially deposited.

  And in this invention, it is equipped with the base | substrate 1 which has the mounting part 1a of the electronic component 4 provided in at least one main surface, and the several hole part 2 for resin material filling which opens in one main surface, In a side perspective view along one direction orthogonal to the depth direction D, the line segment 2a connecting the rearmost position at each depth is substantially continuous, and the line segment 2a has a depth of As the depth increases, the region extends substantially only in the depth direction D. Thereby, in the process of immersing the base body 1 in the processing liquid, when the base body 1 is pulled up from the processing liquid in a state where one direction B orthogonal to the depth direction D is upward, the processing in the hole 2 is performed. The liquid has a structure in which substantially all of the liquid flows out along the line segment 2 a of the hole 2.

  Furthermore, the hole 2 has a ceiling region 2b in which a part of the inner surface intersects the upward direction opposite to the depth direction D. Thereby, when the resin material is filled in the hole 2, the surface on the one main surface side of the filled resin material comes into contact with the inner surface of the hole 2. And when a resin material contact | abuts on the ceiling area | region 2b, it becomes difficult to peel a resin material.

  In FIG. 1, in order to explain the state of the hole 2 inside the base body 1 in an easy-to-understand manner, a portion where the hole part 2 extends inside the base body 1 and is hidden from one main surface side is shown. It is indicated by a broken line. Also in other plan views, the portion where the hole 2 extends forward in one direction B inside the base body 1 and is hidden from one main surface side is similarly broken in the base body 1. Will be shown. The plurality of hole portions 2 have a region extending so as to expand inside the base body 1 more than the opening portion of the hole portion 2, and the base body 1 is arranged so that the one direction B is upward. When the hole 2 is seen through the side view along one direction orthogonal to the depth direction D, the line segment 2a connecting the rearmost position at each depth is located below the other region of the hole 2. Will be. In each of the plurality of hole portions 2, the line segment 2a is positioned below the other region. FIG. 3 is a cross-sectional view schematically showing that the substrate 1 as shown in FIGS. 1 and 2 is taken out from the plating solution 6a in the plating tank 6. In FIG. Indicates that the direction. When the substrate 1 is taken out from the plating solution 6a, the plating solution 6a remaining on the one-direction B side in the plurality of hole portions 2 is effectively discharged substantially along the line segment 2a of the hole portions. Thereby, it can reduce that the plating solution 6a remains in the some hole part 2, and it can reduce possibility that the base | substrate 1 and the wiring layer 3 will generate | occur | produce a stain. In addition, it cannot be overemphasized that there exists an effect of this invention similarly about process liquids other than the plating solution 6a.

  Moreover, since it has the area | region extended toward the front side of one direction B, when resin material is applied so that the electronic component 4 may be covered and it fills in the some hole part 2, it fills in the hole part 2 The surface on the one principal surface side of the resin material thus brought into contact with the ceiling region 2b on the inner surface of the hole 2 can suppress the resin material from peeling off and can be held well, making the resin material difficult to peel off. be able to.

  Prepare ceramic green sheets for such holes 2, for example, two holes 2, and form through-holes with different diameters in these ceramic green sheets by punching by punching or processing methods such as laser processing And it can form easily by laminating | stacking ceramic green sheets so that the one side surface of a through-hole with a small diameter and the one side surface of a through-hole with a large diameter may form the line segment 2a. The hole 2 may be formed from three or more ceramic green sheets.

  The width of the opening portion of the hole portion 2 varies depending on the type of the resin material, the depth of the hole portion 2, and the like, but the width of the opening portion of the hole portion 2 is easy to fill the resin material into the plurality of hole portions 2. Is preferably 0.2 mm or more.

  Moreover, the hole part 2 should just be formed in polygonal shapes, such as circular shape, square shape, and triangular shape, and may be shapes other than the above-mentioned. The hole 2 is preferably a shape having no corners such as a circular shape, an oval shape, or an elliptical shape so that the resin material can be easily filled into the hole portion 2 easily.

  In comparison between the plurality of hole portions 2, the width of the opening portion of at least one hole portion 2 may be different from the width of the opening portion of the other hole portion 2. For example, when the base body 1 has a rectangular shape, the mounting portion 1a of the electronic component 4 is disposed at the center of one main surface of the base body 1, and the four hole portions 2 are distributed around the mounting portion 1a. The width of one of the holes 2 may be different from the width of the other three openings. Specifically, for example, the base 1 has a rectangular shape of 5.0 mm × 5.0 mm, and four holes 2 are dispersed in the vicinity of the corners on the diagonal of the corners on one main surface side of the base 1. In the case of arrangement, one of the hole portions 2 may have a circular shape of Φ1.0 mm, and the other three hole portions 2 may have a circular shape of Φ0.5 mm. Thereby, when one main surface of the base body 1 is observed, the directionality of the base body 1 can be well recognized by the difference in the size of the opening portion of the hole portion 2, and the electronic component 4 is mounted on the mounting portion 1a. In this case, it is easy to perform well when mounting the substrate 1 on the external circuit board. Further, the shape of at least one opening portion of the plurality of hole portions 2 may be different from the shape of the opening portions of the other hole portions 2.

  Next, another embodiment of the present invention will be described with reference to FIG. In an electronic component mounting substrate according to another embodiment of the present invention, at least a mounting portion 1a of an electronic component 4 provided on one main surface and a plurality of hole portions 2 for filling a resin material opened on one main surface. The hole 2 has a substantially continuous line segment 2c connecting the rearmost positions at each depth in a side perspective view along one direction orthogonal to the depth direction D. In addition, a region where the line segment 2c extends substantially only in the depth direction D as the depth increases, and a line segment 2c gradually or stepwise as the depth increases. It consists only of both the area | region extended toward the front side of the one direction B.

  Thus, in the step of immersing the hole 2 in the processing liquid, when the base body 1 is pulled up from the processing liquid in a state where one direction B orthogonal to the depth direction D is upward, The processing liquid has a structure in which substantially all flows out along the line segment 2 c of the hole 2.

  Furthermore, the hole 2 has a ceiling region 2 d where a part of the inner surface intersects the upward direction opposite to the depth direction D. Thus, when the hole 2 is filled with the resin material, the surface on the one main surface side of the filled resin material comes into contact with the ceiling region 2 d of the inner surface of the hole 2. And since a resin material contact | abuts on the ceiling area | region 2d, it becomes difficult to peel a resin material.

  In FIG. 4, the line segment 2 c is inclined from the opening side of the hole portion 2 toward the bottom side so that the line segment 2 c gradually extends to the front side in one direction B orthogonal to the depth direction D. In FIG. 5, a step is formed in the line segment 2c so that the line segment 2c extends stepwise in the direction B perpendicular to the depth direction D. Similar to FIGS. 1 to 2, the plurality of hole portions 2 have a region extending to the one direction B side inside the base body 1 from the opening portion of the hole portion 2. It is shown that it is located in the same position as the side part including the line segment 2c or in one direction side from the side part including the line segment 2c.

  That is, when the base body 1 is disposed so that the above-described one direction B is substantially upward, the other side portion of the hole portion 2 is placed with the side portion including the line segment 2c, or includes the line segment 2c. It will be located above the side part, and the hole part 2 will not have the area | region located below rather than the side part containing the line segment 2c in an opening part. With this configuration, when the substrate 1 is taken out from the plating solution so that the above-described one direction is upward, the plating solution that has flowed into the plurality of holes 2 is plated below the side portion including the line segment 2c. Since there is no region where the solution tends to remain, the plating solution can be discharged well. Thereby, possibility that a plating solution will remain inside a plurality of hole parts 2 can be reduced, and possibility that a base 1 and wiring layer 3 may generate a stain can be reduced.

  In addition, the possibility of stains occurring on the base body 1 and the wiring layer 3 is reduced, and since there is a region extending toward the one direction B, the resin material is placed on the electronic component and in the plurality of holes 2. When filled, the peeling of the resin material filled in the hole 2 can be suppressed and held well, and the adhesion strength between the resin material, the substrate 1 and the wiring layer 3 can be made good. it can.

  4 and 5, when the base body 1 is arranged so that the above-described one direction B is substantially upward, the line segment 2c of the hole 2 is the bottom (depth direction D). Means the bottom when the substrate 1 is placed so that it coincides with the vertical direction.) It is located below the side, and the plating solution can be more easily discharged from the hole 2 better.

  The hole 2 as shown in FIG. 4 is formed such that a portion that becomes a side portion including the line segment 2c is formed on each of the two ceramic green sheets by a punching method by punching or a processing method such as laser processing. In addition, the through holes are stacked so that the slopes of the stacked through holes are slopes without a continuous step. At this time, the diameter of the through hole of the lower ceramic green sheet is formed to be the same as or larger than the diameter of the through hole of the upper ceramic green sheet. The hole 2 may be formed from three or more ceramic green sheets.

  In addition, the hole 2 as shown in FIG. 5 is formed, for example, by forming through holes in a ceramic green sheet for two holes 2 by a punching method by punching or a processing method such as laser processing. Formed by laminating two ceramic green sheets so that the side portion is shifted to one direction B side in the depth direction D and a side portion having a step including the line segment 2c is formed. be able to. The hole 2 may be formed from three or more ceramic green sheets. In this way, by shifting the positions of the through holes in advance, when the hole 2 is formed by stacking two or more ceramic green sheets, even if a stacking shift occurs in these ceramic green sheets, the line segment When the side part including 2c is arranged as a lower side, it is possible to make it difficult to form a region in the hole part 2 below the line segment 2c in the opening part.

  Moreover, as shown in FIGS. 6-9, it is preferable that the some hole part 2 is disperse | distributed and located around the mounting part 1a by planar view. With this configuration, the resin material is dispersed and held by the plurality of hole portions 2, so that the resin material can be better held by the plurality of hole portions 2 around the electronic component, and the electronic component 4 is mounted. The electronic device can have excellent reliability.

  Further, the substrate 1 is not limited to a flat plate shape, and as shown in FIG. 10, a recess 7 in which the electronic component 4 is accommodated may be formed on at least one main surface of the substrate 1. Thereby, the electronic component 4 can be satisfactorily accommodated in the recess 7 (on the bottom surface of the recess 7). Such recesses 7 are formed by forming through holes for the recesses 7 in some of the ceramic green sheets for the substrate 1 by a punching method using a die or punching, or a processing method such as laser processing. And can be formed by stacking. When the base body 1 has the recess 7 on one main surface, the hole 2 may be formed on the bottom surface of the recess 7.

  In addition, as shown in FIG. 11, a recess 8 is formed by bonding a frame 8 made of ceramics, resin, metal, or the like onto a plate-like body 9 with an adhesive such as glass, resin, or brazing material. It doesn't matter. In this case, a structure including the frame body 8 and the plate-like body 9 may constitute the base body 1 and the hole 2 as described above may be formed on one main surface of the frame body 8. In addition, the plate-like body 9 is not limited to a flat plate shape, and may include a concave portion 7. The hole 2 may be formed on the bottom surface of the recess 7 or one main surface of the plate-like body 9.

  In addition, the electronic component mounting substrate of the present invention can be effectively used when immersed in a processing solution such as a plating solution or a cleaning solution. That is, in the first step of preparing the above-described electronic component mounting substrate and immersing the electronic component mounting substrate in the processing liquid, in a state where the electronic component mounting substrate is arranged so that one direction is upward, By sequentially passing through the second step of pulling up from the third step, the third step of mounting the electronic component 4 on the mounting portion 1a, and the fourth step of covering the electronic component 4 with the resin material and filling the hole portion 2, An electronic device is formed. In the second step, the electronic component mounting substrate may be arranged in advance so that one direction B of the electronic component mounting substrate faces upward before being immersed in the processing solution, or pulled up from the processing solution. At this time, the electronic component mounting board may be arranged so that the one direction B faces upward. With this configuration, it is possible to suppress the occurrence of stains due to the processing liquid on the electronic component mounting substrate, so that the possibility that the resin material is peeled off from the electronic component mounting substrate can be reduced, and an electronic device with excellent reliability can be manufactured. be able to.

  The electronic device according to the present invention covers the electronic component mounting substrate as described above, the electronic component 4 mounted on the mounting portion 1a of the electronic component mounting substrate, and covers the electronic component 4 and fills the plurality of holes 2. Resin material. FIG. 12 is a cross-sectional view illustrating an example of the electronic device of the present invention. In FIG. 12, reference numeral 10 denotes a sealing material. Since the electronic component mounting substrate of the present invention is formed so as to reduce the possibility of occurrence of stains on the substrate 1 and the wiring layer 3, the resin material is satisfactorily adhered to the electronic component mounting substrate. Thus, an electronic device having excellent reliability that can reduce the possibility that the resin material is peeled off from the electronic component mounting substrate.

  As the electronic component 4, a semiconductor element, a piezoelectric element, a light emitting element, a light receiving element, or the like is used. When a light emitting element is used as the electronic component 4, a light emitting diode (LED), a semiconductor laser (LD), or the like is used as the light emitting element. Since the resin material 10 is satisfactorily attached to the electronic component mounting substrate, the electronic device is a light emitting device with excellent reliability. The light emitting element is fixed to the mounting portion 1a formed on the upper surface of the substrate 1 by a conductive bonding material such as an epoxy resin material containing, for example, an Au-silicon (Si) alloy or silver (Ag), and an electrode of the light emitting element. And the wiring layer 3 are electrically connected via a bonding wire 5 or the like. Note that the light emitting element may be electrically connected to the wiring layer 3 by flip chip connection.

  The resin material 10 is preferably a silicone resin material or an epoxy resin material, for example. The resin material 10 is applied so as to cover the electronic component 4, and after filling the inside of the plurality of holes 2, the resin material 10 is cured to obtain an electronic device. In addition, when the electronic component 4 consists of a light emitting element or a light receiving element, a translucent resin material is used. In the case of a light emitting element, the resin material may contain a phosphor. The phosphor is for converting the wavelength of light emitted from the light emitting element into another wavelength for visualization, or for receiving a specific wavelength from the outside and matching the light receiving sensitivity of the light emitting element. Arbitrary emission colors can be obtained by a combination of light emitted from and a phosphor capable of emitting light. For example, if the light emitted from the light emitting element is blue light and the light emitted from the phosphor is yellow light, white light can be emitted from the light emitting device by color mixture.

  In the light emitting device in which the electronic component 4 is formed of a light emitting element and the light emitting element is accommodated in the recess 7, the light emitted from the light emitting element is generated by forming a reflective layer on the inner peripheral surface of the recess 7. It becomes possible to radiate well to the outside. For example, when the base 1 is made of ceramics, such a reflective layer is formed by forming a metallized layer on the inner peripheral surface of the recess 7 and using a highly reflective metal such as Ni, Au, or Ag on the metallized layer. It can be formed by depositing a plating layer. Moreover, you may form by depositing thin films, such as Ni, Au, Ag, on the internal peripheral surface of the recessed part 7 by a vapor deposition method etc. Further, a metal frame-like member having a reflective layer of Ni, Au, Ag or the like formed on at least the surface thereof or a white ceramic frame-like member may be accommodated in the recess 7, or the recess 7 It may be formed by attaching a metal plate or metal foil having a reflective layer made of Ni, Au, Ag or the like formed on at least the surface of the inner peripheral surface. In addition, if the concave portion 7 is formed so that the inner peripheral surface of the concave portion 7 extends from the bottom surface of the concave portion 7 to the upper surface of the substrate 1, the light emitted from the light emitting element can be radiated well to the outside.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in FIG. 13, it may be formed in the form of a multi-piece substrate in which a plurality of electronic component mounting substrates are arranged on the mother substrate 11. The electronic component 4 is formed along the outer peripheral edge of the base region 1 ′ before or after being mounted on the mounting portion 1a, and is divided along the planned dividing line 12 indicated by a one-dot chain line, thereby dividing the substrate region 1 ′. Thus, a plurality of electronic component mounting substrates can be formed efficiently. In addition, as a method of dividing into a plurality of electronic component mounting substrates, a dividing groove is formed along the planned dividing line 12 which becomes the boundary of each substrate region 1 ′ of the multi-piece substrate, and along this dividing groove, There are a method of bending and dividing, a method of cutting each substrate region 1 ′ by a slicing method, and the like. In the above example, the case where one electronic component 4 is mounted on the substrate 1 is described. However, even when two or more electronic components 4 are mounted on the substrate 1. I do not care. In this case, the wiring layer 3 may be formed so as to correspond to the electrode of each electronic component 4. Further, as shown in FIG. 14, the electronic component 4 is mounted directly on the base 1, and the electrodes of the electronic component 4 are electrically connected to the wiring layer 3 formed around the mounting portion 1a. It doesn't matter.

  Alternatively, when the hole described above is seen through a plane, the entire internal space is positioned in front of the rear end of the opening in one direction, and a part of the internal space is arranged in one direction on the inner surface of the hole. You may make it extend outside the outer periphery of opening so that the convex part which protrudes to the front side may not be formed. In the case of such a hole, the second depth is deeper than the rearmost end of the internal space at the first depth, and the second depth is higher than the rearmost end of the internal space at the first depth. It is important that the rearmost in the depth is not located on the rear side in the one direction. This also makes it difficult for the treatment liquid to remain inside the hole, and can prevent the resin material from peeling off.

It is a top view which shows an example of embodiment about the board | substrate for electronic component mounting of this invention. It is sectional drawing sectional drawing in the A-A 'line of FIG. It is sectional drawing which shows typically a mode when the board | substrate for electronic component mounting of this invention is taken out from the plating solution. It is sectional drawing which shows an example of embodiment about the electronic component mounting board | substrate of this invention. It is sectional drawing which shows an example of embodiment about the electronic component mounting board | substrate of this invention. It is a top view which shows an example of embodiment about the board | substrate for electronic component mounting of this invention. It is a top view which shows an example of embodiment about the board | substrate for electronic component mounting of this invention. It is a top view which shows an example of embodiment about the board | substrate for electronic component mounting of this invention. It is a top view which shows an example of embodiment about the board | substrate for electronic component mounting of this invention. It is sectional drawing which shows an example of embodiment about the electronic component mounting board | substrate of this invention. It is sectional drawing which shows an example of embodiment about the electronic component mounting board | substrate of this invention. It is sectional drawing which shows an example of embodiment about the electronic device of this invention. It is a top view which shows an example of the multi-piece board | substrate with which the electronic component mounting substrate of this invention was arranged in multiple numbers. It is sectional drawing which shows an example of embodiment about the electronic component mounting board | substrate of this invention.

Explanation of symbols

1: Base 1a: Mounting portion 2: Hole 2a, 2c: Line segment 2b, 2d: Ceiling area 3: Wiring layer 4: Electronic component

Claims (6)

Electronic component mounting having a mounting portion for mounting an electronic component on at least one main surface, and a plurality of holes for filling a part of the resin material attached to the electronic component on one main surface Substrate for
When the hole is seen through a plane, the entire internal space is positioned in front of the rearmost end of the opening in one direction,
A part of the internal space is extended outward from the outer periphery of the opening so that the inner surface of the hole portion does not form a convex portion protruding forward in the one direction. Electronic component mounting board. An electronic component mounting portion provided on at least one main surface, and a substrate having a plurality of holes for filling a resin material that opens on the one main surface;
In the side see-through along one direction orthogonal to the depth direction, the hole portion is substantially continuous with a line segment connecting the rearmost position at each depth,
In addition, the line segment extends substantially only in the depth direction as the depth increases, and the line segment gradually or stepwise increases as the depth increases. Consisting of only one or both of the regions extending toward the front side of the direction,
The hole extends so that a part of the inner surface intersects the upward direction opposite to the depth direction and has a ceiling region on the front side in the one direction, and extends to the rear side in the one direction. An electronic component mounting board characterized by being absent . Wherein the plurality of holes is, according to claim 1 or claim 2 electronic component carrier, wherein the positioned distributed around the mounting portion in a plan view. The electronic component mounting substrate according to any one of claims 1 to 3 , an electronic component mounted on a mounting portion of the electronic component mounting substrate, and covering the electronic component, and in the plurality of hole portions An electronic device comprising: a resin material to be filled. The electronic device according to claim 4 , wherein the electronic component is a light emitting element. A first step of preparing the electronic component mounting substrate according to any one of claims 1 to 3 and immersing the electronic component mounting substrate in a processing solution, wherein the one direction is substantially upward. In a state where the electronic component mounting substrate is arranged as described above, the second step of pulling up from the processing liquid, the third step of mounting the electronic component on the mounting portion, covering the electronic component with the resin material, A method of manufacturing an electronic device, wherein a fourth step of filling the hole with the resin material is sequentially performed.

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