JP2004228531A - Package for housing light emitting element and light emitting device - Google Patents

Package for housing light emitting element and light emitting device Download PDF

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Publication number
JP2004228531A
JP2004228531A JP2003017999A JP2003017999A JP2004228531A JP 2004228531 A JP2004228531 A JP 2004228531A JP 2003017999 A JP2003017999 A JP 2003017999A JP 2003017999 A JP2003017999 A JP 2003017999A JP 2004228531 A JP2004228531 A JP 2004228531A
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emitting element
light emitting
resin
light
hole
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JP4307090B2 (en
Inventor
Toshiyuki Chitose
敏幸 千歳
Yosuke Moriyama
陽介 森山
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide the package for housing a light emitting element where a resin is strongly fitted to the recess of an insulating board. <P>SOLUTION: The package for housing the light emitting element has a plurality of insulating layers laminated. A recess 4 in which a light emitting element 3 is housed and mounted is formed on the upper surface of an insulating board 1. A wiring layer 5b to which the light emitting element 3 is electrically connected is formed from the bottom surface to the lower surface of the recess 4, on the insulating board 1. A hole 8 in which a resin is filled and where a step 8a is formed on the inner peripheral surface is provided to the part except for the part of the bottom surface of the recess 4 where the light emitting element 3 is mounted, and the part of wiring layers 5a and 5b. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、パッケージともいう）として、セラミック製のパッケージが用いられており、その一例を図６に示す（例えば、下記の特許文献１参照）。同図に示すように、従来のパッケージは、複数のセラミック層が積層されているとともに上面に凹部２４が形成されている略直方体の絶縁基体の凹部２４の底面の発光素子２３搭載される部位に導体層から成る搭載部２２が設けられた基体２１と、基体２１の搭載部２２およびその周辺から基体２１の下面に形成され、搭載部２２に一方が電気的に接続された一対の配線層２５とから主に構成されている。
【０００３】
そして、搭載部２２上に発光素子２３を導電性接着剤、半田等を介して載置固定するとともに、発光素子２３の電極と一対の配線層２５の他方とをボンディングワイヤ２６を介して電気的に接続し、しかる後、基体２１の凹部２４内に図示しない樹脂（透明樹脂）を充填して発光素子２３を封止することによって、発光装置が作製される。
【０００４】
また、凹部２４の内面で発光素子２３の光を反射させてパッケージの上方に光を放射させるために、凹部２４の内面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき層を表面に有するメタライズ層からなる金属層２７を被着させていることもある。
【０００５】
【特許文献１】
特開２００２−２３２０１７号公報
【０００６】
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージにおいては、発光素子２３が発する熱により、凹部２４内に充填された樹脂が、基体２１、搭載部２２、配線層２５、金属層２７または発光素子２３から剥がれてしまい、凹部２４から樹脂が脱落しやすく、発光素子２３およびボンディングワイヤ２６が露出したり、露出後に発光素子２３やボンディングワイヤ２６がその接合部から剥がれてしまったり、また、樹脂が凹部２４から脱落した際に、発光素子２３やボンディングワイヤ２６が引き剥がされてしまうというという問題点を有していた。
【０００７】
従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、樹脂をパッケージの凹部に強固に取着することができる発光素子収納用パッケージを提供することにある。
【０００８】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、複数の絶縁層が積層されて成り、上面に発光素子を収容し搭載する凹部が形成された絶縁基体に、前記発光素子が電気的に接続される配線層が前記凹部の底面から下面にかけて形成されている発光素子収納用パッケージであって、前記凹部の底面で前記発光素子が搭載される部位と前記配線層の部位とを除いた部位に、樹脂が充填される、内周面に段差が形成された穴が設けられていることを特徴とする。
【０００９】
本発明の発光素子収納用パッケージによれば、凹部の底面で発光素子が搭載される部位と配線層の部位とを除いた部位に、樹脂が充填される、内周面に段差が形成された穴が設けられていることから、凹部内に発光素子を覆うように樹脂を充填した際に、穴にも樹脂が強固に充填されることとなり、凹部内に充填された樹脂が凹部内の各部材から剥れるのを有効に抑制することができる。また、樹脂が、基体、搭載部、配線層、金属層、ボンディングワイヤまたは発光素子から剥がれたとしても、穴の段差によって樹脂が穴から抜けるのが有効に防止されるので、樹脂とともに発光素子やボンディングワイヤが接続部より剥がれて電気的接続が破壊されるのを有効に防止することができる。さらに、穴は絶縁基体を貫通していないため、発光素子の光が穴を通して外部に漏れるのを防ぐことができる。
【００１０】
本発明の発光素子収納用パッケージは、複数の絶縁層が積層されて成り、上面に発光素子を収容し搭載する凹部が形成された絶縁基体に、前記発光素子が電気的に接続される配線層が前記凹部の底面から下面にかけて形成されている発光素子収納用パッケージであって、前記凹部の底面で前記発光素子が搭載される部位と前記配線層の部位とを除いた部位に、樹脂が充填される、内寸法が上側よりも下側が大きい穴が設けられていることを特徴とする。
【００１１】
本発明の発光素子収納用パッケージによれば、凹部の底面で発光素子が搭載される部位と配線層の部位とを除いた部位に、樹脂が充填される、内寸法が上側よりも下側が大きい穴が設けられていることから、凹部内に発光素子を覆うように樹脂を充填した際に、穴にも樹脂が強固に充填されることとなり、凹部内に充填された樹脂が凹部内の各部材から剥れるのをより有効に抑制することができる。また、樹脂が、基体、搭載部、配線層、金属層、ボンディングワイヤまたは発光素子から剥がれたとしても、穴の上側の縁よって樹脂が穴から抜けるのが有効に防止されるので、樹脂とともに発光素子やボンディングワイヤが接続部より剥がれて電気的接続が破壊されるのを有効に防止することができる。さらに、穴は絶縁基体を貫通していないため、発光素子の光が穴を通して外部に漏れるのを防ぐことができる。
【００１２】
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記凹部に収容され搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う前記樹脂とを具備していることを特徴とする。
【００１３】
本発明の発光装置は、上記の構成により、樹脂の接着性に優れた信頼性の高いものとなる。
【００１４】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は、本発明のパッケージについて実施の形態の一例を示す断面図であり、同図において、１は絶縁基体、２は発光素子３が搭載される部位に形成された導体層から成る搭載部、４は発光素子３を収容するための凹部である。
【００１５】
本発明のパッケージは、複数の絶縁層が積層されて成り、上面に発光素子３を収容し搭載する凹部４が形成された絶縁基体１に、発光素子３が電気的に接続される配線層５ｂが凹部４の底面から下面にかけて形成されているものであって、凹部４の底面で発光素子３が搭載される部位と配線層５ａ，５ｂの部位とを除いた部位に、樹脂が充填される、内周面に段差８ａが形成された穴８が設けられている。
【００１６】
絶縁基体１には、発光素子３が搭載される搭載部２に接続されている配線層５ａおよび発光素子３の電極が接続される配線層５ｂが、凹部４の底面から絶縁基体１の下面にかけて形成されている。
【００１７】
本発明の絶縁基体１はセラミックスや樹脂から成り、セラミックスからなる場合、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成る絶縁層を複数層積層してなる略直方体の箱状であり、この上面の中央部に発光素子３を収容するための凹部４が形成されている。
【００１８】
絶縁基体１が酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー，溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（セラミック生シートで、以下、グリーンシートともいう）を得、しかる後、グリーンシートに凹部４用の貫通孔を打ち抜き加工で形成し、発光素子３を搭載するためのグリーンシートと凹部４用のグリーンシートとを複数枚積層し、高温（約１６００℃）で焼成し一体化することで形成される。
【００１９】
また、凹部４の底面には発光素子３を搭載するための導体層から成る搭載部２が形成されており、搭載部２はタングステン（Ｗ），モリブデン（Ｍｏ），銅（Ｃｕ），銀（Ａｇ）等の金属粉末のメタライズ層から成っている。
【００２０】
また、絶縁基体１は、搭載部２およびその周辺から絶縁基体１の下面に形成された配線層５ａ，５ｂが被着形成されている。配線層５ａ，５ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容する発光素子３を外部に電気的に接続するための導電路である。そして、搭載部２には発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、配線層５ｂには発光素子３の電極がボンディングワイヤ６を介して電気的に接続されている。そして、基体１下面の配線層５ａ，５ｂが外部電気回路基板の配線導体に接続されることで発光素子３の各電極と電気的に接続され、発光素子３へ電力や駆動信号が供給される。また、発光素子３は搭載部２および配線層５ｂにフリップチップ実装により接続されても構わない。
【００２１】
配線層５ａ，５ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを絶縁基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、絶縁基体１の所定位置に被着形成される。
【００２２】
なお、配線層５ａ，５ｂおよび搭載部２の露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのがよく、配線層５ａ，５ｂおよび搭載部２が酸化腐蝕するのを有効に防止できるとともに、搭載部２と発光素子３との固着および配線層５ｂとボンディングワイヤ６との接合、配線層５ａ，５ｂと外部電気回路基板の配線層との接合を強固にすることができる。従って、配線層５ａ，５ｂおよび搭載部２の露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２３】
また、凹部４の内面にはメタライズ金属層および発光素子３が発光する光に対する反射率が８０％以上である金属めっき層を被着した金属層７が形成されていることが好ましい。この金属層７は、例えば、ＷやＭｏ等からなるメタライズ金属層上にＮｉ，Ａｕ，Ａｇ等の金属めっき層を被着させてなり、これにより発光素子３が発光する光に対する反射率を８０％以上とすることができる。発光素子３が発光する光に対する反射率が８０％未満であると、凹部４に収容された発光素子３が発光する光を良好に反射することが困難となる。
【００２４】
また、凹部４の内周面は、傾斜面となっているとともに凹部４の底面から絶縁基体１の上面に向けて３５〜７０°の角度で外側に広がっていることが好ましい。角度θが７０°を超えると、凹部４内に収容する発光素子３が発光する光を外部に対して良好に反射することが困難となる傾向にある。一方、角度θが３５°未満であると、凹部４の内周面をそのような角度で安定かつ効率良く形成することが困難となる傾向にあるとともに、パッケージが大型化してしまう。
【００２５】
また、凹部４の内周面の金属層７の表面の算術平均粗さはＲａは１〜３μｍが好ましい。１μｍ未満であると、凹部４内に収容される発光素子３が発光する光を均一に反射させることが難しくなり、反射する光の強さに偏りが発生し易くなる。３μｍを超えると、凹部４内に収容される発光素子３が発光する光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００２６】
また、凹部４は、その断面形状が円形状であることが好ましい。この場合、凹部４に収容される発光素子３が発光する光を、凹部４の内周面の金属層７表面の金属めっき層でパッケージの上方に満遍なく反射させて外部に極めて均一に放射することができるという利点がある。
【００２７】
そして、本発明においては、穴８は、凹部４の底面で搭載部２の部位と配線層５ａ，５ｂの部位とを除いた部位に形成されており、その内周面に段差８ａを有している。図１の例では、穴８の段差８ａは、凹部４側よりも絶縁基体１の下面側でその内寸法が大きくなっている。即ち、穴８の内寸法が上側よりも下側が大きくなるように一つの段差８ａが形成されている。
【００２８】
穴８の内周面に形成された段差８ａにより、凹部４に充填された樹脂は凹部４に強固に接着される。また、樹脂が絶縁基体１、搭載部２、配線層５ａ，５ｂ、ボンディングワイヤ６、金属層７または発光素子３から剥がれたとしても、穴８の段差８ａによって樹脂が穴８から抜けるのが有効に防止されるので、樹脂が凹部４より脱落するのを有効に防止し、樹脂とともに発光素子３やボンディングワイヤ６が接続部より剥がれて電気的接続が破壊されるのをより有効に防止することができる。
【００２９】
このような穴８は、例えば、複数のグリーンシートに異なる内寸法の貫通孔を打ち抜き、これらのグリーンシートと、貫通孔が形成されていないグリーンシートとを積層することで形成される。例えば、図１の場合、凹部４の底面から下のグリーンシートのうち上側のグリーンシート１ａに貫通孔を形成し、中間のグリーンシート１ｂに上側のグリーンシート１ａよりも内寸法の大きな貫通孔を形成して、これらを下側のグリーンシート１ｃ上に積層することで、内周面に段差８ａを有する穴８を形成することができる。
【００３０】
また、図２，図３に本発明の実施の形態の他の例を示す。図２にパッケージの断面図を示すように、断面形状が複数の凹凸を成すような段差９ａを有する穴９とすることができる。また、図３にパッケージの断面図を示すように、その断面形状が傾斜面を有する襞状の段差１０ａを有する穴１０とすることができる。この場合、段差１０ａの傾斜面（襞の上面）は絶縁基体１の上面側に向かって広がるように形成されていることが好ましい。
【００３１】
上記構成の穴９，１０とすることで、穴９，１０の段差９ａ，１０ａによって樹脂が穴９，１０から抜けるのが有効に防止されるので、樹脂が凹部４より脱落するのを有効に防止し、樹脂をパッケージの凹部４に強固に接着することができる。
【００３２】
また、本発明の実施の形態の他の例を図４に示す。図４はパッケージの断面図であり、この場合、内寸法が上側よりも下側が漸次大きくなるように内周面が傾斜した穴１１が形成されている。この穴１１は、搭載部２と配線層５ｂとを除いた部位に、凹部４の底面から絶縁基体１の下面にかけて形成されており、内寸法が上側よりも下側が大きく形成されている。穴１１は、内寸法が上側よりも下側が大きく形成されていることから、凹部４内に発光素子３を覆うように樹脂を充填した際に、穴１１にも樹脂が充填されることとなり、凹部４内に充填された樹脂は凹部４に強固に接着される。また、樹脂が基体１や搭載部２、配線層５ａ，５ｂ、ボンディングワイヤ６、金属層７または発光素子３から剥がれたとしても、内寸法が上側よりも下側が大きい穴１１によって樹脂が穴１１から抜けるのが有効に防止されるので、樹脂とともに発光素子３やボンディングワイヤ６が接続部より剥がれて電気的接続が破壊されるのをより有効に防止することができる。
【００３３】
このような穴１１は、グリーンシートに打ち抜き金型を用いて貫通孔を形成し、他のグリーンシートに積層することで形成される。例えば、図４の場合、凹部４の底面から下のグリーンシートのうち上側のグリーンシート１ａの一方の主面から他方の主面に向けて内寸法が広がるように形成する。このグリーンシート１ａを凹部４を形成するためのセラミックグリーンシートに上側から下側にかけて内寸法が広がるように積層するとともに、下側のグリーンシート１ｂを積層することで、内寸法が上側よりも下側が大きい穴１１を形成することができる。
【００３４】
なお、図１に示した穴８は、内周面に段差８ａを有するとともにその内寸法が上側よりも下側が大きいものの例である。
【００３５】
図１〜図４に示した本発明の穴８〜穴１１は、横断面形状が円形、楕円形、長円形、四角形、多角形等種々の形状とし得るが、樹脂にクラック等が発生し易い角がない円形、楕円形、長円形が好ましい。
【００３６】
また、穴８〜穴１１の凹部４底面側の開口の幅（直径）は、小さすぎると樹脂がその開口の部位で割れたりちぎれ易くなるため、０．０５ｍｍ以上であるのがよい。一方、０．５ｍｍよりも大きくなると、パッケージが大型化することとなるため、０．５ｍｍ以下がよい。
【００３７】
さらに、穴８〜穴１１の凹部４底面側の開口の部分が、平面状または曲面状に面取り加工されていることが好ましい。この場合、樹脂がその開口の部位で割れたりちぎれたりするのを防ぐことができる。
【００３８】
また、穴８〜穴１１の内面および底面に金属層７と同様なメタライズ金属層および金属めっき層から成る反射層が形成されていてもよい。この場合、穴８〜穴１１の内面で発光素子３の光を反射させて、発光装置の発光効率を高めることができる。
【００３９】
なお、本発明は上述の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何ら差し支えない。例えば、図１〜図４の穴８〜穴１１を組み合わせてもよい。図５はそのような穴の拡大断面図であり、図５（ａ）は階段状の段差１２ａを有する穴１２、図５（ｂ）は内周面に複数の凹凸が形成されているとともに内寸法が全体的に上側よりも下側で大きくなっている段差１３ａを有する穴１３である。また、図５（ｃ）は傾斜面を有する襞部が複数形成されているとともに内寸法が全体的に上側よりも下側で大きくなっている段差１４ａを有する穴１４、図５（ｄ）は内寸法が上側よりも下側で漸次大きくなっているとともに内周面の途中に一つの段差１５ａを有する穴１５である。
【００４０】
本発明の発光装置は、本発明のパッケージと、凹部４に収容され搭載部２に搭載されるとともに配線層５ａ，５ｂに電気的に接続された発光素子３と、発光素子３を覆う樹脂（透明樹脂）とを具備している。この構成により、樹脂の接着性に優れた信頼性の高いものとなる。なお、樹脂は発光素子３およびその周囲のみを覆っていてもよいし、発光素子３を覆うとともに凹部４内に充填されていてもよい。
【００４１】
【発明の効果】
半発明の発光素子収納用パッケージは、基体の凹部の底面で発光素子が搭載される部位と配線層の部位とを除いた部位に、樹脂が充填される、内周面に段差が形成された穴が設けられていることにより、凹部内に発光素子を覆うように樹脂を充填した際に、穴にも樹脂が強固に充填されることとなり、凹部内に充填された樹脂が凹部内の各部材から剥れるのを有効に抑制することができる。また、樹脂が、基体、搭載部、配線層、金属層、ボンディングワイヤまたは発光素子から剥がれたとしても、穴の段差によって樹脂が穴から抜けるのが有効に防止されるので、樹脂とともに接続部より剥がれて電気的接続が破壊されるのを有効に防止することができる。さらに、穴は絶縁基体を貫通していないため、発光素子の光が穴を通して外部に漏れるのを防ぐことができる。
【００４２】
また、本発明の発光素子収納用パッケージは、凹部の底面で発光素子が搭載される部位と配線層の部位とを除いた部位に、樹脂が充填される、内寸法が上側よりも下側が大きい穴が設けられていることにより、凹部内に発光素子を覆うように樹脂を充填した際に、穴にも樹脂が強固に充填されることとなり、凹部内に充填された樹脂が凹部内の各部材から剥れるのをより有効に抑制することができる。また、樹脂が、基体、搭載部、配線層、金属層、ボンディングワイヤまたは発光素子から剥がれたとしても、穴の上側の縁によって樹脂が穴から抜けるのが有効に防止されるので、樹脂とともに接続部より剥がれて電気的接続が破壊されるのををより有効に防止することができる。さらに、穴は絶縁基体を貫通していないため、発光素子の光が穴を通して外部に漏れるのを防ぐことができる。
【００４３】
本発明の発光装置は、本発明の発光素子収納用パッケージと、凹部に収容され搭載されるとともに配線層に電気的に接続された発光素子と、発光素子を覆う樹脂とを具備したことにより、樹脂の接着性に優れた信頼性の高いものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の一例を示す断面図である。
【図２】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図３】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図４】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図５】（ａ）〜（ｄ）は本発明の発光素子収納用パッケージについて実施の形態の各種例を示し、それぞれ穴の拡大断面図である。
【図６】従来の発光素子収納用パッケージの断面図である。
【符号の説明】
１：基体
２：搭載部
３：発光素子
４：凹部
５ａ，５ｂ：配線層
８：穴
８ａ：段差[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a display device or the like using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Reference 1). As shown in the figure, the conventional package has a plurality of ceramic layers stacked and a concave portion 24 formed on the upper surface. A base 21 provided with a mounting portion 22 made of a conductor layer; and a pair of wiring layers 25 formed on the lower surface of the base 21 from the mounting portion 22 of the base 21 and the periphery thereof, and one of which is electrically connected to the mounting portion 22. It is mainly composed of
[0003]
Then, the light emitting element 23 is mounted and fixed on the mounting portion 22 via a conductive adhesive, solder, or the like, and the electrodes of the light emitting element 23 and the other of the pair of wiring layers 25 are electrically connected via the bonding wires 26. After that, a resin (transparent resin) (not shown) is filled in the concave portion 24 of the base 21 and the light emitting element 23 is sealed, whereby a light emitting device is manufactured.
[0004]
Further, in order to reflect the light of the light emitting element 23 on the inner surface of the concave portion 24 and emit the light above the package, a metallization having a nickel (Ni) plating layer or a gold (Au) plating layer on the inner surface of the concave portion 24 is provided. A metal layer 27 composed of layers may be applied.
[0005]
[Patent Document 1]
JP-A-2002-232017
[Problems to be solved by the invention]
However, in the above-described conventional package, the resin filled in the concave portion 24 is separated from the base 21, the mounting portion 22, the wiring layer 25, the metal layer 27, or the light emitting element 23 due to the heat generated by the light emitting element 23, When the resin easily falls off from the concave portion 24, the light emitting element 23 and the bonding wire 26 are exposed, the light emitting element 23 and the bonding wire 26 are peeled off from the joint portion after the exposure, and when the resin falls from the concave portion 24. In addition, there is a problem that the light emitting element 23 and the bonding wire 26 are peeled off.
[0007]
Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and an object of the present invention is to provide a light emitting element housing package capable of firmly attaching a resin to a concave portion of the package.
[0008]
[Means for Solving the Problems]
The light-emitting element housing package of the present invention is formed by stacking a plurality of insulating layers, and a wiring layer in which the light-emitting element is electrically connected to an insulating base having an upper surface formed with a recess for housing and mounting the light-emitting element. Is a light emitting element housing package formed from the bottom surface to the lower surface of the concave portion, and a resin is filled in a portion of the bottom surface of the concave portion excluding a portion where the light emitting element is mounted and a portion of the wiring layer. A hole having a step formed on an inner peripheral surface thereof.
[0009]
According to the light emitting element housing package of the present invention, a resin is filled in a portion except for a portion where the light emitting device is mounted and a portion of the wiring layer on the bottom surface of the concave portion, and a step is formed on the inner peripheral surface. Since the hole is provided, when the resin is filled so as to cover the light emitting element in the concave portion, the resin is also firmly filled in the hole, and the resin filled in the concave portion is filled with each resin in the concave portion. Peeling from the member can be effectively suppressed. Further, even if the resin is peeled off from the base, the mounting portion, the wiring layer, the metal layer, the bonding wire or the light emitting element, the step of the hole effectively prevents the resin from falling out of the hole, so that the light emitting element and the resin can be removed together with the resin. It is possible to effectively prevent the bonding wire from being peeled off from the connection portion and breaking the electrical connection. Further, since the hole does not penetrate the insulating base, light of the light emitting element can be prevented from leaking outside through the hole.
[0010]
The light-emitting element housing package of the present invention is formed by stacking a plurality of insulating layers, and a wiring layer in which the light-emitting element is electrically connected to an insulating base having an upper surface formed with a recess for housing and mounting the light-emitting element. Is a light emitting element housing package formed from the bottom surface to the lower surface of the concave portion, and a resin is filled in a portion of the bottom surface of the concave portion excluding a portion where the light emitting element is mounted and a portion of the wiring layer. A hole whose inner dimension is larger on the lower side than on the upper side.
[0011]
According to the light emitting element storage package of the present invention, the resin is filled in the bottom surface of the concave portion except for the light emitting element mounting portion and the wiring layer portion, and the inner dimension is larger than the upper side. Since the hole is provided, when the resin is filled so as to cover the light emitting element in the concave portion, the resin is also firmly filled in the hole, and the resin filled in the concave portion is filled with each resin in the concave portion. Peeling from the member can be more effectively suppressed. Also, even if the resin is peeled off from the base, the mounting portion, the wiring layer, the metal layer, the bonding wire or the light emitting element, the upper edge of the hole effectively prevents the resin from coming out of the hole, so that the light is emitted together with the resin. It is possible to effectively prevent the element and the bonding wire from being peeled off from the connection portion and breaking the electrical connection. Further, since the hole does not penetrate the insulating base, light of the light emitting element can be prevented from leaking outside through the hole.
[0012]
The light emitting device of the present invention includes the light emitting element housing package of the present invention, a light emitting element housed and mounted in the recess and electrically connected to the wiring layer, and the resin covering the light emitting element. It is characterized by doing.
[0013]
With the above configuration, the light emitting device of the present invention has high reliability and excellent resin adhesion.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a package according to the present invention. In FIG. 1, reference numeral 1 denotes an insulating base, and 2 denotes a mounting portion formed of a conductor layer formed on a portion on which a light emitting element 3 is mounted. Reference numerals 4 denote recesses for accommodating the light emitting elements 3.
[0015]
The package of the present invention is formed by laminating a plurality of insulating layers, and a wiring layer 5b for electrically connecting the light emitting element 3 to an insulating base 1 having a concave portion 4 on the upper surface on which the light emitting element 3 is accommodated and mounted. Is formed from the bottom surface of the concave portion 4 to the lower surface thereof, and the resin is filled in the bottom surface of the concave portion 4 excluding the portion where the light emitting element 3 is mounted and the portions of the wiring layers 5a and 5b. And a hole 8 having a step 8a formed in the inner peripheral surface.
[0016]
A wiring layer 5a connected to the mounting portion 2 on which the light emitting element 3 is mounted and a wiring layer 5b connected to the electrode of the light emitting element 3 are provided on the insulating base 1 from the bottom surface of the recess 4 to the lower surface of the insulating base 1. Is formed.
[0017]
The insulating substrate 1 of the present invention is made of ceramic or resin. When made of ceramic, for example, aluminum oxide sintered body (alumina ceramic), aluminum nitride sintered body, mullite sintered body, glass ceramic sintered body, etc. It has a substantially rectangular parallelepiped box shape formed by laminating a plurality of insulating layers made of ceramics, and a concave portion 4 for accommodating the light emitting element 3 is formed at the center of the upper surface.
[0018]
When the insulating substrate 1 is made of an aluminum oxide sintered body, an appropriate organic binder, a solvent or the like is added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, etc., and the mixture is formed into a slurry. It is formed into a sheet by a well-known doctor blade method, calendar roll method, or the like to obtain a ceramic green sheet (a green ceramic sheet, hereinafter also referred to as a green sheet), and thereafter, a through hole for the recess 4 is punched in the green sheet. It is formed by processing, laminating a plurality of green sheets for mounting the light emitting elements 3 and green sheets for the concave portions 4, and firing and integrating them at a high temperature (about 1600 ° C.).
[0019]
A mounting portion 2 made of a conductor layer for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver ( Ag) and other metal powder layers.
[0020]
Further, the insulating base 1 is provided with wiring layers 5a and 5b formed on the lower surface of the insulating base 1 from the mounting portion 2 and the periphery thereof. The wiring layers 5a and 5b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5b via the bonding wire 6. Then, the wiring layers 5 a and 5 b on the lower surface of the base 1 are electrically connected to the respective electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and a driving signal are supplied to the light emitting element 3. . Further, the light emitting element 3 may be connected to the mounting section 2 and the wiring layer 5b by flip chip mounting.
[0021]
The wiring layers 5a and 5b are formed by applying a metal paste obtained by adding a suitable organic solvent and a solvent to a metal powder such as W or Mo, for example, in a predetermined pattern by screen printing on a green sheet serving as the insulating substrate 1. By doing so, it is adhered and formed at a predetermined position on the insulating base 1.
[0022]
It is preferable that a metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, be applied to the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. In addition, it is possible to effectively prevent the wiring layers 5a and 5b and the mounting portion 2 from being oxidized and corroded, to fix the mounting portion 2 to the light emitting element 3 and to join the wiring layer 5b and the bonding wire 6 to the wiring layers 5a and 5b. And the wiring layer of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method. More preferably, they are sequentially applied by an electroless plating method.
[0023]
In addition, it is preferable that a metal layer 7 coated with a metallized metal layer and a metal plating layer having a reflectance of 80% or more with respect to light emitted by the light emitting element 3 is formed on the inner surface of the concave portion 4. The metal layer 7 is formed by depositing a metal plating layer of Ni, Au, Ag or the like on a metallized metal layer made of, for example, W or Mo. % Or more. If the reflectance for the light emitted by the light emitting element 3 is less than 80%, it becomes difficult to satisfactorily reflect the light emitted by the light emitting element 3 accommodated in the recess 4.
[0024]
It is preferable that the inner peripheral surface of the concave portion 4 is an inclined surface and extends outward at an angle of 35 to 70 ° from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1. When the angle θ exceeds 70 °, it tends to be difficult to favorably reflect light emitted from the light emitting element 3 housed in the recess 4 to the outside. On the other hand, if the angle θ is less than 35 °, it tends to be difficult to form the inner peripheral surface of the concave portion 4 stably and efficiently at such an angle, and the package becomes large.
[0025]
The arithmetic average roughness Ra of the surface of the metal layer 7 on the inner peripheral surface of the concave portion 4 is preferably Ra of 1 to 3 μm. When the thickness is less than 1 μm, it is difficult to uniformly reflect the light emitted from the light emitting element 3 accommodated in the recess 4, and the intensity of the reflected light tends to be biased. If it exceeds 3 μm, the light emitted by the light emitting element 3 accommodated in the concave portion 4 is scattered, and it becomes difficult to uniformly radiate the reflected light to the outside with a high reflectance.
[0026]
Further, the recess 4 preferably has a circular cross section. In this case, the light emitted by the light emitting element 3 accommodated in the concave portion 4 is uniformly reflected above the package by the metal plating layer on the metal layer 7 on the inner peripheral surface of the concave portion 4 and emitted to the outside very uniformly. There is an advantage that can be.
[0027]
In the present invention, the hole 8 is formed on the bottom surface of the concave portion 4 except for the portion of the mounting portion 2 and the portions of the wiring layers 5a and 5b, and has a step 8a on its inner peripheral surface. ing. In the example of FIG. 1, the step 8 a of the hole 8 has a larger inner dimension on the lower surface side of the insulating base 1 than on the concave portion 4 side. That is, one step 8a is formed such that the inner dimension of the hole 8 is larger on the lower side than on the upper side.
[0028]
The resin filled in the recess 4 is firmly bonded to the recess 4 by the step 8 a formed on the inner peripheral surface of the hole 8. Even if the resin is peeled off from the insulating base 1, the mounting portion 2, the wiring layers 5a and 5b, the bonding wires 6, the metal layer 7, or the light emitting element 3, it is effective that the resin is removed from the hole 8 by the step 8a of the hole 8. Effectively prevents the resin from dropping out of the concave portion 4 and more effectively prevents the light emitting element 3 and the bonding wire 6 from peeling off from the connection portion together with the resin to break the electrical connection. Can be.
[0029]
Such a hole 8 is formed, for example, by punching through holes of different internal dimensions in a plurality of green sheets, and laminating these green sheets and a green sheet having no through hole. For example, in the case of FIG. 1, a through hole is formed in the upper green sheet 1a of the lower green sheet from the bottom of the recess 4 and a through hole having a larger inner dimension than the upper green sheet 1a is formed in the middle green sheet 1b. By forming these and laminating them on the lower green sheet 1c, holes 8 having steps 8a on the inner peripheral surface can be formed.
[0030]
2 and 3 show another example of the embodiment of the present invention. As shown in the cross-sectional view of the package in FIG. 2, a hole 9 having a step 9a whose cross-sectional shape forms a plurality of irregularities can be formed. Further, as shown in a cross-sectional view of the package in FIG. 3, the cross-sectional shape may be a hole 10 having a fold-like step 10a having an inclined surface. In this case, it is preferable that the inclined surface (upper surface of the fold) of the step 10 a is formed so as to expand toward the upper surface side of the insulating base 1.
[0031]
With the holes 9 and 10 having the above-described configuration, the resin is effectively prevented from falling out of the holes 9 and 10 by the steps 9 a and 10 a of the holes 9 and 10, so that the resin is effectively prevented from dropping out of the recess 4. Thus, the resin can be firmly bonded to the concave portion 4 of the package.
[0032]
FIG. 4 shows another example of the embodiment of the present invention. FIG. 4 is a cross-sectional view of the package. In this case, a hole 11 having an inclined inner peripheral surface is formed such that the inner dimension is gradually increased from the upper side to the lower side. The hole 11 is formed in a portion excluding the mounting portion 2 and the wiring layer 5b from the bottom surface of the concave portion 4 to the lower surface of the insulating base 1, and the inner dimension is formed larger on the lower side than on the upper side. Since the inner dimension of the hole 11 is formed larger on the lower side than on the upper side, when the resin is filled so as to cover the light emitting element 3 in the concave portion 4, the resin is also filled in the hole 11; The resin filled in the recess 4 is firmly bonded to the recess 4. Even if the resin is peeled off from the base 1, the mounting portion 2, the wiring layers 5a and 5b, the bonding wires 6, the metal layer 7 or the light emitting element 3, the resin is formed by the holes 11 whose inner dimensions are larger on the lower side than on the upper side. As a result, it is possible to more effectively prevent the light emitting element 3 and the bonding wire 6 from being peeled off from the connection portion together with the resin to break the electrical connection.
[0033]
Such a hole 11 is formed by forming a through hole in a green sheet using a punching die and laminating the through hole on another green sheet. For example, in the case of FIG. 4, the inner sheet is formed such that the inner dimension increases from one main surface of the upper green sheet 1 a to the other main surface of the lower green sheet from the bottom surface of the recess 4. The green sheet 1a is laminated on the ceramic green sheet for forming the concave portion 4 so that the inner dimension is widened from the upper side to the lower side, and the lower green sheet 1b is laminated so that the inner dimension is lower than the upper side. A hole 11 having a large side can be formed.
[0034]
The hole 8 shown in FIG. 1 is an example in which a step 8a is formed on the inner peripheral surface and the inner dimension is larger on the lower side than on the upper side.
[0035]
The holes 8 to 11 of the present invention shown in FIGS. 1 to 4 can have various cross-sectional shapes such as a circle, an ellipse, an oval, a quadrangle, and a polygon, but cracks and the like easily occur in the resin. A circle with no corners, an oval, and an oval are preferred.
[0036]
Also, the width (diameter) of the opening on the bottom surface side of the concave portion 4 of the holes 8 to 11 is preferably 0.05 mm or more because if the resin is too small, the resin is likely to be cracked or torn at the opening. On the other hand, if it is larger than 0.5 mm, the package becomes large.
[0037]
Further, it is preferable that the opening portions of the holes 8 to 11 on the bottom surface side of the concave portion 4 are chamfered in a flat or curved shape. In this case, it is possible to prevent the resin from being cracked or torn at the opening.
[0038]
Further, a reflective layer composed of a metallized metal layer and a metal plating layer similar to the metal layer 7 may be formed on the inner surface and the bottom surface of the holes 8 to 11. In this case, the light from the light emitting element 3 is reflected by the inner surfaces of the holes 8 to 11, so that the luminous efficiency of the light emitting device can be increased.
[0039]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, the holes 8 to 11 in FIGS. 1 to 4 may be combined. FIG. 5 is an enlarged sectional view of such a hole. FIG. 5A shows a hole 12 having a step-like step 12a, and FIG. 5B shows a case where a plurality of irregularities are formed on an inner peripheral surface. The hole 13 has a step 13a whose dimension is generally larger on the lower side than on the upper side. FIG. 5 (c) shows a hole 14 having a step 14a in which a plurality of folds having inclined surfaces are formed and the inner size of the fold is generally larger on the lower side than on the upper side. The hole 15 has an inner dimension that is gradually increased below the upper side and has one step 15a in the middle of the inner peripheral surface.
[0040]
The light emitting device of the present invention includes a package of the present invention, a light emitting element 3 housed in the recess 4 and mounted on the mounting portion 2 and electrically connected to the wiring layers 5a and 5b, and a resin ( Transparent resin). With this configuration, a highly reliable resin having excellent adhesiveness can be obtained. Note that the resin may cover only the light emitting element 3 and its surroundings, or may cover the light emitting element 3 and fill the recess 4.
[0041]
【The invention's effect】
The light-emitting element housing package of the semi-invention has a resin-filled portion except for a portion where the light-emitting device is mounted and a portion of the wiring layer on the bottom surface of the concave portion of the base, and a step is formed on the inner peripheral surface. By providing the hole, when the resin is filled so as to cover the light emitting element in the concave portion, the resin is also firmly filled in the hole, and the resin filled in the concave portion is filled with each resin in the concave portion. Peeling from the member can be effectively suppressed. Further, even if the resin is peeled off from the base, the mounting portion, the wiring layer, the metal layer, the bonding wire or the light emitting element, the step of the hole effectively prevents the resin from falling out of the hole, so that the resin and the connecting portion together with the resin. It is possible to effectively prevent peeling and breaking of the electrical connection. Further, since the hole does not penetrate the insulating base, light of the light emitting element can be prevented from leaking outside through the hole.
[0042]
Further, in the light emitting element housing package of the present invention, the portion excluding the portion where the light emitting element is mounted and the portion of the wiring layer on the bottom surface of the concave portion is filled with resin, and the inner dimension is larger than the upper side. By providing the hole, when the resin is filled so as to cover the light emitting element in the concave portion, the resin is also firmly filled in the hole, and the resin filled in the concave portion is filled with the resin in the concave portion. Peeling from the member can be more effectively suppressed. Also, even if the resin is peeled off from the base, the mounting portion, the wiring layer, the metal layer, the bonding wire or the light emitting element, the upper edge of the hole effectively prevents the resin from coming out of the hole, so that the resin is connected together with the resin. It is possible to more effectively prevent the electrical connection from being broken by being peeled off from the portion. Further, since the hole does not penetrate the insulating base, light of the light emitting element can be prevented from leaking outside through the hole.
[0043]
The light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element housed in the recess and mounted and electrically connected to the wiring layer, and a resin that covers the light-emitting element. High reliability with excellent resin adhesion.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIGS. 5A to 5D show various examples of the embodiment of the light emitting element housing package of the present invention, and are enlarged sectional views of holes.
FIG. 6 is a cross-sectional view of a conventional light emitting element storage package.
[Explanation of symbols]
1: base 2: mounting portion 3: light emitting element 4: concave portions 5a, 5b: wiring layer 8: hole 8a: step

Claims (3)

複数の絶縁層が積層されて成り、上面に発光素子を収容し搭載する凹部が形成された絶縁基体に、前記発光素子が電気的に接続される配線層が前記凹部の底面から下面にかけて形成されている発光素子収納用パッケージであって、前記凹部の底面で前記発光素子が搭載される部位と前記配線層の部位とを除いた部位に、樹脂が充填される、内周面に段差が形成された穴が設けられていることを特徴とする発光素子収納用パッケージ。A wiring layer to which the light emitting element is electrically connected is formed from the bottom surface to the lower surface of the insulating base, which is formed by laminating a plurality of insulating layers and has a concave portion on the upper surface on which a light emitting element is accommodated and mounted. A light emitting element housing package, wherein a resin is filled in a portion of the bottom surface of the recess except for a portion where the light emitting device is mounted and a portion of the wiring layer, and a step is formed on an inner peripheral surface. A light-emitting element storage package, comprising: 複数の絶縁層が積層されて成り、上面に発光素子を収容し搭載する凹部が形成された絶縁基体に、前記発光素子が電気的に接続される配線層が前記凹部の底面から下面にかけて形成されている発光素子収納用パッケージであって、前記凹部の底面で前記発光素子が搭載される部位と前記配線層の部位とを除いた部位に、樹脂が充填される、内寸法が上側よりも下側が大きい穴が設けられていることを特徴とする発光素子収納用パッケージ。A wiring layer to which the light emitting element is electrically connected is formed from the bottom surface to the lower surface of the insulating base, which is formed by laminating a plurality of insulating layers and has a concave portion on the upper surface on which a light emitting element is accommodated and mounted. A light-emitting element housing package, wherein a portion excluding a portion where the light-emitting device is mounted and a portion of the wiring layer on the bottom surface of the concave portion is filled with resin, and an inner dimension is smaller than an upper portion. A light emitting element storage package, wherein a hole having a large side is provided. 請求項１または請求項２記載の発光素子収納用パッケージと、前記凹部に収容され搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う前記樹脂とを具備していることを特徴とする発光装置。3. A light-emitting element storage package according to claim 1 or 2, further comprising a light-emitting element housed and mounted in the recess and electrically connected to the wiring layer, and the resin covering the light-emitting element. A light-emitting device, characterized in that:
JP2003017999A 2003-01-27 2003-01-27 Light emitting element storage package and light emitting device Expired - Fee Related JP4307090B2 (en)

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