JP2005019688A - Package for accommodating light emitting element and light emitting device - Google Patents

Package for accommodating light emitting element and light emitting device Download PDF

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Publication number
JP2005019688A
JP2005019688A JP2003182583A JP2003182583A JP2005019688A JP 2005019688 A JP2005019688 A JP 2005019688A JP 2003182583 A JP2003182583 A JP 2003182583A JP 2003182583 A JP2003182583 A JP 2003182583A JP 2005019688 A JP2005019688 A JP 2005019688A
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Prior art keywords
light emitting
emitting element
light
package
hole
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JP2003182583A
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Japanese (ja)
Inventor
Hidekazu Tamaru
日出和 田丸
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Kyocera Corp
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Kyocera Corp
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Priority to JP2003182583A priority Critical patent/JP2005019688A/en
Publication of JP2005019688A publication Critical patent/JP2005019688A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Abstract

<P>PROBLEM TO BE SOLVED: To prevent short circuiting at a metallized wiring conductor, and to enable good reflection of light which is emitted from a light emitting device so as to uniformly and efficiently emit the light to the outside. <P>SOLUTION: A package for accommodating a light emitting device is configured such that a frame 2 having a through hole 2a for accommodating the light emitting device 3 and joined to an upper surface of a plate substrate 1 having a mounting portion 1a for mounting the light emitting device 3 so as to enclose the mounting portion 1a. The frame 2 is provided with a reflective layer 6 reflecting the light from the emitting device 3 at an inner peripheral surface of the through hole 2a except for its upper end portion and lower end. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、単にパッケージともいう）として、セラミック製のパッケージが用いられている。従来のセラミック製のパッケージは、図７の断面図に示すように、上面の中央部に発光素子１３を搭載するための導体層から成る搭載部１１ａを有し、搭載部１１ａおよびその周辺から下面に導出された一対のメタライズ配線導体１４ａ，１４ｂを有する基体１１と、中央部に発光素子１３を収容するための貫通穴１２ａを有する枠体１２とから主に構成されている。
【０００３】
そして、基体１１の上面に形成されるとともに一方のメタライズ配線導体１４ａが接続された搭載部１１ａ上に、発光素子１３を半田等の導電性接合材を介して固着するとともに、発光素子１３の電極と他方のメタライズ配線導体１４ｂとをボンディングワイヤ１５を介して電気的に接続し、しかる後、枠体１２の貫通穴１２ａ内に透明樹脂（図示せず）を充填して発光素子１３を封止することによって、発光装置が作製される。この発光装置を外部電気回路基板の配線導体に半田を介して接続することによって、発光装置が外部電気回路基板に実装されて発光素子１３へ電力が供給されることとなる。
【０００４】
また、枠体１２の貫通穴１２ａの内周面で発光素子１３の光を反射させてパッケージの上方に光を放射させるために、貫通穴１２ａの内周面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき層等の金属層１６ｂを表面に有するメタライズ層１６ａから成る反射層１６を被着させていることもある。
【０００５】
また、このパッケージは、セラミックグリーンシート（以下、グリーンシートともいう）積層法により製作されており、具体的には以下のように製作される。基体１１用のグリーンシートと枠体１２用のグリーンシートとを準備し、これらのグリーンシートにメタライズ配線導体１４ａ，１４ｂを導出させるための貫通穴や発光素子１３を収容するための貫通穴１２ａを打ち抜き法で形成する。
【０００６】
次に、基体１１用のグリーンシートの上面から下面にかけて、メタライズ配線導体１４ａ，１４ｂ形成用のＷ，Ｍｏなどの高融点金属粉末から成る導体ペーストを従来周知のスクリーン印刷法等で塗布し、枠体１２用のグリーンシートの貫通穴内周面にメタライズ金属層１６ａ形成用の上記導体ペーストをスクリーン印刷法等で塗布する。基体１１用のグリーンシートと枠体１２用のグリーンシートとを上下に積層し、これを高温で焼成して焼結体と成す。その後、メタライズ配線導体１４ａ，１４ｂおよびメタライズ金属層１６ａの露出する表面にＮｉやＡｕ等の金属から成るめっき金属層１６ｂを無電解めっき法や電解めっき法により被着させることにより製作される。
【０００７】
【特許文献１】
特開２００２−２３２０１７号公報
【０００８】
【発明が解決しようとする課題】
しかしながら、従来のパッケージにおいては発光素子１３の発光する光が基体１１の下面側へ漏れるのを防止するために、メタライズ配線導体１４ａ，１４ｂを基体１１の上面の広領域に形成しており、このため、基体１１の上面に形成されたメタライズ配線導体１４ａ，１４ｂが枠体１２の貫通穴１２ａの内周面に形成された反射層１６と接触しやすくなってしまい、反射層１６を介してメタライズ配線導体１４ａ，１４ｂが短絡することがあるという問題点を有していた。
【０００９】
また、枠体１２用のグリーンシートの貫通穴１２ａの内周面にメタライズ金属層１６ａ形成用の導体ペーストをスクリーン印刷法により塗布しているために、枠体１２用のグリーンシートの貫通穴１２ａの開口周辺、すなわち枠体１２用のグリーンシートの上面または下面にメタライズ金属層１６ａ形成用の導体ペーストが延出されてしまい、基体１１と枠体１２とを接合されて成るパッケージとした際に、反射層１６がパッケージ表面に必要以上に形成されてしまうこととなり、この延出した部位はパッケージの表面に不明瞭な形状として形成されてしまうことがあり、発光装置を上面から見た際の外観や区別を不明瞭な状態としたり、この部位を明瞭な形状とするために、枠体１２の表面にもこの部位を覆うようなメタライズ金属層１６ａ形成するなどの手間を有するという問題点を有していた。
【００１０】
また、パッケージが小型なものである場合等には、その取り扱いや製造を容易とするために、パッケージを縦横に多数配列した多数個取り基板として製作することがあり、この際、反射層１６が多数個取り基板の表面にも形成されて、多数個取り基板を個々のパッケージの大きさに切断して分割するための多数個取り基板の分割線上にあると、反射層１６のめっき金属層１６ｂを切断することとなり、めっき金属層１６ｂの剥がれやひげ等が発生するという問題点があった。特に、枠体１２の側壁部の厚みが小さいパッケージが縦横に多数個配列された多数個取り基板は、枠体１２の貫通穴１２ａから分割線上までの距離が狭いために、反射層１６が多数個取り配線基板の表面に延出した反射層１６が分割線上に形成されやすくなり、上記の問題点が発生しやすいものであった。
【００１１】
従って、本発明は上記従来の問題点に鑑みて完成されたものであり、その目的は、メタライズ配線導体の短絡を発生させることがなく、また外観を良好なものにするとともに、発光素子が発光する光を良好に反射して外部に均一かつ効率良く放射することができる発光素子収納用パッケージおよび発光装置を提供することにある。
【００１２】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、上面に発光素子を搭載するための搭載部を有する平板状の基体の上面に、前記発光素子を収容するための貫通穴を有する枠体が前記搭載部を囲繞するように接合されている発光素子収納用パッケージであって、前記枠体は、前記貫通穴の内周面にその上端部および下端部を除いて前記発光素子が発する光を反射する反射層が形成されていることを特徴とする。
【００１３】
本発明の発光素子収納用パッケージは、枠体は、貫通穴の内周面にその上端部および下端部を除いて発光素子が発する光を反射する反射層が形成されていることから、上端部は反射層が形成されないのでパッケージ上面に反射層が延出して形成されることがなくなり、上面側から発光装置を見た際にパッケージの上面を明瞭に区別することができる。また、枠体の内周面の下端部にも反射層が形成されないので、反射層がメタライズ配線導体と接触するのを確実に防止できるとともに、メタライズ配線導体同士が短絡するのを有効に防止できる。
【００１４】
また、本発明の発光素子収納用パッケージを縦横に多数個配列した多数個取り基板として製作する場合、多数個取り基板を分割する際にパッケージ上面側に延出した反射層を切断することがなくなるので、めっき金属層が剥がれたりひげが発生したりするのを防止できる。
【００１５】
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記搭載部に搭載された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする。
【００１６】
本発明の発光装置は、上記の構成により、発光素子が発光する光を良好に反射し均一かつ効率良く外部に放射することができる、発光効率の高い高性能のものとなる。
【００１７】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は本発明のパッケージについて実施の形態の一例を示す断面図であり、図１において、１は基体、２は枠体であり、主としてこれらで発光素子３を収容するためのパッケージが構成されている。
【００１８】
本発明のパッケージは、上面に発光素子３を搭載するための搭載部１ａを有する平板状の基体１の上面に、発光素子３を収容するための貫通穴２ａを有する枠体２が搭載部１ａを囲繞するように接合されているものであって、枠体２は、貫通穴２ａの内周面にその上端部および下端部を除いて発光素子３が発する光を反射する反射層６が形成されている。
【００１９】
本発明における基体１は、セラミックス，樹脂等の絶縁体から成る直方体状や四角平板状のものであり、セラミックスから成る場合、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成り、発光素子３を支持する支持体であり、その上面の中央部に発光素子３を搭載する搭載部１ａを有している。基体１が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー，溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してセラミックグリーンシート（セラミック生シートで、以下、グリーンシートともいう）を得、しかる後、グリーンシートに適当な打ち抜き加工を施して、高温（約１６００℃）で焼成することによって製作される。
【００２０】
また、基体１は、搭載部１ａから下面にかけて導出されたメタライズ配線導体４ａおよび搭載部１ａの周辺から下面にかけて導出されたメタライズ配線導体４ｂが被着形成されている。搭載部１ａおよびメタライズ配線導体４ａ，４ｂは、タングステンやモリブデン、銅、銀等の金属粉末のメタライズ層から成り、パッケージ内部に収容する発光素子３を外部に電気的に接続するための導電路として機能する。そして、搭載部１ａには発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、メタライズ配線導体４ｂには発光素子３の電極がボンディングワイヤ５を介して電気的に接続されている。そして、基体１下面のメタライズ配線導体４ａ，４ｂが外部電気回路基板の配線導体に接続されることで、その配線導体と発光素子３の各電極とが電気的に接続され、発光素子３へ電力や駆動信号が供給される。また、発光素子３は、搭載部１ａおよびメタライズ配線導体４ｂにフリップチップ実装されていても構わない。
【００２１】
搭載部１ａおよびメタライズ配線導体４ａ，４ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを、基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、基体１の所定位置に被着形成される。
【００２２】
なお、搭載部１ａおよびメタライズ配線導体４ａ，４ｂの露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのがよく、搭載部１ａおよびメタライズ配線導体４ａ，４ｂが酸化腐蝕するのを有効に防止できるとともに、搭載部１ａと発光素子３との固着、メタライズ配線導体４ｂとボンディングワイヤ５との接合、およびメタライズ配線導体４ａ，４ｂと外部電気回路基板の配線導体との接合を強固にすることができる。従って、搭載部１ａおよびメタライズ配線導体４ａ，４ｂの露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２３】
また、本発明の枠体２は、セラミックスや樹脂等から成り、基体１の上面に、積層されて焼結一体化されて接合されたり、ろう材や樹脂接着剤等により接合されている。枠体２は、セラミックスから成る場合は、酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成り、その中央部に発光素子３を収容するための横断面形状が円形状や四角形状の貫通穴２ａを有しており、この貫通穴２ａ内に搭載部１ａに搭載された発光素子３が収容される。枠体２は、例えば、酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー，溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシートを得、しかる後、グリーンシートに貫通穴２ａとなる貫通穴を適当な打ち抜き加工を施して、高温（約１６００℃）で焼成することによって製作される。
【００２４】
また本発明において、枠体２は貫通穴２ａの内周面にその上端部および下端部を除いて発光素子３が発する光を反射する反射層６が形成されている。これにより、上端部は反射層６が形成されていないので、パッケージ上面に反射層６が延出して形成されることがなくなり、上面から発光装置を見た際にパッケージの上面を明瞭に区別することができる。また、貫通穴２ａの内周面の下端部にも反射層６が形成されていないので、反射層６がメタライズ配線導体４ａ，４ｂに接触するのを防止して、メタライズ配線導体４ａ，４ｂ同士が短絡するのを有効に防止できる。
【００２５】
反射層６は、例えばＷやＭｏ等の金属粉末のメタライズ金属層６ａ上にＮｉ，Ａｕ，Ａｇ等のめっき金属層６ｂが被着されて成る。そして、めっき金属層６ｂは、発光素子３が発光する光に対する反射率が８０％未満であると、枠体２の貫通穴２ａに収容された発光素子３が発光する光を良好に反射することが困難であることから、発光素子３が発光する光に対する反射率が８０％以上であることが好ましい。
【００２６】
また、枠体２の貫通穴２ａの内周面は、傾斜面となっているとともに、基体１の上面となす角度が３５〜７０°の角度で上方に向かうに伴って外側に広がっていることが好ましい。角度が７０°を超えると、貫通穴２ａ内に収容された発光素子３が発光する光を外部に対して良好に反射することが困難となる傾向にある。一方、角度が３５°未満であると、貫通穴２ａの内周面をそのような角度で安定かつ効率良く形成することが困難となる傾向にあるとともに、パッケージが大型化してしまう。
【００２７】
また、貫通穴２ａの内周面の反射層６の表面の算術平均粗さＲａは３μｍ以下が好ましい。３μｍを超えると、貫通穴２ａ内に収容される発光素子３が発光する光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００２８】
また、枠体２の貫通穴２ａの横断面形状は、円形状、長円形状、楕円形状、四角形状、多角形状等の種々の形状で良いが、特に円形状が好ましい。この場合、貫通穴２ａに収容された発光素子３が発光する光を、貫通穴２ａの内周面に形成された反射層６の表面でパッケージの上方に満遍なく反射させて外部に極めて均一に放射することができる。
【００２９】
この枠体２は、例えば、枠体２が３層の枠部材２ｂ，２ｃ，２ｄの３層から成る場合、枠部材２ｂ，２ｃ，２ｄとなるグリーンシートにそれぞれ打ち抜き金型等を用いて貫通孔を形成し、枠部材２ｃとなるグリーンシートの貫通孔の内周面にメタライズ金属層６ａ形成用の導体ペーストを塗布した後、これらの枠部材２ｂ，２ｃ，２ｄのグリーンシートを貫通穴２ａを形成するように順に積層することにより、枠体２が形成される。
【００３０】
これにより、枠体２の内周面に上端部および下端部を除いて、メタライズ金属層６ａが形成されることとなる。このメタライズ金属層６ａ上にめっき金属層６ａを被着することで、発光素子３が発光する光を反射する反射層６とすることができる。また、枠部材２ｃとなるグリーンシートの上面または下面にメタライズ金属層６ａ形成用の導体ペーストが延出したとしても、この部位のメタライズ金属層６ａは、枠部材２ｃと枠部材２ｂ，２ｄとの層間に形成されることとなるので、パッケージ上面から見えることがなく、パッケージ上面の形状を明瞭にするとともに、パッケージ上面にめっき金属層６ｂが被着されることはない。従って、多数のパッケージを縦横に配列した多数個取り基板を用いて、スライシング法等により個々のパッケージに切断して分割する際に、めっき金属層６ｂを切断することはないので、めっき金属層６ｂの剥がれやひげが発生することはない。
【００３１】
枠体２の反射層６が形成されない下端部の厚みは０．０２〜０．２ｍｍ程度が好ましい。０．０２ｍｍ未満であると、反射層６とメタライズ配線層４ａ，４ｂとが短絡する危険性が高くなり、０．２ｍｍを超えると、反射層６が形成されていない部位が大きくなり、下端部から発光素子３が発光する光が漏洩して、発光装置の発光効率が低下しやすくなる。
【００３２】
また、枠体２の反射層６が形成されない上端部の厚みは０．０１〜０．２ｍｍ程度が好ましい。０．０１ｍｍ未満であると、上端部が枠部材２ｄから成る場合にその下面にメタライズ金属層６ａが延出していると、パッケージの上面に凹凸ができやすくなり、０．２ｍｍを超えると、反射層６が形成されていない部位が大きくなり、上端部から発光素子３が発光する光が漏洩して発光装置の発光効率が低下しやすくなる。
【００３３】
また、図２のパッケージの断面図に示すように、メタライズ配線導体４ａ，４ｂを枠体２の下面側にまで延出させても良い。これにより、メタライズ配線導体４ａ，４ｂを短絡させることなく、基体１の上面の枠体２に囲繞される領域にメタライズ配線導体４ａ，４ｂを広領域に形成することができるので、発光素子３が発光する光を効率良く外部に放射することができる。
【００３４】
また、図３のパッケージの断面図に示すように、上端部の枠部材２ｄの貫通穴が枠部材２ｃの貫通穴よりも大きくなるように段差を設けても良い。これにより、枠部材２ｃ，２ｄの積層ずれにより枠部材２ｄの内周面が枠部材２ｃの貫通穴２ａから内側に突出して、発光素子３が発光する光が外部に放射されるのを妨げるのを防止できる。この場合、枠部材２ｃと枠部材２ｄとの貫通穴の径の大きさの差は０．２ｍｍ以下が好ましい。０．２ｍｍを超えると、枠体２の側壁部の幅が小さくなってパッケージの機械的強度が小さくなったり、パッケージが大型化するという問題点が生じやすい。
【００３５】
また、図４のパッケージの断面図に示すように、下端部の枠部材２ｂの貫通穴が枠部材２ｃの貫通穴よりも大きくなるように段差を設けても良い。これにより、この段差の部位に発光素子を覆う樹脂を流入させることができるので、樹脂を強固に接着することができる。
【００３６】
また、基体１と枠体２とを接合した状態で、メタライズ金属層６ａ上にめっき金属層６ｂを被着するような場合は、下端部の枠部材２ｂの貫通穴が枠部材２ｃの貫通穴よりも小さくなるような発光素子３側に突出する段差を設けても良い。この場合、枠部材２ｂと枠部材２ｃとの段差にエアー溜まり等が発生するのを有効に防止することができるので、めっき金属層６ｂが被着されずにめっき欠け等が発生することを有効に防止することができる。
【００３７】
また、下端部の枠部材２ｂを２層以上の異なる層とし、上部の層を半導体素子３側に突出させ下部の層を上部の層よりも外側に凹部を有した形状にしても良い。
【００３８】
また、枠体２の貫通穴２ａの内周面の上端部と下端部は発光素子３の発光する光の反射層６とはならないので、基体１の上面に対して、貫通穴２ａの上端部および下端部の傾斜角度と貫通穴２ａの反射層６が形成されている部位との傾斜角度とが異なるようにしても良い。例えば、図５のパッケージの断面図で示すように、貫通穴２ａの内周面の反射層６が形成される部位が上側に向かうに伴って広がるように傾斜角度を設定するとともに、貫通穴２ａの内周面の上端部および下端部を基体１の上面に対して垂直にすることができる。この場合、貫通穴２ａの内周面の上端部および下端部は傾斜をつけていないので、パッケージが外周方向に大きくならず小型化されるとともに、上端部または下端部と反射層６の部位との間に段差を形成する際に、パッケージを大きくすることなく段差の領域を確保することができる。
【００３９】
なお、本発明は上述の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何ら差し支えない。例えば、図６のパッケージの断面図に示すように、搭載部１ａを導体層として形成せずに発光素子３を基体１の上面に直接搭載し、その周囲に発光素子３の電極と電気的に接続されるメタライズ配線導体４ａ，４ｂを形成してもよい。この場合、メタライズ配線導体４ａ，４ｂと発光素子３の電極とをボンディングワイヤ５ａ，５ｂ等で電気的に接続する。また、複数の発光素子３を搭載したり、複数のメタライズ配線導体を形成したものであっても良い。
【００４０】
【発明の効果】
本発明の発光素子収納用パッケージは、枠体は、貫通穴の内周面にその上端部および下端部を除いて発光素子が発する光を反射する反射層が形成されていることから、上端部は反射層が形成されないのでパッケージ上面に反射層が延出して形成されることがなくなり、上面側から発光装置を見た際にパッケージの上面を明瞭に区別することができる。また、枠体の内周面の下端部にも反射層が形成されないので、反射層がメタライズ配線導体と接触するのを確実に防止できるとともに、メタライズ配線導体同士が短絡するのを有効に防止できる。
【００４１】
また、本発明の発光素子収納用パッケージを縦横に多数個配列した多数個取り基板として製作する場合、多数個取り基板を分割する際にパッケージ上面側に延出した反射層のめっき金属層を切断することがなくなるので、めっき金属層が剥がれたりひげが発生したりするのを防止できる。
【００４２】
本発明の発光装置は、本発明の発光素子収納用パッケージと、搭載部に搭載された発光素子と、発光素子を覆う透明樹脂とを具備していることにより、発光素子が発光する光を良好に反射し均一かつ効率良く外部に放射することができる、発光効率の高い高性能のものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージの実施の形態の一例を示す断面図である。
【図２】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図３】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図４】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図５】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図６】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図７】従来の発光素子収納用パッケージの断面図である。
【符号の説明】
１：基体
１ａ：搭載部
２：枠体
２ａ：貫通穴
３：発光素子
４ａ，４ｂ：メタライズ配線導体
６：反射層
６ａ：メタライズ金属層
６ｂ：めっき金属層[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting element storage package and a light-emitting device for storing a light-emitting element, which are used in a display device using a light-emitting element such as a light-emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package is used as a light emitting element storage package (hereinafter also simply referred to as a package) for storing a light emitting element such as a light emitting diode. As shown in the cross-sectional view of FIG. 7, the conventional ceramic package has a mounting portion 11a made of a conductor layer for mounting the light emitting element 13 at the center of the upper surface, and the lower surface from the mounting portion 11a and its periphery. Are mainly composed of a base body 11 having a pair of metallized wiring conductors 14a and 14b led out and a frame body 12 having a through hole 12a for accommodating the light emitting element 13 at the center.
[0003]
Then, the light emitting element 13 is fixed to the mounting portion 11a formed on the upper surface of the base 11 and connected to one metallized wiring conductor 14a via a conductive bonding material such as solder, and the electrode of the light emitting element 13 is fixed. And the other metallized wiring conductor 14b are electrically connected via a bonding wire 15, and then a transparent resin (not shown) is filled in the through hole 12a of the frame 12 to seal the light emitting element 13. By doing so, a light emitting device is manufactured. By connecting this light-emitting device to the wiring conductor of the external electric circuit board via solder, the light-emitting device is mounted on the external electric circuit board and power is supplied to the light-emitting element 13.
[0004]
Further, in order to reflect the light of the light emitting element 13 on the inner peripheral surface of the through hole 12a of the frame body 12 and to radiate the light above the package, a nickel (Ni) plating layer or gold on the inner peripheral surface of the through hole 12a. A reflective layer 16 made of a metallized layer 16a having a metal layer 16b such as a (Au) plating layer on its surface may be deposited.
[0005]
Further, this package is manufactured by a ceramic green sheet (hereinafter also referred to as green sheet) lamination method, and specifically manufactured as follows. A green sheet for the base 11 and a green sheet for the frame 12 are prepared, and through holes for leading the metallized wiring conductors 14a and 14b to the green sheets and through holes 12a for accommodating the light emitting elements 13 are prepared. It is formed by a punching method.
[0006]
Next, a conductor paste made of a refractory metal powder such as W or Mo for forming the metallized wiring conductors 14a and 14b is applied from the upper surface to the lower surface of the green sheet for the substrate 11 by a conventionally known screen printing method or the like. The conductor paste for forming the metallized metal layer 16a is applied to the inner peripheral surface of the through hole of the green sheet for the body 12 by a screen printing method or the like. A green sheet for the substrate 11 and a green sheet for the frame body 12 are stacked one above the other and fired at a high temperature to form a sintered body. Thereafter, the metallized wiring conductors 14a and 14b and the metallized metal layer 16a are manufactured by depositing a plated metal layer 16b made of a metal such as Ni or Au by an electroless plating method or an electrolytic plating method.
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 2002-232017
[Problems to be solved by the invention]
However, in the conventional package, in order to prevent light emitted from the light emitting element 13 from leaking to the lower surface side of the base 11, the metallized wiring conductors 14a and 14b are formed in a wide area on the upper surface of the base 11. For this reason, the metallized wiring conductors 14 a and 14 b formed on the upper surface of the base 11 are likely to come into contact with the reflective layer 16 formed on the inner peripheral surface of the through hole 12 a of the frame body 12, and the metallization is performed via the reflective layer 16. There is a problem that the wiring conductors 14a and 14b may be short-circuited.
[0009]
Further, since the conductive paste for forming the metallized metal layer 16a is applied to the inner peripheral surface of the through hole 12a of the green sheet for the frame 12 by the screen printing method, the through hole 12a of the green sheet for the frame 12 is provided. When the conductive paste for forming the metallized metal layer 16a is extended to the periphery of the opening of the green body, that is, the upper surface or the lower surface of the green sheet for the frame 12, and the base 11 and the frame 12 are joined to form a package. The reflective layer 16 is formed more than necessary on the surface of the package, and the extended portion may be formed in an unclear shape on the surface of the package. When the light emitting device is viewed from above, In order to make the appearance and distinction unclear or to make this part clear, the metallized metal layer 16 covering the part also on the surface of the frame 12. He has a problem of having a trouble such as formation.
[0010]
Further, when the package is small, etc., it may be manufactured as a multi-chip substrate in which a large number of packages are arranged vertically and horizontally in order to facilitate handling and manufacturing. The plating metal layer 16b of the reflective layer 16 is also formed on the surface of the multi-cavity substrate and is on the dividing line of the multi-cavity substrate for cutting and dividing the multi-cavity substrate into individual package sizes. There is a problem that peeling of the plated metal layer 16b, whiskers, and the like occur. In particular, a multi-chip substrate in which a large number of packages with small side wall portions of the frame 12 are arranged vertically and horizontally has a large number of reflective layers 16 because the distance from the through hole 12a of the frame 12 to the dividing line is small. The reflective layer 16 extending on the surface of the individual wiring board is likely to be formed on the dividing line, and the above-described problems are likely to occur.
[0011]
Accordingly, the present invention has been completed in view of the above-described conventional problems, and the object thereof is to prevent occurrence of a short circuit of the metallized wiring conductor, to improve the appearance, and to make the light emitting element emit light. It is an object of the present invention to provide a light emitting element housing package and a light emitting device capable of reflecting light to be reflected well and radiating the light uniformly and efficiently to the outside.
[0012]
[Means for Solving the Problems]
In the light emitting element storage package according to the present invention, a frame having a through hole for accommodating the light emitting element is formed on the upper surface of a flat substrate having a mounting part for mounting the light emitting element on the upper surface. A package for housing a light emitting element, which is joined so as to surround the reflective body, wherein the frame body reflects the light emitted from the light emitting element on an inner peripheral surface of the through hole except for an upper end portion and a lower end portion thereof. Is formed.
[0013]
In the light emitting element storage package according to the present invention, the frame has a reflection layer that reflects light emitted from the light emitting element except for the upper end and the lower end on the inner peripheral surface of the through hole. Since no reflective layer is formed, the reflective layer is not formed to extend on the upper surface of the package, and the upper surface of the package can be clearly distinguished when the light emitting device is viewed from the upper surface side. In addition, since the reflective layer is not formed on the lower end portion of the inner peripheral surface of the frame body, it is possible to reliably prevent the reflective layer from coming into contact with the metallized wiring conductor and to effectively prevent short circuit between the metallized wiring conductors. .
[0014]
Further, when a multi-chip substrate in which a large number of light emitting element storage packages of the present invention are arranged vertically and horizontally is manufactured, the reflective layer extending to the upper surface side of the package is not cut when the multi-chip substrate is divided. Therefore, it is possible to prevent the plated metal layer from peeling off or generating a beard.
[0015]
The light-emitting device of the present invention includes the light-emitting element storage package of the present invention, a light-emitting element mounted on the mounting portion, and a transparent resin that covers the light-emitting element.
[0016]
The light emitting device of the present invention has a high performance with high light emission efficiency, which can reflect light emitted from the light emitting element well and uniformly and efficiently radiate the light to the outside by the above configuration.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention. In FIG. 1, 1 is a base, 2 is a frame, and these mainly constitute a package for housing the light emitting element 3. ing.
[0018]
In the package of the present invention, a frame 2 having a through hole 2a for accommodating the light emitting element 3 is provided on the upper surface of the flat substrate 1 having a mounting portion 1a for mounting the light emitting element 3 on the upper surface. The frame 2 is formed on the inner peripheral surface of the through-hole 2a with a reflective layer 6 that reflects the light emitted from the light-emitting element 3 except for its upper and lower ends. Has been.
[0019]
The substrate 1 in the present invention has a rectangular parallelepiped shape or a rectangular flat plate shape made of an insulator such as ceramics or resin. When the substrate 1 is made of ceramics, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, It is made of ceramics such as a mullite sintered body and a glass ceramic sintered body, and is a support body that supports the light emitting element 3, and has a mounting portion 1a on which the light emitting element 3 is mounted at the center of the upper surface. When the substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry, which is conventionally used. Ceramic green sheet (ceramic raw sheet, hereinafter also referred to as green sheet) is obtained by forming into a sheet shape by a well-known doctor blade method or calender roll method, etc., and thereafter, the green sheet is subjected to an appropriate punching process, It is manufactured by firing at a high temperature (about 1600 ° C.).
[0020]
Further, the base 1 is formed with a metallized wiring conductor 4a led out from the mounting portion 1a to the lower surface and a metallized wiring conductor 4b led out from the periphery of the mounting portion 1a to the lower surface. The mounting portion 1a and the metallized wiring conductors 4a and 4b are made of a metallized layer of a metal powder such as tungsten, molybdenum, copper, or silver, and serve as a conductive path for electrically connecting the light emitting element 3 housed inside the package to the outside. Function. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 1a by a conductive bonding material such as gold (Au) -silicon (Si) alloy or Ag-epoxy resin. The electrodes of the light emitting element 3 are electrically connected to the metallized wiring conductor 4b through bonding wires 5. Then, the metallized wiring conductors 4a and 4b on the lower surface of the base 1 are connected to the wiring conductor of the external electric circuit board, whereby the wiring conductor and each electrode of the light emitting element 3 are electrically connected, and power is supplied to the light emitting element 3. And a drive signal is supplied. Further, the light emitting element 3 may be flip-chip mounted on the mounting portion 1a and the metallized wiring conductor 4b.
[0021]
The mounting portion 1a and the metallized wiring conductors 4a and 4b are prepared by, for example, applying a metal paste obtained by adding an appropriate organic solvent and solvent to a metal powder such as W or Mo to a green sheet serving as the base 1 in advance by screen printing. By printing and applying in a predetermined pattern, the substrate 1 is deposited on a predetermined position.
[0022]
It should be noted that a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), Ag, etc. is deposited on the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a, 4b in a thickness of about 1 to 20 μm. The mounting portion 1a and the metallized wiring conductors 4a and 4b can be effectively prevented from being oxidized and corroded, the mounting portion 1a and the light emitting element 3 are fixed, the metallized wiring conductor 4b and the bonding wire 5 are joined, and the metallization is performed. The bonding between the wiring conductors 4a and 4b and the wiring conductor of the external electric circuit board can be strengthened. Therefore, the Ni plating layer having a thickness of about 1 to 10 μm and the Au plating layer or the Ag plating layer having a thickness of about 0.1 to 3 μm are electrolytically plated on the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a and 4b. It is more preferable that the films are sequentially deposited by a method or an electroless plating method.
[0023]
Further, the frame body 2 of the present invention is made of ceramics, resin, or the like, and is laminated on the upper surface of the substrate 1 by being sintered and integrated, or joined by a brazing material, a resin adhesive, or the like. When the frame body 2 is made of ceramics, the frame body 2 is made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, and the center portion thereof. The through-hole 2a has a circular or quadrangular cross-sectional shape for accommodating the light-emitting element 3, and the light-emitting element 3 mounted on the mounting portion 1a is accommodated in the through-hole 2a. For example, when the frame body 2 is made of an aluminum oxide sintered body, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. This is formed into a sheet shape by a conventionally known doctor blade method, calendar roll method or the like to obtain a green sheet, and then the through hole to be the through hole 2a is appropriately punched into the green sheet to obtain a high temperature (about 1600 ° C.).
[0024]
Further, in the present invention, the frame 2 is formed with a reflective layer 6 that reflects light emitted from the light emitting element 3 on the inner peripheral surface of the through hole 2a except for its upper end and lower end. Thereby, since the reflective layer 6 is not formed on the upper end portion, the reflective layer 6 is not formed to extend on the upper surface of the package, and the upper surface of the package is clearly distinguished when the light emitting device is viewed from the upper surface. be able to. Further, since the reflective layer 6 is not formed on the lower end portion of the inner peripheral surface of the through hole 2a, the reflective layer 6 is prevented from coming into contact with the metallized wiring conductors 4a and 4b, and the metallized wiring conductors 4a and 4b are connected to each other. Can be effectively prevented from short-circuiting.
[0025]
The reflective layer 6 is formed, for example, by depositing a plated metal layer 6b of Ni, Au, Ag or the like on a metallized metal layer 6a of a metal powder such as W or Mo. And the plating metal layer 6b reflects well the light which the light emitting element 3 accommodated in the through-hole 2a of the frame 2 light-emits as the reflectance with respect to the light which the light emitting element 3 emits is less than 80%. Therefore, the reflectance with respect to the light emitted from the light emitting element 3 is preferably 80% or more.
[0026]
Further, the inner peripheral surface of the through hole 2a of the frame body 2 is an inclined surface, and the angle formed with the upper surface of the base body 1 is spread outward as the angle increases from 35 to 70 °. Is preferred. When the angle exceeds 70 °, it tends to be difficult to favorably reflect the light emitted by the light emitting element 3 accommodated in the through hole 2a to the outside. On the other hand, when the angle is less than 35 °, it tends to be difficult to stably and efficiently form the inner peripheral surface of the through hole 2a at such an angle, and the package becomes large.
[0027]
In addition, the arithmetic average roughness Ra of the surface of the reflective layer 6 on the inner peripheral surface of the through hole 2a is preferably 3 μm or less. If it exceeds 3 μm, the light emitted from the light emitting element 3 accommodated in the through hole 2a is scattered, and it becomes difficult to uniformly radiate the reflected light to the outside with high reflectivity.
[0028]
The cross-sectional shape of the through hole 2a of the frame body 2 may be various shapes such as a circular shape, an oval shape, an elliptical shape, a quadrangular shape, and a polygonal shape, but a circular shape is particularly preferable. In this case, the light emitted from the light emitting element 3 accommodated in the through hole 2a is uniformly reflected above the package by the surface of the reflective layer 6 formed on the inner peripheral surface of the through hole 2a, and radiated to the outside very uniformly. can do.
[0029]
For example, when the frame 2 is composed of three layers of three layers of frame members 2b, 2c, and 2d, the frame 2 is penetrated through a green sheet that becomes the frame members 2b, 2c, and 2d using a punching die or the like. After forming a hole and applying a conductive paste for forming the metallized metal layer 6a on the inner peripheral surface of the through hole of the green sheet to be the frame member 2c, the green sheets of these frame members 2b, 2c and 2d are attached to the through hole 2a. The frame body 2 is formed by laminating in order so as to form.
[0030]
As a result, the metallized metal layer 6a is formed on the inner peripheral surface of the frame 2 except for the upper end and the lower end. By depositing the plated metal layer 6a on the metallized metal layer 6a, the reflective layer 6 that reflects the light emitted from the light emitting element 3 can be formed. Further, even if the conductive paste for forming the metallized metal layer 6a extends on the upper surface or the lower surface of the green sheet to be the frame member 2c, the metallized metal layer 6a at this portion is formed between the frame member 2c and the frame members 2b and 2d. Since it is formed between the layers, it cannot be seen from the upper surface of the package, the shape of the upper surface of the package is clarified, and the plated metal layer 6b is not deposited on the upper surface of the package. Therefore, the plating metal layer 6b is not cut when the multi-cavity substrate in which a large number of packages are arranged vertically and horizontally is cut into individual packages by the slicing method or the like, and the plating metal layer 6b is not cut. There will be no peeling or whiskers.
[0031]
The thickness of the lower end of the frame 2 where the reflective layer 6 is not formed is preferably about 0.02 to 0.2 mm. If the thickness is less than 0.02 mm, there is a high risk of short circuit between the reflective layer 6 and the metallized wiring layers 4a and 4b. If the thickness exceeds 0.2 mm, the portion where the reflective layer 6 is not formed becomes large, and the lower end portion Therefore, the light emitted from the light emitting element 3 leaks, and the light emission efficiency of the light emitting device tends to decrease.
[0032]
The thickness of the upper end portion of the frame 2 where the reflective layer 6 is not formed is preferably about 0.01 to 0.2 mm. When the upper end portion is made of the frame member 2d when it is less than 0.01 mm, the metallized metal layer 6a extends on the lower surface of the frame member 2d. The portion where the layer 6 is not formed becomes large, and light emitted from the light emitting element 3 leaks from the upper end portion, so that the light emission efficiency of the light emitting device tends to be lowered.
[0033]
Further, as shown in the sectional view of the package in FIG. 2, the metallized wiring conductors 4 a and 4 b may be extended to the lower surface side of the frame 2. Accordingly, the metallized wiring conductors 4a and 4b can be formed in a wide area in the region surrounded by the frame 2 on the upper surface of the base 1 without short-circuiting the metallized wiring conductors 4a and 4b. The emitted light can be efficiently emitted to the outside.
[0034]
Further, as shown in the sectional view of the package in FIG. 3, a step may be provided so that the through hole of the frame member 2d at the upper end is larger than the through hole of the frame member 2c. Thereby, the inner peripheral surface of the frame member 2d protrudes inward from the through hole 2a of the frame member 2c due to the stacking deviation of the frame members 2c and 2d, thereby preventing the light emitted from the light emitting element 3 from being emitted to the outside. Can be prevented. In this case, the difference in the diameter of the through hole between the frame member 2c and the frame member 2d is preferably 0.2 mm or less. When it exceeds 0.2 mm, the width of the side wall portion of the frame body 2 is reduced, and the mechanical strength of the package is reduced or the package is likely to be enlarged.
[0035]
Further, as shown in the sectional view of the package of FIG. 4, a step may be provided so that the through hole of the frame member 2b at the lower end is larger than the through hole of the frame member 2c. Accordingly, since the resin covering the light emitting element can be caused to flow into the stepped portion, the resin can be firmly bonded.
[0036]
When the plated metal layer 6b is deposited on the metallized metal layer 6a with the base body 1 and the frame body 2 joined, the through hole of the frame member 2b at the lower end is the through hole of the frame member 2c. A step that protrudes toward the light emitting element 3 so as to be smaller than that may be provided. In this case, it is possible to effectively prevent air accumulation or the like from occurring at the step between the frame member 2b and the frame member 2c. Therefore, it is effective that the plating metal layer 6b is not deposited and plating defects occur. Can be prevented.
[0037]
Alternatively, the frame member 2b at the lower end may have two or more different layers, the upper layer may protrude toward the semiconductor element 3, and the lower layer may have a concave portion outside the upper layer.
[0038]
Further, the upper end portion and the lower end portion of the inner peripheral surface of the through hole 2 a of the frame body 2 do not serve as the light reflection layer 6 for the light emitted from the light emitting element 3. In addition, the inclination angle of the lower end portion may be different from the inclination angle of the portion of the through hole 2a where the reflective layer 6 is formed. For example, as shown in the cross-sectional view of the package of FIG. 5, the inclination angle is set so that the portion where the reflection layer 6 is formed on the inner peripheral surface of the through hole 2a is spread upward, and the through hole 2a is formed. The upper end portion and the lower end portion of the inner peripheral surface can be made perpendicular to the upper surface of the base 1. In this case, since the upper end portion and the lower end portion of the inner peripheral surface of the through hole 2a are not inclined, the package is not enlarged in the outer peripheral direction and is downsized, and the upper end portion or the lower end portion and the portion of the reflective layer 6 are When the step is formed between the steps, the step region can be secured without enlarging the package.
[0039]
Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package in FIG. 6, the light emitting element 3 is directly mounted on the upper surface of the base 1 without forming the mounting portion 1a as a conductor layer, and the electrodes of the light emitting element 3 are electrically connected to the periphery thereof. The metallized wiring conductors 4a and 4b to be connected may be formed. In this case, the metallized wiring conductors 4a and 4b and the electrodes of the light emitting element 3 are electrically connected by bonding wires 5a and 5b. Further, a plurality of light emitting elements 3 may be mounted or a plurality of metallized wiring conductors may be formed.
[0040]
【The invention's effect】
In the light emitting element storage package according to the present invention, the frame has a reflection layer that reflects light emitted from the light emitting element except for the upper end and the lower end on the inner peripheral surface of the through hole. Since no reflective layer is formed, the reflective layer is not formed to extend on the upper surface of the package, and the upper surface of the package can be clearly distinguished when the light emitting device is viewed from the upper surface side. In addition, since the reflective layer is not formed on the lower end portion of the inner peripheral surface of the frame body, it is possible to reliably prevent the reflective layer from coming into contact with the metallized wiring conductor and to effectively prevent short circuit between the metallized wiring conductors. .
[0041]
In addition, when manufacturing a multi-cavity substrate in which a large number of light emitting element storage packages of the present invention are arranged vertically and horizontally, the plating metal layer of the reflective layer extending to the upper surface of the package is cut when the multi-cavity substrate is divided. Therefore, it is possible to prevent the plating metal layer from peeling off or generating beards.
[0042]
The light-emitting device of the present invention includes the light-emitting element storage package of the present invention, the light-emitting element mounted on the mounting portion, and the transparent resin that covers the light-emitting element, so that the light emitted from the light-emitting element is favorable. Therefore, it is possible to emit light to the outside uniformly and efficiently.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting element storage package according to the present invention.
FIG. 2 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 6 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 7 is a cross-sectional view of a conventional light emitting element storage package.
[Explanation of symbols]
1: Base 1a: Mounting portion 2: Frame 2a: Through hole 3: Light emitting element 4a, 4b: Metallized wiring conductor 6: Reflective layer 6a: Metallized metal layer 6b: Plating metal layer

Claims (2)

上面に発光素子を搭載するための搭載部を有する平板状の基体の上面に、前記発光素子を収容するための貫通穴を有する枠体が前記搭載部を囲繞するように接合されている発光素子収納用パッケージであって、前記枠体は、前記貫通穴の内周面にその上端部および下端部を除いて前記発光素子が発する光を反射する反射層が形成されていることを特徴とする発光素子収納用パッケージ。A light emitting element in which a frame having a through hole for accommodating the light emitting element is joined to the upper surface of a flat substrate having a mounting part for mounting the light emitting element on the upper surface so as to surround the mounting part. In the storage package, the frame body is formed with a reflective layer that reflects light emitted from the light emitting element except for an upper end portion and a lower end portion on an inner peripheral surface of the through hole. Light emitting element storage package. 請求項１記載の発光素子収納用パッケージと、前記搭載部に搭載された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする発光装置。A light emitting device comprising: the light emitting element storage package according to claim 1; a light emitting element mounted on the mounting portion; and a transparent resin covering the light emitting element.
JP2003182583A 2003-06-26 2003-06-26 Package for accommodating light emitting element and light emitting device Pending JP2005019688A (en)

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Cited By (11)

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JP2006351611A (en) * 2005-06-13 2006-12-28 Rohm Co Ltd Substrate for mounting light-emitting device and optical semiconductor device using same
JP2007123484A (en) * 2005-10-27 2007-05-17 Kyocera Corp Light emitting device
JP2007149811A (en) * 2005-10-26 2007-06-14 Kyocera Corp Wiring board for light emitting element and light emitting device
JP2008172125A (en) * 2007-01-15 2008-07-24 Citizen Electronics Co Ltd Chip type led light-emitting device and its manufacturing method
JP2008535237A (en) * 2005-11-09 2008-08-28 アルティ エレクトロニクス カンパニー リミテッド Side light emitting diode and manufacturing method thereof
JP2008198782A (en) * 2007-02-13 2008-08-28 Toyoda Gosei Co Ltd Light-emitting device
WO2012102266A1 (en) * 2011-01-27 2012-08-02 大日本印刷株式会社 Resin-attached lead frame, method for manufacturing same, and lead frame
JP2013197368A (en) * 2012-03-21 2013-09-30 Kyocera Corp Substrate for mounting light-emitting element and light-emitting device using the same
JP2013229439A (en) * 2012-04-25 2013-11-07 Kyocera Corp Substrate for mounting light emitting element and light emitting device using the same
KR101790052B1 (en) * 2011-04-15 2017-10-25 엘지이노텍 주식회사 Light emitting device package
WO2017160081A3 (en) * 2016-03-18 2018-08-02 주식회사 세미콘라이트 Semiconductor light emitting device

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351611A (en) * 2005-06-13 2006-12-28 Rohm Co Ltd Substrate for mounting light-emitting device and optical semiconductor device using same
JP2007149811A (en) * 2005-10-26 2007-06-14 Kyocera Corp Wiring board for light emitting element and light emitting device
JP2007123484A (en) * 2005-10-27 2007-05-17 Kyocera Corp Light emitting device
JP2008535237A (en) * 2005-11-09 2008-08-28 アルティ エレクトロニクス カンパニー リミテッド Side light emitting diode and manufacturing method thereof
JP2008172125A (en) * 2007-01-15 2008-07-24 Citizen Electronics Co Ltd Chip type led light-emitting device and its manufacturing method
JP2008198782A (en) * 2007-02-13 2008-08-28 Toyoda Gosei Co Ltd Light-emitting device
CN103348499A (en) * 2011-01-27 2013-10-09 大日本印刷株式会社 Resin-attached lead frame, method for manufacturing same, and lead frame
WO2012102266A1 (en) * 2011-01-27 2012-08-02 大日本印刷株式会社 Resin-attached lead frame, method for manufacturing same, and lead frame
JP5861943B2 (en) * 2011-01-27 2016-02-16 大日本印刷株式会社 Lead frame with resin, manufacturing method thereof, and lead frame
CN103348499B (en) * 2011-01-27 2016-08-10 大日本印刷株式会社 The lead frame of resin and its manufacture method and lead frame
US9461220B2 (en) 2011-01-27 2016-10-04 Dai Nippon Printing Co., Ltd. Resin-attached lead frame, method for manufacturing the same, and lead frame
US9806241B2 (en) 2011-01-27 2017-10-31 Dai Nippon Printing Co., Ltd. Resin-attached lead frame and semiconductor device
KR101790052B1 (en) * 2011-04-15 2017-10-25 엘지이노텍 주식회사 Light emitting device package
JP2013197368A (en) * 2012-03-21 2013-09-30 Kyocera Corp Substrate for mounting light-emitting element and light-emitting device using the same
JP2013229439A (en) * 2012-04-25 2013-11-07 Kyocera Corp Substrate for mounting light emitting element and light emitting device using the same
WO2017160081A3 (en) * 2016-03-18 2018-08-02 주식회사 세미콘라이트 Semiconductor light emitting device

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