JP4070195B2 - Light emitting element storage package - Google Patents

Light emitting element storage package Download PDF

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Publication number
JP4070195B2
JP4070195B2 JP2002344733A JP2002344733A JP4070195B2 JP 4070195 B2 JP4070195 B2 JP 4070195B2 JP 2002344733 A JP2002344733 A JP 2002344733A JP 2002344733 A JP2002344733 A JP 2002344733A JP 4070195 B2 JP4070195 B2 JP 4070195B2
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emitting element
light emitting
hole
surface side
mounting portion
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JP2004179439A (en
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敏幸 千歳
陽介 森山
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージに関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収容するための発光素子収納用パッケージ（以下、パッケージともいう）として、セラミック製のパッケージが用いられている。従来のセラミック製のパッケージは、図４に断面図で示すように、上面の中央部に発光素子23を搭載するための導体層から成る搭載部21ａを有し、搭載部21ａおよびその周辺から下面に導出された一対のメタライズ配線導体24ａ，24ｂを有する略直方体や略四角形平板状のセラミック製の基体21と、その上面に積層され、中央部に発光素子23を収容するための貫通孔22ａを有する略四角枠状のセラミック製の枠体22とから主に構成されている（例えば、下記の特許文献１参照）。
【０００３】
そして、基体21の上面の一方のメタライズ配線導体24ａが接続された搭載部21ａ上に発光素子23を導電性接合材を介して固着するとともに、発光素子23の電極と他方のメタライズ配線導体24ｂとをボンディングワイヤ25を介して電気的に接続し、しかる後、枠体22の貫通孔22ａ内に透明樹脂（図示せず）を充填して発光素子23を封止することによって、発光装置が作製される。この発光装置を外部電気回路基板の配線導体に半田を介して接続することによって、発光装置が外部電気回路基板に実装されるとともに搭載する発光装置の電極が外部電気回路に電気的に接続され発光素子23へ電力が供給されることとなる。
【０００４】
このようなセラミック製のパッケージにおいては、内部に収容する発光素子23が発光する光を枠体22の貫通孔22ａの内周面で反射させるが、発光装置の発光効率を良好なものとするために貫通孔22ａの内周面にニッケル（Ｎｉ）や金（Ａｕ）等の金属から成るめっき金属層26ｂを表面に有するメタライズ金属層26ａを被着させている。
【０００５】
また、このパッケージはセラミックグリーンシート（以下、グリーンシートともいう）積層法により製作される。具体的には、セラミックスから成る基体21用のグリーンシートと、セラミックスから成る枠体22用のグリーンシートとを準備し、これらのグリーンシートにメタライズ配線導体24ａ，24ｂを導出させるための貫通孔や発光素子23を収容するための貫通孔22ａをグリーンシートの上下面に略垂直に打ち抜く。次に、基体21用のグリーンシートの上面から下面にかけてメタライズ配線導体24ａ，24ｂ用のタングステン（Ｗ）やモリブデン（Ｍｏ）などの高融点金属粉末から成る金属ペーストを従来周知のスクリーン印刷法等により塗布し、枠体22用のグリーンシートの貫通孔22ａの内周面にメタライズ金属層26ａ用のＷやＭｏなどの高融点金属粉末から成る金属ペーストをスクリーン印刷法等により塗布する。基体21用のグリーンシートと枠体22用のグリーンシートとを上下に重ねて接合し、これらを高温で焼成して焼結体と成す。その後、搭載部21ａ，メタライズ配線導体24ａ，24ｂおよびメタライズ金属層26ａの露出表面に、ＮｉやＡｕ等の金属から成るめっき金属層26ｂを無電解めっき法や電解めっき法により被着させることにより、パッケージが製作される。
【０００６】
しかしながら、この従来のパッケージでは、貫通孔22ａの内周面が基体21の上面に対して略垂直になっており、そのため、貫通孔22ａの内周面で反射した光が外部に均一かつ良好に放射されず、このパッケージを用いた発光装置の発光効率がそれ程高くならないという問題点を有していた。
【０００７】
そこで、このような問題点を解消するために、本出願人は、図３に示すように、上面に発光素子13を搭載するための搭載部11ａを有する略平板状の基体11の上面に、発光素子13を収容するための貫通孔12ａを有する枠体12を接合して成るパッケージであって、貫通孔12ａの内周面は、基体11上面に対して55〜70度の角度で外側に広がっているとともにその表面に算術平均粗さＲａが１〜３μｍでかつ発光素子13の光に対する反射率が80％以上のめっき金属層16ｂが被着されていることにより、貫通孔12ａ内に収容する発光素子13が発する光を傾斜した貫通孔12ａの内周面のめっき金属層16ｂにより良好に反射させて外部に向かって均一かつ効率良く放射することができるパッケージを提案した（下記の特許文献１参照）。
【０００８】
このパッケージは以下のようにして作製される。枠体12用のグリーンシートに発光素子13収納用の貫通孔12ａをその内周面が55〜70度の傾斜面となるように穿孔する。次に、この貫通孔12ａの内周面に金属ペーストを塗布し、枠体12用のグリーンシートと基体11用のグリーンシートとを枠体12用のグリーンシートの貫通孔12ａの内周面が外側に広がる向きに接合し、これらを焼成して基体11上に貫通孔12ａを有する枠体12が積層一体化されるとともに貫通孔12ａの内周面にメタライズ金属層16ａが被着された焼結体を得る。次に、メタライズ金属層16ａ表面に算術平均粗さＲａが１〜３μｍでかつ発光素子13が発する光に対する反射率が80％以上のめっき金属層16ｂを被着させる。
【０００９】
メタライズ配線導体14ａ，14ｂは、例えばＷ等の高融点金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを、基体11となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって基体11の所定位置に被着形成される。メタライズ配線導体14ａ，14ｂの露出表面にＮｉやＡｕ等の耐蝕性に優れる金属を１〜20μｍ程度の厚みで被着させておくと、メタライズ配線導体14ａ，14ｂが酸化腐蝕するのを有効に防止でき、またメタライズ配線導体14ａと発光素子13、メタライズ配線導体14ｂとボンディングワイヤ15との接合、メタライズ配線導体14ａ，14ｂと外部電気回路基板の配線導体との接合を強固にすることができる。従って、メタライズ配線導体14ａ，14ｂの露出表面には、厚さ１〜10μｍ程度のＮｉめっき層と厚さ0.1〜３μｍ程度のＡｕめっき層とが電解めっき法や無電解めっき法により順次被着されている。
【００１０】
【特許文献１】
特開平14−232017号公報
【００１１】
【発明が解決しようとする課題】
しかしながら、上記特許文献１のパッケージにおいては、貫通孔12ａの内周面の基体11に対する角度が一定の角度で形成されていることから、発光素子13が発光する光を貫通孔12ａの内周面に被着しためっき金属層16ｂで効率良く反射するためには、平面視において発光素子13を枠体12の貫通孔12ａの開口の中心に搭載することが必要であった。そして、平面視において搭載部11ａを貫通孔12ａの開口の中心に形成し、メタライズ配線導体14ｂを搭載部11ａの周囲に形成するためには、基体11上の搭載部11ａおよびメタライズ配線導体14ｂの領域を広領域に形成する必要があるとともに、貫通孔12ａの下面側開口も広くする必要がある。このことから、パッケージが大型化してしまいやすいという問題点を有していた。
【００１２】
また、発光素子13が枠体12の貫通孔12ａの開口の中心以外に搭載されると、発光素子13に対する反射角度が貫通孔12ａの内周面の場所によって大きく異なってくるので、発光素子13が発光する光を貫通孔12ａの内周面で効率良く反射しにくくなり、外部に均一に放射できなくなるという問題点を有していた。
【００１３】
従って、本発明は、上記従来の問題点に鑑み完成されたものであり、その目的は、基体上の搭載部およびメタライズ配線導体の領域を広くする必要がなく、また貫通孔の下面側開口も広くする必要がなくなるとともに、発光素子の光を外部に効率良くかつ収束して放射でき、その結果発光装置の発光効率を極めて高いものとすることが可能な小型で信頼性の高い発光素子収納用パッケージを提供することにある。
【００１４】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、上面に発光素子を搭載するための搭載部を有する略平板状の基体の上面に、前記発光素子を収容するための貫通孔を有する枠体を積層してなる発光素子収納用パッケージであって、前記貫通孔は、前記枠体の上面側開口が下面側開口よりも大きく、かつ前記上面側開口の中心を前記下面側開口の中心に対して前記搭載部と反対側にずらせて形成されていることを特徴としている。
【００１５】
本発明の発光素子収納用パッケージによれば、貫通孔は、枠体の上面側開口が下面側開口よりも大きく、かつ上面側開口の中心を下面側開口の中心に対して搭載部と反対側にずらせて形成されていることから、発光素子を貫通孔の開口の中心に搭載する必要がなくなり、その結果搭載部およびメタライズ配線導体を基体上に広領域に渡って形成する必要がなくなり、貫通孔の下面側開口も広領域に渡って形成する必要がなくなるとともに、発光素子の光を貫通孔の内周面や内周面に被着しためっき金属層で効率良く反射して外部に放射することができる小型化された発光素子収納用パッケージとすることができる。
【００１６】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は、本発明のパッケージの実施の形態の一例を示す正面図であり、図２は、図１のＸ−Ｘ線における断面図を示しており、１は基体、２は枠体であり、主としてこれらで発光素子３を収容するためのパッケージが構成されている。
【００１７】
本発明のパッケージは、上面に発光素子３を搭載するための搭載部１ａを有する略平板状の基体１の上面に、発光素子３を収容するための貫通孔２ａを有する枠体２を積層してなるものであって、貫通孔２ａは、枠体２の上面側開口が下面側開口よりも大きく、かつ上面側開口の中心を下面側開口の中心に対して搭載部１ａと反対側にずらせて形成されている。
【００１８】
本発明の基体１はセラミックス，樹脂等から成り、セラミックスからなる場合は、酸化アルミニウム質焼結体（アルミナセラミックス）、窒化アルミニウム質焼結体等のセラミックスから成る略直方体や略四角平板状のものであり、発光素子３を支持する支持体であり、その上面に発光素子３を搭載する搭載部１ａを有している。基体１が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシート（セラミック生シート）を得、しかる後、グリーンシートに適当な打ち抜き加工を施してこれを複数枚積層し、高温（約1600℃）で焼成することによって製作される。
【００１９】
また基体１は、その搭載部１ａから下面にかけて導出されるメタライズ配線導体４ａおよび搭載部１ａの周辺から下面にかけて導出されるメタライズ配線導体４ｂが被着形成されている。メタライズ配線導体４ａ，４ｂはタングステンやモリブデン等の金属粉末メタライズから成り、内部に収容する発光素子３を外部に電気的に接続するための導電路として機能する。そして、搭載部１ａには発光ダイオード，半導体レーザ等の発光素子３が金−シリコン合金や銀−エポキシ樹脂等の導電性接合材により固着されるとともに、メタライズ配線導体４ｂの搭載部１ａには発光素子３の電極がボンディングワイヤ５を介して電気的に接続される。また、発光素子３は、搭載部１ａおよびメタライズ配線導体４ｂにフリップチップ実装されていても構わない。
【００２０】
なお、搭載部１ａおよびメタライズ配線導体４ａ，４ｂの露出する表面にニッケルや金等の耐蝕性に優れる金属を１〜20μｍ程度の厚みに被着させておくと、搭載部１ａおよびメタライズ配線導体４ａ，４ｂが酸化腐蝕するのを有効に防止できるとともに、搭載部１ａと発光素子３との固着およびメタライズ配線導体４ｂとボンディングワイヤ５との接合を強固なものとすることができる。したがって、搭載部１ａおよびメタライズ配線導体４ａ，４ｂの露出表面には、厚み１〜10μｍ程度のニッケルめっき層と厚み0.1〜３μｍ程度の金メッキ層とが電解めっき法や無電解めっき法により順次被着されている。
【００２１】
枠体２は、基体１と実質的に同じ組成のセラミックスから成り、基体１の上面に積層されて焼結一体化されて接合されている。枠体２は、その中央部に発光素子３を収容するための貫通孔２ａを有しており、この貫通孔２ａ内に搭載部１ａに搭載された発光素子３が収容される。
【００２２】
本発明においては、枠体２の貫通孔２ａは、枠体２の上面側開口が下面側開口よりも大きく、かつ上面側開口の中心を下面側開口の中心に対して搭載部１ａと反対側にずらせて形成されている。これにより、貫通孔２ａの内周面の搭載部１ａ近傍の角度θ１は、その反対側の角度θ２よりも大きくなるので、発光素子３が発光する光を貫通孔２ａの内周面で効率良く反射し、外部に放射することができる。また、発光素子３および搭載部１ａを枠体２の貫通孔２ａの開口の中心に形成する必要がなくなるために、基体１上における搭載部１ａおよびメタライズ配線導体４ｂの形成領域を小さくすることができ、かつ貫通孔２ａの下面側開口も小さくすることができるので、パッケージを小型化することができる。
【００２３】
また、枠体２の貫通孔２ａの内周面は基体１の上面に対する角度（θ１，θ２）が35〜70°であることが好ましく、70°を超えると貫通孔２ａ内に収容する発光素子３の光を外部に対して良好に反射することが困難となる傾向にあり、35°未満では、パッケージが大型化してしまう傾向にある
また、本発明ではθ１＞θ２であるが、（θ１−θ２）は25°以下がよい。（θ１−θ２）が25°を超えると、そのような角度の差を有する貫通孔２ａを安定的に形成するのが困難となる。
【００２４】
本発明の枠体２は、枠体２用のグリーンシートに貫通孔を打ち抜き金型を用いて打ち抜くことによって形成される。このとき、枠体２用のグリーンシートに形成される貫通孔２ａの開口がグリーンシートの上面側と下面側とで大きさが異なるとともに、かつ上面側と下面側とで開口の中心がずれているように形成する。そして、基体１用のグリーンシート上に枠体２用のグリーンシートを、貫通孔２ａが一方の主面から他方の主面に向けて広がるとともに、貫通孔２ａの上面側開口の中心が下面側開口の中心に対して、基体１用セラミックグリーンシート上に形成された搭載部１ａと反対側となるように、順に積層していく。これにより、枠体２の貫通孔２ａの上面側開口が下側開口よりも大きく、かつ上面側開口の中心が下面側開口の中心に対して搭載部１ａと反対側にずれて形成される。
【００２５】
また、貫通孔２ａの開口の形状は、略円形状、略四角形状、略楕円形状、略多角形状等の種々の形状で構わないが、貫通孔２ａの製作の容易さや形状の安定化等の点から上面側開口と下面側開口が略同形状であるのが好ましい。また、開口の形状として特に略円形を用いるとより好ましく、この場合、貫通孔２ａに収容された発光素子３が発する光を略円形の貫通孔２ａの内周面で効率良く反射させて外部に放射することができる。
【００２６】
また、枠体２の貫通孔２ａの内周面の略全面には、メタライズ金属層６ａおよびめっき金属層６ｂが形成されているのが好ましく、例えば、ＷやＭｏ等の金属粉末のメタライズ金属層６ａ上にＮｉ，Ａｕ，Ａｇ等のめっき金属層６ｂが被着されている。そして、めっき金属層６ｂは発光素子３が発光する光に対する反射率を80％以上とすることが好ましいが、めっき金属層６ｂがＮｉ，Ａｕ，Ａｇ等から成ることによって、発光素子３が発光する光に対する反射率を80％以上とすることができる。反射率が80％未満であると、枠体２の貫通孔２ａに収容された発光素子３が発光する光を良好に反射することが困難となる。
【００２７】
なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。
【００２８】
【発明の効果】
本発明の発光素子収納用パッケージは、貫通孔は、枠体の上面側開口が下面側開口よりも大きく、かつ上面側開口の中心を下面側開口の中心に対して搭載部と反対側にずらせて形成されていることから、発光素子を貫通孔の開口の中心に搭載する必要がなくなり、その結果搭載部およびメタライズ配線導体を基体上に広領域に渡って形成する必要がなくなり、貫通孔の下面側開口も広領域に渡って形成する必要がなくなるとともに、発光素子の光を貫通孔の内周面や内周面に被着しためっき金属層で効率良く反射して外部に放射することができる小型化された発光素子収納用パッケージとすることができる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の一例を示す正面図である。
【図２】図１のＸ−Ｘ線における実施の形態の一例を示す断面図である。
【図３】従来の発光素子収納用パッケージの一例を示す断面図である。
【図４】従来の発光素子収納用パッケージの他の例を示す断面図である。
【符号の説明】
１：基体
１ａ：搭載部
２：枠体
２ａ：貫通孔
３：発光素子[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting element housing package for housing a light-emitting element, which is used in a display device using a light-emitting element such as a light-emitting diode.
[0002]
[Prior art]
Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter also referred to as a package) for housing a light emitting element such as a light emitting diode. As shown in a cross-sectional view in FIG. 4, the conventional ceramic package has a mounting portion 21a made of a conductor layer for mounting the light emitting element 23 at the center of the upper surface. A substantially rectangular parallelepiped or substantially rectangular flat plate-shaped ceramic base 21 having a pair of metallized wiring conductors 24a and 24b led to a through hole 22a for accommodating the light-emitting element 23 in the central portion thereof. It is mainly comprised from the substantially square frame-shaped ceramic frame 22 which has (for example, refer the following patent document 1).
[0003]
Then, the light emitting element 23 is fixed to the mounting portion 21a to which the one metallized wiring conductor 24a on the upper surface of the base 21 is connected through a conductive bonding material, and the electrode of the light emitting element 23 and the other metallized wiring conductor 24b Are electrically connected via bonding wires 25, and then a transparent resin (not shown) is filled in the through holes 22a of the frame body 22 to seal the light emitting element 23, thereby producing a light emitting device. Is done. By connecting this light-emitting device to the wiring conductor of the external electric circuit board via solder, the light-emitting device is mounted on the external electric circuit board, and the electrodes of the mounted light-emitting device are electrically connected to the external electric circuit and emit light. Electric power is supplied to the element 23.
[0004]
In such a ceramic package, light emitted from the light emitting element 23 accommodated in the package is reflected by the inner peripheral surface of the through hole 22a of the frame body 22, but the luminous efficiency of the light emitting device is improved. A metallized metal layer 26a having a plated metal layer 26b made of a metal such as nickel (Ni) or gold (Au) on the inner peripheral surface of the through hole 22a is deposited.
[0005]
The package is manufactured by a ceramic green sheet (hereinafter also referred to as green sheet) lamination method. Specifically, a green sheet for the base body 21 made of ceramics and a green sheet for the frame body 22 made of ceramics are prepared, and through holes for leading the metallized wiring conductors 24a and 24b to these green sheets, A through hole 22a for accommodating the light emitting element 23 is punched substantially vertically on the upper and lower surfaces of the green sheet. Next, a metal paste made of a refractory metal powder such as tungsten (W) or molybdenum (Mo) for the metallized wiring conductors 24a and 24b is applied from the upper surface to the lower surface of the green sheet for the substrate 21 by a conventionally known screen printing method or the like. A metal paste made of a refractory metal powder such as W or Mo for the metallized metal layer 26a is applied to the inner peripheral surface of the through hole 22a of the green sheet for the frame 22 by a screen printing method or the like. The green sheet for the substrate 21 and the green sheet for the frame 22 are joined one above the other, and these are fired at a high temperature to form a sintered body. Thereafter, a plating metal layer 26b made of a metal such as Ni or Au is deposited on the exposed surfaces of the mounting portion 21a, the metallized wiring conductors 24a and 24b and the metallized metal layer 26a by an electroless plating method or an electrolytic plating method. A package is produced.
[0006]
However, in this conventional package, the inner peripheral surface of the through hole 22a is substantially perpendicular to the upper surface of the base 21, so that the light reflected by the inner peripheral surface of the through hole 22a is uniformly and satisfactorily externally. There is a problem that the luminous efficiency of the light emitting device using this package is not so high as it is not emitted.
[0007]
Therefore, in order to solve such a problem, the present applicant, as shown in FIG. 3, on the upper surface of the substantially flat substrate 11 having a mounting portion 11a for mounting the light emitting element 13 on the upper surface, The package is formed by joining a frame body 12 having a through hole 12a for accommodating the light emitting element 13, and the inner peripheral surface of the through hole 12a is outward at an angle of 55 to 70 degrees with respect to the upper surface of the substrate 11. The plated metal layer 16b having an arithmetic mean roughness Ra of 1 to 3 μm and a light reflectance of the light emitting element 13 of 80% or more is applied to the surface of the through hole 12a. Proposed is a package that can reflect light emitted from the light emitting element 13 to be reflected well by the plated metal layer 16b on the inner peripheral surface of the inclined through-hole 12a and radiate uniformly and efficiently toward the outside (the following patent documents) 1).
[0008]
This package is manufactured as follows. A through hole 12a for accommodating the light emitting element 13 is drilled in the green sheet for the frame 12 so that the inner peripheral surface thereof is an inclined surface of 55 to 70 degrees. Next, a metal paste is applied to the inner peripheral surface of the through-hole 12a, and the inner peripheral surface of the through-hole 12a of the green sheet for the frame 12 is joined to the green sheet for the frame 12 and the green sheet for the substrate 11. Bonded in a direction that spreads outward, and these are fired to laminate and integrate the frame 12 having the through holes 12a on the base 11, and the metallized metal layer 16a is deposited on the inner peripheral surface of the through holes 12a. Get a tie. Next, a plated metal layer 16b having an arithmetic average roughness Ra of 1 to 3 μm and a reflectance of 80% or more with respect to light emitted from the light emitting element 13 is deposited on the surface of the metallized metal layer 16a.
[0009]
For the metallized wiring conductors 14a and 14b, for example, a metal paste obtained by adding and mixing an appropriate organic solvent and solvent to a refractory metal powder such as W is printed in a predetermined pattern on a green sheet as a base 11 in advance by a screen printing method. By applying it, it is deposited on a predetermined position of the substrate 11. It is possible to effectively prevent the metallized wiring conductors 14a and 14b from being oxidized and corroded if a metal having excellent corrosion resistance such as Ni or Au is deposited on the exposed surfaces of the metallized wiring conductors 14a and 14b to a thickness of about 1 to 20 μm. Further, the bonding between the metallized wiring conductor 14a and the light emitting element 13, the bonding between the metallized wiring conductor 14b and the bonding wire 15, and the bonding between the metallized wiring conductors 14a and 14b and the wiring conductor of the external electric circuit board can be strengthened. Accordingly, the exposed surfaces of the metallized wiring conductors 14a and 14b are successively deposited with a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm by an electrolytic plating method or an electroless plating method. ing.
[0010]
[Patent Document 1]
Japanese Patent Laid-Open No. 14-232017 [0011]
[Problems to be solved by the invention]
However, in the package of Patent Document 1, since the angle of the inner peripheral surface of the through hole 12a with respect to the base body 11 is formed at a constant angle, the light emitted from the light emitting element 13 is transmitted through the inner peripheral surface of the through hole 12a. In order to reflect efficiently by the plated metal layer 16b deposited on the light-emitting element, it is necessary to mount the light emitting element 13 at the center of the opening of the through hole 12a of the frame 12 in a plan view. In order to form the mounting portion 11a at the center of the opening of the through hole 12a and to form the metallized wiring conductor 14b around the mounting portion 11a in plan view, the mounting portion 11a and the metallized wiring conductor 14b on the base 11 are formed. It is necessary to form the region in a wide region, and it is also necessary to widen the lower surface side opening of the through hole 12a. For this reason, there is a problem that the package tends to be large.
[0012]
Further, when the light emitting element 13 is mounted at a position other than the center of the opening of the through hole 12a of the frame body 12, the reflection angle with respect to the light emitting element 13 varies greatly depending on the location of the inner peripheral surface of the through hole 12a. However, it is difficult to efficiently reflect the light emitted by the inner peripheral surface of the through-hole 12a, and the light cannot be emitted uniformly to the outside.
[0013]
Therefore, the present invention has been completed in view of the above-described conventional problems, and the object thereof is not to widen the mounting portion on the substrate and the metallized wiring conductor, and the lower surface side opening of the through hole is also provided. It is not necessary to make it wide, and the light of the light emitting element can be efficiently and converged to radiate to the outside, and as a result, the light emitting device can be made highly compact and highly reliable for storing the light emitting element. To provide a package.
[0014]
[Means for Solving the Problems]
In the light emitting element storage package of the present invention, a frame having a through hole for accommodating the light emitting element is laminated on the upper surface of a substantially flat substrate having a mounting portion for mounting the light emitting element on the upper surface. The light emitting element storage package, wherein the through hole has an opening on the upper surface side of the frame body larger than an opening on the lower surface side, and the mounting portion has a center of the opening on the upper surface side with respect to a center of the opening on the lower surface side. It is characterized by being shifted to the opposite side.
[0015]
According to the light emitting element storage package of the present invention, the through hole has the opening on the upper surface side of the frame body larger than the opening on the lower surface side, and the center of the upper surface side opening is opposite to the mounting portion with respect to the center of the lower surface side opening. As a result, it is not necessary to mount the light emitting element at the center of the opening of the through hole, and as a result, it is not necessary to form the mounting portion and the metallized wiring conductor over a wide area on the base. The opening on the lower surface side of the hole does not need to be formed over a wide area, and the light of the light emitting element is efficiently reflected by the plated metal layer deposited on the inner peripheral surface or inner peripheral surface of the through hole and radiated to the outside. The light-emitting element storage package can be reduced in size.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a front view showing an example of an embodiment of a package of the present invention, FIG. 2 is a sectional view taken along line XX in FIG. 1, 1 is a base body, and 2 is a frame body These mainly constitute a package for housing the light emitting element 3.
[0017]
In the package of the present invention, a frame body 2 having a through hole 2a for accommodating the light emitting element 3 is laminated on the upper surface of a substantially flat substrate 1 having a mounting portion 1a for mounting the light emitting element 3 on the upper surface. In the through hole 2a, the opening on the upper surface side of the frame 2 is larger than the opening on the lower surface side, and the center of the upper surface side opening is shifted to the opposite side of the mounting portion 1a with respect to the center of the lower surface side opening. Is formed.
[0018]
The substrate 1 of the present invention is made of ceramics, resin, or the like. When the substrate 1 is made of ceramics, the base 1 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, or a substantially rectangular plate. It is a support that supports the light emitting element 3 and has a mounting portion 1a on which the light emitting element 3 is mounted. When the substrate 1 is made of, for example, an aluminum oxide sintered body, a suitable organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a mud. A green sheet (ceramic raw sheet) is obtained by forming into a sheet shape by a well-known doctor blade method or calendar roll method, etc. After that, the green sheet is subjected to appropriate punching processing, and a plurality of these are laminated to obtain a high temperature (about It is manufactured by firing at 1600 ° C.
[0019]
The base body 1 is formed with a metallized wiring conductor 4a led out from the mounting portion 1a to the lower surface and a metallized wiring conductor 4b led out from the periphery of the mounting portion 1a to the lower surface. The metallized wiring conductors 4a and 4b are made of a metal powder metallized material such as tungsten or molybdenum, and function as a conductive path for electrically connecting the light emitting element 3 accommodated therein to the outside. A light emitting element 3 such as a light emitting diode or a semiconductor laser is fixed to the mounting portion 1a by a conductive bonding material such as gold-silicon alloy or silver-epoxy resin, and light is emitted to the mounting portion 1a of the metallized wiring conductor 4b. The electrodes of the element 3 are electrically connected via the bonding wires 5. Further, the light emitting element 3 may be flip-chip mounted on the mounting portion 1a and the metallized wiring conductor 4b.
[0020]
If a metal having excellent corrosion resistance such as nickel or gold is deposited on the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a and 4b to a thickness of about 1 to 20 μm, the mounting portion 1a and the metallized wiring conductor 4a. 4b can be effectively prevented from being oxidized and corroded, and the mounting portion 1a and the light emitting element 3 can be firmly fixed and the metallized wiring conductor 4b and the bonding wire 5 can be firmly bonded. Therefore, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surfaces of the mounting portion 1a and the metallized wiring conductors 4a and 4b by an electrolytic plating method or an electroless plating method. Has been.
[0021]
The frame body 2 is made of ceramics having substantially the same composition as that of the base body 1, and is laminated on the upper surface of the base body 1 so as to be sintered and integrated. The frame body 2 has a through hole 2a for accommodating the light emitting element 3 in the center thereof, and the light emitting element 3 mounted on the mounting portion 1a is accommodated in the through hole 2a.
[0022]
In the present invention, the through-hole 2a of the frame body 2 is such that the upper surface side opening of the frame body 2 is larger than the lower surface side opening, and the center of the upper surface side opening is opposite to the mounting portion 1a with respect to the center of the lower surface side opening. It is formed in a slanted manner. As a result, the angle θ1 in the vicinity of the mounting portion 1a on the inner peripheral surface of the through hole 2a is larger than the angle θ2 on the opposite side, so that the light emitted from the light emitting element 3 can be efficiently transmitted on the inner peripheral surface of the through hole 2a. It can be reflected and radiated to the outside. Further, since it is not necessary to form the light emitting element 3 and the mounting portion 1a at the center of the opening of the through hole 2a of the frame body 2, it is possible to reduce the formation region of the mounting portion 1a and the metallized wiring conductor 4b on the base body 1. In addition, since the opening on the lower surface side of the through hole 2a can be reduced, the package can be reduced in size.
[0023]
Further, the angle (θ1, θ2) with respect to the upper surface of the substrate 1 is preferably 35 to 70 ° with respect to the inner peripheral surface of the through hole 2a of the frame body 2, and if it exceeds 70 °, the light emitting element accommodated in the through hole 2a 3 tends to be difficult to reflect well to the outside, and if it is less than 35 °, the package tends to be large. In the present invention, θ1> θ2, but (θ1− θ2) is preferably 25 ° or less. If (θ1-θ2) exceeds 25 °, it is difficult to stably form the through hole 2a having such a difference in angle.
[0024]
The frame body 2 of the present invention is formed by punching through holes in a green sheet for the frame body 2 using a die. At this time, the size of the opening of the through hole 2a formed in the green sheet for the frame 2 is different between the upper surface side and the lower surface side of the green sheet, and the center of the opening is shifted between the upper surface side and the lower surface side. To be formed. Then, the green sheet for the frame 2 is spread on the green sheet for the base body 1 from the one main surface to the other main surface, and the center of the upper surface side opening of the through hole 2a is the lower surface side. The layers are sequentially laminated so as to be opposite to the mounting portion 1a formed on the ceramic green sheet for the substrate 1 with respect to the center of the opening. Thereby, the upper surface side opening of the through-hole 2a of the frame body 2 is formed larger than the lower side opening, and the center of the upper surface side opening is shifted from the center of the lower surface side opening to the opposite side to the mounting portion 1a.
[0025]
Further, the shape of the opening of the through hole 2a may be various shapes such as a substantially circular shape, a substantially square shape, a substantially oval shape, a substantially polygonal shape, etc. From the viewpoint, it is preferable that the upper surface side opening and the lower surface side opening have substantially the same shape. Further, it is more preferable to use a substantially circular shape as the shape of the opening. In this case, the light emitted from the light emitting element 3 accommodated in the through hole 2a is efficiently reflected by the inner peripheral surface of the substantially circular through hole 2a and then exposed to the outside. Can radiate.
[0026]
Further, it is preferable that a metallized metal layer 6a and a plated metal layer 6b are formed on substantially the entire inner peripheral surface of the through hole 2a of the frame 2, for example, a metallized metal layer of metal powder such as W or Mo. A plated metal layer 6b of Ni, Au, Ag or the like is deposited on 6a. The plated metal layer 6b preferably has a reflectance of 80% or more with respect to light emitted from the light emitting element 3, but the light emitting element 3 emits light when the plated metal layer 6b is made of Ni, Au, Ag, or the like. The reflectance with respect to light can be 80% or more. When the reflectance is less than 80%, it becomes difficult to favorably reflect the light emitted by the light emitting element 3 accommodated in the through hole 2a of the frame body 2.
[0027]
It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
[0028]
【The invention's effect】
In the light emitting element storage package of the present invention, the through hole has an opening on the upper surface side of the frame body larger than the opening on the lower surface side, and the center of the upper surface side opening is shifted from the center of the lower surface side opening to the side opposite to the mounting portion. Therefore, it is not necessary to mount the light emitting element at the center of the opening of the through hole, and as a result, it is not necessary to form the mounting portion and the metallized wiring conductor over a wide area on the base. It is not necessary to form the lower surface side opening over a wide area, and the light of the light emitting element can be efficiently reflected and radiated to the outside by the plated metal layer deposited on the inner peripheral surface of the through hole or the inner peripheral surface. It can be set as the miniaturized light emitting element storage package.
[Brief description of the drawings]
FIG. 1 is a front view showing an example of an embodiment of a light emitting element storage package according to the present invention.
FIG. 2 is a cross-sectional view showing an example of an embodiment taken along line XX in FIG.
FIG. 3 is a cross-sectional view illustrating an example of a conventional light emitting element storage package.
FIG. 4 is a cross-sectional view showing another example of a conventional light emitting element storage package.
[Explanation of symbols]
1: Base 1a: Mounting portion 2: Frame 2a: Through hole 3: Light emitting element

Claims (1)

上面に発光素子を搭載するための搭載部を有する略平板状の基体の上面に、前記発光素子を収容するための貫通孔を有する枠体を積層してなる発光素子収納用パッケージであって、前記貫通孔は、前記枠体の上面側開口が下面側開口よりも大きく、かつ前記上面側開口の中心を前記下面側開口の中心に対して前記搭載部と反対側にずらせて形成されていることを特徴とする発光素子収納用パッケージ。A light emitting element storage package in which a frame having a through hole for accommodating the light emitting element is laminated on the upper surface of a substantially flat substrate having a mounting portion for mounting the light emitting element on the upper surface; The through hole is formed such that the upper surface side opening of the frame body is larger than the lower surface side opening, and the center of the upper surface side opening is shifted from the center of the lower surface side opening to the side opposite to the mounting portion. A package for housing a light-emitting element.
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