JP4072084B2 - Light emitting element storage package and light emitting device - Google Patents

Light emitting element storage package and light emitting device Download PDF

Info

Publication number
JP4072084B2
JP4072084B2 JP2003080127A JP2003080127A JP4072084B2 JP 4072084 B2 JP4072084 B2 JP 4072084B2 JP 2003080127 A JP2003080127 A JP 2003080127A JP 2003080127 A JP2003080127 A JP 2003080127A JP 4072084 B2 JP4072084 B2 JP 4072084B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
recess
light
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003080127A
Other languages
Japanese (ja)
Other versions
JP2004288937A (en
Inventor
敏幸 千歳
陽介 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2003080127A priority Critical patent/JP4072084B2/en
Publication of JP2004288937A publication Critical patent/JP2004288937A/en
Application granted granted Critical
Publication of JP4072084B2 publication Critical patent/JP4072084B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた液晶表示装置等のバックライト等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、単にパッケージともいう）として、セラミック製のパッケージが用いられており、その一例を図13に示す（例えば、下記の特許文献１参照）。同図に示すように、従来のパッケージは、複数のセラミック層が積層されて成るとともに上面に凹部14が形成されている直方体状の絶縁基体の凹部14の底面に発光素子13を搭載するための導体層から成る搭載部12が設けられた基体11と、基体11の搭載部12およびその周辺から基体11の下面に形成された一対の配線層15とから主に構成されている。
【０００３】
そして、一方の配線層15の一端が電気的に接続された搭載部12上に発光素子13を導電性接着剤、半田等を介して載置固定するとともに、発光素子13の電極と他方の配線導体15とをボンディングワイヤ16を介して電気的に接続し、しかる後、基体11の凹部14内に図示しない透明樹脂を充填して発光素子13を封止することによって、発光装置が作製される。
【０００４】
また、凹部14の内周面で発光素子13の光を反射させてパッケージの上方に光を放射させるために、凹部14の内周面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき層を表面に有するメタライズ層からなる金属層17を被着させていることもある。
【０００５】
また、上記のパッケージはセラミックグリーンシート積層法により以下のようにして製作される。まず、基体11の搭載部12（搭載部12から下側）を形成するためのセラミックグリーンシート（以下、グリーンシートともいう）と、基体11の凹部14を形成するためのグリーンシートとを準備し、これらのグリーンシートに配線導体15を導出させるための貫通孔や凹部14となる貫通穴を打ち抜き法で形成する。
【０００６】
次に、搭載部12を形成するためのグリーンシートの積層体Ａの貫通孔および所定の部位に、メタライズ層から成る配線層15形成用の導体ペーストをスクリーン印刷法等で印刷塗布し、また凹部14の内周面にメタライズ層を被着する場合、凹部14を形成するためのグリーンシートの積層体Ｂの貫通穴内面に金属層17形成用の導体ペーストをスクリーン印刷法等で印刷塗布する。
【０００７】
次に、積層体Ａ，Ｂを重ねて接着して基体11を形成するための積層体とし、これを所定寸法に切断して成形体となし、高温（1600℃程度）で焼成して焼結体となす。その後、配線層15および金属層17の露出表面にニッケル，金，パラジウム，白金等の金属から成るめっき金属層を無電解めっき法や電解めっき法により被着させることによって、パッケージが製作される。
【０００８】
【特許文献１】
特開2002−232017号公報
【０００９】
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージにおいては、スクリーン印刷法で凹部14の内周面に導体ペーストを印刷塗布して、金属層17を形成することから、導体ペーストの粘度等の影響により、凹部14の内周面に形成された金属層17の厚みや表面粗さがばらつきやすく、発光素子13が発光する光を効率よく反射し、外部に均一に放射しにくくなるという問題点を有していた。
【００１０】
また、凹部14の内周面の傾斜角度が一定とされているため、液晶表示装置等のバックライトのように光を拡散させて広領域の外部に均一かつ効率良く放射させる場合には、光が一定方向に収束してしまい、光を広領域の外部に均一かつ効率良く拡散できないという問題点を有していた。
【００１１】
また、凹部14の内周面の傾斜角度を大きくして広領域の外部に放射しようとすると、パッケージが大型化してしまうという問題点を有していた。
【００１２】
従って、本発明は上記従来の技術の問題点に鑑み完成されたものであり、その目的は、凹部内に収容された発光素子が発光する光を効率よく反射させて広領域の外部に均一かつ効率よく放出することができる小型の発光素子収納用パッケージおよび発光装置を提供することにある。
【００１３】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、絶縁基体の上面に発光素子を収容するための凹部が設けられているとともに、該凹部の底面に前記発光素子が搭載される搭載部および前記発光素子の電極が電気的に接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部は、内周面が前記凹部の底面から前記絶縁基体の上面に向けて外側に広がるように傾斜している金属製の枠体が嵌着されており、該枠体は、前記内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部が設けられていることを特徴とする。
【００１４】
本発明の発光素子収納用パッケージは、凹部は、内周面が凹部の底面から絶縁基体の上面に向けて外側に広がるように傾斜している金属製の枠体が嵌着されており、枠体は、内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部が設けられていることから、凹部の内周面の表面状態に影響を受けることなく発光素子が発光する光を金属製の枠体の内周面で効率よく反射させて、広領域の外部に均一かつ効率よく拡散して放射させることができる。
【００１５】
本発明の発光素子収納用パッケージは、好ましくは、前記枠体は、アルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることを特徴とする。
【００１６】
本発明の発光素子収納用パッケージは、好ましくは枠体はアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子の光をさらに枠体でより良好に反射することができるので、広領域の外部により均一かつ効率よく拡散して放射させることができる。
【００１７】
また本発明の発光素子収納用パッケージは、好ましくは、前記枠体は、表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることを特徴とする。
【００１８】
本発明の発光素子収納用パッケージは、好ましくは枠体は表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることから、発光素子の光を枠体に被着されている金属層でより良好に反射することができるので、広領域の外部により均一かつ効率よく拡散して放射させ得る。
【００１９】
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記配線層に電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする。
【００２０】
本発明の発光装置は、上記の構成により、発光素子の光を良好に反射し、広領域の外部に均一かつ効率良く放射することができる、発光効率の高い高性能のものとなり、液晶表示装置等のバックライト等に好適なものとなる。
【００２１】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は本発明のパッケージの実施の形態の一例を示す断面図であり、図２は図１のパッケージの平面図である。これらの図において、１は絶縁基体、２は発光素子３の搭載部、３は発光素子、４は発光素子３を収容するための凹部である。
【００２２】
本発明のパッケージは、絶縁基体１の上面に発光素子３を収容するための凹部４が設けられているとともに、凹部４の底面に発光素子３が搭載される搭載部２および発光素子３の電極が電気的に接続される配線層５ａ，５ｂが形成されているものであって、凹部４は、内周面が凹部４の底面から絶縁基体１の上面に向けて外側に広がるように傾斜している金属製の枠体８が嵌着されており、枠体８は、内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部８ａが設けられている。
【００２３】
本発明における絶縁基体１は、セラミックスや樹脂から成り、セラミックスからなる場合、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成る絶縁層を複数層積層してなる直方体状の箱状であり、上面の中央部に発光素子３を収容するための凹部４が形成されている。絶縁基体１が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシート（セラミック生シート）を得、しかる後、グリーンシートに凹部４用の貫通孔を打ち抜き加工で形成するとともに、発光素子３を搭載するためのグリーンシートと凹部４用のグリーンシートとを複数枚積層し、高温（約1600℃）で焼成し一体化することで形成される。
【００２４】
また、凹部４の底面には発光素子３を搭載するための搭載部２が形成されており、搭載部２はタングステン（Ｗ），モリブデン（Ｍｏ），銅（Ｃｕ），銀（Ａｇ）等の金属粉末のメタライズ層から成っている。
【００２５】
また、絶縁基体１は、搭載部２およびその周辺から絶縁基体１の下面に形成された配線層５ａ，５ｂが被着形成されている。配線層５ａ，５ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容された発光素子３を外部に電気的に接続するための導電路である。そして、搭載部２には発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、配線層５ｂには発光素子３の電極がボンディングワイヤ６を介して電気的に接続されている。そして、絶縁基体１下面の配線層５ａ，５ｂが外部電気回路基板の配線導体に接続されることで発光素子３の各電極と電気的に接続され、発光素子３へ電力や駆動信号が供給される。また、発光素子３は搭載部２および配線層５ｂにフリップチップ実装により接続されても構わない。
【００２６】
配線層５ａ，５ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、絶縁基体１の所定位置に被着形成される。
【００２７】
なお、配線層５ａ，５ｂおよび搭載部２の露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜20μｍ程度の厚みで被着させておくのがよく、配線層５ａ，５ｂおよび搭載部２が酸化腐蝕するのを有効に防止できるとともに、搭載部２と発光素子３との固着および配線層５ｂとボンディングワイヤ６との接合、配線層５ａ，５ｂと外部電気回路基板の配線導体との接合を強固にすることができる。従って、配線層５ａ，５ｂおよび搭載部２の露出表面には、厚さ１〜10μｍ程度のＮｉめっき層と厚さ0.1〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２８】
そして、本発明において、凹部４は、内周面が凹部４の底面から絶縁基体１の上面に向けて外側に広がるように傾斜している金属製の枠体８が嵌着されており、枠体８は、内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部８ａが設けられている。これにより、凹部４の内周面の表面状態に影響を受けることなく発光素子３が発光する光を金属製の枠体８の内周面で効率よく反射させて、広領域の外部に均一かつ効率よく拡散して放射させることができる。
【００２９】
この枠体８は、樹脂接着剤により凹部４の内周面に嵌着されていても良いし、凹部４の内周面に接合用のメタライズ層を形成し、Ａｇろう等によりろう付けして接合されていても良い。また、凹部４内に発光素子３を収容し、ボンディングワイヤ６等を介して電気的接続を行なった後に、凹部４内に封入する透明樹脂によって、発光素子３とともに枠体８内周面を覆って封止し、枠体８が凹部４に嵌着された状態としても良い。
【００３０】
また、枠体８の貫通穴の内周面の表面の算術平均粗さＲａは３μｍ以下が好ましい。３μｍを超えると、凹部４内に収容された発光素子３の光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００３１】
また、枠体８が嵌着される凹部４は、横断面形状が円形状、長円形状、楕円形状、四角形状等であっても良い。また、図３のパッケージの断面図に示すように、
凹部４の内周面および枠体８の外周面を、凹部４の底面から絶縁基体１の上面に向けて外側に広がるように５〜15°程度（θ３：75〜85°程度）の若干の角度を有するように傾斜させるのが良く、この場合、凹部４の内周面や上端部に若干の変形や反り等の形状の異常が発生したとしても、この変形や反り等に影響をあまり受けることなく、枠体８を容易に凹部４内に挿入することができる。
【００３２】
さらに、図４のパッケージの断面図に示すように、枠体８の上端部に絶縁基体１の上面に延出するように外側に折り曲げられた延出部が形成されていてもよく、この場合枠体８の凹部４への上下方向での嵌め込み位置を正確に位置決めることができる。また、枠体８の下面と凹部４の底面との間に隙間が形成されるようにすることができ、枠体８と搭載部２および配線層５ａ，５ｂとが接触して短絡等が発生するのを防ぐことができる。また、その隙間の部位の凹部４の底面に搭載部２や配線層５ａ，５ｂを形成することでそれらの形成領域を広くすることができる。さらに、その隙間に発光素子３を覆う透明樹脂が入り込むようにして凹部４内に透明樹脂を強固に接着することができる。
【００３３】
また、図５のパッケージの断面図に示すように、枠体８の内周面で発光素子３の発光部よりも低い部位を絶縁基体１の上面に直交するように形成してもよく、この場合凹部４の底面の面積が増大するとともに枠体８と搭載部２および配線層５ｂとが接触して短絡等が発生するのを防ぐことができる。
【００３４】
また、凹部４の内周面の下端に、搭載部２や配線層５ｂの厚みよりも厚く、かつ発光素子３側に突出した段差を形成し、その段差の底面に枠体８を載置するようにしてもよい。この場合、枠体８の下面が凹部４の底面に形成された搭載部２および配線層５ｂよりも高い位置にあるので、枠体８と搭載部２および配線層５ｂとが接触して短絡するのを防止できるとともに、枠体８の下面にも凹部４の突出した段差の底面が接合するので強固に枠体８を嵌着できる。さらに、図６のパッケージの断面図に示すように、凹部４の内周面の下端の段差の幅を枠体８の下面の幅よりも小さくするとよく、枠体８の下面と凹部４の底面との間の隙間に発光素子３を覆う透明樹脂が入り込むようにして凹部４内に透明樹脂を強固に接着することができる。
【００３５】
本発明のパッケージにおいては、枠体８の貫通穴の横断面形状は円形状、楕円形状、長円形状、四角形状、多角形状等の種々の形状とし得るが、円形状がよく、この場合、凹部４内に収容された発光素子３の光を枠体８の内周面で満遍なく反射させて広領域の外部に均一かつ効率よく放射することができる。
【００３６】
また、図２においては、横断面形状が円形状の凹部４の内周面に貫通穴の横断面形状が円形状の枠体８が嵌着されているが、凹部４の横断面形状と枠体８の貫通穴の横断面形状とは異なっていても良い。図７のパッケージの平面図に示すように、横断面形状が四角形状の凹部４に貫通穴の横断面形状が円形状の枠体８を嵌着しても良いし、図８のパッケージの平面図に示すように、横断面形状が四角形状の凹部４に貫通穴の横断面形状が四角形状の枠体８を嵌着しても良い。
【００３７】
また、枠体８に変化部８ａが１つ形成されている場合は、枠体８の変化部８ａよりも上側の凹部４の底面に対する傾斜角度は35〜70°、枠体の変化部８ａよりも下側の凹部４の底面に対する傾斜角度は40〜90°が好ましい。
【００３８】
枠体８の変化部８ａよりも上側の傾斜角度が70°を超えると、凹部４内に収容された発光素子３の光を広領域の外部に均一かつ効率よく拡散して放射させることが困難となる傾向にあり、傾斜角度が35°未満であると、枠体８が大型化し、パッケージが大型化してしまう。
【００３９】
また、枠体の変化部８ａよりも下側の傾斜角度が40°未満であると、枠体８が大型化してしまい、パッケージが大型化してしまう。90°を超えると、枠体８の変化部８ａが凹部４の内側に突出することとなり、変化部８ａが発光素子３よりも上側にある場合、発光素子３の光を遮断し、発光素子３が発光素子３の光を広領域の外部に均一かつ効率よく拡散して放射させることが困難となる傾向になる。
【００４０】
また、発光素子３の光を凹部４の内周面で反射して広領域の外部に光を効率良く放射するために、変化部８ａは、搭載部２に搭載された発光素子３の上面よりも下側にあることが好ましい。また、変化部８ａが上下方向で複数ある場合、凹部４の底面に対する傾斜角度が70°以下となる部位が発光素子３の上面よりも下側の位置から形成されていることが好ましい。
【００４１】
また、枠体８は複数の枠状部材を積み重ねて形成されており、枠状部材同士の境界が変化部８ａとなっていてもよい。例えば、枠体８に変化部８ａが一つ形成されている場合、図９のパッケージの断面図に示すように、内周面の傾斜角度が異なる２つの枠状部材８ｂ，８ｃを接合させて形成されていてもよい。また、図10のパッケージの断面図に示すように、上側の枠状部材８ｃの下面の幅を下側の枠状部材８ｂの上面の幅よりも小さくし、枠状部材８ｂ，８ｃに接合ずれが発生しても、上側の枠状部材８ｃが下側の枠状部材８ｂよりも発光素子３側に突出するのを防止するようにしてもよい。これにより、発光素子３の光が突出した枠状部材８ｃの下面で遮断、反射されるのを防止できるので、広領域の外部に均一かつ効率良く拡散して放射することができる。
【００４２】
また、枠体８は、好ましくはアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子３の光を枠体８でより良好に反射することができるので、広領域の外部により均一かつ効率良く拡散させて放射することができる。特に、枠体８はアルミニウムから成るのがよく、この場合、枠体８が酸化腐食されにくいとともに、発光素子３の光の波長の変動による光の反射率の変動も小さくなるので、広い用途に使用できる。
【００４３】
また、枠体８として、アルミニウム（熱膨張係数約23.5×10−６／℃程度），銀（熱膨張係数約19.1×10−６／℃程度），金（熱膨張係数約14.1×10−６／℃程度），パラジウム（熱膨張係数約11.8×10−６／℃程度）または白金（熱膨張係数約8.8×10−６／℃程度）を用いる場合、絶縁基体１と枠体８との間に、熱膨張係数が絶縁基体１と枠体８との間にある金属板を介装させても良い。例えば、絶縁基体１としてアルミナセラミックス（熱膨張係数７×10−６〜８×10−６／℃程度）等から成るものを用いる場合、絶縁基体１と枠体８との熱膨張係数差により発生する熱応力を緩和するために、絶縁基体１と枠体８との間にＦｅ−Ｎｉ−Ｃｏ合金（熱膨張係数６×10−６〜10×10−６／℃程度）、Ｃｕ−Ｗ合金（熱膨張係数６×10−６〜11×10−６／℃程度）等の、より枠体８に熱膨張係数の近い金属板を用いるのがよい。これにより、絶縁基体１と枠体８との熱膨張係数差により発生する熱応力を緩和して、枠体８の剥がれ等を有効に防止することもできる。
【００４４】
なお、枠体８は、アルミニウム，銀，金，パラジウムまたは白金のいずれかを主成分とする合金であっても良い。
【００４５】
また、本発明における枠体８は、表面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることが好ましく、発光素子３の光を枠体８に被着された金属層で良好に反射して、広領域の外部により均一かつ効率良く拡散させて放射することができる。このような枠体８は、図11に示すように、枠体８の内周面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層８ａを被着したものである。特に、金属層８ａはアルミニウムから成るのがよく、酸化腐食やマイグレーション等の不具合が発生しにくいとともに、発光素子３の光の波長の変動による光の反射率の変動も小さくなるので、広い用途に使用できる。
【００４６】
また、枠体８として絶縁基体１に熱膨張係数の近い材質のものを使用するとよい。例えば、絶縁基体１としてアルミナセラミックス（熱膨張係数７×10−６〜８×10−６／℃程度）等から成るものを用い、枠体８として絶縁基体１に熱膨張係数の近いＦｅ−Ｎｉ−Ｃｏ合金（熱膨張係数６×10−６〜10×10−６／℃程度）等を使用すると、枠体８の剥がれ等を有効に防止することもできる。このような枠体８に金属層８ａを被着すると、枠体８を絶縁基体１に強固に嵌着することができるとともに、発光素子３の光に対する反射率を高いものとすることができる。
【００４７】
また、金属層８ａは、枠体８の発光素子３側の表面（内周面）にのみ被着していても良いし、枠体８の全面に被着していてもよい。
【００４８】
なお、金属層８ａはアルミニウム，銀，金，パラジウムまたは白金のいずれかを主成分とする合金層であっても良い。
【００４９】
また、発光素子３の発光部より下側に変位部８ａを形成し、その変位部８ａよりも上側と下側の表面粗さを異なるようにしても良い。例えば、変位部８ａよりも下側の枠体８または金属層８ｄの表面粗さを粗くして、凹部４に封入される透明樹脂が強固に取着されるようにすることができる。また、発光素子３の発光部よりも下側の方向に照射された発光素子３の光が、枠体８または金属層８ｄで反射される際に、散乱により、凹部４の底面方向に向かう反射光の量を小さくし、凹部４の底面の搭載部２や配線層５ａ，５ｂが形成されていない、絶縁基体１が露出している部位から漏洩する光の量を小さくすることができる。さらに、散乱した反射光の一部は上方にも向けられるため、パッケージの上方に放射される光の量を大きくすることもできる。
【００５０】
また、発光素子３の発光部より下側に変位部８ａを形成し、その変位部８ａの上側と下側とで反射率が異なるようにしても良い。この場合、発光部よりも下側の枠体８または金属層８ｄでは、発光素子３の光は凹部４の底面方向に反射され易いので、変位部８ａの下側で枠体８の内周面または金属層８ｄの反射率を低くして、凹部４の底面方向に向かう反射光の量を小さくし、凹部４の底面の搭載部２や配線層５ａ，５ｂが形成されていない、絶縁基体１が露出している部位から漏洩する光の量を小さくすることができる。
【００５１】
本発明の発光装置は、本発明のパッケージと、搭載部２に搭載されるとともに配線層５ｂに電気的に接続された発光素子３と、発光素子３を覆うシリコーン樹脂等の透明樹脂とを具備している。これにより、発光素子３の光を良好に反射し、広領域の外部に均一かつ効率良く放射することができる、発光効率の高い高性能のものとなり、液晶表示装置等のバックライト等に好適なものとなる。発光素子３を覆う透明樹脂は、発光素子３およびその周囲のみを覆っていてもよいし、凹部４内に充填されて発光素子３を覆っていてもよい。
【００５２】
なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。例えば、図12に示すように、搭載部２を導体層として形成せずに、発光素子３を絶縁基体１の凹部４の底面上に直接搭載し、その周囲に発光素子３と電気的に接続される配線層５ａ，５ｂを形成し、凹部４に枠体８を嵌着している構成であってもよい。この場合、配線層５ａ，５ｂともにボンディングワイヤ等で発光素子３に電気的に接続される。
【００５３】
【発明の効果】
本発明の発光素子収納用パッケージは、凹部は、内周面が凹部の底面から絶縁基体の上面に向けて外側に広がるように傾斜している金属製の枠体が嵌着されており、枠体は、内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部が設けられていることから、凹部の内周面の表面状態に影響を受けることなく発光素子が発光する光を金属製の枠体の内周面で効率よく反射させて、広領域の外部に均一かつ効率よく拡散して放射させることができる。
【００５４】
本発明の発光素子収納用パッケージは、好ましくは枠体はアルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることから、発光素子の光をさらに枠体でより良好に反射することができるので、広領域の外部により均一かつ効率よく拡散して放射させることができる。
【００５５】
また本発明の発光素子収納用パッケージは、好ましくは枠体は内周面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることから、発光素子の光を枠体に被着されている金属層でより良好に反射することができるので、広領域の外部により均一かつ効率よく拡散して放射させ得る。
【００５６】
本発明の発光装置は、本発明の発光素子収納用パッケージと、搭載部に搭載されるとともに配線層に電気的に接続された発光素子と、発光素子を覆う透明樹脂とを具備していることにより、発光素子の光を良好に反射し、広領域の外部に均一かつ効率良く放射することができる、発光効率の高い高性能のものとなり、液晶表示装置等のバックライト等に好適なものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージの実施の形態の一例を示す断面図である。
【図２】図１の発光素子収納用パッケージの平面図である。
【図３】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図４】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図５】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図６】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図７】本発明の発光素子収納用パッケージの実施の形態の他の例を示す平面図である。
【図８】本発明の発光素子収納用パッケージの実施の形態の他の例を示す平面図である。
【図９】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図１０】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図１１】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図１２】本発明の発光素子収納用パッケージの実施の形態の他の例を示す断面図である。
【図１３】従来の発光素子収納用パッケージの断面図である。
【符号の説明】
１：絶縁基体
２：搭載部
３：発光素子
４：凹部
５ａ，５ｂ：配線層
８：枠体[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light-emitting element storage package and a light-emitting device for storing light-emitting elements, which are used in backlights and the like of liquid crystal display devices using light-emitting elements such as light-emitting diodes.
[0002]
[Prior art]
Conventionally, a ceramic package has been used as a light emitting element storage package (hereinafter also simply referred to as a package) for storing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Patent Document 1). As shown in the figure, the conventional package is for mounting the light emitting element 13 on the bottom surface of the concave portion 14 of the rectangular parallelepiped insulating base formed by laminating a plurality of ceramic layers and forming the concave portion 14 on the upper surface. The substrate 11 is mainly composed of a base 11 provided with a mounting portion 12 made of a conductor layer, and a pair of wiring layers 15 formed on the lower surface of the base 11 from the mounting portion 12 of the base 11 and its periphery.
[0003]
Then, the light emitting element 13 is placed and fixed on the mounting portion 12 to which one end of one wiring layer 15 is electrically connected via a conductive adhesive, solder, etc., and the electrode of the light emitting element 13 and the other wiring The conductor 15 is electrically connected via the bonding wire 16, and then the light emitting device 13 is sealed by filling the recess 14 of the base 11 with a transparent resin (not shown) and sealing the light emitting element 13. .
[0004]
Further, in order to reflect the light of the light emitting element 13 on the inner peripheral surface of the recess 14 and to emit light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the recess 14. A metal layer 17 made of a metallized layer on the surface may be deposited.
[0005]
The above package is manufactured by the ceramic green sheet lamination method as follows. First, a ceramic green sheet (hereinafter also referred to as a green sheet) for forming the mounting portion 12 (lower side from the mounting portion 12) of the base 11 and a green sheet for forming the concave portion 14 of the base 11 are prepared. A through hole for leading out the wiring conductor 15 and a through hole to be the recess 14 are formed in these green sheets by a punching method.
[0006]
Next, a conductive paste for forming the wiring layer 15 made of a metallized layer is printed and applied to the through hole and a predetermined portion of the green sheet laminate A for forming the mounting portion 12 by screen printing or the like. When the metallized layer is applied to the inner peripheral surface of 14, the conductive paste for forming the metal layer 17 is printed and applied to the inner surface of the through hole of the green sheet laminate B for forming the recess 14 by screen printing or the like.
[0007]
Next, the laminated bodies A and B are stacked and bonded to form a laminated body for forming the substrate 11, which is cut into a predetermined size to form a molded body, which is fired and sintered at a high temperature (about 1600 ° C). Body and chair. Thereafter, a package is manufactured by depositing a plated metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring layer 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
[0008]
[Patent Document 1]
JP 2002-232017
[0009]
[Problems to be solved by the invention]
However, in the conventional package described above, the conductor paste is printed and applied to the inner peripheral surface of the recess 14 by the screen printing method to form the metal layer 17, so that the inside of the recess 14 is affected by the influence of the viscosity of the conductor paste. The thickness and surface roughness of the metal layer 17 formed on the peripheral surface are likely to vary, and the light emitted from the light emitting element 13 is efficiently reflected, and it is difficult to uniformly radiate the outside.
[0010]
In addition, since the inclination angle of the inner peripheral surface of the concave portion 14 is constant, when light is diffused and emitted uniformly and efficiently to the outside of a wide area like a backlight of a liquid crystal display device or the like, Has converged in a certain direction, and has a problem that light cannot be diffused uniformly and efficiently outside the wide area.
[0011]
Further, if the inclination angle of the inner peripheral surface of the concave portion 14 is increased to radiate outside the wide area, the package becomes large.
[0012]
Accordingly, the present invention has been completed in view of the above-described problems of the prior art, and its purpose is to efficiently reflect the light emitted from the light emitting element accommodated in the recess so as to be uniformly and widely outside the wide area. It is an object of the present invention to provide a small light emitting element storage package and a light emitting device that can efficiently emit light.
[0013]
[Means for Solving the Problems]
In the light emitting element storage package of the present invention, a recess for receiving the light emitting element is provided on the upper surface of the insulating substrate, and a mounting portion on which the light emitting element is mounted on the bottom surface of the recess and the electrode of the light emitting element A package for storing a light emitting element in which a wiring layer to which is electrically connected is formed, wherein the recess is inclined so that an inner peripheral surface extends outward from a bottom surface of the recess toward an upper surface of the insulating base. A metal frame body is fitted, and the frame body is provided with a tilt angle changing portion so that the upper side of the inner peripheral surface has a smaller tilt angle than the lower side. Features.
[0014]
In the light emitting element storage package of the present invention, the recess is fitted with a metal frame that is inclined so that the inner peripheral surface extends outward from the bottom surface of the recess toward the upper surface of the insulating base. Since the body is provided with a tilt angle changing portion so that the upper side of the inner peripheral surface has a smaller tilt angle than the lower side, the light-emitting element is not affected by the surface state of the inner peripheral surface of the recess. The emitted light can be efficiently reflected by the inner peripheral surface of the metal frame, and can be diffused and radiated uniformly and efficiently outside the wide area.
[0015]
In the light emitting element storage package according to the present invention, preferably, the frame body is made of any of aluminum, silver, gold, palladium, or platinum.
[0016]
In the light emitting element storage package of the present invention, the frame body is preferably made of any of aluminum, silver, gold, palladium, or platinum, so that the light of the light emitting element can be further reflected by the frame body. It is possible to diffuse and radiate uniformly and efficiently outside the wide area.
[0017]
In the light emitting element storage package according to the present invention, it is preferable that the frame has a metal layer made of aluminum, silver, gold, palladium, or platinum on the surface thereof.
[0018]
In the light emitting element storage package of the present invention, preferably, the frame body has a metal layer made of any of aluminum, silver, gold, palladium, or platinum deposited on the surface thereof, so that the light of the light emitting element is used as the frame body. Since it can be better reflected by the deposited metal layer, it can be diffused and emitted more uniformly and efficiently outside the wide area.
[0019]
A light emitting device of the present invention includes the light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light emitting element. It is characterized by.
[0020]
The light-emitting device of the present invention has a high-performance light-emitting efficiency and a high-performance liquid crystal display device that can reflect light of the light-emitting element well and radiate uniformly and efficiently to the outside of a wide region by the above-described configuration. And so on.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
The light emitting element storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of the package of the present invention, and FIG. 2 is a plan view of the package of FIG. In these drawings, 1 is an insulating substrate, 2 is a mounting portion for the light emitting element 3, 3 is a light emitting element, and 4 is a recess for housing the light emitting element 3.
[0022]
The package of the present invention is provided with a recess 4 for accommodating the light emitting element 3 on the upper surface of the insulating substrate 1, and a mounting portion 2 on which the light emitting element 3 is mounted on the bottom surface of the recess 4 and an electrode of the light emitting element 3. Are formed, and the recess 4 is inclined so that the inner peripheral surface extends outward from the bottom surface of the recess 4 toward the upper surface of the insulating substrate 1. A metal frame body 8 is fitted, and the frame body 8 is provided with a tilt angle changing portion 8a so that the upper side of the inner peripheral surface has a smaller tilt angle than the lower side.
[0023]
The insulating substrate 1 in the present invention is made of ceramics or resin, and when made of ceramics, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. A rectangular parallelepiped box formed by laminating a plurality of insulating layers made of ceramics or the like, and a recess 4 for accommodating the light emitting element 3 is formed at the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. A green sheet (ceramic raw sheet) is obtained by forming into a sheet shape by a conventionally known doctor blade method or calendar roll method, and then a through hole for the recess 4 is formed in the green sheet by punching and a light emitting element 3 is formed by laminating a plurality of green sheets for mounting 3 and green sheets for the recesses 4, and baking and integrating them at a high temperature (about 1600 ° C.).
[0024]
Further, a mounting portion 2 for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag), or the like. It consists of a metallized layer of metal powder.
[0025]
In addition, the insulating base 1 is provided with wiring layers 5a and 5b formed on the lower surface of the insulating base 1 from the mounting portion 2 and its periphery. The wiring layers 5a and 5b are made of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 accommodated in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 with a conductive bonding material such as gold (Au) -silicon (Si) alloy or Ag-epoxy resin. The electrodes of the light emitting element 3 are electrically connected to the wiring layer 5b through bonding wires 6. Then, the wiring layers 5a and 5b on the lower surface of the insulating base 1 are connected to the wiring conductors of the external electric circuit board so as to be electrically connected to each electrode of the light emitting element 3, and power and driving signals are supplied to the light emitting element 3. The The light emitting element 3 may be connected to the mounting portion 2 and the wiring layer 5b by flip chip mounting.
[0026]
For the wiring layers 5a and 5b, for example, a metal paste obtained by adding and mixing an appropriate organic solvent and solvent to a metal powder such as W or Mo is preliminarily printed and applied in a predetermined pattern on a green sheet serving as the substrate 1 by a screen printing method. As a result, the insulating base 1 is deposited on a predetermined position.
[0027]
It should be noted that a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), Ag or the like is deposited on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. The wiring layers 5a and 5b and the mounting portion 2 can be effectively prevented from being oxidized and corroded, and the mounting portion 2 and the light emitting element 3 are fixed to each other, the wiring layer 5b and the bonding wire 6 are joined, and the wiring layers 5a and 5b. And the wiring conductor of the external electric circuit board can be firmly joined. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electroplating method or non-plating method. More preferably, the electrodes are sequentially deposited by electrolytic plating.
[0028]
In the present invention, the recess 4 is fitted with a metal frame 8 that is inclined so that the inner peripheral surface extends outward from the bottom surface of the recess 4 toward the upper surface of the insulating base 1. The body 8 is provided with a tilt angle changing portion 8a so that the upper side of the inner peripheral surface has a smaller tilt angle than the lower side. Thereby, the light emitted from the light emitting element 3 is efficiently reflected by the inner peripheral surface of the metal frame 8 without being affected by the surface state of the inner peripheral surface of the recess 4, so that the light can be uniformly and outside the wide area. It can be diffused and emitted efficiently.
[0029]
The frame 8 may be fitted to the inner peripheral surface of the recess 4 with a resin adhesive, or a metallized layer for bonding is formed on the inner peripheral surface of the recess 4 and brazed with Ag brazing or the like. It may be joined. Further, after accommodating the light emitting element 3 in the recess 4 and making electrical connection via the bonding wire 6 or the like, the inner peripheral surface of the frame body 8 is covered together with the light emitting element 3 by the transparent resin sealed in the recess 4. The frame body 8 may be in a state of being fitted in the recess 4.
[0030]
Further, the arithmetic average roughness Ra of the inner peripheral surface of the through hole of the frame body 8 is preferably 3 μm or less. If it exceeds 3 μm, the light of the light emitting element 3 accommodated in the recess 4 is scattered, and it becomes difficult to uniformly radiate the reflected light to the outside with high reflectivity.
[0031]
In addition, the recess 4 in which the frame body 8 is fitted may have a cross-sectional shape that is circular, oval, elliptical, rectangular, or the like. As shown in the cross-sectional view of the package in FIG.
About 5 to 15 ° (θ) so that the inner peripheral surface of the recess 4 and the outer peripheral surface of the frame body 8 spread outward from the bottom surface of the recess 4 toward the upper surface of the insulating base 1. 3 : About 75 to 85 °), and it is preferable to incline to have a slight angle. In this case, even if a shape abnormality such as slight deformation or warping occurs on the inner peripheral surface or upper end of the recess 4, The frame body 8 can be easily inserted into the concave portion 4 without being greatly affected by the deformation and warpage.
[0032]
Furthermore, as shown in the cross-sectional view of the package in FIG. 4, an extension portion bent outward may be formed at the upper end portion of the frame body 8 so as to extend to the upper surface of the insulating base 1. It is possible to accurately position the fitting position in the vertical direction of the frame body 8 into the recess 4. Further, a gap can be formed between the lower surface of the frame body 8 and the bottom surface of the recess 4, and the frame body 8, the mounting portion 2 and the wiring layers 5a and 5b come into contact with each other to cause a short circuit or the like. Can be prevented. Further, by forming the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the concave portion 4 at the gap portion, the formation region can be widened. Further, the transparent resin can be firmly bonded in the recess 4 so that the transparent resin covering the light emitting element 3 enters the gap.
[0033]
Further, as shown in the cross-sectional view of the package in FIG. 5, a portion lower than the light emitting portion of the light emitting element 3 on the inner peripheral surface of the frame body 8 may be formed so as to be orthogonal to the upper surface of the insulating substrate 1. In this case, the area of the bottom surface of the concave portion 4 is increased, and it is possible to prevent a short circuit or the like from occurring due to contact between the frame body 8, the mounting portion 2 and the wiring layer 5b.
[0034]
Further, a step that is thicker than the mounting portion 2 and the wiring layer 5 b and protrudes toward the light emitting element 3 is formed at the lower end of the inner peripheral surface of the recess 4, and the frame body 8 is placed on the bottom surface of the step. You may do it. In this case, since the lower surface of the frame body 8 is higher than the mounting portion 2 and the wiring layer 5b formed on the bottom surface of the recess 4, the frame body 8, the mounting portion 2 and the wiring layer 5b come into contact with each other and short-circuit. In addition, the bottom surface of the stepped portion of the recessed portion 4 is joined to the lower surface of the frame body 8, so that the frame body 8 can be firmly fitted. Further, as shown in the sectional view of the package of FIG. 6, the width of the step at the lower end of the inner peripheral surface of the recess 4 may be made smaller than the width of the lower surface of the frame body 8. The transparent resin can be firmly bonded in the recess 4 so that the transparent resin that covers the light emitting element 3 enters the gap between the recess 4 and the light emitting element 3.
[0035]
In the package of the present invention, the cross-sectional shape of the through-hole of the frame body 8 can be various shapes such as a circular shape, an elliptical shape, an oval shape, a rectangular shape, a polygonal shape, etc., but the circular shape is good. The light of the light emitting element 3 accommodated in the recess 4 can be uniformly reflected by the inner peripheral surface of the frame body 8 and can be emitted uniformly and efficiently to the outside of the wide area.
[0036]
In FIG. 2, a frame 8 having a circular cross-sectional shape of the through hole is fitted to the inner peripheral surface of the concave portion 4 having a circular cross-sectional shape. The cross sectional shape of the through hole of the body 8 may be different. As shown in the plan view of the package in FIG. 7, a frame body 8 having a circular cross-sectional shape of the through hole may be fitted into the concave portion 4 having a quadrangular cross-sectional shape. As shown in the figure, a frame body 8 having a rectangular cross-sectional shape of the through hole may be fitted into the recess 4 having a quadrangular cross-sectional shape.
[0037]
When one change part 8a is formed in the frame body 8, the inclination angle with respect to the bottom surface of the recessed part 4 above the change part 8a of the frame body 8 is 35 to 70 °, and from the change part 8a of the frame body. The inclination angle with respect to the bottom surface of the lower recess 4 is preferably 40 to 90 °.
[0038]
If the inclination angle above the change part 8a of the frame 8 exceeds 70 °, it is difficult to diffuse and emit the light of the light emitting element 3 accommodated in the recess 4 uniformly and efficiently outside the wide area. When the inclination angle is less than 35 °, the frame body 8 is enlarged and the package is enlarged.
[0039]
Further, if the inclination angle below the frame changing portion 8a is less than 40 °, the frame body 8 is enlarged and the package is enlarged. When the angle exceeds 90 °, the change part 8a of the frame 8 protrudes inside the recess 4, and when the change part 8a is above the light emitting element 3, the light of the light emitting element 3 is blocked. However, it tends to be difficult to diffuse and emit the light of the light-emitting element 3 uniformly and efficiently outside the wide area.
[0040]
Further, in order to reflect the light of the light emitting element 3 on the inner peripheral surface of the recess 4 and efficiently radiate the light to the outside of the wide area, the changing portion 8a is formed from the upper surface of the light emitting element 3 mounted on the mounting portion 2. Is preferably on the lower side. In addition, when there are a plurality of changing portions 8 a in the vertical direction, it is preferable that the portion where the inclination angle with respect to the bottom surface of the recess 4 is 70 ° or less is formed from a position below the top surface of the light emitting element 3.
[0041]
Further, the frame body 8 is formed by stacking a plurality of frame-shaped members, and the boundary between the frame-shaped members may be the changing portion 8a. For example, when one change part 8a is formed in the frame 8, as shown in the sectional view of the package in FIG. 9, two frame-like members 8b and 8c having different inclination angles on the inner peripheral surface are joined. It may be formed. Further, as shown in the cross-sectional view of the package of FIG. 10, the width of the lower surface of the upper frame-shaped member 8c is made smaller than the width of the upper surface of the lower frame-shaped member 8b, and the joint is shifted to the frame-shaped members 8b, 8c. Even if this occurs, the upper frame-shaped member 8c may be prevented from projecting toward the light emitting element 3 relative to the lower frame-shaped member 8b. Thereby, since the light of the light emitting element 3 can be prevented from being blocked and reflected by the lower surface of the projecting frame-like member 8c, it can be diffused and radiated uniformly and efficiently outside the wide area.
[0042]
Further, since the frame 8 is preferably made of any of aluminum, silver, gold, palladium, or platinum, the light of the light-emitting element 3 can be more favorably reflected by the frame 8, so that the outside of the wide area Therefore, it is possible to diffuse and radiate uniformly and efficiently. In particular, the frame body 8 is preferably made of aluminum. In this case, the frame body 8 is not easily oxidized and corroded, and the variation in the light reflectance due to the variation in the light wavelength of the light emitting element 3 is reduced. Can be used.
[0043]
The frame 8 is made of aluminum (coefficient of thermal expansion of about 23.5 × 10 -6 / ° C), silver (coefficient of thermal expansion: approx. 19.1 × 10 -6 / ℃), gold (coefficient of thermal expansion of about 14.1 × 10 -6 / Degree centigrade), palladium (thermal expansion coefficient approx. 11.8 × 10 -6 / ℃) or platinum (thermal expansion coefficient approx. 8.8 × 10 -6 In the case of using (/ ° C.), a metal plate having a thermal expansion coefficient between the insulating base 1 and the frame 8 may be interposed between the insulating base 1 and the frame 8. For example, alumina ceramics (thermal expansion coefficient 7 × 10 -6 ~ 8 × 10 -6 In order to relieve the thermal stress generated due to the difference in thermal expansion coefficient between the insulating base 1 and the frame 8, the Fe—Ni between the insulating base 1 and the frame 8 is used. -Co alloy (coefficient of thermal expansion 6 × 10 -6 ~ 10 × 10 -6 / C degree), Cu-W alloy (thermal expansion coefficient 6 × 10 -6 ~ 11 × 10 -6 It is better to use a metal plate having a thermal expansion coefficient closer to the frame body 8 such as / degree C.). Thereby, the thermal stress generated by the difference in thermal expansion coefficient between the insulating base 1 and the frame body 8 can be relaxed, and peeling of the frame body 8 can be effectively prevented.
[0044]
The frame body 8 may be an alloy mainly composed of aluminum, silver, gold, palladium, or platinum.
[0045]
In addition, the frame 8 in the present invention preferably has a metal layer made of any of aluminum, silver, gold, palladium or platinum deposited on the surface thereof, and the light of the light emitting element 3 is deposited on the frame 8. It is possible to radiate with good reflection by the formed metal layer, diffused more uniformly and efficiently outside the wide area. As shown in FIG. 11, such a frame 8 is obtained by depositing a metal layer 8 a made of any of aluminum, silver, gold, palladium, or platinum on the inner peripheral surface of the frame 8. In particular, the metal layer 8a is preferably made of aluminum, and is less susceptible to problems such as oxidative corrosion and migration, and the variation in light reflectivity due to variation in the light wavelength of the light-emitting element 3 is reduced. Can be used.
[0046]
The frame 8 may be made of a material having a thermal expansion coefficient close to that of the insulating base 1. For example, alumina ceramics (thermal expansion coefficient 7 × 10 -6 ~ 8 × 10 -6 And an Fe—Ni—Co alloy having a thermal expansion coefficient close to that of the insulating substrate 1 as the frame 8 (thermal expansion coefficient 6 × 10). -6 ~ 10 × 10 -6 ) Or the like can effectively prevent the frame 8 from peeling off. When the metal layer 8a is attached to such a frame 8, the frame 8 can be firmly fitted to the insulating base 1, and the light reflectance of the light emitting element 3 can be increased.
[0047]
The metal layer 8 a may be attached only to the surface (inner peripheral surface) of the frame 8 on the light emitting element 3 side, or may be attached to the entire surface of the frame 8.
[0048]
The metal layer 8a may be an alloy layer mainly composed of aluminum, silver, gold, palladium, or platinum.
[0049]
Moreover, the displacement part 8a may be formed below the light emitting part of the light emitting element 3, and the upper and lower surface roughness of the displacement part 8a may be different. For example, the surface roughness of the frame 8 or the metal layer 8d below the displacement portion 8a can be increased so that the transparent resin sealed in the recess 4 is firmly attached. Further, when the light of the light emitting element 3 irradiated in the direction lower than the light emitting portion of the light emitting element 3 is reflected by the frame body 8 or the metal layer 8d, the light is reflected toward the bottom surface of the recess 4 due to scattering. The amount of light can be reduced, and the amount of light leaking from the portion where the insulating base 1 is exposed, in which the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the recess 4 are not formed, can be reduced. Furthermore, since a part of the scattered reflected light is also directed upward, the amount of light emitted above the package can be increased.
[0050]
Moreover, the displacement part 8a may be formed below the light emitting part of the light emitting element 3, and the reflectance may be different between the upper side and the lower side of the displacement part 8a. In this case, in the frame 8 or the metal layer 8d below the light emitting portion, the light from the light emitting element 3 is easily reflected toward the bottom surface of the recess 4, so that the inner peripheral surface of the frame 8 below the displacement portion 8a. Alternatively, the reflectance of the metal layer 8d is lowered to reduce the amount of reflected light toward the bottom surface of the recess 4, and the insulating substrate 1 in which the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the recess 4 are not formed. It is possible to reduce the amount of light leaking from the portion where is exposed.
[0051]
The light emitting device of the present invention includes the package of the present invention, a light emitting element 3 mounted on the mounting portion 2 and electrically connected to the wiring layer 5b, and a transparent resin such as a silicone resin covering the light emitting element 3. is doing. As a result, the light of the light emitting element 3 is reflected well and can be emitted uniformly and efficiently to the outside of a wide area, and it has a high performance with high luminous efficiency and is suitable for a backlight of a liquid crystal display device or the like. It will be a thing. The transparent resin that covers the light emitting element 3 may cover only the light emitting element 3 and its periphery, or may fill the recess 4 to cover the light emitting element 3.
[0052]
It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, as shown in FIG. 12, the light-emitting element 3 is directly mounted on the bottom surface of the recess 4 of the insulating base 1 without forming the mounting portion 2 as a conductor layer, and is electrically connected to the light-emitting element 3 around it. The wiring layers 5 a and 5 b to be formed may be formed, and the frame body 8 may be fitted into the recess 4. In this case, both the wiring layers 5a and 5b are electrically connected to the light emitting element 3 by bonding wires or the like.
[0053]
【The invention's effect】
In the light emitting element storage package of the present invention, the recess is fitted with a metal frame that is inclined so that the inner peripheral surface extends outward from the bottom surface of the recess toward the upper surface of the insulating base. Since the body is provided with a tilt angle changing portion so that the upper side of the inner peripheral surface has a smaller tilt angle than the lower side, the light-emitting element is not affected by the surface state of the inner peripheral surface of the recess. The emitted light can be efficiently reflected by the inner peripheral surface of the metal frame, and can be diffused and radiated uniformly and efficiently outside the wide area.
[0054]
In the light emitting element storage package of the present invention, the frame body is preferably made of any of aluminum, silver, gold, palladium, or platinum, so that the light of the light emitting element can be further reflected by the frame body. It is possible to diffuse and radiate uniformly and efficiently outside the wide area.
[0055]
In the light emitting element storage package of the present invention, the frame body preferably has a metal layer made of any of aluminum, silver, gold, palladium, or platinum deposited on the inner peripheral surface thereof. Since it can be reflected better by the metal layer applied to the frame, it can be diffused and radiated more uniformly and efficiently outside the wide area.
[0056]
The light emitting device of the present invention includes the light emitting element storage package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light emitting element. Thus, the light of the light emitting element can be reflected well, and can be emitted uniformly and efficiently to the outside of a wide area, and it has a high performance with high luminous efficiency, and is suitable for a backlight of a liquid crystal display device or the like. Become.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting element storage package according to the present invention.
2 is a plan view of the light emitting element storage package of FIG. 1; FIG.
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 6 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 7 is a plan view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 8 is a plan view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 9 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 10 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 11 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 12 is a cross-sectional view showing another example of the embodiment of the light emitting element storage package of the present invention.
FIG. 13 is a cross-sectional view of a conventional light emitting element storage package.
[Explanation of symbols]
1: Insulating substrate
2: Mounted part
3: Light emitting element
4: Recess
5a, 5b: wiring layer
8: Frame

Claims (4)

絶縁基体の上面に発光素子を収容するための凹部が設けられているとともに、該凹部の底面に前記発光素子が搭載される搭載部および前記発光素子の電極が電気的に接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部は、内周面が前記凹部の底面から前記絶縁基体の上面に向けて外側に広がるように傾斜している金属製の枠体が嵌着されており、該枠体は、前記内周面の上側が下側よりも傾斜角度が小さくなるように傾斜角度の変化部が設けられていることを特徴とする発光素子収納用パッケージ。A recess for accommodating the light emitting element is provided on the top surface of the insulating substrate, and a mounting portion on which the light emitting element is mounted and a wiring layer electrically connected to the electrode of the light emitting element are provided on the bottom surface of the recess. The light emitting element storage package is formed, and the recess is fitted with a metal frame that is inclined so that an inner peripheral surface extends outward from the bottom surface of the recess toward the top surface of the insulating base. The light emitting element storage package, wherein the frame body is provided with a change portion of an inclination angle so that the upper side of the inner peripheral surface has a smaller inclination angle than the lower side. 前記枠体は、アルミニウム，銀，金，パラジウムまたは白金のいずれかから成ることを特徴とする請求項１記載の発光素子収納用パッケージ。2. The light emitting element storage package according to claim 1, wherein the frame body is made of any of aluminum, silver, gold, palladium, or platinum. 前記枠体は、前記内周面にアルミニウム，銀，金，パラジウムまたは白金のいずれかから成る金属層が被着されていることを特徴とする請求項１記載の発光素子収納用パッケージ。The light emitting element storage package according to claim 1, wherein the frame body has a metal layer made of any of aluminum, silver, gold, palladium, and platinum attached to the inner peripheral surface. 請求項１乃至請求項３のいずれかに記載の発光素子収納用パッケージと、前記搭載部に搭載されるとともに前記配線層に電極が電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする発光装置。The light emitting element storage package according to any one of claims 1 to 3, a light emitting element mounted on the mounting portion and having an electrode electrically connected to the wiring layer, and a transparent covering the light emitting element A light-emitting device comprising a resin.
JP2003080127A 2003-03-24 2003-03-24 Light emitting element storage package and light emitting device Expired - Fee Related JP4072084B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003080127A JP4072084B2 (en) 2003-03-24 2003-03-24 Light emitting element storage package and light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003080127A JP4072084B2 (en) 2003-03-24 2003-03-24 Light emitting element storage package and light emitting device

Publications (2)

Publication Number Publication Date
JP2004288937A JP2004288937A (en) 2004-10-14
JP4072084B2 true JP4072084B2 (en) 2008-04-02

Family

ID=33294070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003080127A Expired - Fee Related JP4072084B2 (en) 2003-03-24 2003-03-24 Light emitting element storage package and light emitting device

Country Status (1)

Country Link
JP (1) JP4072084B2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100646093B1 (en) 2004-12-17 2006-11-15 엘지이노텍 주식회사 Light emitting device package
KR100610650B1 (en) 2005-06-17 2006-08-09 (주) 파이오닉스 Light emitting diode package and manufacturing method thereof
KR100606550B1 (en) * 2005-07-04 2006-08-01 엘지전자 주식회사 Light emitting device package and method for fabricating the same
JP5038631B2 (en) * 2006-02-03 2012-10-03 新光電気工業株式会社 Light emitting device
JP2011060819A (en) 2009-09-07 2011-03-24 Nitto Denko Corp Resin composition for optical semiconductor element housing package, and optical semiconductor light emitting device obtained using the same
TWI488891B (en) 2009-12-22 2015-06-21 Mitsubishi Chem Corp And a material for a resin molded body for a semiconductor light emitting device
KR101342287B1 (en) 2010-04-28 2013-12-16 미쓰비시 가가꾸 가부시키가이샤 Package for semiconductor light emitting device, and light emitting device
KR101550938B1 (en) 2010-08-06 2015-09-07 엘지이노텍 주식회사 Light-emitting element package
EP3410498A1 (en) * 2011-11-17 2018-12-05 Lumens Co., Ltd. Light emitting element package
JP5971180B2 (en) * 2013-04-19 2016-08-17 日亜化学工業株式会社 Light emitting device
KR101628541B1 (en) * 2014-11-25 2016-06-08 엘지이노텍 주식회사 Light-emitting element package
JP6755090B2 (en) * 2014-12-11 2020-09-16 シチズン電子株式会社 Light emitting device and manufacturing method of light emitting device
JP2017130588A (en) * 2016-01-21 2017-07-27 旭化成株式会社 Ultraviolet light-emitting device
KR101657074B1 (en) * 2016-04-07 2016-09-13 엘지이노텍 주식회사 Light-emitting element package and Back light apparatus, Light-emitting apparatus including the same
KR102094402B1 (en) * 2018-08-24 2020-03-27 주식회사 케이티앤지 Light emitting element and Aerosol generating device including the same

Also Published As

Publication number Publication date
JP2004288937A (en) 2004-10-14

Similar Documents

Publication Publication Date Title
JP4070208B2 (en) Light emitting element storage package and light emitting device
JP4072084B2 (en) Light emitting element storage package and light emitting device
WO2016136733A1 (en) Light-emitting element mounting package, light-emitting device, and light-emitting module
JP2004319939A (en) Package for housing light emitting element and light emitting device
JP4369738B2 (en) Light emitting element storage package and light emitting device
JP4383059B2 (en) Light emitting element storage package and light emitting device
JP4307090B2 (en) Light emitting element storage package and light emitting device
JP4132038B2 (en) Light emitting device
JP2004281994A (en) Package for storing light emitting element and light emitting device
JP2005191111A (en) Package for storing light emitting element, and light emitting device
JP4295519B2 (en) Light emitting element storage package and light emitting device
JP4164006B2 (en) Light emitting element storage package and light emitting device
JP4132043B2 (en) Light emitting element storage package and light emitting device
JP5173903B2 (en) Light emitting element storage package and light emitting device
JP2004259893A (en) Package for housing light-emitting element and light-emitting device
JP4336136B2 (en) Light emitting element storage package and light emitting device
JP2005019688A (en) Package for accommodating light emitting element and light emitting device
JP4129169B2 (en) Light emitting element storage package and light emitting device
JP4336153B2 (en) Light emitting element storage package and light emitting device
JP2005243738A (en) Accommodating light-emitting device and package therefor
JP4336137B2 (en) Light emitting element storage package and light emitting device
JP4132039B2 (en) Light emitting element storage package and light emitting device
JP4183175B2 (en) Light emitting element storage package and light emitting device
JP2005216962A (en) Package for containing light emitting element and light emitting device
JP4129173B2 (en) Light emitting element storage package and light emitting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060307

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20071225

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080118

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110125

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110125

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120125

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120125

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130125

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140125

Year of fee payment: 6

LAPS Cancellation because of no payment of annual fees