JP2004253404A - Package for housing light emitting element and light emitting device - Google Patents

Package for housing light emitting element and light emitting device Download PDF

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Publication number
JP2004253404A
JP2004253404A JP2003014844A JP2003014844A JP2004253404A JP 2004253404 A JP2004253404 A JP 2004253404A JP 2003014844 A JP2003014844 A JP 2003014844A JP 2003014844 A JP2003014844 A JP 2003014844A JP 2004253404 A JP2004253404 A JP 2004253404A
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Prior art keywords
light emitting
emitting element
light
package
housing
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JP2003014844A
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Japanese (ja)
Inventor
Toshiyuki Chitose
Yoshinori Maekawa
Yosuke Moriyama
義紀 前川
敏幸 千歳
陽介 森山
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Kyocera Corp
京セラ株式会社
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Priority to JP2003014844A priority patent/JP2004253404A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing a light emitting element which can be mounted accurately and highly reliably on the wiring conductor of an external electric circuit board with high joint strength without causing any positional deviation nor inclination, by increasing the mechanical strength of the package and, in addition, on which a plurality of pieces of light emitting elements can be mounted so that the elements may make full-color light emission.
SOLUTION: This package for housing light emitting element is constituted by laminating a frame body 2 having through holes 2a for housing light emitting elements 3 upon the upper surface of a square plate-shaped substrate 1 having a mounting section 1a for mounting the plurality of light emitting elements 3 on its upper surface. The substrate 1 has notched sections 7 respectively formed by notching the four side faces of the substrate 1 from the upper surface to the lower surface of the substrate 1 and having arcuate shapes in the top view under the frame body 2, and side-face conductors 7a and 7b formed on the inner peripheral surfaces of the notched sections 7. Some electrodes of the light emitting elements 3 are connected to the side-face conductors 7a and 7b.
COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、発光ダイオード等の発光素子を用いた表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。 The present invention is used in a display device or the like using the light emitting element such as light emitting diodes, a light emitting element storing package and the light emitting device for accommodating a light emitting element.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
従来、発光ダイオード等の発光素子を収容するための発光素子収納用パッケージ(以下、パッケージともいう)として、セラミック製のパッケージが用いられている。 Conventionally, the light-emitting element storing package for housing a light emitting element such as light emitting diodes (hereinafter also referred to as package) as, ceramic packages are used. 従来のセラミック製のパッケージは、図6に断面図で示すように、上面の中央部に発光素子23を搭載するための導体層から成る搭載部21aを有し、搭載部21aおよびその周辺から下面に導出された一対のメタライズ配線導体24a,24bを有する略四角平板状のセラミック製の基体21と、その上面に積層され、中央部に発光素子23を収容するための貫通孔22aを有する略四角枠状のセラミック製の枠体22とから主に構成されている(例えば、下記の特許文献1参照)。 Conventional packaging ceramic, as shown in cross section in FIG. 6, has a mounting portion 21a made of a conductor layer for mounting the light emitting element 23 to the central portion of the upper surface, a lower surface from the mounting portion 21a and the periphery thereof pair of metallized wiring conductors 24a derived in a substantially rectangular plate-shaped ceramic substrate 21 having 24b, is stacked on the upper surface thereof, a substantially rectangular having a through hole 22a for housing the light emitting element 23 in the central portion a frame-shaped ceramic frame body 22. is mainly composed (e.g., see Patent Document 1 below).
【0003】 [0003]
そして、基体21の上面の一方のメタライズ配線導体24aが接続された搭載部21a上に発光素子23を導電性接合材を介して固着するとともに発光素子23の電極と他方のメタライズ配線導体24bとをボンディングワイヤ25を介して電気的に接続し、しかる後、枠体22の貫通孔22a内に透明樹脂(図示せず)を充填して発光素子23を封止することによって発光装置となる。 Then, the electrode and the other metallized wiring conductors 24b of the light emitting element 23 while fixing the light emitting element 23 through the conductive bonding material on the mounting portion 21a while the metallized wiring conductors 24a of the upper surface of the base body 21 is connected and electrically connected through the bonding wires 25, and thereafter, the light-emitting device by sealing the light emitting element 23 is filled with a transparent resin into the through hole 22a of the frame 22 (not shown). この発光装置を外部電気回路基板の配線導体に半田を介して接続することによって、発光装置が外部電気回路基板に実装されるとともに搭載する発光装置の電極が外部電気回路に電気的に接続され発光素子23へ電力が供給されることとなる。 By connecting the light emitting device via a solder to a wiring conductor of the external electric circuit board, the light emitting device electrode of the light emitting device mounted with being mounted on an external electric circuit board is electrically connected to an external electric circuit emitting so that the power to the element 23 is supplied.
【0004】 [0004]
このようなセラミック製のパッケージにおいては、内部に収容する発光素子23が発する光を枠体22の貫通孔22aの内周面で反射させるが、発光装置の発光効率を良好なものとするために貫通孔22aの内周面にニッケル(Ni)や金(Au)等の金属から成る金属めっき層26bを表面に有するメタライズ金属層26aを被着させている。 In such a package ceramic, but to reflect the light emitting element 23 is emitted to accommodate within the inner peripheral surface of the through hole 22a of the frame 22, in order to the luminous efficiency of the light emitting device favorable the metal plating layer 26b on the inner peripheral surface made of nickel (Ni), gold (Au) or the like of the metals of the through hole 22a is made to depositing the metallized metal layer 26a having a surface.
【0005】 [0005]
また、このパッケージはセラミックグリーンシート(以下、グリーンシートともいう)積層法により製作される。 The package also ceramic green sheet (hereinafter also referred to as a green sheet) is fabricated by a lamination method. 具体的には、セラミックスから成る基体21用のグリーンシートと、セラミックスから成る枠体22用のグリーンシートとを準備し、これらのグリーンシートにメタライズ配線導体24a,24bを導出させるための貫通孔や発光素子23を収容するための貫通孔をグリーンシートの上下面に略垂直に打ち抜く。 Specifically, the green sheet for the base body 21 made of ceramics, is prepared and a green sheet for the frame 22 made of ceramic, the through-hole of Ya for leading out metallized wiring conductors 24a, and 24b in the green sheets punching a through hole for housing the light emitting element 23 in a substantially perpendicular to the upper and lower surfaces of the green sheet. 次に、基体21用のグリーンシートの上面から下面にかけてメタライズ配線導体24a,24b用のタングステン(W)やモリブデン(Mo)などの高融点金属粉末から成る金属ペーストを従来周知のスクリーン印刷法等により塗布し、枠体22用のグリーンシートの貫通孔の内周面にメタライズ金属層26a用のWやMoなどの高融点金属粉末から成る金属ペーストをスクリーン印刷法等により塗布する。 Next, metallized wiring conductor 24a from the upper surface to the lower surface of the green sheet for the base 21, the tungsten (W) or molybdenum (Mo) well-known screen printing a metal paste consisting of a refractory metal powder such as such as for 24b coated, the metal paste consisting of a refractory metal powder such as W or Mo for metallized metal layer 26a on the inner peripheral surface of the through hole of the green sheet for the frame 22 is applied by screen printing or the like. 次に、基体21用のグリーンシートと枠体22用のグリーンシートとを上下に重ねて接合し、これらを高温で焼成して焼結体と成す。 Then, joined by overlapping the green sheet for green sheet and the frame 22 for the base 21 vertically, forming a sintered body by firing them at a high temperature. その後、搭載部21a、メタライズ配線導体24a,24bおよびメタライズ金属層26aの露出表面に、NiやAu等の金属から成る金属めっき層26bを無電解めっき法や電解めっき法により被着させることにより、パッケージが製作される。 Thereafter, the mounting portion 21a, metallized wiring conductors 24a, the exposed surface of 24b and metallized metal layer 26a, by depositing the Ni and electroless plating a metal plating layer 26b made of a metal such as Au or electrolytic plating, package is fabricated.
【0006】 [0006]
しかしながら、この従来のパッケージでは、貫通孔22aの内周面が基体21の上面に対して略垂直になっており、そのため、貫通孔22aの内周面で反射した光が外部に均一かつ良好に放射されず、このパッケージを用いた発光装置の発光効率がそれ程高くならないという問題点を有していた。 However, this conventional package, the inner peripheral surface of the through hole 22a are made substantially perpendicular to the upper surface of the base body 21, therefore, uniformly and satisfactorily on the light outside reflected by the inner peripheral surface of the through hole 22a not emitted, emission efficiency of the light emitting device using the package has a problem that not so high.
【0007】 [0007]
そこで、このような問題点を解消するために、本出願人は、図5に示すように、上面に発光素子13を搭載するための搭載部11aを有する略平板状の基体11の上面に、発光素子13を収容するための貫通孔12aを有する枠体12を接合して成るパッケージであって、貫通孔12a内周面は、基体11上面に対して55〜70度の角度で外側に広がっているとともにその表面に算術平均粗さRaが1〜3μmでかつ発光素子13の光に対する反射率が80%以上の金属めっき層16bが被着されていることにより、貫通孔12a内に収容する発光素子13が発する光を傾斜した貫通孔12aの内周面の金属めっき層16bにより良好に反射させて外部に向かって均一かつ効率良く放射することができるパッケージを提案した(下記の特許 Therefore, in order to solve such problems, the applicant, as shown in FIG. 5, the upper surface of the substantially flat base 11 having a mounting portion 11a for mounting the light emitting element 13 on the upper surface, a package formed by joining the frame body 12 having a through hole 12a for housing the light emitting element 13, the inner peripheral surface through hole 12a is outwardly flared at an angle of 55-70 degrees with respect to base 11 the upper surface and an arithmetic average roughness Ra 1~3μm in conjunction with that on its surface reflectance to light from the light emitting element 13 by more than 80% of the metal plating layer 16b are deposited, accommodated in the through hole 12a proposed a package which better reflects the inner peripheral surface of the metal plating layer 16b of the through hole 12a inclined light emitting element 13 emits can be uniformly and efficiently emitted toward the outside (the following patents 献1参照)。 Document reference 1).
【0008】 [0008]
このパッケージは以下のようにして作製される。 This package is produced as follows. 枠体12用のグリーンシートに発光素子13収納用の貫通孔12aをその内周面が55〜70度の傾斜面となるように打ち抜く。 Frame 12 the inner peripheral surface thereof in the green sheet through hole 12a of the light emitting element 13 for accommodating for punches such that the inclined surface of 55 to 70 degrees. 次に、貫通孔12aの内周面に金属ペーストを塗布し、枠体12用のグリーンシートと基体11用のグリーンシートとを枠体12用のグリーンシートの貫通孔12aの内周面が外側に広がる向きに接合し、これらを焼成して基体11上に貫通孔12aを有する枠体12が積層一体化されるとともに貫通孔12aの内周面にメタライズ金属層16aが被着された焼結体を得る。 Next, a metal paste is applied to the inner peripheral surface of the through hole 12a, and a green sheet for the green sheet and the substrate 11 for the frame 12 the inner circumferential surface of the through hole 12a of the green sheet for the frame 12 the outer joined in a direction extending, sintering the inner peripheral surface metallized metal layer 16a of a through-hole 12a frame 12 having a through hole 12a on the base body 11 by firing them is integrally laminated is deposited get the body. 次に、メタライズ金属層16a表面に算術平均粗さRaが1〜3μmでかつ発光素子13が発する光に対する反射率が80%以上の金属めっき層16bを被着させる。 Next, the arithmetic average roughness Ra of 1~3μm and reflectance for light emitting element 13 is emitted is deposited more than 80% of the metal plating layer 16b on the metallized metal layer 16a surface.
【0009】 [0009]
また、基体11に設けたメタライズ配線導体14a,14bは、W,Mo等の高融点金属粉末から成り、このメタライズ配線導体14a,14bは、基体11の下面に延出するように貫通孔を介して導出されており、図示しない外部電気回路基板の配線導体に接続されて、発光素子13の各電極と外部電気回路とが電気的に接続される。 Also, metallized wiring conductor 14a provided on the base 11, 14b are, W, made of a refractory metal powder such as Mo, the metallized wiring conductors 14a, 14b may, through the through hole so as to extend to the lower surface of the base 11 are derived Te, is connected to the wiring conductor of the external electric circuit board (not shown), each electrode and the external electric circuit of the light emitting element 13 are electrically connected.
【0010】 [0010]
メタライズ配線導体14a,14bは、例えばW,Mo等の高融点金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを、基体11となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって基体11の所定位置に被着形成される。 Metallized wiring conductors 14a, 14b may, for example W, the predetermined pattern in advance by a screen printing method a refractory metal powder in a suitable organic solvent such as Mo, a metal paste obtained by admixing the solvent, the green sheets for the base body 11 It is deposited and formed at predetermined positions of the base 11 by that you print applied to. そして、メタライズ配線導体14a,14bの露出表面にNiやAu等の耐蝕性に優れる金属を1〜20μm程度の厚みで被着させておくと、メタライズ配線導体14a,14bが酸化腐蝕するのを有効に防止でき、またメタライズ配線導体14aと発光素子13、メタライズ配線導体14bとボンディングワイヤ15との接合、メタライズ配線導体14a,14bと外部電気回路基板の配線導体との接合を強固にすることができる。 The metallized wiring conductors 14a, when allowed to depositing a metal having excellent corrosion resistance such as Ni or Au on the exposed surface of 14b with a thickness of about 1 to 20 [mu] m, metallized wiring conductors 14a, and 14b is to oxidize corrosion effective can be prevented, also to strengthen the bonding between the metallized wiring conductor 14a and the light emitting element 13, bonding between the metallized wiring conductor 14b and the bonding wire 15, metallized wiring conductors 14a, 14b and the external electric circuit board of the wiring conductor that the . 従って、メタライズ配線導体14a,14bの露出表面には、厚さ1〜10μm程度のNiめっき層と厚さ0.1〜3μm程度のAuめっき層とが電解めっき法や無電解めっき法により順次被着されている。 Therefore, the metallized wiring conductors 14a, 14b exposed surface of the sequentially be by the thickness 1~10μm about Ni plating layer and the thickness of 0.1~3μm about Au plated layer is electroless plating or electroless plating They are wearing.
【0011】 [0011]
また、近年青色の発光素子の開発が進められ、これに伴って3原色の発光素子を1つのパッケージに収納させ、フルカラー発光させるように複数個の発光素子を搭載するパッケージが用いられるようになってきている。 In recent years the development of a blue light emitting element is advanced, this accompanied by accommodating the light emitting element of the three primary colors in a single package, so that the package for mounting a plurality of light emitting elements are used so as to full color emission it has been. このパッケージは、図3の平面図および図4の断面図に示すように、基板31の上面に複数個の発光素子33を搭載する搭載部31aを有するとともに、4隅に平面視で略円弧状であって上下面にわたって切り欠かれた切欠き部34が形成されている。 This package, as shown in a plan view and a cross-sectional view of FIG. 4 in FIG. 3, and has a mounting portion 31a for mounting a plurality of light emitting elements 33 on the upper surface of the substrate 31, a substantially arc shape in plan view at the four corners notch 34 cut out over the upper and lower surfaces comprising at is formed. そして、切欠き部34にそれぞれが電気的に独立した電極34a,34bが形成されており、搭載部31aに搭載される複数個の発光素子33の電極が4隅の電極34a,34bの何れかに接続されている(例えば、下記特許文献2参照)。 Then, each of the cutout portions 34 are electrically independent electrodes 34a, 34b are formed, electrodes are four corners of the electrode 34a of the plurality of light emitting elements 33 mounted on the mounting portion 31a, one of 34b connected to (for example, see Patent Document 2). これにより、例えば搭載部31aに3個の発光素子33を搭載した場合、4つの電極34a,34bのうち1つを共通電極34a、他の3つを個別の電極34bとして3個の発光素子33が接続可能となる。 Thus, for example, when three light emitting elements 33 mounted on the mounting portion 31a, 4 one electrode 34a, 1 single common electrode 34a of 34b, three light emitting element 33 to the other three as individual electrodes 34b but it is possible connection. そしてこの3個の発光素子33を青、緑、赤の3原色とすればフルカラー発光とすることができる。 And it can be the three light emitting elements 33 and blue, green, and full-color emission if the red of the three primary colors.
【0012】 [0012]
また、パッケージの上方へ放射する光の輝度を大きくするために、さらに発光素子33を搭載している。 Further, in order to increase the brightness of the light emitted upwards of the package, and further mounting the light emitting element 33. 例えばフルカラー発光させる際に3原色の発光素子33は色ごとに光の輝度に差があり、特に青の発光素子33の輝度が小さいため、すでに搭載されている青の発光素子33の他に青の発光素子33を1個追加して輝度を大きくしている。 For example a full-color light emission is allowed when the 3 primary colors of the light emitting element 33 there is a difference in luminance of the light for each color, in particular for the brightness of the blue light-emitting element 33 is small, in addition to blue blue light emitting element 33 that is already mounted and to increase the luminance of the light emitting element 33 and add one. なお、追加した発光素子33は、すでに搭載されている発光素子33と電気的に同じ接続となるように電極34a,34bに接続されている。 The light emitting element 33 added is already connected the light emitting element 33 electrically same connection so as to electrodes 34a mounted to 34b.
【0013】 [0013]
【特許文献1】 [Patent Document 1]
特開平14−232017号公報(図1,図4) JP 14-232017 discloses (Fig. 1, Fig. 4)
【特許文献2】 [Patent Document 2]
特開平5−13818号公報【0014】 Japanese Unexamined Patent Publication No. 5-13818 [0014]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
しかしながら、上記の特許文献1のパッケージによると、基体11の下面に延出しているメタライズ配線導体14a,14bの面積が小さいため、基体11用のグリーンシートにメタライズ配線導体14a,14bの形状に金属ペーストを印刷塗布する際、金属ペーストが表面張力により盛り上がりメタライズ配線導体14a,14bを一定の厚みに印刷することができず、メタライズ配線導体14aとメタライズ配線導体14bとで高さのバラツキが発生する。 However, according to Patent Document 1 package of the metal for metallized wiring conductor 14a that extends to the lower surface of the base 11, the area of ​​the 14b small, metallized wiring conductors 14a in the green sheet for the base 11, the shape of 14b when printing applying a paste, metallized wiring conductors 14a swelling metal paste by the surface tension can not be printed 14b constant thickness, variations in height may occur between the metallized wiring conductors 14a and metallized wiring conductor 14b . すると、メタライズ配線導体14a,14bを外部電気回路基板の配線導体に半田を介して接続した際に、発光装置が外部電気回路基板に対して傾斜した状態で実装される。 Then, metallized wiring conductors 14a, when connected 14b the through solder to a wiring conductor of the external electric circuit board, is mounted in a state in which the light-emitting device is inclined with respect to an external electric circuit board. その結果、発光装置のメタライズ配線導体14a,14bと外部電気回路基板の配線導体との間に位置ずれ等が発生するという問題点があった。 As a result, metallized wiring conductor 14a of the light emitting device, positional deviation or the like between the 14b and the external electric circuit board of the wiring conductor is disadvantageously generated.
【0015】 [0015]
また、上記の特許文献2のパッケージによると、基板31の4隅に平面視で略円弧状であって上下面にわたって切り欠かれた切欠き部34に電極34a,34bが形成されているため、切欠き部34がパッケージの搬送時にパッケージ同士の衝突などによって外力を受けて欠けや割れが発生してしまい、電極34a,34bとして機能しなくなったり、電極34a,34bが形成されている切欠き部34を外部回路基板の配線導体に半田を介して接続した際に、切欠き部34と外部回路基板の配線導体との間に形成される半田のメニスカスの量が少なく、接合強度が小さいという問題点があった。 Further, according to Patent Document 2 packages above, since the electrode 34a to the cutout portion 34 is cut out over the upper and lower surfaces a substantially arc shape in a plan view of the four corners of the substrate 31, 34b are formed, cutout portion 34 would lack or crack is generated by an external force, such as by packages conflict during transport of the package, the electrode 34a, or no longer functions as 34b, electrodes 34a, notches 34b are formed 34 when connected via solder to the wiring conductor of the external circuit board, it reduces the amount of the meniscus of the solder which is formed between the cutout portion 34 and the external circuit board of the wiring conductor, a problem that the bonding strength is small there was a point.
【0016】 [0016]
さらに、上記の特許文献2のパッケージによると、例えばフルカラー発光させる際に3原色の発光素子33は色ごとに光の輝度に差があり、特に青の発光素子33の輝度が小さいため、すでに搭載されている青の発光素子33の他に青の発光素子33を1個追加して輝度を大きくしているが、この構成では、輝度を大きくするために搭載された発光素子33の電気的接続がすでに搭載されている発光素子33と同じ接続となるように電極34a,34bに接続されている。 Further, according to Patent Document 2 packages above, e.g. full-color light emission is allowed when the 3 primary colors of the light emitting element 33 there is a difference in luminance of the light for each color, in particular for the brightness of the blue light-emitting element 33 is small, already mounted While increasing the brightness in addition to the blue light-emitting element 33 of the blue light-emitting element 33 which adds one is, in this configuration, electrical connection of the light emitting element 33 mounted in order to increase the brightness electrodes 34a to but the same connected to the light emitting element 33 that is already mounted, is connected to 34b. そのため、すでに搭載されている発光素子33と追加した発光素子33の電圧や光波長、輝度などをそれぞれ単独に微調整することができないという問題点があった。 Therefore, there is a problem that already voltage or light wavelength of the light emitting element 33 added light-emitting element 33 mounted, it is impossible to adjust precisely to singly luminance.
【0017】 [0017]
従って、本発明は上記従来の問題点に鑑み完成されたものであり、その目的は、パッケージの機械的強度を大きくして、外部電気回路基板の配線導体に位置ずれや傾斜もなく正確に実装できるとともに、接合強度の大きい信頼性の高い実装が可能となり、かつフルカラー発光できるように複数個の発光素子を搭載可能なパッケージおよび発光装置を提供することにある。 Accordingly, the present invention has been completed in view of the above problems, and its object is to increase the mechanical strength of the package, precisely implemented without displacement and inclined to the wiring conductor of the external electric circuit board may together is to large reliable implementation of joint strength can be the result, and provides a mountable package and a light emitting device a plurality of light emitting elements to allow full color emission.
【0018】 [0018]
【課題を解決するための手段】 In order to solve the problems]
本発明の発光素子収納用パッケージは、上面に複数個の発光素子を搭載するための搭載部を有する略四角平板状の基体の上面に、前記発光素子を収容するための貫通孔を有する枠体を積層して成る発光素子収納用パッケージであって、前記基体は、4つの側面のそれぞれに前記枠体の下方に位置して上下面にわたって切り欠かれた平面視で円弧状の切欠き部を有し、該切欠き部の内周面に側面導体が形成され、該側面導体に前記発光素子のいずれかの電極が電気的に接続されることを特徴とする。 Package for housing a light-emitting element of the present invention, the upper surface of the substantially rectangular plate-shaped base body having a mounting portion for mounting a plurality of light emitting elements on the top surface, the frame having a through hole for receiving said light emitting element a package for housing a light-emitting element formed by laminating, said base body, an arcuate notch in the notched viewed over upper and lower surfaces located below the frame body to each of the four side surfaces a, the side conductor is formed on the inner peripheral surface of the cutout portion, one of the electrodes of the light emitting element in the side surface conductor, characterized in that it is electrically connected.
【0019】 [0019]
本発明の発光素子収納用パッケージは、上面に複数個の発光素子を搭載するための搭載部を有する略四角平板状の基体は、4つの側面のそれぞれに枠体の下方に位置して上下面にわたって切り欠かれた平面視で円弧状の切欠き部を有し、切欠き部の内周面に側面導体が形成され、側面導体に発光素子のいずれかの電極が電気的に接続されることから、基体の角部に円弧状の切欠き部を形成した場合よりも外力に対する機械的強度が大きくなり欠けや割れがなくなる。 Package for housing a light-emitting element of the present invention, a substantially rectangular flat plate-like base having a mounting portion for mounting a plurality of light emitting elements on the top surface, the upper and lower surfaces located below the frame to each of the four side surfaces has an arc-shaped notch in-away-away plan view over, the side conductor is formed on the inner peripheral surface of the notch, that one of the electrodes of the light emitting element to the side conductor are electrically connected from the mechanical strength against the external force than the case of forming the arc-shaped notch on the corner portion of the substrate is increased chipping or cracking is eliminated.
【0020】 [0020]
また、この切欠き部の内周面に形成された側面導体の表面積は、基体の角部に円弧状の切欠き部を形成した場合の側面導体の表面積に比べ約2倍となり、基体の下面に形成された電極パッドを外部電気回路基板の配線導体に半田を介して接続する際に、切欠き部の側面導体と外部電気回路基板の配線導体との間に形成される半田のメニスカスが約2倍の半田の量をもって形成されるため、接合強度を大きくすることができる。 Further, the surface area of ​​the notch portion side surface conductor formed on the inner circumferential surface of the approximately doubled compared to the surface area of ​​the side conductor in the case of forming an arcuate notch on the corner portion of the substrate, the lower surface of the base body when connected via the solder electrode pads formed on the external electric circuit board of the wiring conductor, solder meniscus about to be formed between the side surface conductor and the external electric circuit board of the wiring conductor of the notch because it is formed with a quantity of solder twice, it is possible to increase the bonding strength.
【0021】 [0021]
また、基体の下面の各電極パッドが外部電気回路基板の配線導体に半田で接合される際に、半田の量を多くして形成されたメニスカスは、各電極パッド間の半田の高さパラツキを吸収するように働き、各電極パッド間の高さバラツキを抑え、かつ接合状態を強固なものとすることができる。 Further, when the electrode pads of the lower surface of the substrate is bonded by solder to the wiring conductor of the external electric circuit board, a solder quantity many and meniscus formed by the solder height Paratsuki between the electrode pads act to absorb, suppress the height variation between the electrode pads and the bonding state can be made firm. これにより、外部電気回路基板の配線導体に平坦な状態で正確な位置に実装させることができる。 Thus, it is possible to mount in the correct position in a flat state to a wiring conductor of the external electric circuit board.
【0022】 [0022]
さらに、基体の上面に形成された、側面導体と発光素子とを接続するためのメタライズ配線導体が短線化されるため、メタライズ配線導体の抵抗やインダクタンスが小さくなり、発光素子を高効率で発光させることが可能となる。 Further, formed on the upper surface of the substrate, for metallized wiring conductors for connecting the side conductor and the light emitting element is shorter line of the resistance and inductance of the metallized wiring conductor is reduced, thereby the light emitting element with high efficiency it becomes possible.
【0023】 [0023]
本発明の発光素子収納用パッケージにおいて、好ましくは、前記複数個の発光素子の少なくとも1個は他の発光素子の輝度調整用であり、該輝度調整用発光素子の電極が電気的に接続される前記側面導体は外部の輝度調整回路に電気的に接続されていることを特徴とする。 In the light-emitting element storing package of the present invention, preferably, at least one of said plurality of light emitting devices is for brightness adjustment of other light emitting elements, electrodes of luminance adjusting light emitting element is electrically connected the side conductor is characterized in that it is electrically connected to an external luminance adjustment circuit.
【0024】 [0024]
本発明の発光素子収納用パッケージは、好ましくは複数個の発光素子の少なくとも1個は他の発光素子の輝度調整用であり、その輝度調整用発光素子の電極が電気的に接続される側面導体は外部の輝度調整回路に電気的に接続されていることから、複数個または複数種の発光素子の電圧、光波長、輝度などの調整を、個々にまたは種類毎に行なうことができるようになり、輝度等の微調整が可能となる。 Package for housing a light-emitting element of the present invention is preferably at least one of a plurality of light emitting elements is for brightness adjustment of other light emitting elements, the side conductor electrodes of the brightness adjusting light emitting element is electrically connected consists in being electrically connected to an external luminance adjustment circuit, the voltage of a plurality or more of the light emitting device, the light wavelength, the adjustments such as brightness, can be performed for each individual or type , it is possible to finely adjust the brightness and the like. 例えばフルカラー発光できるように、青、緑、赤の3原色の発光素子を搭載した場合、3原色の発光素子に対応して3個の輝度調整用発光素子を搭載し、3原色のそれぞれの発光素子の輝度等の微調整を行なうことができる。 For example, as it can be full color emission, blue, green, when mounting the light emitting element of red of the three primary colors, corresponding to the light emitting element of the three primary colors mounted three luminance adjusting light emitting element, each of the light emission of the three primary colors it is possible to perform fine adjustment of brightness or the like of the element. その結果、複数個または複数種の発光素子のそれぞれの色の強さや輝度を精度よく調整することが可能となる。 As a result, it becomes possible to adjust each color intensity or brightness of a plurality or more of the light emitting element precisely.
【0025】 [0025]
本発明の発光装置は、上記本発明の発光素子収納用パッケージと、前記搭載部に搭載された発光素子と、該発光素子を覆う透明樹脂とを具備したことを特徴とする。 The light emitting device of the present invention is characterized by comprising a package for housing a light-emitting element of the present invention, a light emitting element mounted on the mounting portion, and a transparent resin covering the light emitting element.
【0026】 [0026]
本発明の発光装置は、上記の構成により、簡略な構成で高い発光効率を有する高性能のものとなるとともに、外部電気回路基板の配線導体に位置ずれや傾斜もなく正確に実装することができる信頼性の高いものとなる。 The light emitting device of the present invention, the above structure, it becomes that of high performance having a high luminous efficiency with a simple configuration, it is possible to accurately implement without displacement and inclined to the wiring conductor of the external electric circuit board and high reliability.
【0027】 [0027]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
本発明の発光素子収納用パッケージを以下に詳細に説明する。 The light-emitting element storing package of the present invention will be described in detail below. 図1は、本発明のパッケージの実施の形態の一例を示す平面図であり、図2はその断面図である。 Figure 1 is a plan view showing an example of an embodiment of a package of the present invention, FIG. 2 is a sectional view thereof. 1は基体、2は枠体であり、主としてこれらで3個の発光素子3、例えば青、緑、赤の3原色の発光素子3でフルカラー発光させるためのパッケージが構成されている。 1 substrate, 2 is a frame body, and a package for full-color light emission mainly those with three light emitting element 3, for example, blue, green, light emitting element 3 of the red of the three primary colors.
【0028】 [0028]
本発明の基体1は、酸化アルミニウム質焼結体(アルミナセラミックス)、窒化アルミニウム質焼結体等のセラミックスから成る略四角平板状のものであり、複数の発光素子3を支持する支持体であり、その上面に複数の発光素子3を搭載する搭載部1aを有している。 Substrate 1 of the present invention, an aluminum oxide sintered body (alumina ceramics) are of substantially rectangular flat plate made of ceramics of the aluminum nitride sintered body or the like, be a support for supporting a plurality of light emitting elements 3 , and a mounting portion 1a for mounting a plurality of light emitting elements 3 on its upper surface. 基体1が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム、酸化珪素、酸化マグネシウム、酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシート(セラミック生シート)を得、しかる後、グリーンシートに適当な打ち抜き加工を施してこれを複数枚積層し、高温(約1600℃)で焼成することによって製作される。 When the substrate 1 is made of, for example sintered aluminum oxide, aluminum oxide, silicon oxide, magnesium oxide, suitable organic binder to the raw material powder such as calcium oxide, a solvent, etc. added and mixed mud 漿状 and without, this conventional to obtain a green shaped into a sheet-like sheet (ceramic raw sheet) by a known doctor blade method or calendar roll method or the like, after which this laminating a plurality subjected to appropriate punching the green sheet, high temperature (about It is fabricated by sintering at 1600 ° C.).
【0029】 [0029]
また、基体1は、搭載部1aおよびその周辺にメタライズ配線導体4a,4bが被着形成されている。 Further, the substrate 1 is metallized wiring conductors 4a, 4b are deposited and formed on the mounting portion 1a and its periphery. このメタライズ配線導体4a,4bは、基体1の4つの側面のそれぞれに上下面にわたって切り欠かれ、平面視で円弧状の切欠き部7の内周面に形成された側面導体7a,7bを介して、基体1下面に形成された電極パッド8a,8bに電気的に接続されている。 The metallized wiring conductors 4a, 4b are cut out over the upper and lower surfaces to each of the four sides of the base body 1, arc-shaped notch 7 of the inner peripheral surface formed side conductors 7a, and 7b through in plan view Te, the electrode pads 8a formed on the substrate 1 a lower surface, and is electrically connected to 8b. また、メタライズ配線導体4a,4b、側面導体7a,7bおよび電極パッド8a,8bは、WやMo等の金属粉末のメタライズ層から成り、パッケージ内部に収容する3個の発光素子3を外部に電気的に接続するための導電路として機能している。 Also, metallized wiring conductors 4a, 4b, the side conductor 7a, 7b and the electrode pads 8a, 8b consists metallized layer of a metal powder such as W or Mo, an electric three light-emitting element 3 which houses inside the package to the outside functions as a conductive path for connecting.
【0030】 [0030]
そして、メタライズ配線導体4aが接続された搭載部1aには、発光ダイオード等の3個の発光素子3が金−シリコン合金や銀−エポキシ樹脂等の導電性接合材により固着されているとともに、残りの3つのメタライズ配線導体4bの搭載部1a周辺のそれぞれの部位には、3個の発光素子3の電極のそれぞれがボンディングワイヤ5を介して電気的に接続されている。 Then, the mounting portion 1a metallized wiring conductor 4a is connected, three light emitting element 3 gold, such as a light-emitting diode - silicon alloy and silver - with being fixed by a conductive bonding material such as an epoxy resin, the remaining of the respective sites around the mounting portion 1a of the three metallized wiring conductor 4b, each three light emitting element 3 of the electrode are electrically connected through bonding wires 5. また、発光素子3は、搭載部1aおよびメタライズ配線導体4bにフリップチップ実装されていても構わない。 Further, the light-emitting element 3 may be flip-chip mounted on the mounting portion 1a and the metallized wiring conductor 4b. そして、基体1下面の電極パッド8a,8bが外部電気回路基板の配線導体に接続されることで発光素子3の各電極と電気的に接続され、発光素子3へ電力が供給される。 Then, the substrate 1 the lower surface of the electrode pads 8a, 8b are electrically connected with each electrode of the light-emitting element 3 by being connected to the wiring conductor of the external electric circuit board, and power is supplied to the light emitting element 3.
【0031】 [0031]
メタライズ配線導体4a,4b、側面導体7a,7bおよび電極パッド8a,8bは、例えばWやMo等の高融点金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを、基体1となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、基体1の所定位置に被着形成される。 Metallized wiring conductors 4a, 4b, the side conductor 7a, 7b and the electrode pads 8a, 8b, for example W or refractory metal powder in a suitable organic solvent such as Mo, a metal paste obtained by admixing the solvent, the substrate 1 by keeping applied by printing in a predetermined pattern in advance by a screen printing method on the green sheet to be, it is deposited and formed at predetermined positions of the base 1.
【0032】 [0032]
なお、メタライズ配線導体4a,4b、側面導体7a,7bおよび電極パッド8a,8bの露出する表面にNiやAu等の耐蝕性に優れる金属を1〜20μm程度の厚みで被着させておくのがよく、これらの導体が酸化腐蝕するのを有効に防止することができるとともに、メタライズ配線導体4aと発光素子3、メタライズ配線導体4bとボンディングワイヤ5との接合、電極パッド8a,8bおよび側面導体7a,7bと外部電気回路の配線導体との接合を強固なものとすることができる。 Incidentally, metallized wiring conductors 4a, 4b, the side conductor 7a, 7b and the electrode pads 8a, to leave a metal excellent in corrosion resistance such as Ni or Au on the exposed surface of 8b was deposited at a thickness of about 1~20μm well, it is that these conductors can effectively be prevented from being oxidized corrosion, metallized wiring conductor 4a and the light-emitting element 3, bonding between the metallized wiring conductor 4b and the bonding wire 5, the electrode pads 8a, 8b and the side conductor 7a the bonding between 7b and the external electric circuit of the wiring conductor can be made firm. したがって、より好ましくは、メタライズ配線導体4a,4b、側面導体7a,7bおよび電極パッド8a,8bの露出表面には、厚さ1〜10μm程度のNiめっき層と厚さ0.1〜3μm程度のAuめっき層とが電解めっき法や無電解めっき法により順次被着されているのがよい。 Therefore, more preferably, metallized wiring conductors 4a, 4b, the side conductor 7a, 7b and the electrode pads 8a, the 8b exposed surface of, a thickness of about 1 to 10 [mu] m Ni plating layer and a thickness of about 0.1~3μm it is preferable that the Au-plated layer are sequentially deposited by electrolytic plating or electroless plating.
【0033】 [0033]
なお、切欠き部7は、基体1用のグリーンシートの4つの側面となる部位を打ち抜き金型で打ち抜いて形成する。 Incidentally, notch 7 is formed by punching a portion serving as four sides of the green sheet for the substrate 1 by a punching die. このとき、切欠き部7は、枠体2の下方に位置して平面視で枠体2の厚みより小さい曲率半径の円弧状とされてグリーンシートの上下面にわたって切り欠かれるように打ち抜いて形成され、側面導体7a,7bが切欠き部7の側面に形成される。 At this time, the cutout portion 7 is punched so positioned in the lower frame 2 is a plan view in the frame body 2 of smaller than the radius of curvature of the arc-shaped thickness are cut across the upper and lower surfaces of the green sheet formation is, the side conductor 7a, 7b are formed on the side surface of the notch 7.
【0034】 [0034]
枠体2は、基体1と実質的に同じ組成のセラミックスから成り、基体1の上面に積層されて焼結一体化されて接合されている。 Frame 2 is made of a ceramic base body 1 and substantially the same composition, it is joined to be integrated sintered laminated on the upper surface of the base body 1. 枠体2は、グリーンシートに予め、その中央部に発光素子3を収容するための断面形状が略円形や略四角形の貫通孔2aを打ち抜き加工で形成するとともに、これを複数枚積層し、基体1となるグリーンシートの上に積層して焼結一体化して基体1の上面に接合される。 Frame 2 is previously on the green sheet, with its cross-sectional shape for housing the light emitting element 3 in the central portion is formed by punching a through hole 2a of the substantially circular or substantially square, which laminating a plurality, substrate and laminated on the green sheet which becomes 1 integrated sintered is joined to the upper surface of the base body 1.
【0035】 [0035]
また、枠体2の貫通孔2aは、枠体2の上面側開口が下面側開口よりも大きく形成されおり、貫通孔2aの内周面は基体1の上面に対する角度θが35〜70°であることが好ましく、70°を超えると貫通孔2a内に収容する発光素子3の光を外部に対して良好に反射することが困難となる傾向にあり、35°未満では、貫通孔2aをそのような角度で打ち抜き法で安定的かつ効率良く形成することが困難となるとともに、パッケージが大型化される傾向にある。 The through-hole 2a of the frame 2, the upper surface side opening of the frame 2 are formed larger than the lower surface side opening, the inner peripheral surface of the through hole 2a at an angle θ is 35 to 70 ° with respect to the upper surface of the base body 1 preferably there tend to be difficult to satisfactorily reflect light of the light-emitting element 3 to the outside be accommodated in the through hole 2a greater than 70 °, is less than 35 °, the through hole 2a together it is difficult to stably and efficiently formed by stamping at an angle such that, tends to package is large.
【0036】 [0036]
また、枠体2は、枠体2用のグリーンシートの中央部を打ち抜き金型を用いて打ち抜くことによって形成されるが、このとき、枠体2用のグリーンシートに形成される貫通孔2aの内周面をグリーンシートの一方の主面から他方の主面に向けて35〜70度の角度θで広がるように形成する。 Further, the frame 2 is formed by punching with a central portion of the punching die of the green sheet for the frame 2, in this case, through-holes 2a formed in the green sheet for the frame 2 the inner peripheral surface of one main surface of the green sheet toward the other main surface is formed to extend in the 35-70 degree angle theta. このように、貫通孔2aの内周面がグリーンシートの一方の主面から他方の主面に向けて35〜70度の角度θで広がるように形成することにより、貫通孔2aの内周面が基体1の上面に対して35〜70度の角度θで外側に広がるように形成される。 Thus, by the inner circumferential surface of the through hole 2a is formed so as to spread in the 35-70 degree angle θ toward the one main surface of the green sheet on the other main surface, the inner peripheral surface of the through hole 2a There is formed so as to spread outward at an angle of 35-70 degrees with respect to the top of the base body 1 theta. そして、貫通孔2aはその断面形状は略円形がよく、貫通孔2a内に収容される発光素子3が発する光を貫通孔2aの内周面で全方向に満遍なく反射させて外部に極めて均一に放射することができる。 The through-hole 2a its cross-sectional shape may have substantially circular, through hole light emitting element 3 emits contained within 2a by uniformly reflected in all directions by the inner circumferential surface of the through hole 2a very uniformly to the outside it is possible to radiation.
【0037】 [0037]
また、貫通孔2aの開口の形状は、略円形状、略四角形状、略楕円形状、略多角形状等の種々の形状で構わないが、貫通孔2aの製作の容易さや形状の安定化等の点から、枠体2の上面側開口と下面側開口が略同形状であるのが好ましい。 The opening shape of the through hole 2a is substantially circular, substantially rectangular, substantially elliptical shape, but may in various forms such as a substantially polygonal shape, the stabilization such ease and shape of fabrication of the through hole 2a from the point, the upper surface side opening and a lower surface side opening of the frame body 2 is preferably substantially the same shape. また、開口の形状として特に略円形状がより好ましく、この場合、貫通孔2aに収容された発光素子3が発する光を貫通孔2aの内周面で効率良く反射させて外部に放射することができる。 Further, particularly more preferably substantially circular shape of the opening, in this case, the light emitted by the light emitting element 3 housed in the through hole 2a and efficiently is reflected by the inner circumferential surface of the through hole 2a to be emitted to the outside it can.
【0038】 [0038]
また、枠体2の貫通孔2aの内周面の略全面には、メタライズ金属層6aおよび金属めっき層6bが形成されているのが好ましく、例えば、WやMo等の金属粉末のメタライズ金属層6a上にNi,Au,Ag等の金属めっき層6bが被着されている。 In addition, the substantially entire surface of the inner peripheral surface of the through hole 2a of the frame 2 is preferably metallized metal layer 6a and the metal plating layer 6b is formed, for example, metallized metal layer of a metal powder such as W or Mo Ni on the 6a, Au, a metal plating layer 6b of Ag or the like is deposited. そして、金属めっき層6bは発光素子3が発光する光に対する反射率を80%以上であることが好ましいが、金属めっき層6bがNi,Au,Ag等から成ることによって、発光素子3が発光する光に対する反射率を80%以上とすることができる。 Then, the metal plating layer 6b is are preferably light-emitting element 3 is not less than 80% reflectivity for light emitting, metallic plating layer 6b is Ni, Au, by made of Ag or the like, the light-emitting element 3 emits light the reflectance for light can be 80% or more. 反射率が80%未満であると、枠体2の貫通孔2aに収容された発光素子3が発光する光を良好に反射することが困難となる。 When the reflectance is less than 80%, the light-emitting element 3 housed in the through hole 2a of the frame 2 becomes difficult to satisfactorily reflect light emitted.
【0039】 [0039]
また、貫通孔2aの内周面略全面に形成された金属めっき層の表面の算術平均粗さRaは1〜10μmが好ましい。 Also, arithmetic mean roughness Ra of the surface of the inner circumferential surface substantially entire surface formed metal plating layer of the through hole 2a is 1~10μm is preferred. 1μm未満であると、貫通孔2a内に収容される発光素子3が発する光を均一に反射させることができずに、反射する光の強さに偏りが発生しやすくなる。 If it is less than 1 [mu] m, not able to uniformly reflect light emitting element 3 emits housed in the through hole 2a, unevenness is likely to occur in the intensity of the reflected light. 10μmを超えると、貫通孔2a内に収容される発光素子3が発する光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。 Exceeds 10 [mu] m, light-emitting element 3 is accommodated light is scattered to emit in the through hole 2a, it becomes difficult to uniformly emitted to the outside with high reflectance reflected light.
【0040】 [0040]
このように、本発明のパッケージによれば、上面に複数個の発光素子3を搭載するための搭載部1aを有する略四角平板状の基体1の4つの側面のそれぞれに、枠体2の下方に位置して上下面にわたって切り欠かれ、平面視で略半円の円弧状の切欠き部7としたことから、基体1の角部に円弧状の切欠き部7を形成した場合よりも外力に対する機械的強度が大きくなり、欠けや割れがなくなる。 Thus, according to the package of the present invention, each of approximately four sides of the rectangular plate-shaped base body 1 having a mounting portion 1a for mounting a plurality of light emitting elements 3 on the upper surface, the lower frame 2 located is cut away over the upper and lower surfaces, since it has an arcuate notch 7 of the substantially semicircular in plan view, the external force than the case of forming the arc-shaped notch 7 at the corners of the base 1 mechanical strength against the increases, there is no chipping or cracking. また、この切欠き部7の内周面に形成された側面導体7a,7bの表面積は、基体1の角部に円弧状の切欠き部7を形成した場合の側面導体の表面積に比べ約2倍になっており、基体1の下面に形成された電極パッド8a,8bを外部電気回路基板の配線導体に半田を介して接続する際に、切欠き部7の側面導体7a,7bと外部電気回路基板の配線導体との間に形成される半田のメニスカスが約2倍の半田の量で形成されるため、接合強度を大きくすることができる。 Also, the notch 7 of the inner peripheral surface formed side conductor 7a, the surface area of ​​7b is approximately compared to the surface area of ​​the side conductor in the case of forming an arcuate notch 7 at the corners of the base 1 2 has become doubled, when connecting via the solder electrode pads 8a formed on the lower surface of the base body 1, the 8b to wiring conductors of the external electric circuit board, notch 7 of the side conductor 7a, 7b and external electrical since the solder meniscus formed between the circuit board of the wiring conductor is formed in an amount of solder about twice, it is possible to increase the bonding strength.
【0041】 [0041]
また、基体の下面の各電極パッド8a,8bが外部電気回路基板の配線導体に半田で接合される際に、半田の量を多くして形成されたメニスカスは、各電極パッド8a,8b間の半田の高さパラツキを吸収するように働き、各電極パッド8a,8b間の高さバラツキを抑え、かつ接合状態を強固なものとすることができる。 Further, the electrode pads 8a of the lower surface of the substrate, when the 8b are joined by soldering to the wiring conductor of the external electric circuit board, solder amount more by meniscuses formed in the respective electrode pads 8a, between 8b serves to absorb the solder height Paratsuki, the electrode pads 8a, reducing the height variation between 8b, and the bonding state can be made firm. これにより、外部電気回路基板の配線導体に平坦な状態で正確な位置に実装させることができる。 Thus, it is possible to mount in the correct position in a flat state to a wiring conductor of the external electric circuit board.
【0042】 [0042]
さらに、基体1の上面に形成された、側面導体7a,7bと発光素子3とを接続するためのメタライズ配線導体4a,4bが短線化されるため、メタライズ配線導体4a,4bの抵抗やインダクタンスが小さくなり、発光素子3を高効率で発光させることが可能となる。 Further, formed on the upper surface of the base body 1, the side conductor 7a, metallized wiring conductors 4a for connecting 7b and the light-emitting element 3, since 4b is short Senka, metallized wiring conductors 4a, the resistance and inductance of 4b It decreases, it becomes possible to emit a light-emitting element 3 at a high efficiency.
【0043】 [0043]
この電極パッド8a,8bは、表面の平坦度が20μm/10mm以下であることが好ましい。 The electrode pads 8a, 8b are preferably surface flatness is 20 [mu] m / 10 mm or less. 平坦度が20μm/10mmを超えると、外部電子回路基板の配線導体に半田を介して接続する際に、電極パッド8a,8b間に高さのばらつきが発生し、電極パッド8a,8bを外部電子回路基板の配線導体の正確な位置に実装するのが困難となる。 If the flatness exceeds 20 [mu] m / 10 mm, when connecting via a solder to a wiring conductor of the external electric circuit board, the electrode pads 8a, variation in height is generated between 8b, an external electron electrode pads 8a, and 8b it is difficult to implement in the correct position of the circuit board of the wiring conductor.
【0044】 [0044]
また、電極パッド8a,8bは、略均等に配置され、その面積が基体1の下面の面積に対して15〜40%であることが好ましい。 The electrode pads 8a, 8b are substantially uniformly arranged, it is preferable that the area of ​​15 to 40% relative to the area of ​​the lower surface of the substrate 1. 15%未満であると、電極パッド8a,8bの平坦性が劣化し易くなり、40%を超えると、電極パッド8a,8bが短絡する危険性が高くなる。 If it is less than 15%, more likely electrode pads 8a, flatness 8b is deteriorated, and when it exceeds 40%, the risk of the electrode pads 8a, 8b are short-circuited becomes higher.
【0045】 [0045]
また、切欠き部7は枠体2の下方に位置していることから、枠体2の貫通孔2a内に充填される透明樹脂が切欠き部7へ流れ出すのを有効に防止して封止が良好なものとなる。 Also, the notch 7 that is positioned in the lower frame 2, the transparent resin filled in the through hole 2a of the frame body 2 is effectively prevented from flowing into the notch 7 sealing the thing is good.
【0046】 [0046]
また、本発明のパッケージは、好ましくは複数個の発光素子3の少なくとも1個は他の発光素子3の輝度調整用であり、この輝度調整用発光素子3の電極が電気的に接続される側面導体7a,7bは外部の輝度調整回路に電気的に接続されていることから、複数個または複数種の発光素子3の電圧、光波長、輝度などの調整を、個々にまたは種類毎に行なうことができるようになり、輝度等の微調整が可能となる。 Also, the package of the present invention, the side surface preferably at least one of a plurality of light-emitting element 3 is for brightness adjustment of the other light-emitting element 3, the electrode of the brightness adjusting light emitting element 3 is electrically connected conductors 7a, 7b from being electrically connected to an external luminance adjustment circuit, the voltage of the light-emitting element 3 of the plurality or more, the light wavelength, the adjustments such as brightness, to be performed for each individual or type will be able to, it is possible to finely adjust the brightness and the like. 例えば、図7に示すように、フルカラー発光できるように、青、緑、赤の3原色の発光素子13を搭載した場合、3原色の発光素子13に対応して3個の輝度調整用発光素子13aを搭載し、輝度調整用発光素子13aの電極を発光素子13とは電気的に独立した外部の輝度調整回路に電気的に接続されている側面導体17c,17dに接続することで、3原色のそれぞれの発光素子13の輝度等の微調整を行なうことができる。 For example, as shown in FIG. 7, to allow full color emission, blue, green, when mounting the light emitting element 13 of the red of the three primary colors, three luminance adjusting light emitting element corresponding to the light emitting element 13 of the three primary colors 13a was mounted, by connecting to the side conductor 17c, 17d which are electrically independent external luminance adjustment circuit electrically connected to the light emitting element 13 of the electrode of the brightness adjusting light emitting element 13a, 3 primary colors it is possible to perform fine adjustment such as luminance of each light-emitting element 13. その結果、複数個または複数種の発光素子13のそれぞれの色の強さや輝度を精度よく調整することが可能となる。 As a result, it becomes possible to adjust each color intensity or brightness of a plurality or more of the light emitting device 13 precisely.
【0047】 [0047]
なお、図7において、12は基体、15はボンディングワイヤ、17a,17bは発光素子13の電極がボンディングワイヤ15を介して接続される側面導体である。 In FIG. 7, 12 is a substrate, 15 is a bonding wire, 17a, 17b is a side conductor electrode of the light emitting element 13 is connected via a bonding wire 15.
【0048】 [0048]
かくして、本発明のパッケージによれば、基体1の搭載部1aに3個の発光素子3を搭載するとともに3個の発光素子3の何れかの電極をメタライズ配線導体4bにボンディングワイヤ5を介して電気的に接続し、しかる後、発光素子3を覆うように透明樹脂を設けて発光素子3を封止することによって発光装置となる。 Thus, according to the package of the present invention, through a bonding wire 5 three one electrode of the light-emitting element 3 with mounting the three light emitting element 3 on the mounting portion 1a of the base 1 to metallized wiring conductor 4b electrically connected, after which the light-emitting device by sealing the light-emitting element 3 is provided a transparent resin so as to cover the light-emitting element 3. 発光素子3を覆う透明樹脂は、枠体2の内側に充填されていてもよい。 A transparent resin covering the light-emitting element 3 may be filled inside the frame body 2. また、枠体2の上面にガラス,石英,サファイア,透光性樹脂等からなる透光性蓋体を接合してもよい。 The glass on the upper surface of the frame 2, quartz, sapphire, may be joined to the transparent cover made of a translucent resin or the like. また、本発明の発光装置は、発光ダイオード等の発光素子3を複数個収納した小型のものであることから、個々に蓋をするよりも透明樹脂で発光素子3を覆った方が封止の作業性が良く、また内部のボンディングワイヤ5等の位置固定や各導体層の腐蝕防止等の点で有利なものである。 The light emitting device of the present invention, the light-emitting element 3 such as a light emitting diode since it is of small size and multiple storage, better to cover the light-emitting element 3 with the transparent resin than individually the lid sealing good workability, also those favorable in terms of corrosion prevention of internal bonding wires stationary and the conductor layers, such as 5.
【0049】 [0049]
なお、本発明は上述の実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。 The present invention is not limited to the embodiments described above, any way no problem is be variously modified within a scope not departing from the gist of the present invention.
【0050】 [0050]
【発明の効果】 【Effect of the invention】
本発明の発光素子収納用パッケージは、上面に複数個の発光素子を搭載するための搭載部を有する略四角平板状の基体は、4つの側面のそれぞれに枠体の下方に位置して上下面にわたって切り欠かれた平面視で円弧状の切欠き部を有し、切欠き部の内周面に側面導体が形成され、側面導体に発光素子のいずれかの電極が電気的に接続されることから、基体の角部に円弧状の切欠き部を形成した場合よりも外力に対する機械的強度が大きくなり欠けや割れがなくなる。 Package for housing a light-emitting element of the present invention, a substantially rectangular flat plate-like base having a mounting portion for mounting a plurality of light emitting elements on the top surface, the upper and lower surfaces located below the frame to each of the four side surfaces has an arc-shaped notch in-away-away plan view over, the side conductor is formed on the inner peripheral surface of the notch, that one of the electrodes of the light emitting element to the side conductor are electrically connected from the mechanical strength against the external force than the case of forming the arc-shaped notch on the corner portion of the substrate is increased chipping or cracking is eliminated.
【0051】 [0051]
また、この切欠き部の内周面に形成された側面導体の表面積は、基体の角部に円弧状の切欠き部を形成した場合の側面導体の表面積に比べ約2倍となり、基体の下面に形成された電極パッドを外部電気回路基板の配線導体に半田を介して接続する際に、切欠き部の側面導体と外部電気回路基板の配線導体との間に形成される半田のメニスカスが約2倍の半田の量をもって形成されるため、接合強度を大きくすることができる。 Further, the surface area of ​​the notch portion side surface conductor formed on the inner circumferential surface of the approximately doubled compared to the surface area of ​​the side conductor in the case of forming an arcuate notch on the corner portion of the substrate, the lower surface of the base body when connected via the solder electrode pads formed on the external electric circuit board of the wiring conductor, solder meniscus about to be formed between the side surface conductor and the external electric circuit board of the wiring conductor of the notch because it is formed with a quantity of solder twice, it is possible to increase the bonding strength.
【0052】 [0052]
また、基体の下面の各電極パッドが外部電気回路基板の配線導体に半田で接合される際に、半田の量を多くして形成されたメニスカスは、各電極パッド間の半田の高さパラツキを吸収するように働き、各電極パッド間の高さバラツキを抑え、かつ接合状態を強固なものとすることができる。 Further, when the electrode pads of the lower surface of the substrate is bonded by solder to the wiring conductor of the external electric circuit board, a solder quantity many and meniscus formed by the solder height Paratsuki between the electrode pads act to absorb, suppress the height variation between the electrode pads and the bonding state can be made firm. これにより、外部電気回路基板の配線導体に平坦な状態で正確な位置に実装させることができる。 Thus, it is possible to mount in the correct position in a flat state to a wiring conductor of the external electric circuit board.
【0053】 [0053]
さらに、基体の上面に形成された、側面導体と発光素子とを接続するためのメタライズ配線導体が短線化されるため、メタライズ配線導体の抵抗やインダクタンスが小さくなり、発光素子を高効率で発光させることが可能となる。 Further, formed on the upper surface of the substrate, for metallized wiring conductors for connecting the side conductor and the light emitting element is shorter line of the resistance and inductance of the metallized wiring conductor is reduced, thereby the light emitting element with high efficiency it becomes possible.
【0054】 [0054]
本発明の発光素子収納用パッケージは、好ましくは複数個の発光素子の少なくとも1個は他の発光素子の輝度調整用であり、その輝度調整用発光素子の電極が電気的に接続される側面導体は外部の輝度調整回路に電気的に接続されていることから、複数個または複数種の発光素子の電圧、光波長、輝度などの調整を、個々にまたは種類毎に行なうことができるようになり、輝度等の微調整が可能となる。 Package for housing a light-emitting element of the present invention is preferably at least one of a plurality of light emitting elements is for brightness adjustment of other light emitting elements, the side conductor electrodes of the brightness adjusting light emitting element is electrically connected consists in being electrically connected to an external luminance adjustment circuit, the voltage of a plurality or more of the light emitting device, the light wavelength, the adjustments such as brightness, can be performed for each individual or type , it is possible to finely adjust the brightness and the like.
【0055】 [0055]
本発明の発光装置は、上記本発明の発光素子収納用パッケージと、搭載部に搭載された発光素子と、発光素子を覆う透明樹脂とを具備したことにより、簡略な構成で高い発光効率を有する高性能のものとなるとともに、外部電気回路基板の配線導体に位置ずれや傾斜もなく正確に実装することができる信頼性の高いものとなる。 The light emitting device of the present invention includes a package for housing a light-emitting element of the present invention, a light emitting element mounted on the mounting portion, by which is provided a transparent resin covering the light emitting element, a high luminous efficiency with a simple configuration with a high-performance ones, and high reliability can be accurately implemented without displacement and inclined to the wiring conductor of the external electric circuit board.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】本発明の発光素子収納用パッケージについて実施の形態の一例を示す平面図である。 1 is a plan view showing an example embodiment for the light-emitting element storing package of the present invention.
【図2】図1の発光素子収納用パッケージの断面図である。 2 is a cross-sectional view of a package for housing a light-emitting element of FIG.
【図3】従来の発光素子収納用パッケージの平面図である。 3 is a plan view of a conventional package for housing a light-emitting element.
【図4】図3の発光素子収納用パッケージのA−A線における断面図である。 Is a cross-sectional view in FIG. 4 A-A line of the light emitting element storing package FIG.
【図5】従来の発光素子収納用パッケージの他の例の断面図である。 5 is a cross-sectional view of another example of a conventional package for housing a light-emitting element.
【図6】従来の発光素子収納用パッケージの他の例の断面図である。 6 is a cross-sectional view of another example of a conventional package for housing a light-emitting element.
【図7】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。 7 is a plan view of a light-emitting element package for housing showing another example of the embodiment of the present invention.
【符号の説明】 DESCRIPTION OF SYMBOLS
1:基体1a:搭載部2:枠体3:発光素子7:切欠き部7a,7b:側面導体8a,8b:電極パッド13a:輝度調整用発光素子 1: substrate 1a: mounting section 2: frame 3: the light-emitting element 7: notch 7a, 7b: the side conductor 8a, 8b: the electrode pads 13a: luminance adjusting light emitting element

Claims (3)

  1. 上面に複数個の発光素子を搭載するための搭載部を有する略四角平板状の基体の上面に、前記発光素子を収容するための貫通孔を有する枠体を積層して成る発光素子収納用パッケージであって、前記基体は、4つの側面のそれぞれに前記枠体の下方に位置して上下面にわたって切り欠かれた平面視で円弧状の切欠き部を有し、該切欠き部の内周面に側面導体が形成され、該側面導体に前記発光素子のいずれかの電極が電気的に接続されることを特徴とする発光素子収納用パッケージ。 The upper surface of a substantially rectangular plate-shaped base body having a mounting portion for mounting a plurality of light emitting elements on the upper surface, for housing a light-emitting element package formed by laminating a frame having a through hole for accommodating the light emitting element a is, the base has an arcuate notch in the notched viewed over upper and lower surfaces located below the frame body to each of the four sides, notch portion inner periphery of the side conductor surface is formed, the light-emitting element storing package, characterized in that one of the electrodes of the light emitting element side surface conductor are electrically connected.
  2. 前記複数個の発光素子の少なくとも1個は他の発光素子の輝度調整用であり、該輝度調整用発光素子の電極が電気的に接続される前記側面導体は外部の輝度調整回路に電気的に接続されていることを特徴とする請求項1記載の発光素子収納用パッケージ。 Said at least one plurality of light emitting devices is for brightness adjustment of other light emitting elements, the side conductor electrically to an external luminance adjustment circuit electrodes of luminance adjusting light emitting element is electrically connected for housing a light-emitting element package according to claim 1, characterized in that it is connected.
  3. 請求項1または請求項2記載の発光素子収納用パッケージと、前記搭載部に搭載された複数個の発光素子と、該複数個の発光素子を覆う透明樹脂とを具備したことを特徴とする発光装置。 Emission of the light-emitting element storing package according to claim 1 or claim 2 wherein, a plurality of light emitting elements mounted on the mounting portion, characterized by comprising a transparent resin covering the plurality several light emitting element apparatus.
JP2003014844A 2002-12-24 2003-01-23 Package for housing light emitting element and light emitting device Pending JP2004253404A (en)

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JP2007294966A (en) * 2006-04-21 2007-11-08 Samsung Electro-Mechanics Co Ltd Led package with multi-level reflection surface structure, and manufacturing method of the same
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US7670872B2 (en) 2004-10-29 2010-03-02 LED Engin, Inc. (Cayman) Method of manufacturing ceramic LED packages
US7772609B2 (en) 2004-10-29 2010-08-10 Ledengin, Inc. (Cayman) LED package with structure and materials for high heat dissipation
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US8134292B2 (en) 2004-10-29 2012-03-13 Ledengin, Inc. Light emitting device with a thermal insulating and refractive index matching material
US7670872B2 (en) 2004-10-29 2010-03-02 LED Engin, Inc. (Cayman) Method of manufacturing ceramic LED packages
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
JP4601404B2 (en) * 2004-11-26 2010-12-22 京セラ株式会社 A light-emitting device and a lighting device
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JP2006196565A (en) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc Package for housing light-emitting device
JP2009231847A (en) * 2006-03-02 2009-10-08 Tokuyama Corp Support for semiconductor device, and manufacturing method therefor
US8586128B2 (en) 2006-04-21 2013-11-19 Samsung Electronics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
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US8246216B2 (en) 2008-10-14 2012-08-21 Ledengin, Inc. Total internal reflection lens with pedestals for LED emitter
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US8430537B2 (en) 2008-10-14 2013-04-30 Ledengin, Inc. Total internal reflection lens for color mixing
US8912023B2 (en) 2009-04-08 2014-12-16 Ledengin, Inc. Method and system for forming LED light emitters
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
US9554457B2 (en) 2009-04-08 2017-01-24 Ledengin, Inc. Package for multiple light emitting diodes
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US7985000B2 (en) 2009-04-08 2011-07-26 Ledengin, Inc. Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers
US9416928B2 (en) 2009-04-08 2016-08-16 Ledengin, Inc. Method and system for forming LED light emitters
US8303141B2 (en) 2009-12-17 2012-11-06 Ledengin, Inc. Total internal reflection lens with integrated lamp cover
US10149363B2 (en) 2010-04-08 2018-12-04 Ledengin, Inc. Method for making tunable multi-LED emitter module
US9482407B2 (en) 2010-04-08 2016-11-01 Ledengin, Inc. Spot TIR lens system for small high-power emitter
US9345095B2 (en) 2010-04-08 2016-05-17 Ledengin, Inc. Tunable multi-LED emitter module
US9080729B2 (en) 2010-04-08 2015-07-14 Ledengin, Inc. Multiple-LED emitter for A-19 lamps
US8858022B2 (en) 2011-05-05 2014-10-14 Ledengin, Inc. Spot TIR lens system for small high-power emitter
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US8773024B2 (en) 2011-05-12 2014-07-08 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
US9816691B2 (en) 2011-05-12 2017-11-14 Ledengin, Inc. Method and system for forming LED light emitters
US9528665B2 (en) 2011-05-12 2016-12-27 Ledengin, Inc. Phosphors for warm white emitters
US9024529B2 (en) 2011-05-12 2015-05-05 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
US9897284B2 (en) 2012-03-28 2018-02-20 Ledengin, Inc. LED-based MR16 replacement lamp
US9234801B2 (en) 2013-03-15 2016-01-12 Ledengin, Inc. Manufacturing method for LED emitter with high color consistency
US9406654B2 (en) 2014-01-27 2016-08-02 Ledengin, Inc. Package for high-power LED devices
US10172206B2 (en) 2014-11-26 2019-01-01 Ledengin, Inc. Compact emitter for warm dimming and color tunable lamp
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