JP2004335495A - Package for light emitting device and light emitting device - Google Patents

Package for light emitting device and light emitting device Download PDF

Info

Publication number
JP2004335495A
JP2004335495A JP2003116404A JP2003116404A JP2004335495A JP 2004335495 A JP2004335495 A JP 2004335495A JP 2003116404 A JP2003116404 A JP 2003116404A JP 2003116404 A JP2003116404 A JP 2003116404A JP 2004335495 A JP2004335495 A JP 2004335495A
Authority
JP
Japan
Prior art keywords
emitting element
light emitting
light
layer
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003116404A
Other languages
Japanese (ja)
Other versions
JP4336136B2 (en
Inventor
Toshiyuki Chitose
敏幸 千歳
Yosuke Moriyama
陽介 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2003116404A priority Critical patent/JP4336136B2/en
Publication of JP2004335495A publication Critical patent/JP2004335495A/en
Application granted granted Critical
Publication of JP4336136B2 publication Critical patent/JP4336136B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To reflect the light from a light emitting element well and to radiate the light uniformly and efficiently to the outside. <P>SOLUTION: The package for a light emitting element is provided with a recess 4 for containing the light emitting element 3 in the upper surface of an insulating substrate 1. A conductor layer 2 for mounting the light emitting element 3 and a wiring layer 5 being connected with the electrodes of the light emitting element 3 are formed on the bottom face of the recess 4. A level difference 4a is formed on the bottom face of the recess 4 such that the part where the conductor layer 2 is formed becomes higher than the part where the wiring layer 5 is formed and the part where the conductor layer 2 is formed becomes higher than the surface of the wiring layer 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオード等の発光素子を用いた液晶表示装置等に用いられる、発光素子を収納するための発光素子収納用パッケージおよび発光装置に関する。
【０００２】
【従来の技術】
従来、発光ダイオード等の発光素子を収納するための発光素子収納用パッケージ（以下、単にパッケージともいう）として、セラミック製のパッケージが用いられており、その一例を図８に示す（例えば、下記の特許文献１参照）。同図に示すように、従来のパッケージは、複数のセラミック層が積層されて成るとともに上面に凹部１４が形成されている直方体状の絶縁基体の凹部１４の底面に発光素子１３を搭載するため導体層１２が設けられた基体１１と、基体１１の導体層１２およびその周辺から基体１１の下面に形成された一対の配線層１５とから主に構成されている。
【０００３】
そして、一方の配線層１５の一端が電気的に接続された導体層１２上に発光素子１３を導電性接着剤、半田等を介して載置固定するとともに、発光素子１３の電極と他方の配線層１５とをボンディングワイヤ１６を介して電気的に接続し、しかる後、基体１１の凹部１４内に図示しない透明樹脂を充填して発光素子１３を封止することによって、発光装置が作製される。
【０００４】
また、凹部１４の内周面で発光素子１３の光を反射させてパッケージの上方に光を放射させるために、凹部１４の内周面にニッケル（Ｎｉ）めっき層や金（Ａｕ）めっき層を表面に有するメタライズ層からなる金属層１７を被着させていることもある。
【０００５】
また、上記のパッケージはセラミックグリーンシート積層法により以下のようにして製作される。まず、基体１１の導体層１２（導体層１２から下側）を形成するためのセラミックグリーンシート（以下、グリーンシートともいう）と、基体１１の凹部１４を形成するためのグリーンシートとを準備し、これらのグリーンシートに配線導体１５を導出させるための貫通孔や凹部１４となる貫通穴を打ち抜き法で形成する。
【０００６】
次に、導体層１２を形成するためのグリーンシートの積層体Ａの貫通孔および所定の部位に、メタライズ層から成る配線層１５形成用の導体ペーストをスクリーン印刷法等で印刷塗布し、また凹部１４の内周面にメタライズ層から成る金属層１７を被着する場合、凹部１４を形成するためのグリーンシートの積層体Ｂの貫通穴内面に金属層１７形成用の導体ペーストをスクリーン印刷法等で印刷塗布する。
【０００７】
次に、積層体Ａ，Ｂを重ねて積層して基体１１を形成するための積層体とし、これを所定寸法に切断して成形体となし、高温（１６００℃程度）で焼結して焼結体となす。その後、配線層１５および金属層１７の露出表面にニッケル，金，パラジウム，白金等の金属から成るめっき金属層を無電解めっき法や電解めっき法により被着させることによって、パッケージが製作される。
【０００８】
【特許文献１】
特開２００２−２３２０１７号公報
【０００９】
【発明が解決しようとする課題】
しかしながら、上記従来のパッケージにおいては、凹部１４の底面上において導体層１２および配線層１５とが形成されていない領域、すなわち絶縁基体１１が露出している領域より、発光素子１３が発光する光が外部に漏れてしまうため、パッケージ上面方向に効率良く光を放射しにくくなるという問題点を有していた。
【００１０】
また、導体層１２とボンディングワイヤ１６が接続される他方の配線層１５との短絡を防止するために、金属層１７を凹部１４の内周面の一部にのみ被着したり、金属層１７と凹部１４の底面との間に絶縁層を形成するなどして、金属層１７の下端部と凹部１４の底面とを離間させるという構成が用いられているが、その離間した部位は絶縁基体１１が露出していることとなり、その部位より発光素子１３の光が漏れ、パッケージ上面の方向に効率良く光を放射しにくくなるという問題点を有していた。
【００１１】
また、凹部１４の底面に導体層１２を形成し、金属層１７と導体層１２とを連続して形成した一体化したものとし、絶縁基体１１の上面に発光素子１３にボンディングワイヤ１６で電気的に接続される他方の配線層１５を形成すると、ボンディングワイヤ１６が絶縁基体１１上面よりも高くなるため、発光装置が大型化するという問題点を有していた。
【００１２】
従って、本発明は上記従来の技術の問題点に鑑み完成されたものであり、その目的は、絶縁基体の凹部内に収容された発光素子が発光する光を効率良く反射させて、均一かつ良好に外部に放射することができる小型の発光素子収納用パッケージおよび発光装置を提供することにある。
【００１３】
【課題を解決するための手段】
本発明の発光素子収納用パッケージは、絶縁基体の上面に発光素子を収容するための凹部が設けられているとともに、該凹部の底面に前記発光素子が搭載される導体層および前記発光素子の電極が接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部の底面は、前記配線層が形成された部位よりも前記導体層が形成された部位が高くなるように段差が形成されているとともに、前記導体層が形成された部位が前記配線層の表面よりも高いことを特徴とする。
【００１４】
本発明の発光素子収納用パッケージは、凹部の底面は、配線層が形成された部位よりも導体層が形成された部位が高くなるように段差が形成されているとともに、導体層が形成された部位が配線層の表面よりも高いことから、発光素子が発光する光が直接照射される凹部内に露出する絶縁基体の領域を小さくすることができるので、発光素子の光を凹部内で効率良く反射させて、均一かつ良好に外部に放射することができる。また、導体層が形成された部位が配線層の表面よりも高いことから、導体層と配線層との短絡を確実に防止することができる。
【００１５】
本発明の発光素子収納用パッケージは、好ましくは、前記配線層は、前記導体層の周囲を取り囲むように形成されていることを特徴とする。
【００１６】
本発明の発光素子収納用パッケージは、好ましくは配線層は導体層の周囲を取り囲むように形成されていることから、発光素子が発光する光が直接照射される凹部内に露出する絶縁基体の領域をより小さくすることができるので、発光素子の光を凹部内でさらに効率良く反射させて、均一かつ良好に外部に放射することができる。また、導体層が形成された部位が配線層の表面よりも高いことから、導体層と配線層との短絡を確実に防止することができる。
【００１７】
また、凹部の内周面に発光素子が発光する光を反射する金属層を形成した際に、金属層と配線層とが電気的に接続されるようにすると、凹部内において導体層に搭載された発光素子が発光する光が直接照射される露出する絶縁基体の領域を更に小さくすることができる。
【００１８】
本発明の発光装置は、本発明の発光素子収納用パッケージと、前記導体層に搭載されるとともに前記配線層に電極が電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする。
【００１９】
本発明の発光装置は、上記の構成により、発光素子の光を良好に反射して外部に均一かつ効率良く外部に放射することができるとともに導体層と配線層との短絡を確実に防止することができる、小型で発光効率の高い高性能かつ高信頼性のものとなる。
【００２０】
【発明の実施の形態】
本発明の発光素子収納用パッケージを以下に詳細に説明する。図１は本発明のパッケージについて実施の形態の一例を示す断面図であり、図２は図１のパッケージの平面図である。これらの図において、１は絶縁基体、２は発光素子３の導体層、３は発光素子、４は発光素子３を収容するための凹部である。
【００２１】
本発明のパッケージは、絶縁基体１の上面に発光素子３を収容するための凹部４が設けられているとともに、凹部４の底面に発光素子３が搭載される導体層２および発光素子３の電極が接続される配線層５が形成されているものであって、凹部４の底面は、配線層５が形成された部位よりも導体層２が形成された部位が高くなるように段差４ａが形成されているとともに、導体層２が形成された部位が配線層５の表面よりも高くなっている。
【００２２】
本発明における絶縁基体１は、セラミックスや樹脂から成り、セラミックスからなる場合、例えば酸化アルミニウム質焼結体（アルミナセラミックス），窒化アルミニウム質焼結体，ムライト質焼結体，ガラスセラミックス質焼結体等のセラミックスから成る絶縁層を複数層積層してなる直方体状の箱状であり、上面の中央部に発光素子３を収容するための凹部４が形成されている。絶縁基体１が例えば酸化アルミニウム質焼結体から成る場合、酸化アルミニウム，酸化珪素，酸化マグネシウム，酸化カルシウム等の原料粉末に適当な有機バインダー、溶剤等を添加混合して泥漿状となし、これを従来周知のドクターブレード法やカレンダーロール法等によりシート状に成形してグリーンシート（セラミック生シート）を得、しかる後、グリーンシートに凹部４用の貫通孔を打ち抜き加工で形成するとともに、発光素子３を搭載するためのグリーンシート（導体層２より下側のグリーンシート）と凹部４用のグリーンシートとを複数枚積層し、高温（約１６００℃）で焼成し一体化することで形成される。
【００２３】
また、凹部４の底面には発光素子３を搭載するための導体層２およびその周辺に発光素子３の電極と接続される配線層５が形成されており、導体層２および配線層５はタングステン（Ｗ），モリブデン（Ｍｏ），銅（Ｃｕ），銀（Ａｇ）等の金属粉末のメタライズ層から成っている。
【００２４】
また、絶縁基体１は、導体層２および配線層５が、絶縁基体１の下面または側面に形成された配線導体８ａ，８ｂにかけて接続されるようにして、被着形成されている。配線導体８ａ，８ｂは、ＷやＭｏ等の金属粉末のメタライズ層から成り、凹部４に収容された発光素子３を外部に電気的に接続するための導電路である。そして、導体層２には発光ダイオード（ＬＥＤ），半導体レーザ（ＬＤ）等の発光素子３が金（Ａｕ）−シリコン（Ｓｉ）合金やＡｇ−エポキシ樹脂等の導電性接合材により固着されるとともに、配線層５には発光素子３の電極がボンディングワイヤ６を介して電気的に接続されている。そして、絶縁基体１の配線導体８ａ，８ｂが外部電気回路基板の配線導体に接続されることで発光素子３の各電極と電気的に接続され、発光素子３へ電力や駆動信号が供給される。
【００２５】
導体層２および配線層５、配線導体８ａ，８ｂは、例えばＷやＭｏ等の金属粉末に適当な有機溶剤、溶媒を添加混合して得た金属ペーストを絶縁基体１となるグリーンシートに予めスクリーン印刷法により所定パターンに印刷塗布しておくことによって、絶縁基体１の所定位置に被着形成される。
【００２６】
なお、導体層２、配線層５および配線導体８ａ，８ｂの露出する表面に、ニッケル（Ｎｉ），金（Ａｕ），Ａｇ等の耐蝕性に優れる金属を１〜２０μｍ程度の厚みで被着させておくのがよく、導体層２、配線層５および配線導体８ａ，８ｂが酸化腐蝕するのを有効に防止できるとともに、導体層２と発光素子３との固着および配線層５とボンディングワイヤ６との接続、配線導体８ａ，８ｂと外部電気回路基板の配線導体との接続を強固にすることができる。従って、導体層２、配線層５および配線導体８ａ，８ｂの露出表面には、厚さ１〜１０μｍ程度のＮｉめっき層と厚さ０．１〜３μｍ程度のＡｕめっき層またはＡｇめっき層とが、電解めっき法や無電解めっき法により順次被着されていることがより好ましい。
【００２７】
また、凹部４の内周面には、メタライズ層および発光素子３の光に対する反射率が８０％以上であるめっき金属層を被着した金属層７が形成されていることが好ましい。この金属層７は、例えば、ＷやＭｏ等から成るメタライズ層上にＮｉ，Ａｕ，Ａｇ等の金属めっき層を被着させて成り、これにより発光素子３の光に対する反射率を８０％以上とすることができる。発光素子３の光に対する反射率が８０％未満であると、凹部４に収容された発光素子３の光を良好に反射することが困難となる。
【００２８】
また、凹部４の内周面は、傾斜面となっているとともに凹部４の底面から絶縁基体１の上面に向けて３５〜７０°の角度θで外側に広がっていることが好ましい。角度θが７０°を超えると、凹部４内に収容された発光素子３の光を外部に良好に反射することが困難となる傾向にある。角度θが３５°未満であると、凹部４の内周面をそのような角度で安定かつ効率良く形成することが困難となる傾向にあるとともに、パッケージが大型化する。
【００２９】
また、凹部４の内周面の金属層７の表面の算術平均粗さはＲａは３μｍ以下が好ましい。３μｍを超えると、凹部４内に収容された発光素子３の光が散乱し、反射光を高い反射率で外部に均一に放射することが困難になる。
【００３０】
また、凹部４の横断面形状は、円形状、長円形状、楕円形状、四角形状、多角形状等で良いが、円形状が好ましい。この場合、凹部４に収容された発効素子３が発光する光を、凹部４の内周面の金属層７表面のめっき金属層でパッケージの上方に満遍なく反射させて外部に極めて均一に放射することができる。
【００３１】
そして、本発明において、凹部４の底面は、配線層５が形成された部位よりも導体層２が形成された部位が高くなるように段差４ａが形成されているとともに、導体層２が形成された部位が配線層５の表面よりも高くなっている。これにより、凹部４内において露出する絶縁基体１の領域を小さくすることができるので、発光素子３の光を効率良く反射させて、均一かつ良好に外部に放射することができるとともに、導体層２と配線層５との短絡を確実に防止することができる。
【００３２】
段差４ａの高さは、配線層５の表面から上方に５〜２００μｍ程度がよい。５μｍ未満では、導体層２が形成された部位が厚み５〜３０μｍ程度の配線層５の表面に近接して、導体層２および配線層５をスクリーン印刷法等で形成する際の厚さの誤差や、段差４ａ部への導体層２および配線層５の延出、段差４ａおよびその近傍の変形等の影響により、導体層２と配線層５とが短絡する危険性が高くなる。２００μｍを超えると、段差４ａの部位は絶縁基体１が露出した領域であるため、この領域から発光素子３が発光する光が漏れる量が大きくなってしまう。この段差４ａは、導体層２用のグリーンシートに打ち抜き加工等で貫通穴等を形成し、導体層２用のグリーンシートと配線層５用のグリーンシートとを積層するといった方法等で形成できる。
【００３３】
また、導体層２は段差４ａよりも上側の凹部４の底面の全面に形成されるとともに導体層２と金属層７とが接続されているのがよく、この場合、金属層７は導体層２に連続して接続されるが配線層５には接続されないようにして、凹部４の内周面の全面に形成される。これにより、絶縁基体１が凹部４内において露出する領域を小さくすることができる。絶縁基体１の露出する領域は、段差４ａが凹部４の底面の外周よりも内側に形成されている場合は、段差４ａの部位のみとなり、段差４ａの一部が凹部４の底面の外周端にまで形成されている場合は、段差４ａの部位および配線層５表面から金属層７の下端までの間の部位になるので、絶縁基体１の凹部４内において露出する領域は非常に小さくなり、凹部４の内面で発光素子３の光を良好に反射し、均一かつ良好に外部に放射することができる。
【００３４】
また、配線層５は、段差４ａよりも下側の凹部４の底面の全面に形成されていても良いが、段差４ａよりも下側の凹部４の底面において、導体層２の段差４ａ側の上端と発光素子３の発光部とを結ぶ直線の延長線よりも段差４ａ側の部位で絶縁基体１が露出するように配線層５が形成されていてもよい。図３はこのような構成について示すものであり、発光素子３の発光部が発光素子３の上面側にある場合におけるパッケージの要部拡大断面図である。同図において、仮想線Ａ−Ａ’は、導体層２の段差４ａ側の上端と発光素子３の発光部とを結ぶ直線である。この場合、凹部４の底面で絶縁基体１が露出した領域には発光素子３の光が直接照射されないので、光の漏れが小さくなる。またこの場合、配線層５を凹部４の底面で段差４ａの周囲の全面に形成する際に、絶縁基体１を成す絶縁層の積層ずれ等により、配線層５が導体層２の下方の絶縁基体１の内部に入り込んで形成されると、段差４ａの高さが非常に低い場合に、配線層５の厚みの影響により、配線層５が入り込んで形成されている部位の上方の導体層２に隆起や変形等が発生して、発光素子３の光の反射に影響を与えてしまうので、それを有効に防止できる。
【００３５】
また、配線層５を段差４ａよりも下側の凹部４の底面から段差４ａよりも上側の凹部４の底面の下方の絶縁基体１の内部に入り込ませて形成していても良く、この場合、配線層５の入り込ませた部位を発光素子３の光の遮断層とすることができる。したがって、発光素子３の発光部よりも下側の金属層７等で反射した光が、絶縁基体１が露出している段差４ａの部位から絶縁基体１の内部に透過して、外部に漏れるのを配線層５で有効に防ぐことができる。
【００３６】
また、段差４ａの上端と配線層５の表面との間の間隔と、配線層５の表面と金属層７の下端との間の間隔とは同程度であることが好ましい。これにより、配線層５が導体層２および金属層７に接触して短絡するのを防ぐことができる。
【００３７】
さらに、図４のパッケージの断面図に示すように、配線導体８ａ，８ｂを、絶縁基体１の側面または角部に形成された切欠き部の内面に被着された側面導体を経て絶縁基体１の下面に形成しても良い。
【００３８】
また、凹部４の底面に露出する配線層５の平面視形状は、円形状、四角形状、長円形状、多角形状等の種々の形状で良い。図５のパッケージの平面図は、凹部４の底面に露出する配線層５の平面視形状が円形状である例を示し、図６のパッケージの平面図は、凹部４の底面に露出する配線層５の平面視形状が四角形状である例を示す。
【００３９】
また、凹部４に複数の発光素子３を収容するために、凹部４の底面に複数の導体層２を形成する場合や複数の配線層５を凹部４に形成する場合にも、図１，図５，図６と同様の構成とすることができる。図７は、凹部４内に発光素子３を搭載する導体層２が一つ設けられ、配線層５が三つ（配線層５ａ，５ｂ，５ｃ）形成される場合のパッケージの一例を示す平面図である。
【００４０】
また、本発明の好ましい実施の形態の他の例を、図９のパッケージの断面図、図９のパッケージの平面図である図１０に示す。これらの図において、配線層５は導体層２の周囲を取り囲むように形成されている。これにより、凹部４内において発光素子３の光が直接照射される絶縁基体１が露出する領域を小さくすることができ、発光素子３の光の漏れを防いで効率良く外部に放射することができる。
【００４１】
また、この場合は、導体層２を金属層７に接続せずに、配線層５を金属層７に電気的に接続することで、凹部４内において発光素子３の光が直接照射される絶縁基体１が露出する領域をより小さくすることができ、発光素子３の光の漏れを防いでより効率良く放射することができる。
【００４２】
本発明の発光装置は、本発明のパッケージと、導体層２に搭載されるとともに配線層５に電極が電気的に接続された発光素子３と、発光素子３を覆うシリコーン樹脂等の透明樹脂とを具備している。これにより、発光素子３の光を良好に反射し、外部に均一かつ効率良く放射することができる、小型で発光効率の高い高性能の発光装置となる。発光素子３を覆う透明樹脂は、発光素子３およびその周囲のみを覆っていてもよいし、凹部４内に充填されて発光素子３を覆っていてもよい。
【００４３】
なお、本発明は上述の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を施すことは何等差し支えない。例えば、発光素子３の光を外部に良好に反射するために、凹部４の内周面にめっき層より成る金属層７を形成しているが、金属層７を蒸着法により被着形成したものや、金属板等の高い反射率を有する反射板を凹部４の内周面に接着する等して設けて、発光素子３の光を良好に反射するものとしても良い。
【００４４】
【発明の効果】
本発明の発光素子収納用パッケージは、凹部の底面は、配線層が形成された部位よりも導体層が形成された部位が高くなるように段差が形成されているとともに、導体層が形成された部位が配線層の表面よりも高いことから、発光素子が発光する光が直接照射される凹部内に露出する絶縁基体の領域を小さくすることができるので、発光素子の光を凹部内で効率良く反射させて、均一かつ良好に外部に放射することができる。また、導体層が形成された部位が配線層の表面よりも高いことから、導体層と配線層との短絡を確実に防止することができる。
【００４５】
本発明の発光素子収納用パッケージは、好ましくは配線層は導体層の周囲を取り囲むように形成されていることから、発光素子が発光する光が直接照射される凹部内に露出する絶縁基体の領域をより小さくすることができるので、発光素子の光を凹部内で効率良く反射させて、均一かつ良好に外部に放射することができる。また、導体層が形成された部位が配線層の表面よりも高いことから、導体層と配線層との短絡を確実に防止することができる。
【００４６】
また、凹部の内周面に発光素子が発光する光を反射する金属層を形成した際に、金属層と配線層とが電気的に接続されるようにすると、凹部内において発光素子が発光する光が直接照射される露出する絶縁基体の領域をされに小さくすることができる。
【００４７】
本発明の発光装置は、本発明の発光素子収納用パッケージと、導体層に搭載されるとともに配線層に電極が電気的に接続された発光素子と、発光素子を覆う透明樹脂とを具備していることにより、発光素子の光を良好に反射して外部に均一かつ効率良く外部に放射することができるとともに導体層と配線層との短絡を確実に防止することができる、小型で発光効率の高い高性能かつ高信頼性のものとなる。
【図面の簡単な説明】
【図１】本発明の発光素子収納用パッケージについて実施の形態の一例を示す断面図である。
【図２】図１の発光素子収納用パッケージの平面図である。
【図３】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す要部拡大断面図である。
【図４】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図５】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。
【図６】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。
【図７】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す平面図である。
【図８】従来の発光素子収納用パッケージの断面図である。
【図９】本発明の発光素子収納用パッケージについて実施の形態の他の例を示す断面図である。
【図１０】図９の発光素子収納用パッケージの平面図である。
【符号の説明】
１：絶縁基体
２：導体層
３：発光素子
４：凹部
４ａ：段差
５：配線層
８ａ，８ｂ：配線導体[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a liquid crystal display device using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also simply referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Patent Document 1). As shown in the figure, the conventional package is formed by laminating a plurality of ceramic layers and has a conductor 14 for mounting the light emitting element 13 on the bottom surface of the concave portion 14 of the rectangular parallelepiped insulating base having the concave portion 14 formed on the upper surface. It is mainly composed of a base 11 provided with a layer 12, and a pair of wiring layers 15 formed on the lower surface of the base 11 from the conductor layer 12 of the base 11 and its periphery.
[0003]
Then, the light emitting element 13 is placed and fixed on the conductor layer 12 to which one end of one wiring layer 15 is electrically connected via a conductive adhesive, solder, or the like, and the electrode of the light emitting element 13 is connected to the other wiring. The layer 15 is electrically connected via the bonding wires 16, and then the concave portion 14 of the base 11 is filled with a transparent resin (not shown) to seal the light emitting element 13, thereby producing a light emitting device. .
[0004]
In order to reflect the light of the light emitting element 13 on the inner peripheral surface of the concave portion 14 and emit the light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the concave portion 14. The metal layer 17 made of a metallized layer on the surface may be applied.
[0005]
The above package is manufactured by the ceramic green sheet laminating method as follows. First, a ceramic green sheet (hereinafter, also referred to as a green sheet) for forming the conductor layer 12 (below the conductor layer 12) of the base 11 and a green sheet for forming the recess 14 of the base 11 are prepared. Through holes for forming the wiring conductors 15 and the recesses 14 are formed in these green sheets by a punching method.
[0006]
Next, a conductor paste for forming a wiring layer 15 made of a metallized layer is printed and applied by a screen printing method or the like on the through-holes and predetermined portions of the laminate A of the green sheets for forming the conductor layers 12, and the concave portions are formed. When a metal layer 17 made of a metallized layer is applied to the inner peripheral surface of the metal layer 14, a conductor paste for forming the metal layer 17 is screen-printed on the inner surface of the through hole of the green sheet laminate B for forming the concave portion 14. Print and apply.
[0007]
Next, the laminates A and B are overlapped and laminated to form a laminate for forming the base 11, which is cut into a predetermined size to form a molded body, sintered at a high temperature (about 1600 ° C.) and fired. Make a unity. Thereafter, a package is manufactured by applying a plating metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring layer 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
[0008]
[Patent Document 1]
JP-A-2002-232017
[Problems to be solved by the invention]
However, in the above-described conventional package, light emitted by the light emitting element 13 emits light from a region where the conductor layer 12 and the wiring layer 15 are not formed on the bottom surface of the concave portion 14, that is, a region where the insulating base 11 is exposed. Since it leaks to the outside, there is a problem that it is difficult to efficiently emit light in the direction of the package upper surface.
[0010]
Further, in order to prevent a short circuit between the conductor layer 12 and the other wiring layer 15 to which the bonding wire 16 is connected, the metal layer 17 is adhered to only a part of the inner peripheral surface of the concave portion 14, A configuration is used in which the lower end of the metal layer 17 and the bottom surface of the concave portion 14 are separated from each other by forming an insulating layer between the metal substrate 17 and the bottom surface of the concave portion 14, for example. Is exposed, and the light of the light emitting element 13 leaks from that portion, and it is difficult to efficiently emit light in the direction of the package upper surface.
[0011]
Further, the conductor layer 12 is formed on the bottom surface of the concave portion 14, and the metal layer 17 and the conductor layer 12 are continuously formed to be integrated, and the upper surface of the insulating base 11 is electrically connected to the light emitting element 13 by the bonding wire 16. When the other wiring layer 15 connected to the substrate is formed, the bonding wire 16 becomes higher than the upper surface of the insulating base 11, so that there is a problem that the light emitting device becomes large.
[0012]
Therefore, the present invention has been completed in view of the problems of the above-described conventional technology, and an object of the present invention is to efficiently and uniformly reflect light emitted from a light emitting element housed in a concave portion of an insulating base, and to uniformly and favorably emit the light. Another object of the present invention is to provide a small light emitting element housing package and a light emitting device that can radiate light to the outside.
[0013]
[Means for Solving the Problems]
The light-emitting element housing package of the present invention is provided with a recess for housing the light-emitting element on the upper surface of the insulating base, a conductor layer on which the light-emitting element is mounted on the bottom of the recess, and an electrode of the light-emitting element. A light emitting element housing package having a wiring layer to which the conductor layer is connected, wherein the bottom surface of the concave portion is stepped so that a portion where the conductor layer is formed is higher than a portion where the wiring layer is formed. Is formed, and a portion where the conductor layer is formed is higher than a surface of the wiring layer.
[0014]
In the light-emitting element housing package of the present invention, a step is formed on the bottom surface of the concave portion so that a portion where the conductor layer is formed is higher than a portion where the wiring layer is formed, and the conductor layer is formed. Since the portion is higher than the surface of the wiring layer, the area of the insulating base exposed in the concave portion to which the light emitted from the light emitting element is directly irradiated can be reduced, so that the light of the light emitting element can be efficiently emitted in the concave portion. It can be reflected and emitted uniformly and well to the outside. Further, since the portion where the conductor layer is formed is higher than the surface of the wiring layer, a short circuit between the conductor layer and the wiring layer can be reliably prevented.
[0015]
In the package for housing a light emitting element of the present invention, preferably, the wiring layer is formed so as to surround a periphery of the conductor layer.
[0016]
In the light-emitting element housing package of the present invention, preferably, since the wiring layer is formed so as to surround the periphery of the conductor layer, an area of the insulating base exposed in the concave portion to which light emitted from the light-emitting element is directly irradiated Can be made smaller, so that the light of the light emitting element can be reflected more efficiently in the concave portion, and can be uniformly and favorably radiated to the outside. Further, since the portion where the conductor layer is formed is higher than the surface of the wiring layer, a short circuit between the conductor layer and the wiring layer can be reliably prevented.
[0017]
Further, when a metal layer that reflects light emitted by the light emitting element is formed on the inner peripheral surface of the concave portion and the metal layer and the wiring layer are electrically connected to each other, the metal layer is mounted on the conductor layer in the concave portion. The exposed area of the insulating substrate to which the light emitted from the light emitting element is directly irradiated can be further reduced.
[0018]
The light emitting device of the present invention includes the light emitting element housing package of the present invention, a light emitting element mounted on the conductor layer and having an electrode electrically connected to the wiring layer, and a transparent resin covering the light emitting element. It is characterized by having.
[0019]
According to the light emitting device of the present invention, with the above structure, it is possible to satisfactorily reflect the light of the light emitting element and uniformly and efficiently radiate the light to the outside, and to reliably prevent a short circuit between the conductor layer and the wiring layer. , High performance and high reliability with high luminous efficiency.
[0020]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of an embodiment of the package of the present invention, and FIG. 2 is a plan view of the package of FIG. In these figures, 1 is an insulating base, 2 is a conductor layer of the light emitting element 3, 3 is a light emitting element, and 4 is a recess for accommodating the light emitting element 3.
[0021]
In the package of the present invention, a concave portion 4 for accommodating the light emitting element 3 is provided on the upper surface of the insulating base 1, and the conductor layer 2 on which the light emitting element 3 is mounted and the electrode of the light emitting element 3 are provided on the bottom surface of the concave portion 4. Is formed, and a step 4a is formed on the bottom surface of the concave portion 4 so that the portion where the conductor layer 2 is formed is higher than the portion where the wiring layer 5 is formed. In addition, the portion where the conductor layer 2 is formed is higher than the surface of the wiring layer 5.
[0022]
The insulating substrate 1 according to the present invention is made of a ceramic or a resin, and when made of a ceramic, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body It has a rectangular parallelepiped box shape formed by laminating a plurality of insulating layers made of ceramic such as ceramics, and has a concave portion 4 for accommodating the light emitting element 3 in the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide is mixed with an appropriate organic binder, a solvent, and the like to form a slurry. A green sheet (green ceramic sheet) is obtained by forming the sheet into a sheet shape by a well-known doctor blade method, a calendar roll method, or the like. Thereafter, a through hole for the recess 4 is formed in the green sheet by punching, and the light emitting element is formed. A green sheet (on the lower side of the conductor layer 2) for mounting 3 and a plurality of green sheets for the recess 4 are laminated, fired at a high temperature (about 1600 ° C.) and integrated. .
[0023]
A conductor layer 2 for mounting the light emitting element 3 and a wiring layer 5 connected to the electrode of the light emitting element 3 are formed around the bottom of the recess 4. The conductor layer 2 and the wiring layer 5 are made of tungsten. (W), a metallized layer of a metal powder of molybdenum (Mo), copper (Cu), silver (Ag) or the like.
[0024]
The insulating base 1 is formed so that the conductor layer 2 and the wiring layer 5 are connected to the wiring conductors 8a and 8b formed on the lower surface or side surfaces of the insulating base 1. The wiring conductors 8a and 8b are made of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the conductive layer 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5 via the bonding wire 6. Then, the wiring conductors 8a and 8b of the insulating base 1 are electrically connected to the respective electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and a driving signal are supplied to the light emitting element 3. .
[0025]
For the conductor layer 2, the wiring layer 5, and the wiring conductors 8a and 8b, a metal paste obtained by adding a suitable organic solvent and a solvent to a metal powder such as W or Mo is screened in advance on a green sheet serving as the insulating substrate 1. By printing and applying a predetermined pattern by a printing method, the insulating substrate 1 is adhered and formed at a predetermined position.
[0026]
A metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, is applied to the exposed surfaces of the conductor layer 2, the wiring layer 5, and the wiring conductors 8a and 8b in a thickness of about 1 to 20 μm. It is preferable that the conductor layer 2, the wiring layer 5, and the wiring conductors 8a and 8b can be effectively prevented from being oxidized and corroded. And the connection between the wiring conductors 8a and 8b and the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the conductor layer 2, the wiring layer 5, and the wiring conductors 8a and 8b, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are provided. More preferably, they are sequentially applied by an electrolytic plating method or an electroless plating method.
[0027]
Further, it is preferable that a metal layer 7 coated with a metallized layer and a plated metal layer having a reflectance of 80% or more with respect to light of the light emitting element 3 is formed on the inner peripheral surface of the concave portion 4. The metal layer 7 is formed, for example, by depositing a metal plating layer of Ni, Au, Ag, etc. on a metallization layer made of W, Mo, etc., so that the light-emitting element 3 has a light reflectance of 80% or more. can do. If the reflectance of the light emitting element 3 with respect to the light is less than 80%, it becomes difficult to satisfactorily reflect the light of the light emitting element 3 accommodated in the recess 4.
[0028]
It is preferable that the inner peripheral surface of the concave portion 4 is an inclined surface and extends outward from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1 at an angle θ of 35 to 70 °. When the angle θ exceeds 70 °, it tends to be difficult to favorably reflect the light of the light emitting element 3 housed in the recess 4 to the outside. If the angle θ is less than 35 °, it tends to be difficult to form the inner peripheral surface of the concave portion 4 stably and efficiently at such an angle, and the package becomes large.
[0029]
The arithmetic average roughness Ra of the surface of the metal layer 7 on the inner peripheral surface of the recess 4 is preferably 3 μm or less. If it exceeds 3 μm, the light of the light emitting element 3 housed in the concave portion 4 is scattered, and it becomes difficult to uniformly radiate the reflected light with high reflectance to the outside.
[0030]
The cross-sectional shape of the recess 4 may be a circle, an ellipse, an ellipse, a square, a polygon, or the like, but a circle is preferable. In this case, the light emitted by the effecting element 3 housed in the concave portion 4 is uniformly reflected above the package by the plating metal layer on the metal layer 7 on the inner peripheral surface of the concave portion 4 and is emitted to the outside very uniformly. Can be.
[0031]
In the present invention, the step 4 a is formed on the bottom surface of the concave portion 4 so that the portion where the conductor layer 2 is formed is higher than the portion where the wiring layer 5 is formed, and the conductor layer 2 is formed. Is higher than the surface of the wiring layer 5. Thereby, the area of the insulating base 1 exposed in the concave portion 4 can be reduced, so that the light of the light emitting element 3 can be efficiently reflected and emitted uniformly and satisfactorily to the outside. And the wiring layer 5 can be reliably prevented from being short-circuited.
[0032]
The height of the step 4 a is preferably about 5 to 200 μm above the surface of the wiring layer 5. If the thickness is less than 5 μm, the portion where the conductor layer 2 is formed is close to the surface of the wiring layer 5 having a thickness of about 5 to 30 μm, and the thickness error when the conductor layer 2 and the wiring layer 5 are formed by screen printing or the like. Also, the risk of the conductor layer 2 and the wiring layer 5 being short-circuited increases due to the influence of the extension of the conductor layer 2 and the wiring layer 5 to the step 4a, deformation of the step 4a and the vicinity thereof, and the like. If the thickness exceeds 200 μm, since the portion of the step 4a is a region where the insulating base 1 is exposed, the amount of light emitted from the light emitting element 3 leaks from this region. The step 4a can be formed by forming a through hole or the like in the green sheet for the conductor layer 2 by punching or the like, and laminating the green sheet for the conductor layer 2 and the green sheet for the wiring layer 5 or the like.
[0033]
The conductor layer 2 is preferably formed on the entire bottom surface of the concave portion 4 above the step 4a, and the conductor layer 2 and the metal layer 7 are preferably connected. In this case, the metal layer 7 is Is formed on the entire inner peripheral surface of the concave portion 4 so as not to be connected to the wiring layer 5. Thereby, the region where the insulating base 1 is exposed in the concave portion 4 can be reduced. When the step 4a is formed inside the outer periphery of the bottom surface of the concave portion 4, the exposed region of the insulating base 1 is only the portion of the step 4a, and a part of the step 4a is located at the outer peripheral end of the bottom surface of the concave portion 4. In this case, the exposed portion in the concave portion 4 of the insulating base 1 becomes very small because the portion is located between the step 4a and the surface of the wiring layer 5 to the lower end of the metal layer 7. The light of the light-emitting element 3 can be reflected well on the inner surface of the light-emitting element 4 and can be uniformly and well emitted to the outside.
[0034]
The wiring layer 5 may be formed on the entire bottom surface of the concave portion 4 below the step 4a, but on the bottom surface of the concave portion 4 below the step 4a, The wiring layer 5 may be formed such that the insulating base 1 is exposed at a position closer to the step 4a than a linear extension line connecting the upper end and the light emitting portion of the light emitting element 3. FIG. 3 shows such a configuration, and is an enlarged cross-sectional view of a main part of the package when the light-emitting portion of the light-emitting element 3 is on the upper surface side of the light-emitting element 3. In the figure, a virtual line AA ′ is a straight line connecting the upper end of the conductor layer 2 on the side of the step 4 a and the light emitting portion of the light emitting element 3. In this case, since the light of the light emitting element 3 is not directly irradiated to the region where the insulating base 1 is exposed on the bottom surface of the concave portion 4, light leakage is reduced. Further, in this case, when the wiring layer 5 is formed on the entire surface around the step 4 a on the bottom surface of the concave portion 4, the wiring layer 5 may be located below the conductor layer 2 due to lamination misalignment of the insulating layer forming the insulating base 1. 1, when the height of the step 4a is extremely low, the conductor layer 2 is located above the portion where the wiring layer 5 is formed due to the influence of the thickness of the wiring layer 5. Protrusion, deformation, and the like occur, which affects the reflection of light from the light emitting element 3, and can be effectively prevented.
[0035]
Further, the wiring layer 5 may be formed so as to enter the inside of the insulating base 1 below the bottom surface of the concave portion 4 above the step 4a from the bottom surface of the concave portion 4 below the step 4a. The portion where the wiring layer 5 enters can be used as a light blocking layer of the light emitting element 3. Therefore, light reflected by the metal layer 7 and the like below the light emitting portion of the light emitting element 3 transmits through the portion of the step 4a where the insulating base 1 is exposed to the inside of the insulating base 1 and leaks to the outside. Can be effectively prevented by the wiring layer 5.
[0036]
Further, it is preferable that the distance between the upper end of the step 4a and the surface of the wiring layer 5 and the distance between the surface of the wiring layer 5 and the lower end of the metal layer 7 are substantially the same. Thereby, it is possible to prevent the wiring layer 5 from contacting the conductor layer 2 and the metal layer 7 and causing a short circuit.
[0037]
Further, as shown in the cross-sectional view of the package in FIG. 4, the wiring conductors 8a and 8b are connected to the insulating base 1 through the side conductors attached to the inner surfaces of the cutouts formed in the side surfaces or corners of the insulating base 1. May be formed on the lower surface.
[0038]
The shape of the wiring layer 5 exposed on the bottom surface of the concave portion 4 in plan view may be various shapes such as a circular shape, a square shape, an oval shape, and a polygonal shape. The plan view of the package in FIG. 5 shows an example in which the wiring layer 5 exposed on the bottom surface of the recess 4 has a circular shape in plan view, and the plan view of the package in FIG. 5 shows an example in which the plan view shape is a square shape.
[0039]
Also, when accommodating a plurality of light emitting elements 3 in the recess 4 and forming a plurality of conductor layers 2 on the bottom surface of the recess 4 and forming a plurality of wiring layers 5 in the recess 4, FIGS. 5, a configuration similar to that of FIG. FIG. 7 is a plan view showing an example of a package in which one conductor layer 2 on which the light emitting element 3 is mounted is provided in the concave portion 4 and three wiring layers 5 (wiring layers 5a, 5b, 5c) are formed. It is.
[0040]
Another example of the preferred embodiment of the present invention is shown in a sectional view of the package of FIG. 9 and a plan view of the package of FIG. In these drawings, wiring layer 5 is formed so as to surround conductor layer 2. This makes it possible to reduce the area in the recess 4 where the light of the light emitting element 3 is directly exposed to the insulating base 1, thereby preventing light from leaking from the light emitting element 3 and efficiently radiating the light to the outside. .
[0041]
In this case, the wiring layer 5 is electrically connected to the metal layer 7 without connecting the conductor layer 2 to the metal layer 7, so that the light of the light emitting element 3 is directly irradiated in the recess 4. The area where the base 1 is exposed can be made smaller, and light can be emitted more efficiently by preventing light from leaking from the light emitting element 3.
[0042]
The light emitting device of the present invention includes a package of the present invention, a light emitting element 3 mounted on the conductor layer 2 and having an electrode electrically connected to the wiring layer 5, and a transparent resin such as a silicone resin covering the light emitting element 3. Is provided. Thereby, a small-sized, high-performance light-emitting device that can reflect the light of the light-emitting element 3 satisfactorily and uniformly and efficiently emit the light to the outside can be obtained. The transparent resin covering the light emitting element 3 may cover only the light emitting element 3 and its surroundings, or may be filled in the recess 4 to cover the light emitting element 3.
[0043]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the spirit of the present invention. For example, in order to favorably reflect the light of the light emitting element 3 to the outside, the metal layer 7 made of a plating layer is formed on the inner peripheral surface of the concave portion 4, and the metal layer 7 is formed by vapor deposition. Alternatively, a reflective plate having a high reflectivity such as a metal plate may be provided by being adhered to the inner peripheral surface of the concave portion 4 so as to reflect light from the light emitting element 3 well.
[0044]
【The invention's effect】
In the light-emitting element housing package of the present invention, a step is formed on the bottom surface of the concave portion so that a portion where the conductor layer is formed is higher than a portion where the wiring layer is formed, and the conductor layer is formed. Since the portion is higher than the surface of the wiring layer, the area of the insulating base exposed in the concave portion to which the light emitted from the light emitting element is directly irradiated can be reduced, so that the light of the light emitting element can be efficiently emitted in the concave portion. It can be reflected and emitted uniformly and well to the outside. Further, since the portion where the conductor layer is formed is higher than the surface of the wiring layer, a short circuit between the conductor layer and the wiring layer can be reliably prevented.
[0045]
In the light-emitting element housing package of the present invention, preferably, since the wiring layer is formed so as to surround the periphery of the conductor layer, an area of the insulating base exposed in the concave portion to which light emitted from the light-emitting element is directly irradiated Can be made smaller, so that the light of the light emitting element can be efficiently reflected in the concave portion and radiated uniformly and satisfactorily to the outside. Further, since the portion where the conductor layer is formed is higher than the surface of the wiring layer, a short circuit between the conductor layer and the wiring layer can be reliably prevented.
[0046]
In addition, when a metal layer that reflects light emitted by the light emitting element is formed on the inner peripheral surface of the concave portion and the metal layer and the wiring layer are electrically connected, the light emitting element emits light in the concave portion. The exposed area of the insulating substrate to which light is directly applied can be made very small.
[0047]
A light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on a conductor layer and having an electrode electrically connected to a wiring layer, and a transparent resin covering the light-emitting element. With this configuration, the light of the light emitting element can be reflected well and radiated to the outside uniformly and efficiently, and a short circuit between the conductor layer and the wiring layer can be reliably prevented. High performance and high reliability are obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a plan view of the light emitting element housing package of FIG. 1;
FIG. 3 is an enlarged sectional view of a main part showing another example of the embodiment of the package for housing a light emitting element of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 5 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 6 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 7 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 8 is a cross-sectional view of a conventional light emitting element storage package.
FIG. 9 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 10 is a plan view of the light emitting element storage package of FIG. 9;
[Explanation of symbols]
1: Insulating substrate 2: Conductive layer 3: Light emitting element 4: Depression 4a: Step 5: Wiring layers 8a, 8b: Wiring conductor

Claims (3)

絶縁基体の上面に発光素子を収容するための凹部が設けられているとともに、該凹部の底面に前記発光素子が搭載される導体層および前記発光素子の電極が接続される配線層が形成されている発光素子収納用パッケージであって、前記凹部の底面は、前記配線層が形成された部位よりも前記導体層が形成された部位が高くなるように段差が形成されているとともに、前記導体層が形成された部位が前記配線層の表面よりも高いことを特徴とする発光素子収納用パッケージ。A concave portion for accommodating the light emitting element is provided on the upper surface of the insulating base, and a conductor layer on which the light emitting element is mounted and a wiring layer to which an electrode of the light emitting element is connected are formed on the bottom surface of the concave portion. A package for containing a light emitting element, wherein a step is formed on a bottom surface of the recess so that a portion where the conductor layer is formed is higher than a portion where the wiring layer is formed, and the conductor layer is formed. The light emitting element housing package, wherein a portion where is formed is higher than a surface of the wiring layer. 前記配線層は前記導体層の周囲を取り囲むように形成されていることを特徴とする請求項１記載の発光素子収納用パッケージ。2. The package for accommodating a light emitting element according to claim 1, wherein the wiring layer is formed so as to surround a periphery of the conductor layer. 請求項１または請求項２記載の発光素子収納用パッケージと、前記導体層に搭載されるとともに前記配線層に電極が電気的に接続された発光素子と、該発光素子を覆う透明樹脂とを具備していることを特徴とする発光装置。3. A light-emitting element storage package according to claim 1, comprising: a light-emitting element mounted on the conductor layer and having an electrode electrically connected to the wiring layer; and a transparent resin covering the light-emitting element. A light-emitting device, comprising:
JP2003116404A 2003-03-12 2003-04-21 Light emitting element storage package and light emitting device Expired - Lifetime JP4336136B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003116404A JP4336136B2 (en) 2003-03-12 2003-04-21 Light emitting element storage package and light emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003067243 2003-03-12
JP2003116404A JP4336136B2 (en) 2003-03-12 2003-04-21 Light emitting element storage package and light emitting device

Publications (2)

Publication Number Publication Date
JP2004335495A true JP2004335495A (en) 2004-11-25
JP4336136B2 JP4336136B2 (en) 2009-09-30

Family

ID=33512911

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003116404A Expired - Lifetime JP4336136B2 (en) 2003-03-12 2003-04-21 Light emitting element storage package and light emitting device

Country Status (1)

Country Link
JP (1) JP4336136B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191445A (en) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd Package for light-emitting element, and manufacturing method thereof
WO2006035913A1 (en) * 2004-09-30 2006-04-06 Tokuyama Corporation Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
JP2006216764A (en) * 2005-02-03 2006-08-17 Ngk Spark Plug Co Ltd Wiring board for packaging light-emitting device
JP2006269717A (en) * 2005-03-24 2006-10-05 Kyocera Corp Light emitting device and lighting apparatus
KR100646094B1 (en) 2005-07-04 2006-11-14 엘지전자 주식회사 Surface mounting type light emitting device package and fabricating method thereof
JP2007123302A (en) * 2005-10-25 2007-05-17 Nichia Chem Ind Ltd Light emitting device
JP2009054860A (en) * 2007-08-28 2009-03-12 Citizen Electronics Co Ltd Chip-type semiconductor device
US20120021541A1 (en) * 2008-09-05 2012-01-26 Advanced Optoelectronic Technology, Inc. Light emitting device and method of fabricating the same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005191445A (en) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd Package for light-emitting element, and manufacturing method thereof
WO2006035913A1 (en) * 2004-09-30 2006-04-06 Tokuyama Corporation Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
US7718456B2 (en) 2004-09-30 2010-05-18 Tokuyama Corporation Package for housing light-emitting element and method for manufacturing package for housing light-emitting element
JP2006216764A (en) * 2005-02-03 2006-08-17 Ngk Spark Plug Co Ltd Wiring board for packaging light-emitting device
JP2006269717A (en) * 2005-03-24 2006-10-05 Kyocera Corp Light emitting device and lighting apparatus
JP4637623B2 (en) * 2005-03-24 2011-02-23 京セラ株式会社 Light emitting device and lighting device
KR100646094B1 (en) 2005-07-04 2006-11-14 엘지전자 주식회사 Surface mounting type light emitting device package and fabricating method thereof
JP2007123302A (en) * 2005-10-25 2007-05-17 Nichia Chem Ind Ltd Light emitting device
JP2009054860A (en) * 2007-08-28 2009-03-12 Citizen Electronics Co Ltd Chip-type semiconductor device
US20120021541A1 (en) * 2008-09-05 2012-01-26 Advanced Optoelectronic Technology, Inc. Light emitting device and method of fabricating the same

Also Published As

Publication number Publication date
JP4336136B2 (en) 2009-09-30

Similar Documents

Publication Publication Date Title
JP4070208B2 (en) Light emitting element storage package and light emitting device
JP4072084B2 (en) Light emitting element storage package and light emitting device
JP2004319939A (en) Package for housing light emitting element and light emitting device
JP4307090B2 (en) Light emitting element storage package and light emitting device
JP4132038B2 (en) Light emitting device
JP4369738B2 (en) Light emitting element storage package and light emitting device
JP2005191111A (en) Package for storing light emitting element, and light emitting device
JP4295519B2 (en) Light emitting element storage package and light emitting device
JP4150245B2 (en) Light emitting element storage package and light emitting device
JP4336136B2 (en) Light emitting element storage package and light emitting device
JP2004207542A (en) Package for storing light emitting element and light emitting device
JP4164006B2 (en) Light emitting element storage package and light emitting device
JP2004259893A (en) Package for housing light-emitting element and light-emitting device
JP2005019688A (en) Package for accommodating light emitting element and light emitting device
JP5173903B2 (en) Light emitting element storage package and light emitting device
JP2004281996A (en) Package of light emitting element and light emitting element
JP2005243738A (en) Accommodating light-emitting device and package therefor
JP4132039B2 (en) Light emitting element storage package and light emitting device
JP4336153B2 (en) Light emitting element storage package and light emitting device
JP2004200410A (en) Package for housing light emitting element, and light emitting device
JP4336137B2 (en) Light emitting element storage package and light emitting device
JP4183175B2 (en) Light emitting element storage package and light emitting device
JP2005159082A (en) Package for light emitting element housing, method for manufacturing the same, and light emitting device
JP2005216962A (en) Package for containing light emitting element and light emitting device
JP4070195B2 (en) Light emitting element storage package

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060322

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090602

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090626

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4336136

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120703

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130703

Year of fee payment: 4

EXPY Cancellation because of completion of term