JP2006269717A - Light emitting device and lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device and lighting apparatus capable of reducing variation in radiation intensity of light emitted by a light emitting element, axial luminous intensity, brightness, color rendering properties or the like. <P>SOLUTION: The light emitting device includes a substrate 1 having a conductor layer formed at the center of an upper principal plane with which the light emitting element 5 is electrically connected; a frame-like reflecting member 2 joined to surround the conductor layer on the upper principal plane of the substrate 1, and having its inner peripheral surface serving as a reflecting face 2b for reflecting the light emitted from the element 5; the light emitting element 5 electrically connected with the conductor layer; a first translucent member 3 filled inside the reflecting member 2; a tubular member 6 having an internal surface serving as a reflecting face, and joined with the upper surface of the reflecting member 2; a second translucent member 4 containing a phosphor filled inside the tubular member 6; and a lens 7 having a convex face on the upper surface and a concave formed on the lower surface to which the tubular member 6 is to be fitted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light-emitting device and a lighting device that radiate light emitted from a light-emitting element to the outside after wavelength conversion with a phosphor.

  A light emitting device that emits white light by converting light such as near ultraviolet light and blue light emitted from a light emitting element 15 such as a conventional light emitting diode (LED) into a red, green, blue, yellow or the like with a plurality of phosphors for a long wavelength. Is shown in FIG. In FIG. 6, the light emitting device has a mounting portion 11a for mounting the light emitting element 15 in the central portion of the upper main surface, and the light emission led out from the mounting portion 11a and its periphery to the outside of the light emitting device. A base body 11 made of an insulator on which a wiring conductor (not shown) made of a lead terminal or metallized wiring for electrically conducting connection between the inside and the outside of the apparatus is bonded and fixed to the upper main surface of the base body 11, A through-hole 12a having an upper opening larger than the lower opening is formed, and an inner peripheral surface of the reflecting member 12 and the reflecting member 12 having a reflecting surface 12b for reflecting light emitted from the light emitting element 15 Consists mainly of a translucent member 13 containing a phosphor 14 that converts the light emitted from the light emitting element 15 that is filled inside into the long wavelength side, and the light emitting element 15 that is mounted and fixed on the mounting portion 11a. Has been.

  The substrate 11 is made of an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, or a resin such as epoxy resin. When the substrate 11 is made of ceramic, the wiring conductor is formed on the upper main surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 11 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded integrally with the resin and provided inside the base 11.

  The reflecting member 12 has a frame shape in which a through hole 12a having an upper opening larger than the lower opening is formed and a reflecting surface 12b for reflecting light is formed on the inner peripheral surface. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

  Further, the reflecting surface 12b of the reflecting member 12 is formed by smoothing the inner peripheral surface of the through hole 12a or by depositing a metal such as Al on the inner peripheral surface of the through hole 12a by vapor deposition or plating. It is formed by. The reflecting member 12 is formed on the upper main surface of the base 11 so that the mounting portion 11a is surrounded by the inner peripheral surface of the reflecting member 12 by a soldering material such as solder, silver (Ag) brazing, or a bonding material such as a resin adhesive. To be joined.

  And the wiring conductor arrange | positioned around the mounting part 11a and the light emitting element 15 are electrically connected through the electrical connection means 16, such as a bonding wire and a metal ball, and after that, the epoxy resin containing the fluorescent substance 14 A light-transmitting member 13 such as silicone resin is injected inside the reflecting member 12 so as to cover the light-emitting element 15 with an injection machine such as a dispenser, and is thermally cured in an oven, so that light from the light-emitting element 15 is emitted by the phosphor. A light emitting device capable of extracting light having a desired wavelength spectrum by converting the wavelength to the long wavelength side can be obtained (see Patent Document 1 below).

A light emitting device in which a lens having a convex surface is installed on the upper surface of the reflecting member 12 has also been proposed (see Patent Document 2 below).
Japanese Patent Laid-Open No. 2003-37298 Japanese Patent Laid-Open No. 10-261821

  In recent years, there has been an increase in the use of the above light emitting devices for illumination, and there is a demand for light emitting devices with good radiation intensity and heat dissipation characteristics.

  However, in the light-emitting device disclosed in Patent Document 1, the translucent member 13 tends to wet and spread so as to scoop up the inner peripheral surface of the reflecting member 12 due to surface tension, and for this reason, it is injected inside the reflecting member 12. There is a problem that the shape of the upper surface of the translucent member 13 is not stable and the surface shape of the upper surface of the translucent member 13 is not stable. Therefore, the emission angle of the light emitted from the upper surface of the translucent member 13 of the light emitted from the light emitting element 15 cannot be made constant, or the luminous flux emitted from the upper surface of the translucent member 13 varies and the radiation intensity The wavelength conversion efficiency cannot be made constant due to variations in the optical path length through which the light emitted from the light emitting element 15 passes through the translucent member 13 containing the phosphor 14, the radiation intensity or There is a problem that on-axis luminous intensity, luminance, color rendering, and the like vary among light emitting devices, and color unevenness and intensity unevenness occur.

  Further, in the light emitting device disclosed in Patent Document 2, since a lens having a convex surface is directly attached to the upper surface of the reflecting member 12, light reflected from the reflecting member 12 is reflected by the reflecting member 12 below the lens. In some cases, the light is not collected by the lens but is emitted from the side surface of the lens and spreads, and the light reflected from the reflecting member 12 cannot be collected by the lens. As a result, there has been a problem that the light-emitting device cannot have a predetermined radiated light angle (light distribution).

  Accordingly, the present invention has been completed in view of the above-mentioned conventional problems, and its purpose is to reduce variations in radiation intensity, axial luminous intensity, luminance, color rendering, etc., and to radiate light to a predetermined radiation. It is an object to provide a light-emitting device and a lighting device that can have a light angle.

  In the light emitting device of the present invention, a base on which a conductor layer to which a light emitting element is electrically connected is formed at the center of the upper main surface, and the upper main surface of the base are joined so as to surround the conductor layer. A frame-shaped reflecting member whose inner peripheral surface is a reflecting surface that reflects light emitted from the light emitting element, a light emitting element electrically connected to the conductor layer, and an inside of the reflecting member are filled A first translucent member that does not contain a phosphor, a cylindrical member that has an inner surface as a reflecting surface and is joined to the upper surface of the reflecting member, and a phosphor that is filled inside the cylindrical member And a lens having a convex surface on the upper surface and a concave portion in which the cylindrical member is fitted on the lower surface.

  In the light emitting device of the present invention, preferably, a convex portion is formed at a central portion of the upper main surface of the base body, the conductor layer is formed on the upper surface of the convex portion, and the light emitting element is It is characterized by being placed.

  The illuminating device of the present invention is characterized by using the light emitting device of the present invention as a light source.

  The light emitting device according to the present invention includes a base having a conductor layer electrically connected to a light emitting element at the center of the upper main surface, and an inner circumference joined to the upper main surface of the base so as to surround the conductor layer. Does not contain a frame-shaped reflecting member whose surface is a reflecting surface that reflects light emitted from the light emitting element, a light emitting element electrically connected to the conductor layer, and a phosphor filled inside the reflecting member A first translucent member, a cylindrical member whose inner surface is a reflective surface and joined to the upper surface of the reflective member, and a second translucent material containing a phosphor filled inside the cylindrical member Since the lens includes a member and a lens having a convex surface on the upper surface and a concave portion on which the cylindrical member is fitted on the lower surface, the light emitted from the light emitting element is uniformly reflected on the reflective surface of the reflective member. It can be reflected uniformly, and the first translucent member is filled inside the container. Since the shape of the first light-transmissive member is stably it is on-axis luminous intensity and brightness is emitted from the container as uniform light. Then, the light emitted from the container is incident on the second translucent member containing the phosphor filled inside the cylindrical member, and the wavelength is converted to the longer wavelength side by the phosphor to obtain a desired wavelength spectrum. However, since the light emitted from the container is uniform, the wavelength conversion efficiency for all the light emitted from the light emitting element can be made constant, and light with less unevenness in color and intensity can be obtained. Furthermore, since this light is radiated toward the lens fitted so as to be covered with the cylindrical member, the amount of leakage from the side surface of the lens can be suppressed, and the light collecting effect of the lens can be increased. Radiation light having a desired radiation angle can be obtained.

  In addition, the non-transparent cylindrical member is bonded to the lens, and the lower surface of the cylindrical member is bonded to the upper surface of the reflective member, as compared with the case where a transparent lens is bonded to the reflective member. Therefore, it is possible to perform the process after the base is soldered to the external electric circuit board. This makes it easy to attach the lens and the cylindrical member after attaching the base, even when the lens material cannot withstand the heat applied at the time of joining such as soldering when mounted on the external electric circuit board, Radiation light having a desired radiation angle can be obtained without impairing the performance of the lens.

  As a result, a light emitting device having excellent light characteristics such as radiation intensity, axial luminous intensity, luminance, and color rendering can be obtained.

  In the light emitting device according to the present invention, preferably, a convex portion is formed at the center of the upper main surface of the substrate, a conductor layer is formed on the upper surface of the convex portion, and the light emitting element is mounted. Accordingly, the light emitted downward from the light emitting element can be reflected to the outside of the light emitting device by the reflecting member, and the light emitting apparatus capable of radiating the light emitted from the light emitting element without waste.

  Since the lighting device of the present invention uses the light-emitting device of the present invention as a light source, it can utilize light emitted from a light-emitting element made of semiconductor, and illumination using a conventional discharge by the light-emitting element made of semiconductor. It has lower power consumption than the device, can have a long life, and can be a small lighting device. In addition, since the thickness of the second translucent member containing the phosphor can be made constant, fluctuations in the center wavelength of light emitted from the light emitting element can be suppressed, and stable radiation intensity and radiation angle can be maintained over a long period of time. Can emit light, and the illumination device can have less uneven color and uneven illuminance distribution on the irradiated surface.

  In addition, the light emitting device of the present invention is used as a light source, and by installing a reflector, an optical lens, a light diffusing plate, etc. optically designed in an arbitrary shape around these light emitting devices, light having an arbitrary light distribution It can be set as the illuminating device which radiates.

  The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In the figure, 1 is a base, 1a is a mounting portion of the base 1 on which a light-emitting element 5 is formed, 2 is a reflecting member, 3 is a first translucent member that does not contain a phosphor, 4 is a second translucent member containing phosphor, 5 is a light emitting element, 6 is a cylindrical member, 7 is a lens having a convex surface on the upper surface, 7 a is a concave portion on the lower surface of the lens 7, and emits light mainly by these. A light emitting device is configured in which light emitted from the element 5 is emitted to the outside with directionality.

  The light-emitting device of the present invention is joined to the base 1 in which a conductor layer to which the light-emitting element 5 is electrically connected is formed at the center of the upper main surface, and the upper main surface of the base 1 so as to surround the conductor layer. The frame-shaped reflecting member 2 whose inner peripheral surface is a reflecting surface 2 b that reflects light emitted from the light emitting element 5, the light emitting element 5 electrically connected to the conductor layer, and the inner side of the reflecting member 2 The first translucent member 3 that does not contain the phosphor filled in the container composed of the base 1 and the reflecting member 2, and the cylindrical shape whose inner surface is the reflecting surface and is joined to the upper surface of the reflecting member 2 A member 6, a second translucent member 4 containing a phosphor filled inside the cylindrical member 6, and a concave portion 7 a having a convex surface on the upper surface and fitting the cylindrical member 6 on the lower surface are provided. Lens 7 formed.

  The substrate 1 in the present invention is made of ceramics such as alumina ceramics, aluminum nitride sintered bodies, mullite sintered bodies, glass ceramics, resins such as epoxy resins, metals, or the like. The base body 1 has a mounting portion 1a on which the light emitting element 5 is mounted, and a conductive layer to which an electrode of the light emitting element 5 is electrically connected is formed on the mounting portion 1a.

  Preferably, as shown in FIG. 1, the mounting portion 1 a is preferably formed on the upper surface of the convex portion 1 b protruding from the upper main surface of the base body 1, thereby emitting light downward from the light emitting element 5. The light to be reflected can be easily reflected by the reflecting member 2, and it is prevented that the light is absorbed by multiple reflection by the mounting portion 1a and the like, and most of the light emitted from the light emitting element 5 is emitted from the light emitting device. Can be used for light. As a result, the light emitting characteristics of the light emitting element 5 can be maximized, and a light emitting device having excellent light characteristics such as on-axis luminous intensity, luminance, and color rendering can be obtained.

  Further, the mounting portion 1a formed as the convex portion 1b protruding from the upper main surface of the base body 1 makes it easy to mount the light emitting element 5 on the mounting portion 1a, and accurately and easily place the light emitting element 5 at a desired position. There is also an effect that it can be placed on

  In this case, the mounting portion 1a is formed by removing the periphery of the mounting portion 1a of the base body 1 by means such as cutting, mechanical polishing, or blast polishing, or by die molding or ceramic green sheet lamination. 1 can be formed integrally. Or you may join the member used as the mounting part 1a to the upper side main surface of the base | substrate 1 with an adhesive agent.

  On the upper surface of the mounting portion 1a on the upper main surface of the substrate 1, a conductor layer is formed, to which the electrodes of the light emitting element 5 are electrically connected via an electrical connection means such as solder. The pattern for electrical connection by the conductor layer is led out to the outer surface of the light emitting device via a wiring conductor (not shown) formed in the base 1 and connected to the external electric circuit board. An external electric circuit is electrically connected.

  As a method of connecting the light emitting element 5 to the conductor layer, a method of connecting via wire bonding or a method using a flip chip bonding method in which the lower surface of the light emitting element 5 is connected by an electrical connecting means such as a solder bump is used. Used. Preferably, the connection is made by a flip chip bonding method. Accordingly, since the conductor layer can be provided immediately below the light emitting element 5, it is not necessary to provide a space for providing an electrical connection pattern on the upper surface of the base 1 around the light emitting element 5. Therefore, it is possible to prevent the light emitted from the light emitting element 5 from being absorbed by the electrical connection pattern of the substrate 1 and the axial luminous intensity from being lowered.

  The conductor layer serving as the electrical connection pattern is, for example, a lead terminal made of Fe-Ni-Co alloy or the like by forming a metallized layer of a metal powder such as W, Mo, Cu, or Ag on the surface and inside of the substrate 1. Is embedded in the base 1 and one end is exposed to the mounting portion 1a, or an input / output terminal made of an insulator on which a wiring conductor is formed is fitted and joined to a through hole provided in the base 1. .

  The exposed surface of the electrical connection pattern should be coated with a metal having excellent corrosion resistance, such as Ni or gold (Au), with a thickness of about 1 to 20 μm. Can be effectively prevented, and the connection between the light emitting element 5 and the electrical connection pattern can be strengthened. Therefore, for example, an Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the electrical connection pattern by an electrolytic plating method or an electroless plating method. More preferably.

  Further, the reflecting member 2 is attached to the upper surface of the base 1 with a bonding material such as solder, a brazing material such as Ag brazing, or a resin adhesive such as epoxy resin. The reflecting member 2 is formed such that the through hole 2a is inclined at the center at the center, and the inner peripheral surface of the through hole 2a reflects the light emitted from the light emitting element 5 at the center. It is said that.

  The reflecting member 2 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Further, the reflecting surface 2b formed on the inner peripheral surface of the through hole 2a is not particularly limited as long as it reflects light, but the inner peripheral surface of the through hole 2a is polished in order to obtain a higher reflectance. Or by smoothing by pressing a mold or the like, or by plating, vapor deposition, or the like on the inner peripheral surface of the through hole 2a, for example, Al, Ag, Au, platinum (Pt), titanium (Ti), chromium (Cr) The reflective surface 2b is formed by forming a metal thin film layer having a high reflectance such as Cu and Cu.

  In addition, the arithmetic average roughness Ra of the surface of the reflecting surface 2b is preferably 0.004 to 4 μm, whereby the reflecting surface 2b can favorably reflect the light from the light emitting element 5 and the phosphor. When Ra exceeds 4 μm, it becomes difficult to uniformly reflect the light of the light emitting element 5 and it becomes easy to diffusely reflect inside the light emitting device. On the other hand, if it is less than 0.004 μm, it tends to be difficult to form such a surface stably and efficiently.

  The reflecting surface 2b has, for example, a linear inclined surface as shown in FIG. 1 whose longitudinal cross-sectional shape spreads outward as it goes upward, a curved inclined surface that spreads outward as it goes upward, Or shapes, such as a linear inclined surface where an inclination angle changes in the middle, are mentioned.

  The reflecting member 2 may be attached to any part other than the mounting portion 1 a on the upper surface of the base 1, but has a desired surface accuracy around the light emitting element 5, for example, in the longitudinal section of the light emitting device, the light emitting element 5. It is preferable that the reflective surface 2b is provided so that the reflective surface 2b provided on both sides of the light-emitting element 5 is symmetrical with the reflective surface 2b interposed therebetween. Thereby, not only the wavelength of the light from the light emitting element 5 is converted by the phosphor contained in the second light transmissive member 4 and directly emitted to the outside, but also the light emitted from the light emitting element 5 in the lateral direction or the like The light emitted downward from the phosphor can be uniformly reflected by the reflecting surface 2b, and the on-axis luminous intensity, luminance, color rendering, etc. can be effectively improved.

  In particular, the closer the reflection member 2 is to the placement portion 1a, the more prominent the above effect is. Thereby, by enclosing the circumference | surroundings of the mounting part 1a with the reflection member 2, more light can be reflected and it becomes possible to obtain a higher on-axis luminous intensity.

  The first translucent member 3 is a transparent member made of a transparent resin such as an epoxy resin or a silicone resin, sol-gel glass, or the like. As shown in FIG. 1, the first translucent member 3 can be formed by pouring an uncured liquid material onto the upper surface of the light emitting element 5 with an injection machine such as a dispenser and then curing. The first translucent member 3 also has a function of protecting the light emitting element 5.

  The second translucent member 4 is a phosphor that is excited by light emitted from the light-emitting element 5 to a transparent member made of a transparent resin such as epoxy resin or silicone resin, sol-gel glass, or the like, and converts it into long-wavelength fluorescence. It is contained. The second translucent member 4 is prepared by injecting an uncured liquid material in which a phosphor is dispersed into the cylindrical member 6 with an injection machine such as a dispenser, or by cutting out a previously prepared tape-shaped tube. The cylindrical member 6 is filled by being inserted and fixed in the cylindrical member 6. Here, it is important that the second translucent member 4 has a constant thickness and the phosphor is uniformly dispersed. With this configuration, the light emitted from the light-emitting element 5 is extended by the phosphor. It is possible to obtain light having a desired wavelength spectrum by reliably converting the wavelength to the wavelength side.

  The cylindrical member 6 is installed so that the light whose wavelength is converted into light having the desired wavelength spectrum by the second light-transmissive member 4 containing the phosphor does not leak to the side surface, and the inner surface is the reflection member 2. It is set as the same reflective surface. The inner diameter dimension of the lower end of the cylindrical member 6 is larger than the inner diameter dimension of the upper end opening of the through hole 2a of the reflecting member 2 so as to prevent the lower surface of the cylindrical member 6 from blocking the light reflected from the reflecting member 2. It is good to form so that it may become large. In addition to the cylindrical shape, the inner surface of the cylindrical member 6 may be an inclined surface that spreads outward as it goes upward as in the reflective member 3. The outer peripheral surface of the cylindrical member 6 has a shape that can be fitted into a cylindrical recess 7 a provided on the lower surface of the lens 7.

  The cylindrical member 6 is made of metal, ceramics, resin, or the like, and is formed by performing cutting processing, mold forming, or the like. Furthermore, the inner peripheral surface of the cylindrical member 6 is a light reflecting surface. Such a reflective surface is not particularly limited as long as it reflects light, but the inner peripheral surface of the cylindrical member 6 is polished in the same manner as the reflective surface 2b of the reflective member 2 in order to obtain a higher reflectance. Or smoothing by pressing a mold or the like, or by applying high reflectivity such as Al, Ag, Au, Pt, Ti, Cr, Cu to the inner peripheral surface of the cylindrical member 6 by plating or vapor deposition, for example. Alternatively, a metal thin film may be formed.

  As a result, the light converted into the desired wavelength spectrum by wavelength conversion can be efficiently emitted to the lower side of the lens 7. Therefore, the direct light emitted upward from the light emitting element 5 and the light reflected from the reflecting member 2 are reliably transmitted to the lower part of the lens 7 and can be condensed on the lower part of the lens 7. As a result, the light emitted from the light emitting element 5 can be emitted at a desired radiation angle by the lens 7 having a convex surface. The cylindrical member 6 is attached to the upper surface of the reflecting member 2 by a bonding material such as an epoxy resin.

  The lens 7 having a convex surface on the upper surface is formed from a transparent member made of a transparent resin such as acrylic resin, epoxy resin, or silicone resin, sol-gel glass, or the like. A concave portion 7a is provided on the lower surface that is the opposite surface of the convex surface, and the side surface of the concave portion 7a and the tubular member 6 are attached by a bonding material such as epoxy resin. Alternatively, it is attached by setting the cylindrical member 6 in a mold in the portion that becomes the concave portion 7a and integrally molding the lens 7. In addition, since the concave surface 7a is provided on the lower surface that is the opposite surface of the convex surface, and the cylindrical member 6 is attached to the concave portion 7a, the lens 7 can be firmly fixed to the cylindrical member 6.

  Compared with the case where the transparent lens 7 is bonded to the reflecting member 2, the opaque cylindrical member 6 is fitted to the lens 7, and the lower surface of the cylindrical member 6 is aligned with the upper surface of the reflecting member 2. It becomes easy. This facilitates assembly by an automatic assembly machine or the like based on image recognition, so that the reflecting member 2 and the cylindrical member 6 can be joined after the substrate 1 is soldered to the external electric circuit board. Even when the material of the lens 7 cannot withstand the heat applied at the time of joining such as soldering when mounted on the external electric circuit board, it is possible to make the emitted light at a desired radiation angle without impairing the performance of the lens 7. it can.

  In addition, the light emitting device of the present invention may be arranged in a predetermined arrangement by using one light source as a light source, or a plurality of light emitting devices, for example, a lattice shape, a staggered shape, a radial shape, a concentric shape such as a circular shape or a polygonal shape. It can be set as an illuminating device by using as a light source arranged in the. As a result, the illumination device of the present invention has lower power consumption and longer life than the illumination device using the conventional discharge when light emission by the light emitting element 5 made of a semiconductor is used. A small lighting device with little heat generation can be obtained. In addition, since the thickness of the second translucent member 4 containing the phosphor can be made constant, fluctuations in the center wavelength of the light emitted from the light emitting element 5 can be suppressed, and the radiation intensity stable over a long period of time and While being able to radiate | emit light with a radiation | emission angle, it can be set as the illuminating device with few unevenness of color in an irradiation surface, and the bias | inclination of illumination distribution.

  For example, as shown in FIG. 2 and FIG. 3, a plurality of light emitting devices 101 of the present invention are arranged in a plurality of rows on the light emitting device driving circuit board 102, and a desired shape is formed around the light emitting device 101. In the case of an illuminating device in which an optically designed reflector 103 is installed, an arrangement in which adjacent rows of light emitting devices 101 are arranged between a plurality of light emitting devices 101 arranged in a row, a so-called staggered arrangement. It is preferable. That is, when the light emitting devices 101 are arranged in a grid, glare is strengthened by arranging the light emitting devices 101 as light sources on a straight line, and such a lighting device enters human vision. However, since the light emitting device 101 is arranged on a plane at almost equal intervals by using a staggered pattern, glare is suppressed and discomfort to the human eye is reduced. The damage to the eyes can be reduced. Furthermore, compared with the case where the light emitting devices 101 are arranged on a straight line, the distance between the adjacent light emitting devices 101 is increased, so that thermal interference between the adjacent light emitting devices 101 is suppressed, and the light emitting device 101 is mounted. Thus, heat accumulation in the light emitting device driving circuit board 102 is suppressed, and heat is efficiently dissipated outside the light emitting device 101. As a result, it is possible to manufacture a long-life lighting device with stable optical characteristics over a long period of time with little obstacles to human eyes.

  In addition, the lighting device is a concentric arrangement of a circular or polygonal light emitting device 101 group composed of a plurality of light emitting devices 101 on the light emitting device driving circuit board 102 as shown in the plan view and the sectional view shown in FIGS. In the case of the illuminating devices arranged in a plurality of groups, it is preferable that the number of the light emitting devices 101 in one circular or polygonal light emitting device 101 group is increased from the central side to the outer peripheral side of the illuminating device. Thereby, it is possible to arrange more light emitting devices 101 while maintaining an appropriate interval between the light emitting devices 101, and it is possible to further improve the illuminance of the lighting device. In addition, the density of the light emitting device 101 in the central portion of the lighting device can be reduced to suppress heat accumulation in the central portion of the light emitting device driving circuit board 102. Therefore, the temperature distribution in the light emitting device driving circuit board 102 becomes uniform, heat is efficiently transmitted to the external electric circuit board and the heat sink on which the lighting device is installed, and the temperature rise of the light emitting device 101 can be suppressed. As a result, the light-emitting device 101 can operate stably over a long period of time, and a long-life lighting device can be manufactured.

  Examples of such lighting devices include general lighting fixtures, chandelier lighting fixtures, residential lighting fixtures, office lighting fixtures, store lighting, display lighting fixtures, and street lamp lighting fixtures that are used indoors and outdoors. , Guide light fixtures and signaling devices, stage and studio lighting fixtures, advertising lights, lighting poles, underwater lighting lights, strobe lights, spotlights, security lights embedded in power poles, emergency lighting fixtures, flashlights , Electronic bulletin boards and the like, backlights such as dimmers, automatic flashers, displays, moving image devices, ornaments, illuminated switches, optical sensors, medical lights, in-vehicle lights, and the like.

  In addition, this invention is not limited to the example of the above embodiment, If it is in the range which does not deviate from the summary of this invention, it will not interfere at all.

  For example, a plurality of light emitting elements 5 may be mounted on the base 1 in order to improve the radiation intensity. It is also possible to arbitrarily adjust the angle of the reflecting surface 2b. Thereby, a better color rendering can be obtained by providing a complementary color gamut.

  Further, the lighting device of the present invention is not limited to one in which a plurality of light emitting devices 101 are installed in a predetermined arrangement, but may be one in which one light emitting device 101 is installed in a predetermined arrangement. For example, one light emitting device 101 may be arranged at the center of the lighting device.

It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. It is a top view which shows an example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is a top view which shows the other example of embodiment of the illuminating device of this invention. It is sectional drawing of the illuminating device of FIG. It is sectional drawing which shows the example of the conventional light-emitting device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1: Base | substrate 1a: Mounting part 1b: Convex part 2: Reflective member 2b: Reflective surface 3: 1st translucent member 4: 2nd translucent member 5: Light emitting element 6: Tubular member 7: Lens 7a: recess
101: Light-emitting device
102: Light-emitting device drive circuit board
103: Reflector

Claims (3)

A base having a conductor layer electrically connected to the light emitting element at the center of the upper main surface, and an inner peripheral surface joined to the upper main surface of the base so as to surround the conductor layer. A frame-like reflecting member that is a reflecting surface that reflects light emitted from the light emitting element, a light emitting element that is electrically connected to the conductor layer, and a phosphor that does not contain a phosphor filled inside the reflecting member. A translucent member, a cylindrical member having an inner surface as a reflecting surface and bonded to the upper surface of the reflecting member, and a second translucent material containing a phosphor filled inside the cylindrical member A light emitting device comprising: a member; and a lens having a convex surface on an upper surface and a concave portion in which the cylindrical member is fitted on a lower surface. The convex part is formed in the center part of the upper side main surface of the said base | substrate, The said light emitting element is mounted while the said conductor layer is formed in the upper surface of this convex part. The light-emitting device of description. An illumination device comprising the light-emitting device according to claim 1 as a light source.

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