JP2714272B2 - Electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in an electronic component on which a semiconductor chip is mounted.

[0002]

2. Description of the Related Art FIG. 6 is a diagram showing a configuration of a conventional LED lamp. The conventional LED lamp has a cathode electrode 51.
b, a semiconductor chip 53 is mounted via a silver paste 52 or the like.
4 was connected to the anode electrode 51a. Then, the semiconductor chip 53 and the electrode portion around the semiconductor chip were molded with the transparent resin 55.

Another example of the configuration of an LED lamp is disclosed in Japanese Patent Laid-Open No. 1-283883. In this method, a three-dimensional pattern plating electrode portion is provided on a concave portion of a reflective case having a concave surface, and a semiconductor chip is mounted on this electrode portion.

[0004]

However, the conventional L
The ED lamp has the following problems.

In the LED lamp shown in FIG. 6, the semiconductor chip 53 is assayed and then resin-molded, and the electrodes 51 a and 51 b are fixed by the transparent resin 55. In this configuration, the electrodes 51a and 51b are fixed only by the transparent resin 55, and the assayed soldering strength and mechanical strength of the semiconductor chip 53 depend only on the fixing strength of the transparent electrode 55 and the electrodes 51a and 51b. However, there was a problem that the strength was poor. Particularly, the transparent resin used for the mold is inferior in strength, and the problem of strength is great.

In the technology disclosed in Japanese Patent Application Laid-Open No. 1-283883, (a) special patterning on a three-dimensional substrate is required for forming an anode electrode and a cathode electrode.
(b) Since the semiconductor chips are assayed in a matrix, dicing must be performed in a lattice after the completion of the assay, and the frame is fixed in advance to a film or the like, and then cut in two directions in the XY directions by a dicing device. , It must be separated and the cutting work is troublesome, (c) anode electrode,
Each electrode of the cathode electrode is a cut surface of a through hole formed at the time of dicing, and has a shape that is inserted into one part of one side of the chip component and further into the inside thereof, which becomes an obstacle for improving the soldering strength of the electrode. .

It is an object of the present invention, together with the electrode is reliably and easily patterned, it is to provide an electronic component that can have a sufficient strength.

[0008]

Means for Solving the Problems] The present invention, Ri by the continuous two-color extrusion molding, plating can be resin electrode facing portion of the surface
In addition to arranging materials, non-plated
Molding the rod-like resin molded article was placed fat material of the bar
Plating is applied to the resin molded product and molded with a resin material that can be plated.
Forming an electrode pattern on the
The semiconductor chip is mounted in an array on, the rod-like resin formed
It is characterized in that the shape is cut and separated in the short side direction .

[0009]

The electronic part of the present inventionGenuineResin molded product as base
IsUsing a resin material that can be plated and a resin material that cannot be plated
By continuous two-color extrusion moldingrodMolded into a shape, ThatTable
A resin material that can be plated is placed on the electrode facing part of the surface,
Non-plateable resin material is placed on the non-electrode facing part.
When plating is applied to the entire resin molded product, plating is possible
Only the part molded with resin material is plated and the electrode pattern
Is formed. A semiconductor chip is placed on this electrode pattern.
After mounting in a lay shape, a bar-shaped resin molded product is
Than cutting and separatingElectronic components one by oneIs obtained
You.

[0010]

FIG. 1 is a perspective view showing a lead frame according to an embodiment of the present invention, FIG. 2 is an external view of an LED lamp formed from the lead frame, and FIG. 3 is a view showing a manufacturing process of the LED lamp. FIG. 4 is a view showing a state where the LED lamp is mounted on a board, and FIG. 5 is a view showing a lead frame forming apparatus.

First, a resin molded product 1 used in this embodiment
Is molded by a two-color continuous extrusion molding machine. As shown in FIG. 5, the two-color continuous molding machine is configured to inject different resin materials into the inner frame and the outer frame of the mold 10, respectively. Possible resin A
Is injected, and the non-plateable resin B is injected into the inner frame. As the resin A that can be plated, for example, ABS (acrylonitrile-butadiene copolymer), PP (polypropylene) or the like is used. As the resin B that cannot be plated, for example, a liquid crystal polymer, PEI (polyetherimide), or the like is used. . By extruding the two types of resins A and B, a non-plateable resin 3 (resin B) is formed on the inside as shown in FIG. 3A, and an anode electrode and a cathode electrode around the resin 3 are formed. Resin 2 (resin A), which can be plated, is formed on the parts to be plated.

The resin molded article 1 formed by continuous extrusion is plated with Ag, Au or the like. At this time, the metal such as Ag, Au, etc.
Is plated only on the surface, and the non-plateable resin 3 does not adhere to the exposed portion of the surface. As described above, the resin 2 that can be plated is provided in a portion where an anode electrode is to be formed and a portion where a cathode electrode is to be formed.
Therefore, when plating is performed on the surface of the resin molded product 1,
The anode electrode 4a and the cathode electrode 4b are formed by the plating metal (see FIG. 3B). FIGS. 1 and 3C show the electrodes 4a and 4b thus formed.
As shown in (1), the semiconductor chip 5, which is a light emitting diode element, is bonded. The resin molded article 1 as shown in FIG. 1 is configured to rod shape, the semiconductor chip 5 for each one one electronic component (LED lamp) are bonded (assay), after drawing a single point in the dicing step of Each LED lamp is cut in the short side direction of the rod-shaped resin molded product 1 at the position indicated by the chain line.

The resin molded article 1 on which the semiconductor chip 5 has been assayed is molded with a transparent resin 6. The semiconductor chip 5 is protected by this resin mold. The resin molded product 1 after the resin molding is diced at the position indicated by the dashed line as shown in FIG. 1, and the product (LE) shown in FIG.
D lamp). This LED lamp can be mounted on the substrate 7 by a method such as solder reflow as shown in FIG. In the figure, reference numeral 8 denotes solder.

[0014]

According to the present invention, the following effects can be obtained.

[0015] By continuous two-color extrusion molding, the surface of the resin-formed product is previously divided into a portion where an electrode is to be formed and a portion where no electrode is to be formed, and an electrode is formed only by plating on a portion where an electrode is to be formed. . As described above, the electrode can be patterned only by performing continuous two-color extrusion molding, and a complicated patterning step and a stamping step are not required, and an inexpensive frame can be formed.

The anode electrode and the cathode electrode are formed by plating on a resin molded product, and are mechanically firmly fixed as compared with a conventional configuration in which a frame on a plate is fixed with resin. Thus, an electrically stable state is obtained. Therefore, sufficient strength against thermal stress and external stress in the soldering configuration can be obtained.

Since the resin molded product is configured such that electronic components are arranged in an array, the anode electrode and the cathode electrode may be configured to penetrate in the lateral direction, and the electronic components may be configured in a matrix. It is not necessary to divide the electrodes in the vertical direction as compared with the case where it is performed, and the electrode area can be increased. For this reason, there is an advantage that the adhesiveness when the semiconductor chip is assayed is improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a state in which a semiconductor chip is assayed on a resin molded product of a lead frame according to an embodiment of the present invention.

FIG. 2 is a view showing an LED lamp configured using the lead frame.

FIG. 3 is a view showing a manufacturing process of the LED lamp.

FIG. 4 is a diagram showing a state in which the LED lamp is mounted on a substrate.

FIG. 5 shows a continuous two-color extruder.

FIG. 6 is a diagram showing a configuration of a conventional LED lamp.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Resin molded article 2 Plating resin material 3 Non-plating resin material 4a Anode electrode 4b Cathode electrode 5 Semiconductor chip 6 Transparent resin 7 Mounting substrate 8 Solder

Claims (1)

(57) [Claims] 1. A Ri by the continuous two-color extrusion molding, the surface of the electrode
Placing a resin material that can be plated on the opposite part,
Bar-shaped resin molding with non-plateable resin material placed on the opposite part
The product is molded, and the rod-shaped resin molded product is plated.
An electrode pattern is formed on a part formed of a material, and semiconductor chips are mounted in an array on the electrode pattern.
Then, the rod-shaped resin molded product is cut in the short side direction, separated and formed.
Electronic components, characterized in that the.