JP2001332767A - Led element and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a LED element without any burrs on the end face of a substrate. SOLUTION: In this LED element, a LED chip 8 is mounted onto a substrate 1 that is composed by forming a conductive layer on both the front and rear surfaces of an insulating base where glass cloth is covered with resin. In this case, on one side end face 1a of parallel, two sets of side end faces of the rectangular substrate 1, the glass cloth is buried in the resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED device and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 7A and 7B show a prior art of a substrate used for an LED element, wherein FIG. 7A is a perspective view, and FIG.
It is sectional drawing which expanded and showed the part in the circle S inside. As shown in FIG. 7B, the substrate 11 is formed by bonding the copper foil 3 to the front and back surfaces of the insulating base material 12 with an adhesive. The insulating substrate 12 is made of a glass cloth 4 and a resin 5 such as epoxy which covers the surface of the glass cloth 4. The glass cloth 4 is a plain weave of glass fiber bundles as shown in detail in FIG.

Further, as shown in FIG.
1 is provided with a plurality of elongated first slits 6 so as to be substantially parallel to each other. A plurality of lands 7 for mounting an LED chip are formed between adjacent first slits 6.

FIG. 8 is a perspective view of a conventional LED element manufactured from the substrate 11. In order to manufacture this LED element, first, an LED chip 8 (shown in FIG. 8) is mounted on the land 7 of the substrate 11 shown in FIG.
(See FIG. 8, mold resin 9). Then, in order to make the conductive layer 3 on the front surface of the substrate 11 conductive with the conductive layer 3 on the rear surface, the inner surface of the first slit 6 is subjected to electroless plating and copper plating. Finally, each L in the dashed line A
The substrate 11 is cut by a cutter for each ED chip 8 to obtain an LED element shown in FIG.

[0005]

The above-described conventional substrate 1
In 1, an insulating substrate 12 made of a glass cloth 4 and a resin 5
After the copper foil 3 is bonded to the substrate, the first slit 6 is formed by NC processing or punching processing. At this time, the glass cloth 4 is cut by a drill, a router, or a punching die, and the inner surface of the first slit 6 becomes a burr that is exposed in a state where the glass fiber is held down and protrudes downward from the substrate 11. Thereafter, when electroless plating or copper plating is performed, the plating solution adheres to the burrs, and the burrs further grow.

Further, when the substrate 11 is cut off by a dashed line A for each LED chip 8, the cutter cuts the glass cloth 4, so that the glass fiber is exposed in a cut state on the cut surface to become burrs. Thus, the substrate 11
When the LED element having a burr on the side surface of the LED must be mounted on the wiring board at a small interval from other electric components, the burr may interfere with the LED element and good positional accuracy may not be obtained.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an LED element having no burr on a side end face of a substrate and a method of manufacturing the same.

[0008]

Means for Solving the Problems To achieve the above object, an LED element according to the present invention comprises an insulative substrate in which a glass cloth is covered with a resin and a conductive layer formed on both front and back surfaces of the substrate. In an LED element having a chip mounted thereon, at least one of two sets of parallel side end faces of a rectangular substrate is provided.
The glass cloth is buried in the resin on the side end surfaces of the pair. That is, there is no burr since the glass cloth is not exposed at the side end surface.

In the above-mentioned LED element, the volume ratio of glass cloth in the insulating base material is preferably 80%. Thereby, this insulating base material can maintain sufficient rigidity.

[0010] The method of manufacturing an LED element of the present invention comprises:
Forming a conductive layer on each of the front and back surfaces of an insulating base material covered with a glass cloth with a resin to form a substrate; and forming a plurality of elongated first slits on the substrate so as to be positioned substantially parallel to each other. Mounting a plurality of LED chips on a substrate between adjacent first slits and molding each; and plating the inner surface of the first slit with a conductive layer on the front surface and a conductive layer on the back surface of the substrate. And a step of cutting the substrate in a direction substantially perpendicular to the first slit for each LED chip.

Here, the glass cloth of the insulating base material is provided with a plurality of elongated second slits positioned substantially parallel to each other, and the second slit is filled with resin. Then, in the step of forming the first slit, the substrate is cut so that the first slit is located inside the second slit. That is, since the resin filled in the second slit of the glass cloth is cut off to form the first slit of the substrate, the glass cloth is not exposed on the cut surface, that is, the inner surface of the first slit.

In another method of manufacturing an LED element according to the present invention, a step of forming a conductive layer on each of the front and back surfaces of an insulating substrate having a glass cloth covered with a resin to form a substrate; A step of forming elongated slits so as to be located substantially parallel to each other, a step of mounting a plurality of LED chips on a substrate between adjacent slits and molding and sealing each, and plating an inner surface of the slit by plating. The method includes the steps of conducting the conductive layer on the front surface and the conductive layer on the back surface of the substrate, and cutting the substrate in a direction substantially perpendicular to the slit for each LED chip.

Here, in the insulating base material, a plurality of band-shaped glass cloths are arranged in a resin at predetermined intervals. In the step of cutting the substrate for each LED chip, the substrate is cut between adjacent glass cloths. That is, since the resin filled between the glass cloths is cut to separate the substrate, the glass cloth is not exposed on the cut surface.

In the method of manufacturing an LED element according to the present invention, when cutting a portion of the substrate where no glass cloth is interposed, a portion at least 0.05 mm away from an end of the glass cloth is cut. Thus, even if the tool for cutting the substrate is slightly displaced, the glass cloth is not cut.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

First, a first embodiment according to the present invention will be described. 1A and 1B show a configuration of a substrate 1 used for the LED element of the present embodiment, wherein FIG. 1A is an explanatory view showing a state during the manufacture of the substrate 1, and FIG. 1B is a perspective view of a glass cloth 4. . This substrate 1 is made of glass cloth 4 as in the prior art.
A copper foil 3 is adhered to both front and back surfaces of an insulating substrate 2 made of resin and resin 5.

In order to manufacture the substrate 1, as shown in FIG. 1 (a), first, a layer of a resin 5 is formed on a lower copper foil 3 via an adhesive (not shown). The glass cloth 4 is placed thereon. The glass cloth 4 is, as shown in FIG.
The plurality of elongated second slits 10 are formed so as to be located substantially parallel to each other. This glass cloth 4
The resin 5 is further filled in the second slit 10 while a layer of the resin 5 is further formed thereon. Then, the upper copper foil 3 is bonded onto the resin 5 with an adhesive.

FIG. 2A is a front view of the substrate 1, and FIG. 2B is a sectional view. Thereafter, the first slit 6 is formed in the substrate 1 by NC processing or punching processing in the same manner as the conventional substrate 11 shown in FIG. The position where the first slit 6 is formed is indicated by a chain line 6. Then, a plurality of lands 7 are also formed.

Here, the first slit 6 is formed inside the second slit (dotted line 10 in the figure) of the glass cloth 4.
As a result, as shown in FIG. 3B, the NC drill, the router, and the punching die for punching cut off only the copper foil 3 and the resin 5 on the surface but do not cut the glass cloth 4. Therefore, on the inner side surface of the first slit 6 (indicated by the alternate long and short dash line 6 in FIG. 2B), no burr occurs due to glass fibers.

FIG. 3 shows the LED element of the present embodiment manufactured from the substrate 1. In order to manufacture the LED element, first, the LED chips 8 are mounted on the lands 7 of the substrate 1, respectively, and the LED chips 8 are molded and sealed (mold resin 9). Then, in order to conduct the conductive layer 3 on the front surface of the substrate 1 and the conductive layer 3 on the back surface, electroless plating and copper plating are performed on the inner surface of the first slit 6. Finally, the substrate 1 is cut off for each LED chip 8 by a cutter to obtain an LED element shown in FIG. The cutting position of the substrate 1 is the same as the one-dot chain line A of the conventional substrate 1 shown in FIG.

As shown in FIG. 2B, the inner surface of the first slit 6 (dashed line 6) has only the surface of the resin 5, and the end of the glass cloth 4 is buried. Therefore, in the LED element of this embodiment shown in FIG.
The end of the glass cloth 4 is located inside the terminal end face 1a, which was the inner side of the glass cloth 4 (in the figure, the dotted line B is the end of the glass cloth 4).

Here, in order to prevent the glass cloth 4 from being cut off even if the tool used for the NC processing or the punching processing is displaced, a second slit (dotted line) 10 in FIG.
From the first slit (dashed line) 6 which is the cutting position of the substrate 1
Is preferably at least 0.05 mm. For example, when it is desired to set the width L2 of the first slit 6 to 0.8 mm, the width L3 of the second slit 10 may be set to about 0.9 mm.

Next, a second embodiment according to the present invention will be described. 4A and 4B show a substrate 1 used for the LED element of the present embodiment, wherein FIG. 4A is a front view and FIG. 4B is a sectional view. This substrate 1 is made of a copper foil 3 on both front and back surfaces of an insulating base 2 made of a glass cloth 4 and a resin 5 as in the prior art.
Are bonded to form a plurality of first slits 6. The difference from the prior art is that a plurality of belt-shaped glass cloths 4 arranged at equal intervals are sealed with a resin 5 to form an insulating substrate 2. In FIG. 3A, a dotted line C indicates the position of the glass cloth 4 in the substrate 1.

FIG. 5 shows an LED device manufactured from the substrate 1. In order to manufacture the LED element, first, the LED chips 8 are mounted on the lands 7 of the substrate 1, respectively.
The chip 8 is molded and sealed (mold resin 9). Then, in order to make the conductive layer 3 on the front surface of the substrate 1 conductive with the conductive layer 3 on the back surface, electroless plating and copper plating are performed on the inner surface of the first slit 6. Finally, the substrate 1 is each L
Each ED chip 8 is cut off (dotted line A in FIG. 4) to obtain the LED element shown in FIG.

Here, the plurality of strip-shaped glass cloths 4 in the insulating base material 2 are arranged so as to avoid the cutting position (dashed line A) of the substrate 1. Therefore, as shown in FIG. 4B, the cutter cuts off only the copper foil 3 and the resin 5 on the surface and does not cut the glass cloth 4. Therefore, no burrs due to the glass fiber are generated on the cut surface (dashed line A in FIG. 2B).

As shown in FIG. 4B, the cut surface of the substrate 1
(Dashed-dotted line A) has only the resin 5 on the surface, and the end of the glass cloth 4 is buried. Therefore, in the LED element of the present embodiment shown in FIG. 5, the end of the glass cloth 4 is located inside (the dotted line C) on the side end face 1b which was once the cut surface of the substrate 1.

Here, in order to prevent the glass cloth 4 from being cut off even if the teeth of the cutter are displaced, the cutting position of the substrate from the end (dotted line C) of the glass cloth 4 in FIG.
It is preferable that the distance L4 to (the dashed line A) is at least 0.05 mm. Actually, since the tooth width of the cutter must be considered, if the tooth width is set to 0.2 mm, the interval L5 between the glass cloths 4 is preferably set to about 0.3 mm.

Incidentally, in order to avoid the formation position of the first slit 6 in the first embodiment described above, the strip-shaped glass cloths 4 are arranged at intervals in the insulating base material 2 as in the second embodiment. You may. Similarly, in order to avoid the cutting position of the substrate 1 in the second embodiment, a slit may be formed in advance in the glass cloth 4 in the insulating base material 2 as in the first embodiment. In each case, L shown in FIGS.
The glass cloth 4 is not exposed on the end surfaces 1a and 1b of the ED element.

In the LED elements of the first and second embodiments, the glass cloth 4 is exposed not only on one of the two sets of parallel side end faces 1a and 1b of the substrate 1 but also on all the side end faces 1a and 1b. It is good also as a structure which does not do. LE like this
FIG. 6 shows the D element. That is, in order to avoid the formation position of the first slit 6 and the cutting position of the substrate 1, a slit is formed in the glass cloth 4 as in the first embodiment,
It is preferable to appropriately arrange a plurality of glass cloths 4 reduced in size as in the embodiment. In the figure, a dotted line D indicates the position of the glass cloth 4 in the substrate 1.

In the LED elements of the first and second embodiments and the LED element shown in FIG. 6, the volume content of the glass cloth 4 in the insulating base material 2 is at least 60%.
In particular, it is preferably at least 80%. This is because if the glass cloth 4 is less than this, the rigidity of the insulating substrate 2 cannot be sufficiently maintained.

[0031]

As described above, according to the LED element and the method of manufacturing the same of the present invention, the glass cloth is cut by arranging the first slit in the substrate or the cutting position of the substrate while avoiding the glass cloth. It does not have a configuration. Therefore, unlike the related art, the glass fibers are not exposed from the cut surface in the state of being squeezed and do not become burrs. Therefore, since the LED element obtained from such a substrate has no burrs on the side end surfaces of the substrate, it can be mounted on the wiring substrate without any inconvenience.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a configuration of a substrate used for an LED element according to a first embodiment of the present invention.

FIGS. 2A and 2B are a front view and a cross-sectional view showing a state where a copper foil is adhered to an insulating base material in the first embodiment.

FIG. 3 is a perspective view of the LED element of the first embodiment.

FIGS. 4A and 4B are a front view and a cross-sectional view illustrating a configuration of a substrate used for an LED element according to a second embodiment of the present invention.

FIG. 5 is a perspective view of the LED element of the first embodiment.

FIG. 6 is a perspective view of an LED device according to another embodiment of the present invention.

FIGS. 7A and 7B are a perspective view and a cross-sectional view illustrating a configuration of a substrate used for a conventional LED element.

FIG. 8 is a perspective view of a conventional LED element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Insulating base material 3 Copper foil 4 Glass cloth 5 Resin 6 First slit 8 LED chip 9 Mold resin 10 Second slit A Substrate cutting position

Claims (5)

[Claims] 1. An LED element having an LED chip mounted on a substrate formed by forming a conductive layer on both front and back surfaces of an insulating substrate in which a glass cloth is covered with a resin, wherein two sets of the rectangular substrates are parallel to each other. Wherein the glass cloth is buried in the resin on at least one set of the side end faces of the LED element. 2. The LED element according to claim 1, wherein the volume ratio of the glass cloth in the insulating base material is at least 80%. 3. A step of forming a conductive layer on each of the front and back surfaces of an insulating substrate in which a glass cloth is covered with a resin to form a substrate, and a plurality of elongated first slits formed on the substrate so as to be substantially parallel to each other. Forming a plurality of LED chips on the substrate between the adjacent first slits and sealing them by molding, and plating the inner surface of the first slits with the substrate. Electrically connecting the conductive layer on the front surface to the conductive layer on the back surface;
Cutting the substrate in a direction substantially perpendicular to the first slit for each D chip. The method of manufacturing an LED element, wherein the glass cloth of the insulating base material has a plurality of elongated The second slit is provided, and the inside of the second slit is filled with the resin.
In the step of forming a slit, the substrate is cut off such that the first slit is located inside the second slit. 4. A step of forming a conductive layer on each of the front and back surfaces of an insulating substrate in which a glass cloth is covered with a resin to form a substrate, and forming a plurality of elongated slits on the substrate so as to be positioned substantially parallel to each other. And a step of mounting a plurality of LED chips on a substrate between the adjacent slits and molding and sealing each, and plating the inner side surface of the slit with a conductive layer on the surface of the substrate and A method for producing an LED element, comprising: a step of conducting the conductive layer to the back surface; and a step of cutting the substrate in a direction substantially perpendicular to the slit for each of the LED chips. In the step of cutting the substrate for each of the LED chips, the plurality of strip-shaped glass cloths are arranged side by side at a predetermined interval. Method for manufacturing an LED element, characterized in that cutting the substrate between the teeth. 5. The method according to claim 3, wherein, when cutting a portion of the substrate where the glass cloth is not interposed, a portion at least 0.05 mm away from an end of the glass cloth is cut. 3. The method for manufacturing an LED element according to item 1.