JPH05318826A - Structure of led array printing head - Google Patents
Structure of led array printing headInfo
- Publication number
- JPH05318826A JPH05318826A JP13483392A JP13483392A JPH05318826A JP H05318826 A JPH05318826 A JP H05318826A JP 13483392 A JP13483392 A JP 13483392A JP 13483392 A JP13483392 A JP 13483392A JP H05318826 A JPH05318826 A JP H05318826A
- Authority
- JP
- Japan
- Prior art keywords
- head substrate
- resin
- led chip
- synthetic resin
- driving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Facsimile Heads (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子写真式プリンタ等
に使用されるＬＥＤアレイプリントヘッドの構造に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an LED array printhead used in an electrophotographic printer or the like.
【０００２】[0002]
【従来の技術】従来、この種のＬＥＤアレイプリントヘ
ッドは、図５〜図７に示すように、ヘッド基板１の上面
に、複数個のＬＥＤチップアレイ２と、該各ＬＥＤチッ
プアレイ２の各々に対する駆動用ＩＣ３とを列状に搭載
して、このヘッド基板１の下面に、金属製の放熱体４を
配設する一方、前記ヘッド基板１の上面側に、ロッドレ
ンズアレイ６を備えた下面開放型のカバー体５を配設し
て、これらヘッド基板１、放熱体４及びカバー体５の三
者を、略コ字状に形成した板ばね製の締結体７における
両先端部の係合孔７ａ，７ｂに、前記カバー体５の左右
両側面に一体的に造形した係合部５ａ，５ｂを各々嵌ま
り係合することによって締結する構成にしている。2. Description of the Related Art Conventionally, an LED array print head of this type has a plurality of LED chip arrays 2 on the upper surface of a head substrate 1 and each of the LED chip arrays 2 as shown in FIGS. Drive ICs 3 are mounted in a row and a metal radiator 4 is disposed on the lower surface of the head substrate 1, while a lower surface provided with a rod lens array 6 on the upper surface side of the head substrate 1. An open-type cover body 5 is provided, and the head substrate 1, the radiator 4 and the cover body 5 are engaged with each other at both ends of a leaf spring fastening body 7 formed in a substantially U shape. Engagement portions 5a and 5b integrally formed on the left and right side surfaces of the cover body 5 are fitted into and engaged with the holes 7a and 7b, respectively.
【０００３】ところで、このＬＥＤアレイプリントヘッ
ドにおけるカバー体５の内部空間は、気密性にすること
が必要であり、この気密性が不十分であると、大気中の
塵埃及び水分等が侵入したり、使用中においてトナー等
が侵入することによって、ＬＥＤチップアレイ２の性能
が低下すると言う問題が発生するから、従来は、前記カ
バー体５における内部空間における気密性を確保するた
めに、図５〜図７に示すように、カバー体５の下面と、
ヘッド基板１の上面との間に、シール用のスポンジ製ガ
スケット８を介挿するとか、或いは、図８に示すよう
に、組立後において、放熱体４とカバー体５との間に隙
間に、気密用の接着剤等の充填剤９を充填するようにし
ている。By the way, the internal space of the cover body 5 in the LED array print head needs to be airtight. If the airtightness is insufficient, dust and water in the atmosphere may enter. Since there is a problem that the performance of the LED chip array 2 is deteriorated due to the invasion of toner or the like during use, conventionally, in order to ensure airtightness in the internal space of the cover body 5, as shown in FIG. As shown in FIG. 7, the lower surface of the cover body 5,
A sponge gasket 8 for sealing is inserted between the upper surface of the head substrate 1 or, as shown in FIG. 8, after assembly, in a gap between the radiator 4 and the cover body 5, A filler 9 such as an airtight adhesive is filled.
【０００４】[0004]
【発明が解決しようとする課題】しかし、これら従来に
おけるＬＥＤアレイプリントヘッドのように、カバー体
の内部空間の気密性を確保したとしても、そのヘッド基
板を、ガラスエポキシ樹脂等の繊維強化合成樹脂製にす
る場合には、以下に述べるような問題があった。すなわ
ち、ヘッド基板を、ガラスエポキシ樹脂等の繊維強化合
成樹脂製にした場合、この繊維強化合成樹脂製のヘッド
基板は、エポキシ樹脂等の合成樹脂を、これにガラス繊
維等の繊維を入れることによって強化したものである一
方、このヘッド基板は、比較的大きい素材基板を所定の
大きさに切断することによって製造するものであるか
ら、このヘッド基板の周囲における各側端面には、強化
に使用した繊維の一部が露出している。従って、ＬＥＤ
アレイプリントヘッドの組立て中において、ヘッド基板
の周囲における各側端面から前記繊維の屑片及び合成樹
脂の屑片が離脱し、この繊維の屑片及び合成樹脂の屑片
が、ヘッド基板に装着されている各ＬＥＤチップアレイ
における発光部、及びカバー体におけるロッドレンズア
レイ等に付着して、発光むら、ひいては、印字むらの発
生を招来するおそれがある。However, even if the airtightness of the internal space of the cover body is ensured as in the conventional LED array print heads, the head substrate is made of fiber reinforced synthetic resin such as glass epoxy resin. In the case of manufacturing, there were the following problems. That is, when the head substrate is made of fiber reinforced synthetic resin such as glass epoxy resin, the head substrate made of fiber reinforced synthetic resin is obtained by inserting synthetic resin such as epoxy resin into the fiber, such as glass fiber. On the other hand, since this head substrate is manufactured by cutting a relatively large material substrate into a predetermined size, it was used for strengthening on each side end surface around the head substrate. Some of the fibers are exposed. Therefore, the LED
During the assembly of the array print head, the fiber scraps and the synthetic resin scraps are separated from each side end surface around the head substrate, and the fiber scraps and the synthetic resin scraps are mounted on the head substrate. There is a possibility that the light emitting portion in each LED chip array, the rod lens array in the cover body, and the like adhere to each other to cause light emission unevenness and eventually print unevenness.
【０００５】そこで、ＬＥＤアレイプリントヘッドの組
立てに際しては、ヘッド基板の周囲における各側端面
を、当該各側端面から繊維の屑片及び合成樹脂の屑片が
発生しないように、予め、十分に清掃するようにしなけ
ればならないから、その組立てには多大の手数を必要と
し、コトスが大幅にアップするのであった。本発明は、
このような問題を招来することがないようにしたＬＥＤ
アレイプリントヘッドを提供することを技術的課題とす
るものである。Therefore, when assembling the LED array print head, each side end face around the head substrate is thoroughly cleaned in advance so that a fiber scrap and a synthetic resin scrap are not generated from each side end surface. Since it has to be done, it requires a great deal of work for assembling, and the cost is greatly increased. The present invention is
An LED that does not cause such a problem
It is a technical object to provide an array printhead.
【０００６】[0006]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、ロッドレンズアレイを備えたカバー体
と、放熱体とを、その間に、上面に複数個のＬＥＤチッ
プアレイと駆動用ＩＣとを備えたヘッド基板を挟んだ状
態で締結して成るＬＥＤアレイプリントヘッドにおい
て、前記ヘッド基板を、ガラスエポキシ樹脂等の繊維強
化合成樹脂製にして、このヘッド基板の周囲における各
側端面を、樹脂コートで被覆する構成にした。In order to achieve this technical object, the present invention provides a cover body having a rod lens array and a heat radiating body, between which a plurality of LED chip arrays and a driving body are provided. In an LED array print head formed by fastening a head substrate provided with an IC in a sandwiched state, the head substrate is made of fiber reinforced synthetic resin such as glass epoxy resin and each side end face around the head substrate is The resin coating is used.
【０００７】[0007]
【作 用】このように構成すると、ヘッド基板の周囲
における各側端面から繊維の屑片及び合成樹脂の屑片が
脱落することを、当該各側端面を被覆する樹脂コートに
よって確実に防止できるから、ＬＥＤアレイプリントヘ
ッドの組立てに際して、ヘッド基板に装着されている各
ＬＥＤチップアレイにおける発光部、及びカバー体にお
けるロッドレンズアレイ等に対して繊維の屑片及び合成
樹脂の屑片が付着することを確実に防止できるのであ
る。[Operation] With this configuration, it is possible to reliably prevent the fiber scraps and the synthetic resin scraps from falling off from each side end surface around the head substrate by the resin coat covering each side end surface. When assembling the LED array print head, it is possible to prevent fiber scraps and synthetic resin scraps from adhering to the light emitting portions of the LED chip arrays mounted on the head substrate, the rod lens array of the cover body, and the like. It can be reliably prevented.
【０００８】[0008]
【発明の効果】従って、本発明によると、ＬＥＤアレイ
プリントヘッドにおけるヘッド基板を、ガラスエポキシ
樹脂等の繊維強化合成樹脂製にした場合において、ＬＥ
Ｄアレイプリントヘッドに発光むら、ひいては、印字む
らが発生することを確実に低減できると共に、その組立
てに要する手数を軽減できるから、コストを大幅に低減
できる効果を有する。Therefore, according to the present invention, when the head substrate of the LED array print head is made of fiber reinforced synthetic resin such as glass epoxy resin, LE is used.
It is possible to reliably reduce the unevenness of light emission in the D-array printhead, and hence the unevenness of printing, and to reduce the number of steps required for assembling the printing head.
【０００９】[0009]
【実施例】以下、本発明の実施例を図１〜図４の図面に
ついて説明する。この図において符号１１は、ガラスエ
ポキシ樹脂等の繊維強化合成樹脂製のヘッド基板を、符
号１４は、前記ヘッド基板１１の下面側に配設したアル
ミ等の金属製の放熱体を、また、符号１５は、前記ヘッ
ド基板１１の上面側に配設した下面開放型のカバー体１
５を各々示し、前記カバー体１５は、非透明合成樹脂製
であり、その上面には、ロッドレンズアレイ１６を備え
ている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to the drawings of FIGS. In this figure, reference numeral 11 is a head substrate made of fiber reinforced synthetic resin such as glass epoxy resin, reference numeral 14 is a heat radiator made of metal such as aluminum and disposed on the lower surface side of the head substrate 11, and reference numeral Reference numeral 15 denotes a cover body 1 of a lower surface open type disposed on the upper surface side of the head substrate 11.
5, the cover body 15 is made of non-transparent synthetic resin, and the rod lens array 16 is provided on the upper surface thereof.
【００１０】前記放熱体１４と前記カバー体１５とを、
その間に前記ヘッド基板１１を挟んだ状態で、略コ字状
に形成した板ばね製の締結体１７における両先端部の係
合孔１７ａ，１７ｂに、前記カバー体１５の左右両側面
に一体的に造形した係合部１５ａ，１５ｂを各々嵌まり
係合することによって締結する。一方、前記ヘッド基板
１１の上面には、発光部１２ａを備えた複数個のＬＥＤ
チップアレイ１２が一列状に搭載されていると共に、こ
の各ＬＥＤチップアレイ１２の各々に対する駆動用ＩＣ
１３が一列状に搭載されている。なお、前記各ＬＥＤチ
ップアレイ１２とその各々に対する駆動用ＩＣ１３との
間は、細い金線等の金属線１８ａにてワイヤーボンディ
ングされている。また、各駆動用ＩＣ１３と、ヘッド基
板１１の上面に形成した配線パターン（図示せず）との
間も、細い金線等の金属線１８ｂにてワイヤーボンディ
ングされている。The heat radiator 14 and the cover body 15 are
With the head substrate 11 sandwiched therebetween, engaging holes 17a and 17b at both tip ends of a leaf spring fastening body 17 formed in a substantially U-shape are integrally formed on both left and right side surfaces of the cover body 15. The engaging portions 15a and 15b shaped as described above are fitted and engaged with each other to be fastened. On the other hand, on the upper surface of the head substrate 11, a plurality of LEDs having a light emitting part 12a are provided.
The chip arrays 12 are mounted in a line, and a driving IC for each of the LED chip arrays 12 is mounted.
13 are mounted in a line. The LED chip arrays 12 and the driving ICs 13 for the respective LED chip arrays 12 are wire-bonded by a metal wire 18a such as a thin gold wire. Further, the respective drive ICs 13 and the wiring pattern (not shown) formed on the upper surface of the head substrate 11 are also wire-bonded by a metal wire 18b such as a thin gold wire.
【００１１】そして、前記ヘッド基板１１における上面
のうち前記各ＬＥＤチップアレイ１２及び各駆動用ＩＣ
１３の部分並びに各金属線１８ａ，１８ｂの部分に、透
明合成樹脂液を膜状に塗布することによって、薄膜状の
樹脂コート１９ａを、前記各ＬＥＤチップアレイ１２、
各駆動用ＩＣ１３及び各金属線１８ａ，１８ｂを覆うよ
うに形成するにおいて、前記透明合成樹脂液をヘッド基
板１１における上面の全体にわたって塗布すると共に、
ヘッド基板１１の周囲における各側端面１１ａ，１１
ｂ，１１ｃ，１１ｄの全てにも塗布することにより、ヘ
ッド基板１１の上面における全面に樹脂コート１９ｂを
形成すると共に、ヘッド基板１１の周囲における各側端
面１１ａ，１１ｂ，１１ｃ，１１ｄにも樹脂コート１９
ｃを形成する。The LED chip arrays 12 and the driving ICs on the upper surface of the head substrate 11
A thin resin coat 19a is applied to each of the LED chip arrays 12 by applying a transparent synthetic resin liquid in a film shape to the portion 13 and the portions of the metal wires 18a and 18b.
In forming so as to cover each driving IC 13 and each metal wire 18a, 18b, the transparent synthetic resin liquid is applied over the entire upper surface of the head substrate 11, and
Each side end surface 11a, 11 around the head substrate 11
By coating all of b, 11c, and 11d, the resin coat 19b is formed on the entire upper surface of the head substrate 11, and the side end faces 11a, 11b, 11c, and 11d around the head substrate 11 are also coated with the resin coat 19b. 19
form c.
【００１２】このように構成すると、カバー体１５と放
熱体１４とをその間にヘッド基板１１を挟んで締結した
とき、ヘッド基板１１とカバー体１５との間には、ヘッ
ド基板１１の上面における全面にわたって延長するよう
に形成した軟質合成樹脂製の樹脂コート１９ｂが挟ま
れ、且つ、この樹脂コート１９ｂが、カバー体１５と放
熱板１４との締結に際して、カバー体１５に対して密接
することによってシール用ガスケットの役目を遂行する
ことになるから、カバー体１５の内部空間における気密
性を確保することができる。According to this structure, when the cover body 15 and the radiator 14 are fastened with the head substrate 11 sandwiched therebetween, the entire upper surface of the head substrate 11 is between the head substrate 11 and the cover body 15. A resin coat 19b made of a soft synthetic resin formed so as to extend over the entire length is sandwiched, and this resin coat 19b is brought into close contact with the cover body 15 when the cover body 15 and the heat dissipation plate 14 are fastened to each other, thereby providing a seal. Since it performs the role of the gasket for use, airtightness in the internal space of the cover body 15 can be ensured.
【００１３】一方、ヘッド基板１１の周囲における各側
端面１１ａ，１１ｂ，１１ｃ，１１ｄが、樹脂コート１
９ｃにて被覆されることにより、この各側端面１１ａ，
１１ｂ，１１ｃ，１１ｄから繊維の屑片及び合成樹脂の
屑片が脱落することを、前記樹脂コート１９ｃによって
確実に防止できるのである。なお、前記実施例は、ヘッ
ド基板１１における上面のうち各ＬＥＤチップアレイ１
２、各駆動用ＩＣ１３及び各金属線１８ａ，１８ｂの部
分に対する樹脂コート１９ａの保護膜を形成するための
透明合成樹脂液を、ヘッド基板１１における上面の全体
にわたって塗布することに加えて、ヘッド基板１１の周
囲における各側端面１１ａ，１１ｂ，１１ｃ，１１ｄの
全てにも塗布することによって、ヘッド基板１１におけ
る上面の全面に樹脂コート１９ｂを形成すると共に、ヘ
ッド基板１１の周囲における各側端面１１ａ，１１ｂ，
１１ｃ，１１ｄにも樹脂コート１９ｃを形成する場合を
示した。On the other hand, each side end surface 11a, 11b, 11c, 11d around the head substrate 11 is covered with the resin coat 1.
By being coated with 9c, each side end surface 11a,
The resin coat 19c can surely prevent the fiber scraps and the synthetic resin scraps from falling off from 11b, 11c, and 11d. In the above-described embodiment, each LED chip array 1 on the upper surface of the head substrate 11
2. In addition to applying the transparent synthetic resin liquid for forming the protective film of the resin coat 19a on the portions of the driving ICs 13 and the metal wires 18a and 18b over the entire upper surface of the head substrate 11, By coating all of the side end surfaces 11a, 11b, 11c, 11d around 11 as well, a resin coat 19b is formed on the entire upper surface of the head substrate 11, and each side end surface 11a around the head substrate 11 is formed. 11b,
The case where the resin coat 19c is formed also on 11c and 11d is shown.
【００１４】そして、この実施例によると、各樹脂コー
ト１９ａ，１９ｂ，１９ｃを形成することが、各ＬＥＤ
チップアレイ１２、各駆動用ＩＣ１３及び各金属線１８
ａ，１８ｂの部分に対して保護用の樹脂コート１９ａを
形成することと同時にできるので、工程を簡単化できる
利点がある。しかし、本発明は、この実施例に限らず、
ヘッド基板１１の周囲における各側端面１１ａ，１１
ｂ，１１ｃ，１１ｄに対する樹脂コート１９ｃを、ヘッ
ド基板１１の上面のうちカバー体１５に対して接当する
部分における樹脂コート１９ｂ、及び各ＬＥＤチップア
レイ１２及び各駆動用ＩＣ１３の部分に対する樹脂コー
ト１９ａとは別の工程において、同じ材料か或いは別の
材料によって形成するようにしても良いことは言うまで
もない。According to this embodiment, the resin coats 19a, 19b and 19c can be formed by using the respective LEDs.
Chip array 12, each driving IC 13, and each metal wire 18
Since it is possible to form the protective resin coat 19a on the portions a and 18b at the same time, there is an advantage that the process can be simplified. However, the present invention is not limited to this embodiment,
Each side end surface 11a, 11 around the head substrate 11
The resin coat 19c for b, 11c, and 11d is a resin coat 19b on a portion of the upper surface of the head substrate 11 that abuts the cover body 15, and the resin coat 19a for each LED chip array 12 and each driving IC 13 portion. Needless to say, it may be formed of the same material or a different material in a different process.
【００１５】また、他の実施例においては、上面に各Ｌ
ＥＤチップアレイ１２及び各駆動用ＩＣ１３を搭載する
と共に、これらＬＥＤチップアレイ１２と各駆動用ＩＣ
１３との間及び各駆動用ＩＣ１３と配線パターンとの間
をワイヤーボンディングしたヘッド基板１１の全体を、
透明合成樹脂液に浸漬することによって、各樹脂コート
１９ａ，１９ｂ，１９ｃを形成すると共に、ヘッド基板
１１の裏面側にも、図４に二点鎖線で示すように、樹脂
コート１９ｄを形成するようにしても良いのである。In another embodiment, each L is provided on the upper surface.
The ED chip array 12 and each driving IC 13 are mounted, and the LED chip array 12 and each driving IC are mounted.
13, and the entire head substrate 11 in which wire bonding is performed between each drive IC 13 and each wiring pattern,
Each resin coat 19a, 19b, 19c is formed by immersing in a transparent synthetic resin liquid, and a resin coat 19d is also formed on the back surface side of the head substrate 11 as shown by a chain double-dashed line in FIG. However, it is okay.
【図１】本発明の実施例によるＬＥＤアレイプリントヘ
ッドの分解した状態の斜視図である。FIG. 1 is a perspective view of an LED array printhead according to an exemplary embodiment of the present invention in an exploded state.
【図２】図１のII−II視拡大断面図である。FIG. 2 is an enlarged sectional view taken along line II-II of FIG.
【図３】図２の組立てた状態の図である。FIG. 3 is a view of the assembled state of FIG.
【図４】ヘッド基板の拡大断面図である。FIG. 4 is an enlarged cross-sectional view of a head substrate.
【図５】従来におけるＬＥＤアレイプリントヘッドの分
解した状態の斜視図である。FIG. 5 is a perspective view of a conventional LED array printhead in an exploded state.
【図６】図５のVI−VI視拡大断面図である。6 is an enlarged sectional view taken along line VI-VI of FIG.
【図７】図６の組立てた状態の図である。FIG. 7 is a view of the assembled state of FIG. 6;
【図８】従来における別の例を示す断面図である。FIG. 8 is a cross-sectional view showing another conventional example.
１１ ヘッド基板 １１ａ，１１ｂ，１１ｃ，１１ｄ ヘッド基板の側端
面 １２ ＬＥＤチップアレイ １３ 駆動用ＩＣ １４ 放熱体 １５ カバー体 １６ ロッドレンズアレイ １７ 締結体 １９ａ，１９ｂ，１９ｃ，１９ｄ 樹脂コート11 Head Substrate 11a, 11b, 11c, 11d Side End Surface of Head Substrate 12 LED Chip Array 13 Driving IC 14 Heat Sink 15 Cover Body 16 Rod Lens Array 17 Fastening Body 19a, 19b, 19c, 19d Resin Coating
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０４Ｎ 1/036 Ａ 9070−5Ｃ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display area H04N 1/036 A 9070-5C
Claims (1)
放熱体とを、その間に、上面に複数個のＬＥＤチップア
レイと駆動用ＩＣとを備えたヘッド基板を挟んだ状態で
締結して成るＬＥＤアレイプリントヘッドにおいて、前
記ヘッド基板を、ガラスエポキシ樹脂等の繊維強化合成
樹脂製にして、このヘッド基板の周囲における各側端面
を、樹脂コートで被覆したことを特徴とするＬＥＤアレ
イプリントヘッドの構造。1. A cover body having a rod lens array,
In an LED array print head comprising a heat radiator and a head substrate having a plurality of LED chip arrays and a driving IC sandwiched between the radiator and the heat sink, the head substrate is made of glass epoxy resin or the like. The structure of the LED array print head, which is made of the fiber-reinforced synthetic resin and is coated with a resin coat on each side end face around the head substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13483392A JPH05318826A (en) | 1992-05-27 | 1992-05-27 | Structure of led array printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13483392A JPH05318826A (en) | 1992-05-27 | 1992-05-27 | Structure of led array printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05318826A true JPH05318826A (en) | 1993-12-03 |
Family
ID=15137531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13483392A Pending JPH05318826A (en) | 1992-05-27 | 1992-05-27 | Structure of led array printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05318826A (en) |
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