JPH0514531Y2 - - Google Patents
Info
- Publication number
- JPH0514531Y2 JPH0514531Y2 JP1987110394U JP11039487U JPH0514531Y2 JP H0514531 Y2 JPH0514531 Y2 JP H0514531Y2 JP 1987110394 U JP1987110394 U JP 1987110394U JP 11039487 U JP11039487 U JP 11039487U JP H0514531 Y2 JPH0514531 Y2 JP H0514531Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- conductive pattern
- lens
- led chip
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、車両用灯具、フアツクスの光源など
として使用する灯具、特に多数のLEDを用いた
灯具に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lamp used as a vehicle lamp or a light source for a fax machine, and particularly to a lamp using a large number of LEDs.
従来は、例えば第６図に示すように所定の導電
パターンが形成された基板２１に多数のLED（ラ
ンプ形状タイプのもの）２２、電流制限用抵抗２
３、逆電圧保護ダイオード２４をそれぞれ装着す
るとともに、ワイヤーハーネス２５を半田付けに
よつて接続し、これをハウジング２６内に収納し
た後、所定のレンズカツトを施したアウターレン
ズ２７をハウジング２６の前面に取付けた構造と
している。
Conventionally, as shown in FIG. 6, for example, a substrate 21 on which a predetermined conductive pattern is formed is provided with a large number of LEDs (lamp-shaped type) 22 and a current limiting resistor 2.
3. After attaching the reverse voltage protection diodes 24 and connecting the wire harness 25 by soldering and storing them in the housing 26, attach the outer lens 27 with a predetermined lens cut to the front of the housing 26. It has an attached structure.
しかし、このような構造では、基板２１に
LED２２などを装着し、これをハウジング２６
内に収納しているため、基板２１の収納スペース
が必要となつて灯具の薄型化が難しい。また、基
板２１はハウジング２６と比較して加工する形状
に自由度が少ないため、車体フレームなどに有効
に放熱できない。更に、各LED２２にアウター
レンズ２７のレンズカツトを対応させて所要の配
光特性を得るため、LED２２とアウターレンズ
２７との合わせ寸法精度を要するが、基板２１の
介在によつて位置合わせに手間がかかるといつた
問題点がある。
However, in such a structure, the substrate 21
Attach the LED 22 etc. and connect it to the housing 26.
Since the board 21 is housed inside, a storage space is required for the board 21, making it difficult to make the lamp thinner. Further, since the substrate 21 has less freedom in processing its shape than the housing 26, it cannot effectively radiate heat to the vehicle body frame or the like. Furthermore, in order to match the lens cut of the outer lens 27 to each LED 22 to obtain the required light distribution characteristics, the alignment of the LEDs 22 and the outer lens 27 requires dimensional precision, but the intervention of the substrate 21 takes time and effort to align. There are some problems.
本考案は、ハウジングの後部内面に所定形状の
導電パターンを電流制限用抵抗の代用となる抵抗
分を含むように形成して所要数のLEDチツプ、
逆電圧保護ダイオードなどを装着するとともに、
各LEDチツプの部分を透明樹脂でレンズ作用を
持つように被覆し、ハウジングの前面にアウター
レンズを取付けたことを特徴とするものである。
In the present invention, a conductive pattern of a predetermined shape is formed on the inner surface of the rear part of the housing so as to include a resistor that can serve as a substitute for the current limiting resistor, and a required number of LED chips can be installed.
In addition to installing a reverse voltage protection diode,
Each LED chip is coated with a transparent resin so as to act as a lens, and an outer lens is attached to the front of the housing.
以下、本考案を図示の実施例に基づいて詳細に
説明する。
Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
第１図〜第５図は本考案の一実施例を示すもの
で、ハウジング１の後部内面に所定形状の導電パ
ターン２を電流制限用抵抗の代用となる抵抗分を
含むように多数形成してそのチツプマウント部に
LEDチツプ３をボンデイングし、その電極部と
他のパターン２との間を金線４によりワイヤボン
デイングしている。そして、各LEDチツプ３の
部分を透明樹脂５によりレンズ作用を持つように
被覆している。また、前記導電パターン２には逆
電圧保護ダイオード（図示省略）をも装着してい
る。ハウジング１はポリカーボネートやABS樹
脂などによる成形品とし、背面（後部外面）には
取付部1Aを一体に成形するとともに、ワイヤーハ
ーネス（リード線）６を接続している。また、ハ
ウジング１の前面には、所定のレンズカツトを施
したアウターレンズ７を取付けている。 Figures 1 to 5 show an embodiment of the present invention, in which a large number of conductive patterns 2 of a predetermined shape are formed on the inner surface of the rear part of a housing 1 so as to contain a resistance that can serve as a substitute for a current limiting resistor. At the tip mount part
The LED chip 3 is bonded, and wire bonding is performed between the electrode part and the other pattern 2 using a gold wire 4. A portion of each LED chip 3 is covered with a transparent resin 5 so as to have a lens effect. Further, the conductive pattern 2 is also equipped with a reverse voltage protection diode (not shown). The housing 1 is a molded product made of polycarbonate, ABS resin, etc., and a mounting portion 1A is integrally molded on the back (rear outer surface), and a wire harness (lead wire) 6 is connected thereto. Furthermore, an outer lens 7 having a predetermined lens cut is attached to the front surface of the housing 1.
なお、前記導電パターン２の抵抗分は、パター
ン用導電材の材質やパターン幅、パターン距離に
よつて制御する。 Note that the resistance of the conductive pattern 2 is controlled by the material of the conductive material for the pattern, the pattern width, and the pattern distance.
このようにハウジング１の後部内面に導電パタ
ーン２を直に形成してLEDチツプ３、逆電圧保
護ダイオードなどを実装すると、薄型になるとと
もに、部品の発熱はハウジング１を介して車体フ
レームなどを速やかに放熱される。また、導電パ
ターン２に電流制限用抵抗の代用となる抵抗分が
含まれており、実装部品点数が少なくなる。 By forming the conductive pattern 2 directly on the rear inner surface of the housing 1 and mounting the LED chip 3, reverse voltage protection diode, etc. in this way, it becomes thinner, and the heat generated by the components can be quickly transferred to the vehicle body frame etc. through the housing 1. Heat is radiated to Furthermore, the conductive pattern 2 includes a resistance that can be used as a substitute for the current limiting resistor, reducing the number of mounted components.
以上のように本考案によれば、ハウジング自体
の導電パターンを電流制限用抵抗の代用となる抵
抗分を含むように形成して所要数のLEDチツプ、
逆電圧保護ダイオードなどを実装し、ハウジング
の前面にアウターレンズを取付けたので、ハウジ
ングの内部スペースの縮小によつて薄型化が図れ
るとともに、基板や個別素子としての抵抗の省略
によつて軽量化及び工数の削減が図れる。また、
部品のハウジングへの取付けによりその発熱を有
効に放熱することができ、それに伴つて発光効率
の向上が期待できる。しかも、LEDチツプを透
明樹脂によりレンズ作用を持つように被覆したの
で、発光を有効に利用できる。更に、ハウジング
の材質選択に裕度が生じ、素材量の軽減と相俟つ
てコストの低減が可能となるといつた利点があ
る。
As described above, according to the present invention, the conductive pattern of the housing itself is formed so as to include a resistor as a substitute for the current limiting resistor, and a required number of LED chips can be mounted.
By mounting a reverse voltage protection diode, etc. and attaching an outer lens to the front of the housing, the internal space of the housing can be reduced, making it thinner, and the elimination of the board and resistors as individual elements makes it lighter and lighter. Man-hours can be reduced. Also,
By attaching the component to the housing, the heat generated can be effectively dissipated, and an improvement in luminous efficiency can be expected accordingly. Moreover, since the LED chip is coated with transparent resin so that it has a lens effect, the light emitted can be used effectively. Furthermore, there is an advantage in that there is more latitude in selecting the material for the housing, which allows for a reduction in the amount of material and cost.
第１図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るLEDチツプの実装状態を示す正面図、第５図
は第４図の−線断面図、第６図は従来例を示
す一部破断状態の平面図である。
１……ハウジング、1A……取付部、２……導電
パターン、３……LEDチツプ、４……金線、５
……透明樹脂、６……ワイヤーハーネス、７……
アウターレンズ。
Fig. 1 is a partially broken plan view showing an embodiment of the lamp according to the present invention, Figs. 2 and 3 are front and side views of the embodiment, and Fig. 4 is an LED in the embodiment. FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially cutaway plan view showing a conventional example. 1... Housing, 1 A ... Mounting part, 2... Conductive pattern, 3... LED chip, 4... Gold wire, 5
...Transparent resin, 6...Wire harness, 7...
outer lens.
Claims (1)
電流制限用抵抗の代用となる抵抗分を含むように
形成して所要数のLEDチツプ、逆電圧保護ダイ
オードなどを装着するとともに、各LEDチツプ
の部分を透明樹脂でレンズ作用を持つように被覆
し、ハウジングの前面にアウターレンズを取付け
たことを特徴とする灯具。 A predetermined conductive pattern is formed on the rear inner surface of the housing to include a resistor to serve as a substitute for the current limiting resistor, and the required number of LED chips, reverse voltage protection diodes, etc. are mounted, and each LED chip is made transparent. A light fixture characterized by being coated with resin to have a lens effect and having an outer lens attached to the front of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110394U JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110394U JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413750U JPS6413750U (en) | 1989-01-24 |
| JPH0514531Y2 true JPH0514531Y2 (en) | 1993-04-19 |
Family
ID=31347511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110394U Expired - Lifetime JPH0514531Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514531Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0743316Y2 (en) * | 1991-10-11 | 1995-10-09 | 株式会社マルハチ | Retractable skylight |
| JP2002009349A (en) * | 2000-06-26 | 2002-01-11 | Koha Co Ltd | Surface emission led and its manufacturing method |
| JP3125289U (en) * | 2006-07-03 | 2006-09-14 | 株式会社シンプル | Miniature light kit using chip LED for mounting |
-
1987
- 1987-07-17 JP JP1987110394U patent/JPH0514531Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6413750U (en) | 1989-01-24 |
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