JPH0514530Y2 - - Google Patents
Info
- Publication number
- JPH0514530Y2 JPH0514530Y2 JP1987110391U JP11039187U JPH0514530Y2 JP H0514530 Y2 JPH0514530 Y2 JP H0514530Y2 JP 1987110391 U JP1987110391 U JP 1987110391U JP 11039187 U JP11039187 U JP 11039187U JP H0514530 Y2 JPH0514530 Y2 JP H0514530Y2
- Authority
- JP
- Japan
- Prior art keywords
- housing
- large number
- rear inner
- led
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、車両用灯具、フアツクスの光源など
として使用する灯具、特に多数のLEDを用いた
灯具に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lamp used as a vehicle lamp or a light source for a fax machine, and particularly to a lamp using a large number of LEDs.
従来は、例えば第６図に示すように所定に導電
パターンが形成された基板２１に多数のLED（ラ
ンプ形状タイプのもの）２２、電流制限用抵抗２
３、逆電圧保護ダイオード２４をそれぞれ装着す
るとともに、ワイヤーハーネス２５を半田付けに
よつて接続し、これをハウジング２６内に収納し
た後、所定のレンズカツトを施したアウターレン
ズ２７をハウジング２６の前面に取付けた構造と
している。
Conventionally, for example, as shown in FIG. 6, a large number of LEDs (lamp-shaped type) 22 and a current limiting resistor 2 are mounted on a substrate 21 on which a predetermined conductive pattern is formed.
3. After attaching the reverse voltage protection diodes 24 and connecting the wire harness 25 by soldering and storing them in the housing 26, attach the outer lens 27 with a predetermined lens cut to the front of the housing 26. It has an attached structure.
しかし、このような構造では、基板２１に
LED２２などを装着し、これをハウジング２６
内に収納しているため、基板２１の収納スペース
が必要となつて灯具の薄型化が難しい。また、基
板２１はハウジング２６と比較して加工する形状
に自由度が少ないため、車体フレームなどに有効
に放熱できない。更に、各LED２２にアウター
レンズ２７のレンズカツトを対応させて所要の配
光特性を得るため、LED２２とアウターレンズ
２７との合わせ寸法精度を要するが、基板２１の
介在によつて位置合わせに手間がかかるといつた
問題点がある。
However, in such a structure, the substrate 21
Attach the LED 22 etc. and connect it to the housing 26.
Since the board 21 is housed inside, a storage space is required for the board 21, making it difficult to make the lamp thinner. Further, since the substrate 21 has less freedom in processing its shape than the housing 26, it cannot effectively radiate heat to the vehicle body frame or the like. Furthermore, in order to match the lens cut of the outer lens 27 to each LED 22 to obtain the required light distribution characteristics, the alignment of the LEDs 22 and the outer lens 27 requires dimensional precision, but the intervention of the substrate 21 takes time and effort to align. There are some problems.
本考案は、ハウジングの後部内面に所定形状の
導電パターンを形成して多数のLEDチツプ、電
流制限用抵抗、逆電圧保護ダイオードなどを装着
するとともに、前記多数のLEDチツプ装着箇所
の間に所定数の反射枠を一体成形し、更に各
LEDチツプの部分を透明樹脂によりレンズ作用
を持つように被覆し、ハウジングの前面にアウタ
ーレンズを取付けたことを特徴とするものであ
る。
In this invention, a conductive pattern of a predetermined shape is formed on the rear inner surface of the housing, and a large number of LED chips, current limiting resistors, reverse voltage protection diodes, etc. are mounted on the rear inner surface of the housing, and a predetermined number of conductive patterns are mounted between the locations where the large number of LED chips are mounted. The reflective frame is integrally molded, and each
The LED chip is coated with a transparent resin so as to act as a lens, and an outer lens is attached to the front of the housing.
以下、本考案を図示の実施例に基づいて詳細に
説明する。
Hereinafter, the present invention will be explained in detail based on illustrated embodiments.
第１図〜第５図は本考案の一実施例を示すもの
で、ハウジング１の後部内面に所定形状の導電パ
ターン２を多数形成してそのチツプマウント部に
LEDチツプ３をボンデイングし、その電極部と
他のパターン２との間を金線４によりワイヤボン
デイングしている。そして、各LEDチツプ３の
部分を透明樹脂５によりレンズ作用を持つように
被覆している。また、前記導電パターン２には電
流制限用抵抗６、逆電圧保護ダイオード（図示省
略）をも装着している。ハウジング１はポリカー
ボネートやABS樹脂などによる成形品とし、後
部内面のチツプ装着箇所の間に反射枠1Aを一体に
成形し、背面（後部外面）には取付部1Bを一体に
成形するとともに、ワイヤーハーネス（リード
線）７を接続している。また、ハウジング１の前
面には、所定のレンズカツトを施したアウターレ
ンズ８を取付けている。 1 to 5 show an embodiment of the present invention, in which a large number of conductive patterns 2 of a predetermined shape are formed on the rear inner surface of the housing 1, and the chip mount portion thereof is
The LED chip 3 is bonded, and wire bonding is performed between the electrode part and the other pattern 2 using a gold wire 4. A portion of each LED chip 3 is covered with a transparent resin 5 so as to have a lens effect. Further, the conductive pattern 2 is also equipped with a current limiting resistor 6 and a reverse voltage protection diode (not shown). The housing 1 is a molded product made of polycarbonate, ABS resin, etc., with a reflective frame 1A integrally molded between the chip mounting locations on the rear inner surface, and a mounting portion 1B integrally molded on the rear surface (rear outer surface). A wire harness (lead wire) 7 is connected. Furthermore, an outer lens 8 having a predetermined lens cut is attached to the front surface of the housing 1.
このようにハウジング１の後部内面に反射枠1A
と導電パターン２を形成してLEDチツプ３、抵
抗６などを実装すると、薄型になるとともに、
LEDチツプ３の発光の一部が反射枠1Aで反射し
て前方に放射されるようになり、発光が有効に利
用される。また、部品の発熱はハウジング１を介
して車体フレームなどに速やかに放熱される。 In this way, the reflective frame 1 A is attached to the rear inner surface of the housing 1.
By forming a conductive pattern 2 and mounting an LED chip 3, a resistor 6, etc., it becomes thinner and
A part of the light emitted from the LED chip 3 is reflected by the reflective frame 1A and radiated forward, so that the light emitted is effectively used. Furthermore, heat generated by the components is quickly radiated to the vehicle body frame and the like through the housing 1.
以上のように本考案によれば、ハウジング自体
の導電パターンを形成して多数のLEDチツプ、
電流制限用抵抗、逆電圧保護ダイオードなどを実
装し、ハウジングの前面にアウターレンズを取付
けたので、ハウジングの内部スペースの縮小によ
つて薄型化が図れるとともに、基板の省略によつ
て軽量化及び工数の削減が図れる。また、部品の
ハウジングへの取付けによりその発熱を有効に放
熱することができ、それに伴つて発光効率の向上
が期待できる。しかも、ハウジング後部内面に反
射枠を形成したので、通常の白色系樹脂の使用に
よつても発光を有効に利用できる。更にハウジン
グの材質選択によつては発光効率を上げ内部発熱
を抑えて耐熱性の低い材料が使え、部品点数の削
減と相俟つてコストの低減が可能となるといつた
利点がある。
As described above, according to the present invention, a large number of LED chips can be connected by forming a conductive pattern on the housing itself.
A current limiting resistor, a reverse voltage protection diode, etc. are mounted, and an outer lens is attached to the front of the housing, so the internal space of the housing is reduced, making it thinner, and the elimination of the board reduces weight and man-hours. can be reduced. Further, by attaching the component to the housing, the heat generated can be effectively dissipated, and accordingly, an improvement in luminous efficiency can be expected. Moreover, since a reflective frame is formed on the inner surface of the rear part of the housing, the light emitted can be effectively utilized even when using ordinary white resin. Furthermore, depending on the selection of the material of the housing, materials with low heat resistance can be used to increase luminous efficiency and suppress internal heat generation, which has the advantage of reducing costs by reducing the number of parts.
第１図は本考案に係る灯具の一実施例を示す一
部破断状態の平面図、第２図及び第３図は同実施
例の正面図及び側面図、第４図は同実施例におけ
るLEDチツプの実装状態を示す正面図、第５図
は第４図の−線断面図、第６図は従来例を示
す一部破断状態の平面図である。
１……ハウジング、1A……反射枠、２……導電
パターン、３……LEDチツプ、４……金線、５
……透明樹脂、６……電流制限用抵抗、７……ワ
イヤーハーネス、８……アウターレンズ。
Fig. 1 is a partially broken plan view showing an embodiment of the lamp according to the present invention, Figs. 2 and 3 are front and side views of the embodiment, and Fig. 4 is an LED in the embodiment. FIG. 5 is a sectional view taken along the line -- in FIG. 4, and FIG. 6 is a partially cutaway plan view showing a conventional example. 1... Housing, 1 A ... Reflective frame, 2... Conductive pattern, 3... LED chip, 4... Gold wire, 5
...Transparent resin, 6... Current limiting resistor, 7... Wire harness, 8... Outer lens.
Claims (1)
ンを形成して多数のLEDチツプ、電流制限用抵
抗、逆電圧保護ダイオードなどを装着するととも
に、前記多数のLEDチツプ装着箇所の間に所定
数の反射枠を一体成形し、更に各LEDチツプの
部分を透明樹脂によりレンズ作用を持つように被
覆し、ハウジングの前面にアウターレンズを取付
けたことを特徴とする灯具。 A conductive pattern of a predetermined shape is formed on the rear inner surface of the housing, and a large number of LED chips, current limiting resistors, reverse voltage protection diodes, etc. are mounted on the rear inner surface of the housing, and a predetermined number of reflective frames are installed between the locations where the large number of LED chips are mounted. A light fixture characterized by integral molding, each LED chip being coated with transparent resin so as to have a lens effect, and an outer lens attached to the front of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110391U JPH0514530Y2 (en) | 1987-07-17 | 1987-07-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987110391U JPH0514530Y2 (en) | 1987-07-17 | 1987-07-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6413747U JPS6413747U (en) | 1989-01-24 |
| JPH0514530Y2 true JPH0514530Y2 (en) | 1993-04-19 |
Family
ID=31347505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987110391U Expired - Lifetime JPH0514530Y2 (en) | 1987-07-17 | 1987-07-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514530Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010111231A (en) * | 2000-06-09 | 2001-12-17 | 김윤철 | Structure of chip LED and the manufacturing method |
| US7659531B2 (en) * | 2007-04-13 | 2010-02-09 | Fairchild Semiconductor Corporation | Optical coupler package |
-
1987
- 1987-07-17 JP JP1987110391U patent/JPH0514530Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6413747U (en) | 1989-01-24 |
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