JPS6045079A - Flexible lamp using light emitting diode - Google Patents
Flexible lamp using light emitting diodeInfo
- Publication number
- JPS6045079A JPS6045079A JP58153757A JP15375783A JPS6045079A JP S6045079 A JPS6045079 A JP S6045079A JP 58153757 A JP58153757 A JP 58153757A JP 15375783 A JP15375783 A JP 15375783A JP S6045079 A JPS6045079 A JP S6045079A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- conductive pattern
- lamp
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
Description
【発明の詳細な説明】
この発明は、発光ダイオードを用いたフレキシブルラン
プに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flexible lamp using a light emitting diode.
自動車用の各種ランプは、ぞの車体形状に応じて形状や
大きさが異なっている。このため各ランプ毎にレンズや
りフレフタを別個に形成し、使用するバルブも明るさや
大きさを選択しな（〕ればならず、またその取（＝Ｉり
にソクッ１−等の部品も必要どした。従って、各ランプ
共、ｔ１１５品点数が多く １−コスト高どなり、かつ
絹付けに手間が掛かる等の不都合があった。The various types of lamps for automobiles have different shapes and sizes depending on the shape of the vehicle body. For this reason, it is necessary to separately form a lens and a flap for each lamp, and to select the brightness and size of the bulb to be used.Additionally, parts such as a socket are also required for its installation. Therefore, each lamp had a large number of t115 items. 1- There were disadvantages such as high cost and time consuming to attach silk.
本発明は、ランプの光源を発光ダイオードとし、しかも
複数の発光ダイオードを取（ｄ ＋〕だ基板をフレキシ
ブルとなずことにＪ：り各秒車体形状に合Ｕて形状を変
化させ、どのようなランプも容易に形成できるようにし
たものであり、部品点数の削減及び組付■数の省略化を
意図したものである。In the present invention, the light source of the lamp is a light emitting diode, and the board on which a plurality of light emitting diodes are mounted is flexible, and its shape can be changed according to the shape of the vehicle body. The lamp is designed to be easily formed, and is intended to reduce the number of parts and the number of assemblies.
この目的にＪ３いて、本発明は所定の導電パターン部を
施したルキシプル基板と、導電パターン部の所定箇所に
載置固定しこの導電パターン部と電気的に接続した複数
の発光ダイオードユニ７１〜部及び１１Ｓ、抗ユニット
部とを備えた構成を要旨とづるものである。For this purpose, the present invention includes a luxiple substrate provided with a predetermined conductive pattern, and a plurality of light emitting diode units 71 to 71 mounted and fixed at predetermined locations on the conductive pattern and electrically connected to the conductive pattern. 11S and a resistor unit section.
以下、図示の実施例により本発明を具体的に説明り−る
と、１０はフレキシブル基板であり、例えばポリエステ
ルフィルムを主体として形成され、その表面に導電パタ
ーン部１１が印刷容体等により施され、その必要な箇所
に後記する発光ダイオードユニット部又は抵抗ユニット
部の取付部１２．１２’が形成され、かつ端部にはリー
ト線の接続端子部１３が設りられている。２０は発光ダ
イオードユニット部であり、所定の寸法に形成されたセ
ラミック基板２１と、その表面に形成された導電パター
ン部２２と、導電パターン部に載置固定されかつワイへ
７−２３でボンディングされた発光グイオートチツブ２
４とから構成されている。そして前記導電パターン部２
２は、セラミック基板２１の側面に延びる延長部２２ａ
がそれぞれ形成されている。３０は抵抗コニット部であ
り、前記発光タイオードユニット部２０どほぼ同形のセ
ラミック基板３１を有し、その表面に導電パターン部３
２が形成されると共に、抵抗チップ又は印刷抵抗体３３
が載置固定された構成から成り、導電パターン部３２の
両端部はセラミック基板３１の側面に廷ひる延長部３２
ａがそれぞれ形成されている。Hereinafter, the present invention will be specifically explained with reference to the illustrated embodiments. Reference numeral 10 is a flexible substrate, which is formed mainly of, for example, a polyester film, on the surface of which a conductive pattern portion 11 is applied by a printed medium, etc. Attachment portions 12 and 12' for a light emitting diode unit section or a resistor unit section, which will be described later, are formed at the necessary locations, and a connection terminal section 13 for a wire wire is provided at the end. Reference numeral 20 denotes a light emitting diode unit section, which includes a ceramic substrate 21 formed to a predetermined size, a conductive pattern section 22 formed on the surface thereof, and is placed and fixed on the conductive pattern section and bonded to wires 7-23. Light-emitting autochip 2
It is composed of 4. and the conductive pattern section 2
2 is an extension portion 22a extending to the side surface of the ceramic substrate 21;
are formed respectively. Reference numeral 30 denotes a resistive connit part, which has a ceramic substrate 31 having almost the same shape as the light emitting diode unit part 20, and has a conductive pattern part 3 on its surface.
2 is formed and a resistor chip or printed resistor 33
is placed and fixed, and both ends of the conductive pattern portion 32 are extended portions 32 that are attached to the side surfaces of the ceramic substrate 31.
a are formed respectively.
前記発光ダイＡ−ドユニツ１へ部２０は、前記フレキシ
ブル基板１０の導電パターン部１１における取（＝Ｊ部
１２に載置固定し、前記導電パターン部２２の延長部２
２ａをフレキシブル基板１０の導電パターン部１１にそ
れぞれ電気的に接続すれば、導電パターン部１１に発光
ダイＡ−ドユニツト部２０を取イ」（」ることができる
。このとぎ、第４図に示り−ように発光ダイオードユニ
ット部２０の導電パターン部２２の延長部２２ａと、フ
レキシブル基板１０の取イＮ１部１２を構成している接
続用の端子１２ａとをｉ８着１れば、電気的接続と発光
タイオードユニット部２０の固定とを同口４に行なうこ
とができる。このようにして、導電パターン部１１の各
取付部１２に、発光ダイオード］ニツ１〜部２０がそれ
ぞれ電気的に接続して取イ」けられる。The light-emitting diode A-do unit 1 part 20 is mounted and fixed on the conductive pattern part 11 of the flexible substrate 10 (=J part 12), and the extension part 2 of the conductive pattern part 22 is fixed.
2a are electrically connected to the conductive pattern section 11 of the flexible substrate 10, the light emitting diode A-dunit section 20 can be attached to the conductive pattern section 11. At this point, as shown in FIG. If the extension part 22a of the conductive pattern part 22 of the light emitting diode unit part 20 and the connection terminal 12a forming the lead N1 part 12 of the flexible substrate 10 are connected in the same manner as shown in FIG. The light emitting diode units 1 to 20 can be electrically connected to the respective mounting parts 12 of the conductive pattern part 11 in this manner. "I'm going to take it."
前記抵抗ユニツ１一部３０の取付要領も上記発光ダイオ
ード１ニツ１一部２０と全く同様であり、導電ｌくター
ン部１１の各取付部１２′ にそれぞれ電気的に接続し
て取イ」（）ることができる。The mounting procedure for the resistor unit 1 part 30 is exactly the same as that for the light emitting diode 1 part 20, and it can be installed by electrically connecting it to each mounting part 12' of the conductive turn part 11. ) can be done.
このようにして、フレキシブル基板１０の導電パターン
部１１に、複数の発光ダイオードユニツ１一部２０と抵
抗ユニット部３０とを接続することによって第５図に示
ηように点灯＠路を構成づ−ることができる。そして、
導電パターン部１１の接続端子部１３に外部リード線（
図示せず）を接続して通電すｔしば各発光ダイオードユ
ニ７１〜部２０を点灯させること−ができる。In this way, by connecting the plurality of light emitting diode units 1 parts 20 and the resistor unit part 30 to the conductive pattern part 11 of the flexible substrate 10, a lighting path is constructed as shown in FIG. can be done. and,
An external lead wire (
(not shown) is connected and energized, each of the light emitting diode units 71 to 20 can be lit.
つぎに、点灯回路を備えたフレキシブル基板１０を用い
てランプを形成するには、第６図に示づ−ように車体取
付部９０にフレキシブル基板１０４添設し、レンズ４０
を組（＝Ｊけることでよい。このとさ、車体数イ」部９
０が如何なる形状であろうとも、フレキシブル基板１０
は自由に折曲げ又は湾曲させることができるので、車体
数イ」部９０に密接状態で添わせることができる。Next, in order to form a lamp using the flexible substrate 10 equipped with a lighting circuit, a flexible substrate 104 is attached to the vehicle body mounting portion 90 as shown in FIG.
Assemble (=J).For now, the number of car bodies is Part 9.
No matter what shape 0 is, the flexible substrate 10
Since it can be freely bent or curved, it can be attached closely to the vehicle body part 90.
従って、自動車用の各種ランプ例えば第７図に示すよう
にテールアンドストップランプ５０、ターンシグナルラ
ンプ６０、サイドターンランプ７０、マーカーランプ８
０等の灯体を容易に形成することができる。Therefore, various lamps for automobiles, such as a tail and stop lamp 50, a turn signal lamp 60, a side turn lamp 70, a marker lamp 8, as shown in FIG.
0 grade lamp bodies can be easily formed.
以上説明したように、本発明は点灯回路を形成したフレ
キシブル基板を、車体数イ」部に添設しレンズを組付け
てランプを構成できるＪ、うにしたので、自動車用の各
種ランプを容易に形成することができ、かつフレキシブ
ル基板は車体の形状に対して著しく順応性に富み、転用
、共用等が可能となって広範囲に使用することができる
。また、本発明によればリフレクタが不要となるので、
ランプの薄型化が図れ、かつ部品点数の削減及び組付作
業の省力化が可能となる。さらに、レンズ面のほぼ全域
に亘って発光ダイＡ−ドを平均的に配設できる４１４造
であるから、ランプの発光時に部分的に明暗が生じるこ
とがなく、全体を明るく発光さけることができ、ランプ
としての表示機能を向上させることができる。また、本
発明の場合は、発光ダイオードユニツ１〜を光源として
いるから、電球を光源としたものよりも寿命が長く、電
球の交換作業が不要であり、発光ダイＡ−ドユニツＩ〜
の数によって必要とする照度の設定が容易にでき、レン
ズの形状も制約されない等の使用上及び段目上の利点も
ある。As explained above, the present invention makes it possible to construct a lamp by attaching a flexible substrate on which a lighting circuit is formed to the number 1 part of the vehicle body and assembling a lens, so that various types of lamps for automobiles can be easily constructed. In addition, the flexible substrate has excellent adaptability to the shape of the vehicle body, and can be used for a wide range of purposes such as diversion and common use. Further, according to the present invention, a reflector is not required, so
The lamp can be made thinner, and the number of parts and assembly work can be reduced. Furthermore, since the 414-meter structure allows the light-emitting diodes to be arranged evenly over almost the entire area of the lens surface, there is no partial brightness or darkness when the lamp emits light, and the entire light can be brightly emitted. , the display function as a lamp can be improved. In addition, in the case of the present invention, since the light emitting diode unit 1~ is used as the light source, the life is longer than that using a light bulb as the light source, and there is no need to replace the light bulb, and the light emitting diode unit I~ is used as the light source.
There are also advantages in terms of use and design, such as the fact that the required illuminance can be easily set depending on the number of lenses, and the shape of the lens is not restricted.
第１図は本発明に係るフレキシブル基板の斜視図、第２
図は発光ダイＡ−ドユニツｌ一部の斜視図、第３図は抵
抗ユニツ［〜部の斜視図、第４図は発光ダイオードユニ
ツＩ〜部の取（＝Ｊ状態を示す斜視図、第５図はフレキ
シブル基板に形成した点灯回路図、第６図は本発明によ
るランプの一実施例を示づ斜視図、第７図（イ）、（ロ
）はい−ずれも本発明のランプの適用例を示Ｊ説明図で
ある。
１０・・・フレキシブル基板 １１・・・導電パターン
部１２、１２’ ・・・取付部 １３・・・接続端子部
２０・・・発光ダイオ−１１２７１〜部２１・・・セラ
ミック基板 ２２・・・導電パターン部２３・・・ワイ
Ａ７−
２４・・・発光ダイオードチップ
３０・・・抵抗ユニツ１〜部 ３１・・・セラミック基
板３２・・・導電パターン部 ３３・・・＋＋１抗体４
０・・・レンズ
９０・・・車体数イく」部
特Ｙ［出願人 木［ロ技研工業株式会７１同 スタンレ
ー電気株式会ン」FIG. 1 is a perspective view of a flexible substrate according to the present invention, and FIG.
The figure is a perspective view of a part of the light emitting diode unit A, FIG. 3 is a perspective view of the resistor unit, and FIG. The figure is a lighting circuit diagram formed on a flexible substrate, Figure 6 is a perspective view showing an embodiment of the lamp according to the present invention, and Figures 7 (a) and (b) are application examples of the lamp of the present invention. 10... Flexible board 11... Conductive pattern parts 12, 12'... Mounting part 13... Connection terminal part 20... Light emitting diode 11271-part 21... - Ceramic substrate 22... Conductive pattern section 23... Wire A7- 24... Light emitting diode chip 30... Resistance unit 1~ section 31... Ceramic substrate 32... Conductive pattern section 33... ++1 antibody 4
0...Lens 90...Number of vehicle bodies Part Y
Claims (3)
板と、前記導電パターン部の所定箇所に載置固定し導電
パターン部と電気的に接続した複数の発光ダイオードユ
ニット部及び抵抗ユニツ１〜部とを備えてなることを特
徴とする発光ダイオードを用いたフレキシブルランプ。(1) A flexible substrate provided with a predetermined conductive pattern, and a plurality of light emitting diode units and resistor units 1 to 1 placed and fixed at predetermined locations on the conductive pattern and electrically connected to the conductive pattern. A flexible lamp using a light emitting diode.
ク基板と、このレラミック基板上に設けられ前記フレキ
シブル基板の導電パターン部と電気的に接続される導電
パターン部と、この導電パターン部に載置ＩＺ＋定され
かつワイＡ７−ボンディングされた発光ダイオードチッ
プとからなることを特徴とする特許請求の範ｔｉｌｌ第
１項記載の発光ダイオードを用いたフレキシブルランプ
。(2) The light emitting diode units 1 to 1 are mounted on a ceramic substrate, a conductive pattern section provided on the ceramic substrate and electrically connected to the conductive pattern section of the flexible substrate, and mounted on the conductive pattern section IZ+. A flexible lamp using a light-emitting diode according to claim 1, characterized in that the light-emitting diode chip is fixed and wire-bonded.
のセラミック基板上に設けられ前記フレキシブル基板の
導電パターン部と電気的に接続される導電パターン部と
、この導電パターン部に載置固定されたチップ抵抗又は
印刷抵抗体とからなることを特徴とする特許請求のｔ！
（ＩＪＩ第１項記載の発光ダイオードを用いたフレキシ
ブルランプ。(3) The resistance unit section includes a ceramic substrate, a conductive pattern section provided on the ceramic substrate and electrically connected to the conductive pattern section of the flexible substrate, and a chip mounted and fixed on the conductive pattern section. t! of the patent claim, characterized in that it consists of a resistor or a printed resistor!
(Flexible lamp using the light emitting diode described in IJI item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153757A JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153757A JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6045079A true JPS6045079A (en) | 1985-03-11 |
| JPH0452629B2 JPH0452629B2 (en) | 1992-08-24 |
Family
ID=15569457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58153757A Granted JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045079A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361156U (en) * | 1986-10-08 | 1988-04-22 | ||
| JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
| JPH0192704U (en) * | 1987-12-14 | 1989-06-19 | ||
| JPH02189803A (en) * | 1989-01-18 | 1990-07-25 | Koito Mfg Co Ltd | Display device having flexibility |
| JPH031458U (en) * | 1989-05-19 | 1991-01-09 | ||
| JPH0545812U (en) * | 1991-11-22 | 1993-06-18 | 株式会社小糸製作所 | Vehicle lighting |
| JPH05185327A (en) * | 1992-01-10 | 1993-07-27 | Think Lab Kk | Fabricating method for embossed roll |
| JP2002544673A (en) * | 1999-05-12 | 2002-12-24 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | LED-device |
| JP2007128821A (en) * | 2005-11-07 | 2007-05-24 | Toshiba Matsushita Display Technology Co Ltd | Backlight and liquid crystal display device using it |
| JP2009545149A (en) * | 2006-07-21 | 2009-12-17 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Light emitting device and lighting device provided with a plurality of light emitting elements |
| WO2014182773A3 (en) * | 2013-05-10 | 2014-12-31 | Osram Sylvania Inc. | Methods of producing electronic assemblies including a subassembly film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130982U (en) * | 1980-03-04 | 1981-10-05 | ||
| JPS5838180U (en) * | 1981-09-08 | 1983-03-12 | 株式会社東芝 | LED display |
| JPS58105185U (en) * | 1982-01-08 | 1983-07-18 | クラリオン株式会社 | Mounting mechanism for printed circuit boards, etc. |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838180B2 (en) * | 1975-04-26 | 1983-08-20 | フクバコウギヨウ カブシキガイシヤ | Jyuutan Soujikino Kaiten Brush Souji Souchi |
-
1983
- 1983-08-23 JP JP58153757A patent/JPS6045079A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130982U (en) * | 1980-03-04 | 1981-10-05 | ||
| JPS5838180U (en) * | 1981-09-08 | 1983-03-12 | 株式会社東芝 | LED display |
| JPS58105185U (en) * | 1982-01-08 | 1983-07-18 | クラリオン株式会社 | Mounting mechanism for printed circuit boards, etc. |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6361156U (en) * | 1986-10-08 | 1988-04-22 | ||
| JPH0432773Y2 (en) * | 1986-10-08 | 1992-08-06 | ||
| JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
| JPH0192704U (en) * | 1987-12-14 | 1989-06-19 | ||
| JPH02189803A (en) * | 1989-01-18 | 1990-07-25 | Koito Mfg Co Ltd | Display device having flexibility |
| JPH031458U (en) * | 1989-05-19 | 1991-01-09 | ||
| JPH0545812U (en) * | 1991-11-22 | 1993-06-18 | 株式会社小糸製作所 | Vehicle lighting |
| JPH05185327A (en) * | 1992-01-10 | 1993-07-27 | Think Lab Kk | Fabricating method for embossed roll |
| JP2002544673A (en) * | 1999-05-12 | 2002-12-24 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | LED-device |
| JP2007128821A (en) * | 2005-11-07 | 2007-05-24 | Toshiba Matsushita Display Technology Co Ltd | Backlight and liquid crystal display device using it |
| JP4519756B2 (en) * | 2005-11-07 | 2010-08-04 | 東芝モバイルディスプレイ株式会社 | Backlight and liquid crystal display device using the same |
| JP2009545149A (en) * | 2006-07-21 | 2009-12-17 | オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング | Light emitting device and lighting device provided with a plurality of light emitting elements |
| WO2014182773A3 (en) * | 2013-05-10 | 2014-12-31 | Osram Sylvania Inc. | Methods of producing electronic assemblies including a subassembly film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0452629B2 (en) | 1992-08-24 |
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