JPH0452629B2 - - Google Patents
Info
- Publication number
- JPH0452629B2 JPH0452629B2 JP58153757A JP15375783A JPH0452629B2 JP H0452629 B2 JPH0452629 B2 JP H0452629B2 JP 58153757 A JP58153757 A JP 58153757A JP 15375783 A JP15375783 A JP 15375783A JP H0452629 B2 JPH0452629 B2 JP H0452629B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- conductive pattern
- emitting diode
- section
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000000919 ceramic Substances 0.000 claims description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、発光ダイオードを用いたフレキシ
ブルランプに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flexible lamp using a light emitting diode.
自動車用の各種ランプは、その車体形状に応じ
て形状や大きさが異なつている。このため各ラン
プ毎にレンズやリフレクタを別個に形成し、使用
するバルブも明るさや大きさを選択しなければな
らず、またその取付けにソケツト等の部品も必要
とした。従つて、各ランプ共、部品点数が多くて
コスト高となり、かつ組付けに手間が掛かる等の
不都合があつた。 Various types of lamps for automobiles have different shapes and sizes depending on the shape of the vehicle body. For this reason, lenses and reflectors had to be formed separately for each lamp, the brightness and size of the bulbs to be used had to be selected, and parts such as sockets were also required for their installation. Therefore, each lamp has disadvantages such as a large number of parts, high cost, and time-consuming assembly.
本発明は、ランプの光源を発光ダイオードと
し、しかも複数の発光ダイオードを取付けた基板
をフレキシブルとなすことにより各種車体形状に
合せて形状を変化させ、どのようなランプも容易
に形成できるようにしたものであり、部品点数の
削減及び組付工数の省略化を意図したものであ
る。 In the present invention, the light source of the lamp is a light emitting diode, and the substrate on which a plurality of light emitting diodes are attached is made flexible, so that the shape can be changed to match the shape of various vehicle bodies, and any type of lamp can be easily formed. It is intended to reduce the number of parts and the number of assembly steps.
この目的において、本発明は所定の導電パター
ン部を施したフレキシブル基板と、前記導電パタ
ーン部の所定箇所に載置固定し導電パターン部と
電気的に接続した複数の発光ダイオードユニツト
部及び抵抗ユニツト部とを備え、前記発光ダイオ
ードユニツト部は、セラミツク基板と、このセラ
ミツク基板上に設けられ前記フレキシブル基板の
導電パターン部と電気的に接続される導電パター
ン部と、この導電パターン部に載置固定されかつ
ワイヤーボンデイングされた発光ダイオードチツ
プとからなり、又前記抵抗ユニツト部は、セラミ
ツク基板と、このセラミツク基板上に設けられ前
記フレキシブル基板の導電パターン部と電気的に
接続される導電パターン部と、この導電パターン
部に載置固定されたチツプ抵抗又は印刷抵抗体と
からなる構成を要旨とするものである。 For this purpose, the present invention provides a flexible substrate provided with a predetermined conductive pattern, and a plurality of light emitting diode units and resistor units placed and fixed at predetermined locations on the conductive pattern and electrically connected to the conductive pattern. The light emitting diode unit section includes a ceramic substrate, a conductive pattern section provided on the ceramic substrate and electrically connected to the conductive pattern section of the flexible substrate, and a conductive pattern section placed and fixed on the conductive pattern section. and a wire-bonded light emitting diode chip, and the resistor unit portion includes a ceramic substrate, a conductive pattern portion provided on the ceramic substrate and electrically connected to the conductive pattern portion of the flexible substrate, and a conductive pattern portion provided on the ceramic substrate and electrically connected to the conductive pattern portion of the flexible substrate. The main feature is a structure consisting of a chip resistor or a printed resistor placed and fixed on a conductive pattern section.
以下、図示の実施例により本発明を具体的に説
明すると、１０はフキシブル基板であり、例えば
ポリエステルフイルムを主体として形成され、そ
の表面に導電パターン部１１が印刷導体等により
施され、その必要な箇所に後記する発光ダイオー
ドユニツト部又は抵抗ユニツト部の取付部１２，
１２′が形成され、かつ端部にはリード線の接続
端子部１３が設けられている。20は発光ダイオー
ドユニツト部であり、所定の寸法に形成されたセ
ラミツク基板２１と、その表面に形成された導電
パターン部２２と、導電パターン部に載置固定さ
れかつワイヤー２３でボンデイングされた発光ダ
イオードチツプ２４とから構成れている。そして
前記導電パターン部２２は、セラミツク基板２１
の側面に延びる延長部２２ａがそれぞ形成されて
いる。３０は抵抗ユニツト部であり、前記発光ダ
イオードユニツト部２０とほぼ同形のセラミツク
基板３１を有し、その表面に導電パターン部３２
が形成されると共に、抵抗チツプ又は印刷抵抗体
３３が載置固定された構成から成り、導電パター
ン部３２の両端部はセラミツク基板３１の側面に
延びる延長部３２ａがそれぞれ形成されている。 Hereinafter, the present invention will be specifically explained with reference to the illustrated embodiments. Reference numeral 10 denotes a flexible substrate, which is formed mainly of, for example, a polyester film, on the surface of which a conductive pattern portion 11 is applied using a printed conductor or the like. Attachment part 12 of the light emitting diode unit part or resistance unit part, which will be described later in the section.
12' is formed, and a connecting terminal portion 13 for a lead wire is provided at the end. Reference numeral 20 denotes a light emitting diode unit section, which includes a ceramic substrate 21 formed to a predetermined size, a conductive pattern section 22 formed on the surface thereof, and a light emitting diode placed and fixed on the conductive pattern section and bonded with a wire 23. It consists of a chip 24. The conductive pattern portion 22 is formed on the ceramic substrate 21.
Extension portions 22a extending to the side surfaces of each are formed. 30 is a resistor unit section, which has a ceramic substrate 31 having almost the same shape as the light emitting diode unit section 20, and has a conductive pattern section 32 on its surface.
is formed, and a resistor chip or printed resistor 33 is mounted and fixed thereon, and extension portions 32a extending to the side surfaces of the ceramic substrate 31 are formed at both ends of the conductive pattern portion 32, respectively.
前記発光ダイオードユニツト部２０は、前記フ
レキシブル基板１０の導電パターン部１１におけ
る取付部１２に載置固定し、前記導電パターン部
２２の延長部２２ａをフレキシブル基板１０の導
電パターン部１１にそれぞれ電気的に接続すれ
ば、導電パターン部１１に発光ダイオードユニツ
ト部２０を取付けることができる。このとき、第
４図に示すように発光ダイオードユニツト部２０
の導電パターン部２２の延長部２２ａと、フレキ
シブル基板１０の取付部１２を構成している接続
用の端子１２ａとを溶着すれば、電気的接続と発
光ダイオードユニツト部２０の固定とを同時に行
なうことができる。このようにして、導電パター
ン部１１の各取付部１２に、発効ダイオードユニ
ツト部２０がそれぞれ電気的に接続して取付けら
れる。 The light emitting diode unit section 20 is mounted and fixed on the mounting section 12 of the conductive pattern section 11 of the flexible substrate 10, and the extension section 22a of the conductive pattern section 22 is electrically connected to the conductive pattern section 11 of the flexible substrate 10, respectively. Once connected, the light emitting diode unit section 20 can be attached to the conductive pattern section 11. At this time, as shown in FIG.
By welding the extension part 22a of the conductive pattern part 22 and the connection terminal 12a constituting the mounting part 12 of the flexible substrate 10, electrical connection and fixing of the light emitting diode unit part 20 can be performed at the same time. I can do it. In this manner, the effecting diode unit sections 20 are electrically connected and attached to each attachment section 12 of the conductive pattern section 11, respectively.
前記抵抗ユニツト部３０の取付要領も上記発光
ダイオードユニツト部２０と全く同様であり、導
電パターン部１１の各取付部１２′にそれぞれ電
気的に接続して取付けることができる。 The method of attaching the resistor unit section 30 is exactly the same as that of the light emitting diode unit section 20, and can be attached by being electrically connected to each attaching section 12' of the conductive pattern section 11.
このようにして、フレキシブル基板１０の導電
パターン部１１に、複数の発光ダイオードユニツ
部２０と抵抗ユニツト部３０とを接続することに
よつて第５図に示すように点灯回路を構成するこ
とができる。そして、導電パターン部１１の接続
端子部１３に外部リード線（図示せず）を接続し
て通電すれば各発光ダイオードユニツト部２０を
点灯させることができる。 In this way, by connecting a plurality of light emitting diode unit parts 20 and a resistor unit part 30 to the conductive pattern part 11 of the flexible substrate 10, a lighting circuit can be constructed as shown in FIG. . Then, by connecting an external lead wire (not shown) to the connection terminal section 13 of the conductive pattern section 11 and energizing it, each light emitting diode unit section 20 can be lit.
つぎに、点灯回路を備えたフレキシブル基板１
０を用いてランプを形成するには、第６図に示す
ように車体取付部９０にフレキシブル基板１０を
添設し、レンズ４０を組付けることでよい。この
とき、車体取付部９０が如何なる形状であろうと
も、フレキシブル基板１０は自由に折曲げ又は湾
曲させることができるので、車体取付部９０に密
接状態で添わせることができる。 Next, the flexible board 1 equipped with the lighting circuit
In order to form a lamp using 0, it is sufficient to attach the flexible substrate 10 to the vehicle body mounting part 90 and assemble the lens 40 as shown in FIG. At this time, regardless of the shape of the vehicle body attachment part 90, the flexible substrate 10 can be freely bent or curved, so that it can be closely attached to the vehicle body attachment part 90.
従つて、自動車用の各種ランプ例えば第７図に
示すようにテールアンドストツプランプ５０、タ
ーンシグナルランプ６０、サイドターンランプ７
０、マーカーランプ８０等の灯体を容易に形成す
ることができる。 Therefore, various lamps for automobiles, such as a tail and stop lamp 50, a turn signal lamp 60, and a side turn lamp 7 as shown in FIG.
0, a lamp body such as a marker lamp 80 can be easily formed.
以上説明したように、本発明は点灯回路を形成
したフレキシブル基板を、車体取付部に添設しレ
ンズを組付けてランプを構成できるようにしたの
で、自動車用の各種ランプを容易に形成すること
ができ、かつフレキシブル基板は車体の形状に対
して著しく順応性に富み、転用、共用等が可能と
なつて広範囲に使用することができる。また、本
発明によればリフレクタが不要となるので、ラン
プの薄型化が図れ、かつ部品点数の削減及び組付
作業の省力化が可能となる。さらに、レンズ面の
ほぼ全域に亘つて発光ダイオードを平均的に配設
できる構造であるから、ランプの発光時に部分的
に明暗が生じることがなく、全体を明るく発光さ
せることができ、ランプとしての表示機能を向上
させることができる。また、本発明の場合は、発
光ダイオードユニツトを光源としているから、電
球を光源としたものよりも寿命が長く、電球の交
換作業が不要であり、発光ダイオードユニツトの
数によつて必要とする照度の設定が容易にでき、
レンズの形状も制約されない等の使用上及び設計
上の利点もある。 As explained above, in the present invention, a lamp can be constructed by attaching a flexible substrate on which a lighting circuit is formed to a vehicle body mounting part and assembling a lens, so that various lamps for automobiles can be easily formed. In addition, the flexible substrate is extremely adaptable to the shape of the vehicle body, and can be used for different purposes or shared use, allowing for a wide range of uses. Further, according to the present invention, since a reflector is not required, the lamp can be made thinner, and the number of parts and assembly work can be reduced. Furthermore, since the structure allows the light emitting diodes to be arranged evenly over almost the entire area of the lens surface, there is no partial brightness or darkness when the lamp emits light, and the entire light can be emitted brightly, making it suitable for use as a lamp. The display function can be improved. Furthermore, in the case of the present invention, since the light source is a light emitting diode unit, the life is longer than that using a light bulb as a light source, there is no need to replace the light bulb, and the required illuminance depends on the number of light emitting diode units. can be easily set up,
There are also advantages in terms of use and design, such as the fact that the shape of the lens is not restricted.
更に、セラミツク基板上に発光ダイオードチツ
プ又はチツプ抵抗又は印刷抵抗体等を載置固定す
ることによつてフレキシブル基板が自動車の車体
形状に合わせて湾曲された場合であつても、その
湾曲による影響は直接発光ダイオードチツプやチ
ツプ抵抗や印刷抵抗体に及ぶことはなく、接続不
良等の不具合が生じることはない。 Furthermore, even if the flexible substrate is curved to match the shape of the car body by mounting and fixing a light emitting diode chip, chip resistor, printed resistor, etc. on the ceramic substrate, the effect of the curvature will not be affected. It does not directly affect the light emitting diode chip, chip resistor, or printed resistor, and problems such as connection failures do not occur.
第１図は本発明に係るフレキシブル基板の斜視
図、第２図は発光ダイオートユニツト部の斜視
図、第３図は抵抗ユニツト部の斜視図、第４９は
発光ダイオードユニツト部の取付状態を示す斜視
図、第５図はフレキシブル基板に形成した点灯回
路図、第６図は本発明によるランプの一実施例を
示す斜視図、第７図イ，ロはいずれも本発明のラ
ンプの適用例を示す説明図である。
１０……フレキシブル基板、１１……導電パタ
ーン部、１２，１２′……取付部、１３……接続
端子部、２０……発光ダイオードユニツト部、２
１……セラミツク基板、２２……導電パターン
部、２３……ワイヤー、２４……発光ダイオード
チツプ、３０……抵抗ユニツト部、３１……セラ
ミツク基板、３２……導電パターン部、３３……
抵抗体、４０……レンズ、９０……車体取付部。
Fig. 1 is a perspective view of a flexible substrate according to the present invention, Fig. 2 is a perspective view of a light emitting diode unit section, Fig. 3 is a perspective view of a resistor unit section, and Fig. 49 shows a state in which the light emitting diode unit section is attached. 5 is a lighting circuit diagram formed on a flexible substrate, FIG. 6 is a perspective view showing an embodiment of the lamp according to the present invention, and FIGS. 7A and 7B are examples of application of the lamp of the present invention. FIG. DESCRIPTION OF SYMBOLS 10... Flexible board, 11... Conductive pattern part, 12, 12'... Mounting part, 13... Connection terminal part, 20... Light emitting diode unit part, 2
DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 22... Conductive pattern part, 23... Wire, 24... Light emitting diode chip, 30... Resistance unit part, 31... Ceramic substrate, 32... Conductive pattern part, 33...
Resistor, 40...Lens, 90...Vehicle body mounting part.
Claims (1)
基板と、前記導電パターン部の所定箇所に載置固
定し導電パターン部と電気的に接続した複数の発
光ダイオードユニツト部及び抵抗ユニツト部とを
備え、前記発光ダイオードユニツト部は、セラミ
ツク基板と、このセラミツク基板上に設けられ前
記フレキシブル基板の導電パターン部と電気的に
接続される導電パターン部と、この導電パターン
部に載置固定されかつワイヤーボンデイングされ
た発光ダイオードチツプとからなることを特徴と
する発光ダイオードを用いたフレキシブルラン
プ。 ２ 前記抵抗ユニツト部が、セラミツク基板と、
このセラミツク基板上に設けられ前記フレキシブ
ル基板の導電パターン部と電気的に接続される導
電パターン部と、この導電パターン部に載置固定
されたチツプ抵抗又は印刷抵抗体とからなること
を特徴とする特許請求の範囲第１項記載の発光ダ
イオードを用いたフレキシブルランプ。[Scope of Claims] 1. A flexible substrate provided with a predetermined conductive pattern portion, and a plurality of light emitting diode unit portions and resistor unit portions placed and fixed at predetermined locations on the conductive pattern portion and electrically connected to the conductive pattern portion. The light emitting diode unit section includes a ceramic substrate, a conductive pattern section provided on the ceramic substrate and electrically connected to the conductive pattern section of the flexible substrate, and a conductive pattern section placed and fixed on the conductive pattern section. A flexible lamp using a light emitting diode, characterized in that the light emitting diode chip is wire-bonded. 2. The resistor unit portion includes a ceramic substrate;
It is characterized by comprising a conductive pattern section provided on the ceramic substrate and electrically connected to the conductive pattern section of the flexible substrate, and a chip resistor or a printed resistor placed and fixed on the conductive pattern section. A flexible lamp using the light emitting diode according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153757A JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58153757A JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6045079A JPS6045079A (en) | 1985-03-11 |
| JPH0452629B2 true JPH0452629B2 (en) | 1992-08-24 |
Family
ID=15569457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58153757A Granted JPS6045079A (en) | 1983-08-23 | 1983-08-23 | Flexible lamp using light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6045079A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0432773Y2 (en) * | 1986-10-08 | 1992-08-06 | ||
| JPS6486573A (en) * | 1987-07-17 | 1989-03-31 | Oshima Denki Co | Light emitting device |
| JPH0192704U (en) * | 1987-12-14 | 1989-06-19 | ||
| JPH081964B2 (en) * | 1989-01-18 | 1996-01-10 | 株式会社小糸製作所 | Flexible display device |
| JP2525038Y2 (en) * | 1989-05-19 | 1997-02-05 | 株式会社オムジ | A diaper for treating the affected area using light emitting diodes |
| JPH0545812U (en) * | 1991-11-22 | 1993-06-18 | 株式会社小糸製作所 | Vehicle lighting |
| JPH05185327A (en) * | 1992-01-10 | 1993-07-27 | Think Lab Kk | Fabricating method for embossed roll |
| DE19922176C2 (en) * | 1999-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement and its use in a lighting device |
| JP4519756B2 (en) * | 2005-11-07 | 2010-08-04 | 東芝モバイルディスプレイ株式会社 | Backlight and liquid crystal display device using the same |
| DE102006033873A1 (en) * | 2006-07-21 | 2008-01-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Radiation-emitting device with a plurality of radiation-emitting components and illumination device |
| US20140335635A1 (en) * | 2013-05-10 | 2014-11-13 | Osram Sylvania Inc. | Electronic assemblies including a subassembly film and methods of producing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838180B2 (en) * | 1975-04-26 | 1983-08-20 | フクバコウギヨウ カブシキガイシヤ | Jyuutan Soujikino Kaiten Brush Souji Souchi |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6022383Y2 (en) * | 1980-03-04 | 1985-07-03 | 三洋電機株式会社 | light emitting diode display |
| JPS5838180U (en) * | 1981-09-08 | 1983-03-12 | 株式会社東芝 | LED display |
| JPS58105185U (en) * | 1982-01-08 | 1983-07-18 | クラリオン株式会社 | Mounting mechanism for printed circuit boards, etc. |
-
1983
- 1983-08-23 JP JP58153757A patent/JPS6045079A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5838180B2 (en) * | 1975-04-26 | 1983-08-20 | フクバコウギヨウ カブシキガイシヤ | Jyuutan Soujikino Kaiten Brush Souji Souchi |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6045079A (en) | 1985-03-11 |
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